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Dissertations / Theses on the topic 'Electronical temperature'

Author: Grafiati

Published: 4 June 2021

Last updated: 11 February 2022

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1

Smarra, Devin A. "Low Temperature Co-Fired Ceramic (LTCC) Substrate for High Temperature Microelectronics." University of Dayton / OhioLINK, 2017. http://rave.ohiolink.edu/etdc/view?acc_num=dayton1493386231571894.

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2

Williams, Michael Eric. "Ab-initio elastic and thermodynamic properties of high-temperature cubic intermetallics at finite temperatures." [College Station, Tex. : Texas A&M University, 2008. http://hdl.handle.net/1969.1/ETD-TAMU-2779.

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3

Yuan, Mengyang. "GaN electronics for high-temperature applications." Thesis, Massachusetts Institute of Technology, 2020. https://hdl.handle.net/1721.1/128350.

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Thesis: S.M., Massachusetts Institute of Technology, Department of Electrical Engineering and Computer Science, February, 2020<br>Cataloged from PDF version of thesis.<br>Includes bibliographical references (pages 95-100).<br>Gallium nitride is a promising candidate for high-temperature applications. However, despite the excellent performance shown by early high-temperature prototypes, several issues in traditional lateral AlGaN/GaN HEMTs could cause early degradation and failure under high-temperature operation (over 300°C). These include ohmic degradation, gate leakage, buffer leakage, and p

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4

Wagner, Thomas. "Low temperature silicon epitaxy defects and electronic properties /." [S.l. : s.n.], 2003. http://www.bsz-bw.de/cgi-bin/xvms.cgi?SWB10678419.

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5

Lebel, Larry. "Electronic temperature sensor arrays for gas turbine components." Mémoire, Université de Sherbrooke, 2004. http://savoirs.usherbrooke.ca/handle/11143/1255.

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The current master's thesis presents the development of a new temperature sensing technology for gas turbine components.The proposed sensor array allows real time simultaneous measurements of temperature at multiple locations, using only two communication leads. Frequency modulation is used to multiplex the signals of more than ten temperature sensors through common wires. At every point of reading, silicon carbide (SiC) microelectronic oscillators generate the required waveforms, at frequencies that are temperature dependent. Those oscillators are fed with a common DC power source, and add th

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6

Fallas, Chinchilla Juan Carlos. "Pressure-temperature phase diagram of LiA1H₄." abstract and full text PDF (UNR users only), 2009. http://0-gateway.proquest.com.innopac.library.unr.edu/openurl?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:dissertation&res_dat=xri:pqdiss&rft_dat=xri:pqdiss:1464434.

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7

Sapsai, Andrei. "Temperature distribution and thermally induced stresses in electronic packages." Thesis, Monterey, California. Naval Postgraduate School, 1992. http://hdl.handle.net/10945/24065.

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8

Hou, Michelle M. (Michelle Ming-Jan). "Low temperature transient liquid phase bonding for electronic packaging." Thesis, Massachusetts Institute of Technology, 1992. http://hdl.handle.net/1721.1/60735.

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9

Matthews, Jason E. "Thermoelectric and Heat Flow Phenomena in Mesoscopic Systems." Thesis, University of Oregon, 2011. http://hdl.handle.net/1794/12108.

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xvii, 189 p. ： ill. (some col.)<br>Low-dimensional electronic systems, systems that are restricted to single energy levels in at least one of the three spatial dimensions, have attracted considerable interest in the field of thermoelectric materials. At these scales, the ability to manipulate electronic energy levels offers a great deal of control over a device's thermopower, that is, its ability to generate a voltage due to a thermal gradient. In addition, low-dimensional devices offer increased control over phononic heat flow. Mesoscale geometry can also have a large impact on both electron

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10

Schalk, Martin. "Ultra-fast electronic pulse control at cryogenic temperatures." Thesis, Université Grenoble Alpes (ComUE), 2019. http://www.theses.fr/2019GREAY061.

