Log in

Relevant bibliographies by topics / Encapsulation for electronic / Journal articles

To see the other types of publications on this topic, follow the link: Encapsulation for electronic.

Journal articles on the topic 'Encapsulation for electronic'

Author: Grafiati

Published: 28 June 2021

Last updated: 29 July 2025

Create a spot-on reference in APA, MLA, Chicago, Harvard, and other styles

Select a source type:

Consult the top 50 journal articles for your research on the topic 'Encapsulation for electronic.'

Next to every source in the list of references, there is an 'Add to bibliography' button. Press on it, and we will generate automatically the bibliographic reference to the chosen work in the citation style you need: APA, MLA, Harvard, Chicago, Vancouver, etc.

You can also download the full text of the academic publication as pdf and read online its abstract whenever available in the metadata.

Browse journal articles on a wide variety of disciplines and organise your bibliography correctly.

1

Winkler, Sebastian, Jan Edelmann, Christine Welsch, and Roman Ruff. "Different encapsulation strategies for implanted electronics." Current Directions in Biomedical Engineering 3, no. 2 (2017): 725–28. http://dx.doi.org/10.1515/cdbme-2017-0153.

Full text

Abstract:

AbstractRecent advancements in implant technology include increasing application of electronic systems in the human body. Hermetic encapsulation of electronic components is necessary, specific implant functions and body environments must be considered. Additional functions such as wireless communication systems require specialized technical solutions for the encapsulation.In this paper 3 different implant strategies based on the material groups silicone, ceramics and titanium alloys are evaluated. With the background of a specific application the requirements for the encapsulation are defined

APA, Harvard, Vancouver, ISO, and other styles

2

Kulkarni, Romit, Peter Wappler, Mahdi Soltani, et al. "An Assessment of Thermoset Injection Molding for Thin-Walled Conformal Encapsulation of Board-Level Electronic Packages." Journal of Manufacturing and Materials Processing 3, no. 1 (2019): 18. http://dx.doi.org/10.3390/jmmp3010018.

Full text

Abstract:

An ever-growing market demand for board (second) level packages (e.g., embedded systems, system-on-a-chip, etc.) poses newer challenges for its manufacturing industry in terms of competitive pricing, higher reliability, and overall dimensions. Such packages are encapsulated for various reasons including thermal management, protection from environmental conditions and dust particles, and enhancing the mechanical stability. In the due course of reducing overall sizes and material saving, an encapsulation as thin as possible imposes its own significance. Such a thin-walled conformal encapsulation

APA, Harvard, Vancouver, ISO, and other styles

3

Kinkeldei, Thomas, Niko Munzenrieder, Christoph Zysset, Kunigunde Cherenack, and Gerhard Tröster. "Encapsulation for Flexible Electronic Devices." IEEE Electron Device Letters 32, no. 12 (2011): 1743–45. http://dx.doi.org/10.1109/led.2011.2168378.

Full text

APA, Harvard, Vancouver, ISO, and other styles

4

Kaessner, Stefan, Markus G. Scheibel, Stefan Behrendt, Bianca Boettge, Christoph Berthold, and Klaus G. Nickel. "Reliability of Novel Ceramic Encapsulation Materials for Electronic Packaging." Journal of Microelectronics and Electronic Packaging 15, no. 3 (2018): 132–39. http://dx.doi.org/10.4071/imaps.661015.

Full text

Abstract:

Abstract Enhancements on power electronic systems with reduced chip area and miniaturized passive components are subject of several research activities in academics and industry. To realize such future electronic devices, it is necessary to incorporate wide bandgap semiconductor technology such as silicon carbide and gallium nitride operating at higher temperatures. Therefore, the development of novel materials with high thermal conductivities and stability, withstanding harsh environments up to 300°C is of major interest. Especially, polymeric encapsulation materials have to be improved becau

APA, Harvard, Vancouver, ISO, and other styles

5

Kaessner, S., M. G. Scheibel, S. Behrendt, B. Boettge, and K. G. Nickel. "Reliability of Novel Ceramic Encapsulation Materials for Electronic Packaging." International Symposium on Microelectronics 2018, no. 1 (2018): 000425–33. http://dx.doi.org/10.4071/2380-4505-2018.1.000425.

Full text

Abstract:

Abstract Enhancements on power electronic systems with reduced chip area and miniaturized passive components are subject of several research activities in academics and industry. To realize such future electronic devices, it is necessary to incorporate wide bandgap semiconductor technology such as silicon carbide and gallium nitride operating at higher temperatures. Therefore, the development of novel materials with high thermal conductivities and stability, withstanding harsh environments up to 300°C is of major interest. Especially, polymeric encapsulation materials have to be improved becau

APA, Harvard, Vancouver, ISO, and other styles

6

Yu, Yong Peng. "Research Progress of Heat Hv Insulation Resistance of Macromolecular Composite Materials." Advanced Materials Research 391-392 (December 2011): 332–35. http://dx.doi.org/10.4028/www.scientific.net/amr.391-392.332.

