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Journal articles on the topic 'Electronics - Circuits - Printed'

Author: Grafiati

Published: 4 June 2021

Last updated: 28 July 2025

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1

Kim, TaeWoong, and SoYoung Kim. "Electronic design automation requirements for R2R printing foundry." Flexible and Printed Electronics 7, no. 1 (2022): 013001. http://dx.doi.org/10.1088/2058-8585/ac4d3d.

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Abstract Roll-to-roll (R2R) printed electronic devices have been in the spotlight over the decades as a potential replacement for Si-based semiconductors, research into this technology is still being actively conducted over the world. These printed electronic devices can be used in a variety of applications, so the demand for them is expected to reach over USD 20.7 billion in 2025 given a compound annual growth rate (CAGR) of 21.5%. As the new ink materials and printing technologies being researched are commercialized, foundry companies that produce printed electronics need to provide appropri

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2

Chen, Sen, and Jing Liu. "Liquid metal printed electronics towards ubiquitous electrical engineering." Japanese Journal of Applied Physics 61, SE (2022): SE0801. http://dx.doi.org/10.35848/1347-4065/ac5761.

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Abstract Conventional electronic manufacturers are generally not easily accessible due to complicated procedures, time, material and energy consuming, and may generate potential pollution to the environment. From an alternative, liquid metal printed electronics to quickly fabricate electronic circuits and functional devices were proposed a decade before. To promote the further development and application of liquid metal printed electronics, this review aims to summarize and analyze the progress of liquid metal printed electronics from three aspects, namely electronic inks, printing technology

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Clemens, W., W. Fix, J. Ficker, A. Knobloch, and A. Ullmann. "From polymer transistors toward printed electronics." Journal of Materials Research 19, no. 7 (2004): 1963–73. http://dx.doi.org/10.1557/jmr.2004.0263.

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Printed organic circuits have the potential to revolutionize the spread of electronic applications. This will be enabled by inexpensive and fast fabrication with printing techniques using soluble organic materials. Two main challenges have to be mastered on the way towards printed electronics. First, the development of stable transistors and an adapted chip design for organic materials, and second, the development of a reliable fabrication process. We present our results on high performance polymer transistors, mainly based on poly-3alkylthiophene (P3AT) as semiconducting material. Fast circui

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Podsiadły, Bartłomiej, Liubomir Bezgan, and Marcin Słoma. "3D Printed Electronic Circuits from Fusible Alloys." Electronics 11, no. 22 (2022): 3829. http://dx.doi.org/10.3390/electronics11223829.

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This work aims to evaluate the possibility of fabricating conductive paths for printed circuit boards from low-temperature melting metal alloys on low-temperature 3D printed substrates and mounting through-hole electronic components using the fused deposition modeling for metals (FDMm) for structural electronics applications. The conductive materials are flux-cored solder wires Sn60Pb40 and Sn99Ag0.3Cu0.7. The deposition was achieved with a specially adapted nozzle. A comparison of solder wires with and without flux cores is discussed to determine whether the solder alloys exhibit adequate wet

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Yu, Yan. "Material Selection and Design Methods for Flexible RFID Tag Antenna." IETI Transactions on Data Analysis and Forecasting (iTDAF) 2, no. 3 (2024): 38–49. http://dx.doi.org/10.3991/itdaf.v2i3.51975.

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In recent years, advancements in flexible printed electronics have significantly propelled the development of wearable devices, especially in areas of integration, comfort, and streamlined manufacturing. By incorporating electronic components and conductive coatings onto flexible substrates, circuits gain enhanced flexibility and some degree of stretchability. Among these circuits, radio frequency identification (RFID) tag antennas have emerged as a focal point in wearable device communication due to their adaptability in power selection and their compatibility with printed circuit technologie

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Habboush, Shayma, Sara Rojas, Noel Rodríguez, and Almudena Rivadeneyra. "The Role of Interdigitated Electrodes in Printed and Flexible Electronics." Sensors 24, no. 9 (2024): 2717. http://dx.doi.org/10.3390/s24092717.

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Flexible electronics, also referred to as printable electronics, represent an interesting technology for implementing electronic circuits via depositing electronic devices onto flexible substrates, boosting their possible applications. Among all flexible electronics, interdigitated electrodes (IDEs) are currently being used for different sensor applications since they offer significant benefits beyond their functionality as capacitors, like the generation of high output voltage, fewer fabrication steps, convenience of application of sensitive coatings, material imaging capability and a potenti

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Sawamura, Fumiya, Chen Yi Ngu, Raiki Hanazaki, et al. "Dry Printing of Ag–Ni Conductive Particles Using Toner-Type Printed Electronics." Applied Sciences 12, no. 19 (2022): 9616. http://dx.doi.org/10.3390/app12199616.

