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Relevant bibliographies by topics / Electronic temperature

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Academic literature on the topic 'Electronic temperature'

Author: Grafiati

Published: 4 June 2021

Last updated: 11 February 2022

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Journal articles on the topic "Electronic temperature"

1

Gumyusenge, Aristide, and Jianguo Mei. "High Temperature Organic Electronics." MRS Advances 5, no. 10 (2020): 505–13. http://dx.doi.org/10.1557/adv.2020.31.

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ABSTRACTThe emerging breakthroughs in space exploration, smart textiles, and novel automobile designs have increased technological demand for high temperature electronics. In this snapshot review we first discuss the fundamental challenges in achieving electronic operation at elevated temperatures, briefly review current efforts in finding materials that can sustain extreme heat, and then highlight the emergence of organic semiconductors as a new class of materials with potential for high temperature electronics applications. Through an overview of the state-of-the art materials designs and pr

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Harris, Stuart A., and John H. Pedersen. "Comparison of three methods of calculating air temperature from electronic measurements." Zeitschrift für Geomorphologie 39, no. 2 (1995): 203–10. http://dx.doi.org/10.1127/zfg/39/1995/203.

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S., Madhavan Nampoothiri, Sabu Sebastian M., and Sajith Kumar P.C. "Implementation of Peltier Cooling in Hermetically Sealed Electronic Packaging Unit for Sub-sea Vessel." Defence Science Journal 68, no. 3 (2018): 326. http://dx.doi.org/10.14429/dsj.68.12149.

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This paper presents the methodology adopted for implementation of Peltier cooling in hermetically sealed electronic packaging units used in sub-sea vessels. In sub-sea vessels, sonar front-end electronics is packaged in hermetically sealed electronic packaging units. The thermal design of the unit is a highly challenging task considering the heat dissipation of 300W from the electronics, non-availability of chilled air for cooling and IP68 sealing requirements. Cooling fans cannot be integrated, since these units are to be placed in acoustically sensitive pressure capsule area of the subsea ve

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Son, In-Suh, and Dong-Kil Shin. "OS14-3 Adhesion of Thin Film for Electronic Package at Elevated Temperature(Semiconductor Devices and Electronic Packaging 1,OS14 Electronic and photonic packages,APPLICATIONS)." Abstracts of ATEM : International Conference on Advanced Technology in Experimental Mechanics : Asian Conference on Experimental Mechanics 2015.14 (2015): 209. http://dx.doi.org/10.1299/jsmeatem.2015.14.209.

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Riches, S. T., K. Cannon, C. Johnston, et al. "Application of High Temperature Electronics Packaging Technology to Signal Conditioning and Processing Circuits." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2010, HITEC (2010): 000089–96. http://dx.doi.org/10.4071/hitec-sriches-tp11.

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The requirement to install electronic power and control systems in high temperature environments has posed a challenge to the traditional limit of 125°C for high temperature exposure of electronics systems. The leap in operating temperature to above 200°C in combination with high pressures, vibrations and potentially corrosive environments means that different semiconductors, passives, circuit boards and assembly processes will be needed to fulfil the target performance specifications. Bare die mounted onto ceramic and insulated metal substrates can withstand higher temperatures than soldered

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Mirgkizoudi, M., C. Liu, P. Conway, and S. Riches. "Reliability of wire-bonded electronic devices in combined high temperature and vibrational environments." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2013, HITEN (2013): 000220–28. http://dx.doi.org/10.4071/hiten-wa13.

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High temperature electronic systems need to operate in extreme conditions that exceed the current levels specified by the military and aerospace standards. In high temperature and wide operating temperature applications, electronics can suffer from failure modes caused by a combination of environmental and operational loadings such as temperature, vibration, humidity, pressure, external stresses, etc. This work reports the findings and observations of the investigation of the combined effects of thermal and vibrational environments on wire-bonded interconnections used in high temperature elect

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Rüscher, Claus H. "Temperature-dependent absorption of biotite: small-polaron hopping and other fundamental electronic excitations." European Journal of Mineralogy 24, no. 5 (2012): 815–20. http://dx.doi.org/10.1127/0935-1221/2012/0024-2200.

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Larshina, Evelina, Roman Bashoyan, Yulia Zhuravleva, et al. "Indoor temperature monitoring electronic device." Energy Safety and Energy Economy 2 (April 2021): 32–35. http://dx.doi.org/10.18635/2071-2219-2021-2-32-35.

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We have created an energy saving Arduino-based indoor temperature monitoring device and its light monitoring modification. The Arduino has large versatility as well as a variety of hardware and software tools and side modules to implement this kind of projects. For the purpose of this research, the Arduino is interfaced with the DS18B20 temperature sensor to measure the surrounding temperature and the LM393 light sensor module to get the device modified to add the light monitoring option. Arduino IDE is used to program Arduino Nano V3.0.

