Relevant bibliographies by topics / Electronic data processing Pipelining (Electronics)

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  1. Journal articles
  2. Dissertations / Theses
  3. Books
  4. Book chapters
  5. Conference papers

Academic literature on the topic 'Electronic data processing Pipelining (Electronics)'

Author: Grafiati
Published: 4 June 2021
Last updated: 8 February 2022

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Journal articles on the topic "Electronic data processing Pipelining (Electronics)"

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Xiang, Xiaoqiang, Lili Liu, Luying Que, Conghan Jia, Bo Yan, Yongjie Li, Jinhong Guo, and Jun Zhou. "A Biological Retina Inspired Tone Mapping Processor for High-Speed and Energy-Efficient Image Enhancement." Sensors 20, no. 19 (September 30, 2020): 5600. http://dx.doi.org/10.3390/s20195600.

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In this work, a biological retina inspired tone mapping processor for high-speed and energy-efficient image enhancement has been proposed. To achieve high throughput and high energy efficiency, several hardware design techniques have been proposed, including data partition based parallel processing with S-shape sliding, adjacent frame feature sharing, multi-layer convolution pipelining, and convolution filter compression with zero skipping convolution. Implemented on a Xilinx’s Virtex7 FPGA, the proposed design achieves a high throughput of 189 frames per second for 1024 × 768 RGB images while consuming 819 mW. Compared with several state-of-the-art tone mapping processors, the proposed design shows higher throughput and energy efficiency. It is suitable for high-speed and energy-constrained image enhancement applications.
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Najoui, Mohamed, Anas Hatim, Said Belkouch, and Noureddine Chabini. "Novel Implementation Approach with Enhanced Memory Access Performance of MGS Algorithm for VLIW Architecture." Journal of Circuits, Systems and Computers 29, no. 12 (February 19, 2020): 2050200. http://dx.doi.org/10.1142/s021812662050200x.

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Modified Gram–Schmidt (MGS) algorithm is one of the most-known forms of QR decomposition (QRD) algorithms. It has been used in many signal and image processing applications to solve least square problem and linear equations or to invert matrices. However, QRD is well-thought-out as a computationally expensive technique, and its sequential implementation fails to meet the requirements of many real-time applications. In this paper, we suggest a new parallel version of MGS algorithm that uses VLIW (Very Long Instruction Word) resources in an efficient way to get more performance. The presented parallel MGS is based on compact VLIW kernels that have been designed for each algorithm step taking into account architectural and algorithmic constraints. Based on instruction scheduling and software pipelining techniques, the proposed kernels exploit efficiently data, instruction and loop levels parallelism. Additionally, cache memory properties were used efficiently to enhance parallel memory access and to avoid cache misses. The robustness, accuracy and rapidity of the introduced parallel MGS implementation on VLIW enhance significantly the performance of systems under severe rea-time and low power constraints. Experimental results show great improvements over the optimized vendor QRD implementation and the state of art.
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Algredo-Badillo, Ignacio, Kelsey A. Ramírez-Gutiérrez, Luis Alberto Morales-Rosales, Daniel Pacheco Bautista, and Claudia Feregrino-Uribe. "Hybrid Pipeline Hardware Architecture Based on Error Detection and Correction for AES." Sensors 21, no. 16 (August 22, 2021): 5655. http://dx.doi.org/10.3390/s21165655.

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Currently, cryptographic algorithms are widely applied to communications systems to guarantee data security. For instance, in an emerging automotive environment where connectivity is a core part of autonomous and connected cars, it is essential to guarantee secure communications both inside and outside the vehicle. The AES algorithm has been widely applied to protect communications in onboard networks and outside the vehicle. Hardware implementations use techniques such as iterative, parallel, unrolled, and pipeline architectures. Nevertheless, the use of AES does not guarantee secure communication, because previous works have proved that implementations of secret key cryptosystems, such as AES, in hardware are sensitive to differential fault analysis. Moreover, it has been demonstrated that even a single fault during encryption or decryption could cause a large number of errors in encrypted or decrypted data. Although techniques such as iterative and parallel architectures have been explored for fault detection to protect AES encryption and decryption, it is necessary to explore other techniques such as pipelining. Furthermore, balancing a high throughput, reducing low power consumption, and using fewer hardware resources in the pipeline design are great challenges, and they are more difficult when considering fault detection and correction. In this research, we propose a novel hybrid pipeline hardware architecture focusing on error and fault detection for the AES cryptographic algorithm. The architecture is hybrid because it combines hardware and time redundancy through a pipeline structure, analyzing and balancing the critical path and distributing the processing elements within each stage. The main contribution is to present a pipeline structure for ciphering five times on the same data blocks, implementing a voting module to verify when an error occurs or when output has correct cipher data, optimizing the process, and using a decision tree to reduce the complexity of all combinations required for evaluating. The architecture is analyzed and implemented on several FPGA technologies, and it reports a throughput of 0.479 Gbps and an efficiency of 0.336 Mbps/LUT when a Virtex-7 is used.
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Chang, Jan-Kai, Hui Fang, Christopher A. Bower, Enming Song, Xinge Yu, and John A. Rogers. "Materials and processing approaches for foundry-compatible transient electronics." Proceedings of the National Academy of Sciences 114, no. 28 (June 26, 2017): E5522—E5529. http://dx.doi.org/10.1073/pnas.1707849114.

