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Journal articles on the topic 'Electroplating industry'

Author: Grafiati

Published: 4 June 2021

Last updated: 1 February 2022

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1

Gore, Yogesh, and Awkash Kumar. "Air Quality Management for Electroplating Industry for Mumbai Metropolitan Region, Maharashtra—Air Quality Management for Electroplating Industry." Energy and Earth Science 3, no. 2 (2020): p36. http://dx.doi.org/10.22158/ees.v3n2p36.

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Electroplating is considered to be a major polluting industry because it discharges toxic materials and heavy metals through effluent like wastewater, air emissions and solid wastes. There are many registered electroplating units in Mumbai Metropolitan Region (MMR). The quantities of gaseous wastes generated from these industries were estimated and the existing control and treatment techniques for these gaseous wastes were evaluated. Further, Air Quality Modeling (AQM) study was also carried out to predict the concentration of acid mist with the help of emission, characteristics of stack and meteorology. A Gaussian plume model based SCREEN View software was used to predict concentrations for two industries which showed that the acid mist emissions from stack were under the consented limits. Further, health impact survey was performed at 1km radius of the industry to study the effects of air pollution on human health. It showed that 47%, 40% and 57% workers near the electroplating industries are suffering from chest pain, eye irritation and breathlessness respectively. Clustering of electroplating industries in the MMR will improve the waste management in the region. Installation of efficient air pollution control equipment like wet scrubbers can eliminate the hazards caused due to acid mist emissions from electroplating industries.

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2

Perelygin, Yuri P. "Some Environmental Problems in Electroplating Industry." Electroplating and Surface Treatment 26, no. 2 (2018): 57–61. http://dx.doi.org/10.47188/0869-5326_2018_26_2_57.

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3

Jhothiraman, Jivaan Kishore, and Rajesh Balachandran. "Electroplating: Applications in the Semiconductor Industry." Advances in Chemical Engineering and Science 09, no. 02 (2019): 239–61. http://dx.doi.org/10.4236/aces.2019.92018.

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4

Warren, K. A., and L. Ortolano. "Pollution prevention in China’s electroplating industry." Environmental Engineering and Policy 1, no. 1 (1998): 11–23. http://dx.doi.org/10.1007/s100220050002.

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5

Watanakul, Narin. "Stand-Alone Photovoltaic Based on In-Phase Voltage Injection for Electroplating Industry Factory." Advanced Materials Research 853 (December 2013): 306–11. http://dx.doi.org/10.4028/www.scientific.net/amr.853.306.

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This paper presents an application of stand-alone Photovoltaic (PV) systems for AC/DC power conversion for electroplating systems. In these control systems, the external source voltage is generated from a PV stand-alone, the proposed voltage injected method by in phase controller into line input voltage secondary of power transformer. The electroplating process is a capacity 0-250A maximum output system with uses a 12-pulse diode rectifier, using a conventional 3-phase bridge 6-pulse diode rectifier. The process voltage control to electroplating, that performance of the proposed series voltage controller method (producing injected voltage), contribute to voltage control by injecting or absorbing active power, to electroplating. The advantage of this principle will result the system that can saving energy 50% and compensation 100 percent during a power outage. The experimental, and simulation results by MATLAB program are used as a guideline for analyzing and designing the parameters of electroplating system.

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6

Kammel, Roland. "Challenges for saving water in electroplating industry." Journal of the Metal Finishing Society of Japan 38, no. 7 (1987): 273–78. http://dx.doi.org/10.4139/sfj1950.38.273.

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7

Snyder, Donald L. "Electroplating nickel/chromium for the automotive industry." Metal Finishing 95, no. 8 (1997): 29–30. http://dx.doi.org/10.1016/s0026-0576(97)82254-4.

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8

Neumann, Stefan. "Ion Exchange Resins in the Electroplating Industry." Metal Finishing 110, no. 2 (2012): 22–26. http://dx.doi.org/10.1016/s0026-0576(13)70111-9.

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9

Filonov, A. V., and O. A. Kireeva. "Prospects of Galvanic Sludge Recycling." Applied Mechanics and Materials 770 (June 2015): 709–13. http://dx.doi.org/10.4028/www.scientific.net/amm.770.709.

