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Relevant bibliographies by topics / Environmental aspects of Microelectronic packaging

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Academic literature on the topic 'Environmental aspects of Microelectronic packaging'

Author: Grafiati

Published: 4 June 2021

Last updated: 28 July 2025

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Journal articles on the topic "Environmental aspects of Microelectronic packaging"

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Dittman, Timothy. "The True Cost of Hermeticity in Microelectronic Packaging." International Symposium on Microelectronics 2016, no. 1 (2016): 000644–47. http://dx.doi.org/10.4071/isom-2016-thp45.

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Abstract Reliability in microelectronic packaging has been, and will continue to be, a major concern that must be taken into account early in the design of a package. Decisions made relative to packaging materials and the methods for achieving environmental protection drive many other aspects of the design, such as component selection and next higher assembly interfaces. A better understanding of current methods for achieving reliability allows the design community to determine the most appropriate packaging solution for use in a given application. Environmental protection in microelectronic p

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Middendorf, A., M. Böttcher, E. Jung, et al. "Challenges and novel approaches for the development of hardware-related trustworthy electronics." International Symposium on Microelectronics 2021, no. 1 (2021): 000376–81. http://dx.doi.org/10.4071/1085-8024-2021.1.000376.

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Abstract Emerging and future electronic components and systems must not only meet cost, performance, reliability, miniaturization and environmental requirements, they must also be trustworthy. In the near future, we have to trust even more electronic components and systems in everyday life, such as those used in self-driving cars or service robots. In this contribution, we present the challenges and novel approaches for the development of hardware-related trustworthy electronics. Our proposed solutions cover all aspects of the value chain starting with the confidentiality of secure production

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Mi, Jinhua, Yan-Feng Li, Yuan-Jian Yang, Weiwen Peng, and Hong-Zhong Huang. "Thermal Cycling Life Prediction of Sn-3.0Ag-0.5Cu Solder Joint Using Type-I Censored Data." Scientific World Journal 2014 (2014): 1–11. http://dx.doi.org/10.1155/2014/807693.

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Because solder joint interconnections are the weaknesses of microelectronic packaging, their reliability has great influence on the reliability of the entire packaging structure. Based on an accelerated life test the reliability assessment and life prediction of lead-free solder joints using Weibull distribution are investigated. The type-I interval censored lifetime data were collected from a thermal cycling test, which was implemented on microelectronic packaging with lead-free ball grid array (BGA) and fine-pitch ball grid array (FBGA) interconnection structures. The number of cycles to fai

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Duh, J. G., C. C. Young, and C. H. Cheng. "Microstructural characterization of Cu-Sn-Ni Solder in microelectronic packaging." Proceedings, annual meeting, Electron Microscopy Society of America 54 (August 11, 1996): 508–9. http://dx.doi.org/10.1017/s0424820100165008.

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Microelectronic packaging has experienced exciting growth in the past years, and solder joints plays important roles in the reliability of package system. Lead-tin (Pb-Sn) alloys are the most prominent solders for the interconnection and packaging of modern electionic components and devices. However, there are environmental concern on the toxicity of Pb. These concerns have inspired a great deal of research to study the feasibility of lead-free replacement alloys. It is known that the presence of intermetallic is often an indication of good wetting in solder joints. Nevertheless, excessive int

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Spence, Jacqueline L., and David A. Ogg. "The importance of environmental aspects of packaging." South African Journal of Business Management 25, no. 3 (1994): 118–25. http://dx.doi.org/10.4102/sajbm.v25i3.851.

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Increasing attention is being paid to packaging, a component of product in the marketing mix. It is being recognized that packaging is important not only from a functional viewpoint, but also in terms of marketing to the customer. One of the constraints on packaging is environmental issues. These are becoming increasingly important internationally, from both a legislative and consumer perspective. In this study the perceptions of the members of the packaging value chain as regards the functional, marketing and environmental issues surrounding packaging are examined. It is found that functional

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Biesheuvel, Kees, and Patrick Huberts. "High speed wafer grooving with UV‐USP lasers." PhotonicsViews 21, no. 2 (2024): 48–51. http://dx.doi.org/10.1002/phvs.202400009.

