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1
Xiang, Xiaoqiang, Lili Liu, Luying Que, Conghan Jia, Bo Yan, Yongjie Li, Jinhong Guo, and Jun Zhou. "A Biological Retina Inspired Tone Mapping Processor for High-Speed and Energy-Efficient Image Enhancement." Sensors 20, no. 19 (September 30, 2020): 5600. http://dx.doi.org/10.3390/s20195600.
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In this work, a biological retina inspired tone mapping processor for high-speed and energy-efficient image enhancement has been proposed. To achieve high throughput and high energy efficiency, several hardware design techniques have been proposed, including data partition based parallel processing with S-shape sliding, adjacent frame feature sharing, multi-layer convolution pipelining, and convolution filter compression with zero skipping convolution. Implemented on a Xilinx’s Virtex7 FPGA, the proposed design achieves a high throughput of 189 frames per second for 1024 × 768 RGB images while consuming 819 mW. Compared with several state-of-the-art tone mapping processors, the proposed design shows higher throughput and energy efficiency. It is suitable for high-speed and energy-constrained image enhancement applications.
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Najoui, Mohamed, Anas Hatim, Said Belkouch, and Noureddine Chabini. "Novel Implementation Approach with Enhanced Memory Access Performance of MGS Algorithm for VLIW Architecture." Journal of Circuits, Systems and Computers 29, no. 12 (February 19, 2020): 2050200. http://dx.doi.org/10.1142/s021812662050200x.
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Modified Gram–Schmidt (MGS) algorithm is one of the most-known forms of QR decomposition (QRD) algorithms. It has been used in many signal and image processing applications to solve least square problem and linear equations or to invert matrices. However, QRD is well-thought-out as a computationally expensive technique, and its sequential implementation fails to meet the requirements of many real-time applications. In this paper, we suggest a new parallel version of MGS algorithm that uses VLIW (Very Long Instruction Word) resources in an efficient way to get more performance. The presented parallel MGS is based on compact VLIW kernels that have been designed for each algorithm step taking into account architectural and algorithmic constraints. Based on instruction scheduling and software pipelining techniques, the proposed kernels exploit efficiently data, instruction and loop levels parallelism. Additionally, cache memory properties were used efficiently to enhance parallel memory access and to avoid cache misses. The robustness, accuracy and rapidity of the introduced parallel MGS implementation on VLIW enhance significantly the performance of systems under severe rea-time and low power constraints. Experimental results show great improvements over the optimized vendor QRD implementation and the state of art.
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Algredo-Badillo, Ignacio, Kelsey A. Ramírez-Gutiérrez, Luis Alberto Morales-Rosales, Daniel Pacheco Bautista, and Claudia Feregrino-Uribe. "Hybrid Pipeline Hardware Architecture Based on Error Detection and Correction for AES." Sensors 21, no. 16 (August 22, 2021): 5655. http://dx.doi.org/10.3390/s21165655.
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Currently, cryptographic algorithms are widely applied to communications systems to guarantee data security. For instance, in an emerging automotive environment where connectivity is a core part of autonomous and connected cars, it is essential to guarantee secure communications both inside and outside the vehicle. The AES algorithm has been widely applied to protect communications in onboard networks and outside the vehicle. Hardware implementations use techniques such as iterative, parallel, unrolled, and pipeline architectures. Nevertheless, the use of AES does not guarantee secure communication, because previous works have proved that implementations of secret key cryptosystems, such as AES, in hardware are sensitive to differential fault analysis. Moreover, it has been demonstrated that even a single fault during encryption or decryption could cause a large number of errors in encrypted or decrypted data. Although techniques such as iterative and parallel architectures have been explored for fault detection to protect AES encryption and decryption, it is necessary to explore other techniques such as pipelining. Furthermore, balancing a high throughput, reducing low power consumption, and using fewer hardware resources in the pipeline design are great challenges, and they are more difficult when considering fault detection and correction. In this research, we propose a novel hybrid pipeline hardware architecture focusing on error and fault detection for the AES cryptographic algorithm. The architecture is hybrid because it combines hardware and time redundancy through a pipeline structure, analyzing and balancing the critical path and distributing the processing elements within each stage. The main contribution is to present a pipeline structure for ciphering five times on the same data blocks, implementing a voting module to verify when an error occurs or when output has correct cipher data, optimizing the process, and using a decision tree to reduce the complexity of all combinations required for evaluating. The architecture is analyzed and implemented on several FPGA technologies, and it reports a throughput of 0.479 Gbps and an efficiency of 0.336 Mbps/LUT when a Virtex-7 is used.
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Chang, Jan-Kai, Hui Fang, Christopher A. Bower, Enming Song, Xinge Yu, and John A. Rogers. "Materials and processing approaches for foundry-compatible transient electronics." Proceedings of the National Academy of Sciences 114, no. 28 (June 26, 2017): E5522—E5529. http://dx.doi.org/10.1073/pnas.1707849114.
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Foundry-based routes to transient silicon electronic devices have the potential to serve as the manufacturing basis for “green” electronic devices, biodegradable implants, hardware secure data storage systems, and unrecoverable remote devices. This article introduces materials and processing approaches that enable state-of-the-art silicon complementary metal-oxide-semiconductor (CMOS) foundries to be leveraged for high-performance, water-soluble forms of electronics. The key elements are (i) collections of biodegradable electronic materials (e.g., silicon, tungsten, silicon nitride, silicon dioxide) and device architectures that are compatible with manufacturing procedures currently used in the integrated circuit industry, (ii) release schemes and transfer printing methods for integration of multiple ultrathin components formed in this way onto biodegradable polymer substrates, and (iii) planarization and metallization techniques to yield interconnected and fully functional systems. Various CMOS devices and circuit elements created in this fashion and detailed measurements of their electrical characteristics highlight the capabilities. Accelerated dissolution studies in aqueous environments reveal the chemical kinetics associated with the underlying transient behaviors. The results demonstrate the technical feasibility for using foundry-based routes to sophisticated forms of transient electronic devices, with functional capabilities and cost structures that could support diverse applications in the biomedical, military, industrial, and consumer industries.
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Rambo, Jeffrey, and Yogendra Joshi. "Thermal Performance Metrics for Arranging Forced Air Cooled Servers in a Data Processing Cabinet." Journal of Electronic Packaging 127, no. 4 (February 11, 2005): 452–59. http://dx.doi.org/10.1115/1.2056575.
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The optimal arrangement of various components in a standard data processing cabinet layout is investigated through computational fluid dynamics and heat transfer. Relevant heat transfer performance of candidate designs is measured by newly proposed metrics for systems level electronics cooling. The results are then extended to define a favorable power dissipation profile, the most favorable of which was found to be one where the power dissipation increases in the vertical direction.
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Noakes, J. E., J. D. Spaulding, and R. J. Valenta. "Low-Level Liquid Scintillation Counter Array with Computerized Data Acquisition and Age Calculation Capabilities for 14C Dating." Radiocarbon 37, no. 2 (1995): 773–79. http://dx.doi.org/10.1017/s0033822200031325.
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We describe a two-phase study directed toward background reduction of a manual liquid scintillation counter and the interfacing of electronics for counting to a computer data acquisition system. Counter background reduction is achieved with afterpulse electronics, a high-performance cocktail, an auxiliary detector/guard and a special sample vial holder. The data acquisition system is comprised of an electronic signal processor and sorter for operating up to eight counters simultaneously and interfacing to a computer with software for data storage, acquisitions and age dating calculations. We discuss low-background counter modifications, electronic signal processing and computer software for 14C age dating.
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Webb, A. J., P. R. Bampton, S. Smith, and S. P. Close. "Electronics in genetic improvement of pigs." Proceedings of the British Society of Animal Production (1972) 1990 (March 1990): 106. http://dx.doi.org/10.1017/s0308229600018870.
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Past genetic improvement programmes have concentrated mainly on lean growth. They have relied on a few simple measurements of growth rate, food intake and ultrasonic backfat, which were laborious to record, check and process. Now there is increasing concern to improve, or at least avoid undesirable correlated changes in, eating quality, distribution of lean, and reproduction.New electronic techniques offer the opportunity to record additional traits, with lower costs and faster data processing. This paper reviews the likely impact of electronics on the rate and nature of genetic improvement in pigs.
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Nugraha, Arya Adhi. "Electronic Stetoscope Design And Analysis Application Of Heart Sound With Digital Signal Processing." Jurnal Jartel: Jurnal Jaringan Telekomunikasi 1, no. 1 (May 30, 2015): 1–8. http://dx.doi.org/10.33795/jartel.v1i1.123.