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Foundry-based routes to transient silicon electronic devices have the potential to serve as the manufacturing basis for “green” electronic devices, biodegradable implants, hardware secure data storage systems, and unrecoverable remote devices. This article introduces materials and processing approaches that enable state-of-the-art silicon complementary metal-oxide-semiconductor (CMOS) foundries to be leveraged for high-performance, water-soluble forms of electronics. The key elements are (i) collections of biodegradable electronic materials (e.g., silicon, tungsten, silicon nitride, silicon dioxide) and device architectures that are compatible with manufacturing procedures currently used in the integrated circuit industry, (ii) release schemes and transfer printing methods for integration of multiple ultrathin components formed in this way onto biodegradable polymer substrates, and (iii) planarization and metallization techniques to yield interconnected and fully functional systems. Various CMOS devices and circuit elements created in this fashion and detailed measurements of their electrical characteristics highlight the capabilities. Accelerated dissolution studies in aqueous environments reveal the chemical kinetics associated with the underlying transient behaviors. The results demonstrate the technical feasibility for using foundry-based routes to sophisticated forms of transient electronic devices, with functional capabilities and cost structures that could support diverse applications in the biomedical, military, industrial, and consumer industries.
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Rambo, Jeffrey, and Yogendra Joshi. "Thermal Performance Metrics for Arranging Forced Air Cooled Servers in a Data Processing Cabinet." Journal of Electronic Packaging 127, no. 4 (February 11, 2005): 452–59. http://dx.doi.org/10.1115/1.2056575.

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The optimal arrangement of various components in a standard data processing cabinet layout is investigated through computational fluid dynamics and heat transfer. Relevant heat transfer performance of candidate designs is measured by newly proposed metrics for systems level electronics cooling. The results are then extended to define a favorable power dissipation profile, the most favorable of which was found to be one where the power dissipation increases in the vertical direction.
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Noakes, J. E., J. D. Spaulding, and R. J. Valenta. "Low-Level Liquid Scintillation Counter Array with Computerized Data Acquisition and Age Calculation Capabilities for 14C Dating." Radiocarbon 37, no. 2 (1995): 773–79. http://dx.doi.org/10.1017/s0033822200031325.

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We describe a two-phase study directed toward background reduction of a manual liquid scintillation counter and the interfacing of electronics for counting to a computer data acquisition system. Counter background reduction is achieved with afterpulse electronics, a high-performance cocktail, an auxiliary detector/guard and a special sample vial holder. The data acquisition system is comprised of an electronic signal processor and sorter for operating up to eight counters simultaneously and interfacing to a computer with software for data storage, acquisitions and age dating calculations. We discuss low-background counter modifications, electronic signal processing and computer software for 14C age dating.
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Webb, A. J., P. R. Bampton, S. Smith, and S. P. Close. "Electronics in genetic improvement of pigs." Proceedings of the British Society of Animal Production (1972) 1990 (March 1990): 106. http://dx.doi.org/10.1017/s0308229600018870.

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Past genetic improvement programmes have concentrated mainly on lean growth. They have relied on a few simple measurements of growth rate, food intake and ultrasonic backfat, which were laborious to record, check and process. Now there is increasing concern to improve, or at least avoid undesirable correlated changes in, eating quality, distribution of lean, and reproduction.New electronic techniques offer the opportunity to record additional traits, with lower costs and faster data processing. This paper reviews the likely impact of electronics on the rate and nature of genetic improvement in pigs.
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Nugraha, Arya Adhi. "Electronic Stetoscope Design And Analysis Application Of Heart Sound With Digital Signal Processing." Jurnal Jartel: Jurnal Jaringan Telekomunikasi 1, no. 1 (May 30, 2015): 1–8. http://dx.doi.org/10.33795/jartel.v1i1.123.

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In this paper and has implemented a stethoscope electronic application sound analysis in heart client-server. A stethoscope electronics will catch a heart and menghantarkannya to computer so that the computer can sound mendigitalisasi heart. The application will process, sound analysis heart store and display a heart condition and sound spectrum of the heart. Extraction habitude anything undertaken to gain special habitude from the heart to perform the process of decomposing paket wavelet and root mean square ( rms ) at the sound of the heart. From the data obtained, in different heart conditions, decomposition of wavelet package give value range min 6 up to a maximum of 23 is much larger and RMS only give minimal range 0.04 to 0.16 in band 0-125Hz of variations of the same types of heart conditions. Sample Data obtained from 5 persons recorded sound his heart and then analyzed with the same two methods. The Data obtained are more closer to the normal heart sound so it can be deduced from the 5 sample data used is the sound of the heart under normal conditions.
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Jastrzebska-Perfect, Patricia, George D. Spyropoulos, Claudia Cea, Zifang Zhao, Onni J. Rauhala, Ashwin Viswanathan, Sameer A. Sheth, Jennifer N. Gelinas, and Dion Khodagholy. "Mixed-conducting particulate composites for soft electronics." Science Advances 6, no. 17 (April 2020): eaaz6767. http://dx.doi.org/10.1126/sciadv.aaz6767.

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Bioelectronic devices should optimally merge a soft, biocompatible tissue interface with capacity for local, advanced signal processing. Here, we introduce an organic mixed-conducting particulate composite material (MCP) that can form functional electronic components by varying particle size and density. We created MCP-based high-performance anisotropic films, independently addressable transistors, resistors, and diodes that are pattern free, scalable, and biocompatible. MCP enabled facile and effective electronic bonding between soft and rigid electronics, permitting recording of neurophysiological data at the resolution of individual neurons from freely moving rodents and from the surface of the human brain through a small opening in the skull. We also noninvasively acquired high–spatiotemporal resolution electrophysiological signals by directly interfacing MCP with human skin. MCP provides a single-material solution to facilitate development of bioelectronic devices that can safely acquire, transmit, and process complex biological signals.
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Riches, S. T., C. Johnston, M. Sousa, and P. Grant. "High Temperature Endurance of Packaged SOI Devices for Signal Conditioning and Processing Applications." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2011, HITEN (January 1, 2011): 000251–54. http://dx.doi.org/10.4071/hiten-paper8-sriches.