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Printed electronics are a set of additive manufacturing methods for creating future flexible electronics on thin polymeric sheets. We proposed the toner-type, dry, page-printing of Ag–Ni composite conductive particles on flexible plastic sheets without pre-treatment. No chemical solvents are necessary to compose the inks of the electronic materials used for the toner-type printing, and no chemical treatment is required for the plastic film substrate surface. In addition, multilayer printing is simple when using toner printing because previously printed materials do not need to be resolved; fur

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Jaafar, Ahmad, Spyridon Schoinas, and Philippe Passeraub. "Pad-Printing as a Fabrication Process for Flexible and Compact Multilayer Circuits." Sensors 21, no. 20 (2021): 6802. http://dx.doi.org/10.3390/s21206802.

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The purpose of this paper is to present a newly developed process for the fabrication of multilayer circuits based on the pad-printing technique. Even though the maturity level, in terms of accuracy, substrate type and print size of several printing industrial processes is relatively high, the fabrication complexity of multilayer printed electronics remains relatively high. Due to its versatility, the pad-printing technique allows the superposition of printed conductive and insulating layers. Compared to other printing processes, its main advantage is the ability to print on various substrates

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Jaafar, Ahmad, Spyridon Schoinas, and Philippe Passeraub. "Pad-Printing as a Fabrication Process for Flexible and Compact Multilayer Circuits." Sensors 21, no. 20 (2021): 6802. http://dx.doi.org/10.3390/s21206802.

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The purpose of this paper is to present a newly developed process for the fabrication of multilayer circuits based on the pad-printing technique. Even though the maturity level, in terms of accuracy, substrate type and print size of several printing industrial processes is relatively high, the fabrication complexity of multilayer printed electronics remains relatively high. Due to its versatility, the pad-printing technique allows the superposition of printed conductive and insulating layers. Compared to other printing processes, its main advantage is the ability to print on various substrates

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Verdingovas, Vadimas, Salil Joshy, Morten Stendahl Jellesen, and Rajan Ambat. "Analysis of surface insulation resistance related failures in electronics by circuit simulation." Circuit World 43, no. 2 (2017): 45–55. http://dx.doi.org/10.1108/cw-09-2016-0040.

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Purpose The purpose of this study is to show that the humidity levels for surface insulation resistance (SIR)-related failures are dependent on the type of activators used in no-clean flux systems and to demonstrate the possibility of simulating the effects of humidity and contamination on printed circuit board components and sensitive parts if typical SIR data connected to a particular climatic condition are available. This is shown on representative components and typical circuits. Design/methodology/approach A range of SIR values obtained on SIR patterns with 1,476 squares was used as input

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Andersson, Henrik, Pavol Šuly, Göran Thungström, et al. "PEDOT: PSS Thermoelectric Generators Printed on Paper Substrates." Journal of Low Power Electronics and Applications 9, no. 2 (2019): 14. http://dx.doi.org/10.3390/jlpea9020014.

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Flexible electronics is a field gathering a growing interest among researchers and companies with widely varying applications, such as organic light emitting diodes, transistors as well as many different sensors. If the circuit should be portable or off-grid, the power sources available are batteries, supercapacitors or some type of power generator. Thermoelectric generators produce electrical energy by the diffusion of charge carriers in response to heat flux caused by a temperature gradient between junctions of dissimilar materials. As wearables, flexible electronics and intelligent packagin

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Futera, Konrad, Konrad Kielbasinski, Anna Młozniak, and Malgorzata Jakubowska. "Inkjet printed microwave circuits on flexible substrates using heterophase graphene based inks." Soldering & Surface Mount Technology 27, no. 3 (2015): 112–14. http://dx.doi.org/10.1108/ssmt-04-2015-0013.

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Purpose – The purpose of this paper is to present the result of research on a new fabrication technology of printed circuits board and electronics modules. The new method is based on inkjet printing technique on flexible substrates using new generations of heterophase inks. New fabrications method was used to print microwave waveguides and signal splitters as new technology demonstrators. Design/methodology/approach – A fully Inkjet printed filter was printed on a flexible, transparent Kapton foil using heterophase inks developed in Instytut Technologii Materiałów Elektronicznych (ITME) for th

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Dembowski, Dawid, and Marcin Słoma. "Powder Bed Approach to 3D Printing of Structural Electronic Circuits." Electronics 12, no. 14 (2023): 3088. http://dx.doi.org/10.3390/electronics12143088.

