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Journal articles on the topic 'Electroless plating'

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Published: 4 June 2021
Last updated: 9 June 2025

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1

SAITO, Mamoru. "Electroless Plating. Recent Trend of Electroless Plating." Journal of the Surface Finishing Society of Japan 48, no. 4 (1997): 375–79. http://dx.doi.org/10.4139/sfj.48.375.

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2

Aal, A. Abdel, V. V. Khutoryanskiy, Z. S. Nurkeeva, and G. A. Mun. "Optimization of Electroless Copper Plating on Polyethylene Films Modified by Surface Grafting of Vinyl Ether of Monoethanolamine." Eurasian Chemico-Technological Journal 9, no. 1 (January 10, 2007): 63–69. https://doi.org/10.18321/ectj256.

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Metallized plastics have recently received significant interest for their useful applications in electronic devices such as for integrated circuits, packaging, printed circuits and sensor applications. In this work the metallized films were developed by electroless copper plating of polyethylene films grafted with vinyl ether of monoethanoleamine. There are several techniques for metal deposition on surface of polymers such as evaporation, sputtering, electroless plating and electrolysis. In this work the metallized films were developed by electroless copper plating of polyethylene films grafted with vinyl ether of monoethanoleamine. Polyethylene films were subjected to gamma-radiation induced surface graft copolymerization with vinyl ether of monoethanolamine. Electroless copper plating was carried out effectively on the modified films. The catalytic processes for the electroless copper plating in the presence and the absence of SnCl2 sensitization were studied and the optimum activation conditions that give the highest plating rate were determined. The effect of grafting degree on the plating rate is studied. Electroless plating conditions (bath additives, pH and temperature) were optimized. Plating rate was determined gravimetrically and spectrophotometrically at different grafting degrees. The results reveal that plating rate is a function of degree of grafting and increases with increasing grafted vinyl ether of monoethanolamine onto polyethylene. It was found that pH 13 of electroless bath and plating temperature 40 °C are the optimal conditions for the plating process. The increasing of grafting degree results in faster plating rate at the same pH and temperature. The surface morphology of the metallized films was investigated using scanning electron microscopy (SEM). The adhesion strength between the metallized layer and grafted polymer was studied using tensile machine. SEM photos and adhesion measurements clarified that uniform and adhered deposits were obtained under optimum conditions.
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3

Sun, Hua, Xiao Fei Guo, Ke Gao Liu, Hong Fang Ma, and Li Ming Feng. "Influence of Ultrasonic on the Microstructure and Properties of Electroless Plating Ni-Co-P Coating at Low Temperature." Advanced Materials Research 314-316 (August 2011): 259–62. http://dx.doi.org/10.4028/www.scientific.net/amr.314-316.259.

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By electron energy spectrometer,X-ray diffractometer,transmission elec-tron microscopy andmicro-hardometer,the depositing speed of electrolessNi-Co-P plating baths,chemical composition,crystal structure and microhardness of the alloy coatings were inspected and analyzed with ultrasonic and rare earth metalcerium intervening in electroless Ni-Co-P plating•The results show that the depositing speed of electroless Ni-Co-P plating isobviously increased under the effect of ultrasonic.The chemical compositions of electroless Ni-Co-P plating are changed，The XRD of coating has a diffuse sexual diffraction peak closing to typical amorphous structure.the obtained Ni-Co-P coating has more fine crystal grain, even and dense surface morphology. Its wear resistance and hardness have been improved obviously.
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4

HARADA, Hisashi. "Electroless Plating." Journal of the Japan Society of Colour Material 69, no. 1 (1996): 60–70. http://dx.doi.org/10.4011/shikizai1937.69.60.

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5

UCHIDA, Ei. "Electroless Plating. Electroless Palladium Plating and Its Applications." Journal of the Surface Finishing Society of Japan 48, no. 4 (1997): 400–404. http://dx.doi.org/10.4139/sfj.48.400.

