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Journal articles on the topic 'Electroless plating'

Author: Grafiati

Published: 4 June 2021

Last updated: 25 July 2025

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1

SAITO, Mamoru. "Electroless Plating. Recent Trend of Electroless Plating." Journal of the Surface Finishing Society of Japan 48, no. 4 (1997): 375–79. http://dx.doi.org/10.4139/sfj.48.375.

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2

Aal, A. Abdel, V. V. Khutoryanskiy, Z. S. Nurkeeva, and G. A. Mun. "Optimization of Electroless Copper Plating on Polyethylene Films Modified by Surface Grafting of Vinyl Ether of Monoethanolamine." Eurasian Chemico-Technological Journal 9, no. 1 (2007): 63–69. https://doi.org/10.18321/ectj256.

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Metallized plastics have recently received significant interest for their useful applications in electronic devices such as for integrated circuits, packaging, printed circuits and sensor applications. In this work the metallized films were developed by electroless copper plating of polyethylene films grafted with vinyl ether of monoethanoleamine. There are several techniques for metal deposition on surface of polymers such as evaporation, sputtering, electroless plating and electrolysis. In this work the metallized films were developed by electroless copper plating of polyethylene films graft

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3

Sun, Hua, Xiao Fei Guo, Ke Gao Liu, Hong Fang Ma, and Li Ming Feng. "Influence of Ultrasonic on the Microstructure and Properties of Electroless Plating Ni-Co-P Coating at Low Temperature." Advanced Materials Research 314-316 (August 2011): 259–62. http://dx.doi.org/10.4028/www.scientific.net/amr.314-316.259.

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By electron energy spectrometer,X-ray diffractometer,transmission elec-tron microscopy andmicro-hardometer,the depositing speed of electrolessNi-Co-P plating baths,chemical composition,crystal structure and microhardness of the alloy coatings were inspected and analyzed with ultrasonic and rare earth metalcerium intervening in electroless Ni-Co-P plating•The results show that the depositing speed of electroless Ni-Co-P plating isobviously increased under the effect of ultrasonic.The chemical compositions of electroless Ni-Co-P plating are changed，The XRD of coating has a diffuse sexual diffrac

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4

HARADA, Hisashi. "Electroless Plating." Journal of the Japan Society of Colour Material 69, no. 1 (1996): 60–70. http://dx.doi.org/10.4011/shikizai1937.69.60.

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5

UCHIDA, Ei. "Electroless Plating. Electroless Palladium Plating and Its Applications." Journal of the Surface Finishing Society of Japan 48, no. 4 (1997): 400–404. http://dx.doi.org/10.4139/sfj.48.400.

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6

SAKATA, Takahiro, and Hideo HONMA. "Electroless copper plating by applying electrolysis." Journal of the Surface Finishing Society of Japan 40, no. 3 (1989): 488–89. http://dx.doi.org/10.4139/sfj.40.488.

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7

Uraz, Canan, and Tuğba Gürmen Özçelik. "ELECTROLESS METAL PLATING OVER ABS PLASTIC." E-journal of New World Sciences Academy 14, no. 2 (2019): 63–70. http://dx.doi.org/10.12739/nwsa.2019.14.2.1a0432.

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8

SHIBATA, Mitsuo. "Electroless Plating. Direct Electroless Nickel Plating on Magnesium Alloys." Journal of the Surface Finishing Society of Japan 48, no. 4 (1997): 413–16. http://dx.doi.org/10.4139/sfj.48.413.

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9

KAMIYAMA, Hiroharu. "Electroless copper plating." Circuit Technology 4, no. 6 (1989): 318–26. http://dx.doi.org/10.5104/jiep1986.4.318.

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10

HONMA, Hideo, Yasunori KOUCHI, and Masaaki OYAMADA. "Electroless Solder Plating." Circuit Technology 6, no. 6 (1991): 299–305. http://dx.doi.org/10.5104/jiep1986.6.6_299.

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11

Brown, L. D. "Electroless nickel plating." International Materials Reviews 37, no. 1 (1992): 196. http://dx.doi.org/10.1179/imr.1992.37.1.196.