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In this paper and has implemented a stethoscope electronic application sound analysis in heart client-server. A stethoscope electronics will catch a heart and menghantarkannya to computer so that the computer can sound mendigitalisasi heart. The application will process, sound analysis heart store and display a heart condition and sound spectrum of the heart. Extraction habitude anything undertaken to gain special habitude from the heart to perform the process of decomposing paket wavelet and root mean square ( rms ) at the sound of the heart. From the data obtained, in different heart conditions, decomposition of wavelet package give value range min 6 up to a maximum of 23 is much larger and RMS only give minimal range 0.04 to 0.16 in band 0-125Hz of variations of the same types of heart conditions. Sample Data obtained from 5 persons recorded sound his heart and then analyzed with the same two methods. The Data obtained are more closer to the normal heart sound so it can be deduced from the 5 sample data used is the sound of the heart under normal conditions.
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Jastrzebska-Perfect, Patricia, George D. Spyropoulos, Claudia Cea, Zifang Zhao, Onni J. Rauhala, Ashwin Viswanathan, Sameer A. Sheth, Jennifer N. Gelinas, and Dion Khodagholy. "Mixed-conducting particulate composites for soft electronics." Science Advances 6, no. 17 (April 2020): eaaz6767. http://dx.doi.org/10.1126/sciadv.aaz6767.
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Bioelectronic devices should optimally merge a soft, biocompatible tissue interface with capacity for local, advanced signal processing. Here, we introduce an organic mixed-conducting particulate composite material (MCP) that can form functional electronic components by varying particle size and density. We created MCP-based high-performance anisotropic films, independently addressable transistors, resistors, and diodes that are pattern free, scalable, and biocompatible. MCP enabled facile and effective electronic bonding between soft and rigid electronics, permitting recording of neurophysiological data at the resolution of individual neurons from freely moving rodents and from the surface of the human brain through a small opening in the skull. We also noninvasively acquired high–spatiotemporal resolution electrophysiological signals by directly interfacing MCP with human skin. MCP provides a single-material solution to facilitate development of bioelectronic devices that can safely acquire, transmit, and process complex biological signals.
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Riches, S. T., C. Johnston, M. Sousa, and P. Grant. "High Temperature Endurance of Packaged SOI Devices for Signal Conditioning and Processing Applications." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2011, HITEN (January 1, 2011): 000251–54. http://dx.doi.org/10.4071/hiten-paper8-sriches.
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Silicon on Insulator (SOI) device technology is fulfilling a niche requirement for electronics that functions satisfactorily at operating temperatures of >200°C. Most of the reliability data on the high temperature endurance of the devices is generated on the device itself with little attention being paid to the packaging technology around the device. Similarly, most of the reliability data generated on high temperature packaging technologies uses testpieces rather than real devices, which restricts any conclusions on long term electrical performance. This paper presents results of high temperature endurance studies on SOI devices combined with high temperature packaging technologies relevant to signal conditioning and processing functions for sensors in down-well and aero-engine applications. The endurance studies have been carried out for up to 7,056 hours at 250°C, with functioning devices being tested periodically at room temperature, 125°C and 250°C. Different die attach and wire bond options have been included in the study and the performance of multiplexers, transistors, bandgap voltage, oscillators and voltage regulators functional blocks have been characterised. This work formed part of the UPTEMP project which was set-up with support from UK Technology Strategy Board and the EPSRC. The project brought together a consortium of end-users (Sondex Wireline and Vibro-Meter UK), electronic module manufacturers (GE Aviation Systems Newmarket) and material suppliers (Gwent Electronic Materials and Thermastrate Ltd) with Oxford University-Materials Department, the leading UK high temperature electronics research centre.
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Riches, S. T., C. Johnston, and A. Lui. "Realisation of High Temperature Electronics Packaging Technology for Sensor Conditioning and Processing Applications." International Symposium on Microelectronics 2012, no. 1 (January 1, 2012): 000192–99. http://dx.doi.org/10.4071/isom-2012-ta61.
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The requirement to install electronic power and control systems in high temperature environments in aero-engines and in down-well exploration has posed a challenge to the traditional limit of 125°C of electronics systems. The leap in operating temperature to above 200°C in combination with high pressures, vibrations and potentially corrosive environments means that different semiconductors, passives, circuit boards and assembly processes will be needed to fulfil target performance specifications. Silicon on Insulator (SOI) device technology has been shown to be capable of functioning satisfactorily at operating temperatures of >200°C. Most of the applications to date have required performance for short times (<2,000 hours) at the highest operating temperatures of up to 225°C in down-well drilling applications. There is interest in extending the endurance of high temperature electronics into aero-engine and other applications where a minimum 20 year operating life is stipulated. Most of the reliability data on the high temperature endurance of the integrated circuit is generated with little consideration of the packaging technologies, whilst most of the reliability data pertinent to high temperature packaging technologies uses test pieces, which limits any conclusions relating to long term electrical performance. This paper will present results of studies on high temperature packaging technologies relevant to signal conditioning and processing functions for sensors in down-well and aero-engine applications. Different die attach and wire bond options have been included in the study and the performance of several functional blocks on a high temperature SOI device has been tracked over the endurance tests which have lasted for >11,000 hours at 250°C. Degradation phenomena such as thermal migration and material deterioration due to high temperature exposure in air and inert atmospheres will be described. An assessment of the availability of high temperature materials and components to meet long term requirements for operation at 250°C will be presented.
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Ye, Hongjun, Xiaojun Jing, Liang Liu, Maolei Wang, Shuo Hao, Xingkang Lang, and Baoguo Yu. "Analysis of Quasi-Zenith Satellite System Signal Acquisition and Multiplexing Characteristics in China Area." Sensors 20, no. 6 (March 11, 2020): 1547. http://dx.doi.org/10.3390/s20061547.
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On the basis of realizing regional navigation, the Quasi-Zenith Satellite System (QZSS) has advanced navigation function, which leads to the broadcasting of more signals in a single frequency of QZSS signals. Current signal transmission technology cannot solve this problem, so it is necessary to design a signal multiplexing method. The current QZSS satellite interface document does not disclose the multiplexing modulation method of the signal transmission, which has a certain impact on the acquisition of high-precision observation data and further data processing. The iGMAS (International GNSS Monitoring & Assessment System) Monitoring and Evaluation Center of the 54th Research Institute of China Electronics Technology Group Corporation has used the low-distortion data acquisition and processing platform and refined signal software receiving processing algorithm of the iGMAS to complete the signal acquisition and analysis of QZSS satellites. Analysis of the multiplexing and modulation method and signal characteristics for the QZSS has been carried out, which can provide a reference for the design and data processing of high-precision receivers.
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Sharifi, Leila, Marcello De Matteis, Hubert Kroha, Robert Richter, and Andrea Baschirotto. "Time-Variant Front-End Read-Out Electronics for High-Data-Rate Detectors." Electronics 10, no. 13 (June 24, 2021): 1528. http://dx.doi.org/10.3390/electronics10131528.
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The foreseen incremental luminosity for near-future high-energy physics experiments demands evolution for the read-out electronics in terms of event data-rate. However, the filtering necessary to reject noise and meet the signal-to-noise-ratio requirements imposes a restriction on the operational speed of the conventional read-out electronics. The stringent trade-off between signal-to-noise-ratio and the event data-rate originates from the time-invariant behavior of the conventional systems. In this paper, the cases of time-variant systems are addressed, studying a benchmark with the RC-CR shaping function used in time-over-threshold methods. It was demonstrated that the time-variant systems enable a higher data-rate for the given noise performance. Moreover, taking advantage of time-variant systems, the proposed rising-edge method enables further data-rate enhancement with respect to the traditional time-over-threshold technique by reading the data from the rising edge of the analog output waveform. A comparison between the conventional time-invariant time-over-threshold technique, its time-variant equivalent and rising-edge method confirms the better performance of the latter one in terms of data-rate enhancement for a target noise performance. Moreover, design challenges for time-variant systems are briefly discussed, considering the ATLAS Monitored Drift Tube detector as a design case.
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Huang, Chien-Yi, Marvin Ruano, Ching-Hsiang Chen, and Christopher Greene. "Applying data mining methodology to establish an intelligent decision system for PCBA process." Soldering & Surface Mount Technology 31, no. 4 (September 2, 2019): 271–78. http://dx.doi.org/10.1108/ssmt-10-2018-0036.