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Synchronisation ultra-rapide, mise en forme d’impulsions et commutation efficace sont au cœur des mesures précises. L’objectif de ce projet de thèse est d’apporter le contrôle électronique ultra-rapide aux circuits nanométriques refroidis à des températures de l’ordre du mK. L’opération quantique rapide rapprochera le domaine de l’optique électronique quantique de son homologue photonique avec des applications pour un contrôle électronique rapide et efficace des dispositifs quantiques. Les dispositifs expérimentaux développés au cours de ce projet de thèse sont décrits et testés de manière à e

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11

Badenhorst, Le Roux. "Cryogenic amplifiers for interfacing superconductive systems to room temperature electronics." Thesis, Stellenbosch : Stellenbosch University, 2008. http://hdl.handle.net/10019.1/1586.

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Thesis (MScEng (Electrical and Electronic Engineering))--Stellenbosch University, 2008.<br>This thesis is aimed at testing commercially available CMOS amplifier ICs at 4 K. Super Conducting Electronics (SCE) will also be used to amplify RSFQ signals for easier detection by CMOS technology and better signal-to-noise ratios. The SCE comprises of a Suzuki stack amplifier, a 250 μA JTL and a DC-to-SFQ converter. The Suzuki stack amplifier is simulated in WRSPICE. It is able to amplify an SFQ signal synchronised with an external clock signal. The amplified signal can then be detected by a no

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12

Chen, Minghan. "Optical studies of high temperature superconductors and electronic dielectric materials." [Gainesville, Fla.] : University of Florida, 2005. http://purl.fcla.edu/fcla/etd/UFE0012986.

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13

Wagner, Thomas [Verfasser]. "Low temperature silicon epitaxy : Defects and electronic properties / Thomas Wagner." Aachen : Shaker, 2003. http://d-nb.info/1179037057/34.

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14

Musallam, Mahera. "Real-time power electronic device junction temperature estimation and control." Thesis, University of Newcastle Upon Tyne, 2005. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.420031.

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15

Chan, Ka Keung. "Electronic properties of room temperature deposited thin-film carbon/diamond." Thesis, University of Cambridge, 1992. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.260488.

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16

Mackay, Kenneth Donald. "The low temperature electronic transport properties of amorphous metallic alloys." Thesis, University of Cambridge, 1991. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.386132.

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17

Ribeiro, Tiago Castro. "Electronic properties of doped Mott insulators and high temperature superconductors." Thesis, Massachusetts Institute of Technology, 2005. http://hdl.handle.net/1721.1/34383.

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Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Physics, 2005.<br>Includes bibliographical references (p. 129-140).<br>High-temperature superconducting cuprates, which are the quintessential example of a strongly correlated system and the most extensively studied materials after semiconductors, spurred the development in the fields of material science and experimental and theoretical physics. As first noted by Anderson, these materials are doped Mott insulators and the novel phenomenology emerges in the regime intermediate to the Neel state and the Fermi liquid metal where ele

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18

yin, jian. "High Temperature SiC Embedded Chip Module (ECM) with Double-sided Metallization Structure." Diss., Virginia Tech, 2005. http://hdl.handle.net/10919/30076.

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The work reported in this dissertation is intended to propose, analyze and demonstrate a technology for a high temperature integrated power electronics module, for high temperature (e.g those over 200oC) applications involving high density and low stress. To achieve this goal, this study has examined some existing packaging approaches, such as wire-bond interconnects and solder die-attach, flip-chip and pressure contacts. Based on the survey, a high temperature, multilayer 3-D packaging technology in the form of an Embedded Chip Module (ECM) is proposed to realize a lower stress distribution

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19

Wade, James Matthew. "Calorimetry studies of high temperature superconductors." Thesis, University of Cambridge, 1995. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.363078.

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20

Truong, L. H. "Dielectrics for high temperature superconducting applications." Thesis, University of Southampton, 2013. https://eprints.soton.ac.uk/355538/.