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AbstractThis article explores the application of ultraviolet ultrashort‐pulse (UV‐USP) laser grooving in tandem with other process steps such as plasma dicing as a practical approach to enable advanced microelectronic packaging. The non‐contact nature of UV‐USP laser grooving, along with its ability to ablate material with minimal lateral thermal damage, results in clean and precise grooving lines.

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Schröder, Henning, Wojciech Lewoczko-Adamczyk, and Daniel Weber. "Enabling photonic system integration by applying glass based microelectronic packaging approaches." EPJ Web of Conferences 266 (2022): 03020. http://dx.doi.org/10.1051/epjconf/202226603020.

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Advanced hybrid packaging technologies are used to enhance functionality of glass-based substrates featuring electrical, thermal and optical components including laser diodes, modulators, isolators, photonic integrated circuits, beam-splitters and micro lenses. Such glass-based substrates can be either thin glass layers on large panels containing optical waveguides or more mini-bench-like boards. Optical fiber interconnects, plugs, and electrical-optical integration platforms are used for higher level system integration. We discuss thin glass as a suitable base material for ion exchanged waveg

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Gobet, J., Ph Rychen, F. Cardot, and E. Santoli. "Microelectrode array sensor for water quality monitoring." Water Science and Technology 47, no. 2 (2003): 127–34. http://dx.doi.org/10.2166/wst.2003.0102.

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A versatile microelectrode array sensor for water quality monitoring has been developed. The array fabrication, based on batch microelectronic processes, results in a highly stable passivation of the silicon chip surface and provides the possibility to use a backside contact. Packaging was optimized for on-line water operation at high pressures. Examples of applications include chlorine monitoring in drinking water, ozone monitoring in deionized water, dissolved oxygen in activated sludge and preliminary measurements of trace arsenic.

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Qiu, Baojun, Jingang Xiong, Han Wang, et al. "Survey on Fatigue Life Prediction of BGA Solder Joints." Electronics 11, no. 4 (2022): 542. http://dx.doi.org/10.3390/electronics11040542.

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With the development of science and technology, consumers’ requirements for various electronic devices present a trend of more diverse functions and thinner bodies. This makes integrated circuits mounted in electronic products and their packaging more vital to satisfying the above requirements. Ball grid array (BGA) packaging is widely used in the field of microelectronic manufacturing industries due to its multiple I/O volumes and excellent electric characteristics. However, due to environmental loads such as vibration and impact during its production and application, defects inevitably emerg

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Vogt, Holger, Frank Altmann, Sebastian Braun, et al. "HOT-300 – A Multidisciplinary Technology Approach Targeting Microelectronic Systems at 300 °C Operating Temperature." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2016, HiTEC (2016): 000001–10. http://dx.doi.org/10.4071/2016-hitec-1a.

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Abstract Several applications in the fields of industrial sensors and power electronics are creating a demand for high operating temperature of 300 °C or even higher. Due to the increased temperature range new potential defect risks and material interactions have to be considered. As a consequence, innovation in semiconductor, devices and packaging technologies has to be accompanied by dedicated research of the reliability properties. Therefore various investigations on realizing high temperature capable electronic systems have shown that a multidisciplinary approach is necessary to achieve hi

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Dissertations / Theses on the topic "Environmental aspects of Microelectronic packaging"

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Zhang, Jian. "In-process stress analysis of flip chip assembly and reliability assessment during environmental and power cycling tests." Diss., Available online, Georgia Institute of Technology, 2004:, 2003. http://etd.gatech.edu/theses/available/etd-04082004-180504/unrestricted/zhang%5fjian%5f200312%5fphd.pdf.

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Zhang, Zhuqing. "No-flow underfill materials for environment sensitive flip-chip process." Thesis, Georgia Institute of Technology, 2001. http://hdl.handle.net/1853/19084.