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Purpose This paper aims to consider the practical production environment of electronics manufacturing industry firms, and the large quantities of information collected on machine processes, testing data and production reports, while simultaneously taking into account the properties of the processing environment, in conducting analysis to obtain valuable information. Design/methodology/approach This research constructs a prediction model of the circuit board assembly process yield. A decision tree is used to extract the key attributes. The authors also integrate association rules to determine the relevance of key attributes of undesirable phenomena. Findings The results assure the successful application of the methodology by reconfirming the rules for solder skip and short circuit occurrence and their causes. Originality/value Measures for improvement are recommended, production parameters determined and debugging suggestions made to improve the process yield when the new process is implemented.
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Andreta, André, Luiz Fernando Lavado Villa, Yves Lembeye, and Jean Christophe Crebier. "A Novel Automated Design Methodology for Power Electronics Converters." Electronics 10, no. 3 (January 23, 2021): 271. http://dx.doi.org/10.3390/electronics10030271.
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This work proposes a methodology for designing power electronic converters called “Automatic Design for Manufacturing” (ADFM). This methodology proposes creating Power Converter Arrays (PCAs) using standardized converter cells. The approach is greatly inspired by the microelectronics integrated circuit design flow, power electronics building blocks, and multicell converters. To achieve the desired voltage/current specifications, the PCA conversion stage is made from the assembly of several Conversion-Standard Cells (CSCs) in series and/or parallel. The ADFM uses data-based models to simulate the behavior of a PCA with very little computational effort. These models require a special characterization approach to maximize the amount of knowledge while minimizing the amount of data. This approach consists of establishing an experiment plan to select the relevant measurements that contain the most information about the PCA technology, building an experimental setup that is capable of acquiring data automatically and using statistical learning to train models that can yield precise predictions. This work performed over 210 h of tests in nine different PCAs in order to gather data to the statistical models. The models predict the efficiency and converter temperature of several PCAs, and the accuracy is compared with real measurements. Finally, the models are employed to compare the performance of PCAs in a specific battery charging application.
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Kucevic, Denis, S. Trivunovic, M. Plavsic, S. Stankovski, and G. Ostojic. "Modern aspects of marking of animals." Biotehnologija u stocarstvu 25, no. 1-2 (2009): 153–59. http://dx.doi.org/10.2298/bah0902153k.
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The conventional marking and identification of animals can be done in several different ways. With the application of modern informatics and electronics solutions, it is possible to substitute conventional ways with the different types of the electronic marking and identification. All types of electronic identification for transferring data are using the technology of the radio frequency (RFDI). With application of electronic marking, it is possible to achieve a great number of advantages of which the most important are the high precision of reading the data, individual supervision for every animal, automatic input of data, processing and keeping the information as a permanent actualization of data base. It is necessary to remove all existing defects and in future to work on the improvement of existing types of the electronic marking of animals. .
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Zhou, Yi Hua, Jun Qian, and Xue Mei Yu. "Study on Precision and Uniformity Evaluation Method of PEDOT/PSS Ink-Jet Print Film." Advanced Materials Research 634-638 (January 2013): 3840–43. http://dx.doi.org/10.4028/www.scientific.net/amr.634-638.3840.
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PEDOT/PSS has an excellent performance in the electronic components and ink jet print has been used widely printed electronics. But the film quality of PEDOT/PSS produced by ink jet printers can be limited by many parameters and is very difficult to evaluate accurately. In this paper, we propose uniformity and precision as the key indicators and combine image processing method in to the evaluation methods. First we analyses the characteristic and limitation of the ink jet printer, and use image processing methods to evaluate the experimental data. From the result it demonstrates this new method is feasible, and can get more detail. And it can apply in the future dedicated ink jet printer study and quality detection
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OLD, TOM, ROY HENDRICK, DAVE HIGHAM, NELSON PALMER, and CHRIS MANNING. "THE HYPERTEMPORAL-HYPERSPECTRAL ANALYSIS TEST STATION — HYHATS." International Journal of High Speed Electronics and Systems 18, no. 03 (September 2008): 557–67. http://dx.doi.org/10.1142/s0129156408005564.
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ATK Mission Research will describe a very high speed FT-IR spectrometer that collects 1000 interferograms per second at a 4 cm−1 resolution in the 2-5 micrometer bandpass. The field of view of the instrument is about 1 degree. Collection of photons is on a single cryo-cooled InSb detector with output data streamed to a RAID device for later processing. The system uses a rotating lightweight air bearing mirror to achieve rapid variation of optical path length. Tilt compensation optics include a corner cube in a variation of the Michelson arrangement. The instrument is a one-man portable, tripod-mounted unit with off-unit data collection electronics. The system is designed for field deployment where measurements of energetic events are desired. Applications are commercial and military.
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Savelyev, Timofey, Xiaodong Zhuge, Bill Yang, Pascal Aubry, Alexander Yarovoy, Leo Ligthart, and Boris Levitas. "Comparison of 10–18 GHz SAR and MIMO-based short-range imaging radars." International Journal of Microwave and Wireless Technologies 2, no. 3-4 (June 8, 2010): 369–77. http://dx.doi.org/10.1017/s1759078710000383.
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This paper presents an experimental investigation of two approaches to short-range radar imaging at microwaves by means of ultra-wideband (UWB) technology. The first approach represents a classical synthetic aperture radar (SAR) that employs a transmit–receive antenna pair on mechanical scanner. The second one makes use of a multiple input multiple output (MIMO) antenna array that scans electronically in the horizontal plane and mechanically, installed on the scanner, in the vertical plane. The mechanical scanning in only one direction reduces significantly the measurement time. Two respective prototypes have been built and compared. Both systems comprise the same 10–18 GHz antennas and multi-channel video impulse electronics while the same data processing and imaging method based on Kirchhoff migration is applied to acquired data for digital beamforming. The study has been done for an application of concealed weapon detection.
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Mishra, Saswat, Yun-Soung Kim, Jittrapol Intarasirisawat, Young-Tae Kwon, Yongkuk Lee, Musa Mahmood, Hyo-Ryoung Lim, et al. "Soft, wireless periocular wearable electronics for real-time detection of eye vergence in a virtual reality toward mobile eye therapies." Science Advances 6, no. 11 (March 2020): eaay1729. http://dx.doi.org/10.1126/sciadv.aay1729.
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Recent advancements in electronic packaging and image processing techniques have opened the possibility for optics-based portable eye tracking approaches, but technical and safety hurdles limit safe implementation toward wearable applications. Here, we introduce a fully wearable, wireless soft electronic system that offers a portable, highly sensitive tracking of eye movements (vergence) via the combination of skin-conformal sensors and a virtual reality system. Advancement of material processing and printing technologies based on aerosol jet printing enables reliable manufacturing of skin-like sensors, while the flexible hybrid circuit based on elastomer and chip integration allows comfortable integration with a user’s head. Analytical and computational study of a data classification algorithm provides a highly accurate tool for real-time detection and classification of ocular motions. In vivo demonstration with 14 human subjects captures the potential of the wearable electronics as a portable therapy system, whose minimized form factor facilitates seamless interplay with traditional wearable hardware.
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Jurgielewicz, Paweł, Tomasz Fiutowski, Ewa Kublik, Andrzej Skoczeń, Małgorzata Szypulska, Piotr Wiącek, Paweł Hottowy, and Bartosz Mindur. "Modular Data Acquisition System for Recording Activity and Electrical Stimulation of Brain Tissue Using Dedicated Electronics." Sensors 21, no. 13 (June 28, 2021): 4423. http://dx.doi.org/10.3390/s21134423.
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In this paper, we present a modular Data Acquisition (DAQ) system for simultaneous electrical stimulation and recording of brain activity. The DAQ system is designed to work with custom-designed Application Specific Integrated Circuit (ASIC) called Neurostim-3 and a variety of commercially available Multi-Electrode Arrays (MEAs). The system can control simultaneously up to 512 independent bidirectional i.e., input-output channels. We present in-depth insight into both hardware and software architectures and discuss relationships between cooperating parts of that system. The particular focus of this study was the exploration of efficient software design so that it could perform all its tasks in real-time using a standard Personal Computer (PC) without the need for data precomputation even for the most demanding experiment scenarios. Not only do we show bare performance metrics, but we also used this software to characterise signal processing capabilities of Neurostim-3 (e.g., gain linearity, transmission band) so that to obtain information on how well it can handle neural signals in real-world applications. The results indicate that each Neurostim-3 channel exhibits signal gain linearity in a wide range of input signal amplitudes. Moreover, their high-pass cut-off frequency gets close to 0.6Hz making it suitable for recording both Local Field Potential (LFP) and spiking brain activity signals. Additionally, the current stimulation circuitry was checked in terms of the ability to reproduce complex patterns. Finally, we present data acquired using our system from the experiments on a living rat’s brain, which proved we obtained physiological data from non-stimulated and stimulated tissue. The presented results lead us to conclude that our hardware and software can work efficiently and effectively in tandem giving valuable insights into how information is being processed by the brain.
