Relevant bibliographies by topics / Electromagnetic Compatibility of integrated circuits

Contents

  1. Journal articles
  2. Dissertations / Theses
  3. Books
  4. Book chapters
  5. Conference papers
  6. Reports

Academic literature on the topic 'Electromagnetic Compatibility of integrated circuits'

Author: Grafiati
Published: 4 June 2021
Last updated: 10 February 2022

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Journal articles on the topic "Electromagnetic Compatibility of integrated circuits"

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Sicard, E. "Electromagnetic compatibility of integrated circuits." Microelectronics Journal 35, no. 6 (2004): 485–86. http://dx.doi.org/10.1016/j.mejo.2003.11.010.

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Zhang, Jie, Xu Zhang, Guo Kai Jiang, Hai Ming Liu, and Yan Fan. "Overview of Electromagnetic Compatibility in Automotive Integrated Circuits." Journal of Physics: Conference Series 1607 (August 2020): 012034. http://dx.doi.org/10.1088/1742-6596/1607/1/012034.

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Wang, Hong You, and Jin Guang Li. "Research on Interference of Electromagnetic Radiation on Micro-Strip Line." Applied Mechanics and Materials 110-116 (October 2011): 971–76. http://dx.doi.org/10.4028/www.scientific.net/amm.110-116.971.

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Micro-strip line is a kind of transmission line that is the most widely used in microwave integrated circuit. With the development of microwave integrated circuits and the increasing work frequency of the micro-strip line, a higher requirement for its electromagnetic compatibility has been raised. Finite-Difference Time-Domain (FDTD) method has characteristics of good adaptability in the analysis of electromagnetic compatibility issues and superiority in complexity of the structure modeling. For these reasons, this Article uses FDTD method which is widely used in electromagnetic field calculat
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Sicard, E., and J. M. Dienot. "Issues in electromagnetic compatibility of integrated circuits: emission and susceptibility." Microelectronics Reliability 45, no. 9-11 (2005): 1277–84. http://dx.doi.org/10.1016/j.microrel.2005.07.057.

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Carlton, Ross M. "An overview of standards in electromagnetic compatibility for integrated circuits." Microelectronics Journal 35, no. 6 (2004): 487–95. http://dx.doi.org/10.1016/j.mejo.2003.11.011.

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Ramdani, Mohamed, Etienne Sicard, Alexandre Boyer, et al. "The Electromagnetic Compatibility of Integrated Circuits—Past, Present, and Future." IEEE Transactions on Electromagnetic Compatibility 51, no. 1 (2009): 78–100. http://dx.doi.org/10.1109/temc.2008.2008907.

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Zeng, Xiang-jun, Xu Yang, and Zhao-an Wang Xi'an. "Analysis of Capacitive and Inductive Coupling inside Hybrid Integrated Power Electronic Module." Journal of Microelectronics and Electronic Packaging 1, no. 3 (2004): 169–75. http://dx.doi.org/10.4071/1551-4897-1.3.169.

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Electromagnetic compatibility has to be given enough attention in the design of hybrid Integrated Power Electronic Module (IPEM) due to the sharply decreased distances between power devices and the control/driving circuits as compared to such distances for conventional power electronic equipment built with discrete devices. The high dν/dt, di/dt and high frequency parasitic ringing emanating from the switching circuit can cause serious EMI within the control/driving circuit due to cross-coupling. This paper analyzes the capacitive and inductive cross-coupling problems inside an IPEM. Finite El
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Demakov, A. V., and M. E. Komnatnov. "Development of a TEM-cell for electromagnetic compatibility testing of integrated circuits." Proceedings of Tomsk State University of Control Systems and Radioelectronics 21, no. 1 (2018): 52–56. http://dx.doi.org/10.21293/1818-0442-2018-21-1-52-56.

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Глотова, Т. С., А. С. Иваницкий, and В. В. Глотов. "EQUIVALENT DIPOLE MODEL FOR ESTIMATING THE NEAR FIELD OF RES STRUCTURES." ВЕСТНИК ВОРОНЕЖСКОГО ГОСУДАРСТВЕННОГО ТЕХНИЧЕСКОГО УНИВЕРСИТЕТА, no. 5() (November 18, 2020): 102–6. http://dx.doi.org/10.36622/vstu.2020.16.5.015.

