Log in

Relevant bibliographies by topics / Electronics - Circuits - Printed / Dissertations / Theses

To see the other types of publications on this topic, follow the link: Electronics - Circuits - Printed.

Dissertations / Theses on the topic 'Electronics - Circuits - Printed'

Author: Grafiati

Published: 4 June 2021

Last updated: 28 July 2025

Create a spot-on reference in APA, MLA, Chicago, Harvard, and other styles

Select a source type:

Consult the top 50 dissertations / theses for your research on the topic 'Electronics - Circuits - Printed.'

Next to every source in the list of references, there is an 'Add to bibliography' button. Press on it, and we will generate automatically the bibliographic reference to the chosen work in the citation style you need: APA, MLA, Harvard, Chicago, Vancouver, etc.

You can also download the full text of the academic publication as pdf and read online its abstract whenever available in the metadata.

Browse dissertations / theses on a wide variety of disciplines and organise your bibliography correctly.

1

Sopeña, i. Martínez Pol. "Laser-induced forward transfer for printed electronics applications." Doctoral thesis, Universitat de Barcelona, 2020. http://hdl.handle.net/10803/670919.

Full text

Abstract:

Printed electronics appeared in the 1980s as a cost-effective alternative to silicon-based electronics. Employing the techniques from the graphics industry, such as rotogravure or screen printing, it was possible to print metals, ceramics, and polymers on a wide variety of materials, including flexible and organic substrates. However, these techniques became not adequate when customization or short runs were considered since the production costs of the components and devices substantially increased. To overcome these issues, direct-write techniques, such as inkjet printing, allowed depositing

APA, Harvard, Vancouver, ISO, and other styles

2

Llamas, Rodríguez Manuel José. "Design Automation methods and tools for building Digital Printed Microelectronics Circuits." Doctoral thesis, Universitat Autònoma de Barcelona, 2017. http://hdl.handle.net/10803/457967.

Full text

Abstract:

La electrónica orgánica/impresa está continuamente creciendo en interés, con la aparición de nuevas propuestas y aplicaciones. Este tipo de tecnologías no pretenden competir directamente con las que provienen de la industria tradicional basada en Silicio, sino que tienen como propósito complementarla con nuevos dispositivos que proporcionen ciertas ventajas en determinadas situaciones, ya sea en términos de coste u otras. Sin embargo, en lo que se refiere al campo del procesado digital queda mucho trabajo por hacer para, paulatinamente, ir siguiendo los pasos del modelo ‘fabless’ que rige el

APA, Harvard, Vancouver, ISO, and other styles

3

Mashayekhi, Mohammad. "Inkjet-configurable gate arrays: towards application specific printed electronic circuits." Doctoral thesis, Universitat Autònoma de Barcelona, 2016. http://hdl.handle.net/10803/402272.

Full text

Abstract:

Over the last decades, Organic Electronics has been emerging as a multidisciplinary and innovative way to generate electronic devices and systems. It is intended to provide a platform for low-cost, large-area, and low-frequency Printable Electronics on a variety of substrates, including flexible plastic substrates. Just as the first information revolution caused by integrated silicon circuits, PE is expected to cause another revolution characterized by the distribution of information systems in all aspects of life. Although the integrated circuits, based on Organic Thin Film Transistors

APA, Harvard, Vancouver, ISO, and other styles

4

Wan, Qiansu. "Life Cycle Assessment of Paper Based Printed Circuits." Licentiate thesis, KTH, Skolan för informations- och kommunikationsteknik (ICT), 2017. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-219405.

Full text

Abstract:

Printed circuit boards have been massively manufactured and wildly used in all kinds of electronic devices during people’s daily life for more than thirty years since the last century. As a highly integrated device mainly consists of silicon base, an etched copper layer and other soldered components, massive production of printed circuit boards are considered to be environmentally unfriendly due to the wet chemical manufacturing mode and lack of recycling ability. On the other hand, the newly invented ink jet printing technology enables cost-effective manufacturing of flexible, thin and dispos

APA, Harvard, Vancouver, ISO, and other styles

5

Salas, Barenys Arnau. "Full-3D Printed Electronics Fabrication of Radiofrequency Circuits and Passive Components." Doctoral thesis, Universitat de Barcelona, 2021. http://hdl.handle.net/10803/673257.