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The article analyzes galvanic sludge recycling methods; development prospects are outlined; recycling in the electroplating industry is considered in terms of environment protection. Actual methods of galvanic sludge reuse are systematized. The author suggests areas for development of less hazardous electroplating methods.

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10

Averina, Yu M., G. E. Kalyakina, V. V. Menshikov, Yu I. Kapustin, and V. S. Boldyrev. "Neutralisation Process Design for Electroplating Industry Wastewater Containing Chromium and Cyanides." Herald of the Bauman Moscow State Technical University. Series Natural Sciences, no. 84 (June 2019): 70–80. http://dx.doi.org/10.18698/1812-3368-2019-3-70-80.

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Manufacturing processes in the electroplating industry employ hazardous chemicals and generate hazardous waste, including hexavalent chromium compounds and heavy metal cyanides. We designed a reagent-based treatment technology that can remove these contaminants and is relatively simple to implement and maintain. The technology features low reagent consumption but high treatment efficiency and simplifies separating precipitates from the treated effluent. The paper presents a detailed description of how to neutralise electroplating shop wastewater. We propose a system of organizational and technological measures to improve chemical safety.

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11

Patil, Y. B., and K. M. Paknikar. "Biodetoxification of silver-cyanide from electroplating industry wastewater." Letters in Applied Microbiology 30, no. 1 (2000): 33–37. http://dx.doi.org/10.1046/j.1472-765x.2000.00648.x.

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12

Christie, I. R. "Future trends in electroplating for the electronics industry." Transactions of the IMF 64, no. 1 (1986): 47–51. http://dx.doi.org/10.1080/00202967.1986.11870733.

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13

Abou‐Elela, Sohair I., Hala M. El‐Kamah, and Hamdy I. Aly. "Waste minimization in the electroplating industry (case study)." International Journal of Environmental Studies 55, no. 4 (1998): 287–96. http://dx.doi.org/10.1080/00207239808711186.

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14

Vasilenko, T. A., M. P. Lamakina, and O. M. Brusnitsyna. "The Purification of Electroplating Industry Effluents with Agricultural Waste." Solid State Phenomena 284 (October 2018): 814–21. http://dx.doi.org/10.4028/www.scientific.net/ssp.284.814.

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The article suggests the usage of ash from sunflower husk combustion, which is constantly considered to be production waste, as a treating agent for electroplating industry wastewater purification. The chemical and mineral composition of ash waste has been researched by means of X-ray diffraction method with an X-ray fluorescent spectrometer. The structure of waste has been studied with a high-resolution scanning electron microscope. The ash contains calcium, magnesium and potassium oxides, so this waste can be used as a chemical treating agent in purifying water from heavy metals. The acid leaching of ash has been performed to determine the degree of its components transition. The trial purification of real electroplating wastes with the ash has been carried out. The purification efficiency for nickel and copper amounts to 62.0 and 48.0 % at the ash consumption 3.0 g/dm3.

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15

Arowolo, Matthew Oluwole, A. A. Adekunle, and A. O. Olusegun. "PARAMETERS AFFECTING QUALITATIVE AND EFFICIENT ELECTRODEPOSITION OF METALS IN AN ELECTROLYTIC CELL: A REVIEW." FUDMA JOURNAL OF SCIENCES 4, no. 2 (2020): 584–89. http://dx.doi.org/10.33003/fjs-2020-0402-190.

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Electroplating has been a useful practice in the laboratory and industry for a long time. Its usefulness is more profound in oil industries for corrosion prevention and control, automobile industry, jewelries and decoration. Today, the scope of electroplating has expanded considerably with many players exploring its advantages and optimizing its parameters for enhanced productivity. The paper presented a review of electroplating with the aim of making concise information available on its process parameters and its process optimization. The review was compiled from several major work which pertained to parameters affecting qualitative and efficient electrodeposition of metals in an electrolytic cell. Results gathered included actual effect of identified parameters and interplay of parameter on quality of electrodeposition and microstructure of deposited metal. Important recommendations were made to further enhance the practice of electrodeposition.

