Log in

Relevant bibliographies by topics / Electromigration in liquid metals

Contents

Journal articles

Academic literature on the topic 'Electromigration in liquid metals'

Author: Grafiati

Published: 6 September 2023

Create a spot-on reference in APA, MLA, Chicago, Harvard, and other styles

Select a source type:

Consult the lists of relevant articles, books, theses, conference reports, and other scholarly sources on the topic 'Electromigration in liquid metals.'

Next to every source in the list of references, there is an 'Add to bibliography' button. Press on it, and we will generate automatically the bibliographic reference to the chosen work in the citation style you need: APA, MLA, Harvard, Chicago, Vancouver, etc.

You can also download the full text of the academic publication as pdf and read online its abstract whenever available in the metadata.

Journal articles on the topic "Electromigration in liquid metals"

1

Belashchenko, David K. "The Relationship between Electrical Conductivity and Electromigration in Liquid Metals." Dynamics 3, no. 3 (2023): 405–24. http://dx.doi.org/10.3390/dynamics3030022.

Full text

Abstract:

The phenomena of electrical conductivity and electromigration in metallic systems are related, since in both cases the basic physical process is the scattering of conduction electrons by metal ions. Numerous searches have been made for equations connecting the conductivity with electromigration. In the case of a liquid metal, when using the Drude–Sommerfeld (DS) conductivity equation, it was not possible to obtain a quantitative relationship between these phenomena, which would be correct. Attempts to find such a relationship when taking into account the N. Mott correction (g-factor) in the DS

APA, Harvard, Vancouver, ISO, and other styles

2

Kumar, Sumit, Praveen Kumar, and Rudra Pratap. "A model for electromigration induced flow in liquid metals." Journal of Physics D: Applied Physics 50, no. 39 (2017): 39LT02. http://dx.doi.org/10.1088/1361-6463/aa84a2.

Full text

APA, Harvard, Vancouver, ISO, and other styles

3

Mao, Xin, Ruhua Zhang, and Xiaowu Hu. "Influence of Ni foam/Sn composite solder foil on IMC growth and mechanical properties of solder joints bonded with solid-liquid electromigration." Intermetallics 131 (April 2021): 107107. http://dx.doi.org/10.1016/j.intermet.2021.107107.

Full text

APA, Harvard, Vancouver, ISO, and other styles

4

Ho, P. S., and T. Kwok. "Electromigration in metals." Reports on Progress in Physics 52, no. 3 (1989): 301–48. http://dx.doi.org/10.1088/0034-4885/52/3/002.

Full text

APA, Harvard, Vancouver, ISO, and other styles

5

Rous, P. J., T. L. Einstein, and Ellen D. Williams. "Theory of surface electromigration on metals: application to self-electromigration on Cu(111)." Surface Science 315, no. 1-2 (1994): L995—L1002. http://dx.doi.org/10.1016/0039-6028(94)90532-0.

Full text

APA, Harvard, Vancouver, ISO, and other styles

6

Ek, J. van, and A. Lodder. "Electromigration in transition metals. I. Computational method." Journal of Physics: Condensed Matter 3, no. 38 (1991): 7307–30. http://dx.doi.org/10.1088/0953-8984/3/38/007.

Full text

APA, Harvard, Vancouver, ISO, and other styles

7

Michaud, Hadrien O., and Stéphanie P. Lacour. "Liquid electromigration in gallium-based biphasic thin films." APL Materials 7, no. 3 (2019): 031504. http://dx.doi.org/10.1063/1.5059380.

Full text

APA, Harvard, Vancouver, ISO, and other styles

8

Li, C. H., Y. C. Chuang, and C. Y. Liu. "Fabrication of Mg-Based Intermetallic Compounds by Liquid Electromigration." Journal of Electronic Materials 36, no. 11 (2007): 1489–94. http://dx.doi.org/10.1007/s11664-007-0231-4.

Full text

APA, Harvard, Vancouver, ISO, and other styles

9

van Ek, J., and A. Lodder. "Electromigration of Interstitial and Substitutional Impurities in Transition Metals." Defect and Diffusion Forum 95-98 (January 1993): 265–70. http://dx.doi.org/10.4028/www.scientific.net/ddf.95-98.265.

Full text

APA, Harvard, Vancouver, ISO, and other styles

10

Kuge, Toshihiro, Masataka Yahagi, and Junichi Koike. "Electromigration characteristics of CuAl2." Journal of Alloys and Compounds 918 (October 2022): 165615. http://dx.doi.org/10.1016/j.jallcom.2022.165615.

Full text

APA, Harvard, Vancouver, ISO, and other styles

More sources

We offer discounts on all premium plans for authors whose works are included in thematic literature selections. Contact us to get a unique promo code!