Relevant bibliographies by topics / Electronics - Circuits - Printed

Contents

  1. Journal articles
  2. Dissertations / Theses
  3. Books
  4. Book chapters
  5. Conference papers
  6. Reports

Academic literature on the topic 'Electronics - Circuits - Printed'

Author: Grafiati
Published: 4 June 2021
Last updated: 28 July 2025

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Journal articles on the topic "Electronics - Circuits - Printed"

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Kim, TaeWoong, and SoYoung Kim. "Electronic design automation requirements for R2R printing foundry." Flexible and Printed Electronics 7, no. 1 (2022): 013001. http://dx.doi.org/10.1088/2058-8585/ac4d3d.

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Abstract Roll-to-roll (R2R) printed electronic devices have been in the spotlight over the decades as a potential replacement for Si-based semiconductors, research into this technology is still being actively conducted over the world. These printed electronic devices can be used in a variety of applications, so the demand for them is expected to reach over USD 20.7 billion in 2025 given a compound annual growth rate (CAGR) of 21.5%. As the new ink materials and printing technologies being researched are commercialized, foundry companies that produce printed electronics need to provide appropri
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Chen, Sen, and Jing Liu. "Liquid metal printed electronics towards ubiquitous electrical engineering." Japanese Journal of Applied Physics 61, SE (2022): SE0801. http://dx.doi.org/10.35848/1347-4065/ac5761.

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Abstract Conventional electronic manufacturers are generally not easily accessible due to complicated procedures, time, material and energy consuming, and may generate potential pollution to the environment. From an alternative, liquid metal printed electronics to quickly fabricate electronic circuits and functional devices were proposed a decade before. To promote the further development and application of liquid metal printed electronics, this review aims to summarize and analyze the progress of liquid metal printed electronics from three aspects, namely electronic inks, printing technology
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Clemens, W., W. Fix, J. Ficker, A. Knobloch, and A. Ullmann. "From polymer transistors toward printed electronics." Journal of Materials Research 19, no. 7 (2004): 1963–73. http://dx.doi.org/10.1557/jmr.2004.0263.

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Printed organic circuits have the potential to revolutionize the spread of electronic applications. This will be enabled by inexpensive and fast fabrication with printing techniques using soluble organic materials. Two main challenges have to be mastered on the way towards printed electronics. First, the development of stable transistors and an adapted chip design for organic materials, and second, the development of a reliable fabrication process. We present our results on high performance polymer transistors, mainly based on poly-3alkylthiophene (P3AT) as semiconducting material. Fast circui
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Podsiadły, Bartłomiej, Liubomir Bezgan, and Marcin Słoma. "3D Printed Electronic Circuits from Fusible Alloys." Electronics 11, no. 22 (2022): 3829. http://dx.doi.org/10.3390/electronics11223829.

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This work aims to evaluate the possibility of fabricating conductive paths for printed circuit boards from low-temperature melting metal alloys on low-temperature 3D printed substrates and mounting through-hole electronic components using the fused deposition modeling for metals (FDMm) for structural electronics applications. The conductive materials are flux-cored solder wires Sn60Pb40 and Sn99Ag0.3Cu0.7. The deposition was achieved with a specially adapted nozzle. A comparison of solder wires with and without flux cores is discussed to determine whether the solder alloys exhibit adequate wet
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Yu, Yan. "Material Selection and Design Methods for Flexible RFID Tag Antenna." IETI Transactions on Data Analysis and Forecasting (iTDAF) 2, no. 3 (2024): 38–49. http://dx.doi.org/10.3991/itdaf.v2i3.51975.

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In recent years, advancements in flexible printed electronics have significantly propelled the development of wearable devices, especially in areas of integration, comfort, and streamlined manufacturing. By incorporating electronic components and conductive coatings onto flexible substrates, circuits gain enhanced flexibility and some degree of stretchability. Among these circuits, radio frequency identification (RFID) tag antennas have emerged as a focal point in wearable device communication due to their adaptability in power selection and their compatibility with printed circuit technologie
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Habboush, Shayma, Sara Rojas, Noel Rodríguez, and Almudena Rivadeneyra. "The Role of Interdigitated Electrodes in Printed and Flexible Electronics." Sensors 24, no. 9 (2024): 2717. http://dx.doi.org/10.3390/s24092717.