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Cheng, Hoi Po 1975. "Popcorn for cushioning purpose." Thesis, McGill University, 2005. http://digitool.Library.McGill.CA:80/R/?func=dbin-jump-full&object_id=81610.

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In the packaging industry, cushioning products are usually made of plastic materials, such as polystyrene. The insulation and lightweight character make it more popular and convenient to use. However, the extensive use of it creates more waste leading to an environmental problem. Usually the cushioning foams are discarded after being used for inbox protection as packaging material; eventually they end up in a landfill. Most plastic foams are not biodegradable, which cannot be composted and will create more and more waste that affects the ecological system. In the mean time, foams made u

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Fairbanks, Ronald. "Assessing the environmental impact of polystyrene, paperboard and polypropylene food packaging articles used in retail for fast food applications using product life cycle assessment methods." Thesis, Stellenbosch : Stellenbosch University, 2008. http://hdl.handle.net/10019.1/5731.

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Thesis (MBA (Business Management))--Stellenbosch University, 2008.<br>ENGLISH ABSTRACT: Over the last few years consumers have become more environmentally focused and have transferred this pressure upwards through the supply chain to retailers and manufacturers in turn. One of the areas under scrutiny is food packaging, as this does not form part of the product being consumed or used. Packaging's primary function is to protect the contents from the time of manufacture until it is used and the environmental footprint of packaging is only a small portion of the overall food chains'. In a study c

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Chan, Ping-sum, and 陳冰心. "The impact of German packaging regulations and similar regulations in different countries on Hong Kong and the Hong Kong's economy." Thesis, The University of Hong Kong (Pokfulam, Hong Kong), 1993. http://hub.hku.hk/bib/B31252564.

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Haupt, Lynn. "Innovation with flexible packaging of wine : Western Cape consumer reactions to pouch." Thesis, Stellenbosch : University of Stellenbosch, 2010. http://hdl.handle.net/10019.1/6405.

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Wahab, Abdul, and Carl Kessler. "Eco-Friendliness Assessment Of Primary Food Packaging : A case study to assess relevant criteria and evaluate packaging options for sustainable development." Thesis, Jönköping University, JTH, Logistik och verksamhetsledning, 2021. http://urn.kb.se/resolve?urn=urn:nbn:se:hj:diva-53937.

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Purpose: The purpose of this thesis is to investigate how food start-ups (FS) can make their primary food packaging (PFP) more eco-friendly by identifying and evaluating the performance of suited packaging alternative. The purpose was fulfilled by answering the three research questions: RQ1) How to assess the eco-friendliness of PFP? RQ2) Which are areas of improvement in environmental performance? RQ3) What are the differences in performance across similar PFP’s? Methods: To answer the research questions both the literature review and empirical data was required. The literature study was co

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Tajelawi, Omolola Ayobamidele. "Using material flow cost accounting to determine the impacts of packaging waste costs in alcoholic beverage production in an alcoholic beverage company in Durban." Thesis, 2016. http://hdl.handle.net/10321/1603.

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Submitted in fulfillment of the requirements of the Master of Accounting degree, Faculty of Accounting and Informatics, Durban University of Technology, Durban, South Africa. Durban. South Africa, 2016.<br>A large number of manufacturing companies adopt the use of the traditional accounting method in their operations. This technique fails to reflect a detailed report of all material losses incurred in their production processes. Worthy of note, is that losses/waste are considered as inefficiencies in manufacturing operations and viewed as a costly venture to the sustainability of the company.

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Books on the topic "Environmental aspects of Microelectronic packaging"

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European Microelectronics & Packaging Conference (12th 1999 Harrogate, England). 12th European Microelectronics & Packaging Conference: Harrogate, Yorkshire, England, 7-9 June 1999 : proceedings. International Microelectronics & Packaging Society-Europe, 1999.

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McWilliams, Jacqueline M. Green packaging across Europe: An impediment to Irish export activity. University College Dublin, 1991.