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Электромагнитная совместимость интегральных микросхем становится все более важным аспектом в разработке высокоскоростных печатных плат. Международные стандарты были установлены для количественной и качественной оценки характеристик интегральных микросхем, а также помехоустойчивости с использованием различных методов измерения. Для решения задач, связанных с прогнозированием электромагнитных помех между интегральными микросхемами и печатными платами, необходимы модели интегральных микросхем как на внутриаппаратурном уровне, так и внутрисистемном. Такие модели могут быть получены из моделировани
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Кондрашов, Д. А., та А. А. Шостак. "ПОЧЕМУ НЕВОЗМОЖНА АВТОМАТИЗАЦИЯ ПРИ ВЫЯВЛЕНИИ ПОМЕХ НА ИНТЕГРАЛЬНЫХ МИКРОСХЕМАХ (ИС)?" NANOINDUSTRY Russia 96, № 3s (2020): 524–27. http://dx.doi.org/10.22184/1993-8578.2020.13.3s.524.527.

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Рассмотрены методы возникновения помех в интегральных микросхемах (ИС), способы проверки на помехоустойчивость и помехоэмисиию ИС, меры по повышению электромагнитной совместимости ИС. The paper highlights methods of the occurrence of interference in integrated circuits (ICs), as well as methods for checking the radiated immunity and radiated emission of an IC, and measures to increase the electromagnetic compatibility of an IC.
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Dissertations / Theses on the topic "Electromagnetic Compatibility of integrated circuits"

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Huang, Kuan Hsiang Nick, and 黃冠翔. "Electromagnetic compatibility modeling for integrated circuits." Thesis, The University of Hong Kong (Pokfulam, Hong Kong), 2014. http://hdl.handle.net/10722/206335.

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The integrated circuit (IC) packaging electromagnetic compatibility (EMC)/signal integrity (SI)/power integrity (PI) problems have been broadly attested. But IC packaging electromagnetic interference (EMI) was seldom addressed. Because the electromagnetic emission from IC packagings becomes more critical as the data rate of digital system continues increasing. Its working mechanism and modeling technology are very important. In this thesis, EM emission behaviors of IC packaging are systematically studied for the first time. It was never seen from other literatures. The fundamental principle
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Li, Shaohua. "Development and validation of a microcontroller emissions model." Diss., Rolla, Mo. : Missouri University of Science and Technology, 2008. http://scholarsmine.mst.edu/thesis/pdf/Li_09007dcc804e2d0e.pdf.

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Thesis (M.S.)--Missouri University of Science and Technology, 2008.<br>Vita. The entire thesis text is included in file. Title from title screen of thesis/dissertation PDF file (viewed May 5, 2008) Includes bibliographical references (p. 21-22).
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Kasturi, Vijay. "The influence of printed circuit board design on TEM cell measurements." Diss., Rolla, Mo. : University of Missouri-Rolla, 2007. http://scholarsmine.mst.edu/thesis/pdf/Kasturi_09007dcc8048d628.pdf.

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Thesis (M.S.)--University of Missouri--Rolla, 2007.<br>Vita. The entire thesis text is included in file. Title from title screen of thesis/dissertation PDF file (viewed March 24, 2008) Includes bibliographical references (p. 105-106).
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Bèges, Rémi. "Analysis and modeling methods for predicting functional robustness of integrated circuits during fast transient events." Thesis, Toulouse 3, 2017. http://www.theses.fr/2017TOU30046/document.

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La miniaturisation des circuits intégrés se poursuit de nos jours avec le développement de technologies toujours plus fines et denses. Elle permet une intégration des circuits toujours plus massive, avec des performances plus élevées et une réduction des coûts de production. La réduction de taille des circuits s'accompagne aussi d'une augmentation de leur sensibilité électrique. L'électronique automobile est un acteur majeur dans la nouvelle tendance des véhicules autonomes. Ce type d'application a besoin d'analyser des données et d'appliquer des actions sur le véhicule en temps réel. L'object
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Ndoye, Amadou cissé. "Contribution à la modélisation de l'immunité conduite des circuits intégrés et étude de l'impact du vieillissement sur leur compatibilité électromagnétique." Thesis, Toulouse, INSA, 2010. http://www.theses.fr/2010ISAT0023/document.