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Flexible electronics, also referred to as printable electronics, represent an interesting technology for implementing electronic circuits via depositing electronic devices onto flexible substrates, boosting their possible applications. Among all flexible electronics, interdigitated electrodes (IDEs) are currently being used for different sensor applications since they offer significant benefits beyond their functionality as capacitors, like the generation of high output voltage, fewer fabrication steps, convenience of application of sensitive coatings, material imaging capability and a potenti
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Sawamura, Fumiya, Chen Yi Ngu, Raiki Hanazaki, et al. "Dry Printing of Ag–Ni Conductive Particles Using Toner-Type Printed Electronics." Applied Sciences 12, no. 19 (2022): 9616. http://dx.doi.org/10.3390/app12199616.

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Printed electronics are a set of additive manufacturing methods for creating future flexible electronics on thin polymeric sheets. We proposed the toner-type, dry, page-printing of Ag–Ni composite conductive particles on flexible plastic sheets without pre-treatment. No chemical solvents are necessary to compose the inks of the electronic materials used for the toner-type printing, and no chemical treatment is required for the plastic film substrate surface. In addition, multilayer printing is simple when using toner printing because previously printed materials do not need to be resolved; fur
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Jaafar, Ahmad, Spyridon Schoinas, and Philippe Passeraub. "Pad-Printing as a Fabrication Process for Flexible and Compact Multilayer Circuits." Sensors 21, no. 20 (2021): 6802. http://dx.doi.org/10.3390/s21206802.

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The purpose of this paper is to present a newly developed process for the fabrication of multilayer circuits based on the pad-printing technique. Even though the maturity level, in terms of accuracy, substrate type and print size of several printing industrial processes is relatively high, the fabrication complexity of multilayer printed electronics remains relatively high. Due to its versatility, the pad-printing technique allows the superposition of printed conductive and insulating layers. Compared to other printing processes, its main advantage is the ability to print on various substrates
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Jaafar, Ahmad, Spyridon Schoinas, and Philippe Passeraub. "Pad-Printing as a Fabrication Process for Flexible and Compact Multilayer Circuits." Sensors 21, no. 20 (2021): 6802. http://dx.doi.org/10.3390/s21206802.

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The purpose of this paper is to present a newly developed process for the fabrication of multilayer circuits based on the pad-printing technique. Even though the maturity level, in terms of accuracy, substrate type and print size of several printing industrial processes is relatively high, the fabrication complexity of multilayer printed electronics remains relatively high. Due to its versatility, the pad-printing technique allows the superposition of printed conductive and insulating layers. Compared to other printing processes, its main advantage is the ability to print on various substrates
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Verdingovas, Vadimas, Salil Joshy, Morten Stendahl Jellesen, and Rajan Ambat. "Analysis of surface insulation resistance related failures in electronics by circuit simulation." Circuit World 43, no. 2 (2017): 45–55. http://dx.doi.org/10.1108/cw-09-2016-0040.

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Purpose The purpose of this study is to show that the humidity levels for surface insulation resistance (SIR)-related failures are dependent on the type of activators used in no-clean flux systems and to demonstrate the possibility of simulating the effects of humidity and contamination on printed circuit board components and sensitive parts if typical SIR data connected to a particular climatic condition are available. This is shown on representative components and typical circuits. Design/methodology/approach A range of SIR values obtained on SIR patterns with 1,476 squares was used as input
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Dissertations / Theses on the topic "Electronics - Circuits - Printed"

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Sopeña, i. Martínez Pol. "Laser-induced forward transfer for printed electronics applications." Doctoral thesis, Universitat de Barcelona, 2020. http://hdl.handle.net/10803/670919.