Full text

Abstract:

Epoxy resin (EP) with excellent performance was widely used as electronic encapsulation materials, but the traditional EP can not meet require of nowadays electronic encapsulation materials in wet-heat resistance, flame retardant, insulation and other performance. So the current research progress of EP with wet-heat resistance and high-performance was summarized in the field of electronic encapsulation.

APA, Harvard, Vancouver, ISO, and other styles

7

Guo, Jiahui, Yunru Yu, Dagan Zhang, Han Zhang, and Yuanjin Zhao. "Morphological Hydrogel Microfibers with MXene Encapsulation for Electronic Skin." Research 2021 (March 3, 2021): 1–10. http://dx.doi.org/10.34133/2021/7065907.

Full text

Abstract:

Electronic skins with distinctive features have attracted remarkable attention from researchers because of their promising applications in flexible electronics. Here, we present novel morphologically conductive hydrogel microfibers with MXene encapsulation by using a multi-injection coflow glass capillary microfluidic chip. The coaxial flows in microchannels together with fast gelation between alginate and calcium ions ensure the formation of hollow straight as well as helical microfibers and guarantee the in situ encapsulation of MXene. The resultant hollow straight and helical MXene hydrogel

APA, Harvard, Vancouver, ISO, and other styles

8

Setaro, Antonio. "(Invited) Effect of the Encapsulation of Small Moieties in SWNTs." ECS Meeting Abstracts MA2025-01, no. 12 (2025): 1007. https://doi.org/10.1149/ma2025-01121007mtgabs.

Full text

Abstract:

Single-walled carbon nanotubes (SWNTs) are versatile nanoscale containers for encapsulating small molecular systems. In this work we focus on polyaromatic hydrocarbons and fluorinated organic compounds, enabling novel hybrid materials with new functionalities. Small aromatic hydrocarbons benefit from confinement within CNTs, where π-π interactions and spatial restriction stabilize their structure and modify their optical and electronic behaviors. Fluorinated organic compounds, characterized by high electronegativity and stability, might affect the SWNTs with improved solubility, chemical resis

APA, Harvard, Vancouver, ISO, and other styles

9

Jeon, Yongmin, Hyeongjun Lee, Hyeunwoo Kim, and Jeong-Hyun Kwon. "A Review of Various Attempts on Multi-Functional Encapsulation Technologies for the Reliability of OLEDs." Micromachines 13, no. 9 (2022): 1478. http://dx.doi.org/10.3390/mi13091478.

Full text

Abstract:

As the demand for flexible organic light-emitting diodes (OLEDs) grows beyond that for rigid OLEDs, various elements of OLEDs, such as thin-film transistors, electrodes, thin-film encapsulations (TFEs), and touch screen panels, have been developed to overcome OLEDs’ physical and chemical limitations through material and structural design. In particular, TFEs, which protect OLEDs from the external environment, including reactive gases, heat, sunlight, dust, and particles, have technical difficulties to be solved. This review covers various encapsulation technologies that have been developed wit

APA, Harvard, Vancouver, ISO, and other styles

10

Ahn, Jeong, and Kim. "Emerging Encapsulation Technologies for Long-Term Reliability of Microfabricated Implantable Devices." Micromachines 10, no. 8 (2019): 508. http://dx.doi.org/10.3390/mi10080508.

Full text

Abstract:

The development of reliable long-term encapsulation technologies for implantable biomedical devices is of paramount importance for the safe and stable operation of implants in the body over a period of several decades. Conventional technologies based on titanium or ceramic packaging, however, are not suitable for encapsulating microfabricated devices due to their limited scalability, incompatibility with microfabrication processes, and difficulties with miniaturization. A variety of emerging materials have been proposed for encapsulation of microfabricated implants, including thin-film inorgan

APA, Harvard, Vancouver, ISO, and other styles

11

Wong, C. P. "An Overview of Integrated Circuit Device Encapsulants." Journal of Electronic Packaging 111, no. 2 (1989): 97–107. http://dx.doi.org/10.1115/1.3226528.