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Frewin, Christopher L., Melanie Ecker, Alexandra Joshi-Imre, Jonathan Kamgue, Jeanneane Waddell, Vindhya Reddy Danda, Allison M. Stiller, Walter E. Voit, and Joseph J. Pancrazio. "Electrical Properties of Thiol-ene-based Shape Memory Polymers Intended for Flexible Electronics." Polymers 11, no. 5 (May 17, 2019): 902. http://dx.doi.org/10.3390/polym11050902.
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Thiol-ene/acrylate-based shape memory polymers (SMPs) with tunable mechanical and thermomechanical properties are promising substrate materials for flexible electronics applications. These UV-curable polymer compositions can easily be polymerized onto pre-fabricated electronic components and can be molded into desired geometries to provide a shape-changing behavior or a tunable softness. Alternatively, SMPs may be prepared as a flat substrate, and electronic circuitry may be built directly on top by thin film processing technologies. Whichever way the final structure is produced, the operation of electronic circuits will be influenced by the electrical and mechanical properties of the underlying (and sometimes also encapsulating) SMP substrate. Here, we present electronic properties, such as permittivity and resistivity of a typical SMP composition that has a low glass transition temperature (between 40 and 60 °C dependent on the curing process) in different thermomechanical states of polymer. We fabricated parallel plate capacitors from a previously reported SMP composition (fully softening (FS)-SMP) using two different curing processes, and then we determined the electrical properties of relative permittivity and resistivity below and above the glass transition temperature. Our data shows that the curing process influenced the electrical permittivity, but not the electrical resistivity. Corona-Kelvin metrology evaluated the quality of the surface of FS-SMP spun on the wafer. Overall, FS-SMP demonstrates resistivity appropriate for use as an insulating material.
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Muñoz-Benavent, Pau, Vicente Puig-Pons, Gabriela Andreu-García, Víctor Espinosa, Vicente Atienza-Vanacloig, and Isabel Pérez-Arjona. "Automatic Bluefin Tuna Sizing with a Combined Acoustic and Optical Sensor." Sensors 20, no. 18 (September 16, 2020): 5294. http://dx.doi.org/10.3390/s20185294.
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A proposal is described for an underwater sensor combining an acoustic device with an optical one to automatically size juvenile bluefin tuna from a ventral perspective. Acoustic and optical information is acquired when the tuna are swimming freely and the fish cross our combined sensor’s field of view. Image processing techniques are used to identify and classify fish traces in acoustic data (echogram), while the video frames are processed by fitting a deformable model of the fishes’ ventral silhouette. Finally, the fish are sized combining the processed acoustic and optical data, once the correspondence between the two kinds of data is verified. The proposed system is able to automatically give accurate measurements of the tuna’s Snout-Fork Length (SFL) and width. In comparison with our previously validated automatic sizing procedure with stereoscopic vision, this proposal improves the samples per hour of computing time by 7.2 times in a tank with 77 juveniles of Atlantic bluefin tuna (Thunnus thynnus), without compromising the accuracy of the measurements. This work validates the procedure for combining acoustic and optical data for fish sizing and is the first step towards an embedded sensor, whose electronics and processing capabilities should be optimized to be autonomous in terms of the power supply and to enable real-time processing.
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Paramonov, Alexander. "FELIX: the Detector Interface for the ATLAS Experiment at CERN." EPJ Web of Conferences 251 (2021): 04006. http://dx.doi.org/10.1051/epjconf/202125104006.
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The Front-End Link eXchange (FELIX) system is an interface between the trigger and detector electronics and commodity switched networks for the ATLAS experiment at CERN. In preparation for the LHC Run 3, to start in 2022, the system is being installed to read out the new electromagnetic calorimeter, calorimeter trigger, and muon components being installed as part of the ongoing ATLAS upgrade programme. The detector and trigger electronic systems are largely custom and fully synchronous with respect to the 40.08 MHz clock of the Large Hadron Collider (LHC). The FELIX system uses FPGAs on server-hosted PCIe boards to pass data between custom data links connected to the detector and trigger electronics and host system memory over a PCIe interface then route data to network clients, such as the Software Readout Drivers (SW ROD), via a dedicated software platform running on these machines. The SW RODs build event fragments, buffer data, perform detector-specific processing and provide data for the ATLAS High Level Trigger. The FELIX approach takes advantage of modern FPGAs and commodity computing to reduce the system complexity and effort needed to support data acquisition systems in comparison to previous designs. Future upgrades of the experiment will introduce FELIX to read out all other detector components.
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Soni, Mahesh, and Ravinder Dahiya. "Soft eSkin: distributed touch sensing with harmonized energy and computing." Philosophical Transactions of the Royal Society A: Mathematical, Physical and Engineering Sciences 378, no. 2164 (December 23, 2019): 20190156. http://dx.doi.org/10.1098/rsta.2019.0156.
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Inspired by biology, significant advances have been made in the field of electronic skin (eSkin) or tactile skin. Many of these advances have come through mimicking the morphology of human skin and by distributing few touch sensors in an area. However, the complexity of human skin goes beyond mimicking few morphological features or using few sensors. For example, embedded computing (e.g. processing of tactile data at the point of contact) is centric to the human skin as some neuroscience studies show. Likewise, distributed cell or molecular energy is a key feature of human skin. The eSkin with such features, along with distributed and embedded sensors/electronics on soft substrates, is an interesting topic to explore. These features also make eSkin significantly different from conventional computing. For example, unlike conventional centralized computing enabled by miniaturized chips, the eSkin could be seen as a flexible and wearable large area computer with distributed sensors and harmonized energy. This paper discusses these advanced features in eSkin, particularly the distributed sensing harmoniously integrated with energy harvesters, storage devices and distributed computing to read and locally process the tactile sensory data. Rapid advances in neuromorphic hardware, flexible energy generation, energy-conscious electronics, flexible and printed electronics are also discussed. This article is part of the theme issue ‘Harmonizing energy-autonomous computing and intelligence’.
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Gao, R. X., and W. Thelen. "Sensor-Integrated Grinding Balls for on-Line Load Distribution Measurement in Ball Mills." Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture 208, no. 3 (August 1994): 183–90. http://dx.doi.org/10.1243/pime_proc_1994_208_077_02.
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For the on-line measurement of stress and energy distributions inside ball mills, two types of self-contained, autonomous grinding balls with fully integrated piezo-electric sensors and data-processing electronics are developed and fabricated. The basic model is designed for batchwise experiments on ball mills, where data registered in electronic memories are read out through cable connections to a processing circuit. The improved model contains additional data modulation circuits with a VHF microtransmitter, allowing on-line data retrieval. For the purpose of circuit miniaturization, hybrid and surface mount techniques (SMT) have been utilized. The instrumented balls are identical in size, mass and surface characteristics to the normal grinding balls, with the minimum outer diameter being 40 mm. Systematic experiments have shown that they are fully applicable in a realistic grinding environment where grinding media are presented. In addition to ball mill applications, the developed integration and measuring technique is generally suited for on-line data registration on free-moving objects or other industrial applications where accessibility of the measurand is insufficient.
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HAIDER, MOHAMMAD RAFIQUL, JEREMY HOLLEMAN, SALWA MOSTAFA, and SYED KAMRUL ISLAM. "LOW-POWER BIOMEDICAL SIGNAL MONITORING SYSTEM FOR IMPLANTABLE SENSOR APPLICATIONS." International Journal of High Speed Electronics and Systems 20, no. 01 (March 2011): 115–28. http://dx.doi.org/10.1142/s0129156411006453.
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Implantable biomedical sensors and continuous real time in vivo monitoring of various physiological parameters requires low-power sensor electronics and wireless telemetry for transmission of sensor data. In this article, generic blocks required for such systems have been demonstrated with design examples. Ideally neural or electro-chemical sensor signal monitoring units comprise of low noise amplifiers, current or voltage mode analog to digital domain data conversion circuits and wireless telemetry circuits. The low-noise amplifier described here has a novel open loop amplifier scheme used for neural signal recording systems. The design has been implemented using 0.5-μm SOI-BiCMOS process. The fabricated chip can work with 1 V supply and consumes 805 nA. The current mode analog to digital conversion signal processing circuitry takes the current signal as an input and generates a pulse-width modulated data signal. The data signal is then modulated with a high frequency carrier signal to generate FSK data for wireless transmission. The design is fabricated in 0.5-μm standard CMOS process and consumes 1.1 mW of power with 3.5 V supply.