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12

Brown, L. D. "‘Electroless nickel plating’." British Corrosion Journal 27, no. 1 (1992): 25–26. http://dx.doi.org/10.1179/000705992798268882.

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13

Henry, James R. "Electroless (autocatalytic) plating." Metal Finishing 98, no. 1 (2000): 424–35. http://dx.doi.org/10.1016/s0026-0576(00)80351-7.

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14

Henry, James R. "Electroless (autocatalytic) plating." Metal Finishing 97, no. 1 (1999): 424–35. http://dx.doi.org/10.1016/s0026-0576(00)83102-5.

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15

Henry, James R. "Electroless (autocatalytic) plating." Metal Finishing 99 (January 2001): 424–35. http://dx.doi.org/10.1016/s0026-0576(01)85302-2.

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16

Henry, James R. "Electroless (autocatalytic) plating." Metal Finishing 100 (January 2002): 409–20. http://dx.doi.org/10.1016/s0026-0576(02)82044-x.

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17

Henry, James R. "Electroless (autocatalytic) plating." Metal Finishing 97, no. 1 (1999): 431–42. http://dx.doi.org/10.1016/s0026-0576(99)80044-0.

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18

Baudrand, Don, and Jon Bengston. "Electroless plating processes." Metal Finishing 93, no. 9 (1995): 55–57. http://dx.doi.org/10.1016/0026-0576(95)99502-2.

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19

NAKAGISHI, Yutaka. "Electroless Plating. Functional Separation and Application of Electroless Nickel Plating." Journal of the Surface Finishing Society of Japan 48, no. 4 (1997): 380–86. http://dx.doi.org/10.4139/sfj.48.380.

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20

NISHIYAMA, Kouji, and Hideto WATANABE. "Electroless Plating. The Type and Application of Electroless Gold Plating." Journal of the Surface Finishing Society of Japan 48, no. 4 (1997): 393–99. http://dx.doi.org/10.4139/sfj.48.393.

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21

NITTA, Masahiro, and Hiroshi ADACHI. "Electroless Plating. Deep Black Electroless Nickel Plating-Phos Black II." Journal of the Surface Finishing Society of Japan 48, no. 4 (1997): 417–19. http://dx.doi.org/10.4139/sfj.48.417.

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22

Fan, Qingming, Guokang Su, Congmin Zhu, et al. "Optimization and Experimental Analysis of Electroless Nickel Plating on the Diamond Surface." Micromachines 16, no. 6 (2025): 709. https://doi.org/10.3390/mi16060709.

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Coating diamond particle surfaces with a layer of high-temperature resistant nickel, which possesses weldability, effectively enhances the bonding strength between diamond particles and substrates in pre-grinding tools. This improves their stability and strength at high temperatures, thereby enhancing the performance, lifespan, and efficiency of grinding tools. This paper explores the electroless nickel plating process on diamond surfaces, analyzes the working principle of electroless nickel plating on diamond surfaces, and proposes the use of 2 g/L AgNO3 solution and 2 g/L AgNO3 + 10 mL/L NH3

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23

Liu, Guan Jun, Xin Hua Mao, Jun Cao, and Zhou Yu. "Effect of Heat Treatment on Hardness of Electroless Ni-P Plating." Advanced Materials Research 228-229 (April 2011): 878–82. http://dx.doi.org/10.4028/www.scientific.net/amr.228-229.878.

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Hardness of electronless Ni-P alloy plating which have five different phosphorus content were investigated with HX-1000 type microscopic Vickers hardness tester, respectively. Phosphorus content of Ni-P platings were investigated by Quanta 200 type scanning electron microscope and Oxford Energy Disperse Spectroscopy Heat treatment temperature and time of the different platings were optimized and analysed by Uniform Design method, respectively. The results show that correlation consist between maximum hardness of the Ni-P alloy plating and heat treatment temperature, not heat treatment time und

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24

Liu, Yan Ping, Yan Mei Zhang, Yuan Gao, and Zhong Xu. "The Influence of Impulse Electroless Plating on Amorphous Ni-P Alloys in Structure and Hot Stability." Materials Science Forum 475-479 (January 2005): 3989–92. http://dx.doi.org/10.4028/www.scientific.net/msf.475-479.3989.

