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Journal articles on the topic 'Embedded Device'

Author: Grafiati

Published: 4 June 2021

Last updated: 25 May 2024

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1

Wang, Lei, Yalong Li, Xinyuan Tian, and Deyun Mo. "A design of the lightweight key management system for multi-level embedded devices." Applied Mathematics and Nonlinear Sciences 7, no. 2 (July 1, 2022): 1093–104. http://dx.doi.org/10.2478/amns.2021.2.00319.

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Abstract Embedded devices often face security risks such as device loss, cracking, key disclosure and side-channel attacks. Owing to the relative meagreness characterising the availability of computing as well as storage resources, it might be said that embedded devices themselves have limited resources, and traditional key management solutions are thus not fully suitable for embedded device usage scenarios. In addition, embedded device key management also necessitates consideration of the dynamic changes of devices, such as device joining and withdrawal, and blacklist management and control. A lightweight key management scheme is proposed for multi-layer embedded devices, and the management and control problems of the device blacklist library are analysed and an optimisation scheme is proposed. Finally, the scheme of this paper is analysed in detail based on the aspects of security and resource overhead. Compared with the traditional key management scheme, the scheme designed in this paper can be better applied to the communication of embedded devices to meet the security requirements of embedded systems.

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Dhakshayeni, Dhakshayeni, and Dr S. Rathinavel. "Automated food feeder for dogs using embedded device." International Journal of Research Publication and Reviews 5, no. 4 (April 2024): 1074–77. http://dx.doi.org/10.55248/gengpi.5.0424.0933.

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3

Zhou, Xu, Pengfei Wang, Lei Zhou, Peng Xun, and Kai Lu. "A Survey of the Security Analysis of Embedded Devices." Sensors 23, no. 22 (November 16, 2023): 9221. http://dx.doi.org/10.3390/s23229221.

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Embedded devices are pervasive nowadays with the rapid development of the Internet of Things (IoT). This brings significant security issues that make the security analysis of embedded devices important. This paper presents a survey on the security analysis research of embedded devices. First, we analyze the embedded device types and their operating systems. Then, we describe a major dynamic security analysis method for an embedded device, i.e., simulating the firmware of the embedded device and performing fuzzing on the web interface provided by the firmware. Third, we discuss some other issues in embedded security analysis, such as analyzing the attack surface, applying static analysis, and performing large-scale analysis. Based on these analyses, we finally conclude three challenges in the current research and present our insights for future research directions.

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Yi, Sung, Kyungo Kim, Dongwan Lee, Hongwon Kim, and Taesung Jung. "Embedded passive device technology for wireless mobile devices." Microelectronics International 30, no. 1 (January 18, 2013): 33–39. http://dx.doi.org/10.1108/13565361311298213.

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5

Cebel, Efecan, Nevzat Donum, and Huseyin Karacali. "Platform Independent Embedded Linux OTA Method." European Journal of Research and Development 2, no. 4 (December 31, 2022): 243–52. http://dx.doi.org/10.56038/ejrnd.v2i4.165.

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Embedded devices are often used at remote locations. Accordingly, since it is difficult and costly to physically access the devices for firmware updates, the updates are made with Over-the-Air (OTA). OTA is a firmware update method that allows embedded devices to be updated wirelessly without requiring physical access. OTA applications for Embedded Linux devices are platform-dependent. Therefore, the aim of this study is to develop an easy integrated, steady, and robust OTA method. This method runs in the background without any user action on a platform-independent Embedded Linux device and it has a small footprint. The firmware is compressed in this method. The compressed firmware is uploaded to a storage area such as a remote drive, cloud, and repository. The storage area is used efficiently thanks to compressed firmware. The OTA application checks versions of firmware in the storage area and compares them with firmware running on the device. It decides which version is more up-to-date. If the version of the firmware in the storage area is more up-to-date, the OTA application runs in the background and downloads the updated firmware without interfering with the working functions on the device. After the download is completed, compressed firmware is extracted and flashed into the specified memory location. When the device is rebooted after the procedure is completed, the device is going to boot with the new version of the firmware. Consequently, the OTA application can be integrated easily on most Embedded Linux platforms. Besides the OTA application can be enhanced with security and power-safe features.

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Oklobdzija, Danilo, and Branislav Jevtovic. "Using XML Web services as a platform for remote access and control of embedded systems." Facta universitatis - series: Electronics and Energetics 21, no. 1 (2008): 23–36. http://dx.doi.org/10.2298/fuee0801023o.

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This paper has pointed out the need for new technologies for integrating embedded devices in heterogeneous distributed networks, and outlines the perspectives opened by applying service-oriented paradigm for realizing interaction with embedded devices. As a foundation for interaction with embedded devices, XML and Web services have been used. Strong integration power of XML and Web services make presented framework appropriate for unique approach to all resources of embedded device regardless of applied technology. Developed Web services based middleware, provides application designers with a high level of semantic abstraction, hiding the complexity of the applied technologies. This makes presented framework suitable for use in many domains, independent of embedded devices physical realization or network characteristics. Two ways to achieve such integration have been presented in this paper: device level for modern embedded devices, and using service oriented gateway for "legacy" embedded systems. .