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Kamalieva, A. N., N. A. Toropov, T. A. Vartanyan, M. A. Baranov, P. S. Parfenov, K. V. Bogdanov, Y. A. Zharova, and V. A. Tolmachev. "Fabrication of silicon nanostructures for application in photonics." Физика и техника полупроводников 52, no. 5 (2018): 518. http://dx.doi.org/10.21883/ftp.2018.05.45862.51.
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AbstractSilicon is the primary material of modern electronics. It also possesses bright potentials for applications in nanophotonics. At the same time optical properties of bulk silicon do not fully satisfy requirements imposed on them. Fortunately, properties of silicon nanostructures strongly depend on their shapes and sizes. In this regard, of special interest is the development of fabrication and post-processing methods of silicon nanostructures. In this contribution we propose a method for silicon nanostructures fabrication combining the technique of high-vacuum deposition with metal-assisted chemical etching. SEM images as well as ellipsometry, Raman scattering and optical spectroscopy data prove that the desired structural changes were obtained.
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Coffa, Salvatore, and Leonid Tsybeskov. "Silicon-Based Optoelectronics." MRS Bulletin 23, no. 4 (April 1998): 16–19. http://dx.doi.org/10.1557/s0883769400030219.
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The enormous progress of communication technologies in the last years has increased the demand for efficient and low-cost optoelectronic functions. For several present and future applications, photonic materials—in which light can be generated, guided, modulated, amplified, and detected—need to be integrated with standard electronic circuits in order to combine the information-processing capabilities of electronics data transfer and the speed of light. Long-distance communications, local-area-networks data transfer, and chip-to-chip or even intrachip optical communications all require the development of efficient optical functions and their integration with state-of-the-art electronic functions. Silicon is the material of choice for reliable and low-cost optoelectronic integrated circuits because it is the leading semiconductor in the electronic arena and since a wellestablished processing technology exists for this material. However Si is characterized by an indirect bandgap and by a weak electro-optic effect. It is therefore not suitable for the implementation of fundamental optical functions such as light emission and modulation. At the moment, hybrid integration of compound-semiconductor optical functions with Si electronic functions is providing the gateway from electronic to photonic technology. However several strategies are being considered to engineer the optical functions of Si and to realize fully Si-based or at least Si-compatible optoelectronics.
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Lee, Ah-Hyoung, Jihun Lee, Farah Laiwalla, Vincent Leung, Jiannan Huang, Arto Nurmikko, and Yoon-Kyu Song. "A Scalable and Low Stress Post-CMOS Processing Technique for Implantable Microsensors." Micromachines 11, no. 10 (October 5, 2020): 925. http://dx.doi.org/10.3390/mi11100925.
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Implantable active electronic microchips are being developed as multinode in-body sensors and actuators. There is a need to develop high throughput microfabrication techniques applicable to complementary metal–oxide–semiconductor (CMOS)-based silicon electronics in order to process bare dies from a foundry to physiologically compatible implant ensembles. Post-processing of a miniature CMOS chip by usual methods is challenging as the typically sub-mm size small dies are hard to handle and not readily compatible with the standard microfabrication, e.g., photolithography. Here, we present a soft material-based, low chemical and mechanical stress, scalable microchip post-CMOS processing method that enables photolithography and electron-beam deposition on hundreds of micrometers scale dies. The technique builds on the use of a polydimethylsiloxane (PDMS) carrier substrate, in which the CMOS chips were embedded and precisely aligned, thereby enabling batch post-processing without complication from additional micromachining or chip treatments. We have demonstrated our technique with 650 μm × 650 μm and 280 μm × 280 μm chips, designed for electrophysiological neural recording and microstimulation implants by monolithic integration of patterned gold and PEDOT:PSS electrodes on the chips and assessed their electrical properties. The functionality of the post-processed chips was verified in saline, and ex vivo experiments using wireless power and data link, to demonstrate the recording and stimulation performance of the microscale electrode interfaces.
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Hambly, N. C., M. Cropper, S. Boudreault, C. Crowley, R. Kohley, J. H. J. de Bruijne, C. Dolding, et al. "Gaia Data Release 2." Astronomy & Astrophysics 616 (August 2018): A15. http://dx.doi.org/10.1051/0004-6361/201832716.
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Context. The European Space Agency’s Gaia satellite was launched into orbit around L2 in December 2013. This ambitious mission has strict requirements on residual systematic errors resulting from instrumental corrections in order to meet a design goal of sub-10 microarcsecond astrometry. During the design and build phase of the science instruments, various critical calibrations were studied in detail to ensure that this goal could be met in orbit. In particular, it was determined that the video-chain offsets on the analogue side of the analogue-to-digital conversion electronics exhibited instabilities that could not be mitigated fully by modifications to the flight hardware. Aims. We provide a detailed description of the behaviour of the electronic offset levels on short (<1 ms) timescales, identifying various systematic effects that are known collectively as “offset non-uniformities”. The effects manifest themselves as transient perturbations on the gross zero-point electronic offset level that is routinely monitored as part of the overall calibration process. Methods. Using in-orbit special calibration sequences along with simple parametric models, we show how the effects can be calibrated, and how these calibrations are applied to the science data. While the calibration part of the process is relatively straightforward, the application of the calibrations during science data processing requires a detailed on-ground reconstruction of the readout timing of each charge-coupled device (CCD) sample on each device in order to predict correctly the highly time-dependent nature of the corrections. Results. We demonstrate the effectiveness of our offset non-uniformity models in mitigating the effects in Gaia data. Conclusions. We demonstrate for all CCDs and operating instrument/modes on board Gaia that the video-chain noise-limited performance is recovered in the vast majority of science samples.
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Hudedmani, Mallikarjun G., and Bindu Suresh Pagad. "Plasmonics: A Path to Replace Electronics and Photonics by Scalable Ultra-fast Technology." Advanced Journal of Graduate Research 7, no. 1 (October 27, 2019): 37–44. http://dx.doi.org/10.21467/ajgr.7.1.37-44.
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Semiconductor devices, circuits, and components are dependent upon miniaturization for transporting huge amounts of data at a high speed these provide the ability to control the transport and storage of electrons. Current communication systems are based on either electrons or photonics. These modern electronic devices for information processing and sensing are functioning almost close to their fundamental speed and bandwidth limitations which a serious problem. The performance of electronic circuits, as well as photonics, is now becoming rather limited when digital information needs to be sent from one point to another. Plasmonics is a new technology a kind of photonics-based on surface plasmons viable. Surface plasmons are a way of guiding light. Surface Plasmon (SP) based circuits, which merge electronics and photonics at the nanoscale, may offer a solution to the size-compatibility problem. Optical fiber communication (OFC) is a well-known light enabled information transmission mechanism communicates very effectively over large distance. Surface plasmons, on the other hand, can guide light only over distances of tens or hundreds of microns. Surface plasmons are the electromagnetic (optical) waves get generated from the interaction between light and the mobile conduction electrons on the surface of a metal. The surface plasmons created by the interaction of light near the surface possess unique advantages like the high speed of communication which is very essential for the current generation of electrical and medical fields.
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Álvarez, José Luis, Juan Daniel Mozo, and Eladio Durán. "Analysis of Single Board Architectures Integrating Sensors Technologies." Sensors 21, no. 18 (September 21, 2021): 6303. http://dx.doi.org/10.3390/s21186303.
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Development boards, Single-Board Computers (SBCs) and Single-Board Microcontrollers (SBMs) integrating sensors and communication technologies have become a very popular and interesting solution in the last decade. They are of interest for their simplicity, versatility, adaptability, ease of use and prototyping, which allow them to serve as a starting point for projects and as reference for all kinds of designs. In this sense, there are innumerable applications integrating sensors and communication technologies where they are increasingly used, including robotics, domotics, testing and measurement, Do-It-Yourself (DIY) projects, Internet of Things (IoT) devices in the home or workplace and science, technology, engineering, educational and also academic world for STEAM (Science, Technology, Engineering and Mathematics) skills. The interest in single-board architectures and their applications have caused that all electronics manufacturers currently develop low-cost single board platform solutions. In this paper we realized an analysis of the most important topics related with single-board architectures integrating sensors. We analyze the most popular platforms based on characteristics as: cost, processing capacity, integrated processing technology and open-source license, as well as power consumption (mA@V), reliability (%), programming flexibility, support availability and electronics utilities. For evaluation, an experimental framework has been designed and implemented with six sensors (temperature, humidity, CO2/TVOC, pressure, ambient light and CO) and different data storage and monitoring options: locally on a μSD (Micro Secure Digital), on a Cloud Server, on a Web Server or on a Mobile Application.