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The purpose of this study is to research the possibility of producing structural electronics with the powder bed Binder Jetting (BJ) technique. The adaptation of the BJ ZPrinter 450 printer for the deposition of silver nanoparticle inks and the fabrication of conductive paths using commercially available consumables was successfully carried out. The research included testing the influence of different orientations of the printed substrates for the conductive paths and also checking the dependence of the resistance on a number of printed nanoparticle ink layers. First, the measured average resi

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Silvestre, Rocío, Raúl Llinares Llopis, Laura Contat Rodrigo, Víctor Serrano Martínez, Josué Ferri, and Eduardo Garcia-Breijo. "Low-Temperature Soldering of Surface Mount Devices on Screen-Printed Silver Tracks on Fabrics for Flexible Textile Hybrid Electronics." Sensors 22, no. 15 (2022): 5766. http://dx.doi.org/10.3390/s22155766.

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The combination of flexible-printed substrates and conventional electronics leads to flexible hybrid electronics. When fabrics are used as flexible substrates, two kinds of problems arise. The first type is related to the printing of the tracks of the corresponding circuit. The second one concerns the incorporation of conventional electronic devices, such as integrated circuits, on the textile substrate. Regarding the printing of tracks, this work studies the optimal design parameters of screen-printed silver tracks on textiles focused on printing an electronic circuit on a textile substrate.

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Erozan, Ahmet Turan, Dennis D. Weller, Yijing Feng, Gabriel Cadilha Marques, Jasmin Aghassi-Hagmann, and Mehdi B. Tahoori. "A Printed Camouflaged Cell Against Reverse Engineering of Printed Electronics Circuits." IEEE Transactions on Very Large Scale Integration (VLSI) Systems 28, no. 11 (2020): 2448–58. http://dx.doi.org/10.1109/tvlsi.2020.3022776.

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Jansson, E., A. Korhonen, M. Hietala, and T. Kololuoma. "Development of a full roll-to-roll manufacturing process of through-substrate vias with stretchable substrates enabling double-sided wearable electronics." International Journal of Advanced Manufacturing Technology 111, no. 11-12 (2020): 3017–27. http://dx.doi.org/10.1007/s00170-020-06324-4.

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AbstractIn the recent years, there has been a growing interest towards printed stretchable electronics used in diagnostics, health-monitoring, and wearable applications. Double-sided electronic circuits with through-substrate vias offer a solution where the amount of printed circuitry and assembled SMDs (surface-mount devices) in direct contact with the human skin can be minimized. This improves not only the wearability and cost-effectiveness of the printed electronic devices but also the product safety and comfort to wear. Another factor decreasing the unit costs in printed electronics is the

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Kim, Woojo, Jimin Kwon, and Sungjune Jung. "3D Integration of Flexible and Printed Electronics: Integrated Circuits, Memories, and Sensors." Journal of Flexible and Printed Electronics 2, no. 2 (2023): 199–210. http://dx.doi.org/10.56767/jfpe.2023.2.2.199.

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Printing technologies have received a lot of attention and expectations for producing flexible and wearable electronics. However, the low transistor density of the printed devices has been a major obstacle to commercialization. In this review, a three-dimensional (3D) integration of organic flexible and printed electronics is described. First, layout-to-bitmap conversion and design rules for printed transistors, arrays, and integrated circuits are introduced. Then, printed 3D transistors, digital integrated circuits, and memories are described. Finally, 3D integration of printed active-matrix

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Liang, Shuting, Xingyan Chen, Fengjiao Li, and Na Song. "Laser-Engraved Liquid Metal Circuit for Wearable Electronics." Bioengineering 9, no. 2 (2022): 59. http://dx.doi.org/10.3390/bioengineering9020059.

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Conventional patterning methods for producing liquid metal (LM) electronic circuits, such as the template method, use chemical etching, which requires long cycle times, high costs, and multiple-step operations. In this study, a novel and reliable laser engraving micro-fabrication technology was introduced, which was used to fabricate personalized patterns of LM electronic circuits. First, by digitizing the pattern, a laser printing technology was used to burn a polyethylene (PE) film, where a polydimethylsiloxane (PDMS) or paper substrate was used to produce grooves. Then, the grooves were fil

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Kim, Ernest M., and Thomas F. Schubert. "A low-cost design experience for junior-level electronics circuits laboratories through emulation of industry-printed circuit board design practice." International Journal of Electrical Engineering & Education 54, no. 3 (2016): 208–22. http://dx.doi.org/10.1177/0020720916673650.