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Using a special impulse device, the impulse electroless Ni-P alloy plating were prepared. The microstructure、crystallization and the starting activation energy for crystallization was investigated by TEM、XRD and DTA, compared with electroless Ni-P alloys plating. The results showed that the diffractive ring was wider when using impulse, depositing temperature dropped up to 65°C,and crystallization temperature rose up to 310°C. Furthermore , the starting activation energy for crystallization and crystallization temperature of impulse electroless Ni-P alloys plating measured were more than that

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25

Wanping, Chen, Li Longtu, and Gui Zhilun. "Effects of Electroless Nickel Plating on Resistivity-temperature Characteristics of (Ba1-xPbx)TiO3thermistor." Journal of Materials Research 12, no. 4 (1997): 877–79. http://dx.doi.org/10.1557/jmr.1997.0127.

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Effects of electroless nickel plating on resistivity-temperature (R-T) characteristics of (Ba1-xPbx)TiO3 thermistor were studied. Comparison experiments showed that not only the permeation of plating solution, but also the reaction of electroless nickel plating influences the positive temperature coefficient (PTC) effect, and that the two effects are different in nature. It is first proposed in this paper that hydrogen atoms generated in electroless nickel plating may reduce components of PTC ceramics.

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26

FUJINAMI, Tomoyuki. "Electroless Plating. Various Functional Applications of Formalin-Free Electroless Copper Plating." Journal of the Surface Finishing Society of Japan 48, no. 4 (1997): 387–92. http://dx.doi.org/10.4139/sfj.48.387.

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27

Feng, Li Ming, and Xue Wei. "On the Dispersants of Diamond-Ni-P Composite Electroless Plating and Properties of the Coating." Advanced Materials Research 189-193 (February 2011): 181–85. http://dx.doi.org/10.4028/www.scientific.net/amr.189-193.181.

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In order to obtain stable and homogeneous diamond-Ni-P composite electroless plating, dispersants were selected by determining the height of emulsion in the colorimetric cylinder after standing different time.The structure,elemental contents and properties of the diamond-Ni-P composite electroless plating coating were investigated by SEM and EDS. Experimental results show that OP-10 of 50mL•L-1 and softex kw of 1g•L-1 have better dispersing effect to diamond powder of 1g•L-1 in water. This composite electroless plating solution can keep stable for more than twelve or eight hours respectively a

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28

ZHAO, YAN, RUN ZHANG, TONG ZHANG, and YUEXIN DUAN. "EFFECT OF DIFFERENT PRETREATMENTS TO ELECTROLESS NICKEL OR COBALT PLATING ON HOLLOW MICROSPHERES." International Journal of Modern Physics B 24, no. 15n16 (2010): 2706–11. http://dx.doi.org/10.1142/s0217979210065507.

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Different pretreatment methods for electroless nickel and cobalt plating are demonstrated and compared in the present investigation. The surface morphologies of the nickel or cobalt deposits are investigated by scanning electron microscopy (SEM), and the chemical compositions of the coatings are analyzed by energy-dispersive X-ray spectroscopy (EDX). Method of single-step pretreatment is selected as the optimized method for electroless nickel plating process, while improved two-step sensitization-activation and single-step pretreatment methods can be selected for electroless cobalt plating. It

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29

URAZ, Canan. "Effect of Room Temperature Ionic Liquids for Electroless Nickel Plating on Acrylonitrile Butadiene Styrene Plastic." Materials Science 25, no. 3 (2019): 276–80. http://dx.doi.org/10.5755/j01.ms.25.3.20116.