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This thesis is concerned with the development of condition monitoring for future design of high temperature superconducting (HTS) power apparatus. In particular, the use of UHF sensing for detecting PD activity within HTS has been investigated. Obtained results indicate that fast current pulses during PD in LN2 radiate electromagnetic waves which can be captured by the UHF sensor. PD during a negative streamer in LN2 appears in the form of a series of pulses less than 1 μs apart. This sequence cannot be observed using conventional detection method due to its bandwidth limitation. Instead, a sl

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21

Tidholm, Johan. "Thermodynamic and electronic properties of niobium at finite temperatures." Thesis, Linköpings universitet, Teoretisk Fysik, 2015. http://urn.kb.se/resolve?urn=urn:nbn:se:liu:diva-121042.

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Niobium (Nb) is a fascinating element, that when it is in a solid state has remarkable properties. This is believed to be a result of its electronic configuration that has partially filled 4d and 5s sub-shells. Nb has a melting temperature of 2750 K, a high strength at high temperature, and a good wear resistance. Because of these properties, Nb is used as material for components of rockets and jet engines, and for strengthening steel. In the phonon dispersion relations, Kohn anomalies are experimentally observed to weaken with increased temperature, which is related to the superconducting pro

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22

Grummel, Brian. "HIGH TEMPERATURE PACKAGING FOR WIDE BANDGAP SEMICONDUCTOR DEVICES." Master's thesis, University of Central Florida, 2008. http://digital.library.ucf.edu/cdm/ref/collection/ETD/id/3200.

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Currently, wide bandgap semiconductor devices feature increased efficiency, higher current handling capabilities, and higher reverse blocking voltages than silicon devices while recent fabrication advances have them drawing near to the marketplace. However these new semiconductors are in need of new packaging that will allow for their application in several important uses including hybrid electrical vehicles, new and existing energy sources, and increased efficiency in multiple new and existing technologies. Also, current power module designs for silicon devices are rife with problems that mus

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23

Lei, Guangyin. "Thermomechanical Reliability of Low-Temperature Sintered Attachments on Direct Bonded Aluminum (DBA) Substrate for High-Temperature Electronics Packaging." Diss., Virginia Tech, 2010. http://hdl.handle.net/10919/37803.

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This study focused on the development and evaluation of die-attach material and substrate technology for high-temperature applications. For the die-attach material, a low-temperature sintering technique enabled by a nanoscale silver paste was developed for attaching large-area (>100 mm2) semiconductor chips. The nanoscale silver paste can be sintered at a much lower temperature (<300 oC) than in the conventional sintering process (>800 oC), and at the same time reached about 80 vol% bulk density. Analyses of the sintered joints by scanning acoustic imaging and electron microscopy showed that t

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24

Sucharitakul, Sukrit. "2D ELECTRONIC SYSTEMS IN LAYERED SEMICONDUCTING MATERIALS." Case Western Reserve University School of Graduate Studies / OhioLINK, 2017. http://rave.ohiolink.edu/etdc/view?acc_num=case1491497351482802.

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25

Monica, Andrew Hayes. "In-plane carbon nanotube field emitters for high temperature integrated electronics." Connect to Electronic Thesis (ProQuest) Connect to Electronic Thesis (CONTENTdm), 2008. http://worldcat.org/oclc/436284954/viewonline.

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26

Wang, Annie I. (Annie I.-Jen) 1981. "Low temperature lithographically patterned metal oxide transistors for large area electronics." Thesis, Massachusetts Institute of Technology, 2011. http://hdl.handle.net/1721.1/66471.

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Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2011.<br>Cataloged from PDF version of thesis.<br>Includes bibliographical references (p. 167-184).<br>Optically transparent, wide bandgap metal oxide semiconductors are a promising candidate for large-area electronics technologies that require lightweight, temperature-sensitive flexible substrates. Because these thin films retain relatively high carrier mobilities even in an amorphous state, metal oxide-based field effect transistors (FETs) can be processed at near-room temperatures.

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27

Ramamurti, Rahul. "Synthesis of Diamond Thin Films for Applications in High Temperature Electronics." University of Cincinnati / OhioLINK, 2006. http://rave.ohiolink.edu/etdc/view?acc_num=ucin1145630189.