Full text

Abstract:

This doctoral thesis raises the idea that 3D printing can change the paradigm of radio- frequency electronics, which has been traditionally developed mainly conceiving planar topologies. A review on additive manufacturing and the different existing technologies is reported. To focus on the concerning topic, several applications of 3D-printed electronics in the RF field are collected to elaborate the State-of-the-Art. The main objectives of this project is to develop a 3D manufacturing technology for RF electronics passive components and circuits and to generate innovative research about the po

APA, Harvard, Vancouver, ISO, and other styles

6

Mannerbro, Richard, and Martin Ranlöf. "Inkjet and Screen Printed Electrochemical Organic Electronics." Thesis, Linköping University, Department of Electrical Engineering, 2007. http://urn.kb.se/resolve?urn=urn:nbn:se:liu:diva-8117.

Full text

Abstract:

<p>Linköpings Universitet och Acreo AB i Norrköping bedriver ett forskningssamarbete rörande organisk elektrokemisk elektronik och det man kallar papperselektronik. Målet på Acreo är att kunna trycka denna typ av elektronik med snabba trycktekniker så som offset- eller flexotryck. Idag görs de flesta demonstratorer och prototyper, baserade på denna typ av elektrokemisk elektronik, med manuella och subtraktiva mönstringsmetoder. Det skulle vara intressant att hitta fler verktyg och automatiserade tekniker som kan underlätta detta arbete. Målet med detta examensarbete har varit att utvärdera vil

APA, Harvard, Vancouver, ISO, and other styles

7

Ogunjimi, A. O. "Finite element modelling of the thermal effects of the manufacturing process on the quality of electronics interconnection." Thesis, Loughborough University, 1994. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.261299.

Full text

APA, Harvard, Vancouver, ISO, and other styles

8

Chada, Arun Reddy. "Modeling of vias and via arrays in high speed printed circuit boards." Diss., Rolla, Mo. : Missouri University of Science and Technology, 2009. http://scholarsmine.mst.edu/thesis/pdf/Chada_09007dcc80704979.pdf.

Full text

Abstract:

Thesis (M.S.)--Missouri University of Science and Technology, 2009.<br>Vita. The entire thesis text is included in file. Title from title screen of thesis/dissertation PDF file (viewed November 16, 2009) Includes bibliographical references (p. 90-91).

APA, Harvard, Vancouver, ISO, and other styles

9

Li, Jing. "Evaluation and improvement of the robustness of a PCB pad in a lead-free environment." Diss., Online access via UMI:, 2007.

Find full text

Abstract:

Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Systems Science and Industrial Engineering, 2007.<br>Includes bibliographical references.

APA, Harvard, Vancouver, ISO, and other styles

10

Leung, Yun Yuen. "Performance models and fabrication of low cost radio frequency identification tags with printed antennas /." View abstract or full-text, 2008. http://library.ust.hk/cgi/db/thesis.pl?MECH%202008%20LEUNG.

Full text

APA, Harvard, Vancouver, ISO, and other styles

11

Yepez, Denisse E. "Analysis of a mechanical punching process to create registration holes on a continuous roll-to-roll flexible electronics substrates using SPC techniques." Diss., Online access via UMI:, 2008.

Find full text

Abstract:

Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Systems Science and Industrial Engineering, 2008.<br>Includes bibliographical references.

APA, Harvard, Vancouver, ISO, and other styles

12

Subbarayan, Guhan. "A systematic approach for selection of best PB-free printed circuit board (PCB) surface finish." Diss., Online access via UMI:, 2007.

Find full text

APA, Harvard, Vancouver, ISO, and other styles

13

Cook, Benjamin Stassen. "Vertical integration of inkjet-printed RF circuits and systems (VIPRE) for wireless sensing and inter/intra-chip communication applications." Diss., Georgia Institute of Technology, 2014. http://hdl.handle.net/1853/51844.