Full text

Abstract:

The rapid development of integrated circuit technology from small-scale integration (SSI) to very large scale integration (VLSI) has had great technological and economical impact on the electronics industry. The exponential growth of the number of components per IC chip, the exponential decrease of device dimensions, and the steady increase in IC chip size have imposed stringent requirements, not only on the IC physical design and fabrication, but also on IC encapsulants. This report addresses the purpose of encapsulation, encapsulation techniques, and a general overview of the application of

APA, Harvard, Vancouver, ISO, and other styles

12

Elshabini, Aicha, Fred Barlow, Sharmin Islam, and Pin-Jen Wang. "Advanced Devices and Electronic Packaging for Harsh Environment." International Symposium on Microelectronics 2013, no. 1 (2013): 000937–50. http://dx.doi.org/10.4071/isom-2013-thp61.

Full text

Abstract:

The paper addresses the challenges in electronic packaging for extreme environment based on experimental work of the researchers and conducted reliability testing to evaluate high speed devices suitable for these applications, substrates, die attach, wire bonding, and encapsulation and housing. In particular, the researcher's work has focused on SiC power devices with low loss high voltage Schottky diodes with significant applications, high temperature JFETs and SiC MOSFETs (double trench), and GaN microwave devices. The paper provides recommendations for selection of devices, substrates, die

APA, Harvard, Vancouver, ISO, and other styles

13

Han, S., K. K. Wang, and D. L. Crouthamel. "Wire-Sweep Study Using an Industrial Semiconductor-Chip-Encapsulation Operation." Journal of Electronic Packaging 119, no. 4 (1997): 247–54. http://dx.doi.org/10.1115/1.2792245.

Full text

Abstract:

In this study, the wire-sweep problem has been studied by performing experiments using a commercial-grade epoxy molding compound, a real chip assembly, and an industrial encapsulation process. After encapsulating the chip, the deformed wire shape inside the plastic package has been determined by X-ray scanning. A procedure for the wire-sweep calculation during encapsulation process has been developed. The wire sweep values have been calculated using this procedure with material properties measured from experiments. The calculated wire-sweep values are compared with experimental values measured

APA, Harvard, Vancouver, ISO, and other styles

14

SAKAI, Tadamoto, Shinji YAMAMOTO, Tsukasa SHIROGANEYA, and Akira KOSAKI. "Development of encapsulation moulding equipment for electronic devices." Journal of the Japan Society for Precision Engineering 54, no. 12 (1988): 2277–82. http://dx.doi.org/10.2493/jjspe.54.2277.

Full text

APA, Harvard, Vancouver, ISO, and other styles

15

Pecht, Michael, and Yuliang Deng. "Electronic device encapsulation using red phosphorus flame retardants." Microelectronics Reliability 46, no. 1 (2006): 53–62. http://dx.doi.org/10.1016/j.microrel.2005.09.001.

Full text

APA, Harvard, Vancouver, ISO, and other styles

16

Kuganathan, Navaratnarajah, and Alexander Chroneos. "Tuning the electronic properties of C12A7 via Sn doping and encapsulation." Journal of Materials Science: Materials in Electronics 31, no. 23 (2020): 21203–13. http://dx.doi.org/10.1007/s10854-020-04633-8.

Full text

Abstract:

AbstractCation doping in electride materials has been recently considered as a viable engineering strategy to enhance the electron concentration. Here we apply density functional theory-based energy minimisation techniques to investigate the thermodynamical stability and the electronic structures of Sn-doped and Sn-encapsulated in stoichiometric and electride forms of C12A7. The present calculations reveal that encapsulation is exoergic and doping is endoergic. The electride form is more energetically favourable than the stoichiometric form for both encapsulation and doping. Encapsulation in t

APA, Harvard, Vancouver, ISO, and other styles

17

Gembaczka, P., M. Görtz, Y. Celik, et al. "Encapsulation of implantable integrated MEMS pressure sensors using polyimide epoxy composite and atomic layer deposition." Journal of Sensors and Sensor Systems 3, no. 2 (2014): 335–47. http://dx.doi.org/10.5194/jsss-3-335-2014.

Full text

Abstract:

Abstract. Implantable MEMS sensors are an enabling technology for diagnostic analysis and therapy in medicine. The encapsulation of such miniaturized implants remains a largely unsolved problem. Medically approved encapsulation materials include titanium or ceramics; however, these result in bulky and thick-walled encapsulations which are not suitable for MEMS sensors. In particular, for MEMS pressure sensors the chip surface comprising the pressure membranes must be free of rigid encapsulation material and in direct contact with tissue or body fluids. This work describes a new kind of encapsu

APA, Harvard, Vancouver, ISO, and other styles

18

Nashed, Mohamad-Nour, Dorothy Hardy, Theodore Hughes-Riley, and Tilak Dias. "A Novel Method for Embedding Semiconductor Dies within Textile Yarn to Create Electronic Textiles." Fibers 7, no. 2 (2019): 12. http://dx.doi.org/10.3390/fib7020012.