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7

Balandin, Sergey, and Michel Gillet. "Embedded Networks in Mobile Devices." International Journal of Embedded and Real-Time Communication Systems 1, no. 1 (January 2010): 22–36. http://dx.doi.org/10.4018/jertcs.2010103002.

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The concept of a mobile phone has recently transformed into a new concept of mobile multimedia devices capable of performing multiple complex tasks and integrating multiple functionalities. It has resulted in a significant increase of device integration costs and complicated deployment of new technologies. Device integrator companies favor modularity everywhere possible, which results in a new trend toward networked architectures for the mobile devices. However, comparing to the best-known embedded network solutions, e.g., SoC and NoC, these architectures have unique constraints and requirements, which also are significantly different from the wide area networks. The main constraints are power consumption and having a modular architecture to allow reuse of the components. Transition to the new architectures for mobile devices is a time consuming task that requires the analysis of many solutions applied in other contexts, especially for embedded protocols, QoS and resource management. This article reviews the state of the art in embedded networks research and the key assumptions, restrictions and limitations faced by designers of embedded networks architectures for mobile devices.

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Wang, Enze, Baosheng Wang, Wei Xie, Zhenhua Wang, Zhenhao Luo, and Tai Yue. "EWVHunter: Grey-Box Fuzzing with Knowledge Guide on Embedded Web Front-Ends." Applied Sciences 10, no. 11 (June 10, 2020): 4015. http://dx.doi.org/10.3390/app10114015.

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At present, embedded devices have become a part of people’s lives, so detecting security vulnerabilities contained in devices becomes imperative. There are three challenges in detecting embedded device vulnerabilities: (1) Most network protocols are stateful; (2) the communication between the web front-end and the device is encrypted or encoded; and (3) the conditional constraints of programs in the device reduce the depth and breadth of fuzz testing. To address these challenges, we propose a new type of gray-box fuzz testing framework in this paper, called EWVHunter, which is mainly used to find authentication bypass and command injection vulnerabilities in embedded devices. The key idea in this paper is based on the observation that most embedded devices are controlled through the web front-end. Such embedded devices often contain rich information in the communication protocol between the web front-end and device. Therefore, by filling data at the input source on the web front-end and reusing web front-end program logic, we can effectively solve the impact of the stateful network protocol and communication data encryption on fuzzing without relying on any knowledge about the communication protocol. Additionally, we use firmware information extraction to enhance EWVHunter so that it can detect vulnerabilities in deep layer codes and hidden interfaces. In our research, we implemented EWVHunter and evaluated 8 real-world embedded devices, and our approach identified 12 vulnerabilities (including 7 zero-days), which affect a total of 31,996 online devices.

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9

Okude, Satoshi, Kazushisa Itoi, Masahiro Okamoto, Nobuki Ueta, and Osamu Nakao. "Active and Passive Devices Embedded in Laminate-Based Multilayer Board." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, DPC (January 1, 2012): 001253–83. http://dx.doi.org/10.4071/2012dpc-tp44.

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We have developed active and passive devices embedded multilayer board utilizing our laminate-based WLCSP embedding technology. The proposed embedded board is realized by laminating plural circuit formed polyimide films together by adhesive with thin devices being arranged in between those polyimide layers. The electrical connection via has a filled via structure composed of the alloy forming conductive paste which ensures high reliable connection. The embedded active device is WLCSP which has no solder bump on its pads therefore the thickness of the die is reduced to 80 microns. The embedded passive device is a chip resistor or capacitor whose thickness is 150 microns with copper electrodes. The electrical connection between components and board's circuits are made by same conductive paste vias. The thin film based structure and low profile devices yields the 260 microns thickness board which is the thinnest embedded of its kind in the world. To confirm the reliability of the embedded board, we have performed several reliability tests on the WLCSP and resistors embedded TEG board of 4 polyimide/5 copper circuit layers. As environmental tests, we performed a moisture reflow test compliant to JEDEC MSL2 followed by a thermal cycling test (−55 deg.C to 125 deg.C, 1000cycles) and a high temperature storage test (150 deg.C). All tested samples passed the moisture reflow test and showed no significant change of circuit resistance after the thermal cycling/high temperature storage tests. Moreover, mechanical durability of the board was also confirmed by bending the devices embedded portion. The embedded device was never broken and the circuit resistance change was also within acceptable range. The proposed embedded board will open up a new field of device packaging. Alan/Rey ok move from Flip Chip and Wafer Level Packaging 1-3-12.

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10

Choo, Kim-Kwang Raymond, Yunsi Fei, Yang Xiang, and Yu Yu. "Embedded Device Forensics and Security." ACM Transactions on Embedded Computing Systems 16, no. 2 (April 14, 2017): 1–5. http://dx.doi.org/10.1145/3015662.

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11

Widmer, Christoph. "Hearing device with embedded channnel." Journal of the Acoustical Society of America 124, no. 6 (2008): 3369. http://dx.doi.org/10.1121/1.3047430.