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6

SAKATA, Takahiro, and Hideo HONMA. "Electroless copper plating by applying electrolysis." Journal of the Surface Finishing Society of Japan 40, no. 3 (1989): 488–89. http://dx.doi.org/10.4139/sfj.40.488.

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7

Uraz, Canan, and Tuğba Gürmen Özçelik. "ELECTROLESS METAL PLATING OVER ABS PLASTIC." E-journal of New World Sciences Academy 14, no. 2 (April 29, 2019): 63–70. http://dx.doi.org/10.12739/nwsa.2019.14.2.1a0432.

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8

SHIBATA, Mitsuo. "Electroless Plating. Direct Electroless Nickel Plating on Magnesium Alloys." Journal of the Surface Finishing Society of Japan 48, no. 4 (1997): 413–16. http://dx.doi.org/10.4139/sfj.48.413.

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9

KAMIYAMA, Hiroharu. "Electroless copper plating." Circuit Technology 4, no. 6 (1989): 318–26. http://dx.doi.org/10.5104/jiep1986.4.318.

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10

HONMA, Hideo, Yasunori KOUCHI, and Masaaki OYAMADA. "Electroless Solder Plating." Circuit Technology 6, no. 6 (1991): 299–305. http://dx.doi.org/10.5104/jiep1986.6.6_299.

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11

Brown, L. D. "Electroless nickel plating." International Materials Reviews 37, no. 1 (January 1992): 196. http://dx.doi.org/10.1179/imr.1992.37.1.196.

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12

Brown, L. D. "‘Electroless nickel plating’." British Corrosion Journal 27, no. 1 (January 1992): 25–26. http://dx.doi.org/10.1179/000705992798268882.

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13

Henry, James R. "Electroless (autocatalytic) plating." Metal Finishing 98, no. 1 (January 2000): 424–35. http://dx.doi.org/10.1016/s0026-0576(00)80351-7.

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14

Henry, James R. "Electroless (autocatalytic) plating." Metal Finishing 97, no. 1 (January 1999): 424–35. http://dx.doi.org/10.1016/s0026-0576(00)83102-5.

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15

Henry, James R. "Electroless (autocatalytic) plating." Metal Finishing 99 (January 2001): 424–35. http://dx.doi.org/10.1016/s0026-0576(01)85302-2.

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16

Henry, James R. "Electroless (autocatalytic) plating." Metal Finishing 100 (January 2002): 409–20. http://dx.doi.org/10.1016/s0026-0576(02)82044-x.

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17

Henry, James R. "Electroless (autocatalytic) plating." Metal Finishing 97, no. 1 (January 1999): 431–42. http://dx.doi.org/10.1016/s0026-0576(99)80044-0.

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18

Baudrand, Don, and Jon Bengston. "Electroless plating processes." Metal Finishing 93, no. 9 (September 1995): 55–57. http://dx.doi.org/10.1016/0026-0576(95)99502-2.

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19

NAKAGISHI, Yutaka. "Electroless Plating. Functional Separation and Application of Electroless Nickel Plating." Journal of the Surface Finishing Society of Japan 48, no. 4 (1997): 380–86. http://dx.doi.org/10.4139/sfj.48.380.

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20

NISHIYAMA, Kouji, and Hideto WATANABE. "Electroless Plating. The Type and Application of Electroless Gold Plating." Journal of the Surface Finishing Society of Japan 48, no. 4 (1997): 393–99. http://dx.doi.org/10.4139/sfj.48.393.

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21

NITTA, Masahiro, and Hiroshi ADACHI. "Electroless Plating. Deep Black Electroless Nickel Plating-Phos Black II." Journal of the Surface Finishing Society of Japan 48, no. 4 (1997): 417–19. http://dx.doi.org/10.4139/sfj.48.417.