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Cunningham, James A. An evaluation of environmental voluntary approaches: A case study of the Irish Packaging Voluntary Agreement. University College Dublin, 2002.

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Consortium, British Retail. Guidance notes on retail packaging: 1993 update. British Retail Consortium, 1993.

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Nast, Matthias. Die stummen Verkäufer: Lebensmittelverpackungen im Zeitalter der Konsumgesellschaft : umwelthistorische Untersuchung über die Entwicklung der Warenpackung und den Wandel der Einkaufsgewohnheiten (1950er bis 1990er Jahre). P. Lang, 1997.

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Perchard, Denise. Effects of environmental packaging legislation: A literature review. Pira International, 1994.

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National Risk Management Research Laboratory (U.S.) and University of Tennessee, Knoxville. Center for Clean Products and Clean Technologies, eds. Demonstration of packaging materials alternatives to expanded polystyrene. National Risk Management Research Laboratory, Office of Research and Development, U.S. Environmental Protection Agency, 1998.

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European Congress "Packaging & Environment" (3rd 1994 Brussels, Belgium). Shared responsibility in financing the management of packaging waste: The ethics of environmental communication with regard to packaging . Brussels Institute for Management of the Environment, 1995.

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Canada, Canada Consumer and Corporate Affairs. Guiding principles for environmental labelling and advertising. Consumer and Corporate Affairs Canada, 1991.

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Wolf, Nancy. Plastics: America's packaging dilemma. Island Press, 1991.

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Book chapters on the topic "Environmental aspects of Microelectronic packaging"

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Politis, Anastasios E., Christos Sarigiannidis, and Vasilis Voutsinas. "The Environmental Aspects of Packaging: Implications for Marketing Strategies." In Strategic Innovative Marketing and Tourism. Springer International Publishing, 2019. http://dx.doi.org/10.1007/978-3-030-12453-3_111.

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Yanamadala, Pavan Kumar. "Packaging materials." In A Text Book of Pharmaceutics for I Year Diploma in Pharmacy. THINKPLUS PHARMA PUBLICATIONS, 2024. http://dx.doi.org/10.69613/rjav7f23.

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Packaging materials are crucial components in pharmaceutical products, serving multiple functions beyond mere containment. They protect drugs from environmental factors such as light, moisture, and oxygen, thereby preserving their stability and efficacy. Various materials are employed in pharmaceutical packaging, including glass, plastics, metals, and flexible laminates, each with specific properties suited to different drug formulations and dosage forms. Primary packaging, which comes into direct contact with the drug, requires careful selection to ensure compatibility and stability. Secondar

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SHARMA, SATISH KUMAR. "BIODEGRADABLE PACKAGING: FOCUS ON STARCH-BASED ALTERNATE FILMS." In RECENT TRENDS IN FOOD PACKAGING. NOBLE SCIENCE PRESS, 2023. http://dx.doi.org/10.52458/9788196897437.nsp.2023.eb.ch-16.

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Starch-based biodegradable packaging has emerged as a promising and sustainable alternative to conventional packaging materials. This review delves into the key aspects of starch-based biodegradable packaging, exploring its significance in the context of environmental concerns and the growing demand for eco-friendly alternatives. The review covers the materials involved, their characteristics, and the environmental implications of adopting starch-based biodegradable packaging. The exploration of starch-based materials opens new avenues for environmentally conscious packaging solutions.

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Maria Mosconi, Enrico, Andrea Colantoni, and Mariarita Tarantino. "Strategies for Enhancing the Efficiency of Packaging and Managing Packaging Waste in Compliance with Regulations." In Solid Waste Management [Working Title]. IntechOpen, 2024. http://dx.doi.org/10.5772/intechopen.1007064.

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The packaging industry is a critical key point of the global economy, estimated to be worth around $1 trillion dollars. It is made of different sectors that work together to create a dynamic value chain, connecting companies, manufacturers, finance, and environmental aspects that influence each other. Overall, from the upstream to downstream of the processes, the packaging industry is a significant indicator of the economies’ development, production, and consumption trends. It is expected to grow by 4% annually from 2021 to 2026, mainly due to the increased use of materials such as cardboard.

