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Dissertations / Theses on the topic 'Epoxy-adhesive'

Author: Grafiati
Published: 4 June 2021
Last updated: 25 July 2025

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1

Vertuccio, Luigi. "Nanofilled epoxy adhesive for structural aereonautic materials." Doctoral thesis, Universita degli studi di Salerno, 2017. http://hdl.handle.net/10556/2588.

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2015 - 2016<br>The focus of this study is to design new nano-modified epoxy adhesives using carbon nanofillers such as carbon nanotubes, carbon nanofibers and exfoliated graphite. Kinetic analysis, transport properties, dynamic mechanical properties and electrical properties have shown to be a powerful means for understanding molecular structure and phase composition of the formulated nanocomposites. Kinetic analysis, performed by using an advanced iso-conversional method and the Kamal’s model-diffusion controlled respectively, has shown which, in epoxy resin, based on the tetrafunctional epo
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2

REZAEI, MOHSEN. "Environmental effects on epoxy adhesive and joints." Doctoral thesis, Politecnico di Torino, 2012. http://hdl.handle.net/11583/2497165.

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The use of adhesive joining in mechanical structures, especially in industrial usage, is rapidly increasing. However, to be confident in their use it is essential to evaluate the performance of the joints, especially when their strength tends to decrease upon exposure to warm and humid conditions that cause degradation. Since degradation is a long time process and evaluating the degradation of adhesive joints in normal condition needs several months or years tests, accelerated test under controlled environment is unavoidable. Water can affect both the physical and mechanical properties o
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3

李雁婷 and Ralphaelynne Cochingyan Lee. "Investigation of epoxy and polychloroprene adhesive bonded joints." Thesis, The University of Hong Kong (Pokfulam, Hong Kong), 1987. http://hub.hku.hk/bib/B3120823X.

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4

Pyykkoe, Juha Petri Ensio. "The strength and durability of epoxy adhesive bonds." Thesis, Manchester Metropolitan University, 2002. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.392832.

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5

Lee, Ralphaelynne Cochingyan. "Investigation of epoxy and polychloroprene adhesive bonded joints /." [Hong Kong] : University of Hong Kong, 1987. http://sunzi.lib.hku.hk/hkuto/record.jsp?B12359506.

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6

Xu, Botao. "Fracture mechanisms and failure criteria of adhesive joints and toughened epoxy adhesives." Thesis, Queen Mary, University of London, 2010. http://qmro.qmul.ac.uk/xmlui/handle/123456789/371.

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Adhesive bonded applications are used widely in industry because of significant advantages such as uniform stress distribution, and the ability to join different materials. However most epoxy structural adhesives are brittle at room temperature and it is required to improve their toughness. The objective of this work was to understand the fracture of adhesive joints, failure criteria and rubber toughening mechanisms via a series of experiments and FEA modelling. Double lap joints (DLJ) bonded by commercial AV119 adhesive were studied. It was found that local strain and failure path were contro
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7

BERRY, NARA GUIDACCI. "MECHANICAL AND ADHESIVE PROPERTIES EVALUATION OF EPOXY RESINS BEFORE AND AFTER AGEING." PONTIFÍCIA UNIVERSIDADE CATÓLICA DO RIO DE JANEIRO, 2004. http://www.maxwell.vrac.puc-rio.br/Busca_etds.php?strSecao=resultado&nrSeq=6060@1.

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CONSELHO NACIONAL DE DESENVOLVIMENTO CIENTÍFICO E TECNOLÓGICO<br>Um tipo de resina epoxídica (RE) foi modificada com polibutadieno líquido hidroxilado (PBLH) a partir da mistura física de ambos os componentes (EPH) ou a partir da obtenção de copolímeros em bloco da resina epoxídica com PBLH funcionalizado com grupos isocianato (EPI) e carboxila (EPA). Foi realizado um estudo do comportamento mecânico desses sistemas epoxídicos, após a cura com um endurecedor a base de aminas, antes e após envelhecimento. Também foram avaliadas as propriedades adesivas, antes e após envelhecimento, atravé
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8

Rider, Andrew Chemistry Faculty of Science UNSW. "Surface Properties Influencing the Fracture Toughness of Aluminium-Epoxy Joints." Awarded by:University of New South Wales. School of Chemistry, 1998. http://handle.unsw.edu.au/1959.4/17804.