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Silicon on Insulator (SOI) device technology is fulfilling a niche requirement for electronics that functions satisfactorily at operating temperatures of >200°C. Most of the reliability data on the high temperature endurance of the devices is generated on the device itself with little attention being paid to the packaging technology around the device. Similarly, most of the reliability data generated on high temperature packaging technologies uses testpieces rather than real devices, which restricts any conclusions on long term electrical performance. This paper presents results of high temperature endurance studies on SOI devices combined with high temperature packaging technologies relevant to signal conditioning and processing functions for sensors in down-well and aero-engine applications. The endurance studies have been carried out for up to 7,056 hours at 250°C, with functioning devices being tested periodically at room temperature, 125°C and 250°C. Different die attach and wire bond options have been included in the study and the performance of multiplexers, transistors, bandgap voltage, oscillators and voltage regulators functional blocks have been characterised. This work formed part of the UPTEMP project which was set-up with support from UK Technology Strategy Board and the EPSRC. The project brought together a consortium of end-users (Sondex Wireline and Vibro-Meter UK), electronic module manufacturers (GE Aviation Systems Newmarket) and material suppliers (Gwent Electronic Materials and Thermastrate Ltd) with Oxford University-Materials Department, the leading UK high temperature electronics research centre.
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Dissertations / Theses on the topic "Electronic data processing Pipelining (Electronics)"

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Du, Wei. "Advanced middleware support for distributed data-intensive applications." Connect to resource, 2005. http://rave.ohiolink.edu/etdc/view?acc%5Fnum=osu1126208308.

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Thesis (Ph. D.)--Ohio State University, 2005.
Title from first page of PDF file. Document formatted into pages; contains xix, 183 p.; also includes graphics (some col.). Includes bibliographical references (p. 170-183). Available online via OhioLINK's ETD Center
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McMulkin, Mark L. "Observation, description, and prediction of long-term learning on a keyboarding task." Thesis, This resource online, 1992. http://scholar.lib.vt.edu/theses/available/etd-08222009-040412/.

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Lum, Randall M. G. "Differential pulse code modulation data compression." Scholarly Commons, 1989. https://scholarlycommons.pacific.edu/uop_etds/2181.

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With the requirement to store and transmit information efficiently, an ever increasing number of uses of data compression techniques have been generated in diverse fields such as television, surveillance, remote sensing, medical processing, office automation, and robotics. Rapid increases in processing capabilities and the speed of complex integrated circuits make data compression techniques a prime candidate for application in the areas mentioned above. This report addresses, from a theoretical viewpoint, three major data compression techniques, Pixel Coding, Predictive Coding, and Transform Coding. It begins with a project description and continues with data compression techniques, focusing on Differential Pulse Code Modulation.
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O'Brien, Marita A. "Effects of Shape, Letter Arrangements, and Practice on Text Entry on a Virtual Keyboard." Thesis, Georgia Institute of Technology, 2006. http://hdl.handle.net/1853/11499.

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This research study examined the design of a virtual keyboard that can be used for text entry with a rotary controller, particularly when users may differ in age and experience with a particular system. I specifically examined the shape and letter arrangement on the virtual keyboard to help determine the best features to use in a design. Two keyboard shapes, an Oval and a Plus, were selected to represent different aspects of the shape. Two keyboard arrangements, Alphabetic and a Standard QWERTY-based ordering, were selected to represent a well-known and less familiar arrangement. In the experiment, older and younger adults entered words over two consecutive days. Most of the time, they used either the Oval or the Plus, but they also used the alternate shape at specific points during their practice session to allow assessment of their ability to transfer what they had learned. At the end of the second day, they also used a variation of the practiced arrangement to examine how well they had learned the letter arrangement. Text entry performance on both shapes improved as a function of practice, demonstrating that participants could learn even unfamiliar devices and virtual keyboards to complete a word entry task. No overall shape effects were found for any level of performance, but shape did affect how participants learned and performed the word entry task. In particular, unique visual features on a shape may facilitate memorization of letter/visual cue mappings. These shape features are particularly important for older adults, as younger adults seem to develop a mental model that helps them memorize letter locations on either shape. With practice, older adults could achieve optimal performance levels with an Alphabetic keyboard on the Plus shape that has the more visually unique corners. In general, alphabetic ordering is best not only because it helped visual search, but also because it facilitated better movement planning. Overall, designers should consider creating unique visual features on a virtual keyboard that will blend with the compatibility and allowed movements for the selected device to create an effective virtual keyboard.
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Nelson, Graham Martin. "Development of an Experimentally-Validated Compact Model of a Server Rack." Thesis, Georgia Institute of Technology, 2007. http://hdl.handle.net/1853/19726.

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A simplified computational fluid dynamics and heat transfer (CFD-HT) model of an electronics enclosure was developed. The compact model was based on a server simulator, which dissipates a variable amount of heat at an adjustable air flow rate. Even though a server simulator does not accurately represent the geometry of an actual electronics enclosure, the modeling of such a unit deals with many of the same issues as the modeling of actual enclosures. Even at the server simulator level, a disparity in length scales prevents detailed modeling of intricate components most notably grilles, fins, and fans. Therefore, a compact model for each of these components was developed. Fan performance curves were determined experimentally for varying fan rotational speeds. In addition, component pressure drop characteristics were found experimentally for grilles and fin banks, and these empirical relationships were applied to the model as well. To determine the validity of the simplifications employed in the model, experimental outlet temperature and velocity measurements were taken to compare to those provided by the CFD-HT simulations.
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Sorel, Julien. "Tomographie électronique analytique : Automatisation du traitement de données et application aux nano-dispositifs 3D en micro-électronique." Thesis, Lyon, 2020. http://www.theses.fr/2020LYSEI078.

