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Dissertations / Theses on the topic 'Electroplating (Study)'

Author: Grafiati

Published: 4 June 2021

Last updated: 10 February 2022

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1

Le, Penven Roselyne. "The study of some platinum and palladium electroplating baths." Thesis, University of Southampton, 1991. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.303092.

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2

Yan, Pengyu. "A study on hoist scheduling problems in automated electroplating lines." Troyes, 2010. http://www.theses.fr/2010TROY0028.

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Dans cette thèse, nous étudions des problèmes d’ordonnancement d’un pont roulant dans des lignes de galvanoplastie automatisées que l’on trouve également souvent dans l’industrie de manière générale. Dans ces systèmes, des ponts roulants sont utilisées pour le transport des pièces entre les machines. Ordonnancer ces mouvements joue un rôle important dans l’optimisation de la performance de ces systèmes. Nous classifions ces problèmes en quatre familles (I) HSP cyclique avec durées opératoires fixes, (II) HSP non cyclique avec durées opératoires fixes, (III) HSP cyclique avec fenêtres temporell

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3

Dabholkar, Anuj Ajit. "Study of diamond abrasive microtool fabrication by pulse-electroplating method." University of Cincinnati / OhioLINK, 2012. http://rave.ohiolink.edu/etdc/view?acc_num=ucin1337971851.

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4

Gullapalli, Vikranth. "Study of Metal Whiskers Growth and Mitigation Technique Using Additive Manufacturing." Thesis, University of North Texas, 2015. https://digital.library.unt.edu/ark:/67531/metadc804972/.

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For years, the alloy of choice for electroplating electronic components has been tin-lead (Sn-Pb) alloy. However, the legislation established in Europe on July 1, 2006, required significant lead (Pb) content reductions from electronic hardware due to its toxic nature. A popular alternative for coating electronic components is pure tin (Sn). However, pure tin has the tendency to spontaneously grow electrically conductive Sn whisker during storage. Sn whisker is usually a pure single crystal tin with filament or hair-like structures grown directly from the electroplated surfaces. Sn whisker is h

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5

Paradine, R. G. "A study of the electroplating mechanism of fuel cell sensor electrodes." Thesis, Bucks New University, 1985. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.356212.

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6

Henderson, Steven Christopher. "The economics of zinc plating : a microeconomic case study." Thesis, Georgia Institute of Technology, 1999. http://hdl.handle.net/1853/28979.

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7

Pinate, Santiago. "Study of particle-current-electrocrystallization interactions in electroplating of Ni/SiC coatings." Licentiate thesis, Tekniska Högskolan, Högskolan i Jönköping, JTH, Material och tillverkning, 2019. http://urn.kb.se/resolve?urn=urn:nbn:se:hj:diva-43548.

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Composite coatings have great potential due to the possibility to combine properties of two different materials in one coating. This way, new surface properties can be tailored and applied to any material's surface. Among different manufacturing routes, electrodeposition has the biggest potential in creating composite metal matrix coatings, especially nanocomposites. Nevertheless, there is a knowledge gap between the deposition of composite coatings in laboratory conditions, described in the literature, and those that are now in place on an industrial level. While micro-composites have been in

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8

Sleboda, Thomas James. "A study of plated through-hole reliability of formaldehyde-based electroless copper depositions in multi-layer board production." Thesis, Georgia Institute of Technology, 1996. http://hdl.handle.net/1853/32803.

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9

Flores, Araujo Sarah Cecilia. "Electrochemical Study of Under-Potential Deposition Processes on Transition Metal Surfaces." Thesis, University of North Texas, 2006. https://digital.library.unt.edu/ark:/67531/metadc5372/.