Full text

Abstract:

Inkjet-printing is a technology which has for the last decade been exploited to fabricate flexible RF components such as antennas and planar circuit elements. However, the limitations of feature size and single layer fabrication prevented the demonstration of compact, and high efficiency RF components operating above 10 GHz into the mm-Wave regime which is critical to silicon integration and fully-printed modules. To overcome these limitations, a novel vertically-integrated fully inkjet-printed process has been developed and characterized up to the mm-Wave regime which incorporates up to five

APA, Harvard, Vancouver, ISO, and other styles

14

Ortega, Tañá Laura. "Paper-based bateries as key enablers for self-powered conductivity sensing." Doctoral thesis, Universitat de Barcelona, 2021. http://hdl.handle.net/10803/671822.

Full text

Abstract:

This thesis presents the development of different self-powered devices that allow the conductivity measurement of liquid samples, from different types of water samples to biological fluids. The devices have been developed with the aim of offering robust single-use systems following the criteria dictated by the WHO for Point of Care (PoC) devices, the ASSURED criteria (Affordable, Sensitive, Specific, User-friendly, Rapid and robust , Without equipment and deliverable to end users). For the development of these devices, three technological drivers have been used, such as printed electronics, pa

APA, Harvard, Vancouver, ISO, and other styles

15

Agar, Joshua Carl. "Highly conductive stretchable electrically conductive composites for electronic and radio frequency devices." Thesis, Georgia Institute of Technology, 2011. http://hdl.handle.net/1853/44875.

Full text

Abstract:

The electronics industry is shifting its emphasis from reducing transistor size and operational frequency to increasing device integration, reducing form factor and increasing the interface of electronics with their surroundings. This new emphasis has created increased demands on the electronic package. To accomplish the goals to increase device integration and interfaces will undoubtedly require new materials with increased functionality both electrically and mechanically. This thesis focuses on developing new interconnect and printable conductive materials capable of providing power, ground

APA, Harvard, Vancouver, ISO, and other styles

16

Raut, Rahul. "Thermal management of heat sensitive components in Pb-free assembly." Diss., Online access via UMI:, 2005.

Find full text

APA, Harvard, Vancouver, ISO, and other styles

17

Fernández, Sanjuán Josep Maria. "Noves estructures LTCC i HTCC per a sensors de pressió capacitius i per a sensors lambda de tipus resistiu." Doctoral thesis, Universitat de Barcelona, 2013. http://hdl.handle.net/10803/134925.

Full text

Abstract:

La tecnologia thick film pot definir-se com el procés on es du a terme la creació de dipòsits de circuits impresos en un substrat de ceràmica rígida mitjançant la tècnica de la serigrafia. Les pastes que s’utilitzen per aquest propòsit es formulen amb l’addició de vidres i diferents òxids que promouen l’adhesió dels dipòsits generats al substrat a temperatures entre 600 i 950ºC. Per altra banda, la tecnologia ceràmica multicapa, permet una disposició densa de circuits impresos incorporant components interns en un únic dispositiu amb estructura multicapa monolítica. Els substrats ceràmics p

APA, Harvard, Vancouver, ISO, and other styles

18

Vishwanathan, Krishnan. "Process development and microstructural analysis of capacitor filter assemblies using lead free solder preforms." Diss., Online access via UMI:, 2007.

Find full text

Abstract:

Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Systems Science and Industrial Engineering, 2007.<br>Includes bibliographical references.

APA, Harvard, Vancouver, ISO, and other styles

19

Shah, Vatsal. "Pb-free process development and microstructural analysis of capacitor filter assemblies using solder preforms." Diss., Online access via UMI:, 2005.

Find full text

APA, Harvard, Vancouver, ISO, and other styles

20

Manuelli, Alessandro. "Influences of Printing Techniques on the Electrical Performances of Conjugated Polymers for Organic Transistors." Doctoral thesis, Universitätsbibliothek Chemnitz, 2007. http://nbn-resolving.de/urn:nbn:de:swb:ch1-200700044.