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Le développement de l'électronique dans les systèmes embarqués à application aéronautique, spatial, ou encore automobile est alimenté par des performances croissantes, une intégration poussée et des coûts attractifs, permettant aux industriels d'offrir des solutions techniques et économiques concurrentielles. Néanmoins, cette évolution rapide nécessite une remise en cause permanente des méthodes de conception des systèmes embarqués, dont on doit garantir la maîtrise du comportement dans des environnements sévères. En particulier, la maîtrise de la compatibilité électromagnétique (CEM) est un é
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Op, 'T Land Sjoerd. "La modélisation de l’immunité des circuits intégrés au-delà de 1 GHz." Thesis, Rennes, INSA, 2014. http://www.theses.fr/2014ISAR0029/document.

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La compatibilité électromagnétique (CEM) est l'aptitude des produits électroniques à coexister au niveau électromagnétique. Dans la pratique, c'est une tâche très complexe que de concevoir des produits compatibles. L'arme permettant de concevoir des produits bon-du-premier-coup est la modélisation. Cette thèse étudie l'utilité et la faisabilité de la modélisation de l'immunité des circuits intégrés (CI) au-delà de 1 GHz. Si les pistes des circuits imprimés déterminent l'immunité rayonnée de ces circuits, il serait pertinent de pouvoir prévoir l'efficacité de couplage et de comprendre comment e
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Huang, He. "Développement de modèles prédictifs pour la robustesse électromagnétique des composants électroniques." Thesis, Toulouse, INSA, 2015. http://www.theses.fr/2015ISAT0036/document.

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Un objectif important des études de la compatibilité électromagnétique (CEM) est de rendre les produits conformes aux exigences CEM des clients ou les normes. Cependant, toutes les vérifications de la conformité CEM sont appliquées avant la livraison des produits finis. Donc nous pourrions avoir de nouvelles questions sur les performances CEM des systèmes électroniques au cours de leur vie. Les comportements CEM de ces produits seront-ils toujours conformes dans plusieurs années ? Un produit peut-il garder les mêmes performances CEM pendant toute sa durée de vie ? Si non, combien de temps la c
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Baptistat, Nicolas. "Etude et corrélation de l’influence des paramètres électriques sur la compatibilité électromagnétique." Thesis, Bordeaux, 2020. http://www.theses.fr/2020BORD0179.

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Les progrès des techniques de fabrication des systèmes électroniques permettent de réduire considérablement la taille des composants tout en augmentant les performances des circuits intégrés d'un point de vue rapidité ainsi que de consommation pour n'en citer que quelques-unes. Toutefois, cette révolution technologique génère davantage de problèmes de compatibilité électromagnétique (CEM). Pour pallier cela, les ingénieurs qui conçoivent les circuits électroniques réalisent différents tests de simulations et mesures CEM.Cependant, ces tests peuvent paraître insuffisants du fait qu'ils ne tienn
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Thomas, tomasevic Marc veljko. "Etude des couplages substrats dans des circuits mixtes "Smart Power" pour applications automobiles." Thesis, Toulouse, INSA, 2017. http://www.theses.fr/2017ISAT0002/document.

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Les circuits Smart Power, utilisés dans l’industrie automobile, se caractérisent par l’intégration sur une puce des parties de puissance avec des parties analogiques&amp;numériques basse tension. Leur principal point faible vient de la commutation des structures de puissance sur des charges inductives. Celles-ci injectent des courants parasites dans le substrat, pouvant activer des structures bipolaires parasites inhérentes au layout du circuit, menant à une défaillance ou la destruction du circuit intégré.Ces structures parasites ne sont pas actuellement modélisées dans les outils CAO ni simu
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Deobarro, Mikaël. "Etude de l'immunité des circuits intégrés face aux agressions électromagnétiques : proposition d'une méthode de prédiction des couplages des perturbations en mode conduit." Thesis, Toulouse, INSA, 2011. http://www.theses.fr/2011ISAT0002/document.