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Copper under-potential deposition (UPD) on iridium was studied due to important implications it presents to the semiconductor industry. Copper UPD allows controlled superfilling on sub-micrometer trenches; iridium has characteristics to prevent copper interconnect penetration into the surrounding dielectric. Copper UPD is not favored on iridium oxides but data shows copper over-potential deposition when lower oxidation state Ir oxide is formed. Effect of anions in solution on silver UPD at platinum (Pt) electrodes was studied with the electrochemical quartz crystal microbalance. Silver UPD for

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10

Yu, Kyle K. Chyan Oliver Ming-Ren. "Study of copper electrodeposition on ruthenium oxide surfaces and bimetallic corrosion of copper/ruthenium in gallic acid solution." [Denton, Tex.] : University of North Texas, 2007. http://digital.library.unt.edu/permalink/meta-dc-3897.

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11

Ojeda, Mota Oscar Ulises. "Interfacial Study of Copper Electrodeposition with the Electrochemical Quartz Crystal Microbalance (EQCM)." Thesis, University of North Texas, 2005. https://digital.library.unt.edu/ark:/67531/metadc4755/.

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The electrochemical quartz crystal microbalance (EQCM) has been proven an effective mean of monitoring up to nano-scale mass changes related to electrode potential variations at its surface. The principles of operation are based on the converse piezoelectric response of quartz crystals to mass variations on the crystal surface. In this work, principles and operations of the EQCM and piezo-electrodes are discussed. A conductive oxide, ruthenium oxide (RuO2) is a promising material to be used as a diffusion barrier for metal interconnects. Characterization of copper underpotential deposition (UP

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12

Marappan, Saravanan. "A study of the current best practice in the Scottish electroplating industry and improved metal recovery technique for waste water streams." Thesis, Robert Gordon University, 2006. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.425379.

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13

Scarazzato, Tatiana. "Treatment of a cyanide-free copper electroplating solution by electrodialysis: study of ion transport and evaluation of water and inputs recovery." Universidade de São Paulo, 2017. http://www.teses.usp.br/teses/disponiveis/3/3137/tde-12032018-145732/.

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The two most common commercial copper baths are the acid sulfate copper bath and the alkaline cyanide copper bath. Alkaline copper baths are mostly used to coat parts with complex geometry and to avoid galvanic deposition when depositing a metal on a less noble substrate. Because of the toxicity of cyanide compounds, alternative baths have been developed using different complexing agents. The starting point of the present study is a cyanide-free strike bath developed for copper plating on Zamak substrates developed by the Institute for Technological Research of the State of São Paulo/ Brazil.

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14

Scarazzato, Tatiana. "Treatment of a cyanide-free copper electroplating solution by electrodialysis: study of ion transport and evaluation of water and inputs recovery." Doctoral thesis, Universitat Politècnica de València, 2018. http://hdl.handle.net/10251/98502.

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Los dos baños de cobre más utilizados comercialmente son el baño ácido a base de sulfato y el baño alcalino a base de cianuro. Los baños alcalinos son utilizados principalmente para producir recubrimientos en piezas con geometría compleja y para evitar la deposición galvánica cuando se deposita un metal en un sustrato menos noble. Debido a la toxicidad de los compuestos de cianuro, se han desarrollado baños alternativos usando diferentes agentes complejantes. El punto de partida de la presente investigación es un baño primario sin cianuros para deposición de cobre en sustratos de Zamak desarro

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15

Yamane, Daisuke, Toshifumi Konishi, Minami Teranishi, et al. "A Study on Mechanical Structure of a MEMS Accelerometer Fabricated by Multi-layer Metal Technology." Universitätsbibliothek Chemnitz, 2016. http://nbn-resolving.de/urn:nbn:de:bsz:ch1-qucosa-207232.

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This paper reports the evaluation results of the mechanical structures of MEMS (micro electro mechanical systems) sensor implemented in the integrated MEMS inertial sensor for a wide sensing range from below 0.1 G to 20 G (1 G = 9.8 m/s^2). To investigate the mechanical tolerance, a maximum target acceleration of 20G was applied to the sub-1G sensor which had the heaviest proof mass of all that sensors had. The structure stability of Ti/Au multi-layered structures was also examined by using Ti/Au micro cantilevers. The results showed that the stoppers effectively functioned to prevent the proo

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16

Yu, Kyle K. "Study of Copper Electrodeposition on Ruthenium Oxide Surfaces and Bimetallic Corrosion of Copper/Ruthenium in Gallic Acid Solution." Thesis, University of North Texas, 2007. https://digital.library.unt.edu/ark:/67531/metadc3897/.