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Over a 2-year period, printed circuit board layout design and test were included in the laboratory portion of the second of two junior-level electronic circuits courses. Printed circuit board design using industry-accepted board specifications and standard industry Gerber file export experience was developed. The students’ printed circuit board design experience emulated real-world situations and cost criteria. The instructor served as the fabricator in this model of the industrial design situation. Students individually used industry standard schematic capture and layout software to develop a

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Batalova, Karina V., Yana V. Chertkova, and Denis N. Katasonov. "HYBRID LASER SYSTEM FOR CREATING PRINTED ELECTRONICS." Interexpo GEO-Siberia 6 (May 21, 2021): 32–37. http://dx.doi.org/10.33764/2618-981x-2021-6-32-37.

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This article deals with the problem of printing current-conducting circuits on various substrates. The article provides an overview of modern technologies for solving this problem. The author describes a hybrid laser system that solves the problem under consideration. This device uses modern technologies and materials that show good results in research. A brief description of the software for preparing data for this system is also provided.

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Pimpolari, Lorenzo, Irene Brunetti, Riccardo Sargeni, et al. "Fully Printed and Flexible Schottky Diodes Based on Carbon Nanomaterials Operating Up to 5 MHz." IEEE JOURNAL ON FLEXIBLE ELECTRONICS 1, no. 3 (2022): 153–58. https://doi.org/10.1109/JFLEX.2022.3215928.

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The capability to fabricate printed and flexible energy harvesting and conditioning circuits, over a large area and with low-cost techniques, is crucial to enable flexible and wearable electronics. Carbon nanomaterials show excellent electrical, optical, chemical, and mechanical properties for printed electronics, offering low-cost, and large-area functionality on flexible substrates. In the past few years, many efforts have been dedicated to the fabrication of printed transistors made with carbon nanomaterials, but very few works have been dedicated to diodes, which are fundamental circuit el

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MUJAL, JORDI, ELOI RAMON, and JORDI CARRABINA. "METHODOLOGY AND TOOLS FOR INKJET PROCESS ABSTRACTION FOR THE DESIGN OF FLEXIBLE AND ORGANIC ELECTRONICS." International Journal of High Speed Electronics and Systems 20, no. 04 (2011): 829–42. http://dx.doi.org/10.1142/s0129156411007082.

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Inkjet printing is a promising and challenging technique that could potentially revolutionize large area and organic electronics fabrication. Inkjet systems are designed to construct devices and circuits drop by drop, which would lead to a new paradigm in electronics fabrication. However, inkjet technology for Printed Electronics is still under development and several challenges remain. While there is significant progress being made in the development of electronic devices, such as transistors or sensors, there is a lack of work on circuit and system level design. Designing devices and circuit

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He, Liang, Jarrid A. Wittkopf, Ji Won Jun, Kris Erickson, and Rafael Tico Ballagas. "ModElec." Proceedings of the ACM on Interactive, Mobile, Wearable and Ubiquitous Technologies 5, no. 4 (2021): 1–20. http://dx.doi.org/10.1145/3495000.

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Integrating electronics with highly custom 3D designs for the physical fabrication of interactive prototypes is traditionally cumbersome and requires numerous iterations of manual assembly and debugging. With the new capabilities of 3D printers, combining electronic design and 3D modeling workflows can lower the barrier for achieving interactive functionality or iterating on the overall design. We present ModElec---an interactive design tool that enables the coordinated expression of electronic and physical design intent by allowing designers to integrate 3D-printable circuits with 3D forms. W

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Zhang, Chuang, Chang-Ling Zou, Yan Zhao, et al. "Organic printed photonics: From microring lasers to integrated circuits." Science Advances 1, no. 8 (2015): e1500257. http://dx.doi.org/10.1126/sciadv.1500257.

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A photonic integrated circuit (PIC) is the optical analogy of an electronic loop in which photons are signal carriers with high transport speed and parallel processing capability. Besides the most frequently demonstrated silicon-based circuits, PICs require a variety of materials for light generation, processing, modulation, and detection. With their diversity and flexibility, organic molecular materials provide an alternative platform for photonics; however, the versatile fabrication of organic integrated circuits with the desired photonic performance remains a big challenge. The rapid develo

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Monne, Mahmuda Akter, Peter Mack Grubb, Harold Stern, Harish Subbaraman, Ray T. Chen, and Maggie Yihong Chen. "Inkjet-Printed Graphene-Based 1 × 2 Phased Array Antenna." Micromachines 11, no. 9 (2020): 863. http://dx.doi.org/10.3390/mi11090863.