Full text

Abstract:

The discovery of conducting and semiconducting polymers has opened the possibility to produce integrated circuits entirely of plastic with standard continuous printing techniques. Nowadays several of this polymers are commercial available, however the performances of this materials are strongly affected by their supramolecular order achieved after deposition. In this research, the influence of some standard printing techniques on the electrical performances of conjugated polymers is evidenced in order to realise logic devices with these materials.

APA, Harvard, Vancouver, ISO, and other styles

21

Marquez, de Tino Ursula. "Reduction of nitrogen consumption of lead-free reflow processes and prediction models for behaviors of lead-free assemblies." Diss., Online access via UMI:, 2009.

Find full text

Abstract:

Thesis (Ph. D.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Systems Science and Industrial Engineering, 2009.<br>Includes bibliographical references.

APA, Harvard, Vancouver, ISO, and other styles

22

Ahmed, Ahmed Sabry Eltaher. "High-performance cooling of power semiconductor devices embedded in a printed circuit board." Electronic Thesis or Diss., Lyon, INSA, 2024. http://www.theses.fr/2024ISAL0100.

Full text

Abstract:

L'intégration de dispositifs semi-conducteurs de puissance dans un circuit imprimé (PCB) est une solution prometteuse pour réduire les éléments parasites des circuits, simplifier le packaging des dispositifs et réduire les coûts. Cependant, la réduction continue de la taille des puces semi-conductrices, combinée à la faible conductivité thermique des couches diélectriques des PCB nécessitent des solutions de gestion thermique plus efficaces. Les solutions de gestion thermique et de refroidissement doivent offrir une faible résistance thermique entre la jonction de la puce et son environnement,

APA, Harvard, Vancouver, ISO, and other styles

23

Pascal, Yoann. "Étude multicritère pour l'enfouissement partiel ou total de convertisseurs d'électronique de puissance dans un circuit imprimé." Thesis, Université Paris-Saclay (ComUE), 2019. http://www.theses.fr/2019SACLN038/document.

Full text

Abstract:

Les travaux présentés dans ce manuscrit traitent de l’enfouissement dans un circuit imprimé de convertisseurs de puissance, paradigme visant l’insertion de composants électroniques au sein du circuit imprimé.Une structure simple et économique de composant inductif enfoui, pouvant être employé comme inductance, coupleur, ou résonateur monolithique, est tout d’abord décrite. Un modèle analytique complet est développé. Des prototypes sont réalisés, validant le modèle et démontrant l’intérêt de la topologie.L’agencement des composants de puissance constituant une cellule de commutation est ensuite

APA, Harvard, Vancouver, ISO, and other styles

24

Eben-Chaime, Moshe. "The physical design of printed circuit boards : a mathematical programming approach." Diss., Georgia Institute of Technology, 1989. http://hdl.handle.net/1853/25505.

Full text

APA, Harvard, Vancouver, ISO, and other styles

25

Wood, Matthew. "Analysis of near fields and radiation of a printed circuit via hole." University of Western Australia. School of Electrical, Electronic and Computer Engineering, 2008. http://theses.library.uwa.edu.au/adt-WU2009.0053.

Full text

Abstract:

Electromagnetic compatibility remains an important topic in the design and manufacturing of printed circuit boards (PCBs). Compatibility of these devices with their surroundings is becoming increasingly difficult as a modern PCB can have hundreds or thousands of parts, operating on many layers, and all at high speed. One such part is a via and its clearance, or via hole, commonly required in multilayer circuits where vertical connections between layers are used. The via hole may be exposed to large electromagnetic fields within the PCB. Although electrically small, the via hole provides a path

APA, Harvard, Vancouver, ISO, and other styles

26

Shina, Sammy G. "A design quality and cost model for printed circuit board assembly /." Thesis, Connect to Dissertations & Theses @ Tufts University, 1998.