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Printed electronics appeared in the 1980s as a cost-effective alternative to silicon-based electronics. Employing the techniques from the graphics industry, such as rotogravure or screen printing, it was possible to print metals, ceramics, and polymers on a wide variety of materials, including flexible and organic substrates. However, these techniques became not adequate when customization or short runs were considered since the production costs of the components and devices substantially increased. To overcome these issues, direct-write techniques, such as inkjet printing, allowed depositing
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Llamas, Rodríguez Manuel José. "Design Automation methods and tools for building Digital Printed Microelectronics Circuits." Doctoral thesis, Universitat Autònoma de Barcelona, 2017. http://hdl.handle.net/10803/457967.

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La electrónica orgánica/impresa está continuamente creciendo en interés, con la aparición de nuevas propuestas y aplicaciones. Este tipo de tecnologías no pretenden competir directamente con las que provienen de la industria tradicional basada en Silicio, sino que tienen como propósito complementarla con nuevos dispositivos que proporcionen ciertas ventajas en determinadas situaciones, ya sea en términos de coste u otras. Sin embargo, en lo que se refiere al campo del procesado digital queda mucho trabajo por hacer para, paulatinamente, ir siguiendo los pasos del modelo ‘fabless’ que rige el
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Mashayekhi, Mohammad. "Inkjet-configurable gate arrays: towards application specific printed electronic circuits." Doctoral thesis, Universitat Autònoma de Barcelona, 2016. http://hdl.handle.net/10803/402272.

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Over the last decades, Organic Electronics has been emerging as a multidisciplinary and innovative way to generate electronic devices and systems. It is intended to provide a platform for low-cost, large-area, and low-frequency Printable Electronics on a variety of substrates, including flexible plastic substrates. Just as the first information revolution caused by integrated silicon circuits, PE is expected to cause another revolution characterized by the distribution of information systems in all aspects of life. Although the integrated circuits, based on Organic Thin Film Transistors
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Wan, Qiansu. "Life Cycle Assessment of Paper Based Printed Circuits." Licentiate thesis, KTH, Skolan för informations- och kommunikationsteknik (ICT), 2017. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-219405.

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Printed circuit boards have been massively manufactured and wildly used in all kinds of electronic devices during people’s daily life for more than thirty years since the last century. As a highly integrated device mainly consists of silicon base, an etched copper layer and other soldered components, massive production of printed circuit boards are considered to be environmentally unfriendly due to the wet chemical manufacturing mode and lack of recycling ability. On the other hand, the newly invented ink jet printing technology enables cost-effective manufacturing of flexible, thin and dispos
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Salas, Barenys Arnau. "Full-3D Printed Electronics Fabrication of Radiofrequency Circuits and Passive Components." Doctoral thesis, Universitat de Barcelona, 2021. http://hdl.handle.net/10803/673257.

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This doctoral thesis raises the idea that 3D printing can change the paradigm of radio- frequency electronics, which has been traditionally developed mainly conceiving planar topologies. A review on additive manufacturing and the different existing technologies is reported. To focus on the concerning topic, several applications of 3D-printed electronics in the RF field are collected to elaborate the State-of-the-Art. The main objectives of this project is to develop a 3D manufacturing technology for RF electronics passive components and circuits and to generate innovative research about the po
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Mannerbro, Richard, and Martin Ranlöf. "Inkjet and Screen Printed Electrochemical Organic Electronics." Thesis, Linköping University, Department of Electrical Engineering, 2007. http://urn.kb.se/resolve?urn=urn:nbn:se:liu:diva-8117.

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<p>Linköpings Universitet och Acreo AB i Norrköping bedriver ett forskningssamarbete rörande organisk elektrokemisk elektronik och det man kallar papperselektronik. Målet på Acreo är att kunna trycka denna typ av elektronik med snabba trycktekniker så som offset- eller flexotryck. Idag görs de flesta demonstratorer och prototyper, baserade på denna typ av elektrokemisk elektronik, med manuella och subtraktiva mönstringsmetoder. Det skulle vara intressant att hitta fler verktyg och automatiserade tekniker som kan underlätta detta arbete. Målet med detta examensarbete har varit att utvärdera vil
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Ogunjimi, A. O. "Finite element modelling of the thermal effects of the manufacturing process on the quality of electronics interconnection." Thesis, Loughborough University, 1994. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.261299.