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Low-cost and conformal phased array antennas (PAAs) on flexible substrates are of particular interest in many applications. The major deterrents to developing flexible PAA systems are the difficulty in integrating antenna and electronics circuits on the flexible surface, as well as the bendability and oxidation rate of radiating elements and electronics circuits. In this research, graphene ink was developed from graphene flakes and used to inkjet print the radiating element and the active channel of field effect transistors (FETs). Bending and oxidation tests were carried out to validate the a

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Li, Geng, Shang Wang, Jiayue Wen, et al. "A Manufacturing Method for High-Reliability Multilayer Flexible Electronics by Electrohydrodynamic Printing." Coatings 14, no. 5 (2024): 625. http://dx.doi.org/10.3390/coatings14050625.

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To meet the demand for higher performance and wearability, integrated circuits are developing towards having multilayered structures and greater flexibility. However, traditional circuit fabrication methods using etching and lamination processes are not compatible with flexible substrates. As a non-contact printing method in additive manufacturing, electrohydrodynamic printing possesses advantages such as environmental friendliness, sub-micron manufacturing, and the capability for flexible substrates. However, the interconnection and insulation of different conductive layers become significant

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Yang, Jun, and Jing Liu. "Direct printing and assembly of FM radio at the user end via liquid metal printer." Circuit World 40, no. 4 (2014): 134–40. http://dx.doi.org/10.1108/cw-07-2014-0029.

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Purpose – This paper aims to demonstrate the practicability of the liquid metal printer, developed in the authors’ laboratory, in the direct manufacture and assembly of circuit boards at the end customer side using GaIn24.5 alloy as printing ink at room temperature. Design/methodology/approach – A practical procedure for printing a real designed frequency modulation (FM) radio circuit on flexible and transparent substrate using liquid metal printer was established. Necessary electronic components are then assembled on this circuit board. To enhance the mechanical stability of the FM radio circ

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Zhou, Ying Mei, and Zhong Min Jiang. "Study of Hybrid Printing Based on Printed Electronics." Applied Mechanics and Materials 731 (January 2015): 316–20. http://dx.doi.org/10.4028/www.scientific.net/amm.731.316.

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With the development of technologies in printed electronics, they are perfect for low performance applications, such as displays, labels, clothing, and batteries. Flexible, electrical circuits can be printed using functional inks and printing methods, such as screen printing, gravure and inkjet. Uniform ink surface, smoothness, fine lines, and registration are keys in determining the capability of printed electronics. Screen mesh count, printing methods and emulsion thickness are all variables that are involved in screen printing and need to be quantified in order to determine optimal operatio

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Büttner, Dustin, Klaus Krüger, Beat Zobrist, Andreas Schönberger, and Dieter Jung. "Laser Printing of RFID Antenna Coils on Ceramic." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2011, CICMT (2011): 000295–301. http://dx.doi.org/10.4071/cicmt-2011-tha23.

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Printed electronics are a major field of activity in research and industrial applications nowadays, especially in thick-film technology. Within the last decade, large progress was made to digitally print electronic circuits, in order to supplement or replace the established screen printing technology. The advantage of digital printing is its capability to rapidly produce any layout desired at minimum space requirements. This highly flexible production method is especially applicable for prototyping and small series productions. Electrophotography, commonly known as laser printing, has been con

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Kostić, Miloš, Vladimir Kojić, Savo Ičagić, et al. "Design and Development of OECT Logic Circuits for Electrical Stimulation Applications." Applied Sciences 12, no. 8 (2022): 3985. http://dx.doi.org/10.3390/app12083985.

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This paper presents the first successful implementation of fully printed electronics for flexible and wearable smart multi-pad stimulation electrodes intended for use in medical, sports and lifestyle applications. The smart multi-pad electrodes with the electronic circuits based on organic electrochemical transistor (OECT)-based electronic circuits comprising the 3–8 decoder for active pad selection and high current throughput transistors for switching were produced by multi-layer screen printing. Devices with different architectures of switching transistors were tested in relevant conditions

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Podsiadły, Bartłomiej, Andrzej Skalski, and Marcin Słoma. "Soldering of Electronics Components on 3D-Printed Conductive Substrates." Materials 14, no. 14 (2021): 3850. http://dx.doi.org/10.3390/ma14143850.

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Rapid development of additive manufacturing and new composites materials with unique properties are promising tools for fabricating structural electronics. However, according to the typical maximum resolution of additive manufacturing methods, there is no possibility to fabricate all electrical components with these techniques. One way to produce complex structural electronic circuits is to merge 3D-printed elements with standard electronic components. Here, different soldering and surface preparation methods before soldering are tested to find the optimal method for soldering typical electron

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Jangid, Aditya R., E. Brandon Strong, Jacqueline Chuang, Andres W. Martinez, and Nathaniel W. Martinez. "Evaluation of commercially-available conductive filaments for 3D printing flexible circuits on paper." PeerJ Materials Science 4 (April 25, 2022): e21. http://dx.doi.org/10.7717/peerj-matsci.21.

