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1

National Research Council (U.S.) Committee on Manufacturing Trends in Printed Circuit Technology, ed. Linkages: Manufacturing trends in electronics interconnection technology. National Academies Press, 2005.

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2

Suganuma, Katsuaki. Introduction to printed electronics. Springer, 2014.

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3

Group, Cahners Exposition, ed. Automated design and engineering for electronics. Cahners Exposition Group, 1985.

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4

Brindley, Keith. Starting electronics. 2nd ed. Newnes, 1999.

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5

Turok, Ivan. Making connections: The growth of a Scottish industrial cluster in electronics. University of Strathclyde, Centre for Planning, 1992.

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6

Sinclair, Ian Robertson. Practical electronics handbook. 6th ed. Newnes, 2007.

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7

Sinclair, Ian Robertson. Practical electronics handbook. 5th ed. Newnes, 2000.

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8

Cantatore, Eugenio. Applications of Organic and Printed Electronics: A Technology-Enabled Revolution. Springer US, 2013.

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9

Schroeder, Chris. Printed circuit board design using AutoCAD. Newnes, 1998.

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10

Judd, Mike. Soldering in electronics assembly. 2nd ed. Newnes, 1999.

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11

Lyssel, Melanie Van. Environmentally acceptable soldering and cleaning materials in electronics. Business Communications Co., 1997.

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12

Design for the Environment Program (U.S.), ed. Federal environmental regulations affecting the electronics industry. U.S. EPA, 1995.

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13

Brindley, Keith. Newnes electronics assembly handbook. Heinemann Newnes, 1990.

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14

B, Waterhouse R., ed. Printed antennas for wireless communications. Wiley, 2007.

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15

Archambeault, Bruce. PCB design for real-world EMI control. Kluwer Academic Publishers, 2002.

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16

Trsan, Mạnh Hòa. Học liueu khóa electronics assembly: Thru hole technology & surface mount technology. [s.n.], 1995.

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17

T, Nunno, ed. Toxic waste minimization in the printed circuit board industry. Noyes Data Corp., 1988.

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18

Soh, Hyongsok T. Scanning probe lithography. Kluwer Academic Publishers, 2001.

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19

Soh, Hyongsok T. Scanning probe lithography. Kluwer Academic Publishers, 2001.

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20

Ron, Daniels, ed. New cleaning strategies: Environmental issues and technical developments. Miller Freeman Books, 1994.

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21

Edwards, Phillip R. Manufacturing technology in the electronics industry: An introduction. Chapman & Hall, 1991.

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22

1931-, Romankiw Lubomyr T., Electrochemical Society Electrodeposition Division, and International Symposium on Electrochemical Technology Applications in Electronics (3rd : 1999 : Honolulu, Hawaii), eds. Electrochemical technology applications in electronics: Proceedings of the Third International Symposium. Electrochemical Society, 2000.

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23

Michael, Shur, Wilson Patricia M, Urban Dick, and Materials Research Society, eds. Electronics on unconventional substrates--electrotextiles and giant-area flexible circuits: Symposium held December 2-3, 2002, Boston, Massachusetts, U.S.A. Materials Research Society, 2003.

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24

Ginsberg, Gerald L. Surface mount and related technologies. M. Dekker, 1989.

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25

Hwang, Jennie S. Solder paste in electronics packaging: Technology and applications in surface mount, hybrid circuits and component assembly. Van Nostrand Reinhold, 1992.

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26

Castrovilla, Joseph A. Environmentally acceptable soldering and cleaning materials and systems in electronics. Business Communications Co., 1993.

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27

Norbert, Fruehauf, and Materials Research Society Meeting, eds. Flexible electronics 2004--materials and device technology: Symposium held April 13-16, 2004, San Francisco, California, U.S.A. Materials Research Society, 2004.

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28

Schroeder, Chris. Inside OrCAD. Newnes, 1996.

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29

Gurnett, Keith W. No-clean technology: An assessment of market & technical potential. Elsevier Advanced Technology, 1995.

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30

Company, PennWell Publishing. SMT: 2006 step-by-step collection. PennWell Corporation, 2008.

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31

Hinch, Stephen W. Handbook of surface mount technology. Longman Scientific & Technical, 1988.

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32

Company, PennWell Publishing, ed. SMT: 2006 step-by-step collection. PennWell Corporation, 2008.

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33

Someya, Takao. Stretchable Electronics. Wiley & Sons, Incorporated, John, 2012.

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34

Someya, Takao. Stretchable Electronics. Wiley & Sons, Incorporated, John, 2012.

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35

Someya, Takao. Stretchable Electronics. Wiley & Sons, Incorporated, John, 2012.

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36

Someya, Takao. Stretchable Electronics. Wiley & Sons, Limited, John, 2012.

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37

Zhang, Jie, Paul Brazis, Daniel R. Gamota, and Krishna Kalyanasundaram. Printed Organic and Molecular Electronics. Springer, 2014.

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38

Brazis, Paul, Daniel R. Gamota, Krishna Kalyanasundaram, and Jie Jie Zhang. Printed Organic and Molecular Electronics. Springer London, Limited, 2013.

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39

Printed Organic and Molecular Electronics. Springer, 2004.

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40

Suganuma, Katsuaki. Introduction to Printed Electronics. Springer London, Limited, 2014.

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41

Wong, William S., and Alberto Salleo. Flexible Electronics: Materials and Applications. Springer, 2010.

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42

Chen, Liangliang. Materials and Technologies for Flexible and Printed Electronics. Trans Tech Publications, Limited, 2015.

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43

Chen, Liang Liang. Materials and Technologies for Flexible and Printed Electronics. Trans Tech Publications, Limited, 2015.

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44

Flexible Electronics and Photonics: Materials and Devices. World Scientific Publishing Co Pte Ltd, 2011.

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45

Einspruch, Norman G., and R. K. Watts. Lithography for VLSI: VLSI Electronics Microstructure Science. Elsevier Science & Technology Books, 2014.

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46

Clyde, F. Jr Coombs. Soldering (Printed Circuits Workbook Series, Vol 3). McGraw-Hill Companies, 1990.

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47

Applications Of Organic And Printed Electronics A Technologyenabled Revolution. Springer, 2012.

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48

Bath, Jasbir, Carol A. Handwerker, Edwin Bradley, Ronald W. Gedney, and Richard D. Parker. Lead-Free Electronics. Wiley & Sons, Incorporated, John, 2007.

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49

Jawitz, Martin W., and Michael J. Jawitz. Materials for Rigid and Flexible Printed Wiring Boards. Taylor & Francis Group, 2018.

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50

Jawitz, Martin W., and Michael J. Jawitz. Materials for Rigid and Flexible Printed Wiring Boards. Taylor & Francis Group, 2018.

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