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This thesis systematically investigates the properties of the aluminium adherend which influence the fracture toughness of aluminium-epoxy adhesive joints in humid environments. The fracture energy of the adhesive joint exposed to a humid environment in comparison with the fracture energy in a dry environment provides a measure of the joint durability. A 500C and 95% relative humidity environment is used to simulate aging of an adhesive joint over several years under normal service conditions. Initially, surface roughness is found to have a significant influence on the fracture toughness of t
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9

Bhat, Narendra Venugopal. "Delamination suppression in graphite/epoxy composites via efficient use of film adhesive layers." Thesis, Massachusetts Institute of Technology, 1989. http://hdl.handle.net/1721.1/42979.

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10

Xu, Dingying. "Durability and Adhesion of a Model Epoxy Adhesive Bonded to Modified Silicon Substrates." Diss., Virginia Tech, 2004. http://hdl.handle.net/10919/28166.

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The adhesion and durability of model epoxy/silane/SiO2/Si bonded systems were investigated under various conditions, including the type of surface preparation, pH of the environmental media, temperature, cyclic thermal stress, and external applied stress. The fundamental debond mechanism was studied for bonded systems exposed to selected environments. The bond failure mode was characterized by examining the failed bond surfaces using X-ray photoelectron spectroscopy. The effectiveness of combining the oxygen plasma treatment and silane coupling agent (SCA) derivatization in adhesion promotion
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11

Rutgers, Lyndal Materials Science &amp Engineering Faculty of Science UNSW. "Development and fracture behaviour of graded alumina/epoxy joins." Awarded by:University of New South Wales. School of Materials Science and Engineering, 2005. http://handle.unsw.edu.au/1959.4/26004.

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Introduction of a composition gradient at a join between two materials of different elastic properties should reduce the stress concentrating effect of the interfacial discontinuity. A crack oriented perpendicular to this elasticity gradient will experience mode-mixity, and possible subsequent crack deflection. Explicit analytical solutions for the stress state at the tip of an angled crack in a graded material of a given finite geometry do not exist, and ongoing crack path development in such a gradient has not been characterised. An infiltration processing technique is developed which allows
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12

Leoni, Enrico. "Fracture toughness characterization of aluminium-epoxy adhesive joints reinforced with electrospun Nylon 6,6 nanofibers." Master's thesis, Alma Mater Studiorum - Università di Bologna, 2019. http://amslaurea.unibo.it/19226/.

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The use of adhesives to join two different substrates is an efficient replacement to classic joining technologies such as welding and soldering. One the one hand adhesion has different advantages over those techniques such as an improved stress distribution and the potential weight reduction of the structure; on the other hand, two of the most important drawbacks are a relatively low fracture toughness and the need of an accurate surface preparation. These two aspects will be accurately analysed in the present work: the use of Nylon nanofibers as reinforcement for the adhesive should increase
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13

Flores, Joel D. "Chemical characterization and two-step cure kinetics of a high performance epoxy adhesive system." Thesis, Wichita State University, 2006. http://hdl.handle.net/10057/1609.

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The cure kinetics of a high performance epoxy adhesive system based on TGDDM/DGEBA/DDS/DICY and toughened with carboxy terminated poly(acrylonitrile-co-butadiene) rubber with aluminum filler was investigated using differential scanning calorimetry. Three different sets of experiments were performed to follow the cure kinetics of the adhesive in a multi-step cure cycle. Three-dimensional plots of data entered into a surface-fitting software allowed for the interpolation of the degree and rate of cure as functions of heating rate and temperature, time and temperature, or time and initial degree
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14

Flores, Joel D. Stevenson William T. K. "Chemical characterization and two-step cure kinetics of a high performance epoxy adhesive system." Diss., A link to full text of this thesis in SOAR, 2006. http://soar.wichita.edu/dspace/handle/10057/1609.