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Singha, Surjit, Ranjit Singha, Shruti Jose, V. Muthu Ruben, and Alphonsa Diana Haokip. "Revolutionizing Packaging Sustainability Through Advanced Materials and Technologies." In Futuristic Technology for Sustainable Manufacturing. IGI Global, 2024. http://dx.doi.org/10.4018/979-8-3693-1862-1.ch010.

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Consumer engagement is identified as a catalyst for positive environmental impact in the context of sustainable packaging. It probes into three fundamental aspects collectively contributing to forming a conscientious community: packaging transparency and labelling, consumer education, and packaging as a narrative medium. Education promotes advocacy for sustainability, transparent labelling enables individuals to make informed decisions, and packaging narratives establish emotional connections. Collectively, they facilitate a transition towards conscientious consumption. The potential for impro

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Sharma, Meena, Anupal Mongia, Richa Pareek, and Lalita Kumari. "How Does Product Packaging Affect Consumers' Buying Decisions?" In Advances in Marketing, Customer Relationship Management, and E-Services. IGI Global, 2024. http://dx.doi.org/10.4018/979-8-3693-9351-2.ch012.

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The packaging gives constant development in marketing. It grows into the basic magnitudes in the production and manufacturing concept, as it plays an important role in prominence the mental image of the product to the consumer. The status of packaging makes marketing thinkers consider it to closed element for the marketing complex and positive process on which the product depends. Therefore, this study examines the packaging concept and its impact on consumers buying decisions. This study is based on primary data collection through a designed questionnaire and distributed to 750 consumers in t

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Kaur, Uttam, and Prashant Kumar Siddhey. "Innovative Eco-Friendly Solutions for Sustainability in the Packaging Industry." In Eco-Innovation and Sustainable Development in Industry 5.0. IGI Global, 2024. http://dx.doi.org/10.4018/979-8-3693-2219-2.ch012.

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Businesses are under pressure to embrace innovation for their survival, efficiency, and environmental performance, and to gain a competitive edge due to the shifting ecological environment and growing awareness of sustainability and waste management challenges. An increasing number of businesses are eager to implement an eco-innovation strategy to demonstrate their commitment to environmental protection and waste avoidance. As a result, packaging has an impact on society and the environment globally while also providing possibilities. Additional empirical study is needed to investigate the asp

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Enerijiofi, Kingsley Erhons, Ndukwe Maduka, Ruth Chiamaka Osaro-Matthew, and Cyril Ohikhatemen Ahonsi. "Nanoparticles in Food." In Advances in Environmental Engineering and Green Technologies. IGI Global, 2024. http://dx.doi.org/10.4018/979-8-3693-1890-4.ch018.

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The advent of nanotechnology in the twentieth century and its application in various aspects of food production, processing, and packaging offers a lot of benefits to the increasing world population facing food shortages, malnutrition, hunger, and foodborne illnesses, especially in developing countries. However, public health concerns, ethical considerations, and arguments over labeling of food products containing nanoparticles could influence the level of acceptability of the product by consumers. There are many commercial nanofoods of high quality manufactured by leading food companies in th

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Mir, Shabir Ahmad, and Manzoor Ahmad Shah. "Nanotechnology in the Food Industry." In Advances in Environmental Engineering and Green Technologies. IGI Global, 2015. http://dx.doi.org/10.4018/978-1-4666-6304-6.ch008.

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This chapter addresses the potential application of nanotechnology in various areas of the food industry. Nanotechnology is having an impact on several aspects of the food industry, from product development to packaging processes. Nanotechnology is capable of solving the very complex set of engineering and scientific challenges in the food processing industries. This chapter focuses on exploring the role of nanotechnology in enhancing food stability at the various stages of processing. Research has highlighted the prospective role of nanotechnology use in the food sector, including nanoencapsu

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Anjli and Ruturaj Baber. "Digital Transformation and Sustainability in the Age of Industry 5.0." In Practical Frameworks for New-Age Digitalization Business Strategy. IGI Global, 2025. https://doi.org/10.4018/979-8-3373-2018-2.ch006.