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Avec les progrès technologiques réalisés au cours de ces dernières décennies, la complexité et les vitesses de fonctionnement des circuits intégrés ont beaucoup été augmentées. Bien que ces évolutions aient permis de diminuer les dimensions et les tensions d’alimentations des circuits, la compatibilité électromagnétique (CEM) des composants a fortement été dégradée. Identifiée comme étant un verrou technologique, la CEM est aujourd’hui l’une des principales causes de « re-design » des circuits car les problématiques liées aux mécanismes de génération et de couplage du bruit ne sont pas suffisa
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Books on the topic "Electromagnetic Compatibility of integrated circuits"

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Ben Dhia, Sonia, Mohamed Ramdani, and Etienne Sicard, eds. Electromagnetic Compatibility of Integrated Circuits. Springer US, 2006. http://dx.doi.org/10.1007/b137864.

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Sketoe, J. G. Integrated circuit electromagnetic immunity handbook. National Aeronautics and Space Administration, Marshall Space Flight Center, 2000.

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Redouté, Jean-Michel. EMC of analog integrated circuits. Springer, 2010.

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Redouté, Jean-Michel. EMC of analog integrated circuits. Springer, 2010.

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EMC at component and PCB level. Newnes, 1998.

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Electromagnetics for high-speed analog and digital communication circuits. Cambridge University Press, 2006.

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Electromagnetic compatibility. Prentice Hall, 1992.

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1936-, Ott Henry W., ed. Electromagnetic compatibility engineering. John Wiley & Sons, 2009.

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Introduction to electromagnetic compatibility. 2nd ed. John Wiley & Sons, 2006.

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Introduction to electromagnetic compatibility. Wiley, 1992.

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Book chapters on the topic "Electromagnetic Compatibility of integrated circuits"

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Ben Dhia, Sonia, Mohamed Ramdani, and Etienne Sicard. "Basic Concepts in EMC for ICs." In Electromagnetic Compatibility of Integrated Circuits. Springer US, 2006. http://dx.doi.org/10.1007/0-387-26601-1_1.

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Ben Dhia, Sonia, Mohamed Ramdani, and Etienne Sicard. "Historical Review and State-of-the art." In Electromagnetic Compatibility of Integrated Circuits. Springer US, 2006. http://dx.doi.org/10.1007/0-387-26601-1_2.

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Ben Dhia, Sonia, Mohamed Ramdani, and Etienne Sicard. "Fundamentals and Theory." In Electromagnetic Compatibility of Integrated Circuits. Springer US, 2006. http://dx.doi.org/10.1007/0-387-26601-1_3.

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Ben Dhia, Sonia, Mohamed Ramdani, and Etienne Sicard. "Measurement Methods." In Electromagnetic Compatibility of Integrated Circuits. Springer US, 2006. http://dx.doi.org/10.1007/0-387-26601-1_4.

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Ben Dhia, Sonia, Mohamed Ramdani, and Etienne Sicard. "EMC Modeling." In Electromagnetic Compatibility of Integrated Circuits. Springer US, 2006. http://dx.doi.org/10.1007/0-387-26601-1_5.

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Ben Dhia, Sonia, Mohamed Ramdani, and Etienne Sicard. "Case Studies." In Electromagnetic Compatibility of Integrated Circuits. Springer US, 2006. http://dx.doi.org/10.1007/0-387-26601-1_6.

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Ben Dhia, Sonia, Mohamed Ramdani, and Etienne Sicard. "Guidelines." In Electromagnetic Compatibility of Integrated Circuits. Springer US, 2006. http://dx.doi.org/10.1007/0-387-26601-1_7.

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Violette, J. L. Norman, Donald R. J. White, and Michael F. Violette. "EMI Control in Analog and Digital Circuits." In Electromagnetic Compatibility Handbook. Springer Netherlands, 1987. http://dx.doi.org/10.1007/978-94-017-7144-3_17.