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12

Arandia, Nerea, Jose Ignacio Garate, and Jon Mabe. "Embedded Sensor Systems in Medical Devices: Requisites and Challenges Ahead." Sensors 22, no. 24 (December 16, 2022): 9917. http://dx.doi.org/10.3390/s22249917.

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The evolution of technology enables the design of smarter medical devices. Embedded Sensor Systems play an important role, both in monitoring and diagnostic devices for healthcare. The design and development of Embedded Sensor Systems for medical devices are subjected to standards and regulations that will depend on the intended use of the device as well as the used technology. This article summarizes the challenges to be faced when designing Embedded Sensor Systems for the medical sector. With this aim, it presents the innovation context of the sector, the stages of new medical device development, the technological components that make up an Embedded Sensor System and the regulatory framework that applies to it. Finally, this article highlights the need to define new medical product design and development methodologies that help companies to successfully introduce new technologies in medical devices.

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13

Zhang, Yang, Wenyan Sun, and Jia Chen. "Application of Embedded Smart Wearable Device Monitoring in Joint Cartilage Injury and Rehabilitation Training." Journal of Healthcare Engineering 2022 (January 7, 2022): 1–11. http://dx.doi.org/10.1155/2022/4420870.

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Joint injuries cause varying degrees of damage to joint cartilage. The purpose of this paper is to study the application of embedded smart wearable device monitoring in articular cartilage injury and rehabilitation training. This paper studies what an embedded system is and what a smart wearable device is and also introduces the rehabilitation training method of articular cartilage injury. We cited an embedded matching cost algorithm and an improved AD-Census. The joint cartilage damage and rehabilitation training are monitored. Finally, we introduced the types of smart wearable devices and different types of application fields. The results of this paper show that, after an articular cartilage injury, the joint function significantly recovers using the staged exercise rehabilitation training based on embedded smart wearable device monitoring. We concluded that, from 2013 to 2020, smart wearable devices are very promising in the medical field. In 2020, the value will reach 20 million US dollars.

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14

Lin, Wen-Shan, and Yue Kuo. "Electrical and Optical Characteristics of SSI-LED Made from Capacitor Containing Tri-Layer WO_x Embedded Zr-Doped HfO_x Gate Dielectric." ECS Journal of Solid State Science and Technology 10, no. 12 (December 1, 2021): 126001. http://dx.doi.org/10.1149/2162-8777/ac44f5.

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Solid-state incandescent light emitting devices made from MOS capacitors with the WOx embedded Zr-doped HfOx gate dielectric were characterized for electrical and optical characteristics. Devices made from capacitors containing Zr-doped HfOx and WOx, gate dielectrics were also fabricated for comparison. The device with the WOx embedded gate dielectric layer had electrical and light emitting characteristics between that with WOx gate dielectric layer and that with the Zr-doped HfOx but no WOx embedded gate dielectric layer. The difference can be explained by the nano-resistor formation process and the content of the high emissivity W in the nano-resistor. The device made from the WOx embedded Zr-doped HfOx gate dielectric MOS capacitor is applicable to areas where uniform emission of warm white light is required.

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15

Chen, Wen, Ying Zhou, Yun Wu, Xiao Fei Liao, and Xing Ru Ding. "Wireless Sensor Network Management Based on SNMP Protocol." Applied Mechanics and Materials 303-306 (February 2013): 292–96. http://dx.doi.org/10.4028/www.scientific.net/amm.303-306.292.

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This paper proposes a network management scheme of WSN. With embedded technology and SNMP (Simple Network Management Protocol) agent technology, an embedded SNMP agent is designed. The agent abstracts a WSN device to a virtual device as a SNMP management node. The main advantage is that the agent supports SNMP to manage the network, and diverse embedded devices can be managed identically with the conventional Internet network management. Therefore, the scheme can reduce the cost of network management and simplify the operation. Finally, by experiments, the scheme is proved to be feasible.

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Tanaka, Kouichi, Nobuyuki Kurashima, Hajime Iizuka, Kiyoshi Ooi, Yoshihiro Machida, Satoshi Shiraki, and Tetsuya Koyama. "Thinner and Miniaturization Embedded Device Package, MCeP, for PoP and Module Application." International Symposium on Microelectronics 2012, no. 1 (January 1, 2012): 001010–17. http://dx.doi.org/10.4071/isom-2012-wp67.

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Along with miniaturization and high functionality of electronics, many embedded device substrates and packages have been developed by various companies. We have been also developing embedded device package named MCeP, Molded Core embedded Package. This package consists of base substrate, upper substrate and molding resin. These substrates material is conventional organic base. Bare IC devices without re-routing are mounted on inner surface of base substrate. Upper substrate and base substrate are connected electrically by copper core solder balls. The space between upper and base substrate is encapsulated by molding resin. MCeP is possible to be adopted for bottom package alternative of PoP. For thinner PoP application less than 1.0mm height, thinner MCeP less than 300um has been investigated. Base substrate has 3 conductive layers and thickness is 130um. Upper substrate has 2 conductive layers and thickness is 95um. Embedded layer thickness is 52.5um. For original MCeP, IC device is mounted by flip chip bonding using Au bump and tin-silver solder interconnection. The space between IC device and base substrate is encapsulated by under-filling resin. It is necessary to keep under-filling resin flow area around IC device. Because of this resin flow area, package size should be enlarged. To miniaturize package size, solder bumped IC device and encapsulation by molding resin instead of under-filling resin were used, then resin flow area was eliminated. MCeP is possible to use bottom package alternative for PoP and module application with IC device and passive components embedded.