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Neckel, Anderson, and Ricardo Boeing. "Relation between Consumer Innovativeness Behavior and Purchasing Adoption Process: A Study with Electronics Sold Online." International Journal of Marketing Studies 9, no. 3 (May 29, 2017): 64. http://dx.doi.org/10.5539/ijms.v9n3p64.
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This paper aims at analyzing the influence of consumer innovativeness behavior on the purchasing adoption process of products sold on the internet. Through a theoretical framework, the Domain Specific Innovativeness (DSI) and New Involvement Profile (NIP) scales were used in the study. The research approach has a mixed methodology, having both qualitative and quantitative approaches. In the qualitative phase, two focus group were conducted, with the objective of aligning the scales with the main research focus, and in the quantitative phase, an online survey with 448 respondents was applied. Data processing was based on multiple linear regression and results shows that the construct of the consumer innovativeness behavior has an explanatory power (R²) of 59.8% relative to the purchasing adoption process by the consumer. The consumers with a stronger innovativeness behavior showed to have similar characteristics when it came to purchasing innovative electronic products, making it easier to lead them to consumption.
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Atamas, A. I., I. A. Slipukhina, I. S. Chernetckyi, and Y. S. Shykhovtsev. "Virtual environments for the design of electronic devices as a means of instrumental digital didactics." Scientific Notes of Junior Academy of Sciences of Ukraine, no. 2(18) (2020): 57–67. http://dx.doi.org/10.51707/2618-0529-2020-18-06.
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Instrumental digital didactics reflects the application to education of various digital means of obtaining, processing and interpreting experimental data in accordance with the logic of the scientific method and engineering design. An important component of a modern STEM-oriented educational environment are innovative software products for modelling and simulation of electronic circuits. In educational research projects on their basis, the parameters of the components of electrical circuits created in virtual environments are compared with the technical characteristics of similar devices available for sale. This technique allows not only to demonstrate the similarities and differences of idealized and real artifacts, to identify sources and magnitude of possible errors, but also to obtain electrical characteristics sufficient to build equivalent schemes for substituting devices without prior experimental research. The proposed approach is demonstrated on the example of studying the parameters of a device of current interest — a photoelectric converter (determining the point of its maximum power and the fill factor). Learning by means of using equivalent substitution schemes demonstrates one of the variants of the engineering design process to students. In addition, the proposed method, due to the possibility of development from an algorithmic training procedure to an engineering research, allows for an individual approach to the teaching of electrical engineering and electronics. Research of didactic features of the study of electricity and the basics of electronics, in particular with the use of NI “Multisim 11.0”, is one of the activities of the STEM-laboratory of “MANLab” National centre “Junior academy of sciences of Ukraine”. Some of the tested methods are designed as a workbook and placed in free access in the form of instructions on the online resource stemua.science.
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Lu, Taofeng, Gregory Reimonn, Gregory Morose, Evan Yu, and Wan-Ting Chen. "Removing Acrylic Conformal Coating with Safer Solvents for Re-Manufacturing Electronics." Polymers 13, no. 6 (March 18, 2021): 937. http://dx.doi.org/10.3390/polym13060937.
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Conformal coating is typically composed of polymeric film and is used to protect delicate electronic components such as printed-circuit boards. Without removing conformal coating, it would be difficult to repair these complicated electronics. Methylene chloride, also called dichloromethane (DCM), has a widespread usage in conformal coating stripper products. The high toxicity of DCM increases human health risk when workers are exposed to DCM during the conformal coating removal processes. Therefore, the replacement of DCM would be beneficial to greatly improve the overall safety profile for workers in the electronics and coating industries. This research identified and evaluated alternative chemicals for replacing DCM used in acrylic conformal coating stripping operations. The solubility of an acrylic conformal coating was measured and characterized using Hansen solubility parameters (HSP) theory. Coating dwell time tests using various solvent blends verified the accuracy of the created HSP solubility sphere. A data processing method was also developed to identify and screen potential alternative solvent blends in terms of safety, toxicity, and cost-effectiveness. The identified safer solvent blends were demonstrated to provide equivalent stripping performance as compared to DCM based coating strippers within an acceptable cost range. The results of this research will be of value to other types of conformal coatings, such as silicone and polyurethane, where DCM is commonly used in similar coating stripping operations. By safely removing conformal coating, delicate electronics would be available for re-manufacturing, enabling a circular economy.
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Sundaram, Rajyashree M., Atsuko Sekiguchi, Mizuki Sekiya, Takeo Yamada, and Kenji Hata. "Copper/carbon nanotube composites: research trends and outlook." Royal Society Open Science 5, no. 11 (November 2018): 180814. http://dx.doi.org/10.1098/rsos.180814.
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We present research progress made in developing copper/carbon nanotube composites (Cu/CNT) to fulfil a growing demand for lighter copper substitutes with superior electrical, thermal and mechanical performances. Lighter alternatives to heavy copper electrical and data wiring are needed in automobiles and aircrafts to enhance fuel efficiencies. In electronics, better interconnects and thermal management components than copper with higher current- and heat-stabilities are required to enable device miniaturization with increased functionality. Our literature survey encouragingly indicates that Cu/CNT performances (electrical, thermal and mechanical) reported so far rival that of Cu, proving the material's viability as a Cu alternative. We identify two grand challenges to be solved for Cu/CNT to replace copper in real-life applications. The first grand challenge is to fabricate Cu/CNT with overall performances exceeding that of copper. To address this challenge, we propose research directions to fabricate Cu/CNT closer to ideal composites theoretically predicted to surpass Cu performances (i.e. those containing uniformly distributed Cu and individually aligned CNTs with beneficial CNT–Cu interactions ). The second grand challenge is to industrialize and transfer Cu/CNT from lab bench to real-life use. Toward this, we identify and propose strategies to address market-dependent issues for niche/mainstream applications. The current best Cu/CNT performances already qualify for application in niche electronic device markets as high-end interconnects. However, mainstream Cu/CNT application as copper replacements in conventional electronics and in electrical/data wires are long-term goals, needing inexpensive mass-production by methods aligned with existing industrial practices. Mainstream electronics require cheap CNT template-making and electrodeposition procedures, while data/electrical cables require manufacture protocols based on co-electrodeposition or melt-processing. We note (with examples) that initiatives devoted to Cu/CNT manufacturing for both types of mainstream applications are underway. With sustained research on Cu/CNT and accelerating its real-life application, we expect the successful evolution of highly functional, efficient, and sustainable next-generation electrical and electronics systems.
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Guerrero, José Carlos Reyes, Ismail Ben Mabrouk, Mu’ath Al-Hassan, and Mourad Nedil. "Experimental Validation of Receiver Sensitivity for 100-Mbps Data Rates in Seawater by Using 2.4 GHz-Low-Power Electronics." International Journal on Communications Antenna and Propagation (IRECAP) 9, no. 1 (February 28, 2019): 62. http://dx.doi.org/10.15866/irecap.v9i1.15660.
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Daves, Glenn G. "Trends in Automotive Packaging." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2014, DPC (January 1, 2014): 001818–50. http://dx.doi.org/10.4071/2014dpc-keynote_th1_daves.
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The long-term trend in automobiles has been increasing electronics content over time. This trend is expected to continue and drives diverse functional, form factor, and reliability requirements. These requirements, in turn, are leading to changes in the package types selected and the performance specifications of the packages used for automotive electronics. Several examples will be given. This abstract covers the development of a distributed high temperature electronics demonstrator for integration with sensor elements to provide digital outputs that can be used by the FADEC (Full Authority Digital Electronic Control) system or the EHMS (Engine Health Monitoring System) on an aircraft engine. This distributed electronics demonstrator eliminates the need for the FADEC or EHMS to process the sensor signal, which will assist in making the overall system more accurate and efficient in processing only digital signals. This will offer weight savings in cables, harnesses and connector pin reduction. The design concept was to take the output from several on-engine sensors, carry out the signal conditioning, multiplexing, analogue to digital conversion and data transmission through a serial data bus. The unit has to meet the environmental requirements of DO-160 with the need to operate at 200°C, with short term operation at temperatures up to 250°C. The work undertaken has been to design an ASIC based on 1.0 μm Silicon on Insulator (SOI) device technology incorporating sensor signal conditioning electronics for sensors including resistance temperature probes, strain gauges, thermocouples, torque and frequency inputs. The ASIC contains analogue multiplexers, temperature stable voltage band-gap reference and bias circuits, ADC, BIST, core logic, DIN inputs and two parallel ARINC 429 serial databuses. The ASIC was tested and showed to be functional up to a maximum temperature of 275°C. The ASIC has been integrated with other high temperature components including voltage regulators, a crystal oscillator, precision resistors, silicon capacitors within a hermetic hybrid package. The hybrid circuit has been assembled within a stainless steel enclosure with high temperature connectors. The high temperature electronics demonstrator has been demonstrated operating from −40°C to +250°C. This work has been carried out under the EU Clean Sky HIGHTECS project with the Project being led by Turbomeca (Fr) and carried out by GE Aviation Systems (UK), GE Research – Munich (D) and Oxford University (UK).