Full text

Abstract:

Electronic yarns (E-yarns) contain electronics fully incorporated into the yarn’s structure prior to textile or garment production. They consist of a conductive core made from a flexible, multi-strand copper wire onto which semiconductor dies or MEMS (microelectromechanical systems) are soldered. The device and solder joints are then encapsulated within a resin micro-pod, which is subsequently surrounded by a textile sheath, which also covers the copper wires. The encapsulation of semiconductor dies or MEMS devices within the resin polymer micro-pod is a critical component of the fabrication p

APA, Harvard, Vancouver, ISO, and other styles

19

de Beeck, Maaike Op, John O'Callaghan, Karen Qian, et al. "Biocompatible encapsulation and interconnection technology for implantable electronic devices." International Symposium on Microelectronics 2012, no. 1 (2012): 000215–24. http://dx.doi.org/10.4071/isom-2012-ta65.

Full text

Abstract:

A biocompatible packaging process for implantable electronic systems is under development at imec, combining biocompatibility, hermeticity, extreme miniaturization and cost aspects. In a first phase of this packaging sequence, hermetic chip sealing is performed by encapsulating all chips to realize a bi-directional diffusion barrier preventing body fluids to leach into the package causing corrosion, and preventing IC materials such as Cu to diffuse into the body, causing various adverse effects. For cost effectiveness, this chip sealing is performed as post-processing at wafer level, using mod

APA, Harvard, Vancouver, ISO, and other styles

20

Ahubele, B. O., and L. U. Oghenekaro. "Secured Electronic Voting System Using RSA Key Encapsulation Mechanism." European Journal of Electrical Engineering and Computer Science 6, no. 2 (2022): 81–87. http://dx.doi.org/10.24018/ejece.2022.6.2.427.

Full text

Abstract:

A secured process whereas enumerating and casting of votes with the electronic aids with aim of improving the performance of electoral system is called E-voting (Electronic voting). Present e-voting mechanisms are faced with challenges such as confidentiality, integrity, verifiability, transparency, non-repudiation, and authenticity. In e-voting system, blockchain cryptography exists to protect voter’s records. Encryption as well as decryption prevents forgery and other electoral malpractices by confirming voter’s coherence and confidentiality. Rivest, Shamir, Adleman (RSA) is a crooked algori

APA, Harvard, Vancouver, ISO, and other styles

21

Fujii, Shintaro, Haruna Cho, Yoshifumi Hashikawa, Tomoaki Nishino, Yasujiro Murata, and Manabu Kiguchi. "Tuneable single-molecule electronic conductance of C60 by encapsulation." Physical Chemistry Chemical Physics 21, no. 23 (2019): 12606–10. http://dx.doi.org/10.1039/c9cp02469g.

Full text

Abstract:

It has been demonstrated that the single-molecule transport properties of fullerene C<sub>60</sub> can be modulated by encapsulating endohedral species, i.e. Li<sup>+</sup> and H<sub>2</sub>O, which exhibit different degrees of van der Waals interactions with the C<sub>60</sub> cage.

APA, Harvard, Vancouver, ISO, and other styles

22

Winkler, Anja, Adrian Ehrenhofer, Thomas Wallmersperger, Maik Gude, and Niels Modler. "Soft robotic structures by smart encapsulation of electronic devices." Procedia Manufacturing 52 (2020): 277–82. http://dx.doi.org/10.1016/j.promfg.2020.11.046.

Full text

APA, Harvard, Vancouver, ISO, and other styles

23

Ho, Tzong-Rann, and Chun-Shan Wang. "Dispersed acrylate rubber-modified epoxy resins for electronic encapsulation." Journal of Polymer Research 1, no. 1 (1994): 103–8. http://dx.doi.org/10.1007/bf01378600.

Full text

APA, Harvard, Vancouver, ISO, and other styles

24

Sakai, Tadamoto. "Encapsulation process for electronic devices using injection molding method." Advances in Polymer Technology 12, no. 1 (1993): 61–71. http://dx.doi.org/10.1002/adv.1993.060120106.

Full text

APA, Harvard, Vancouver, ISO, and other styles

25

Xu, Yibo, Rui Xia, Jifan Gao, et al. "A Facile Approach for the Encapsulation of Perovskite Solar Cells." Energies 16, no. 2 (2023): 598. http://dx.doi.org/10.3390/en16020598.