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Chada, Arun Reddy. "Modeling of vias and via arrays in high speed printed circuit boards." Diss., Rolla, Mo. : Missouri University of Science and Technology, 2009. http://scholarsmine.mst.edu/thesis/pdf/Chada_09007dcc80704979.pdf.

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Thesis (M.S.)--Missouri University of Science and Technology, 2009.<br>Vita. The entire thesis text is included in file. Title from title screen of thesis/dissertation PDF file (viewed November 16, 2009) Includes bibliographical references (p. 90-91).
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Li, Jing. "Evaluation and improvement of the robustness of a PCB pad in a lead-free environment." Diss., Online access via UMI:, 2007.

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Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Systems Science and Industrial Engineering, 2007.<br>Includes bibliographical references.
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Leung, Yun Yuen. "Performance models and fabrication of low cost radio frequency identification tags with printed antennas /." View abstract or full-text, 2008. http://library.ust.hk/cgi/db/thesis.pl?MECH%202008%20LEUNG.

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Books on the topic "Electronics - Circuits - Printed"

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National Research Council (U.S.) Committee on Manufacturing Trends in Printed Circuit Technology, ed. Linkages: Manufacturing trends in electronics interconnection technology. National Academies Press, 2005.

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Suganuma, Katsuaki. Introduction to printed electronics. Springer, 2014.

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Group, Cahners Exposition, ed. Automated design and engineering for electronics. Cahners Exposition Group, 1985.

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Brindley, Keith. Starting electronics. 2nd ed. Newnes, 1999.

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Turok, Ivan. Making connections: The growth of a Scottish industrial cluster in electronics. University of Strathclyde, Centre for Planning, 1992.

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Sinclair, Ian Robertson. Practical electronics handbook. 6th ed. Newnes, 2007.

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Sinclair, Ian Robertson. Practical electronics handbook. 5th ed. Newnes, 2000.

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Cantatore, Eugenio. Applications of Organic and Printed Electronics: A Technology-Enabled Revolution. Springer US, 2013.

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Schroeder, Chris. Printed circuit board design using AutoCAD. Newnes, 1998.

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Judd, Mike. Soldering in electronics assembly. 2nd ed. Newnes, 1999.

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Book chapters on the topic "Electronics - Circuits - Printed"

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Matisoff, Bernard S. "Printed Circuits." In Handbook Of Electronics Packaging Design and Engineering. Springer Netherlands, 1990. http://dx.doi.org/10.1007/978-94-011-7047-5_16.

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Lawrence, Dan, Jim Kohler, Brian Brollier, Tim Claypole, and Timothy Burgin. "Manufacturing Platforms for Printing Organic Circuits." In Printed Organic and Molecular Electronics. Springer US, 2004. http://dx.doi.org/10.1007/978-1-4419-9074-7_3.

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Gundlach, David J., Michael S. Shur, Thomas Jackson, et al. "Electrical Behavior of Organic Transistors and Circuits." In Printed Organic and Molecular Electronics. Springer US, 2004. http://dx.doi.org/10.1007/978-1-4419-9074-7_4.

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Krumm, Jürgen, and Wolfgang Clemens. "Printed Electronics—First Circuits, Products, and Roadmap." In Analog Circuit Design. Springer Netherlands, 2011. http://dx.doi.org/10.1007/978-94-007-0391-9_17.

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Baeg, Kang-Jun, and Yong-Young Noh. "Inkjet-Printed Electronic Circuits Based on Organic Semiconductors." In Large Area and Flexible Electronics. Wiley-VCH Verlag GmbH & Co. KGaA, 2015. http://dx.doi.org/10.1002/9783527679973.ch12.