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28

Chang, Johan. "Magnetic and electronic properties of the high-temperature superconductor La₂₋xSrxCuO₄ /." Zürich : ETH, 2008. http://e-collection.ethbib.ethz.ch/show?type=diss&nr=17699.

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29

Douglas, J. Fraser. "The isotope effect on the electronic structure of high temperature superconductors." Connect to online resource, 2008. http://gateway.proquest.com/openurl?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:dissertation&res_dat=xri:pqdiss&rft_dat=xri:pqdiss:3337050.

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30

Mascaro, Mark Daniel. "Temperature effects on the electronic conductivity of single-walled carbon nanotubes." Thesis, Massachusetts Institute of Technology, 2007. http://hdl.handle.net/1721.1/44817.

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Thesis (S.B.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 2007.<br>Includes bibliographical references (p. 57-59).<br>The room-temperature electronic conductivity and temperature dependence of conductivity were measured for samples of carbon nanotubes of three types: pristine; functionalized with a nitrobenzene covalent functionalization, which are expected to display poor electronic conductivity; and functionalized with a carbene covalent functionalization, which are expected to display pristine-like conductivity. Measurements were taken via four-point

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31

Reynolds, Bryan. "Electronic Transport Properties of Nanonstructured Semiconductors: Temperature Dependence and Size Effects." University of Cincinnati / OhioLINK, 2016. http://rave.ohiolink.edu/etdc/view?acc_num=ucin1463130513.

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32

Pilgrim, James A. "Circuit rating methods for high temperature cables." Thesis, University of Southampton, 2011. https://eprints.soton.ac.uk/195003/.

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For the safe and efficient operation of power transmission systems, each system compo-nent must have an accurate current rating. Since the advent of formal power networks a wide variety of methods have been employed to calculate the current carrying capacity of power cables, ranging from simple analytical equations to complex numerical simulations. In the present climate of increasing power demand, but where finance for large scale network reinforcement schemes is limited, providing an accurate rating becomes paramount to the safe operation of the transmission network. Although the majority of

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33

Kobayashi, Makiko. "Development and applications of high temperature piezoelectric ultrasonic transducers." Thesis, McGill University, 2004. http://digitool.Library.McGill.CA:80/R/?func=dbin-jump-full&object_id=85079.

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High temperature ultrasonic transducers (HTUTs) have been developed for non-destructive evaluation (NDE) of metals and on-line monitoring of industrial polymer processes at elevated temperatures. Developed HTUTs are two types; one is sol gel sprayed HTUTs and the other is a crystal of high Curie temperature permanently bonded onto a steel substrate by brazing or diffusion bonding. In sol gel method, piezoelectric powders were dispersed into sol gel precursor. Sol gel precursor of Al2O3, PZT or BIT, serves as adhesion material between powders, LT, PZT or BIT and a substrate to be coated.

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34

Hai, Md. "Minimizing temperature dependent spectral shift in SOI DPSK demodulators." Thesis, McGill University, 2011. http://digitool.Library.McGill.CA:80/R/?func=dbin-jump-full&object_id=104852.

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Silicon on insulator (SOI) photonic devices are becoming popular due to their compatibility with complementary metal oxide semiconductor (CMOS) technology. Over the last five years, we have seen several practical demonstrations of high-speed optical modulators, switches, filters designed on SOI platform. Some of these devices were made utilizing one fundamental property of light: Interference. However, interference-based SOI devices show disastrous spectral phase shift with temperature change which result in the necessity of integrating active temperature control circuits to stabilize them. In

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35

Jones, Alexander R. "The application of temperature sensors into fabric substrates." Thesis, Kansas State University, 2011. http://hdl.handle.net/2097/11991.