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Ce travail porte sur l’automatisation du traitement des données de tomographie électronique analytique appliquée aux nano-dispositifs électroniques. La technique utilisée est la spectroscopie de dispersion en énergie des rayons-X en mode balayage en microscopie électronique en transmission (STEM-EDX : Scanning Transmission Electron Microscopy, Energy Dispersive X-ray spectroscopy). Si la tomographie électronique STEM-EDX a bénéficié d’avancées technologiques récentes, comme de nouvelles sources électroniques ‘X’-FEG (Field Emission Gun) et des détecteurs X sensibles, les SDD (Silicon Drift Detectors), elle reste chronophage avec une statistique de comptage souvent faible pour éviter des durées prohibitives et une dégradation de l’échantillon par irradiation électronique. L’empilement des projections STEM-EDX, acquises sous différents angles d’inclinaison, est par ailleurs très volumineux et les logiciels commerciaux actuels ne peuvent pas le traiter automatiquement et de manière optimale. Pour améliorer cette situation, nous avons développé un programme utilisant la librairie Hyperspy en langage python, dédiée au traitement de données multi-dimensionnelles. L’analyse statistique multivariée permet d’optimiser et d’automatiser le débruitage des données, la calibration des spectres et la séparation des raies d’émission X superposées pour l’obtention de reconstructions tridimensionnelles quantitatives. Une technique de reconstruction avancée, l’acquisition comprimée, a aussi été mise en œuvre, diminuant le nombre de projections sans réduire l’information 3D finale. La méthode développée a été utilisée pour l’analyse chimique 3D de quatre nanostructures issues de la microélectronique : des transistors FET multi-grilles, HEMT et GAA, et un film mince GeTe. Les échantillons ont été taillés en pointe par FIB (Focused Ion Beam: Faisceau d’ions focalisés), et les données obtenues sur un microscope Titan Themis muni d’un système à 4 détecteurs SDD. L’évaluation du programme atteste qu’il permet d’obtenir des résultats précis et fiables sur les architectures 3D étudiées. Des pistes d’améliorations sont discutées en perspective d’un futur logiciel dédié au traitement de données en tomographie électronique analytique
The aim of this thesis is to automate the process of hyperspectral analysis for analytical electron tomography applied to nanodevices. The work presented here is focused on datasets obtained by energy-dispersive X-ray spectroscopy in a scanning transmission electron microscope (STEM-EDX). STEM-EDX tomography has benefited greatly from recent developments in electron sources such as the ‘X’-FEG (Field Emission Gun), and multiple X-ray detector systems such as the Super-X, incorporating four SSD (Silicon Drift Detectors) detectors. The technique remains however very time-consuming, and low X-ray count rates are necessary to minimize the total acquisition time and avoid beam damage during the experiment. In addition, tomographic stacks of STEM-EDX datacubes, acquired at different tilt angles, are too large to be analyzed by commercial software packages in an optimal way. In order to automate this process, we developed a code based on Hyperspy, a Python library for multidimensional data analysis. Multivariate statistical analysis techniques were employed to optimize and automate the denoising, the energy calibration and the separation of overlapping X-ray lines, with the aim to achieve quantitative, chemically sensitive volumes. Moreover, a compressed sensing based algorithm was employed to achieve high fidelity reconstructions with undersampled tomographic datasets. The code developed during this thesis was used for the 3D chemical analysis of four microelectronic nanostructures: FinFET, HEMT and GAA transistors, and a GeTe thin film for memory device applications. The samples were prepared in a needle shape using a focused ion beam, and the data acquisitions were performed using a Titan Themis microscope equipped with a super-X EDX detector system. It is shown that the code yields 3D morphological and chemical information with high accuracy and fidelity. Ways to improve the current methodology are discussed, with future efforts aiming at developing a package dedicated to analytical electron tomography
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Renbi, Abdelghani. "Power and Energy Efficiency Evaluation for HW and SW Implementation of nxn Matrix Multiplication on Altera FPGAs." Thesis, Jönköping University, JTH, Computer and Electrical Engineering, 2009. http://urn.kb.se/resolve?urn=urn:nbn:se:hj:diva-10545.

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In addition to the performance, low power design became an important issue in the design process of mobile embedded systems. Mobile electronics with rich features most often involve complex computation and intensive processing, which result in short battery lifetime and particularly when low power design is not taken in consideration. In addition to mobile computers, thermal design is also calling for low power techniques to avoid components overheat especially with VLSI technology. Low power design has traced a new era. In this thesis we examined several techniques to achieve low power design for FPGAs, ASICs and Processors where ASICs were more flexible to exploit the HW oriented techniques for low power consumption. We surveyed several power estimation methodologies where all of them were prone to at least one disadvantage. We also compared and analyzed the power and energy consumption in three different designs, which perform matrix multiplication within Altera platform and using state-of-the-art FPGA device. We concluded that NIOS II\e is not an energy efficient alternative to multiply nxn matrices compared to HW matrix multipliers on FPGAs and configware is an enormous potential to reduce the energy consumption costs.

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Hruby, Gregory William. "Toward a Generalized Model of Biomedical Query Mediation to Improve Electronic Health Record Data Retrieval." Thesis, 2016. https://doi.org/10.7916/D8R49QZW.

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The electronic health record (EHR) is an invaluable resource for medical knowledge discovery. EHR data interrogation requires significant medical and technical knowledge. To access EHR data, medical researchers often rely on query analysts to translate their EHR information needs into EHR database queries. The conversation between the medical researcher and the query analyst is an information needs negotiation; I have named this process biomedical query mediation (BQM). There exists no BQM standard to guide medical researchers and query analysts to effectively bridge the communication gap between these medical and technical experts. The current practice of BQM likely varies among query analysts. This variation may contribute to the delivery of EHR data sets with varying degrees of accuracy. For example, a query analyst may return an EHR dataset that misrepresents the medical researcher’s information need or another query analyst may return a different EHR dataset to the medical researcher for the same information need. The process used to formulate the medical researcher’s information need and translate that need into an executable EHR database query may have severe downstream consequences affecting the reliability and quality of EHR datasets for medical research. This dissertation contributes early understandings of the BQM process and thereby improves the transparency and highlights the complexity of BQM by completing five studies: 1) survey the literature from other information intensive scientific disciplines to identify knowledge and methods potentially useful for BQM, 2) perform a review of existing tools and forms for assisting researchers in BQM, 3) perform a content analysis of the BQM process, 4) conduct a cognitive task analysis to detail a generalized workflow, and 5) develop an enriched concept schema to capture comprehensive EHR data needs. This dissertation employs extensive qualitative methods using grounded theory, expert interviews, and cognitive task analysis to produce a deep understanding of BQM. Additionally, I contribute a promising concept class schema to represent medical researchers’ EHR data needs to help standardize the BQM process.
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Mauser, Kevin Alton. "A digitally invertible universal amplifier for recording and processing of bioelectric signals." Thesis, 2014. http://hdl.handle.net/1805/3812.