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Kumar, Rakesh. "A high temperature nano/micro vapor phase conformal coating for electronics applications." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2015, HiTEN (2015): 000083–90. http://dx.doi.org/10.4071/hiten-session3a-paper3a_1.

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Through characterization of dielectric and other properties at high temperatures, this work describes the development of a high temperature and UV stable nano/micro vapor phase deposited polymer coating for providing electrical insulation and protection of various electronics from chemical corrosion and other harsh environmental effects. Packaging, protection and reliability of various electronic devices and components, including PCBs, MEMS, optoelectronic devices, fuel cell components and nanoelectronic parts, are becoming more challenging due to the long-term performance requirements on devi

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Park, Won Ho, Tamer Ali, and C. K. Ken Yang. "Analysis of Refrigeration Requirements of Digital Processors in Subambient Temperatures." Journal of Microelectronics and Electronic Packaging 7, no. 4 (2010): 197–204. http://dx.doi.org/10.4071/imaps.257.

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The total power consumption for high-performance computing systems is a serious concern for designers of integrated circuits and systems. It is well known that cooling the operating temperature results in reduced electronic power and/or speed gains. However, total power dissipation includes both electronic power and the refrigeration power. This study explores the optimal operating temperatures and the amount of total power reduction at subambient temperatures. This paper presents a realistic system-level model that includes both the electronic and the refrigeration systems. Analysis using the

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Dissertations / Theses on the topic "Electronic temperature"

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Smarra, Devin A. "Low Temperature Co-Fired Ceramic (LTCC) Substrate for High Temperature Microelectronics." University of Dayton / OhioLINK, 2017. http://rave.ohiolink.edu/etdc/view?acc_num=dayton1493386231571894.

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Wagner, Thomas. "Low temperature silicon epitaxy defects and electronic properties /." [S.l. : s.n.], 2003. http://www.bsz-bw.de/cgi-bin/xvms.cgi?SWB10678419.

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Lebel, Larry. "Electronic temperature sensor arrays for gas turbine components." Mémoire, Université de Sherbrooke, 2004. http://savoirs.usherbrooke.ca/handle/11143/1255.

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The current master's thesis presents the development of a new temperature sensing technology for gas turbine components.The proposed sensor array allows real time simultaneous measurements of temperature at multiple locations, using only two communication leads. Frequency modulation is used to multiplex the signals of more than ten temperature sensors through common wires. At every point of reading, silicon carbide (SiC) microelectronic oscillators generate the required waveforms, at frequencies that are temperature dependent. Those oscillators are fed with a common DC power source, and add th

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Fallas, Chinchilla Juan Carlos. "Pressure-temperature phase diagram of LiA1H₄." abstract and full text PDF (UNR users only), 2009. http://0-gateway.proquest.com.innopac.library.unr.edu/openurl?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:dissertation&res_dat=xri:pqdiss&rft_dat=xri:pqdiss:1464434.

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Sapsai, Andrei. "Temperature distribution and thermally induced stresses in electronic packages." Thesis, Monterey, California. Naval Postgraduate School, 1992. http://hdl.handle.net/10945/24065.

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Hou, Michelle M. (Michelle Ming-Jan). "Low temperature transient liquid phase bonding for electronic packaging." Thesis, Massachusetts Institute of Technology, 1992. http://hdl.handle.net/1721.1/60735.

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Badenhorst, Le Roux. "Cryogenic amplifiers for interfacing superconductive systems to room temperature electronics." Thesis, Stellenbosch : Stellenbosch University, 2008. http://hdl.handle.net/10019.1/1586.

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Thesis (MScEng (Electrical and Electronic Engineering))--Stellenbosch University, 2008.<br>This thesis is aimed at testing commercially available CMOS amplifier ICs at 4 K. Super Conducting Electronics (SCE) will also be used to amplify RSFQ signals for easier detection by CMOS technology and better signal-to-noise ratios. The SCE comprises of a Suzuki stack amplifier, a 250 μA JTL and a DC-to-SFQ converter. The Suzuki stack amplifier is simulated in WRSPICE. It is able to amplify an SFQ signal synchronised with an external clock signal. The amplified signal can then be detected by a no

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Chen, Minghan. "Optical studies of high temperature superconductors and electronic dielectric materials." [Gainesville, Fla.] : University of Florida, 2005. http://purl.fcla.edu/fcla/etd/UFE0012986.

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Wagner, Thomas [Verfasser]. "Low temperature silicon epitaxy : Defects and electronic properties / Thomas Wagner." Aachen : Shaker, 2003. http://d-nb.info/1179037057/34.

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Musallam, Mahera. "Real-time power electronic device junction temperature estimation and control." Thesis, University of Newcastle Upon Tyne, 2005. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.420031.