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In this study, electroless nickel (EN) plating on acrylonitrile butadiene styrene (ABS) engineering plastic using room temperature ionic liquids (RTIL) was studied. Electroless plating is a fundamental step in metal plating on plastic. This step makes the plastic conductive and makes it possible to a homogeneous and hard plating without using any hazardous and unfriendly chemical such as palladium, tin, etc. In the industry there are many distinct chemical materials both catalysts and activation solutions for the electroless bath which is one of the most important parts of the process. In this

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30

Wu, Ming Ming, and Bai Yang Lou. "Preparation and Corrosion Resistance of Electroless Plating of Ni-Cr-P/Ni-P Composite Coating on Sintered Nd-Fe-B Permanent Magnet." Advanced Materials Research 284-286 (July 2011): 2187–90. http://dx.doi.org/10.4028/www.scientific.net/amr.284-286.2187.

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This paper introduces electroless plating Ni-Cr-P/Ni-P composite coating technologies and techniques on the Nd-Fe-B permanent magnet surface. It has got a Ni-Cr-P/Ni-P composite coating successfully on the Nd-Fe-B substrate surface through rational processing plan. The coating surfaces are bright and have low Porosity, good binding between the electroless plating and Nd-Fe-B matrix. The experimental results show that the composite coating prepared by Ni-Cr-P electroless plating (15min) and Ni-P acidic electroless plating (45min) has amorphous structure, simple process and better anticorrosion

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31

Bae, Sung, Sungsoon Kim, Seong Yi, Injoon Son, Kyung Kim, and Hoyong Chung. "Effect of Surface Roughness and Electroless Ni–P Plating on the Bonding Strength of Bi–Te-based Thermoelectric Modules." Coatings 9, no. 3 (2019): 213. http://dx.doi.org/10.3390/coatings9030213.

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In this study, electroless-plating of a nickel-phosphor (Ni–P) thin film on surface-controlled thermoelectric elements was developed to significantly increase the bonding strength between Bi–Te materials and copper (Cu) electrodes in thermoelectric modules. Without electroless Ni–P plating, the effect of surface roughness on the bonding strength was negligible. Brittle SnTe intermetallic compounds were formed at the bonding interface of the thermoelectric elements and defects such as pores were generated at the bonding interface owing to poor wettability with the solder. However, defects were

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32

Lee, Kyunbae, Taehoon Kim, Sang Bok Lee, and Byung Mun Jung. "Effect of Pretreatment on Magnetic Nanoparticle Growth on Graphene Surface and Magnetic Performance in Electroless Plating." Journal of Nanomaterials 2019 (March 18, 2019): 1–7. http://dx.doi.org/10.1155/2019/5602742.

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Electroless plating involves sensitization, activation, and plating processes. Sensitization and activation are conducted by dipping the substrate in SnCl2 solution and PdCl2 solution, respectively. These pretreatment processes are required to plate the substrate with noncatalytic surfaces. We investigated the effect of sensitization on the magnetic properties of FeCoNi@graphene hybrids prepared via electroless plating. The solution concentrations during sensitization were varied to observe changes in the structural, morphological, and magnetic properties of FeCoNi@graphene using XRD, TEM, and

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33

Kim, S. S., I. Son, and K. T. Kim. "Effect of Electroless Ni–P Plating on the Bonding Strength of Bi–Te-Based Thermoelectric Modules." Archives of Metallurgy and Materials 62, no. 2 (2017): 1225–29. http://dx.doi.org/10.1515/amm-2017-0182.

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AbstractIn the present study, electroless Ni–P plating was applied to Bi–Te-based thermoelectric materials as a barrier layer and the effect of the Ni–P plating on the bonding strength of the thermoelectric module was investigated. The bonding strength of the n- and p-type modules increased after being subjected to the electroless Ni–P plating treatment. In the case of the thermoelectric module that was not subjected to electroless Ni–P plating, Sn and Te were interdiffused and formed a brittle Sn–Te-based metallic compound. The shearing mostly occurred on the bonding interface where such an i

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34

Xu, Yang, Sheng Zhi Hao, Xiang Dong Zhang, Min Cai Li, and Chuang Dong. "Influence of High Current Pulsed Electron Beam Irradiation on Ni-P Electroless Plating." Advanced Materials Research 299-300 (July 2011): 77–81. http://dx.doi.org/10.4028/www.scientific.net/amr.299-300.77.