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Sekitani, Tsuyoshi, Tomoyuki Yokota, and Takao Someya. "Large-Area, Printed Organic Circuits for Ambient Electronics." In Large Area and Flexible Electronics. Wiley-VCH Verlag GmbH & Co. KGaA, 2015. http://dx.doi.org/10.1002/9783527679973.ch13.

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Matsui, Hiroyuki, Kenjiro Fukuda, and Shizuo Tokito. "Printed Organic Thin-Film Transistors and Integrated Circuits." In Organic Electronics Materials and Devices. Springer Japan, 2024. http://dx.doi.org/10.1007/978-4-431-56936-7_4.

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Hussain, Aftab M. "Flexible Printed Circuit Boards." In Introduction to Flexible Electronics. CRC Press, 2021. http://dx.doi.org/10.1201/9781003010715-14.

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Craig, Edwin C. "Printed Circuit Boards." In Laboratory Manual for Electronics via Waveform Analysis. Springer New York, 1994. http://dx.doi.org/10.1007/978-1-4612-2610-9_14.

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Edwards, Phillip R. "Printed circuit board manufacture." In Manufacturing Technology in the Electronics Industry. Springer Netherlands, 1991. http://dx.doi.org/10.1007/978-94-011-3130-8_5.

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Conference papers on the topic "Electronics - Circuits - Printed"

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Kuo, Shan-Jen Simon, and Jen-Chieh Wei. "Approaches to Streamline Manufacturing in Flexible Hybrid Printed Electronics (FHPE)." In 2024 19th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT). IEEE, 2024. https://doi.org/10.1109/impact63555.2024.10818864.

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Yahyapour, Babak, Frederic Marcotte, Roya Gachiloo, and Maksim Skorobogatiy. "3D Printed THz Demultiplexer Circuits Using Suspended-in-Air Grating Couplers." In 2025 IEEE International Conference on Consumer Electronics (ICCE). IEEE, 2025. https://doi.org/10.1109/icce63647.2025.10929929.

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Lall, Pradeep, Shriram Kulkarni, and Scott Miller. "Screen-Printed Thermoformed Circuits Performance and Reliability under Sustained High Temperatures for In-Mold Electronics." In 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm). IEEE, 2024. http://dx.doi.org/10.1109/itherm55375.2024.10709621.

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Yarram, Srimaan, Manjunath HN, S. Karthiga, Mohammed Fallah, and R. Maranan. "Deep Learning based DeepLab Version 3+ for Fault Detection in Printed Circuit Boards Manufacturing." In 2025 4th International Conference on Distributed Computing and Electrical Circuits and Electronics (ICDCECE). IEEE, 2025. https://doi.org/10.1109/icdcece65353.2025.11035476.

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Lall, Pradeep, Sabina Bimali, and Scott Miller. "Process-Performance Interactions Under Exposure to Sustained High Temperature for Additively Manufactured Electronics and SMT Assembly With Low-Temperature Curable Adhesives." In ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. American Society of Mechanical Engineers, 2024. http://dx.doi.org/10.1115/ipack2024-141856.

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Abstract Rapid progress in technology necessitates an in-depth understanding of the enduring reliability of flexible printed circuitry constructed using different connecting materials. The adaptability of flexible printed circuits and their potential applications in a wide range of electronic devices, from automotive systems to wearable electronics, has garnered substantial interest in recent years. Thermal aging is an important factor that might potentially compromise the structural integrity and performance of electronic assemblies used in real-world applications. The reliability of flexible
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Lall, Pradeep, Md Golam Sarwar, Ved Soni, and Scott Miller. "Repairability of SMDs on 3D Printed Circuitry for Sustainable Electronics Utilizing Direct Write Technique." In ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. American Society of Mechanical Engineers, 2023. http://dx.doi.org/10.1115/ipack2023-112061.