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16

Yang, Jian She, and Lian Jun Li. "Research on Electroplating Wastewater Treatment and Operation Effect in Jiangmen." Advanced Materials Research 765-767 (September 2013): 2904–7. http://dx.doi.org/10.4028/www.scientific.net/amr.765-767.2904.

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In this paper, I use the ion exchange method for treatment of electroplating heavy metal ions in waste water and I also use a single-stage rinsing and resin enrichment combined form of management, whose wastewater contains Cu2+, Cr6+and Ni2+. The process can ensure the cleaning quality, good treatment effect, which recovers the energy of nickel sulfate and copper sulfate and its returning rate reaches as 90%. That achieved the goal without discharge of nickel, copper, environment and economic benefits. Electroplating wastewater composition is very complicated, in addition to cyanide (CN-) wastewater and effluent. Wastewater with heavy metal electroplating is the potential harmful categories in the industry. According to the heavy metal wastewater containing heavy metal element classification, it can generally be divided into Cr containing nickel wastewater, wastewater containing cadmium (Ni), (Cd) wastewater, wastewater containing copper (Cu), zinc(Zn), gold(Au) from wastewater, wastewater containing silver(Ag). Electroplating wastewater treatment is widespread attention at home and abroad, which has various developed management technology and management of toxic to nontoxic, changing harmful wastewater into harmless water. Then we can recover those precious metals. Water recycling and other measures are helpful to eliminate and reduce the emission of heavy metals. With the rapid development of electroplating industry and increasing requirements of environmental protection, current electroplating wastewater treatment has begun to enter into the clean production process. According to total circular economy integration phase, the recycling of resources is the main development direction [1].

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17

Rizky, Hana Eka, and Jojok Mukono. "Levels of Chromium in Air with Chromium in the Blood of Workers Electroplating in Purbalingga." JURNAL KESEHATAN LINGKUNGAN 9, no. 2 (2018): 172. http://dx.doi.org/10.20473/jkl.v9i2.2017.172-180.

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Chromium (VI) is a form of chromium which commonly used in metal plating industry with engineering electroplating. The negative impacts for workers when contact with chromium are, skin irritation, nose, throat and lungs irritations. Research purposes are to describe the levels of chromium in the air and the blood of electroplating workers. This was an observational research design with cross sectional approach. Data analyzed by descriptive methods. Population of this research were electroplating workers of metal plating industry in Purbalingga. The samples were consisted of the respondents and environmental samples. The number of respondents were 8 workers which determinated purposive sampling methods. Environmental samples were obtained by measurements the levels of chromium in the air. The results showed that average level of chromium in the air 0.01 mg/m3. This level was appropriate to threshold limit value according to Peraturan Menteri Tenaga Kerja Dan Transmigrasi RI 13/MEN/X/2011. Most of electroplating workers (87.5%), had the high levels of chromium blood (1.7 μg/L) and exceeded the normal limit value. Metal coating business owners should regularly control the use of personal equipment for workers to reduce the exposure of chromium for them.

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18

Piccinini, Norberto, Gian Nicola Ruggiero, Giancarlo Baldi, and Angelo Robotto. "Risk of hydrocyanic acid release in the electroplating industry." Journal of Hazardous Materials 71, no. 1-3 (2000): 395–407. http://dx.doi.org/10.1016/s0304-3894(99)00089-8.

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19

Verma, Shiv Kumar, Vinita Khandegar, and Anil K. Saroha. "Removal of Chromium from Electroplating Industry Effluent Using Electrocoagulation." Journal of Hazardous, Toxic, and Radioactive Waste 17, no. 2 (2013): 146–52. http://dx.doi.org/10.1061/(asce)hz.2153-5515.0000170.

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20

Pearson, Trevor. "President's Address: The future of the European electroplating industry." Transactions of the IMF 83, no. 1 (2005): 2–4. http://dx.doi.org/10.1179/002029605x17729.