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Ruthenium, proposed as a new candidate of diffusion barrier, has three different kinds of oxides, which are native oxide, electrochemical reversible oxide and electrochemical irreversible oxide. Native oxide was formed by naturally exposed to air. Electrochemical reversible oxide was formed at lower anodic potential region, and irreversible oxides were formed at higher anodic potential region. In this study, we were focusing on the effect of copper electrodeposition on each type of oxides. From decreased charge of anodic stripping peaks and underpotential deposition (UPD) waves in cyclic volta

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17

Chauveau, Eric. "Analyse, par modélisation, de la sélectivité réactionnelle dans les procédés d'électrolyse pulsée : cas d'un dépôt métallique." Grenoble INPG, 1987. http://www.theses.fr/1987INPG0141.

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18

Waechtler, Thomas, Steffen Schulze, Lutz Hofmann, et al. "Detailed Study of Copper Oxide ALD on SiO2, TaN, and Ru." Universitätsbibliothek Chemnitz, 2009. http://nbn-resolving.de/urn:nbn:de:bsz:ch1-200901295.

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Copper films with a thickness in the nanometer range are required as seed layers for the electrochemical Cu deposition to form multilevel interconnects in ultralarge-scale integrated (ULSI) electronic devices. Continuously shrinking device dimensions and increasing aspect ratios of the dual-damascene structures in the copper-based metallization schemes put ever more stringent requirements on the films with respect to their conformality in nanostructures and thickness homogeneity across large wafers. Due to its intrinsic self-limiting film growth characteristic, atomic layer deposition (ALD) a

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19

Cintra, Elaine Pavini. "Caracterização espectroeletroquímica de polímeros condutores preparados a partir de monômeros bifuncionais." Universidade de São Paulo, 2003. http://www.teses.usp.br/teses/disponiveis/46/46132/tde-08122014-170358/.

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O poli(5-amino 1-naftol) é um polímero que pertence à classe dos polímeros condutores e pode ser obtido através da oxidação do monômero bifuncionalizado, 5-amino 1-naftol, que possui dois grupos funcionais: -NH2 e -OH. Neste trabalho é apresentado um estudo dos polímeros provenientes do referido monômero quando polimerizado na presença de diferentes ácidos. As influências do meio eletrolítico na eletrodeposição, na morfologia e nos processos redox dos filmes, são estudadas. As transformações eletrocrômicas, conseqüência dos diferentes estados de oxidação dos filmes, são acompanhadas por experi

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20

BONCORPS, VAUCHERET PASCALE. "Etude par mesures d'impedances d'un mecanisme de depot electrolytique faisant intervenir des reactions d'adsorption et de desorption : application au cas du tellure." Paris 6, 1987. http://www.theses.fr/1987PA066039.

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Etude du mecanisme de depot cathodique dans lequel interviennent des reactions d'adsorption et de desorption. Calcul du courant et de l'impedance. Application a la reduction du tellure (iv) en tellure en presence d'ions potassium

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21

ROGER, JEAN-PAUL. "Contributions a l'etude des surfaces, interfaces et films minces par la methode mirage." Paris 6, 1988. http://www.theses.fr/1988PA066509.

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Detection in situ d'un depot metallique sur une electrode rugueuse avec une sensibilite d'une fraction de couche monoatomique; analyse et modelisation des effets de rugosite pour des surfaces metalliques, caracterisation optique et thermique de couches minces semiconductrices et mise en evidence d'une absorption de surface

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22

Cherkaoui, Mohammed. "Elaboration par electrolyse en courant pulse de revetements d'alliages ni-cu et ni-mo : etude de leurs proprietes." Paris 6, 1987. http://www.theses.fr/1987PA066306.