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22

Liu, Guan Jun, Xin Hua Mao, Jun Cao, and Zhou Yu. "Effect of Heat Treatment on Hardness of Electroless Ni-P Plating." Advanced Materials Research 228-229 (April 2011): 878–82. http://dx.doi.org/10.4028/www.scientific.net/amr.228-229.878.

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Hardness of electronless Ni-P alloy plating which have five different phosphorus content were investigated with HX-1000 type microscopic Vickers hardness tester, respectively. Phosphorus content of Ni-P platings were investigated by Quanta 200 type scanning electron microscope and Oxford Energy Disperse Spectroscopy Heat treatment temperature and time of the different platings were optimized and analysed by Uniform Design method, respectively. The results show that correlation consist between maximum hardness of the Ni-P alloy plating and heat treatment temperature, not heat treatment time under the experimental condition which the heat treatment time is between one hour and five hours, and maximal value of the plating hardness appears when the heat treatment temperature is 400-430 Celsius degree. Maximal hardness value of the electronless Ni-P alloy plating increases with increase of their phosphorus content under heat treatment condition.
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23

Liu, Yan Ping, Yan Mei Zhang, Yuan Gao, and Zhong Xu. "The Influence of Impulse Electroless Plating on Amorphous Ni-P Alloys in Structure and Hot Stability." Materials Science Forum 475-479 (January 2005): 3989–92. http://dx.doi.org/10.4028/www.scientific.net/msf.475-479.3989.

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Using a special impulse device, the impulse electroless Ni-P alloy plating were prepared. The microstructure、crystallization and the starting activation energy for crystallization was investigated by TEM、XRD and DTA, compared with electroless Ni-P alloys plating. The results showed that the diffractive ring was wider when using impulse, depositing temperature dropped up to 65°C,and crystallization temperature rose up to 310°C. Furthermore , the starting activation energy for crystallization and crystallization temperature of impulse electroless Ni-P alloys plating measured were more than that of electroless plating in the heating rate at 5、10、20、 40K/min, and it was also higher in the amorphous disorder degree and the starting crystallization temperature. Impulse electroless Ni-P alloys plating had better performance of thermal stability.
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24

FUJINAMI, Tomoyuki. "Electroless Plating. Various Functional Applications of Formalin-Free Electroless Copper Plating." Journal of the Surface Finishing Society of Japan 48, no. 4 (1997): 387–92. http://dx.doi.org/10.4139/sfj.48.387.

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25

Wanping, Chen, Li Longtu, and Gui Zhilun. "Effects of Electroless Nickel Plating on Resistivity-temperature Characteristics of (Ba1-xPbx)TiO3thermistor." Journal of Materials Research 12, no. 4 (April 1997): 877–79. http://dx.doi.org/10.1557/jmr.1997.0127.

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Effects of electroless nickel plating on resistivity-temperature (R-T) characteristics of (Ba1-xPbx)TiO3 thermistor were studied. Comparison experiments showed that not only the permeation of plating solution, but also the reaction of electroless nickel plating influences the positive temperature coefficient (PTC) effect, and that the two effects are different in nature. It is first proposed in this paper that hydrogen atoms generated in electroless nickel plating may reduce components of PTC ceramics.
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26

Feng, Li Ming, and Xue Wei. "On the Dispersants of Diamond-Ni-P Composite Electroless Plating and Properties of the Coating." Advanced Materials Research 189-193 (February 2011): 181–85. http://dx.doi.org/10.4028/www.scientific.net/amr.189-193.181.