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21

Minyaum, Gu. "China's Treatment of Waste Gas from the Electroplating Industry." Filtration & Separation 29, no. 2 (1992): 133. http://dx.doi.org/10.1016/0015-1882(92)80038-k.

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22

Benvenuti, Tatiane, Marco Antonio Siqueira Rodrigues, Andréa Moura Bernardes, and Jane Zoppas-Ferreira. "Closing the loop in the electroplating industry by electrodialysis." Journal of Cleaner Production 155 (July 2017): 130–38. http://dx.doi.org/10.1016/j.jclepro.2016.05.139.

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23

Selvakumari, G., M. Murugesan, S. Pattabi, and M. Sathishkumar. "Treatment of Electroplating Industry Effluent Using Maize Cob Carbon." Bulletin of Environmental Contamination and Toxicology 69, no. 2 (2002): 195–202. http://dx.doi.org/10.1007/s00128-002-0047-0.

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24

Zagorc-Koncan, J., and M. Dular. "Evaluation of Toxicity in Receiving Streams." Water Science and Technology 26, no. 9-11 (1992): 2357–60. http://dx.doi.org/10.2166/wst.1992.0736.

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A laboratory river model for the study of self-purification inhibition in a stream containing toxic substances is presented. It enables an engineering - technological prediction of the impact of toxic substances or wastewaters on dissolved oxygen (DO) profile in an organically polluted river downstream from the point of entry of toxic effluent thus providing rapidly and inexpensively significant design information to an environmental scientist or engineer. The method was applied to the toxicity evaluation of wastewaters from electroplating industry. The effects of copper, cyanide (representing two significant constituents of this type of wastewaters) and wastewater from electroplating industry on the biodegradation of organic municipal pollution in receiving stream were evaluated experimentally.

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25

Sathvika, T., Akhil Raj Kumar Saraswathi, Vidya Rajesh, and N. Rajesh. "Confluence of montmorillonite and Rhizobium towards the adsorption of chromium(vi) from aqueous medium." RSC Advances 9, no. 49 (2019): 28478–89. http://dx.doi.org/10.1039/c9ra05528b.

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26

Sukarjo, Heribertus, and R. Soelarso Pani. "Pengaruh Variasi Kuat Arus Listrik dan Waktu Electroplating Nickel-Chrome terhadap Ketebalan Lapisan pada Permukaan Baja Karbon Rendah." Jurnal Engine: Energi, Manufaktur, dan Material 2, no. 1 (2018): 18. http://dx.doi.org/10.30588/jeemm.v2i1.355.

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<p><em>The development and progress of science and technology in the metal plating industry has become a field of work that is experiencing rapid advances ranging from the type of coating, a coating material that is used, and the results of a layer. The metal plating industry needs not only demand resistance to corrosion, but also the strength of the material, has a beautiful appearance, and has a high economic value. one of them, namely by means of electroplating coating.</em><em> </em><em>The purpose of this research is to know the influence of variations in the strength of an electric current and time of electroplating nickel-chrome against the thickness of the surface layer of low carbon steel. The benefits of this research are expected to add to the knowledge about the coating on the process of electroplating nickel-chrome and can apply it. In the activities of this research material used is low carbon steel plates with a size 40 mm x 25 mm x 1 mm with the number 27 specimens are coated using electroplating method with the variation of strength of electric current of 0.5 A, 1 A, 1.5 A and time electroplating 10 minutes, 15 minutes, 20 minutes. </em><em>T</em><em>esting done next the thickness of the layer.</em><em> </em><em>Results of the study showed that the highest hardness of nickel-chrome electroplating process occurs on a variation of value the highest layer thickness variation in the strength of the current 1.5 A long coating 20 minutes 1.97 µm.</em></p>

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27

Guo, Zeliang, Yusen Zhao, Shipeng Sun, and Hui Wu. "Direct electroplating of Ag nanowires using superionic conductors." Nanoscale Horizons 5, no. 1 (2020): 89–94. http://dx.doi.org/10.1039/c9nh00395a.

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28

Hyie, Koay Mei, Salina Budin, Normariah Che Maideen, and Yudi Rahmawan. "Static Electroplating of Iron Triad on Fastener Washers." Key Engineering Materials 879 (March 2021): 275–83. http://dx.doi.org/10.4028/www.scientific.net/kem.879.275.