Find full text

Abstract:

Thesis (Ph.D.)--Tufts University, 1998.<br>Adviser: Anil Saigal. Submitted to the Dept. of Mechanical Engineering. Includes bibliographical references. Access restricted to members of the Tufts University community. Also available via the World Wide Web;

APA, Harvard, Vancouver, ISO, and other styles

27

Gaitis, Alexandre. "Etude et développement de diélectriques avancés pour des transistors imprimés low-voltage." Thesis, Université Grenoble Alpes (ComUE), 2019. http://www.theses.fr/2019GREAT032.

Full text

Abstract:

Cette thèse s'articule autour de l'étude des diélectriques à haute permittivité et de leur implémentation dans la structure des transistors organiques afin de proposer une solution pour réduire leurs tensions de fonctionnement tout en restant compatible avec des processus de fabrication par impression.La première partie cette thèse se concentre sur la théorie des semi-conducteurs et transistors organiques ainsi que les différentes approches de réduction de tensions proposées dans la littérature.Elle se focalisera ensuite sur l'étude des propriétés diélectriques de matériaux polymère à haute pe

APA, Harvard, Vancouver, ISO, and other styles

28

Stiteler, Michael Ross. "An automated system for measuring PWB/PWBA warpage during simulation of the infrared reflow and wave soldering processes, and during operational thermal cycling." Thesis, Georgia Institute of Technology, 1996. http://hdl.handle.net/1853/17099.

Full text

APA, Harvard, Vancouver, ISO, and other styles

29

Reuter, Kay. "Elektrostatische Aufladung organischer Feldeffekttransistoren zur Verbesserung von gedruckten Schaltungen." Doctoral thesis, Universitätsbibliothek Chemnitz, 2012. http://nbn-resolving.de/urn:nbn:de:bsz:ch1-qucosa-91992.

Full text

Abstract:

Topic of the thesis is the production of unipolar digital circuits by means of mass-printing technologies. For this purpose accumulation-mode and depletion-mode field-effect transistors have been used. To realize depletion-mode field-effect transistors charges are injected and stored in the gate-dielectric. Consequently, the charge transport on the semiconductor-dielectric interface is influenced and the threshold voltage can be controlled. To inject charges into the dielectric different technologies have been used and will be discussed in terms of their process parameters. Finally, fully-prin

APA, Harvard, Vancouver, ISO, and other styles

30

Radojicic, Marko L. M. "Aspects of electromagnetic interference on printed circuit boards." Thesis, University of Ottawa (Canada), 1990. http://hdl.handle.net/10393/5873.

Full text

Abstract:

General guidelines for the design of printed circuit boards have been developed for two important aspects of electromagnetic compatibility: cross-talk and radiated emissions. Numerical methods were used to study the cross-talk between tracks of several common printed circuit board technologies. Design recommendations are suggested that minimize the cross-talk on printed circuit boards. A simple model was developed to predict radiated emissions from complicated circuits on printed circuit boards. The concepts of ground impedance and common-mode currents were used to build a model which gives fa

APA, Harvard, Vancouver, ISO, and other styles

31

Mabe, Nuala Anne. "Information system design for PCB registration process control." Diss., Online access via UMI:, 2007.

Find full text

Abstract:

Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Systems Science and Industrial Engineering, 2007.<br>Includes bibliographical references.

APA, Harvard, Vancouver, ISO, and other styles

32

Bapu, Vijay Madhukar. "Eliminating package resonances in printed circuit boards over wide frequency band." Diss., Online access via UMI:, 2004. http://wwwlib.umi.com/dissertations/fullcit/1424171.

Full text

APA, Harvard, Vancouver, ISO, and other styles

33

Hickam, James William III 1956. "Paperless planning in printed circuit board manufacturing." Thesis, The University of Arizona, 1990. http://hdl.handle.net/10150/277250.

Full text

Abstract:

One of the aspects of Computer Integrated Manufacturing is the ability to provide current work instructions to the operator at their workstation on a terminal or graphic monitor. The problem is, today, paperless planning is displayed to the operator one page at a time, making the operator report the completion or not completion of that task before showing the next page. This allows the operator no freedom of choice in how to do the job, which leads to reduced productivity and quality. A possible solution is presented by structuring the planning instructions and enhancing the workstation. The o

APA, Harvard, Vancouver, ISO, and other styles

34

Ellis, Kimberly Paige. "Analysis of setup management strategies in electronic assembly systems." Diss., Georgia Institute of Technology, 1996. http://hdl.handle.net/1853/30757.