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McCreary, Clay. "Techniques to Design Robust Lightning Protection Circuits for Avionics Equipment." In Handbook of Aerospace Electromagnetic Compatibility. John Wiley & Sons, Inc., 2018. http://dx.doi.org/10.1002/9781119082880.ch5.

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Michalski, Krzysztof A. "Integral Equation Analysis of Microwave Integrated Circuits." In Directions in Electromagnetic Wave Modeling. Springer US, 1991. http://dx.doi.org/10.1007/978-1-4899-3677-6_33.

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Conference papers on the topic "Electromagnetic Compatibility of integrated circuits"

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Rayment, P. A. "Radiated susceptibility measurement on integrated circuits." In 9th International Conference on Electromagnetic Compatibility. IEE, 1994. http://dx.doi.org/10.1049/cp:19940695.

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Goulette, R. R. "The Measurement Of Radiated Emissions From Integrated Circuits." In International Symposium on Electromagnetic Compatibility. IEEE, 1992. http://dx.doi.org/10.1109/isemc.1992.626105.

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Abedi, Zahra, Sameer Hemmady, Thomas Antonsen, Edl Schamiloglu, and Payman Zarkesh-Ha. "Electromagnetic Compatibility in Leakage Current of CMOS Integrated Circuits." In 2019 International Symposium on Electromagnetic Compatibility - EMC EUROPE. IEEE, 2019. http://dx.doi.org/10.1109/emceurope.2019.8872123.

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Sicard, E., S. Ben Dhia, M. Ramdani, and Todd Hubing. "EMC of Integrated Circuits : A Historical Review." In 2007 IEEE International Symposium on Electromagnetic Compatibility. IEEE, 2007. http://dx.doi.org/10.1109/isemc.2007.94.

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Klotz, Frank. "EMC test specification for integrated circuits." In 2007 18th International Zurich Symposium on Electromagnetic Compatibility. IEEE, 2007. http://dx.doi.org/10.1109/emczur.2007.4388199.

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Lacrampe, Nicolas, Ali Alaeldine, Fabrice Caignet, et al. "Investigation on ESD Transient Immunity of Integrated Circuits." In 2007 IEEE International Symposium on Electromagnetic Compatibility. IEEE, 2007. http://dx.doi.org/10.1109/isemc.2007.162.

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Bakshi, S. T., and M. Coenen. "Impulse immunity test method for digital integrated circuits." In 8th International Conference on Electromagnetic Interference and Compatibility. IEEE, 2003. http://dx.doi.org/10.1109/icemic.2003.238030.

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Ker, Ming-Dou, and Cheng-Cheng Yen. "Latchup-Like Failure of Power-Rail ESD Clamp Circuits in CMOS Integrated Circuits Under System-Level ESD Test." In 2007 International Symposium on Electromagnetic Compatibility. IEEE, 2007. http://dx.doi.org/10.1109/isemc.2007.163.

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D'Addio, G. "Integrated modelling of audiofrequency track circuits." In EMC York 99. International Conference and Exhibition on Electromagnetic Compatibility. IEE, 1999. http://dx.doi.org/10.1049/cp:19990252.

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Heinrich, Ralf, Robert Bechly, and Bernd Deutschmann. "Radiated immunity testing of integrated circuits in reverberation chambers." In 2012 International Symposium on Electromagnetic Compatibility - EMC EUROPE. IEEE, 2012. http://dx.doi.org/10.1109/emceurope.2012.6396877.

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Reports on the topic "Electromagnetic Compatibility of integrated circuits"

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Nyquist, Dennis P. Electromagnetic Interactions in High-Speed Integrated Electronic Circuits. Defense Technical Information Center, 1989. http://dx.doi.org/10.21236/ada206882.

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Wendt, Harold C., and Fritz E. Newcomer. EX 419 Multifunction Fuze Monolithic Microwave Integrated Circuits Electromagnetic Vulnerability Tests Brief Presented at the Annual American Defense Preparedness Association Fuze Conference (40th),. Defense Technical Information Center, 1996. http://dx.doi.org/10.21236/ada310232.

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