Full text

Abstract:

Effectively encapsulating perovskite solar cells (PSCs) to enhance the external reliability is the key towards commercialization. We herein propose a facile encapsulation method by introducing conductive ribbons and a polyethylene terephthalate (PET) backsheet on both sides of PSC. Via applying thermoplastic polyolefin (TPO) encapsulant, we implemented PSCs with fine encapsulation, enabling considerable durability in the ambient atmosphere and even with water immersion, demonstrating almost no degradation in the device output, which is ascribed to the low water vapor transmission rate as well

APA, Harvard, Vancouver, ISO, and other styles

26

Dai, Xinyue, Yanyan Jiang, and Hui Li. "BAs nanotubes with non-circular cross section shapes for gas sensors." Physical Chemistry Chemical Physics 22, no. 22 (2020): 12584–90. http://dx.doi.org/10.1039/d0cp01708f.

Full text

APA, Harvard, Vancouver, ISO, and other styles

27

Mosallaei, Mahmoud, Jarno Jokinen, Mikko Kanerva, and Matti Mäntysalo. "The Effect of Encapsulation Geometry on the Performance of Stretchable Interconnects." Micromachines 9, no. 12 (2018): 645. http://dx.doi.org/10.3390/mi9120645.

Full text

Abstract:

The stretchability of electronic devices is typically obtained by tailoring the stretchable interconnects that link the functional units together. The durability of the interconnects against environmental conditions, such as deformation and chemicals, is therefore important to take into account. Different approaches, including encapsulation, are commonly used to improve the endurance of stretchable interconnects. In this paper, the geometry of encapsulation layer is initially investigated using finite element analysis. Then, the stretchable interconnects with a narrow-to-wide layout are screen

APA, Harvard, Vancouver, ISO, and other styles

28

Ríos-Gutiérrez, Mar, and Bartłomiej Gostyński. "Comparative Study of the Fluoride Ion Interaction with Small Fullerenes and POSS Cages." Scientiae Radices 4, no. 2 (2025): 94–114. https://doi.org/10.58332/scirad2025v4i2a01.

Full text

Abstract:

This study investigates the encapsulation of the F- anion within fullerene and silsesquioxane (POSS) cage frameworks, using both Intermolecular Quantum Analysis (IQA) and Quantum Theory of Atoms in Molecules (QTAIM) at the DFT level of theory to analyze the effects of the F- presence on cage stability, as well as the nature of its interactions with the given framework. A detailed understanding of the energetic and electronic consequences of F- encapsulation is necessary to inform future design strategies for molecular encapsulation and ion stabilization in these and similar cage systems. The r

APA, Harvard, Vancouver, ISO, and other styles

29

Kim, Shin Young, Bong Jun Kim, Do Heung Kim, and Sung Gap Im. "A monolithic integration of robust, water-/oil-repellent layer onto multilayer encapsulation films for organic electronic devices." RSC Advances 5, no. 84 (2015): 68485–92. http://dx.doi.org/10.1039/c5ra10425d.

Full text

APA, Harvard, Vancouver, ISO, and other styles

30

Lee, Harrison Ka Hin, Andrew M. Telford, Jason A. Röhr, et al. "The role of fullerenes in the environmental stability of polymer:fullerene solar cells." Energy & Environmental Science 11, no. 2 (2018): 417–28. http://dx.doi.org/10.1039/c7ee02983g.

Full text

APA, Harvard, Vancouver, ISO, and other styles

31

Kuganathan, Navaratnarajah, Ruslan V. Vovk, and Alexander Chroneos. "Mayenite Electrides and Their Doped Forms for Oxygen Reduction Reaction in Solid Oxide Fuel Cells." Energies 13, no. 18 (2020): 4978. http://dx.doi.org/10.3390/en13184978.

Full text

Abstract:

The oxygen reduction reaction is an important reaction at the cathode in solid oxide fuel cells. Materials that exhibit high chemical and mechanical stability, high ionic and electronic conductivity, and are non-toxic are of great interest as cathodes for the reduction of oxygen. Here, we use density functional theory simulations to examine the efficacy of 12CaO·7Al2O3 and 12SrO·7Al2O3 electrides and their doped forms for the conversion of O2 gas to form O2− in their nanocages via encapsulation. Calculations show that encapsulation is exoergic in the un-doped electrides, and the formation of O

APA, Harvard, Vancouver, ISO, and other styles

32

Park, Chan, Hyunsuk Jung, Hyunwoo Lee, Sunguk Hong, Hyonguk Kim, and Seong Cho. "One-Step Laser Encapsulation of Nano-Cracking Strain Sensors." Sensors 18, no. 8 (2018): 2673. http://dx.doi.org/10.3390/s18082673.