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Books on the topic "Electronic temperature"

1

Imanaka, Yoshihiko. Multilayered low temperature cofired ceramics (LTCC) technology. Springer, 2005.

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Multilayered low temperature cofired ceramics (LTCC) technology. Springer, 2004.

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service), SpringerLink (Online, ed. High-Temperature Superconductors. 2nd ed. Springer Berlin Heidelberg, 2012.

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Sapsai, Andrei. Temperature distribution and thermally induced stresses in electronic packages. Naval Postgraduate School, 1992.

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Hara, Ko. High temperature superconducting electronics: Basis for materials and device structures. Ohmsha, 1993.

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Lall, Pradeep. Influence of temperature on microelectronics and system reliability. CRC Press, 1997.

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Symposium on Low Temperature Electronic Device Operation (1991 Washington, D.C.). Proceedings of the Symposium on Low Temperature Electronic Device Operation. Electrochemical Society, 1991.

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Nakhimovsky, L. A. Handbook of low temperature electronic spectra of polycyclic aromatic hydrocarbons. Elsevier, 1989.

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Design and packaging of electronic equipment. Van Nostrand Reinhold Co., 1985.

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Randa, J. Noise temperature measurements on wafer. U.S. Dept. of Commerce, Technology Administration, National Institute of Standards and Technology, 1997.

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Book chapters on the topic "Electronic temperature"

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Cardwell, D. A. "High-Temperature Superconducting Materials." In Electronic Materials. Springer US, 1991. http://dx.doi.org/10.1007/978-1-4615-3818-9_28.

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Goldman, Allen M. "High-Temperature Superconductivity: The Experimental Situation." In Electronic Materials. Springer Berlin Heidelberg, 1991. http://dx.doi.org/10.1007/978-3-642-84359-4_6.

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Plakida, Nikolai M. "Electronic Properties of High-Tc Superconductors." In High-Temperature Superconductivity. Springer Berlin Heidelberg, 1995. http://dx.doi.org/10.1007/978-3-642-78406-4_5.

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Cohen, R. E., H. Krakauer, and W. E. Pickett. "Electronic Structure, Lattice Dynamics, and Electron-Phonon Interaction in High Tc Superconductors." In High-Temperature Superconductivity. Springer US, 1991. http://dx.doi.org/10.1007/978-1-4615-3338-2_2.

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Wang, Ching-ping S. "Electronic Structure, Lattice Dynamics, and Magnetic Interactions." In High Temperature Superconductivity. Springer New York, 1990. http://dx.doi.org/10.1007/978-1-4612-3222-3_5.

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Wördenweber, Roger. "Vortex matter and superconducting electronic devices." In High Temperature Superconductivity 2. Springer Berlin Heidelberg, 2004. http://dx.doi.org/10.1007/978-3-662-07764-1_13.

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Yu, Jaejun, and A. J. Freeman. "Electronic Structure Fermi Liquid Theory of High TcSuperconductors." In High-Temperature Superconductivity. Springer US, 1991. http://dx.doi.org/10.1007/978-1-4615-3338-2_56.

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Avlyanov, J. K., and A. Mavlyanov. "Low Temperature Transitions in Polyanilines." In Electronic Properties of Polymers. Springer Berlin Heidelberg, 1992. http://dx.doi.org/10.1007/978-3-642-84705-9_49.

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Yates, John T. "Electronic Temperature Programmer—Metal Crystals." In Experimental Innovations in Surface Science. Springer New York, 1998. http://dx.doi.org/10.1007/978-1-4612-2304-7_142.

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Shen, Z. X., D. S. Dessau, and B. O. Wells. "Electronic Structure and the Superconducting Gap of Bi2Sr2CaCu2O8+δ." In High-Temperature Superconductivity. Springer US, 1991. http://dx.doi.org/10.1007/978-1-4615-3338-2_14.

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Conference papers on the topic "Electronic temperature"

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Emery, V. J., and S. A. Kivelson. "Local electronic structure and high temperature superconductivity." In High temperature superconductivity. AIP, 1999. http://dx.doi.org/10.1063/1.59581.

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Liu, H. L., S. Yoon, S. L. Cooper, S.-W. Cheong, and P. D. Han. "Electronic Raman scattering in the perovskite manganese oxides." In High temperature superconductivity. AIP, 1999. http://dx.doi.org/10.1063/1.59603.

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Rees, D. G., P. Glasson, V. Antonov, et al. "An Electronic Array On Liquid Helium." In LOW TEMPERATURE PHYSICS: 24th International Conference on Low Temperature Physics - LT24. AIP, 2006. http://dx.doi.org/10.1063/1.2355255.