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In order to obtain stable and homogeneous diamond-Ni-P composite electroless plating, dispersants were selected by determining the height of emulsion in the colorimetric cylinder after standing different time.The structure,elemental contents and properties of the diamond-Ni-P composite electroless plating coating were investigated by SEM and EDS. Experimental results show that OP-10 of 50mL•L-1 and softex kw of 1g•L-1 have better dispersing effect to diamond powder of 1g•L-1 in water. This composite electroless plating solution can keep stable for more than twelve or eight hours respectively at 85°C. While in the electroless plating solution, Softex kw of 1g•L-1 has better dispersing effect and can be stable for more than two hours at 85°C. The diamond powder grains in the composite coating are homogeneous and the content of carbon is 2.261 wt% under the certain amount of the selected dispersant. When the content of diamond was 5g•L-1 in the solution, the diamond powders were dispersed non-homogeneously in plating and cluster phenomena were appeared. The composite electroless plating coating consists of amorphous Ni-P and diamond powder. Its hardness and porosity are similar to those of the electroless plating Ni-P coating. The wear-resisting is improved greatly,which is 2.6 times of electroless plating Ni-P or 2 times of that after heat treatment at 400°C for one hour.
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27

ZHAO, YAN, RUN ZHANG, TONG ZHANG, and YUEXIN DUAN. "EFFECT OF DIFFERENT PRETREATMENTS TO ELECTROLESS NICKEL OR COBALT PLATING ON HOLLOW MICROSPHERES." International Journal of Modern Physics B 24, no. 15n16 (June 30, 2010): 2706–11. http://dx.doi.org/10.1142/s0217979210065507.

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Different pretreatment methods for electroless nickel and cobalt plating are demonstrated and compared in the present investigation. The surface morphologies of the nickel or cobalt deposits are investigated by scanning electron microscopy (SEM), and the chemical compositions of the coatings are analyzed by energy-dispersive X-ray spectroscopy (EDX). Method of single-step pretreatment is selected as the optimized method for electroless nickel plating process, while improved two-step sensitization-activation and single-step pretreatment methods can be selected for electroless cobalt plating. It can be found that the content of free Co is much lower compared to electroless Ni plating.
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28

URAZ, Canan. "Effect of Room Temperature Ionic Liquids for Electroless Nickel Plating on Acrylonitrile Butadiene Styrene Plastic." Materials Science 25, no. 3 (May 10, 2019): 276–80. http://dx.doi.org/10.5755/j01.ms.25.3.20116.

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In this study, electroless nickel (EN) plating on acrylonitrile butadiene styrene (ABS) engineering plastic using room temperature ionic liquids (RTIL) was studied. Electroless plating is a fundamental step in metal plating on plastic. This step makes the plastic conductive and makes it possible to a homogeneous and hard plating without using any hazardous and unfriendly chemical such as palladium, tin, etc. In the industry there are many distinct chemical materials both catalysts and activation solutions for the electroless bath which is one of the most important parts of the process. In this study the effects of the ionic liquid, plating time, and sand paper size were investigated on electroless nickel plating. The etching and the plating processes were performed with environmentally friendly chemicals instead of the chromic and sulphuric acids used in the traditional processes. Experiments were carried out with and without ionic liquid, EMIC, 1-ethyl-3-methyl imidazolium chloride (C6H11N2Cl), and with 400, 500 and 800 grit sandpaper with the application of the sand attrition process and 70, 80, and 90 °C bath temperatures with 30, 60, and 90 minutes of deposition time. The surface morphology and the thickness of deposit analysis were performed using the Fischer scope X-Ray XDL-B System, X-ray Diffraction (XRD), and Scanning Electron Microscopy (SEM). Due to the results of the experiments and analysis, the electroless nickel plating on ABS plastic was a success. The best plating was obtained at 5.010 μm as the maximum plating thickness, at 90 min of plating time and 80 °C as the plating bath temperature for electroless nickel plating on ABS plastic whit the surface activated with 800 grit sandpaper using EMIC ionic liquid. DOI: http://dx.doi.org/10.5755/j01.ms.25.3.20116
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29

Wu, Ming Ming, and Bai Yang Lou. "Preparation and Corrosion Resistance of Electroless Plating of Ni-Cr-P/Ni-P Composite Coating on Sintered Nd-Fe-B Permanent Magnet." Advanced Materials Research 284-286 (July 2011): 2187–90. http://dx.doi.org/10.4028/www.scientific.net/amr.284-286.2187.