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Depot electrolytique sous courant pulse de revetements d'alliages base nickel. Etude de l'influence des parametres du courant pulse sur les differentes proprietes des depots ni-cu et ni-mo: composition, structure, contraintes, tenue a la corrosion (nacl a 3%)

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23

Antoine, François. "Electrodeposition de metaux sur le titane : barriere de penetration a l'hydrogene." Université Louis Pasteur (Strasbourg) (1971-2008), 1987. http://www.theses.fr/1987STR13050.

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Determination des conditions d'obtention, par electrodeposition, de revetements compacts et adherents de nickel, cadnium et chrome sur le titane. Etude de la penetration de l'hydrogene dans le titane revetu et non revetu lors d'un chargement cathodique en milieu h::(2)so::(4) 0,1n a 70**(o)c contenant ou non comme promoteur n::(4)p::(2)o::(7) ou naaso::(2)

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24

Bousedra, Harrag. "Codeposition electrolytique de zinc et de cadmium sur acier doux : resistance a la corrosion." Université Louis Pasteur (Strasbourg) (1971-2008), 1988. http://www.theses.fr/1988STR13109.

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Analyses et etudes de la structure des revetements obtenus par co-deposition electrolytique de zinc et de cadnium sur des aciders bas carbone. Etude de la resistance a la corrosion en brouillard salin des depots et de l'influence de leur composition

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25

Amani, Bouzekri. "Contribution a l'etude des revetements electrodeposes de ni, de zn et d'alliages zn-ni : preparation, porosite, comportement a la corrosion." Caen, 1988. http://www.theses.fr/1988CAEN2031.

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Etude de la porosite des revetements electrolytiques de zn, ni et zn-12% ni par une methode basee sur les mesures du potentiel et de la vitesse de corrosion et par une methode basee sur les mesures d'impedance electrochimique. Comparaison du comportement des differents revetements en milieu neutre et en milieu acide

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26

Bouhouch, Lahoussine. "Élaboration des couches d'alliages NI-FE par voie électrolytique : Études électrique, magnétique et structurale." Nancy 1, 1988. http://www.theses.fr/1988NAN10089.

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Mécanismes, caractéristiques et facteurs influant le dépôt électrolytique. Techniques d'élaboration et de dosage du fer dans les alliages NI-FE déposés. Influence des conditions opératoires sur la nature et composition des alliages élaborés. Étude des propriétés électriques magnétiques et de l'influence des traitements thermiques sur la structure des alliages

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27

Chen, Shi Wei, and 陳世偉. "Toxicty reduction study of electroplating wastwater." Thesis, 1995. http://ndltd.ncl.edu.tw/handle/78391753235405190984.

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28

游大慶. "The Study of the Electroplating Cobalt Sulfide." Thesis, 2013. http://ndltd.ncl.edu.tw/handle/75159307894102281968.

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29

Yang, Ya-Lin, and 楊雅麟. "Degradation Study of Additives in Copper Electroplating Bath." Thesis, 2013. http://ndltd.ncl.edu.tw/handle/60001911287807474503.

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碩士<br>中原大學<br>化學研究所<br>101<br>Increasing electroplating time of copper electroplating on silicon wafer may cause system contact to increase, resulting in formation of void or seam in the filling. Cyclic voltammetric stripping (CVS) analysis is typically used for the analysis of the concentrations of organic additives in the copper plating solution due to its simplicity and speed. However, this method can only provide the concentration of the analytes but not the information of the by-product such as the species and its concentration. This research aims to compare the results of CVS to those ob

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30

Hou, Guan Zheng, and 侯冠正. "The study of a hydrodynamic electroplating test cell." Thesis, 1994. http://ndltd.ncl.edu.tw/handle/60750504104466781732.

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31

Gau, W. C., and 高武群. "The Study of Copper Electroplating for ULSI Interconnection." Thesis, 1999. http://ndltd.ncl.edu.tw/handle/35288742258771918482.