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Booth, N. E., L. Parlato, G. P. Pepe, et al. "Superconducting electronic device with transistor-like properties." In LOW TEMPERATURE DETECTORS: Ninth International Workshop on Low Temperature Detectors. American Institute of Physics, 2002. http://dx.doi.org/10.1063/1.1457646.

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Strohm, T., M. Cardona, and A. A. Martin. "Electronic Raman scattering in high-T[sub c] superconductors." In High temperature superconductivity. AIP, 1999. http://dx.doi.org/10.1063/1.59635.

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Konoike, T., S. Uji, T. Terashima та ін. "Fermi Surface and Electronic Properties of κ-(BETS)2FeCl4". У LOW TEMPERATURE PHYSICS: 24th International Conference on Low Temperature Physics - LT24. AIP, 2006. http://dx.doi.org/10.1063/1.2354863.

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Ichioka, Masanori, Hiroto Adachi, Takeshi Mizushima, and Kazushige Machida. "Electronic Structure of Vortex in the FFLO Superconducting State." In LOW TEMPERATURE PHYSICS: 24th International Conference on Low Temperature Physics - LT24. AIP, 2006. http://dx.doi.org/10.1063/1.2354912.

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Moeckel, N., M. Galeazzi, M. Lindeman, and C. K. Stahle. "A constant temperature TES microcalorimeter with an external electronic feedback system." In LOW TEMPERATURE DETECTORS: Ninth International Workshop on Low Temperature Detectors. American Institute of Physics, 2002. http://dx.doi.org/10.1063/1.1457608.

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Momono, N., T. Goto, A. Hashimoto, et al. "STM/STS Study on Local Electronic States of La2−xSrxCuO4." In LOW TEMPERATURE PHYSICS: 24th International Conference on Low Temperature Physics - LT24. AIP, 2006. http://dx.doi.org/10.1063/1.2354760.

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Watanabe, Chiduru, Shutaro Chiba, and Yoshiyuki Ono. "Phonon Softening and Multimode Peierls Transition in a 2D Anisotropic Square-Lattice Electron-Lattice System with a Half-Filled Electronic Band." In LOW TEMPERATURE PHYSICS: 24th International Conference on Low Temperature Physics - LT24. AIP, 2006. http://dx.doi.org/10.1063/1.2355194.

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Reports on the topic "Electronic temperature"

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Wu, X. D., A. Finokoglu, M. Hawley, et al. High-temperature superconducting thin-film-based electronic devices. Office of Scientific and Technical Information (OSTI), 1996. http://dx.doi.org/10.2172/378956.

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Shelton, Jr., W. (Theoretical studies on the electronic structure of high-temperature superconductors). Office of Scientific and Technical Information (OSTI), 1988. http://dx.doi.org/10.2172/5504566.

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Dunn, Lisa. Electronic Structure of the Bismuth Family of High Temperature Superconductors. Office of Scientific and Technical Information (OSTI), 2002. http://dx.doi.org/10.2172/799025.

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Maxey, L. C., and T. V. Blalock. Optimizing the temperature compensation of an electronic pressure measurement system. Office of Scientific and Technical Information (OSTI), 1990. http://dx.doi.org/10.2172/6488289.

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Leonard, Francois Leonard. Temperature dependence of the electronic and optoelectronic properties of carbon nanotube devices. Office of Scientific and Technical Information (OSTI), 2013. http://dx.doi.org/10.2172/1113878.

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Spittle, Eric K., Roy R. Rasmussen, and Ints Kaleps. The Electronic Evaluation of the Advanced Dynamic Anthropomorphic Manikin (ADAM) in High Temperature Environments. Defense Technical Information Center, 1991. http://dx.doi.org/10.21236/ada245459.

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Liu, Chang. Electronic structure of ion arsenic high temperature superconductors studied by angle resolved photoemission spectroscopy. Office of Scientific and Technical Information (OSTI), 2011. http://dx.doi.org/10.2172/1029553.

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Williams, Clayton, and Christoph Boehme. Room Temperature Single-Spin Tunneling Force Microscopy for Characterization of Paramagnetic Defects in Electronic Materials. Defense Technical Information Center, 2014. http://dx.doi.org/10.21236/ada604959.

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Dr. Steve Semancik. Correlation of Chemisorption and Electronic Effects for Metal Oxide Interfaces: Transducing Principles for Temperature Programmed Gas Microsensors. Office of Scientific and Technical Information (OSTI), 2002. http://dx.doi.org/10.2172/791537.

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Semancik, Steve, Michael Tarlov, Richard Cavicchi, John S. Suehle, and Thomas J. McAvoy. Correlation of Chemisorption and Electronic Effects for Metal/Oxide Interfaces: Transducing Principles for Temperature-Programmed Gas Microsensors. Office of Scientific and Technical Information (OSTI), 1999. http://dx.doi.org/10.2172/833292.

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