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Three commercially-available conductive filaments were evaluated for 3D printing flexible circuits on paper. While all three filaments were printed successfully, the resulting conductive traces were found to have significantly different impedances when characterized by electrochemical impedance spectroscopy. Using a graphite-doped polylactic acid filament, the flexibility of paper-based conductive traces was evaluated, methods of integrating common electrical and electronic components with the conductive traces were demonstrated, and the resistive heating of the traces was characterized. The a

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Jangid, Aditya R., E. Brandon Strong, Jacqueline Chuang, Andres W. Martinez, and Nathaniel W. Martinez. "Evaluation of commercially-available conductive filaments for 3D printing flexible circuits on paper." PeerJ Materials Science 4 (April 25, 2022): e21. http://dx.doi.org/10.7717/peerj-matsci.21.

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Three commercially-available conductive filaments were evaluated for 3D printing flexible circuits on paper. While all three filaments were printed successfully, the resulting conductive traces were found to have significantly different impedances when characterized by electrochemical impedance spectroscopy. Using a graphite-doped polylactic acid filament, the flexibility of paper-based conductive traces was evaluated, methods of integrating common electrical and electronic components with the conductive traces were demonstrated, and the resistive heating of the traces was characterized. The a

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Chang, Joseph S., Antonio F. Facchetti, and Robert Reuss. "Guest Editorial Organic/Printed Electronics: A Circuits and Systems Perspective." IEEE Journal on Emerging and Selected Topics in Circuits and Systems 7, no. 1 (2017): 1–6. http://dx.doi.org/10.1109/jetcas.2017.2671038.

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Persons, Ryan, and Paul Gundel. "Print Copper on Ceramic for High Reliability Electronics." International Symposium on Microelectronics 2015, no. 1 (2015): 000330–35. http://dx.doi.org/10.4071/isom-2015-wp12.

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In the power electronics world, Direct Bonded Copper (DBC) is the primary substrate technology. In this paper, we will discuss an alternative technology utilizing screen printable copper pastes (Thick Printed Copper - TPC) on a variety of substrate technologies including Alumina (Al2O3) and Aluminum Nitride (AlN). These materials when processed, look and perform similar to DBC, but exhibit superior reliability and excellent design flexibility. DBC has drawbacks when it comes to thermal mechanical reliability and lacks the flexibility to have multiple copper thicknesses for power and signal cir

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Büttner, Dustin, Klaus Krüger, Beat Zobrist, Andreas Schönberger, and Dieter Jung. "Electrophotographic Printing of RFID Antenna Coils on Cofired and Postfired Ceramics." Journal of Microelectronics and Electronic Packaging 8, no. 2 (2011): 58–65. http://dx.doi.org/10.4071/imaps.290.

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Digitally printed electronics are a major field of activity in research and industrial applications nowadays, especially in thick-film technology. Within the last decade great progress has been made in print electronics toward the goal of supplementing or replacing the established screen printing technology. The advantage of digital printing is its capability for rapid production without any layout-specific tools (i.e., screens). This highly flexible production method is especially applicable for prototyping and small series productions. Electrophotography, commonly known as laser printing, ha

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Turok, I. "The Growth of an Indigenous Electronics Industry: Scottish Printed Circuit Boards." Environment and Planning A: Economy and Space 25, no. 12 (1993): 1789–813. http://dx.doi.org/10.1068/a251789.

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The growth and development of the Scottish printed circuits industry is examined in this paper. It is an unusual case of strong indigenous growth with limited foreign ownership. The sector produces a quarter of all UK sales of open-market printed circuit boards (PCBs) and employs 1800 people, 50% more than a decade ago. Its growth is explained in terms of four key interrelated factors: the special nature of PCB production, local demand conditions, the sector's organisational structure, and government support. The sector is best conceptualised as part of a wider division of labour within the re

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Narayanan, Alagusundari, and Dr Sivakumari Subramania Pillai. "A Novel Optimized Neural Network Model for Ink Selection in Printed Electronics." International Journal of Electrical and Electronics Research 11, no. 4 (2023): 1103–9. http://dx.doi.org/10.37391/ijeer.110430.