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Fasteners are commonly used in construction industry for parts joining purpose. There are many types of construction fasteners such as stud, bolt, anchor, nut, screw, and washer. The major problem of the fastener made by carbon steel is the poor resistance to corrosion. Electroplating is a simple yet low-cost tool to give a strong corrosion protection coating layer on the carbon steel. This study was performed to investigate the effect of current and deposition time on the iron triad (cobalt-nickel-iron) electroplating on the fastener washer. The experiment was conducted at 50 °C, pH 1-3 and at different electroplating time (30 minutes to 90 minutes) and current (0.2 A to 0.5 A). Burnt-out surface coating was observed on the fastener washer when the current was more than 0.4 A. A field test was carried out for 60 days to observe the corrosion behavior and performance of the products. Scanning electron microscope (SEM) analysis showed that a thin protection layer with 5.64 µm was formed at 60 minutes of electroplating time and 0.4 A of current. The surface roughness of the fastener washer was increased by increasing the electroplating time and current. The hardness was also improved with higher current and electroplating time if compared to the original fastener washer. The result of this study confirmed that a strong adhesive corrosion resistant layer to the fastener washer was using the current of 0.4 A (77 mA/cm2) and the electroplating time of 60 minutes.

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29

Machado, Tiele Caprioli, Marla Azário Lansarin, and Camila Silva Ribeiro. "Wastewater remediation using a spiral shaped reactor for photochemical reduction of hexavalent chromium." Photochemical & Photobiological Sciences 14, no. 3 (2015): 501–5. http://dx.doi.org/10.1039/c4pp00263f.

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30

Chen, Ming, Wei Huang, and Chun Hai Wang. "A Research on Manufacture Technology of Superhard Material Precision Reamers Based on Inside-Holding Technique." Materials Science Forum 532-533 (December 2006): 69–72. http://dx.doi.org/10.4028/www.scientific.net/msf.532-533.69.

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In modern industry time, more strict requirement on dimension precision, geometry shape and surface roughness of holes have been set to meet the continue advent of superhard materials, the interchanges requirement under batch production, and the application of precision and super-precision machining technique. The super hard material precision reamers have great advantages in dealing with these problems. This paper presents a new process in designing and manufacturing of the superhard material precision reamers, which is called inside-holding electroplating technique. The new process adopts inside-holding electroplating process, eddy flowage electroplating device, extracting pattern process and etc.. Comparing with traditional process, the new one has such advantages as low production cost, high precision, long service life, undressed, and so on.

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31

Giurlani, Walter, Filippo Gambinossi, Emanuele Salvietti, Maurizio Passaponti, and Massimo Innocenti. "Color Measurements in Electroplating Industry: Implications for Product Quality Control." ECS Transactions 80, no. 10 (2017): 757–66. http://dx.doi.org/10.1149/08010.0757ecst.

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32

Dydo, Piotr, Dorota Babilas, Agata Jakóbik-Kolon, Aneta Franczak, and Ryszard Nycz. "Study on the electrodialytic nickel concentration from electroplating industry waste." Separation Science and Technology 53, no. 8 (2017): 1241–48. http://dx.doi.org/10.1080/01496395.2017.1334666.

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33

Alves Goulart, Douglas, and Renato Dutra Pereira. "Autonomous pH control by reinforcement learning for electroplating industry wastewater." Computers & Chemical Engineering 140 (September 2020): 106909. http://dx.doi.org/10.1016/j.compchemeng.2020.106909.

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34

Islam, Fahrul, and Budi Hatono. "Paparan kromium dan kerusakan ginjal pada pekerja pelapisan logam." Berita Kedokteran Masyarakat 32, no. 8 (2018): 257. http://dx.doi.org/10.22146/bkm.12130.