Full text

Abstract:

Development of flexible strain sensors that can be attached directly onto the skin, such as skin-mountable or wearable electronic devices, has recently attracted attention. However, such flexible sensors are generally exposed to various harsh environments, such as sweat, humidity, or dust, which cause noise and shorten the sensor lifetimes. This study reports the development of a nano-crack-based flexible sensor with mechanically, thermally, and chemically stable electrical characteristics in external environments using a novel one-step laser encapsulation (OLE) method optimized for thin films

APA, Harvard, Vancouver, ISO, and other styles

33

Anggraeni, Ida Ayu Bela, Ni Made Wartini, and Lutfi Suhendra. "PENGARUH KOMBINASI TWEEN 80 DAN SPAN 80 SEBAGAI EMULSIFIER PADA ENKAPSULASI EKSTRAK BUNGA KENIKIR MENGGUNAKAN GUM ARAB." JURNAL REKAYASA DAN MANAJEMEN AGROINDUSTRI 10, no. 4 (2022): 493. http://dx.doi.org/10.24843/jrma.2022.v10.i04.p10.

Full text

Abstract:

The study aimed to know the effect of the combination of tween 80 and span 80 on the encapsulating characteristics of kenikir flower dye extract and determine the best combination of tween 80 and span 80 to produce encapsulated kenikir flower dye extract. This study using a simple Group Randomized Design with a combination treatment of tween 80 with span 80, to archive HLB values of 8, 9, 10, 11, 12, and 13. Each treatment is carried out 3 times so that 18 units are obtained. The data obtained is analyzed with variety analysis and if there is an effect of treatment on the observed variables, t

APA, Harvard, Vancouver, ISO, and other styles

34

Yu, Yunru, Jiahui Guo, Lingyu Sun, Xiaoxuan Zhang, and Yuanjin Zhao. "Microfluidic Generation of Microsprings with Ionic Liquid Encapsulation for Flexible Electronics." Research 2019 (June 19, 2019): 1–9. http://dx.doi.org/10.34133/2019/6906275.

Full text

Abstract:

Inspired by helical or spiral veins, which endow plants with excellent flexibility and elasticity to withstand storms, we present novel hollow microsprings with ionic liquid encapsulation for flexible and stretchable electronics. The microsprings were generated by using a coaxial capillary microfluidic device to consecutively spin poly(vinylidene fluoride) (PVDF) presolution and an ionic liquid, which formed laminar flows in the coaxial injection microfluidic channels. The fast phase inversion of PVDF helps to form the core-shell structure of a microfiber and guarantees the in situ encapsulati

APA, Harvard, Vancouver, ISO, and other styles

35

Shahidi, Arash M., Parvin Ebrahimi, Kalana Marasinghe, et al. "Influence of Encapsulation Size and Textile Integration Techniques on the Wash Durability of Textiles with Integrated Electronic Yarn." Fibers 13, no. 7 (2025): 89. https://doi.org/10.3390/fib13070089.

Full text

Abstract:

A crucial factor when developing e-textiles is ensuring their robustness and functionality during everyday activities, particularly washing. The ability to launder e-textile garments is not merely a matter of convenience but a necessity for widespread adoption. Incorporating electronics into textiles can lead to damage due to mechanical and chemical stresses, which most electronics are not designed to withstand. This work focuses on electronic yarn technology (e-yarn), in which electronic functionality is added to textiles by embedding small electronic components into a flexible yarn-like stru

APA, Harvard, Vancouver, ISO, and other styles

36

Chen, Li Xin, Ling Yu Fan, and Li Shuai Gao. "Modification of Epoxy Resin with Silicone for Electronic Encapsulation Application." Advanced Materials Research 936 (June 2014): 643–50. http://dx.doi.org/10.4028/www.scientific.net/amr.936.643.

Full text

Abstract:

The reaction was carried out with a solventless (hot-melt) method using epoxy resin (E-20) as a base material and dihydroxydiphenylsilane (DHDPS) or polymethyltriethoxysilane (PTS) as a modifier. IR spectrum, epoxy value of modified epoxy resins indicated that DHDPS and PTS were incorporated into epoxy resin respectively. The influences of silicone contents on softening point and thermal resistance of cured silicone modified epoxy resin systems were studied. The thermal stability was investigated by thermogravimetic analysis (TGA). Effects of the viscosity of packaging slurry on the performanc

APA, Harvard, Vancouver, ISO, and other styles

37

Lovino, Magalí, M. Fernanda Cardinal, Diana B. V. Zubiri, and Delia L. Bernik. "Electronic nose screening of ethanol release during sol–gel encapsulation." Biosensors and Bioelectronics 21, no. 6 (2005): 857–62. http://dx.doi.org/10.1016/j.bios.2005.02.003.