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Master of Science<br>Department of Apparel, Textiles, and Interior Design<br>Diana Sindicich<br>With continuing advancements in the area of electronics, there are more ways in which they are utilized in order to improve the lives of humans. These advancements have to led to the incorporation of electronic components into fabric structures, creating electronic textiles (e-textiles). As it has become possible to place small electrical components within clothing without the performance of the electronics being hampered, research has been conducted in the use of e-textiles in measuring aspects of

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36

Huang, Taotao. "Quench modelling of high temperature superconductor." Thesis, University of Southampton, 2006. https://eprints.soton.ac.uk/65717/.

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HTS magnets have been developed to generate high magnetic fields because its high critical field at low temperatures. For HTS magnets, the design of thermal stability and protection is based on understanding of its quench behaviour. However, there are few experimental and numerical results on the quench behaviour of HTS at low temperatures. This thesis work is mainly dedicated to investigate the quench behaviour of high temperature superconductor (HTS) at low temperatures by 1D and 2D numerical analysis. In addition, this work also investigates the critical current of HTS coils made from Bi/Ag

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37

Lin, Yen-Hung. "Large-area flexible electronics based on low-temperature solution-processed oxide semiconductors." Thesis, Imperial College London, 2015. http://hdl.handle.net/10044/1/38442.

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Due to their high charge carrier mobility, optical transparency and mechanical flexibility, thin-film transistors (TFTs) based on metal oxide semiconductors represent an emerging technology that offers the potential to revolutionise the next-generations of large-area electronics. This thesis focuses on the development of high-performance TFTs based on low-temperature, solution-processed metal oxide semiconductors that are compatible with inexpensive flexible plastic substrates. The first part of the dissertation describes an ultraviolet light assisted processing method suitable for room-temper

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38

Thiede, David Anthony 1965. "Optical response in high temperature superconducting thin films." Thesis, The University of Arizona, 1990. http://hdl.handle.net/10150/278027.

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Since the discovery of a class of superconducting materials with critical temperatures as high as 125 degrees kelvin, there has been a great deal of research interest in their possible application to optical radiation detection, particularly in the infrared spectrum. The motivation for this research is the promise of a fast detector operating at elevated temperatures that is sensitive to low level optical signals and that operates out to the far IR. It has been shown that thin films of these high temperature superconductors (HTS) exhibit a change in their electrical properties when exposed to

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39

Tabasnikov, Aleksandr. "Development of a high temperature sensor suitable for post-processed integration with electronics." Thesis, University of Edinburgh, 2018. http://hdl.handle.net/1842/28971.

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Integration of sensors and silicon-based electronics for harsh environment applications is driven by the automotive industry and the maturity of semiconductor processes that allow embedding sensitive elements onto the same chip without sacrificing the performance and integrity of the electronics. Sensor devices post-processed on top of electronics by surface micromachining allow the addition of extra functionality to the fabricated ICs and creating a sensor system without significant compromise of performance. Smart sensors comprised of sensing structures integrated with silicon carbide-based

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40

French, Roger Harquail. "Electronic structure of A12O3 : VUV reflectivity measurements from room temperature to 1100C̊." Thesis, Massachusetts Institute of Technology, 1985. http://hdl.handle.net/1721.1/86250.

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Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1985.<br>MICROFICHE COPY AVAILABLE IN ARCHIVES AND SCIENCE.<br>Includes bibliographical references.<br>by Roger Harquail French.<br>Ph.D.

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41

Yue, Naili. "Planar Packaging and Electrical Characterization of High Temperature SiC Power Electronic Devices." Thesis, Virginia Tech, 2008. http://hdl.handle.net/10919/36278.

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This thesis examines the packaging of high-temperature SiC power electronic devices. Current-voltage measurements were conducted on as-received and packaged SiC power devices. The planar structure was introduced and developed as a substitution for traditional wire-bonding vertical structure. The planar structure was applied to a high temperature (>250oC) SiC power device. Based on the current-voltage (I-V) measurements, the packaging structures were improved, materials were selected, and processes were tightly controlled. This study applies two types of planar structures, the direct bond and

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42

Li, Qi. "A pair of stationary stochastic processes with application to Wichita temperature data." Thesis, Wichita State University, 2010. http://hdl.handle.net/10057/3644.