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König, A., and K. Thongpull. "Lab-on-Spoon – a 3-D integrated hand-held multi-sensor system for low-cost food quality, safety, and processing monitoring in assisted-living systems." Journal of Sensors and Sensor Systems 4, no. 1 (February 13, 2015): 63–75. http://dx.doi.org/10.5194/jsss-4-63-2015.
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Abstract. Distributed integrated sensory systems enjoy increasing impact leveraged by the surging advance of sensor, communication, and integration technology in, e.g., the Internet of Things, cyber-physical systems, Industry 4.0, and ambient intelligence/assisted-living applications. Smart kitchens and "white goods" in general have become an active field of R&D. The goal of our research is to provide assistance for unskilled or challenged consumers by efficient sensory feedback or context on ingredient quality and cooking step results, which explicitly includes decay and contamination detection. As one front end of such a culinary-assistance system, an integrated, multi-sensor, low-cost, autonomous, smart spoon device, denoted as Lab-on-Spoon (LoS), has been conceived. The first realized instance presented here features temperature, color, and impedance spectroscopy sensing in a 3-D-printed spoon package. Acquired LoS data are subject to sensor fusion and decision making on the host system. LoS was successfully applied to liquid ingredient recognition and quality assessment, including contamination detection, in several applications, e.g., for glycerol detection in wine. In future work, improvement to sensors, electronics, and algorithms will be pursued to achieve an even more robust, dependable and self-sufficient LoS system.
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Chen, Xiyuan, Loic Maxwell, Franklin Li, Amrita Kumar, Elliot Ransom, Tanay Topac, Sera Lee, Mohammad Faisal Haider, Sameh Dardona, and Fu-Kuo Chang. "Design and Integration of a Wireless Stretchable Multimodal Sensor Network in a Composite Wing." Sensors 20, no. 9 (April 29, 2020): 2528. http://dx.doi.org/10.3390/s20092528.
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This article presents the development of a stretchable sensor network with high signal-to-noise ratio and measurement accuracy for real-time distributed sensing and remote monitoring. The described sensor network was designed as an island-and-serpentine type network comprising a grid of sensor “islands” connected by interconnecting “serpentines.” A novel high-yield manufacturing process was developed to fabricate networks on recyclable 4-inch wafers at a low cost. The resulting stretched sensor network has 17 distributed and functionalized sensing nodes with low tolerance and high resolution. The sensor network includes Piezoelectric (PZT), Strain Gauge (SG), and Resistive Temperature Detector (RTD) sensors. The design and development of a flexible frame with signal conditioning, data acquisition, and wireless data transmission electronics for the stretchable sensor network are also presented. The primary purpose of the frame subsystem is to convert sensor signals into meaningful data, which are displayed in real-time for an end-user to view and analyze. The challenges and demonstrated successes in developing this new system are demonstrated, including (a) developing separate signal conditioning circuitry and components for all three sensor types (b) enabling simultaneous sampling for PZT sensors for impact detection and (c) configuration of firmware/software for correct system operation. The network was expanded with an in-house developed automated stretch machine to expand it to cover the desired area. The released and stretched network was laminated into an aerospace composite wing with edge-mount electronics for signal conditioning, processing, power, and wireless communication.
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Riches, S. T., C. Warn, K. Cannon, G. Rickard, L. Stoica, and C. Johnston. "Design and Assembly of High Temperature Distributed Aero-engine Control System Demonstrator." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2014, HITEC (January 1, 2014): 000285–90. http://dx.doi.org/10.4071/hitec-tha12.
Full textAbstract:
This paper covers the development of a distributed high temperature electronics demonstrator for integration with sensor elements to provide digital outputs that can be used by the FADEC (Full Authority Digital Electronic Control) system or the EHMS (Engine Health Monitoring System) on an aircraft engine. This distributed electronics demonstrator eliminates the need for the FADEC or EHMS to process the sensor signal, which will assist in making the overall system more accurate and efficient in processing only digital signals. This will offer weight savings in cables, harnesses and connector pin reduction. The design concept was to take the output from several on-engine sensors, carry out the signal conditioning, multiplexing, analogue to digital conversion and data transmission through a serial data bus. The unit has to meet the environmental requirements of DO-160 with the need to operate at 200°C, with short term operation at temperatures up to 250°C. The work undertaken has been to design an ASIC based on 1.0μm Silicon on Insulator (SOI) device technology incorporating sensor signal conditioning electronics for sensors including resistance temperature probes, strain gauges, thermocouples, torque and frequency inputs. The ASIC contains analogue multiplexers, temperature stable voltage band-gap reference and bias circuits, ADC, BIST, core logic, DIN inputs and two parallel ARINC 429 serial databuses. The ASIC was tested and showed to be functional up to a maximum temperature of 275°C. The ASIC has been integrated with other high temperature components including voltage regulators, a crystal oscillator, precision resistors, silicon capacitors within a hermetic hybrid package. The hybrid circuit has been assembled within a stainless steel enclosure with high temperature connectors. The high temperature electronics demonstrator has been shown to operate from −40°C to +250°C. This work has been carried out under the EU Clean Sky HIGHTECS project with the Project being led by Turbomeca (Fr) and carried out by GE Aviation Systems (UK), GE Research – Munich (D) and Oxford University (UK).
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Kogdenko, V. G. "Accounting and Analytical Support of Public Procurement in the Electronics Industry in the Digitalization." Accounting. Analysis. Auditing 8, no. 2 (April 4, 2021): 48–61. http://dx.doi.org/10.26794/2408-9303-2021-8-2-48-61.
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The article deals with the problems of accounting and analytical support of public procurement in the electronics industry; one of the objectives of the study is to substantiate the criteria for assessing suppliers' reputation; evaluations of persons filing procurement complaints; procurement monitoring indicators. In the process of research, the author used such general scientific principles and methods as abstraction, generalization, as well as statistical methods of data processing. As a result, there has been developed a methodology for assessing the suppliers' reputation including three stages. At the first one — participating companies are assessed according to the criteria of size, industry, ownership, organizational and legal form, data transparency for subsequent calculations. At the second stage — the economic viability of the subjects is assessed in terms of the availability of financial, material and human resources, as well as the effectiveness of companies and the dynamics of their growth. At the third stage — the conscientiousness of the participants is assessed according to the criteria of the authorized capital, credit limit, tax burden, the Spark-Risk lists inclusion. The technique has been tested on data from the register of unscrupulous suppliers supplying products for the electronics industry; the data for analysis has been generated on the basis of 1360 companies. Calculations have shown that the overwhelming majority of unscrupulous suppliers are micro-enterprises that do not belong to the production related industries, repair, and in electronics trade; the significant part of them are registered in Moscow and its region. There is found out some companies which are unscrupulous suppliers of electronic products. They do not have sufficient financial, material and human resources and are characterized by low reputation characteristics. The proposed changes in the legislation in the introduction of prequalification terms require an adequate accounting and analytical support that would help to control the admittance of only participants with high reputational characteristics that can and should be allowed in the public procurement system.
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Mehdi, Mubarak, Muhammad Taha Ajani, Hasan Tahir, Shahzaib Tahir, Zahoor Alizai, Fawad Khan, Qaiser Riaz, and Mehdi Hussain. "PUF-Based Key Generation Scheme for Secure Group Communication Using MEMS." Electronics 10, no. 14 (July 15, 2021): 1691. http://dx.doi.org/10.3390/electronics10141691.