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The surface irradiation of 6063 aluminum alloy by high current pulsed electron was conducted with the aim of replacing the complicated pre-treatment in the processes of electroless plating. To explore the microstructure changes, optical metallography, SEM (scanning electron microscope), XRD (X-ray diffraction) analyses were carried out, and the sliding tests were used for the detection of wear resistance. It was concluded that the HCPEB irradiation could replace the pre-treatment of aluminum substrate as required in conventional electroless plating with a decreased surface roughness of Ni-P al

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35

ZHANG, HONGYAN, JIAOJUAN ZOU, NAIMING LIN, and BIN TANG. "REVIEW ON ELECTROLESS PLATING Ni–P COATINGS FOR IMPROVING SURFACE PERFORMANCE OF STEEL." Surface Review and Letters 21, no. 04 (2014): 1430002. http://dx.doi.org/10.1142/s0218625x14300020.

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Electroless plating has been considered as an effective approach to provide protection and enhancement for metallic materials with many excellent properties in engineering field. This paper begins with a brief introduction of the fundamental aspects underlying the technological principles and conventional process of electroless nickel–phosphorus ( Ni – P ) coatings. Then this paper discusses different electroless nickel plating, including binary plating, ternary composite plating and nickel plating with nanoparticles and rare earth, with the intention of improving the surface performance on st

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36

Gezerman, Ahmet Ozan, and Burcu Didem Çorbacıoğlu. "2-Mercaptobenzimidazole, 2-Mercaptobenzothiazole, and Thioglycolic Acid in an Electroless Nickel-Plating Bath." Journal of Chemistry 2015 (2015): 1–11. http://dx.doi.org/10.1155/2015/872516.

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The use of three different materials, 2-mercaptobenzimidazole, 2-mercaptobenzothiazole, and thioglycolic acid, was investigated to improve the performance of electroless nickel-plating baths. By changing the concentrations of these materials, sample plates were coated. Optical microscope images were obtained by selecting representative coated plates. From the results of the investigations, the effects of these materials on electroless nickel plating were observed, and the most appropriate amounts of these materials for nickel plating were determined. Moreover, the nickel plating speed observed

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37

Dervos, C. T., P. Vassiliou, and J. Novakovic. "Electroless Ni-B plating for electrical contact applications." Revista de Metalurgia 41, Extra (2005): 232–38. http://dx.doi.org/10.3989/revmetalm.2005.v41.iextra.1031.

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38

Huang, Yuan Sheng. "Nickel-Diamond Compound Electroless Plating on Cast Aluminum Alloys." Advanced Materials Research 189-193 (February 2011): 265–68. http://dx.doi.org/10.4028/www.scientific.net/amr.189-193.265.

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In order to improve both the hardness and the erosion resistance of cast aluminum alloys, nickel-diamond compound coatings were deposited on the alloys by a compound electroless plating process. The morphology, phase structure, hardness, erosion resistance and adhesion of the electroless coating were investigated. The results show that the pretreatment such as removing the silicon in the surface of the alloys, zinc dipping, alkali electroless nickel is necessary. The deposition of an electroless nickel coating without diamond prior to nickel-diamond electroless plating can improves the erosion

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39

Yu, Zu Xiao, Shi Xiong Hao, Lan Li, and De Tao Zheng. "The Influences of Additives on the Corrosion Resistant Properties of Electroless Plating Ni-W-P Alloy on the Aluminum." Applied Mechanics and Materials 723 (January 2015): 860–63. http://dx.doi.org/10.4028/www.scientific.net/amm.723.860.

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To improve the anti-corrosion properties of the aluminum, the electroless plating Ni-W-P on the aluminum is necessary. Investigation was made on the influences of additives (stabilizers and surfactants) on the deposition rate, weight loss corrosion rate, porosity, corrosion current, corrosion potential, electrochemical impedance spectroscopy (EIS) and webster hardness of electroless plating Ni-W-P alloy coating by electrochemical methods, etc. The results show that the deposition rate and anti-corrosion properties of electroless plating Ni-W-P are obviously improved when the stabilizer KIO3 (1

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40

Li, Jian Zhong, Yan Wen Tian, Ying Li, and Xiang Rong Wang. "Process of Ni-P Electroless Deposition on SiCp/Al Composites from Acid Bath." Advanced Materials Research 160-162 (November 2010): 314–18. http://dx.doi.org/10.4028/www.scientific.net/amr.160-162.314.