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The thesis investigates a pair of stationary stochastic process models whose domains are the set of integers and the set of real numbers respectively. The stationary processes with our specific correlation functions include the discrete and continuous first and second order autoregressive processes as their special cases. The maximum likelihood method is then applied to obtain the nonlinear equation system for the maximum likelihood estimators of the model parameters and the solutions are found by using the deepest gradient algorithm. The advantage of the algorithm lies in the calculation coul

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43

Favaloro, Tela. "High temperature experimental characterization of microscale thermoelectric effects." Thesis, University of California, Santa Cruz, 2014. http://pqdtopen.proquest.com/#viewpdf?dispub=3641688.

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<p> Thermoelectric devices have been employed for many years as a reliable energy conversion technology for applications ranging from the cooling of sensors or charge coupled devices to the direct conversion of heat into electricity for remote power generation. However, its relatively low conversion efficiency has limited the implementation of thermoelectric materials for large scale cooling and waste heat recovery applications. Recent advances in semiconductor growth technology have enabled the precise and selective engineering of material properties to improve the thermoelectric figure of me

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44

Sinno, Bilal. "Mechanical and dielectric characterization of electronic grade polymers at subambient temperatures." Thesis, Georgia Institute of Technology, 1995. http://hdl.handle.net/1853/10149.

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45

Dumpala, Bindya. "Design, construction, optimization, and characterization of a temperature control system for studying the effects of a rapid and reversible changes in temperature on neurosecretion." abstract and full text PDF (free order & download UNR users only), 2006. http://0-gateway.proquest.com.innopac.library.unr.edu/openurl?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:dissertation&res_dat=xri:pqdiss&rft_dat=xri:pqdiss:1438916.

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46

Suman, Shivesh K. "Characterization of temperature variation during the wire bonding process." Thesis, Georgia Institute of Technology, 2002. http://hdl.handle.net/1853/17560.

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47

Vo, Tien Minh. "Cure temperature variation and hygrothermal effects on an out-of-autoclave polymer composite." Thesis, Wichita State University, 2012. http://hdl.handle.net/10057/5431.

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The effects of cure temperature variation and hygrothermal conditioning on thermal, physical, and mechanical properties of an out-of-autoclave prepreg were investigated and correlated. To study the effects of cure temperature variation, intermediate-cure temperature, second ramp rate, and post-cure temperature were varied from a recommended two-stage cure cycle. The effects of adverse environmental conditions on the cure temperature variation were studied by conditioning the samples in boiling water and a conditioning chamber. The material’s cure state was monitored using a Different Scanning

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48

Gernaat, Christopher Ronald. "Correlation between rheological and mechanical properties in a low-temperature cure prepreg composite." Thesis, Wichita State University, 2008. http://hdl.handle.net/10057/2090.

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With an ever growing fleet of commercial airplanes utilizing composite structures, it is increasingly important to develop cost-effective and robust repair procedures. Issues invariably occur during on-site repair which casts doubt on the structural suitability of the part. This makes the ability to quantify the relationship between dwell temperature, cure state, and mechanical properties extremely important. Curing temperatures play a vital role in the difficulty of repairs. Lower cure temperatures mean lower cost, less possibility of damage to surrounding material, and therefore, the potenti

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49

Ruppert, Jesse. "Development of zirconia-based mesoporous materials for intermediate-temperature solid-oxide fuel cells." abstract and full text PDF (UNR users only), 2009. http://0-gateway.proquest.com.innopac.library.unr.edu/openurl?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:dissertation&res_dat=xri:pqdiss&rft_dat=xri:pqdiss:1472975.

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Gernaat, Christopher Ronald Minaie Bob. "Correlation between rheological and mechanical properties in a low-temperature cure prepreg composite." A link to full text of this thesis in SOAR, 2008. http://hdl.handle.net/10057/2090.

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Wichita State University, College of Engineering, Dept. of Mechanical Engineering<br>Copyright 2008 by Christopher Ronald Gernaat. All Rights Reserved. Includes bibliographic references (leaves 89-92).

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