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The field of Printed Electronics (PE) is experiencing significant growth in the industrial sector and generating considerable interest across various industries due to its ability to produce intricate components. The functionality of printed electronic products heavily relies on the utilization of conductive ink during the printing process, which plays a vital role in developing flexible electronic circuits and improving the communicative functionalities of objects. Selecting the right ink for printing is crucial to meet consumer requirements. However, the conventional approach to this process

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Khodataeva, Tatiana Sergeevna, Nikolai Vladimirovich Kashirin, Alexandra Ivanovna Averina, and Artyom Evgenyevich Guryanov. "Approaches to the Development of a Printed Circuit Board Defect Detection System Based on AOI Technology." Proceedings of the Institute for System Programming of the RAS 35, no. 4 (2023): 109–20. http://dx.doi.org/10.15514/ispras-2023-35(4)-5.

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Some modern approaches to detecting defects in printed circuit boards based on automatic optical inspection are considered in order to design their own control system. The importance of the control process is growing in connection with the tightening of the requirements imposed by modern production processes. At the enterprises of mass production of electronics, attempts are being made to achieve high quality of all parts, assemblies and finished products. The optical inspection system is one of the most important tools for automating the visual inspection of printed circuits. In addition to e

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Riches, S. T., K. Cannon, C. Johnston, et al. "Application of High Temperature Electronics Packaging Technology to Signal Conditioning and Processing Circuits." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2010, HITEC (2010): 000089–96. http://dx.doi.org/10.4071/hitec-sriches-tp11.

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The requirement to install electronic power and control systems in high temperature environments has posed a challenge to the traditional limit of 125°C for high temperature exposure of electronics systems. The leap in operating temperature to above 200°C in combination with high pressures, vibrations and potentially corrosive environments means that different semiconductors, passives, circuit boards and assembly processes will be needed to fulfil the target performance specifications. Bare die mounted onto ceramic and insulated metal substrates can withstand higher temperatures than soldered

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-, Sushmitha D., and V. Swetha -. "Circuits for Printed Electronics for Flexible Displays & Sensors." International Journal For Multidisciplinary Research 6, no. 3 (2024). http://dx.doi.org/10.36948/ijfmr.2024.v06i03.20138.

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Printed circuits are crucial components in the field of printed electronics, enabling the creation of flexible, lightweight, and cost-effective electronic devices. This proposal explores the fabrication techniques, materials, and applications of printed circuits in printed electronics. Various printing methods such as inkjet, screen, and flexography are discussed, along with the integration of conductive inks and substrates. The versatility of printed circuits allows for the development of diverse electronic products including wearable sensors, RFID tags, and flexible displays. Moreover, advan

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Chalklen, Thomas, Michael Smith, and Sohini Kar-Narayan. "Improved fatigue resistance in transfer-printed flexible circuits embedded in polymer substrates with low melting temperatures." Flexible and Printed Electronics, May 10, 2023. http://dx.doi.org/10.1088/2058-8585/acd402.

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Abstract Flexible electronics are of great interest and importance due to their applications in a range of fields, from wearable electronics to solar cells. While resolutions of printed flexible electronics have been improving in recent years, there remain problems with mechanical fatigue and substrate cost, curtailing the use of such devices due to performance-related issues, and resulting in increased cost and waste products. Here we present a novel method for improving the fatigue resistance of printed flexible electronics by a factor of ~ 40 by sintering the electronic circuits prior to tr

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Mukherjee, Arka, Ahmed Hassan Gohar, Luis F. Centeno, et al. "Stretchable Printed Circuit Board Meets Stretchable Light Emitting Gallium Nitride." Journal of Engineering and Applied Sciences Technology, February 28, 2025, 1–7. https://doi.org/10.47363/jeast/2025(7)289.

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The human body is a dynamic three-dimensional soft entity. Metal lines in commercially available electronic devices are mechanically flexible yet insufficiently deformable, enabling rigid circuits with excellent electronic characteristics but limited compliance to mechanical stress. Future electronics need to be independent of rigid electronic components to adapt to anatomical movements. Recent interest in elastic printed circuit boards (E-PCB) has been enhanced by their potential applications in skin electronics, implant electronics, electronic bio-interfaces, electronic muscles, and stretcha

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Ren, Ping, and Jingyan Dong. "Electrohydrodynamic Printed Pedot:Pss/Graphene/Pva Circuits for Sustainable and Foldable Electronics." Advanced Materials Technologies, August 24, 2023. http://dx.doi.org/10.1002/admt.202301045.

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AbstractThe generation of electronic waste (e‐waste) poses a significant environmental challenge, necessitating strategies to extend electronics’ lifespan and incorporate eco‐friendly materials to enable their rapid degradation after disposal. Foldable electronics utilizing eco‐friendly materials offer enhanced durability during operation and degradability at the end of their life cycle. However, ensuring robust physical adhesion between electrodes/circuits and substrates during the folding process remains a challenge, leading to interface delamination and electronic failure. In this study, el

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Dr. Gaganpreet Kaur and Abhi Saxena. "Capacitive Inks for 3D Printed Electronics." Transdisciplinary Journal of Engineering & Science 15 (March 20, 2024). http://dx.doi.org/10.22545/2024/00250.