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This paper introduces electroless plating Ni-Cr-P/Ni-P composite coating technologies and techniques on the Nd-Fe-B permanent magnet surface. It has got a Ni-Cr-P/Ni-P composite coating successfully on the Nd-Fe-B substrate surface through rational processing plan. The coating surfaces are bright and have low Porosity, good binding between the electroless plating and Nd-Fe-B matrix. The experimental results show that the composite coating prepared by Ni-Cr-P electroless plating (15min) and Ni-P acidic electroless plating (45min) has amorphous structure, simple process and better anticorrosion property in both alkaline and acidic medium.
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30

Bae, Sung, Sungsoon Kim, Seong Yi, Injoon Son, Kyung Kim, and Hoyong Chung. "Effect of Surface Roughness and Electroless Ni–P Plating on the Bonding Strength of Bi–Te-based Thermoelectric Modules." Coatings 9, no. 3 (March 26, 2019): 213. http://dx.doi.org/10.3390/coatings9030213.

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In this study, electroless-plating of a nickel-phosphor (Ni–P) thin film on surface-controlled thermoelectric elements was developed to significantly increase the bonding strength between Bi–Te materials and copper (Cu) electrodes in thermoelectric modules. Without electroless Ni–P plating, the effect of surface roughness on the bonding strength was negligible. Brittle SnTe intermetallic compounds were formed at the bonding interface of the thermoelectric elements and defects such as pores were generated at the bonding interface owing to poor wettability with the solder. However, defects were not present at the bonding interface of the specimen subjected to electroless Ni–P plating, and the electroless Ni–P plating layer acted as a diffusion barrier toward Sn and Te. The bonding strength was higher when the specimen was subjected to Ni–P plating compared with that without Ni–P plating, and it improved with increasing surface roughness. As electroless Ni–P plating improved the wettability with molten solder, the increase in bonding strength was attributed to the formation of a thicker solder reaction layer below the bonding interface owing to an increase in the bonding interface with the solder at higher surface roughness.
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31

Lee, Kyunbae, Taehoon Kim, Sang Bok Lee, and Byung Mun Jung. "Effect of Pretreatment on Magnetic Nanoparticle Growth on Graphene Surface and Magnetic Performance in Electroless Plating." Journal of Nanomaterials 2019 (March 18, 2019): 1–7. http://dx.doi.org/10.1155/2019/5602742.

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Electroless plating involves sensitization, activation, and plating processes. Sensitization and activation are conducted by dipping the substrate in SnCl2 solution and PdCl2 solution, respectively. These pretreatment processes are required to plate the substrate with noncatalytic surfaces. We investigated the effect of sensitization on the magnetic properties of FeCoNi@graphene hybrids prepared via electroless plating. The solution concentrations during sensitization were varied to observe changes in the structural, morphological, and magnetic properties of FeCoNi@graphene using XRD, TEM, and VSM, respectively. Sensitization under high concentration produced a large amount of SnO2, resulting in low saturation magnetization. Further, the FeCoNi@graphene hybrid prepared via electroless plating without sensitization also exhibited low saturation magnetization owing to the formation of oxides and hydroxides. We prepared FeCoNi@graphene with a saturation magnetization of 40.8 emu/g under sensitization at low concentration; this is the highest saturation magnetization among the reported magnetic material@graphene hybrids prepared via electroless plating. This study provides guidelines for the pretreatment of graphene via electroless plating and should contribute to future studies on the synthesis of magnetic material@graphene hybrids.
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32

Kim, S. S., I. Son, and K. T. Kim. "Effect of Electroless Ni–P Plating on the Bonding Strength of Bi–Te-Based Thermoelectric Modules." Archives of Metallurgy and Materials 62, no. 2 (June 1, 2017): 1225–29. http://dx.doi.org/10.1515/amm-2017-0182.