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Indiana University-Purdue University Indianapolis (IUPUI)
The recording and processing of bioelectric signals over the decades has led to the development of many different types of analog filtering and amplification techniques. Meanwhile, there have also been many advancements in the realm of digital signal processing that allow for more powerful analysis of these collected signals. The issues with present acquisition schemes are that (1) they introduce irreversible distortion to the signals and may ultimately hinder analyses that rely on the unique morphological differences between bioelectric signal events and (2) they do not allow the collection of frequencies in the signal from direct-current (DC) to high-frequencies. The project put forth aims to overcome these two issues and present a new scheme for bioelectric signal acquisition and processing. In this thesis, a system has been developed, verified, and validated with experimental data to demonstrate the ability to build an invertible universal amplifier and digital restoration scheme. The thesis is primarily divided into four sections which focus on (1) the introduction and background information, (2) theory and development, (3) verification implementation and testing, and (4) validation implementation and testing. The introduction and background provides pertinent information regarding bioelectric signals and recording practices for bioelectric signals. It also begins to address some of the issues with the classical and present methods for data acquisition and make the case for why an invertible universal amplifier would be better. The universal amplifier transfer function and architecture are discussed and presented along with the development and optimization of the characterization and the inversion, or restoration, filter process. The developed universal amplifier, referred to as the invertible universal amplifier (IUA), while the universal amplifier and the digital restoration scheme together are referred to as the IUA system. The IUA system is then verified on the bench using typical square, sine, and triangle waveforms with varying offsets and the results are presented and discussed. The validation is done with in-vivo experiments showing that the IUA system may be used to acquire and process bioelectric signals with percent error less than to 6% when post-processed using estimated characteristics of and when compared to a standard flat bandwidth high-pass cutoff amplifier.
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Books on the topic "Electronic data processing Pipelining (Electronics)"

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Electronics circuit design using Electronics workbench. Boston: PWS Pub. Co., 1998.

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Rajagopalan, Venkatachari. Computer-aided analysis of power electronic systems. New York: Dekker, 1987.

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Electronics projects using Electronics workbench. Oxford: Newnes, 1998.

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Jobes, Keith. Software tools and techniques for electronic engineers. London: McGraw-Hill, 1994.

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Dian zi xue: Electronics. Taibei Xian Zhonghe Shi: Xin wen jing kai fa chu ban gu fen you xian gong si, 2009.

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Samuel, Dick, ed. Applied electronic engineering with Mathematica. Reading, Mass: Addison-Wesley, 1995.

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Ferris, Clifford D. SPICE for electronics. Minneapolis/St. Paul: West Pub. Co., 1995.

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Berube, R. H. Computer simulated experiments for electronic devices using Electronics workbench. Englewood Cliffs, N.J: Prentice Hall, 1996.

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The digital information age: An introduction to electrical engineering. Boston: PWS Pub. Co., 1999.

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Berube, R. H. Learning electronics communications through experimentation using Electronics workbench multisim. Upper Saddle River, N.J: Prentice Hall, 2002.

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Book chapters on the topic "Electronic data processing Pipelining (Electronics)"

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Kolanoski, Hermann, and Norbert Wermes. "Trigger and data acquisition systems." In Particle Detectors, 795–814. Oxford University Press, 2020. http://dx.doi.org/10.1093/oso/9780198858362.003.0018.

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The quantities measured by detectors are generally analogue signals or rates which are, with few exemptions, available in electronic form and which one usually wants to further process with computers. This chapter describes the interfaces between the detector-near electronics (see chapter 17) and a computer or a computer system. In order to limit the transfer rates of the interfaces and the capacities of storage media to the necessary, the interesting events are usually selected by triggers. Data acquisition and triggering are therefore closely connected and have to be coordinated. The capabilities of data acquisition and processing have grown with high speed and will presumably further grow following the developments in computers, networks and consumer electronics. In the framework of this book only a limited inside into these developments can be given.
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Townsend, Peter. "From Live Music to Electronic Offerings." In The Evolution of Music through Culture and Science, 151–66. Oxford University Press, 2019. http://dx.doi.org/10.1093/oso/9780198848400.003.0010.

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Distribution of music via recordings and broadcasts has been a lively activity for well over a century. The value for music is immense, but this is a symbiotic process, where the musical demands spawned the invention of electronic amplifiers, microphones, speakers, and onward to all modern electronics. The original aim was to make a faithful recording of a performance. In reality, this is impossible because the conditions for listening are always different from the original performance. The musical data and reproduction are modified by every aspect of the electronics, and the way in which sound engineers and marketing companies handle the music. There may be advantages in that performance errors can be corrected, balance between instruments adjusted, or the pop music autotune which corrects the pitch. This chapter considers many aspects of current and future sound processing.
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Devi, Jutika, and Pranayee Datta. "Nanoelectronics." In Handbook of Research on 5G Networks and Advancements in Computing, Electronics, and Electrical Engineering, 20–35. IGI Global, 2021. http://dx.doi.org/10.4018/978-1-7998-6992-4.ch002.

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The passive circuit elements resistor, inductor, and capacitor, which are the basic building blocks of an electronic circuit, need to be scaled down for application in fifth-generation wireless communication networks. Due to the growing demands in memory and computational capacities of integrated circuits along with high processing and transmission data speed for next-generation, microelectronics will be replaced by nanoelectronics in the future. The concept of nanoscale network on chip system is expected to play an important role in the field of communication systems for designing new devices of ultra-high speed for long and short-range communication links, power efficient computing devices, high-density memory and logic, and ultrafast interconnects. This chapter focuses on the mechanism of tailoring, patterning, and manipulating optical signals using nanometer-scale structures that may play the role of lumped nanocircuit elements at optical domain when selected properly with tremendous promise for application for fifth-generation communication systems.
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Ajiferuke, Isola, and Wole Olatokun. "Information Technology Usage in Nigeria." In Encyclopedia of Information Science and Technology, First Edition, 1508–12. IGI Global, 2005. http://dx.doi.org/10.4018/978-1-59140-553-5.ch265.