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Consumer electronics manufacturers have been incorporating support for 4G/5G communication technologies into many electronic devices. Thus, highly capable Internet of Things (IoT)-ready versions of electronic devices are being purchased which will eventually replace traditional consumer electronics. With the goal of creating a smart environment, the IoT devices enable data sharing, sensing, awareness, increased control. Enabled by high-speed networks, the IoT devices function in a group setting thus compounding the attack surface leading to security and privacy concerns. This research is a study on the possibility of incorporating PUF as a basis for group key generation. The challenge here lies in identifying device features that are unique, stable, reproducible and unpredictable by an adversary. Each device generates its own identity leading to collaborative cryptographic key generation in a group setting. The research uses a comprehensive hardware testbed to demonstrate the viability of PUFs for the generation of a symmetric key through collaboration. Detailed analysis of the proposed setup and the symmetric key generation scheme has shown that the system is scalable and offers unrivalled advantages compared to conventional cryptographic implementations.
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Capineri, Lorenzo, and Andrea Bulletti. "Ultrasonic Guided-Waves Sensors and Integrated Structural Health Monitoring Systems for Impact Detection and Localization: A Review." Sensors 21, no. 9 (April 22, 2021): 2929. http://dx.doi.org/10.3390/s21092929.
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This review article is focused on the analysis of the state of the art of sensors for guided ultrasonic waves for the detection and localization of impacts for structural health monitoring (SHM). The recent developments in sensor technologies are then reported and discussed through the many references in recent scientific literature. The physical phenomena that are related to impact event and the related main physical quantities are then introduced to discuss their importance in the development of the hardware and software components for SHM systems. An important aspect of the article is the description of the different ultrasonic sensor technologies that are currently present in the literature and what advantages and disadvantages they could bring in relation to the various phenomena investigated. In this context, the analysis of the front-end electronics is deepened, the type of data transmission both in terms of wired and wireless technology and of online and offline signal processing. The integration aspects of sensors for the creation of networks with autonomous nodes with the possibility of powering through energy harvesting devices and the embedded processing capacity is also studied. Finally, the emerging sector of processing techniques using deep learning and artificial intelligence concludes the review by indicating the potential for the detection and autonomous characterization of the impacts.
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Mantler, Michael. "The electronic age: energy-dispersive X-ray analysis and other modern techniques to the present and beyond." Powder Diffraction 29, no. 2 (May 15, 2014): 127–32. http://dx.doi.org/10.1017/s0885715614000219.
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This paper summarizes an oral presentation of the same title presented at the occasion of recognizing the “The 100th Anniversary of X-ray Spectroscopy” at DXC 2013. It gives an overview of the development in electronics with focus on (mainly) energy-dispersive X-ray detectors and related data processing. Naturally this has its origin in the early transistors and the first semiconductor junction detectors of the late 1940s. It was followed by refinement of semiconductor detector technology in general and particularly by the invention of Li-drifting and employment of low-noise field effect transistors until such devices matured sufficiently to be marketed by the late 1960s. Further improvement followed in resolution, speed, operability at room temperature, and development of junction arrays with imaging capabilities. An important aspect is the development of related software requiring affordable laboratory computers, programming languages, and databases of fundamental parameters. Today x-ray fluorescence analysis (and not only the energy-dispersive variant) is widely employed as an analytical tool for the traditional technical and industrial applications but notably also, at an expanding rate as well as variety, in other fields including environmental, medical, archaeological, space, arts, and many more.
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Purwanggono, Bambang, and Yohana Aeria Damyana. "Effect of internal R&D activities to the accumulation of organizational technical knowledge with the mediation role of absorptive capacity to establish the innovation capability of electronic industries." MATEC Web of Conferences 154 (2018): 01059. http://dx.doi.org/10.1051/matecconf/201815401059.
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Innovation is a strategy for the electronics industry to create a sustainable competitive advantage, in the midst of a rapidly changing environment with all its complexity. Seven AT program as an effort for PT. Hartono Istana Teknologi (Polytron) into enterprise knowledge, will accelerate the innovation process, combined with good organizational technical knowledge management. Organizational technical knowledge will be instrumental in innovation capabilities properly if there is an internal R & D activities that support and absorptive capacity as a mediator. This study reviewed the organizational technical knowledge influence to innovation capability, the influence of R & D activities to organizational technical knowledge, as well as the role of absorptive capacity as a mediator. The study was conducted by distributing questionnaires to 130 employees of PT. Hartono Istana Teknologi. Data processing was conducted using SEM. The results showed that the absorptive capacity mediate the relationship between R & D activities and organizational technical knowledge by 51%, and organizational technical knowledge affect innovation capabilities by 64%.
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Rafique, Amjid, Usman Zubair, Mara Serrapede, Marco Fontana, Stefano Bianco, Paola Rivolo, Candido F. Pirri, and Andrea Lamberti. "Binder Free and Flexible Asymmetric Supercapacitor Exploiting Mn3O4 and MoS2 Nanoflakes on Carbon Fibers." Nanomaterials 10, no. 6 (May 31, 2020): 1084. http://dx.doi.org/10.3390/nano10061084.
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Emerging technologies, such as portable electronics, have had a huge impact on societal norms, such as access to real time information. To perform these tasks, portable electronic devices need more and more accessories for the processing and dispensation of the data, resulting in higher demand for energy and power. To overcome this problem, a low cost high-performing flexible fiber shaped asymmetric supercapacitor was fabricated, exploiting 3D-spinel manganese oxide Mn3O4 as cathode and 2D molybdenum disulfide MoS2 as anode. These asymmetric supercapacitors with stretched operating voltage window of 1.8 V exhibit high specific capacitance and energy density, good rate capability and cyclic stability after 3000 cycles, with a capacitance retention of more than 80%. This device has also shown an excellent bending stability at different bending conditions.
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Laparra, Egoitz, Aurelie Mascio, Sumithra Velupillai, and Timothy Miller. "A Review of Recent Work in Transfer Learning and Domain Adaptation for Natural Language Processing of Electronic Health Records." Yearbook of Medical Informatics 30, no. 01 (August 2021): 239–44. http://dx.doi.org/10.1055/s-0041-1726522.
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Summary Objectives: We survey recent work in biomedical NLP on building more adaptable or generalizable models, with a focus on work dealing with electronic health record (EHR) texts, to better understand recent trends in this area and identify opportunities for future research. Methods: We searched PubMed, the Institute of Electrical and Electronics Engineers (IEEE), the Association for Computational Linguistics (ACL) anthology, the Association for the Advancement of Artificial Intelligence (AAAI) proceedings, and Google Scholar for the years 2018-2020. We reviewed abstracts to identify the most relevant and impactful work, and manually extracted data points from each of these papers to characterize the types of methods and tasks that were studied, in which clinical domains, and current state-of-the-art results. Results: The ubiquity of pre-trained transformers in clinical NLP research has contributed to an increase in domain adaptation and generalization-focused work that uses these models as the key component. Most recently, work has started to train biomedical transformers and to extend the fine-tuning process with additional domain adaptation techniques. We also highlight recent research in cross-lingual adaptation, as a special case of adaptation. Conclusions: While pre-trained transformer models have led to some large performance improvements, general domain pre-training does not always transfer adequately to the clinical domain due to its highly specialized language. There is also much work to be done in showing that the gains obtained by pre-trained transformers are beneficial in real world use cases. The amount of work in domain adaptation and transfer learning is limited by dataset availability and creating datasets for new domains is challenging. The growing body of research in languages other than English is encouraging, and more collaboration between researchers across the language divide would likely accelerate progress in non-English clinical NLP.
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Weidenmüller, Jens, Oezgue Dogan, Alexander Stanitzki, Mario Baum, Tim Schröder, Dirk Wünsch, Michael Görtz, and Anton Grabmaier. "Implantable multi-sensor system for hemodynamic controlling." tm - Technisches Messen 85, no. 5 (May 25, 2018): 359–65. http://dx.doi.org/10.1515/teme-2017-0116.
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Abstract A miniaturized implantable multi-sensor system for cardiovascular monitoring of physiological parameters is presented. High accuracy pressure measurements within the vessel can be performed by a capacitive pressure sensor. Additional information about the patient, e. g., sudden movement, inclination or increased temperature can be obtained by additional sensor components such as an acceleration sensor and a temperature sensor unit. This information facilitates compensation of interferences for more accurate pressure measurements. A multi-functional ASIC enables, amongst others, sensor signal processing, power management and telemetric communication with extracorporeal electronics. Sensor chips, the multi-functional ASIC and passive components are assembled on a LTCC circuit board in which an antenna coil is integrated for telemetric energy and data transmission at a frequency of 13.56 MHz. In order to support further miniaturization, the implant shall be encapsulated with a stack of very thin and hermetic ceramics applied by ALD instead of using bulky metal housings. Further encapsulation with polymers, which can be functionalised with appropriate biomolecules, is necessary for a proper shape, a biocompatible interface to the surrounding tissue and, thereby, reduction of thrombogenicity.