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碩士<br>中原大學<br>化學工程學系<br>87<br>Cu metallization will play an important role in future microelectronic processing because Cu has lower resistivity and higher electromigration resistance compared to Al. Copper could be deposited by either physical sputtering, chemical vapor deposition (CVD), or electrochemical deposition. Since electroplating has advantages of low processing temperature, short processing time, and simple deposition facilities, which compared to traditional sputtering and CVD, it becomes the most attractive technique implemented in Cu metallization. However, many challenges are

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32

HSUEH, YUN-I., and 薛昀伊. "Study on Electroplating Copper by Citric Acid Additives." Thesis, 2019. http://ndltd.ncl.edu.tw/handle/eqg2f7.

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碩士<br>國立聯合大學<br>化學工程學系碩士班<br>107<br>In recent years, as the development of electroplating technology has become more mature, the competition among various manufacturers is mainly in the types of additives and the proportion of additions. In the electroplating industry, the types of additives have been roughly the same. Take inhibitors as an example: most of the manufacturers use polyethylene glycol as its selling price is high; however, polyethylene glycol is a polymer, and it is easy to pollute the environment. In this experiment, citric acid was used as an additive by replacing the more ex

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33

Lin, You-Shin, and 林佑信. "The study of Cu electroplating for ULSI metallization." Thesis, 2001. http://ndltd.ncl.edu.tw/handle/43215111542591901000.

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碩士<br>中原大學<br>化學工程研究所<br>89<br>Abstract Chemical additives play important roles in copper electroplating, because it could effect on film quality as well as gap filling. However, a fundamental understanding of the roles of chemical additives is still deficient. In order to illustrate the roles of chemical additives in copper electroplating, the technique of cyclic voltage stripping (CVS) together with rotating disk electrode (RDE) is proposed to be used studying the roles of chemical additives on copper electroplating. Based on my study, my research resultes are shown that film nucleation an

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34

SenHorng, Lin, and 林森弘. "The Study of Additive Effect on Tin Electroplating." Thesis, 1994. http://ndltd.ncl.edu.tw/handle/67939483820718934802.

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35

JEN-YU, LEE, and 李仁佑. "Analyzing The Effectiveness of Knowledge Transfer in Electroplating Industry–A Case Study of an Electroplating Company in Taiwan." Thesis, 2015. http://ndltd.ncl.edu.tw/handle/pd4w8g.

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36

LIN, JYUN-MIAO, and 林雋淼. "The Study on Copper Electroplating by One-step and Two-step Process with Different Additives and Electroplating Conditions." Thesis, 2018. http://ndltd.ncl.edu.tw/handle/efv484.

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碩士<br>國立聯合大學<br>化學工程學系碩士班<br>106<br>This experiment uses a cyanide-free formulation and additives for copper plating on stainless steel plates. It is expected that the surface of the stainless steel plate is coated with a film with copper metallic luster. Electrochemical analyses are investigated by cyclic linear sweep voltammetry (CLSV) and galvanostatic plating operation. The cyclic linear sweep voltammetry analysis shows that the inhibitory effect of the cupric electroplating bath have chlorine ion (Cl-), 2-MP (leveler), PEG (suppressor) and MPSA (accelerator) is better than that have o

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Lin, Ming-Jie, and 林明頡. "The Study of Copper Electroplating on Sub-micron Contacts." Thesis, 2005. http://ndltd.ncl.edu.tw/handle/88151108935261751255.

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碩士<br>中原大學<br>化學工程研究所<br>93<br>In this study, two chemical additives, Janus green B. (JGB) and 1,3-diethyl-2-thiourea, were employed in copper electroplating. The electroplating mechanism was illustrated using interfacial theory together with polarization measurement. Based on our studies, addition of JGB into an electroplating solution with 1,3-diethyl-2-thiourea electrolyte would increase the surface energy of liquid-solid interface, decrease the polarization, and make copper surface much more rough. On the other hand, adding 1,3-diethyl-2-thiourea into a solution containing JGB additives

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38

Chan, Chi-Lun, and 詹綮倫. "A Study of Selective Micro-electroplating Technique and Materials." Thesis, 2003. http://ndltd.ncl.edu.tw/handle/03329015806711334249.