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The initial nickel deposition for the direct electroless nickel plating on active SiCp/Al composites is critical. So it is necessary to investigate the process of the electroless Ni-P plating deposition on SiCp/Al composites by means of scanning electron microscopy (SEM) and energy dispersive X-ray spectroscopy (EDS). In addition, the mass gain/loss in the initial nickel deposition process was measured by using the electro-balance. The results show that after being treated using phosphoric acid and hydrogen peroxide, the compositions of SiCp/Al composites substrate contains Al, SiC and Al2O3.

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41

KOBAYASHI, Michio, and Tadashi IIMORI. "Electroless plating on titanium." Jitsumu Hyomen Gijutsu 35, no. 6 (1988): 312–18. http://dx.doi.org/10.4139/sfj1970.35.312.

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42

KOURA, Nobuyuki, and Atsushi KUBOTA. "Electroless plating of silver." Journal of the Metal Finishing Society of Japan 36, no. 5 (1985): 182–90. http://dx.doi.org/10.4139/sfj1950.36.182.

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43

NAKAZATO, Junichi, Kei HASHIZUME, and Toru MORIMOTO. "Black Electroless Ni Plating." Journal of the Surface Finishing Society of Japan 66, no. 11 (2015): 503–6. http://dx.doi.org/10.4139/sfj.66.503.

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44

WATANABE, Hideto. "Electroless Precious Metal Plating." Journal of The Surface Finishing Society of Japan 70, no. 9 (2019): 435–40. http://dx.doi.org/10.4139/sfj.70.435.

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45

NAKAO, YUKIMICHI. "Electroless Plating of Paper." Sen'i Gakkaishi 42, no. 12 (1986): P510—P514. http://dx.doi.org/10.2115/fiber.42.12_p510.

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46

"Electroless plating apparatus and electroless plating method." Metal Finishing 103, no. 6 (2005): 67–68. http://dx.doi.org/10.1016/s0026-0576(05)80105-9.

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47

Kim, Na Kyoung, Seung Min Kang, Taegyun Kim, Suhyeon Kim, and Geon Hwee Kim. "Electroless Plating on Polymer Surfaces: Comprehensive Review of Mechanism, Process, Analysis, and Future Applications." Advanced Materials Interfaces, March 10, 2025. https://doi.org/10.1002/admi.202400931.

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AbstractElectroless plating is a solution‐based metal deposition technique through redox reaction, without external power. Due to its simple, versatile, and low‐cost process, coupled with high compatibility with various metals, electroless plating has become a key technology in many industrial fields such as electronics, automotive, aerospace, and biomedical engineering. Recent advances in electroless plating have enabled sophisticated plating on polymers and three‐dimensional surfaces, making it a prominent technology in emerging fields such as selective laser sintering, additive manufacturin

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48

Kılıçay, Koray, and Sevgin Gökel. "Comparison of tribological performance of hard chrome and heat-treated electroless Ni–P platings." Surface Engineering, September 25, 2024. http://dx.doi.org/10.1177/02670844241265682.

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The search for alternatives to hard chrome platings, which have been used in the aviation sector for an extended time but have begun to be abandoned due to their negative effects on human and environmental health, has continued in recent years. Hard chrome plating's primary application in the aviation sector is for wear performance. Electroless Ni–P platings lack the necessary hardness and wear resistance compared to hard chrome platings. The purpose of this study was to determine whether these coatings might be used in place of hard chrome plating and to determine how heat treatment affected

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49

"Electroless plating solution." Metal Finishing 98, no. 2 (2000): 119. http://dx.doi.org/10.1016/s0026-0576(00)81463-4.

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50

"Electroless plating process." Metal Finishing 98, no. 5 (2000): 93–94. http://dx.doi.org/10.1016/s0026-0576(00)81789-4.

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