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Abstract Sustainable conductive ink for 3D-printed flexible electronics is needed to enable lower-impact waste print processes. The ability to undertake reparability is an additional method to achieve sustainable products through the extension of electronic components’ lifespan and reduced e-waste. However, repairability studies are scarce for sustainable, flexible electronics in the literature. This study assessed the repairability potential of Surface Mount Devices (SMD) on 3D-printed full wave rectifier circuits for sustainable flexible electronics. Full wave rectifiers are commonly used in
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Lall, Pradeep, Md Golam Sarwar, Ved Soni, and Scott Miller. "Direct Write Thermoformed Additive Silver Circuits With SMDs Attachment for In-Mold Electronics." In ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. American Society of Mechanical Engineers, 2023. http://dx.doi.org/10.1115/ipack2023-112063.

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Abstract Additively printed thermoformable circuitry for In-Mold Electronics (IME) is getting tremendous research focus because of its numerous advantages: design flexibility, cost-effectiveness, weight reduction, and potential for seamless integration into structural components. This study uses a direct write printing technique to produce conductive FWR circuits using stretchable silver ink. A stretchable ink capable of thermoforming was used for circuit fabrication. Once the conductive traces were printed, SMDs were joined to the circuit using ECA. An impedance analyzer was used to examine t
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Lall, Pradeep, Ved Soni, Jinesh Narangaparambil, and Scott Miller. "Evaluation of Thermoformability of Additively Printed Circuits Printed Using Gravure Offset Printing Technique and Investigation of In-Mold Electronic Circuits." In ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. American Society of Mechanical Engineers, 2023. http://dx.doi.org/10.1115/ipack2023-112060.

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Abstract Throughout the past decade, the field of printed electronics has gained increased research impetus and has started to make entryways into the consumer electronics product market. The applications of additive printed electronics are numerous and range from healthcare devices and smart packaging to energy harvesting systems and intelligent textiles. Another novel application area for printed electronics is in-mold electronics (IME) which is a process that involves the integration of printed electronic circuits into injection-molded parts. In this process, electronic circuits are printed
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Sharma, Apoorv, and Rahul Rai. "Transfer Printing of Stretchable Electronics on Conformal Surfaces." In ASME 2015 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference. American Society of Mechanical Engineers, 2015. http://dx.doi.org/10.1115/detc2015-46093.

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In this paper, we outline a hybrid process to print stretchable electronic circuits on non-planar surfaces. Using this process, the stretchable structures, generated using traditional printed circuit board fabrication technology can be printed on conformal surfaces using transfer printing by PDMS membranes. Three different configurations of stretchable structures for use in the circuits are also compared for their robustness of shape representation and structural strength. The application of the proposed process is illustrated through application examples.
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Lall, Pradeep, Sabina Bimali, and Scott Miller. "Reparability Test of Aerosol-Jet Printed Sustainable Silver Ink Circuit." In ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. American Society of Mechanical Engineers, 2023. http://dx.doi.org/10.1115/ipack2023-112064.

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Abstract The earlier generation of additive printable inks was based on volatile organic solvent carrier fluids. Increased awareness of the environmental impact of electronic waste has resulted in the emergence of environmentally friendly water-based inks with low-impact waste. The repairability of additively printed circuits can be used to reduce electronic waste and enable life extensions of deployed electronics through repair and replacement. However, the repairability potential, processes, and impact on reliability are relatively unexplored for new sustainable materials. This study consist
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Reports on the topic "Electronics - Circuits - Printed"

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Keyack, Michael, Fillipo Latte Blonval, Cheng-Yu Lai, and Daniela Radu. Enhancing Silver Nanoparticles Based Inks for Printable Flexible Electronics. Florida International University, 2025. https://doi.org/10.25148/fiuurj.3.1.17.

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As additive manufacturing comes to the forefront of industrial fabrication processes, the possibility of printable electronics has become a reality. However, commercial implementation of such processes is constrained by scalability and reproducibility. This project aims to improve the formulation of silver based conductive inks through the integration of silver nanoparticles and a viscoelastic polymer enabling printability on both rigid and flexible substrates. Test specimens were printed and characterized for conductivity, resistivity, and viscosity. Post treatment annealing temperatures were
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