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Huapeng Chen, and Jie Lin. "Research on Embedded Speech Recognition Device." INTERNATIONAL JOURNAL ON Advances in Information Sciences and Service Sciences 3, no. 11 (December 31, 2011): 342–49. http://dx.doi.org/10.4156/aiss.vol3.issue11.42.

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18

Tomokage, Hajime. "International Standardization of Device Embedded Substrates." Journal of The Japan Institute of Electronics Packaging 17, no. 5 (2014): 337–41. http://dx.doi.org/10.5104/jiep.17.337.

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19

Katoh, Yoshihisa, Shintaro So, Younggun Han, Osamu Horiuchi, Woon Choi, and Hajime Tomokage. "Reliability Test of Embedded Device Substrates." Journal of The Japan Institute of Electronics Packaging 17, no. 5 (2014): 370–75. http://dx.doi.org/10.5104/jiep.17.370.

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20

Cheung, Vincent Y. T. "Embedded stainless steel ring intrauterine device." Journal of Family Planning and Reproductive Health Care 39, no. 2 (March 14, 2013): 153.2–154. http://dx.doi.org/10.1136/jfprhc-2013-100597.

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21

Joo, Won-Jae, Tae-Lim Choi, and Kwang-Hee Lee. "Embossed structure embedded organic memory device." Thin Solid Films 516, no. 10 (March 2008): 3133–37. http://dx.doi.org/10.1016/j.tsf.2007.08.116.

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22

Selvam, Umapriya, P. Muthu Subramanian, and A. Rajeswari. "Machine Learning on Standard Embedded Device." International Journal of Computer Applications 185, no. 19 (June 20, 2023): 8–10. http://dx.doi.org/10.5120/ijca2023922911.

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Suresh, P., S. George Fernandez, S. Vidyasagar, V. Kalyanasundaram, K. Vijayakumar, Vaidheeswaran Archana, and Soham Chatterjee. "Reduction of transients in switches using embedded machine learning." International Journal of Power Electronics and Drive Systems (IJPEDS) 11, no. 1 (March 1, 2020): 235. http://dx.doi.org/10.11591/ijpeds.v11.i1.pp235-241.

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<p>Non-linear loads can cause transients in electronic switches. They also result in a fluctuating output when the device is switched ON or OFF. These transients can harm not only the switches but also the devices that they are connected to, by passing excess currents or voltages to the devices. By applying machine learning, we can improve the gate drive voltages of the switches and thereby reduce switch transients. A feedback system is built that measures the output transients and then feeds it to a neural network algorithm that then gives a proper gate drive to the device. This will reduce transients and also improve performances of switch based devices like inverters and converters.</p>

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Zhang, Zhaoyun, and Jingpeng Li. "A Review of Artificial Intelligence in Embedded Systems." Micromachines 14, no. 5 (April 22, 2023): 897. http://dx.doi.org/10.3390/mi14050897.

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Advancements in artificial intelligence algorithms and models, along with embedded device support, have resulted in the issue of high energy consumption and poor compatibility when deploying artificial intelligence models and networks on embedded devices becoming solvable. In response to these problems, this paper introduces three aspects of methods and applications for deploying artificial intelligence technologies on embedded devices, including artificial intelligence algorithms and models on resource-constrained hardware, acceleration methods for embedded devices, neural network compression, and current application models of embedded AI. This paper compares relevant literature, highlights the strengths and weaknesses, and concludes with future directions for embedded AI and a summary of the article.

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Hu, Wei Hua, and Han Yun Yang. "The Research and Design of Distributed Automated Test Framework which is Oriented to Embedded Devices." Applied Mechanics and Materials 121-126 (October 2011): 2998–3002. http://dx.doi.org/10.4028/www.scientific.net/amm.121-126.2998.

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With the development of embedded technology, research for embedded software test techniques and tools is a hot topic in the field of IT. To resolve the the two problems of scarcity of embedded devices and interacting directly with the device, we have designed a distributed automated test framework for embedded communication devices, It has a unique distributed engine to handle a variety of distributed test cases.To compare with the most popular automated test framework QTP (quicktest Professional),we find that our framework has the advantages of directly interact with the embedded devices, higher efficiency and higher accuracy.

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Burger, Alwyn, Gregor Schiele, and David W. King. "Reconfigurable Embedded Devices Using Reinforcement Learning to Develop Action Policies." ACM Transactions on Autonomous and Adaptive Systems 15, no. 4 (December 31, 2020): 1–25. http://dx.doi.org/10.1145/3487920.