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Thesis (M.S.)--Wichita State University, College of Liberal Arts and Sciences, Dept. of Chemistry.<br>"July 2006." Title from PDF title page (viewed on Nov. 4, 2007). Thesis adviser: William T. K. Stevenson. Includes bibliographic references (leaves 95-99).
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15

Salinas-Ruiz, Maria del Mar. "Development of a rubber toughened epoxy adhesive loaded with carbon nanotubes, for aluminium-polymer bonds." Thesis, Cranfield University, 2009. http://dspace.lib.cranfield.ac.uk/handle/1826/4415.

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This thesis describes the formulation of a ternary thermosetting adhesive which consists of a diglycidyl ether of bisphenol-A (DGEBA) epoxy resin cured with 3,3’-diamino diphenyl sulphone (3,3’-DDS) hardener and modified through the addition of carboxyl- terminated butadiene-acrylonitrile (CTBN) rubber and multi-walled carbon nanotubes (MWCNTs). Processing implications of the novel adhesive in the film form are considered in order to manufacture bonded specimens for characterisation of the adhesive performance in structural joints. The ternary blend which represents the novel adhesive formulat
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16

Ivanova, Katya Ivanonva. "The effect of hygrothermal ageing on the mechanical and dielectric properties of an epoxy adhesive." Thesis, University of Strathclyde, 2003. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.275161.

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17

Vrana, Mark A. "A chemical and mechanical evaluation of interfacial fracture in dicyandiamide cured epoxy/steel adhesive systems." Diss., This resource online, 1995. http://scholar.lib.vt.edu/theses/available/etd-06062008-163707/.

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18

Lanyon, Benjamin P. "Novel techniques for the characterisation of curing epoxy adhesive systems using non-contact electromagnetic acoustic transducers." Thesis, University of Warwick, 2005. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.425551.

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19

Cardanini, Alisha Ann. "Finite Element Analysis of Bi-Metallic Structures with Adhesive Delamination." The Ohio State University, 2017. http://rave.ohiolink.edu/etdc/view?acc_num=osu150185598849201.

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20

Hernandez, Baltodano Dany Arnoldo [UNESP]. "Strain rate dependent behavior of composite materials and epoxy." Universidade Estadual Paulista (UNESP), 2017. http://hdl.handle.net/11449/150330.

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Submitted by DANY ARNOLDO HERNÁNDEZ BALTODANO (danyhdzb@hotmail.com) on 2017-04-18T19:13:44Z No. of bitstreams: 1 Thesis Dany Hernandez.pdf: 2171039 bytes, checksum: 8f2efded7710ccbd5aed9274952116a7 (MD5)<br>Approved for entry into archive by Luiz Galeffi (luizgaleffi@gmail.com) on 2017-04-18T20:27:33Z (GMT) No. of bitstreams: 1 hernandezbaltodano_da_me_bauru.pdf: 2171039 bytes, checksum: 8f2efded7710ccbd5aed9274952116a7 (MD5)<br>Made available in DSpace on 2017-04-18T20:27:33Z (GMT). No. of bitstreams: 1 hernandezbaltodano_da_me_bauru.pdf: 2171039 bytes, checksum: 8f2efded7710ccbd5aed9274
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21

Bump, Maggie Bobbitt. "The Effect of Chemistry and Network Structure on Morphological and Mechanical Properties of Diepoxide Precursors and Poly(Hydroxyethers)." Diss., Virginia Tech, 2001. http://hdl.handle.net/10919/27350.