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The fusion of digitalization and sustainability drives changes in retail operations during traditional purchases and e-commerce operations thus creating 5IR business models. 5IR establishes human-centered priorities as essential aspects along with automated systems and big databases. Modern e-commerce development has created new market space yet it struggles with serious environmental issues which are coupled with supply chain ethical problems as well as excessive carbon footprint and excessive packaging waste. The analysis studies how digitalization transforms retail operations and e-commerce

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Conference papers on the topic "Environmental aspects of Microelectronic packaging"

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Zavadil, Priscila, and Régio Pierre da Silva. "Information design aiding the communication of environmental and social aspects in consumer packaging." In 6th Information Design International Conference. Editora Edgard Blücher, 2014. http://dx.doi.org/10.5151/designpro-cidi-23.

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Brown, Steven H. "Radiological Aspects of In Situ Uranium Recovery." In The 11th International Conference on Environmental Remediation and Radioactive Waste Management. ASMEDC, 2007. http://dx.doi.org/10.1115/icem2007-7379.

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In the last few years, there has been a significant increase in the demand for Uranium as historical inventories have been consumed and new reactor orders are being placed. Numerous mineralized properties around the world are being evaluated for Uranium recovery and new mining / milling projects are being evaluated and developed. Ore bodies which are considered uneconomical to mine by conventional methods such as tunneling or open pits, can be candidates for non-conventional recovery techniques, involving considerably less capital expenditure. Technologies such as Uranium in situ leaching in s

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Chhanda, Nusrat J., Jeffrey C. Suhling, and Pradeep Lall. "Effects of Moisture Exposure on the Mechanical Behavior of Polymer Encapsulants in Microelectronic Packaging." In ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. American Society of Mechanical Engineers, 2013. http://dx.doi.org/10.1115/ipack2013-73242.

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Polymer encapsulants exhibit evolving properties that change significantly with environmental exposures such as moisture uptake, isothermal aging and thermal cycling. In this study, the effects of moisture adsorption on the stress-strain behavior of a polymer encapsulant were evaluated experimentally. The uniaxial test specimens were exposed in an adjustable thermal and humidity chamber to combined hygrothermal exposures at 85 °C/85% RH for various durations. After moisture preconditioning, a microscale tension-torsion testing machine was used to evaluate the complete stress-strain behavior of

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Shevtsova, E. V., P. K. Shalkevich, and L. A. Lipnitski. "THE IMPACT OF PLASTIC AND ITS ALTERNATIVES ON THE ENVIRONMENT." In SAKHAROV READINGS 2022: ENVIRONMENTAL PROBLEMS OF THE XXI CENTURY. International Sakharov Environmental Institute of Belarusian State University, 2022. http://dx.doi.org/10.46646/sakh-2022-2-335-338.

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The environmental aspects of using plastic in the context of introduction and use of its alternatives are considered. Modern trends in replacing plastic packaging with its organic alternatives are assessed. The conditions are formulated when the use of plastic container alternatives are environmentally friendly.

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Poskas, P., V. Ragaisis, and J. E. Adomaitis. "Environmental Safety Aspects of the New Spent Nuclear Fuel Management and Storage System at Ignalina NPP." In The 11th International Conference on Environmental Remediation and Radioactive Waste Management. ASMEDC, 2007. http://dx.doi.org/10.1115/icem2007-7248.

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In the framework of the preparation for the decommissioning of the Ignalina Nuclear Power Plant (INPP) a new Interim Spent Nuclear Fuel Storage Facility (ISFSF) will be built in the existing sanitary protection zone (SPZ) of INPP. In addition to the ISFSF, the new spent nuclear fuel management activity will include all necessary spent nuclear fuel retrieval and packaging operations at the Reactor Units, transfer of storage casks to the ISFSF, and other activities appropriate to the chosen design solution and required for the safe removal of the existing spent nuclear fuel from storage pools an

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Lall, Pradeep, Yihua Luo, and Luu Nguyen. "Chlorine-Ion Related Corrosion in Cu-Al Wirebond Microelectronic Packages." In ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels. American Society of Mechanical Engineers, 2015. http://dx.doi.org/10.1115/ipack2015-48639.