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The size of sensor networks supporting smart cities is ever increasing. Sensor network resiliency becomes vital for critical networks such as emergency response and waste water treatment. One approach is to engineer “self-aware” sensors that can proactively change their component composition in response to changes in work load when critical devices fail. By extension, these devices could anticipate their own termination, such as battery depletion, and offload current tasks onto connected devices. These neighboring devices can then reconfigure themselves to process these tasks, thus avoiding catastrophic network failure. In this article, we compare and contrast two types of self-aware sensors. One set uses Q-learning to develop a policy that guides device reaction to various environmental stimuli, whereas the others use a set of shallow neural networks to select an appropriate reaction. The novelty lies in the use of field programmable gate arrays embedded on the sensors that take into account internal system state, configuration, and learned state-action pairs, which guide device decisions to meet system demands. Experiments show that even relatively simple reward functions develop both Q-learning policies and shallow neural networks that yield positive device behaviors in dynamic environments.

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Li, Li Meng. "Sedona Frame Application in Embedded Linux." Applied Mechanics and Materials 303-306 (February 2013): 2391–96. http://dx.doi.org/10.4028/www.scientific.net/amm.303-306.2391.

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Embedded systems are used in many fields, but they are different from each other due to the varied practical conditions. Even for embedded devices installed under the similar situations, different control logic programs still exist. Covering the difference coursed by specific applications would highly improve the adaptability of the embedded devices. This paperwork presents a proposal that using Sedona Frame to improve the flexibility of embedded devices. In this paperwork, coupling plan and procedure are focused on greatly between Sedona Frame and device drivers and the feasibility of the coupling plan is proved using an instance of digital input devices. The advantage of graphic programming of Sedona Frame is discussed as well.

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Ferreira, José, Alan Oliveira, André Souto, and José Cecílio. "Software-Based Security Approach for Networked Embedded Devices." ACM SIGAda Ada Letters 43, no. 1 (October 30, 2023): 73–77. http://dx.doi.org/10.1145/3631483.3631495.

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As the Internet of Things (IoT) continues to expand, data security has become increasingly important for ensuring privacy and safety, especially given the sensitive and, sometimes, critical nature of the data handled by IoT devices. There exist hardware-based trusted execution environments used to protect data, but they are not compatible with low-cost devices that lack hardware-assisted security features. The research in this paper presents software-based protection and encryption mechanisms explicitly designed for embedded devices. The proposed architecture consists of two parts: the Agent, which is designed to work with low-cost, low-end devices without requiring modifications to the underlying hardware, and the Computing Module, which is designed for slightly more computationally powerful devices. The Computing Module enables devices to write data in protected memory and continuously verifies its integrity to provide protection. Additionally, it utilizes the Agents located on the device to safeguard device applications against attacks by requesting the Agent to generate an application code signature and validating it. The proposed solution is an alternative data security approach for low-cost IoT devices without compromising performance or functionality. Our work underscores the importance of developing secure and cost-effective solutions for protecting data in the context of IoT.

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Haryanto, Eri, and Imam Riadi. "Forensik Internet Of Things pada Device Level berbasis Embedded System." Jurnal Teknologi Informasi dan Ilmu Komputer 6, no. 6 (December 2, 2019): 703. http://dx.doi.org/10.25126/jtiik.2019661828.

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<p>Perangkat Internet of Things (IoT) merupakan perangkat cerdas yang memiliki interkoneksi dengan jaringan internet global. Investigasi kasus yang menyangkut perangkat IoT akan menjadi tantangan tersendiri bagi investigator forensik. Keberagaman jenis perangkat dan teknologi akan memunculkan tantangan baru bagi investigator forensik. Dalam penelitian ini dititikberatkan forensik di level internal device perangkat IoT. Belum banyak bahkan belum penulis temukan penelitian sejenis yang fokus dalam analisis forensik perangkat IoT pada level device. Penelitian yang sudah dilakukan sebelumnya lebih banyak pada level jaringan dan level cloud server perangkat IoT. Pada penelitian ini dibangun environment perangkat IoT berupa prototype smart home sebagai media penelitian dan kajian tentang forensik level device. Pada penelitian ini digunakan analisis model forensik yang meliputi collection, examination, analysis, dan reporting dalam investigasi forensik untuk menemukan bukti digital. Penelitian ini berhasil mengungkap benar-benar ada serangan berupa injeksi malware terhadap perangkat IoT yang memiliki sistem operasi Raspbian, Fedberry dan Ubuntu Mate. Pengungkapan fakta kasus mengalami kesulitan pada perangkat IoT yang memiliki sistem operasi Kali Linux. Ditemukan 1 IP Address komputer penyerang yang diduga kuat menanamkan malware dan mengganggu sistem kerja perangkat IoT.</p><p><em><strong>Abstract</strong></em></p><p class="Abstract"><em>The Internet of Things (IoT) is an smart device that has interconnection with global internet networks. Investigating cases involving IoT devices will be a challenge for forensic investigators. The diversity of types of equipment and technology will create new challenges for forensic investigators. In this study focused on forensics at the IoT device's internal device level, there have not been many similar research that focuses on forensic analysis of IoT devices at the device level. Previous research has been done more at the network level and cloud level of IoT device's. In this study an IoT environment was built a smart home prototype as a object for research and studies on forensic level devices. This study, using forensic model analysis which includes collection, examination, analysis, and reporting in finding digital evidence. This study successfully revealed that there was really an attack in the form of malware injection against IoT devices that have Raspbian, Fedberry and Ubuntu Mate operating systems. Disclosure of the fact that the case has difficulties with IoT devices that have the Kali Linux operating system. Found 1 IP Address of an attacker's computer that is allegedly strongly infusing malware and interfering with the work system of IoT devices.</em></p><p><em><strong><br /></strong></em></p>

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Karin, Tomer, and Shlomo Weiss. "Programming Windows NT device drivers to operate non-interrupting embedded devices." Microprocessors and Microsystems 28, no. 1 (February 2004): 27–35. http://dx.doi.org/10.1016/s0141-9331(03)00115-7.