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碩士<br>中國文化大學<br>材料科學與製造研究所<br>91<br>Micro-electroplating is a procedure of manufacturing micro-structure. It’s essential asking and trend to research it to be thin and small in the future. Therefore, the thesis meet a demand of future development, applying innovative electroplating technique in microminiaturization. Traditional electroplating need a vat of electrolyte solutions and put entire to wait electroplate of the materials into electrolyte flume. It will not only contaminate to wait electroplate of the materials but add the times of electroplating procedure. The variation o

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JIANG, GUAN WEI, and 江冠緯. "Study on supercritical electroplating process by ultrasonic parameter change." Thesis, 2019. http://ndltd.ncl.edu.tw/handle/a75u97.

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碩士<br>國立臺北科技大學<br>機械工程系機電整合碩士班<br>107<br>This experiment investigates fabrication of ultrasonic-assisted supercritical carbon dioxide (US-SC-CO2) electroplating film properties, In atmospheric pressure (Conventional), supercritical (SC-CO2), and supercritical ultrasonic are compared under three processes to compare material properties ,and change ultrasonic power and frequency to compare the characteristics of the film. The film properties such as grain size, film element content, surface microstructure, film hardness, corrosion resistance, surface roughness, crystal orientation, and their cha

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40

Lee, Yu-Chih, and 李有植. "A Simulative Study on Invar Electrodeposition with Electroplating Tank." Thesis, 2019. http://ndltd.ncl.edu.tw/handle/vry29z.

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碩士<br>國立中興大學<br>化學工程學系所<br>107<br>Nowadays, the fine metal mask required by the industry, deposited by Invar plating with a low thermal expansion coefficient and the thickness should be less than 30 μm with a unit plating deposition area of 200×700 mm2. Using the software to simulate the deposition thickness of 30 microns or less as the target, we can explore the experimental parameters’ relationship between deposition thickness and uniformity. As an experimental design proposal, we can shorten the time for experiment and have effect of saving energy and reducing environmental pollution. This

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41

Huang, Pei-Yi, and 黃佩億. "Study of Trench filling behavior of Nano/Micro-Electroplating." Thesis, 2009. http://ndltd.ncl.edu.tw/handle/83082202854403586220.

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碩士<br>大同大學<br>材料工程學系(所)<br>97<br>The copper electroplating is studies and applied extensively. Especially, fill-in copper electroplating plays an important role on printed circuit boards (PCBs) now because of its connection of those multilayer boards. Thus, many researchers investigate the improvement of copper structures. Defects such as seams, voids and vacant spaces may cause damage to copper structure. Therefore, the quality of copper structures may affect the performance of electricity and signal transformation. Traditionally, the method to examine defects is observing the cross-section b

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42

HUNG, FU-CHUN, and 洪福鈞. "The study of the aluminum electroplating in molten salt." Thesis, 1992. http://ndltd.ncl.edu.tw/handle/06794010787800338749.

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43

Hsieh, Yu-Hsuan, and 謝宇軒. "Electroplating Chromium-Carbide Alloy On Fuel Cell Bipolar Mechanism Study." Thesis, 2011. http://ndltd.ncl.edu.tw/handle/68402441464628901674.

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碩士<br>國防大學中正理工學院<br>應用化學碩士班<br>99<br>In tradition fuel cell bipolar plate is almost use graphite bipolar plate, although with good conductivity and low corrosion resistance, but it’s high price and the weight of heavy, bulky, therefore, replace graphite bipolar plates with metal bipolar plates is the most important thing in fuel cell process. But in the acidic environment of fuel cell the metal bipolar plates can’t resist the corrosion occurred, this study prepared to trivalent chromium plating chromium-carbide plating on copper bipolar plate, in order to improve its corrosion resistance. The

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44

胡淑惠. "The Study of Direct Electroplating on Nonconductor Surfaces via CNT." Thesis, 2008. http://ndltd.ncl.edu.tw/handle/11671605960376384259.

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45

Ren, Rung-Hsuan, and 任容萱. "A Simulative Study on Copper Electrodeposition with Jet Electroplating Devices." Thesis, 2018. http://ndltd.ncl.edu.tw/handle/d7t7c6.