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The term information technology (IT) came into common use in the late 1980s, supplanting earlier terms such as electronic data processing systems (EDP), management information systems (MIS), and office systems (IS). Oliver, E. C., Chapman, R. J. and French, C. S. (1990) defined IT as the technology which supports activities involving the creation, storage, manipulation and communication of information (principally computing, electronics and electronic communications) together with their related methods, management and applications. Such an all-embracing term is clearly open to a number of interpretations depending on in which context it is used. In some contexts, the term “information technology” means computers, ancillary equipment, software and firmware (hardware) and similar procedures, services (including support services) and related resources. Also, it includes any equipment or interconnected system or subsystem of equipment that is used in the automatic acquisition, storage, manipulation, management, movement, control, display, switching, interchange, transmission or reception of data or information.
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Conference papers on the topic "Electronic data processing Pipelining (Electronics)"

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Bash, Cullen E., Chandrakant D. Patel, and Ratnesh K. Sharma. "Inkjet Assisted Spray Cooling of Electronics." In ASME 2003 International Electronic Packaging Technical Conference and Exhibition. ASMEDC, 2003. http://dx.doi.org/10.1115/ipack2003-35058.

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Increases in microprocessor power dissipation and the resulting effect on the cost and complexity of thermal management solutions has been well documented in recent years. Accompanying this increase in overall power dissipation has been a reduction in feature size due to process improvements resulting in a steady decrease in the size of the processing core where most of the power on a die is generated. This trend is expected to continue into the near future and will likely lead to a power dense core covering a fraction of the total die surface area surrounded by areas of reduced power density cache. Evaporative spray cooling has been long identified as a technology that can be used to manage very high power densities (> 100 W/cm2). Limitations in the controllability of individual spray droplets, however, have generally prevented its use in applications that contain marked variation in spatial power density. Since only a relatively uniform spray pattern is possible with existing spray delivery technologies, sections of lower power density become susceptible to pool boiling and thereby place limitations on bulk flow rates, which accordingly limit thermal performance. Conversely, variations in heat transfer coefficients caused by uncontrolled pool boiling across devices can create thermal stresses. In this paper we demonstrate how thermal inkjet technology can be effectively utilized to spray cool a heat source with non-uniform power density. Experimental data is presented for a water-cooled heat source and critical heat fluxes of up to 270 W/cm2 are reported. Additionally, correlations are developed for the unique spray pattern afforded by the technology.
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Lall, Pradeep, Hao Zhang, and Rahul Lall. "Design and Development of Biometric Sensor Wearable Band Using Flexible Electronics." In ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Processing Systems. American Society of Mechanical Engineers, 2017. http://dx.doi.org/10.1115/ipack2017-74232.

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Flexible electronics have a myriad of potential applications in fields such as healthcare, soldier situational awareness, soldier rehabilitation, sports performance, and textile manufacturing among other areas. The primary benefits that flexible electronics provide to both the producers and consumers are their light weight, low power consumption, efficiency, low cost of production, flexibility, and scalability. In comparison to rigid electronics, these systems would be subjected to a greater amount of mechanical and thermal stress in real-time due to their ability to be flexed, rolled, folded, and stretched. Environmental conditions such as bending, mechanical shock, water immersion, sweat, UV radiation, and temperature exposure could degrade the performance of these embedded electronic systems. At this time, there is a lack of suitable test standards and reliability data about flexible electronics manufacturing, assembly, and real-time use. In this paper, a fully flexible medical electronics system was built in full dimension to study the assembly and operation-related failure mechanisms of flexible and wearable electronics. The fabricated flexible electronics system measures pulse and muscle activity, and then transmits this data to a paired mobile device. The pulse rate was measured using an LED and a photo diode, while an electromyography (EMG) sensor was used to measure muscle activity. After collecting the data, the microcontroller sends it to a Bluetooth module, which can in turn transmit this information to a paired mobile device. Through experimentation with the fabricated flexible electronics device, unexpected degradation and quality issues were observed. In flexible PCBs, the space between the IC lead could not be isolated by the solder mask because of its large feature size and as a result, increases the risk of shortage between IC leads when subjected to mechanical stress. In addition, during the assembly process, high reflow temperature was found to subject a huge thermal stress on the connections between the solder pad and copper trace. Proper support of the solder pad should be designed to compensate the thermal stress during the reflow process, and prevent the copper joint on top of the board from being damaged. A set of guidelines for flexible medical electronics and an implementable reliability test standard can, therefore, be established for medical device manufacturers based on these reliability assessments.
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Yates, Luke, Ramez Cheaito, Aditya Sood, Zhe Cheng, Thomas Bougher, Mehdi Asheghi, Kenneth Goodson, et al. "Investigation of the Heterogeneous Thermal Conductivity in Bulk CVD Diamond for Use in Electronics Thermal Management." In ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Processing Systems. American Society of Mechanical Engineers, 2017. http://dx.doi.org/10.1115/ipack2017-74163.