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31

Beal, Aubrey, C. Stevens, T. Baginski, M. Hamilton, and R. Dean. "Design, Simulation and Testing of High Density, High Current Micro-machined Embedded Capacitors." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2013, DPC (January 1, 2013): 000515–34. http://dx.doi.org/10.4071/2013dpc-ta32.

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Due to increasing speed, density and number of signal paths in integrated circuits, motivations for high density capacitors capable of quickly sourcing large amounts of current have led to many design and fabrication investigations. This work outlines continued efforts to achieve devices which meet these stringent requirements and are compatible with standard silicon fabrication processes as well as silicon interposer technologies. Previous work has been further developed resulting in devices exhibiting greater capacitance values by employing geometries which maximize surface area. The Atomic Layer Deposition (ALD) of thin layered high K materials, such as Hafnium Oxide, as opposed to previous silicon-dioxide based devices effectively increased the capacitance per unit area of the structures. This paper outlines the design, fabrication, and testing of high density micro-machined embedded capacitors capable of quickly sourcing (i.e. risetimes greater than 100A/nsec) high currents (i.e. greater than 100A). These devices were successfully simulated then tested using a standard ringdown procedure. Generally, the resulting device characterization found during testing stages strongly correlates to the expected simulated device behavior. Subsequent descriptions and design challenges encountered during fabrication, testing and integration of these passive devices are outlined, as well as potential device integration and implementation strategies for use in silicon interposers. The modification and revision of several device generations is documented and presented. Increased device capacitive density, maximized current capabilities and minimized effects of series inductance and resistance are presented. These resulting thin, capacitive structures exhibit compatibility with Si interposer technology.

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Lee, Ke-Jing, Wei-Shao Lin, Li-Wen Wang, Hsin-Ni Lin, and Yeong-Her Wang. "Resistive Switching Memory Cell Property Improvement by Al/SrZrTiO3/Al/SrZrTiO3/ITO with Embedded Al Layer." Nanomaterials 12, no. 24 (December 10, 2022): 4412. http://dx.doi.org/10.3390/nano12244412.

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The SrZrTiO3 (SZT) thin film prepared by sol-gel process for the insulator of resistive random-access memory (RRAM) is presented. Al was embedded in the SZT thin film to enhance the switching characteristics. Compared with the pure SZT thin-film RRAM, the RRAM with the embedded Al in SZT thin film demonstrated outstanding device parameter improvements, such as a resistance ratio higher than 107, lower operation voltage (VSET = −0.8 V and VRESET = 2.05 V), uniform film, and device stability of more than 105 s. The physical properties of the SZT thin film and the embedded-Al SZT thin-film RRAM devices were probed.

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Cai, Tao, Qingjian He, Dejiao Niu, Fuli Chen, Jie Wang, and Lei Li. "A New Embedded Key–Value Store for NVM Device Simulator." Micromachines 11, no. 12 (December 2, 2020): 1075. http://dx.doi.org/10.3390/mi11121075.

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The non-volatile memory (NVM) device is a useful way to solve the memory wall in computers. However, the current I/O software stack in operating systems becomes a performance bottleneck for applications based on NVM devices, especially for key–value stores. We analyzed the characteristics of key–value stores and NVM devices and designed a new embedded key–value store for an NVM device simulator named PMEKV. The embedded processor in NVM devices was used to manage key–value pairs to reduce the data transfer between NVM devices and key–value applications. Meanwhile, it also cut down the data copy between the user space and the kernel space in the operating system to alleviate the I/O software stacks on the efficiency of key–value stores. The architecture, data layout, management strategy, new interface and log strategy of PMEKV are given. Finally, a prototype of PMEKV was implemented based on PMEM. We used YCSB to test and compare it with Redis, MongDB, and Memcache. Meanwhile, the Redis for PMEM named PMEM-Redis and PMEM-KV were also used to test and compared with PMEKV. The results show that PMEKV had the advantage of throughput and adaptability compared with the current key–value stores.

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Cherskikh, Ekaterina. "Event-oriented model of data flow control between embedded devices of a ground-based robotic vehicle." Robotics and Technical Cybernetics 11, no. 4 (December 2023): 292–302. http://dx.doi.org/10.31776/rtcj.11406.