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碩士<br>國立中興大學<br>化學工程學系所<br>106<br>The study used COMSOL Multiphysics 5.3 finite element method (FEM) combined with electrodeposition (Secondary Current Distribution) and fluid flow. Assumed that the fluid was laminar, copper ions was adequate and uniform concentration at plating bath. Using jet plating devices to simulate fluid flow from the pipe with 14 small holes, the fluid hit the tilting board and then sprayed onto the Ti plate for electroplating copper deposition. According to the calculation of copper electrodeposition and numerical simulation, it was analyzed how to affecting the coati

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Wang, Chen-yu, and 王晨宇. "The study of monocrystalline silicon electrochemical discharge drilling and coaxial electroplating." Thesis, 2013. http://ndltd.ncl.edu.tw/handle/91527022564271729202.

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碩士<br>國立中央大學<br>機械工程學系<br>101<br>We propose a new way that combined micro chemical electro discharge machining and plating on silicon wafer which can machining a hollow plating layer. In tradition micro hole machining on Si wafer , there are almost using the strong acid or alkali, which is harm for the environment and the operator, but in our way, we replaced by strong acid with sodium hydroxide, it is not only we success to machining a micro hole on Si wafer but also it is more friendly to the environment and operator. In micro electrochemical discharge machining, we propose a new electrode t

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Wang, Hui-Tung, and 王惠東. "Study on ZnO-nanowire interdigitated electrodes for electroplating Ni-Co solution." Thesis, 2016. http://ndltd.ncl.edu.tw/handle/42663800919078853643.

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碩士<br>中原大學<br>機械工程研究所<br>104<br>Abstract A simple and inexpensive approach to selectively synthesized the ZnO nanowires at the specific area is proposed in this study. By integrating the hydrothermal method with the photolithography process, both the positive and negative resists were used to control the growth of nanowires through lift-off concept. The printed circuit board (PCB) was adopted as the substrate. On PCB, the interdigitated electrodes (IDE) array was firstly fabricated by etching the copper foil. Two types of chips were compared: global growth of ZnO nanowires on the device and pa

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Chien, Chu-Mo, and 簡竹模. "Study of Cu film directly electroplating on InduimTin Oxide diffusion barrier." Thesis, 2008. http://ndltd.ncl.edu.tw/handle/q7kbpq.

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碩士<br>國立虎尾科技大學<br>光電與材料科技研究所<br>96<br>In the research, the effect of electroplating Copper (Cu) film on Indium Tin Oxide (ITO) diffusion barrier was studied, improved by additional treatments and finally compared with electroless Cu and magnetron sputter Cu film. First, silicon (Si) substrate was deposited ITO thin film with 10 and 5 nm thickness by Magnetron Sputter in vacuum, separately, then electro Cu film was electroplated onto it, and annealed at 300 to 800 ℃ for 5 min in rapid thermal annealing (RTA) furnace in vacuum and atmosphere of Ar and H2 with a volume ratio of 95:5, respectively

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Lin, Chien-Hien, and 林見衡. "A Study of Occupational Hazards Exposure on Hard-Chrome Electroplating Workers." Thesis, 1997. http://ndltd.ncl.edu.tw/handle/58510177933466327830.

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碩士<br>文化大學<br>勞工研究所<br>85<br>Electroplating, called 3-K industry, caused many environmental pollutionsand industrial hygiene problems. Such as waste-water, soil heavy-metalpollution, unsafe and unhealthy working places and behaviors results in accidents and occupational diseases. There is a famous case that chromic-acid mist causes nasal septum perforation. 1996 Chen''s study showed that the Cr(VI) average concentration was 17.4ug/m3 in hard-chrome plating.It is far below the 8hrs TLVs(0.1m

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LIU, SHI-XIONG, and 劉世雄. "Standard cost systems as applied to the electroplating industry: a case study." Thesis, 1989. http://ndltd.ncl.edu.tw/handle/08854806590219189673.

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