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AbstractIn the present study, electroless Ni–P plating was applied to Bi–Te-based thermoelectric materials as a barrier layer and the effect of the Ni–P plating on the bonding strength of the thermoelectric module was investigated. The bonding strength of the n- and p-type modules increased after being subjected to the electroless Ni–P plating treatment. In the case of the thermoelectric module that was not subjected to electroless Ni–P plating, Sn and Te were interdiffused and formed a brittle Sn–Te-based metallic compound. The shearing mostly occurred on the bonding interface where such an intermetallic compound was formed. On the other hands, it was found from the FE-EPMA analysis of the bonding interface of thermoelectric module subjected to electroless Ni-P plating that the electroless Ni-P plating acted as an anti-diffusion layer, preventing the interdiffusion of Sn and Te. Therefore, by forming such an anti-diffusion layer on the surface of the Bi–Te based thermoelectric element, the bonding strength of the thermoelectric module could be increased.
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33

Xu, Yang, Sheng Zhi Hao, Xiang Dong Zhang, Min Cai Li, and Chuang Dong. "Influence of High Current Pulsed Electron Beam Irradiation on Ni-P Electroless Plating." Advanced Materials Research 299-300 (July 2011): 77–81. http://dx.doi.org/10.4028/www.scientific.net/amr.299-300.77.

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The surface irradiation of 6063 aluminum alloy by high current pulsed electron was conducted with the aim of replacing the complicated pre-treatment in the processes of electroless plating. To explore the microstructure changes, optical metallography, SEM (scanning electron microscope), XRD (X-ray diffraction) analyses were carried out, and the sliding tests were used for the detection of wear resistance. It was concluded that the HCPEB irradiation could replace the pre-treatment of aluminum substrate as required in conventional electroless plating with a decreased surface roughness of Ni-P alloy plating layer. The plates exhibited an amorphous microstructure as demonstrated by XRD analysis. The plates, produced with the routine of HCPEB irradiation, activation and electroless plating possess, also exhibited good quality, even better than that of conventional electroless plating technique.
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34

ZHANG, HONGYAN, JIAOJUAN ZOU, NAIMING LIN, and BIN TANG. "REVIEW ON ELECTROLESS PLATING Ni–P COATINGS FOR IMPROVING SURFACE PERFORMANCE OF STEEL." Surface Review and Letters 21, no. 04 (August 2014): 1430002. http://dx.doi.org/10.1142/s0218625x14300020.

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Electroless plating has been considered as an effective approach to provide protection and enhancement for metallic materials with many excellent properties in engineering field. This paper begins with a brief introduction of the fundamental aspects underlying the technological principles and conventional process of electroless nickel–phosphorus ( Ni – P ) coatings. Then this paper discusses different electroless nickel plating, including binary plating, ternary composite plating and nickel plating with nanoparticles and rare earth, with the intention of improving the surface performance on steel substrate in recent years in detail. Based on different coating process, the varied features depending on the processing parameters are highlighted. Separately, diverse preparation techniques aiming at improvement of plating efficiency are summarized. Moreover, in view of the outstanding performance, such as corrosion resistance, abrasive resistance and fatigue resistance, this paper critically reviews the behaviors and features of various electroless coatings under different conditions.
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35

Gezerman, Ahmet Ozan, and Burcu Didem Çorbacıoğlu. "2-Mercaptobenzimidazole, 2-Mercaptobenzothiazole, and Thioglycolic Acid in an Electroless Nickel-Plating Bath." Journal of Chemistry 2015 (2015): 1–11. http://dx.doi.org/10.1155/2015/872516.