Full text

APA, Harvard, Vancouver, ISO, and other styles

38

Sawyer, Eric J., Aliaksandr V. Zaretski, Adam D. Printz, Nathaniel V. de los Santos, Alejandra Bautista-Gutierrez, and Darren J. Lipomi. "Large increase in stretchability of organic electronic materials by encapsulation." Extreme Mechanics Letters 8 (September 2016): 78–87. http://dx.doi.org/10.1016/j.eml.2016.03.012.

Full text

APA, Harvard, Vancouver, ISO, and other styles

39

Ho, Tzong-Hann, and Chun-Shan Wang. "Modification of epoxy resins by hydrosilation for electronic encapsulation application." Journal of Applied Polymer Science 54, no. 1 (1994): 13–23. http://dx.doi.org/10.1002/app.1994.070540102.

Full text

APA, Harvard, Vancouver, ISO, and other styles

40

Manna, Utsab, and Gopal Das. "Halo-methylphenyl substituted neutral tripodal receptors for cation-assisted encapsulation of anionic guests of varied dimensionality." CrystEngComm 20, no. 31 (2018): 4406–20. http://dx.doi.org/10.1039/c8ce00885j.

Full text

APA, Harvard, Vancouver, ISO, and other styles

41

Zhao, Wangcheng, Yan Du, Shameen Ashfaq, Shafaqat Ali, Amer M. Alanazi, and Moreno Santi. "Evaluation of the Efficacy, Biocompatibility, and Permeation of Bupivacaine-Loaded Poly(epsilon-caprolactone) Nano-Capsules as an Anesthetic." Journal of Biomedical Nanotechnology 18, no. 1 (2022): 268–76. http://dx.doi.org/10.1166/jbn.2022.3223.

Full text

Abstract:

In this study bupivacaine (BVC) was encapsulated in Nano-capsules of poly-ε-caprolactone (PCL) and its cytotoxicity in HaCaT (MTT) cells, its permeability in the oesophageal epithelium of pigs, as well as its anesthetic effect in the incision model of rat’s hind paw (electronic von Frey anesthesiometer) were evaluated. BVC and epinephrine-associated bupivacaine (BVC-Epi) have been compared to BVC-Nano and it was demonstrated that BVC-Nano had high physicochemical properties and remained stable for 120 days; also, encapsulation of bupivacaine did not affect its toxicity to HaCaT cells, but epin

APA, Harvard, Vancouver, ISO, and other styles

42

Kuganathan, Navaratnarajah, Ratnasothy Srikaran, and Alexander Chroneos. "Stability of Coinage Metals Interacting with C60." Nanomaterials 9, no. 10 (2019): 1484. http://dx.doi.org/10.3390/nano9101484.

Full text

Abstract:

Buckminsterfullerene (C60) has been advocated as a perfect candidate material for the encapsulation and adsorption of a variety of metals and the resultant metallofullerenes have been considered for the use in different scientific, technological and medical areas. Using spin-polarized density functional theory together with dispersion correction, we examine the stability and electronic structures of endohedral and exohedral complexes formed between coinage metals (Cu, Ag and Au) and both non-defective and defective C60. Encapsulation is exoergic in both forms of C60 and their encapsulation ene

APA, Harvard, Vancouver, ISO, and other styles

43

Kulkarni, Romit, Mahdi Soltani, Peter Wappler, et al. "Reliability Study of Electronic Components on Board-Level Packages Encapsulated by Thermoset Injection Molding." Journal of Manufacturing and Materials Processing 4, no. 1 (2020): 26. http://dx.doi.org/10.3390/jmmp4010026.

Full text

Abstract:

A drastically growing requirement of electronic packages with an increasing level of complexity poses newer challenges for the competitive manufacturing industry. Coupled with harsher operating conditions, these challenges affirm the need for encapsulated board-level (2nd level) packages. To reduce thermo-mechanical loads induced on the electronic components during operating cycles, a conformal type of encapsulation is gaining preference over conventional glob-tops or resin casting types. The availability of technology, the ease of automation, and the uncomplicated storage of raw material inte

APA, Harvard, Vancouver, ISO, and other styles

44

Corona, Domenico, Francesco Buonocore, Friedhelm Bechstedt, Massimo Celino, and Olivia Pulci. "Structural, Electronic and Vibrational Properties of B24N24 Nanocapsules: Novel Anodes for Magnesium Batteries." Nanomaterials 14, no. 3 (2024): 271. http://dx.doi.org/10.3390/nano14030271.