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From a materials perspective, diamond exhibits properties that are extremely well suited for use in the thermal management of high power and high heat flux electronic devices. While bulk diamond grown via chemical vapor deposition (CVD) has been demonstrated since the 1980s, and people have measured thermal conductivities ranging from 500–2000 W/m-K, these measurements have typically taken place over a large domain that encompasses numerous diamond grains. However, many of these techniques do not reveal the heterogenous nature of the diamond thermal conductivity which arises due to the local grain structure and orientation. The diamond sample investigated in this study contained a high level of boron doping on the order of 1021cm−3, giving rise to a reduced thermal conductivity measured as 714 W/m-K with a laser flash method. Similar bulk CVD diamond samples that are undoped show thermal conductivity values of greater than 1500 W/m-K with the same measurement technique. Through the use of time-domain thermoreflectance (TDTR) we are able to measure the thermal conductivity of bulk CVD diamond at a spatial resolution smaller than the size of the columnar grains. This allows us to examine significant changes in thermal conductivity as a function of spatial location, which is of great significance when the thermal source from electronics is on the size scale of this variation. Using TDTR, we present an approach involving a variation in the laser spot size using multiple focusing objectives to yield the heterogeneous thermal conductivity in bulk CVD diamond. The data show variations in thermal conductivity near 40% over a diameter of 40 μm. Scanning Electron Microscopy (SEM) and electron backscatter diffraction (EBSD) data are presented which also show variation in microstructure over this length scale giving rise to the heterogeneity.
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Meyyappan, Karumbu, Milena Vujosevic, Qifeng Wu, Pramod Malatkar, Charles Hill, and Ryan Parrott. "Knowledge Based Qualification Process to Evaluate Vibration Induced Failures in Electronic Components." In ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Processing Systems. American Society of Mechanical Engineers, 2017. http://dx.doi.org/10.1115/ipack2017-74190.

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Electronic products used in autonomous vehicles can be subjected to harsh road conditions. Transportation induced vibration is one such reliability risk to be addressed as part of qualification. Vibration use data and reliability models are very extensively studied for fully packaged systems exposed to vibration risks during shipping. MIL-STD-810G and ISTA4AB are some of the industry standards that address these risks. On the other hand, USCAR-2 and GMW-3172 are couple of standards that may be more relevant for electronics used in automotive applications, where electronic components are exposed to vibration risks during their entire lifetime. Even though the usage model and duration for fully packaged systems in shipping and automotive electronics are different, the source of energy (road conditions), driving the risks are similar. The industry standards based damage model appear to be generic, covering a wide variety of products. In this paper, a knowledge based qualification (KBQ) framework, is used to map use conditions to accelerated test requirements for two failure modes: solder joint fatigue and socket contact fretting. The mechanisms chosen are distinct with different damage metric and drivers. The KBQ obtained qualification requirements were discussed relative to standard requirement with the objective to verify how well industry standard models reflect field reliability risks. For the chosen failure mechanisms and use condition data, it was observed that the industry standards lead to erroneous conclusions about vibration risk in the field.
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Rouet, Vincent, and Bruno Foucher. "Use of MEMS Sensors to Design a Life Consumption Monitoring System for Electronics." In CANEUS 2006: MNT for Aerospace Applications. ASMEDC, 2006. http://dx.doi.org/10.1115/caneus2006-11093.

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To improve the reliability, the design and the maintenance of electronic systems, the knowledge of the operational environment in which these systems operate is essential. HUMS (Health and Usage Monitoring System) are specialised in environmental monitoring and provide operating life status according to the experienced loads. Nevertheless, their major drawbacks, which limit their use, come from their size and their ability to provide relevant information for health assessment. Usually performed by a ground-based software, the environmental data are analysed off-board periodically, after regular HUMS downloads. However, the speed needed for failure prediction calculation from the stress monitored to the warning reported is essential to prevent ongoing operation of an electronic system on the way to failure. This paper presents a smart integrated electronic system embedding MEMS sensors for in-situ health assessment associated to the experienced loads. This system uses advanced algorithms processing the measurements for immediate Prognostic Health Monitoring (PHM), based on the Physics of Failure for real-time life consumption prediction of electronic systems.
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Frear, D. R., M. M. Rashid, and S. N. Burchett. "Microstructurally Based Thermomechanical Fatigue Lifetime Model of Solder Joints for Electronic Applications." In ASME 1993 Design Technical Conferences. American Society of Mechanical Engineers, 1993. http://dx.doi.org/10.1115/detc1993-0081.

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Abstract We present a new methodology for predicting the fatigue life of solder joints for electronics applications. This approach involves the integration of experimental and computational techniques. The first stage involves correlating the manufacturing and processing parameters with the starting microstructure of the solder joint. The second stage involves a series of experiments that characterize the evolution of the microstructure during thermal cycling. The third stage consists of a computer modeling and simulation effort that utilizes the starting microstructure and experimental data to produce a reliability prediction of the solder joint. This approach is an improvement over current methodologies because it incorporates the micro-structure and properties of the solder directly into the model and allows these properties to evolve as the microstructure changes during fatigue.
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Lall, Pradeep, and Kartik Goyal. "Reliability of SAC 305 Solder Interconnects on Double-Sided Flexible Printed Circuit Board Using X-Ray Micro-CT." In ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Processing Systems. American Society of Mechanical Engineers, 2017. http://dx.doi.org/10.1115/ipack2017-74264.