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This paper discusses methods for extracting significant events from data streams generated by actuating and sen-sory devices built into robotic means. An event-oriented model for managing data streams between embedded devices of a ground-based robotic vehicle using a knowledge base that stores information about embedded de-vices and their configurations has been developed. To isolate significant events from the streams of data generat-ed by devices, the restrictions described in the device configurations are used. The proposed model also takes into account possible device failures. The generated events initiate the selection and launch of a certain process by a robotic means, for the description of which BPMN notation is used. The results of simulation modeling are shown, which confirm the effectiveness of the proposed event-oriented model, which provides a 41.8% reduction in data volumes processed by the central computer due to the distribution of calculations to the intermediate microcontrol-lers of embedded devices.

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Zacniewski, Artur, and Radosław Zdunek. "Research of speed and accuracy of speech synthesis methods for the purposes of deployment in embedded device." Bulletin of the Military University of Technology 67, no. 2 (June 29, 2018): 99–107. http://dx.doi.org/10.5604/01.3001.0012.0958.

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In the article, the methods concerning speech synthesis were analysed, having in mind their usage in an embedded device. Research was carried out on the devices with mixed parameters, and the criteria were accuracy and speed of the given method. The research is a part of the Toucan Eye project – an embedded device with an artificial intelligence system able to help people with impaired sight. It was shown how important is optimization of the applied methods in the phase of an engineer project to ensure better quality of a working device and the end-user’s comfort. Keywords: speech synthesis, assisting persons with impaired sight, Toucan Eye

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Krosman, Kazimierz, and Janusz Sosnowski. "Correlating Time Series Signals and Event Logs in Embedded Systems." Sensors 21, no. 21 (October 27, 2021): 7128. http://dx.doi.org/10.3390/s21217128.

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In many embedded systems, we face the problem of correlating signals characterising device operation (e.g., performance parameters, anomalies) with events describing internal device activities. This leads to the investigation of two types of data: time series, representing signal periodic samples in a background of noise, and sporadic event logs. The correlation process must take into account clock inconsistencies between the data acquisition and monitored devices, which provide time series signals and event logs, respectively. The idea of the presented solution is to classify event logs based on the introduced similarity metric and deriving their distribution in time. The identified event log sequences are matched with time intervals corresponding to specified sample patterns (objects) in the registered signal time series. The matching (correlation) process involves iterative time offset adjustment. The paper presents original algorithms to investigate correlation problems using the object-oriented data models corresponding to two monitoring sources. The effectiveness of this approach has been verified in power consumption analysis using real data collected from the developed Holter device. It is quite universal and can be easily adapted to other device optimisation problems.

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Qi, Feng, Jie Ying Jiang, Hiroshi Oyama, Hiroaki Nagashima, and Takuya Azumi. "ECHONET Lite Framework Based on Embedded Component Systems." ECTI Transactions on Computer and Information Technology (ECTI-CIT) 16, no. 1 (March 12, 2022): 74–83. http://dx.doi.org/10.37936/ecti-cit.2022161.245976.

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The large number and many types of electrical equipment in modern house-holds pose major challenges to developers. To increase the breadth of smart homes, improving the development e°ciency of electrical equipment in smart homes is essential. The present research proposes a development method based on embedded components for devices in smart homes. Besides improving the development e°ciency, this method of development reduces the developmental complexity and increases the scalability of elec-trical equipment. The smart home devices are developed and controlled in TOPPERS Embedded-Component System (TECS), a component description language that automatically generates template C ˝les when expand-ing new components or functions. Using the ECHONET Lite plugin, TECS then reads the parameters of the electrical device in the device description ˝le (JSON ˝), and outputs the function parameters for implementation by the developer. The evaluation shows that the code automatically gen-rated by the plugin slows down the software execution time by only 2%compared with the default, thus improving the software development efficiency.

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Kim, Hyunho. "Passive device embedded substrate for application of RF module." Circuit World 42, no. 2 (May 3, 2016): 84–88. http://dx.doi.org/10.1108/cw-07-2015-0033.

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Purpose The purpose of this study is to form fabrication and electrical characteristics of passive device embedded substrate that is embedded chip bead inductor and chip capacitor inside substrate for the application of radio frequency (RF) modules. Design/methodology/approach Passive device embedded substrate was fabricated using embedding process that consists of lamination process, laser drilling at the electrode Cu pads of passive components, electro-less Cu plating formation process such as photolithography, electrolytic Cu plating and etching. Impedance and capacitance characteristics of the fabricated passive device embedded substrate were evaluated. Findings By checking what embedded components are placed in the appropriate place using failure analysis via connection performance between copper plane and embedded components was verified. For measuring electrical characteristics of the fabricated passive device embedded substrate, the evaluation was done using test methods like continuity test for checking interconnections which are not connected to any embedded components and in-circuit test for checking interconnections which are connected to any embedded component. From in-circuit testing for embedding passive components with series and parallel circuits, the authors verified how to test passive device embedded substrate by using capacitance and impedance measurement with the comparison of measured results between good samples and bad samples. Originality/value Ultra miniaturized and low-profile mobile products are driving the need for embedded passive component integration technologies using a novel manufacturing-compatible organic substrate and interconnect technologies. Fabrication and test methods for passive device embedded substrate described in this paper are expected to lead to be developed to make quality measurable for the application of RF modules.