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This dissertation research addresses the interrelationships between chemistry and network structure in epoxy networks as well as how mechanical properties of the resulting networks are affected by these relationships. The effects of chemistry and network structure on interphase morphology and performance in vinyl ester/carbon fiber composites have also been investigated on both a macro and nanoscale. Thermosets were prepared with blends of bisphenol-A and novel phosphine oxide based diepoxide oligomers using a siloxane or a novolac crosslinking agent. In the siloxane cured networks the inc
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22

Nitowski, Gary Alan. "Topographic and Surface Chemical Aspects of the Adhesion of Structural Epoxy Resins to Phosphorus Oxo Acid Treated Aluminum Adherends." Diss., Virginia Tech, 1998. http://hdl.handle.net/10919/29461.

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Structural adhesive bonding offers several advantages over other types of joining. These include improved stress distribution and increased design flexibility. Adhesive bonding is important in aerospace, automotive, and packaging applications. However, the full potential of the technology has not been exploited because the understanding of the basic mechanisms of adhesion and adhesion failure is incomplete. This investigation elucidates the chemical and mechanical mechanisms responsible for durable adhesion of epoxy resins to phosphorus oxo acid treated aluminum alloys. By s
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23

Othman, Daryan Jalal. "The influence of adhesive curing temperature upon the performance of FRP strengthened steel structures at ambient and elevated temperatures." Thesis, University of Edinburgh, 2017. http://hdl.handle.net/1842/29646.

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The structural adhesives widely used in structural strengthening applications are thermoset ambient cure adhesive polymers. At ambient temperatures, these polymers are in a relatively hard and inflexible state. At higher temperatures, the material becomes soft and flexible. The region where the molecular mobility changes dramatically is known as the glass transition temperature Tg and often is presented as a single value. Epoxy polymers exhibit a significant reduction in mechanical properties near glass transition temperature Tg when they are exposed to elevated temperatures. Glass transition
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24

Al-Mansouri, Omar. "Behavior of bonded anchors in concrete under fire." Thesis, Ecole nationale supérieure Mines-Télécom Lille Douai, 2020. http://www.theses.fr/2020MTLD0011.

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La technique des ancrages par scellement chimique consiste à sceller une tige filetée dans un trou foré dans le béton durci grâce à une résine polymère. Les principaux avantages de cette technique sont la facilité d’installation et les propriétés mécaniques élevées de la résine à température ambiante. Grâce à l’adhérence de la résine, ce type d’ancrage peut être dimensionné pour avoir des performances similaires voire supérieures de celles des autres systèmes d’ancrages (mécaniques et coulés en place). En revanche, à hautes températures, e.g. incendie, l’adhérence de la résine se dégrade rapid
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25

Yang, Kao Z. "MENs Doped Adhesive and Influence on Fracture Toughness." FIU Digital Commons, 2016. http://digitalcommons.fiu.edu/etd/2487.

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Composites are in high demand; however, fasteners are often required for joining process and can reduce their advantages. One solution is adhesive bonding, but uncertainty exists regarding long term durability and the ability to interrogate bonds noninvasively. One potential solution to qualify bond integrity over its service life is to dope an adhesive with magneto-electric nanoparticles (MENs). MENs can yield output magnetic signatures that are influenced by bond quality and damage state. In this study, adhesives have been doped with MENs prior to bonding at 1% volume concentration. For opti
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26

Zhang, Huiying. "An Evaluation of the Durability of Polymer Concrete Bonds to Aluminum Bridge Decks." Thesis, Virginia Tech, 1999. http://hdl.handle.net/10919/31655.

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The objective of this study is to evaluate the bond durability of an epoxy-based polymer concrete wearing surface bonded to aluminum bridge decks. In the bridge design, an aluminum alloy bridge deck is used with a polymer concrete wearing surface. A modified mixed mode flexure fracture test was developed to assess the bond durability of specimens aged in the following environmental conditionings: 30°C [86°F], 98% RH; 45°C [113°F], 98% RH; 60°C [140°F], 98% RH; freezing and thawing; salt (NaCl) water soak; and 60°C [140°F], dry. The exposure times varied from none to twelve months. T
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27

Frank, Niklaus. "Adhesive Wafer Bonding for Microelectronic and Microelectromechanical Systems." Doctoral thesis, KTH, Signals, Sensors and Systems, 2002. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-3410.