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The use of three different materials, 2-mercaptobenzimidazole, 2-mercaptobenzothiazole, and thioglycolic acid, was investigated to improve the performance of electroless nickel-plating baths. By changing the concentrations of these materials, sample plates were coated. Optical microscope images were obtained by selecting representative coated plates. From the results of the investigations, the effects of these materials on electroless nickel plating were observed, and the most appropriate amounts of these materials for nickel plating were determined. Moreover, the nickel plating speed observed with the bath solution containing 2-mercaptobenzimidazole, 2-mercaptobenzothiazole, and thioglycolic acid is higher than that in the case of traditional electroless plating baths, but the nickel consumption amount in the former case is lower. In order to minimize the waste water generated from electroless nickel-plating baths, we determined the lowest amounts of the chemicals that can be used for the concentrations reported in the literature.
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36

Dervos, C. T., P. Vassiliou, and J. Novakovic. "Electroless Ni-B plating for electrical contact applications." Revista de Metalurgia 41, Extra (December 17, 2005): 232–38. http://dx.doi.org/10.3989/revmetalm.2005.v41.iextra.1031.

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37

Huang, Yuan Sheng. "Nickel-Diamond Compound Electroless Plating on Cast Aluminum Alloys." Advanced Materials Research 189-193 (February 2011): 265–68. http://dx.doi.org/10.4028/www.scientific.net/amr.189-193.265.

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In order to improve both the hardness and the erosion resistance of cast aluminum alloys, nickel-diamond compound coatings were deposited on the alloys by a compound electroless plating process. The morphology, phase structure, hardness, erosion resistance and adhesion of the electroless coating were investigated. The results show that the pretreatment such as removing the silicon in the surface of the alloys, zinc dipping, alkali electroless nickel is necessary. The deposition of an electroless nickel coating without diamond prior to nickel-diamond electroless plating can improves the erosion resistance. A best nickel-diamond compound electroless plating process is found. The hardness of the nickel-diamond compound coating reaches 730 HV. Both the adhesion and erosion resistance of the compound coatings are very good.
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38

Yu, Zu Xiao, Shi Xiong Hao, Lan Li, and De Tao Zheng. "The Influences of Additives on the Corrosion Resistant Properties of Electroless Plating Ni-W-P Alloy on the Aluminum." Applied Mechanics and Materials 723 (January 2015): 860–63. http://dx.doi.org/10.4028/www.scientific.net/amm.723.860.

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To improve the anti-corrosion properties of the aluminum, the electroless plating Ni-W-P on the aluminum is necessary. Investigation was made on the influences of additives (stabilizers and surfactants) on the deposition rate, weight loss corrosion rate, porosity, corrosion current, corrosion potential, electrochemical impedance spectroscopy (EIS) and webster hardness of electroless plating Ni-W-P alloy coating by electrochemical methods, etc. The results show that the deposition rate and anti-corrosion properties of electroless plating Ni-W-P are obviously improved when the stabilizer KIO3 (1mg/L) is added into plating solution. In addition, the Ni-W-P coating become more dense, uniform and defect-free with the addition of stabilizer KIO3 by comparison with no stabilizer. When the surfactant SDBS (50mg/L) added into bath, the corrosion resistance properties of electroless plating Ni-W-P alloy coating are also obtained.
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39

KOBAYASHI, Michio, and Tadashi IIMORI. "Electroless plating on titanium." Jitsumu Hyomen Gijutsu 35, no. 6 (1988): 312–18. http://dx.doi.org/10.4139/sfj1970.35.312.

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40

KOURA, Nobuyuki, and Atsushi KUBOTA. "Electroless plating of silver." Journal of the Metal Finishing Society of Japan 36, no. 5 (1985): 182–90. http://dx.doi.org/10.4139/sfj1950.36.182.

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41

NAKAZATO, Junichi, Kei HASHIZUME, and Toru MORIMOTO. "Black Electroless Ni Plating." Journal of the Surface Finishing Society of Japan 66, no. 11 (2015): 503–6. http://dx.doi.org/10.4139/sfj.66.503.