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The current revolution of Internet of Things (IoT) and smart homes cannot be possible if the cost of current sensors and circuitry is not reduced. In this work we present an effective conductive ink/paint by experimenting with various materials under different compositions and use this conductive paint for the fabrication of capacitive sensors in the electrical circuits. Additionally, the proposed capacitive ink used for printing the sensors offers a lot of flexibility and creativity in designing the circuits. The conductive paint can be used in wearables because of its unique advantage of bei

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Babatain, Wedyan, Christine Park, Hiroshi Ishii, and Neil Gershenfeld. "Laser‐Enabled Fabrication of Flexible Printed Electronics with Integrated Functional Devices." Advanced Science, March 4, 2025. https://doi.org/10.1002/advs.202415272.

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AbstractThe demand for flexible and printed electronics in wearable and soft robotics applications has increased the need for scalable, additive manufacturing processes. However, traditional printed circuit board manufacturing involves complex, multistep processes, is limited to certain substrates, and faces challenges in integrating functional devices. Here, an additive, laser‐enabled process is introduced for fabricating flexible, double‐sided printed electronics leveraging laser‐induced graphene (LIG) as a seed layer for selective copper electrodeposition (E‐LIG). This technique enables pre

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Stanley, Jessica, Phil Kunovski, John A. Hunt, and Yang Wei. "Stretchable electronic strips for electronic textiles enabled by 3D helical structure." Scientific Reports 14, no. 1 (2024). http://dx.doi.org/10.1038/s41598-024-61406-7.

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AbstractThe development of stretchable electronic devices is a critical area of research for wearable electronics, particularly electronic textiles (e-textiles), where electronic devices embedded in clothing need to stretch and bend with the body. While stretchable electronics technologies exist, none have been widely adopted. This work presents a novel and potentially transformative approach to stretchable electronics using a ubiquitous structure: the helix. A strip of flexible circuitry (‘e-strip’) is twisted to form a helical ribbon, transforming it from flexible to stretchable. A stretchab

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Skarżyński, Kacper, Jakub Krzemiński, Małgorzata Jakubowska, and Marcin Słoma. "Highly conductive electronics circuits from aerosol jet printed silver inks." Scientific Reports 11, no. 1 (2021). http://dx.doi.org/10.1038/s41598-021-97312-5.

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AbstractRecently, low-cost electronics printed on lightweight, flexible and 3D shaped substrates are gaining importance in the markets of wearables and smart packaging. However, printed electronics do not meet the electrical performance of subtractive techniques because the resistivity of metallic printed patterns is still much higher than that of bulk material. To fulfil this need, low-resistive and easy printable inks for high resolution printed electronics techniques are needed. In this work, parameters of silver nanoparticles ink for micro-scale printed electronics technique, Aerosol Jet P

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Taba, Adib, Aarsh Patel, and Masoud Mahjouri-Samani. "Dry Printing Fully Functional Eco-Friendly and Disposable Transient Papertronics." Flexible and Printed Electronics, August 19, 2024. http://dx.doi.org/10.1088/2058-8585/ad70c5.

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Abstract The demand for flexible printed electronics is growing fast, especially with the move toward the Internet of Things (IoT). These printed electrons are usually designed for short-term use, after which they are disposed of. The polymeric substrates used in printed electronics comprise the biggest portion of their non-biodegradable E-waste after their disposal. This paper demonstrates the feasibility of printing fully functional transient electronics on flexible, water-soluble, and biodegradable paper substrates using the dry printing approach. The in-situ generation and real-time sinter

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Lamport, Emily, Sai G. R. Avuthu, Si Chen, Javed Mapkar, and Alkim Akyurtlu. "Process Optimization of Additively Manufactured Conformal Temperature and Humidity Sensor for High-Temperature Applications." Journal of Microelectronics and Electronic Packaging 22, no. 1 (2025). https://doi.org/10.4071/001c.133286.

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Additive Manufacturing (AM) and Printed Electronics (PE) have recently seen widespread implementation in numerous technological applications. The shift towards manufacturing AM PE is largely due to the numerous benefits that AM offers compared to traditional manufacturing. Some of these benefits include the ability to rapidly prototype and the reduction of waste material compared to traditional manufacturing methods, and the ability to realize conformal circuits onto existing structures and substrates with varying form factors. In this work, an AM analog temperature and humidity sensor for hig

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