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The increasing price of gold has resulted in industry interest in use of copper as alternative wire bonds interconnect material. Copper wire has the advantages of the lower cost, lower thermal resistivity, lower electrical resistivity, higher mechanical strength and higher deformation stability over the gold wire. In spite of the upside above, the Cu-Al wire bond is susceptible to the electrolytic corrosion and the reliability of Cu-Al wire bond is of great concern. Typical electronic molding compounds are hydrophilic and absorb moisture when exposed to humid environmental conditions. EMC cont

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Wright, M. W., D. Franzen, H. Hemmati, and M. Sandor. "Qualification and Reliability Testing of a Microchip Laser System for Space Applications." In ASME 2003 International Electronic Packaging Technical Conference and Exhibition. ASMEDC, 2003. http://dx.doi.org/10.1115/ipack2003-35298.

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A compact microchip laser pumped by a single fiber coupled diode laser was developed for a scanning laser radar instrument called Laser Mapper (LAMP) to be used as a guidance and control sensor in future JPL/NASA missions [1]. The system involves commercial-off-the-shelf components that were packaged and qualified for space applications. In particular, the system has to meet a 5000 hour minimum life requirement on a LEO platform. This paper discusses the process being used and the results of the selection and qualification of a low cost prepackaged diode laser with a custom packaged microchip

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Ramot, Medy. "Mechanical Design Aspects During Full-Scale Development Process of Electronic Assemblies for Military Systems." In ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. ASMEDC, 2005. http://dx.doi.org/10.1115/ipack2005-73026.

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Full-scale development of an electronic assembly is a very complex process conducted by a multidisciplinary team. The process involves numerous professional skills, the main being: Electrical, Mechanical, Software, Component and Reliability engineering. Electronic assemblies designed for military applications, require high quality performance, long life cycle (storage and mission profiles) and operation in harsh environmental conditions. This paper presents main aspects of the mechanical design and the issues to be considered during the full-scale development process of electronic units used i

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Barbosa, Maria Francilania Fontes, and Áurea Luiza Quixabeira Rosa e. Silva Rapôso. "Analysis of the use of plastic packaging for inputs in the cookie industry inArapiraca-AL from the perspective of Lean and Green practices." In ENSUS 2024 - XII Encontro de Sustentabilidade em Projeto. Grupo de Pesquisa Virtuhab/UFSC, 2024. http://dx.doi.org/10.29183/2596-237x.ensus2024.v12.n1.p1067-1076.

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The food industry faces challenges in reducing and properly disposing of plastic packaging for inputs. Lean and Green thinking, which combines Lean Manufacturing and Cleaner Production practices, can help with these challenges. This research sought to analyze the use of plastic packaging for the production of cookies in a small food industry in the city of Arapiraca-AL, with a view to proposing opportunities for environmental improvement in the production process. A literature search was carried out to identify Lean and Green practices; and the characterization of plastic packaging and the env

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Sankarasubramanian, Santosh, Jaime Cruz, Kyle Yazzie, et al. "High Temperature Interfacial Adhesion Strength Measurement in Electronic Packaging Using the Double Cantilever Beam Method." In ASME 2016 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2016. http://dx.doi.org/10.1115/imece2016-67007.

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Abstract:

Advanced microelectronic packages utilize a multitude of materials with dramatically different mechanical properties. Delamination occurring at the interfaces between these materials, due to poor adhesion and/or moisture exposure, is an important failure mode affecting the thermomechanical reliability of the package. The adhesion strength of these interfaces is a critical mechanical property that plays a role in the reliability performance of these packages. A good adhesion strength metrology is required to perform material selection and enable assembly process optimization in order to avoid t

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