Full text

Abstract:

We report on DFT-TDDFT studies of the structural, electronic and vibrational properties of B24N24 nanocapsules and the effect of encapsulation of homonuclear diatomic halogens (Cl2, Br2 and I2) and chalcogens (S2 and Se2) on the interaction of the B24N24 nanocapsules with the divalent magnesium cation. In particular, to foretell whether these BN nanostructures could be proper negative electrodes for magnesium-ion batteries, the structural, vibrational and electronic properties, as well as the interaction energy and the cell voltage, which is important for applications, have been computed for e

APA, Harvard, Vancouver, ISO, and other styles

45

Beigi, Homayoon, and Judith A. Markowitz. "Standard audio format encapsulation (SAFE)." Telecommunication Systems 47, no. 3-4 (2010): 235–42. http://dx.doi.org/10.1007/s11235-010-9315-1.

Full text

APA, Harvard, Vancouver, ISO, and other styles

46

Löffler, Susanne, Axel Wuttke, Bo Zhang, Julian J. Holstein, Ricardo A. Mata, and Guido H. Clever. "Influence of size, shape, heteroatom content and dispersive contributions on guest binding in a coordination cage." Chem. Commun. 53, no. 87 (2017): 11933–36. http://dx.doi.org/10.1039/c7cc04855f.

Full text

Abstract:

Encapsulation of neutral guest molecules inside a self-assembled coordination cage was systematically studied using NMR and MS experiments. Electronic structure calculations reveal substantial contributions of dispersive interactions to binding.

APA, Harvard, Vancouver, ISO, and other styles

47

Khan, Zuhanee. "A review of phase change materials (PCMs) in electronic device cooling applications." Future Technology 1, no. 2 (2022): 36–45. http://dx.doi.org/10.55670/fpll.futech.1.2.5.

Full text

Abstract:

Due The portable electronic devices in everyday life have been getting increasingly compact day by day, and with the advancement in wireless technology, they are expected to facilitate multitasking. In this context, efficient heat dissipation to maintain consistent thermal performance has become quite a challenge. Phase change materials (PCMs) have emerged as a viable option to eliminate problems regarding the thermal management of compact electronics. This review looks into the different types of PCMs investigated by researchers so far, especially in the case of cooling compact electronic dev

APA, Harvard, Vancouver, ISO, and other styles

48

Wu, Jun Hui, Quan Zhou, Qiang Zhou, et al. "Thermal Design, Analysis and Verification of Chip-Level MCM with Properties of Semiconductor Materials." Advanced Materials Research 625 (December 2012): 280–86. http://dx.doi.org/10.4028/www.scientific.net/amr.625.280.

Full text

Abstract:

A lot of practice had proved that the failure rate can be used as the reliability indicators of MCM (Multi-Chip Module). The lower the junction temperature of the semiconductor integrated circuit device in MCM, the lower the failure rate of components was, thus the higher the reliability of MCM. Therefore, in order to measure the junction temperature of the semiconductor components of MCM, computer simulation is needed in the stage of design，which was essential for improving the reliability of MCM’s encapsulation and even the whole electronic machine system. In this paper, we tried to thermal

APA, Harvard, Vancouver, ISO, and other styles

49

Dai, Xiaolong, and Jianbo Li. "Study on the Performances of Toughening UV-LED-Cured Epoxy Electronic Encapsulants." Coatings 14, no. 11 (2024): 1347. http://dx.doi.org/10.3390/coatings14111347.

Full text

Abstract:

This study aims to investigate the effects of three toughening agents—core–shell rubber particles (CSR), nano-silica particles (NSPs), and epoxidized polybutadiene (EPB)—on the performance of UV-LED-cured epoxy electronic encapsulants. By systematically comparing the curing behavior, thermomechanical properties, and impact resistance of different toughening agents in alicyclic epoxy resins, their potential applications in more environmentally friendly UV-cured electronic encapsulation are evaluated. The results show that NSP and CSR toughened samples have fast cured speed under 365 nm UV-LED l

APA, Harvard, Vancouver, ISO, and other styles

50

Dragomir, David Catalin, Vlad Carbunaru, Carmen Aura Moldovan, et al. "Biocompatibility Analysis of GelMa Hydrogel and Silastic RTV 9161 Elastomer for Encapsulation of Electronic Devices for Subdermal Implantable Devices." Coatings 13, no. 1 (2022): 19. http://dx.doi.org/10.3390/coatings13010019.

Full text

Abstract:

The natural differences between human-made electronics and biological tissues constitute a huge challenge in materials and the manufacturing of next-generation bioelectronics. As such, we performed a series of consecutive experiments for testing the biofunctionality and biocompatibility for device implantation, by changing the exterior chemical and physical properties of electronics coating it with silicone or hydrogels. In this article, we present a comparison of the main characteristics of an electronic device coated with either silicone or hydrogel (GelMa). The coating was performed with a

APA, Harvard, Vancouver, ISO, and other styles

We offer discounts on all premium plans for authors whose works are included in thematic literature selections. Contact us to get a unique promo code!