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Krüger, Marius, Birgit Vogel-Heuser, and Simon Vollmann. "Investigating the rendering capability of embedded devices for graphical-user-interfaces in mobile machines." at - Automatisierungstechnik 71, no. 11 (November 1, 2023): 939–52. http://dx.doi.org/10.1515/auto-2023-0043.

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Abstract This paper focuses on the alignment of Graphical-User-Interface (GUI) applications and embedded devices. The main contribution is a benchmark approach that enables measuring and comparing the GUI rendering capability of embedded devices and provides a performance-oriented GUI design recommendation for an embedded device. The benchmark is tailored to common GUI applications and resource-limited devices, which are usually mounted in mobile machines. GUI applications can only be rendered smoothly if these devices have sufficient performance. A general benchmark concept is described and modeled in Unified Modeling Language (UML) at first, followed by a prototypical implementation and evaluation. It is demonstrated that the benchmark approach is applicable to GUI applications with different levels of complexity as well as embedded devices of different performance classes.

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Xian Zhang, Xian Zhang, Pengju Tang Xian Zhang, Dong Yin Pengju Tang, Taiguo Qu Dong Yin, and Yiwen Liu Taiguo Qu. "The Network Model of Internet Access Intranet Based on Embedded Platform." 網際網路技術學刊 23, no. 2 (March 2022): 201–8. http://dx.doi.org/10.53106/160792642022032302001.

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<p>To better manage and control the embedded devices located in the remote Intranet, the functional requirements of the Internet accessing the Intranet need to be effectively solved. This paper studies and implements a network model of external network accessing intranet network and realizes the network model’s function by programming. At the same time, an experimental platform is built to test the performance metrics of the network model, such as the maximum load and CPU utilization, device connection success rate, user access response time, and other performance parameters. The test results show that the network model can meet the network scale of at least 3000 intranet devices and has high practical value and application prospects.</p> <p> </p>

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Brooks, Tyson. "An internet control device embedded sensor agent." International Journal of Internet of Things and Cyber-Assurance 1, no. 3/4 (2020): 267. http://dx.doi.org/10.1504/ijitca.2020.112534.

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Bhute, Anupama, and Sindhu Bhute. "Embedded Intrauterine Contraceptive Device with Cervical Fibroid." International Journal of Recent Surgical and Medical Sciences 02, no. 01 (June 2016): 047–48. http://dx.doi.org/10.5005/jp-journals-10053-0012.

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AbstractIntrauterine contraceptive devices (IUCDs) are among the most frequently used methods of contraception since 1965. An embedded IUCD is a situation where there is an abnormally positioned IUCD within the endometrium or myometrium, however, without an extension through the serosa. We are reporting an interesting case that presented with a missing thread, pain in lower abdomen, and menorrhagia with incidental diagnosis of cervical fibroid.

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Brooks, Tyson. "An internet control device embedded sensor agent." International Journal of Internet of Things and Cyber-Assurance 1, no. 3/4 (2020): 267. http://dx.doi.org/10.1504/ijitca.2020.112535.

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Aoki, Masamitsu. "International Standardization Activities for Embedded Device Substrate." Journal of The Japan Institute of Electronics Packaging 15, no. 7 (2012): 508–14. http://dx.doi.org/10.5104/jiep.15.508.

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Hayashi, Eiichi, and Masanori Ohkoshi. "Dielectric Materials for the Device Embedded Substrate." Journal of The Japan Institute of Electronics Packaging 17, no. 5 (2014): 398–403. http://dx.doi.org/10.5104/jiep.17.398.

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Nakao, Osamu, Nobuki Ueta, Masahiro Okamoto, Hirokazu Nanjo, Satoshi Onai, and Masatoshi Inaba. "Polyimide Based Low-Profile Device Embedded Substrate." Journal of The Japan Institute of Electronics Packaging 22, no. 6 (September 1, 2019): 542–50. http://dx.doi.org/10.5104/jiep.22.542.

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Xu Ping, Yuan Xia, Yang Tuo, Huang Hai-Xuan, Tang Shao-Tuo, Huang Yan-Yan, Xiao Yu-Fei, and Peng Wen-Da. "Design of embedded tri-color shift device." Acta Physica Sinica 66, no. 12 (2017): 124201. http://dx.doi.org/10.7498/aps.66.124201.

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Xu Ping, Tang Shao-Tuo, Yuan Xia, Huang Hai-Xuan, Yang Tuo, Luo Tong-Zheng, and Yu Jun. "Design of an embedded tricolor-shifting device." Acta Physica Sinica 67, no. 2 (2018): 024202. http://dx.doi.org/10.7498/aps.67.20170782.

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Brooks, Tyson. "An internet control device embedded sensor agent." International Journal of Internet of Things and Cyber-Assurance 1, no. 1 (2020): 1. http://dx.doi.org/10.1504/ijitca.2020.10031140.

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Beedham, T., and K. Rao. "Giant Vaginal Stone with Embedded Contraceptive Device." Journal of the Royal Society of Medicine 94, no. 10 (October 2001): 522–23. http://dx.doi.org/10.1177/014107680109401009.

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