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<p>Semiconductor wafer bonding has been a subject of interestfor many years and a wide variety of wafer bonding techniqueshave been reported in literature. In adhesive wafer bondingorganic and inorganic adhesives are used as intermediatebonding material. The main advantages of adhesive wafer bondingare the relatively low bonding temperatures, the lack of needfor an electric voltage or current, the compatibility withstandard CMOS wafers and the ability to join practically anykind of wafer materials. Adhesive wafer bonding requires nospecial wafer surface treatmentssuch as planarisation.Structur
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28

Queiroz, Rodrigo Albani. "Estudo do comportamento em fluência de juntas metálicas coladas." Universidade do Estado do Rio de Janeiro, 2013. http://www.bdtd.uerj.br/tde_busca/arquivo.php?codArquivo=6082.

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Fundação Carlos Chagas Filho de Amparo a Pesquisa do Estado do Rio de Janeiro<br>Juntas coladas têm se mostrado como a principal alternativa de união entre componentes fabricados em materiais distintos ou não, tendo como vantagem principal a ausência de aporte de calor e melhor distribuição de tensões. A literatura mostra que estudos anteriores foram realizados com o objetivo de caracterizar diversas propriedades associados às juntas, porém, pouco ainda se conhece sobre o comportamento dessas uniões relacionado à fluência. Os ensaios de fluência têm como principal desvantagem a baixa produtivi
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29

Gärdin, Marcus. "Characterization of Graphene-Based Anisotropic Conducting Adhesives : A study regarding x-ray sensing applications." Thesis, KTH, Skolan för elektroteknik och datavetenskap (EECS), 2019. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-257844.

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A common method of cancer treatment is radiation therapy. In radiation therapy, a treatment planning system is made to specify the dose of X-rays needed to eradicate the tumor. To assure the right amount of X-ray dosage a quality assurance is using a phantom containing radiation sensors. The sensors are made of semiconductor materials with heavy metal-based contacts. Irradiating heavy elements with a high-intensity beam such as Xrays causes secondary scattering of electrons, resulting in an additional photocurrent which may distort the signal used in the quality analysis. By exchanging the hea
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30

Patel, Ammar Abbas. "Epoxy Adhesives: Formulation for Sustainability and Mechanism of Adhesion." Case Western Reserve University School of Graduate Studies / OhioLINK, 2020. http://rave.ohiolink.edu/etdc/view?acc_num=case1573254388960149.

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31

Cayssials, Franck. "Prise en compte des propriétés viscoélastiques de colles structurales pour l'optimisation de joints adhésifs vis-à-vis de leur résistance au choc." Paris, ENSAM, 1995. http://www.theses.fr/1995ENAM0043.

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Si dans l'industrie automobile, le compromis prestation/fiabilité/cout est satisfaisant avec la technique d'assemblage par collage, une telle technique ne peut se limiter au choix d'un adhésif particulier. Il est indispensable d'optimiser le couple substrat-adhésif (et donc l'adhésif), vis-à-vis de sa résistance au choc. Dans la présente étude, nous nous sommes attaches a démontrer le bon comportement au choc d'un assemblage colle tôle/adhésif/tôle en prenant en compte les propriétés viscoélastiques de l'adhésif et en étudiant l'influence de certaines charges. Nous avons notamment pu mettre en
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32

Delozanne, Justine. "Durabilité des époxys ; application au collage structural aéronautique." Thesis, Paris, ENSAM, 2018. http://www.theses.fr/2018ENAM0071/document.