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Chromium exposure and the kidney damage risk among electroplating workersPurposeThis study was carried out to investigate the kidney damage risk due to chromium exposure at the workplace.Method33 electroplating workers and 33 control subjects with no history of occupational exposure to chromium in Makassar were involved. Chromium levels in urine were measured with atomic absorption spectrometry. ResultsUrine from exposed workers contained higher levels of chromium, when compared with those obtained in the control group. Furthermore, there was a direct relationship was obtained between the amount of chromium and kidney damage. Kidney damage was associated with the existence of chromium level in urine. Electroplating work environments increased the high risk of chromium exposure. Workers exposed for long periods of time result in a higher level of accumulated exposure in the body. The findings of this study indicated that there was higher level of chromium exposure in electroplating workers with kidney damage.ConclusionThis study suggested the labor office to closely monitor chromium emission levels in high risk industries. Meanwhile, industry owners need to ensure that every worker uses personal protective equipment to reduce risk.

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35

M.R.Rajan, M. R. Rajan, S. David Noel, and V. Kalaiselvi V.Kalaiselvi. "Impact Of Zinc Electroplating Industry Effluent Residue On Growth, Biochemical Characteristics And Yield Of Black Gram." Indian Journal of Applied Research 3, no. 7 (2011): 326–28. http://dx.doi.org/10.15373/2249555x/july2013/100.

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36

M. R. Rajan, M. R. Rajan, S. David Noel, and V. Antony Arockia Selvan. "Impact of Zinc Electroplating Industry Effluent Residue on Growth and Biochemical Characteristics of Brinjal Solanum Melongena." Indian Journal of Applied Research 3, no. 3 (2011): 353–54. http://dx.doi.org/10.15373/2249555x/mar2013/120.

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M. R. Rajan, M. R. Rajan. "Zinc Electroplating Industry Effluent Residue on Growth, Biochemical Characteristics and Yield of Lady’s Finger Abelmoschus Esculentus." Indian Journal of Applied Research 3, no. 5 (2011): 592–93. http://dx.doi.org/10.15373/2249555x/may2013/191.

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38

Stout, Gene, Doug Scott, Anthony Curtis, Guy Burgess, and Theodore G. Tessier. "Electroplating with Dielectric Bridges." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2015, DPC (2015): 000590–610. http://dx.doi.org/10.4071/2015dpc-tp22.

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The electroplating of underlying metal redistribution layers, under-bump metallization (UBM) layers, WLCSP, Cu pillar and other flip chip applications is well established in the semiconductor industry. The use of semi-additive plating can sometimes be adversely affected by the absence of plating occurring in all targeted locations or with plating non-uniformity as a result of front-end fab related structural anomalies. Subsequent analysis has routinely determined that the previously deposited metal seed layer had been discontinuous due to the topography of wafer features. The most predominant types of topographical issues causing discontinuity in the seed layer are related to adverse sidewall profiles of an underlying dielectric layer or an edge of die feature. Typically die streets are kept clear of certain dielectric layers to avoid complications from saw tool wear and residual defects. As such, these particular dielectric layers are usually terminated at or near each die edge on a semiconductor wafer during processing. Introducing dielectric bridges over the dicing streets provides additional assurances an alternative means to significantly improve the ability to uniformly plate on all targeted die by creating an electrically continuous seed layer pathway while still allowing for subsequent wafer dicing with minimal blade wear, die chipping or residual dielectric issues. FCI has developed and successfully uses this patent pending method to insure the uniform electroplating of metallization layers for a wide variety of applications. This paper will highlight the advantages of this wafer level processing strategy in a high volume, high mix wafer bump fabrication facility including improvements in processing quality and consistency. The transparency on deploying this front-end process change on back-end assembly operations and device reliability will also be addressed.

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39

Rosa Cláudio, Jair, and Pedro Alem Sobrinho. "Solidification of Electroplating Wastewater Treatment Sludges with Cement." Water Science and Technology 22, no. 12 (1990): 287–301. http://dx.doi.org/10.2166/wst.1990.0123.