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42

WATANABE, Hideto. "Electroless Precious Metal Plating." Journal of The Surface Finishing Society of Japan 70, no. 9 (September 1, 2019): 435–40. http://dx.doi.org/10.4139/sfj.70.435.

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43

NAKAO, YUKIMICHI. "Electroless Plating of Paper." Sen'i Gakkaishi 42, no. 12 (1986): P510—P514. http://dx.doi.org/10.2115/fiber.42.12_p510.

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44

"Electroless plating apparatus and electroless plating method." Metal Finishing 103, no. 6 (June 2005): 67–68. http://dx.doi.org/10.1016/s0026-0576(05)80105-9.

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45

Kim, Na Kyoung, Seung Min Kang, Taegyun Kim, Suhyeon Kim, and Geon Hwee Kim. "Electroless Plating on Polymer Surfaces: Comprehensive Review of Mechanism, Process, Analysis, and Future Applications." Advanced Materials Interfaces, March 10, 2025. https://doi.org/10.1002/admi.202400931.

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AbstractElectroless plating is a solution‐based metal deposition technique through redox reaction, without external power. Due to its simple, versatile, and low‐cost process, coupled with high compatibility with various metals, electroless plating has become a key technology in many industrial fields such as electronics, automotive, aerospace, and biomedical engineering. Recent advances in electroless plating have enabled sophisticated plating on polymers and three‐dimensional surfaces, making it a prominent technology in emerging fields such as selective laser sintering, additive manufacturing, and wearable technology. This review provides a comprehensive overview of electroless plating, from its core theory to the latest research trends. Initially, the detailed mechanism of electroless plating is described, followed by an examination of the plating process. Then, the compositions of a typical electroless plating bath are introduced, and the critical operating parameters are categorized. Next, the evaluation factors of electroless plated surfaces are discussed, along with the current limitations of electroless plating technology. Finally, the various applications of electroless plating studied to date are presented, and future directions for this technology are suggested.
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46

Kılıçay, Koray, and Sevgin Gökel. "Comparison of tribological performance of hard chrome and heat-treated electroless Ni–P platings." Surface Engineering, September 25, 2024. http://dx.doi.org/10.1177/02670844241265682.

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The search for alternatives to hard chrome platings, which have been used in the aviation sector for an extended time but have begun to be abandoned due to their negative effects on human and environmental health, has continued in recent years. Hard chrome plating's primary application in the aviation sector is for wear performance. Electroless Ni–P platings lack the necessary hardness and wear resistance compared to hard chrome platings. The purpose of this study was to determine whether these coatings might be used in place of hard chrome plating and to determine how heat treatment affected the tribological performance of electroless Ni–P platings applied to steel substrates. Hard chrome and electroless Ni–P platings were applied to five different steel substrates. The coatings’ microstructure, bending, corrosion resistance, hardness, and dry sliding wear tests were conducted. It has been shown that heat treating the Ni–P platings can result in appreciable increases in hardness and tribological performance. In the heat-treated coatings, hardness values were higher than those of the hard chrome platings. It was concluded that although hard chrome plating showed better wear resistance, heat-treated electroless Ni–P platings have the potential to compete with hard chrome platings in terms of tribological performance.
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47

"Electroless plating solution." Metal Finishing 98, no. 2 (February 2000): 119. http://dx.doi.org/10.1016/s0026-0576(00)81463-4.

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48

"Electroless plating process." Metal Finishing 98, no. 5 (May 2000): 93–94. http://dx.doi.org/10.1016/s0026-0576(00)81789-4.

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49

"Electroless nickel plating." Metal Finishing 98, no. 7 (July 2000): 71–72. http://dx.doi.org/10.1016/s0026-0576(00)82397-1.

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50

"Monitoring electroless plating." Metal Finishing 98, no. 11 (November 2000): 109–10. http://dx.doi.org/10.1016/s0026-0576(00)83673-9.

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