Full text

APA, Harvard, Vancouver, ISO, and other styles

35

Vishnubhotla, Phanilatha Carleton University Dissertation Engineering Electronics. "Transient thermal analysis of printed circuit boards and electronic packages." Ottawa, 1996.

Find full text

APA, Harvard, Vancouver, ISO, and other styles

36

Tong, Xin. "Simplified equivalent modelling of electromagnetic emissions from printed circuit boards." Thesis, University of Nottingham, 2010. http://eprints.nottingham.ac.uk/11301/.

Full text

Abstract:

Characterization of electromagnetic emissions from printed circuit boards (PCBs) is an important issue in electromagnetic compatibility (EMC) design and analysis of modern electronic systems. This thesis is focused on the development of a novel modelling and characterization methodology for predicting the electromagnetic emissions from PCBs in both free space and closed environment. The basic idea of this work is to model the actual PCB radiating source with a dipole-based equivalence found from near-field scanning. A fully automatic near-field scanning system and scanning methodology are deve

APA, Harvard, Vancouver, ISO, and other styles

37

Stimpson, Curtis Bruce. "The influence of the boundary condition in board-level drop testing and modeling techniques." Diss., Online access via UMI:, 2006.

Find full text

APA, Harvard, Vancouver, ISO, and other styles

38

Leal, James Andrew 1963. "Automated radiographic inspection of through-hole electronic circuit board solder defects." Thesis, The University of Arizona, 1988. http://hdl.handle.net/10150/276672.

Full text

Abstract:

A study has been carried out to investigate the use of "real-time" radiography as a method of automated inspection of through-hole electronic circuit board solder joints. By evaluating five major solder defects it has been found that film radiography employing high contrast film results in a definite distinction between a good solder joint and a defective solder joint. The same five defects were also found to be distinguishable from a good solder joint when evaluated by a real-time radiographic inspection unit using digital image processing. Although the type of defect being investigated was n

APA, Harvard, Vancouver, ISO, and other styles

39

Bent, Westin R. "Evaluating the effect of conformal coatings in reducing the rate of conductive anodic filament." Thesis, Georgia Institute of Technology, 1999. http://hdl.handle.net/1853/20128.

Full text

APA, Harvard, Vancouver, ISO, and other styles

40

Cocchini, Matteo. "Via transition modeling and charge replenishment of the power delivery network in multilayer PCBs." Diss., Rolla, Mo. : Missouri University of Science and Technology, 2008. http://scholarsmine.mst.edu/thesis/pdf/Cocchini_09007dcc805051ee.pdf.

Full text

Abstract:

Thesis (M.S.)--Missouri University of Science and Technology, 2008.<br>Vita. The entire thesis text is included in file. Title from title screen of thesis/dissertation PDF file (viewed May 27, 2008) Includes bibliographical references.

APA, Harvard, Vancouver, ISO, and other styles

41

Vardanyan, Konstantin. "A Low Cost Time Domain Reflectometry Circuit for printed Electronic Applications." Thesis, KTH, Material- och nanofysik, 2013. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-143197.

Full text

APA, Harvard, Vancouver, ISO, and other styles

42

McCalib, David Jr. "Design method of a modular electronic printed circuit board testing system." Thesis, Massachusetts Institute of Technology, 2013. http://hdl.handle.net/1721.1/85790.

Full text

Abstract:

Thesis: M. Eng. in Manufacturing, Massachusetts Institute of Technology, Department of Mechanical Engineering, 2013.<br>Cataloged from PDF version of thesis.<br>Includes bibliographical references (pages 52-54).<br>The failure rate of the printed circuit board electronic testing process is higher than acceptable at a Lenze Americas factory. This thesis will understand the root causes of failure, and use system engineering methods to decide what course of action should be taken. A Tradespace analysis is used to help decompose some of the complexity into a visualization that simplifies the decis

APA, Harvard, Vancouver, ISO, and other styles

43

Lee, Chun-ming Angus. "Reduction of electromagnetic interference due to electric field coupling on printed circuit board /." Hong Kong : University of Hong Kong, 2001. http://sunzi.lib.hku.hk/hkuto/record.jsp?B23501674.