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Flexible electronics provide new design options not afforded by rigid electronics in a variety of applications including wearable electronics, robotics and automotive systems. However, the processes for the manufacturing of complex electronic assemblies using fine-pitch components are not as well developed as those for rigid electronics. The lack of structural rigidity of flexible printed circuit cards requires attention to assembly configuration for double-sided flexible assemblies. In addition, mechanisms are needed to compensate for the deformation and warpage of the flexible substrate and components during assembly. In this paper, the stresses in solder joints of double-sided flexible assemblies have been measured during thermal excursions using x-ray micro-computed tomography in conjunction with digital volume correlation. The method allows for non-invasive measurement and does not require cross-sectioning of the part for the purpose of deformation and strain measurement. In addition, the measurements are not limited to the joints in the line of sight. The three-dimensional measurements of deformation and strain have been visualized on the geometry of the solder joints in the package. Digital volume correlation (DVC) method has been used to find the displacements and strains in interconnects of operational electronics. The x-ray microscopic computed tomography (μCT) system has been used to generate the 16 bit digital volume data. The x-ray detector has ability to image the x-ray attenuation of x-rays through the object. Reliability testing of SAC 305 solder interconnects has been performed on double-sided flexible circuit board using x-ray μCT by heating the package to 100°C. The flexible circuit board used in this experiment is of BGA 256-144 combination, two packages, A-PBGA256-1.0mm-17mm and A-CABGA144-1.0mm-13mm. A 3D printed fixture has also been used to support the flexible board and keep it flat while in the CT scan machine. The reference and deformed scans are then re-constructed 3D using Volume Graphics, and Digital Volume Correlation performed using MATLAB modules. Reliability of double-sided flexible printed circuit boards will be discussed and any crack, defects, or deformation in the solder interconnectivity which might occur while heating the package on flexible board is presented. The solder joint strains during thermal excursions are also compared between the flexible and rigid printed circuit assemblies.
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Lall, Pradeep, Nakul Kothari, and John Deep. "Damage Progression in Fuze Assemblies Subjected to High-G Mechanical Shock Using X-Ray Digital Volume Correlation." In ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Processing Systems. American Society of Mechanical Engineers, 2017. http://dx.doi.org/10.1115/ipack2017-74269.

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Field extracted electrical assemblies, subjected to harsh environments including storage, and transportation may have often sustained degradation in their material properties and physical structure, without exhibiting external signs of damage. The lack of macro-indicators of damage makes the quantification of sustained damage and the remaining useful life challenging for assessment of the reliability makes quantification of accrued damage and remaining useful life much difficult. The operation environment requires survivability under high-g loads often in excess of 10,000g-100,000g. The need of non-destructive test methods for determination of the internal damage and the assessment of expected operational reliability under the presence of accrued damage from prolonged storage is extremely desirable. While a number of non-destructive test methods such as x-ray, and acoustic imaging exist in the state-of-art — they are limited to the acquisition of imaging of the internal damage state without the ability of conducting measurement of deformation under the action of environment loads. There is scarcity of literature on studying progressive damage to the physical structure of fuze components when subjected to high g shocks. Previously, researchers have studied the reliability of fuze subjected to high-temperature and high-g mechanical shocks, measured redundancy and reliability of fuze electronics through prediction of failure rates and MTTF using MIL-HDBK-217F standard, and performed on fault diagnosis. In this paper, a full-field deformation measurement technique has been presented to monitor damage in key components of the fuze after exposure to multiple high G shocks. Fuze assembly has been subjected to 30,000g mechanical shock until failure. The fuze assembly is CT scanned at regular intervals and the scan data is compared to the pristine scan data to compute physical deformations and damage sustained during the mechanical shock event.
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Lall, Pradeep, Di Zhang, Jeff Suhling, and David Locker. "Anand Parameters for SAC305 Alloys After Prolonged Storage up to 1-Year." In ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Processing Systems. American Society of Mechanical Engineers, 2017. http://dx.doi.org/10.1115/ipack2017-74300.

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Electronics in automotive underhood environments may be subjected to high temperatures in the neighborhood of 175°C while subjected to high strain rate mechanical loads of vibration. Portable products such as smartphones and tablets stay in the powered on condition for a majority of their operational life during which time the device internals are maintained at higher than ambient temperature. Thus, it would be expected for interconnects in portable products to be at a temperature high than room temperature when subjected to accidental drop or shock. Furthermore, electronics in missile-applications may be subjected to high strain rates after prolonged period of storage often at high temperature. Electronics systems including interconnects may experience high strain rates in the neighborhood of 1–100 per sec during operation at high temperature. However, the material properties of SAC305 leadfree solders at high strain rates and high operating temperatures are scarce after long-term storage. Furthermore, the solder interconnects in simulation of product drop are often modeled using elastic-plastic properties or linear elastic properties, neither of which accommodate the effect of operating temperature on the solder interconnect deformation at high operating temperature. SAC305 solders have been shown to demonstrate the significant degradation of mechanical properties including the tensile strength and the elastic modulus after exposure to high temperature storage for moderate periods of time. Previously, Anand’s viscoplastic constitutive model has been widely used to describe the inelastic deformation behavior of solders in electronic components under thermo-mechanical deformation. Uniaxial stress-strain curves have been plotted over a wide range of strain rates (ε. = 10, 35, 50, 75 /sec) and temperatures (T = 25, 50, 75, 100, 125, 150, 175, 200°C). Anand viscoplasticity constants have been calculated by non-linear fitting procedures. In addition, the accuracy of the extracted Anand constants has been evaluated by comparing the model prediction and experimental data.
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Chandrasekaran, Sriram, and Sushil Bhavnani. "Flow Distribution and Nucleation Suppression in a Small Form Factor Liquid Immersion Cooled Server Model." In ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Processing Systems. American Society of Mechanical Engineers, 2017. http://dx.doi.org/10.1115/ipack2017-74025.

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The rapid growth of the global network infrastructure has resulted in a sharp increase in the number and size of data center facilities. Total data center power consumption now represents a significant fraction of global electricity production. To conserve natural resources, and to satisfy the cooling demands of compact, powerful electronics, thermal management strategies with high heat transfer coefficients must be employed. Two-phase liquid immersion cooling is one such strategy that has been gaining momentum in commercial cooling applications over recent years. The work discussed in this paper provides information on two different flow boiling investigations performed on vertically oriented surfaces in a small form factor server model. Two different types of surfaces — bare silicon, and silicon surfaces attached with microfinned heat sinks were tested in this study. Novec 649 dielectric fluid was used as the primary working fluid. The first investigation compares the thermal performance of parallel and impinging flow distribution systems, for different subcooling and flow rate conditions. The second investigation is on nucleation suppression in flow boiling for the parallel and impinging flow distribution systems. In this study, flow rates ranging from 0 ml/min to 1650 ml/min were tested and high-speed imaging was performed to capture the change in bubble characteristics. The resulting observations, including highest heat flux values supported without nucleation activity, are reported and discussed.
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