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At the São Paulo Metropolitan Area, the sludge resulting from treatment of electroplating industry wastewater is inadequately disposed of, generating environmental hazards. A possible way to solve this problem is the cementation of this sludge before disposal. From July,1986 to March, 1987, the authors developed laboratory tests on cementation of electroplating wastewater treatment sludges. Performed at the laboratories of Escola Politécnica of the University of São Paulo and of CETESB, tests were conducted with three types of cement produced in Brazil - CPC - Portland Cement, POZ-pozzolanic cement and CAF - blast furnace cement. The tests had the following steps:characterization of electroplating industry wastewater treatment sludge and study of the sludge - cement mixtures;preparation of sludge - cement mixtures with water/cement ratios of 0.3, 0.5 and 0.7;measurements of mixture consistency with Casagrande soil mechanics equipment;determination of leaching quality and resistance to compression of solidified specimen at the ages of 7 days, 28 days and 90 days;analytical determination of the sludge cement mixture;test for solubility in water at the age of 90 days;analytical determination of cyanide and heavy metals in the cure water of specimen. Results showed that solidification with cement is an efficient technology for the fixation of toxic metal ions such as Cd, Hg and Pb and other metals such as Cr, Ni, Cu or Zn present in large concentrations in electroplating wastewater treatment sludges. With the only exception of Al+++ the other metallicions determined in the leachate showed concentrations below drinking water standards. As to mechanical resistance after 90 days, the sludge - cement mixtures presented a performance similar to that of structural concrete.

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40

Yarygin, V. I., I. I. Kasikov, V. S. Mironov, et al. "Physicotechnical problems in designing a thermionic rectifier for the electroplating industry." Technical Physics 54, no. 1 (2009): 128–32. http://dx.doi.org/10.1134/s1063784209010198.

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41

Christensen, Per, and Susse Georg. "Regulatory effects in the electroplating industry—a case study in Denmark." Journal of Cleaner Production 3, no. 4 (1995): 221–24. http://dx.doi.org/10.1016/0959-6526(96)00001-7.

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42

CHAN, F. "Application of a hybrid case-based reasoning approach in electroplating industry." Expert Systems with Applications 29, no. 1 (2005): 121–30. http://dx.doi.org/10.1016/j.eswa.2005.01.010.

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43

Cavaco, Sofia A., Sandra Fernandes, Margarida M. Quina, and Licínio M. Ferreira. "Removal of chromium from electroplating industry effluents by ion exchange resins." Journal of Hazardous Materials 144, no. 3 (2007): 634–38. http://dx.doi.org/10.1016/j.jhazmat.2007.01.087.

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Citra, A. D. P., H. D. Iswandari, and P. Purwanto. "Environmental management for small medium electroplating industry, A Cleaner production approach." IOP Conference Series: Materials Science and Engineering 1053, no. 1 (2021): 012073. http://dx.doi.org/10.1088/1757-899x/1053/1/012073.

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Schoeman, J. J., J. F. van Staden, H. M. Saayman, and W. A. Vorster. "Evaluation of Reverse Osmosis for Electroplating Effluent Treatment." Water Science and Technology 25, no. 10 (1992): 79–93. http://dx.doi.org/10.2166/wst.1992.0239.

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A South African developed tubular cellulose acetate reverse osmosis (RO) system from Membratek (Pty) Ltd was evaluated for the treatment of nickel rinse water and mixed electroplating effluent. Spiral wrap polyamide (DuPont) and thin film composite (FilmTec) membranes were evaluated for cadmium and chromium rinse water treatment, respectively. Preliminary laboratory results have shown that nickel rinse water should be treated economically with tubular RO. Approximately 92% of the rinse water could be recovered for reuse. The RO brine is of suitable quality for reuse in the electroplating process. Plant payback for a 5 m3/h nickel/water recovery RO plant was determined to.be 1.3 years (approximately 2 000 mg/ℓ Ni in feed). No severe membrane fouling was encountered during the investigation. However, membrane fouling can affect the process adversely and this will be studied further. Approximately 90% water, of suitable quality for reuse as rinse water in the plating process, could be recovered from mixed electroplating effluent. Effluent volume for subsequent treatment with lime was significantly reduced. It may also be possible to treat cadmium and chromium rinse waters with RO. Approximately 92% and 91% water, of suitable quality for reuse as rinse water, could be recovered with spiral wrap polyamide and thin film composite membranes, respectively. Membrane fouling was experienced during cadmium rinse water treatment. However, water flux could be restored by chemical cleaning. Very little fouling was experienced during chromium rinse water treatment. The fouling potential of the rinse waters for the membranes and subsequent cleaning procedures will be studied further. Preliminary results have shown that payback for 5 m3/h RO cadmium/water and RO chromium/water recovery plants should be 3 and 7 years, respectively. Reverse osmosis has been shown to be a very effective technology for water and chemical recovery and for effluent volume reduction. The electroplating industry causes serious pollution and wastes large volumes of water. Consequently, RO is a technology that may be applied to good effect in the electroplating industry to control pollution and to save scarce water.