Full text

APA, Harvard, Vancouver, ISO, and other styles

44

Reuter, Kay. "Elektrostatische Aufladung organischer Feldeffekttransistoren zur Verbesserung von gedruckten Schaltungen." Doctoral thesis, Universitätsverlag der Technischen Universität Chemnitz, 2011. https://monarch.qucosa.de/id/qucosa%3A19751.

Full text

Abstract:

Topic of the thesis is the production of unipolar digital circuits by means of mass-printing technologies. For this purpose accumulation-mode and depletion-mode field-effect transistors have been used. To realize depletion-mode field-effect transistors charges are injected and stored in the gate-dielectric. Consequently, the charge transport on the semiconductor-dielectric interface is influenced and the threshold voltage can be controlled. To inject charges into the dielectric different technologies have been used and will be discussed in terms of their process parameters. Finally, fully-prin

APA, Harvard, Vancouver, ISO, and other styles

45

Li, Weiping. "Large-area, low-cost via formation and metallization in multilayer thin film interconnection on Printed Wiring Boards (PWB)." Diss., Georgia Institute of Technology, 1999. http://hdl.handle.net/1853/19641.

Full text

APA, Harvard, Vancouver, ISO, and other styles

46

Strusevich, Nadezhda. "Numerical modelling of electrodeposition process for printed circuit boards manufacturing." Thesis, University of Greenwich, 2013. http://gala.gre.ac.uk/10214/.

Full text

Abstract:

Printed circuit boards (PCBs) are used extensively in electronic products to connect assembled components within a system. The so-called vertical interconnect access (via) is a vertical hole or cavity in the PCB filled with metal to facilitate conductivity. The current trend, particularly for high technology products (e.g., 3D packaging), is to manufacture PCBs with high aspect ratio (AR) vias. Typically, the size of such a via is at the micrometer scale (this is why they are termed micro-vias). The most widely used technique for manufacturing micro-vias is electrodeposition of metal (e.g., co

APA, Harvard, Vancouver, ISO, and other styles

47

Lee, Chun-ming Angus, and 李俊明. "Reduction of electromagnetic interference due to electric field coupling on printed circuit board." Thesis, The University of Hong Kong (Pokfulam, Hong Kong), 2001. http://hub.hku.hk/bib/B29957709.

Full text

APA, Harvard, Vancouver, ISO, and other styles

48

Wong, Ee Hua. "A study on the mechanics of electronic interconnection subjected to mechanical shock and impact loading." Thesis, The University of Sydney, 2006. https://hdl.handle.net/2123/28181.

Full text

Abstract:

Over the last few years, there has been increasing failure of the solder interconnections between the IC package and the printed circuit board (PCB) — generally referred to as board level interconnection — when subjected to mechanical shock such as the drop-impact of a portable electronic portable. The IC packaging industries are searching earnestly for a comprehensive solution to the problem. In this thesis project, a systematic approach has been adopted to first develop a fundamental understanding of the mechanics of shock impact on the PCB assembly and the mechanics of failure on th

APA, Harvard, Vancouver, ISO, and other styles

49

Agrawal, Akash. "Board level energy comparison and interconnect reliability modeling under drop impact." Diss., Online access via UMI:, 2009.

Find full text

Abstract:

Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Mechanical Engineering, 2009.<br>Includes bibliographical references.

APA, Harvard, Vancouver, ISO, and other styles

50

Ready, William Judson IV. "Factors which enhance conductive anodic filament (CAF) formation." Thesis, Georgia Institute of Technology, 1997. http://hdl.handle.net/1853/19682.

Full text

APA, Harvard, Vancouver, ISO, and other styles

We offer discounts on all premium plans for authors whose works are included in thematic literature selections. Contact us to get a unique promo code!