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M.R.Rajan, M. R. Rajan, and M. Periyasamy M.Periyasamy. "Impact of Zinc electroplating industry effluent residue on growth, biochemical characteristics and yield of Tomato Lycopersicom esculentum." Indian Journal of Applied Research 3, no. 12 (2011): 229–31. http://dx.doi.org/10.15373/2249555x/dec2013/67.

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Best, Keith, Roger McCleary, Richard Hollman, and Phillip Holmes. "Advanced lithography and electroplating approach to form high-aspect ratio copper pillars." International Symposium on Microelectronics 2015, no. 1 (2015): 000793–98. http://dx.doi.org/10.4071/isom-2015-thp23.

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Advanced packaging technologies continue to enable the semiconductor industry to meet the needs for ever thinner, smaller and faster components required in mobile devices and other high performance applications. In the early days of advanced packaging, C4 solder bumps were the alternative to wire bonding. Although lead-free solder remains one of the preferred methods for assembly, tall copper structures (copper pillars) are becoming the standard interconnect solution for many applications. A process of lithography and subsequent electroplating are the mainstream process for today's copper pillar formation on wafer level for high-end flip chip devices. The latest trends in advanced packaging require another technology development when it comes to copper pillars. Modern integration schemes such as 2.5D interposer as well as 3D stacking have pushed the limits of standard lithography and copper electroplating capabilities. Specifically, the need for fine-pitch high aspect ratio copper pillars represents a challenge. In addition, the trend towards rectangular panel-based packaging as seen with glass interposers or panel fan-out (P-FO) devices demands a challenging scale-up of lithography and electroplating equipment and processing capabilities. This work specifically focuses on the formation of high-aspect ratio copper pillars in excess of 100μm by means of stepper-based lithography followed by electroplating. A unique test vehicle has been created to evaluate the process latitude for lithography for different resist materials as well as the specific electroplating challenges associated with these tall and narrow structures. The paper investigates the influence of key parameters such as CD uniformity, pattern density variations and resist profile on the critically important pillar height uniformity across the wafer or panel. In addition, the resist profile behavior at the substrate interface is being examined as it influences undercut behavior during wet etch of the plating seed layer. A number of wet and dry-film resist materials and appropriate lithography processes (spin coat or laminate, expose, develop) followed by copper plating based on varying chemistries and process parameters are being explored. The paper also summarizes the current requirements for the above mentioned lithography and plating processes as seen in the industry today.

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Tsybulskaya, Oksana, Tatiyana Ksenik, Aleksandr Yudakov, Vyacheslav Slesarenko, Aleksandr Perfiliev, and Aleksey Kisel. "Features of reactant treatment of chromium-containing waste water of electroplating industry." Modern science: researches, ideas, results, technologies, no. 1(16) (September 10, 2015): 74–78. http://dx.doi.org/10.23877/ms.ts.23.013.

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Cobley, A. J., and D. R. Gabe. "Methods for achieving high speed acid copper electroplating in the PCB industry." Circuit World 27, no. 3 (2001): 19–25. http://dx.doi.org/10.1108/03056120110385465.

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Beattie, Helen, Chris Keen, Matthew Coldwell, et al. "The use of bio-monitoring to assess exposure in the electroplating industry." Journal of Exposure Science & Environmental Epidemiology 27, no. 1 (2015): 47–55. http://dx.doi.org/10.1038/jes.2015.67.

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