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Cette thèse porte sur l’étude multi-échelle du vieillissement d’assemblages collés à base de colle époxy employés dans le domaine aéronautique. Dans leurs conditions de service, ces matériaux sont soumis à un vieillissement humide, qui peut s’accompagner d’un vieillissement thermique essentiellement lors des phases de décollage des avions. De telles conditions rendent difficiles la prédiction de la durée de vie basée uniquement sur le suivi des propriétés mécaniques des assemblages (par des tests de cisaillement simple ou de clivage) lors d’essais de vieillissement normalisés qui prévalent, po
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33

Brethous, Romain. "Assemblages collés modèles à base d’adhésifs nanostructurés : interdiffusion entre des copolymères triblocs et une résine époxyde." Thesis, Toulouse, INPT, 2013. http://www.theses.fr/2013INPT0151/document.

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La solution collage représente un intérêt industriel croissant dans l’assemblage des matériaux. Cependant, à cause des propriétés propres d’un polymère, l’utilisation de cette technologie d’assemblage est limitée par sa température de service. Afin d’augmenter la zone d’opérabilité du joint adhésif, la solution du Joint Multi Adhésifs a déjà été initiée par le passé. Ce joint repose sur la combinaison d’un adhésif résistant à basses températures LTA et d’un second résistant à hautes températures HTA. Le premier joint est placé sur les bords de l’assemblage tandis que le second occupe une posit
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34

Sauvage, Jean-Baptiste. "Caractérisation et modélisation de l’adhérence dans les assemblages collés." Thesis, Mulhouse, 2016. http://www.theses.fr/2016MULH9553/document.

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Cette thèse porte sur le développement d’un essai mécanique pour la caractérisation de l’adhérence d’une colle à un substrat. L’enjeu est d’étudier les différentes méthodes de la caractérisation de l’adhérence dans les assemblages collés et de pouvoir modéliser le comportement associé. La première partie de la thèse consiste en une étude bibliographique des essais mécaniques permettant de caractériser l’adhérence. Ceux-ci sont classés en distinguant les essais en propagation et ceux en initiation de rupture. Cet état de l’art fait ressortir l’intérêt de l’utilisation de l’essai de flexion 3 po
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Chauffaille, Sébastien. "Durabilite des assemblages collés : aspects mécaniques et physico-chimiques." Thesis, Bordeaux 1, 2011. http://www.theses.fr/2011BOR14237/document.

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L’assemblage par collage est une technique de plus en plus utilisée dans les industries aéronautique, aérospatiale et médicale. L’étude des assemblages est d’une grande importance et nécessite le développement de techniques de contrôle des performances, autant au niveau mécanique, que physico-chimique. Dans cette étude nous abordons plusieurs problématiques liées au collage. La première approche est purement mécanique, avec la mise au point d’un essai à simple levier ou « Single Cantilever Beam adhesion test » (SCB), variante du « Wedge test » dans lequel une charge constante est appliquée a u
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Bergara, Tomas. "Réversibilité de l'adhérence dans des assemblages structuraux modèles." Thesis, Bordeaux 1, 2011. http://www.theses.fr/2011BOR14445.

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La démontabilité des assemblages collés structuraux est une nouvelle problématique liée à l’augmentation de l’utilisation de la technologie du collage dans de nombreux secteurs industriels et de la prise en compte de l’éco-conception dans les processus industriels. Peu de travaux ont été menés à ce jour sur cette thématique qui représente un véritable verrou technologique pour la diffusion de la technologie d’assemblage par collage. Une des voies utilisées et détaillées dans la présente étude est basée sur l’incorporation, dans une formulation d’adhésif, d’un additif organique solide possédant
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Anandarajah, Arumugam. "Fracture mechanics of adhesive joints in shear." Thesis, University of Dundee, 1991. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.357160.

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38

Kodokian, George-Kevork. "Adhesive bonding of thermoplastic fibre-composites." Thesis, Imperial College London, 1989. http://hdl.handle.net/10044/1/8815.

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Hashim, Safa A. "Assessment of adhesive bonding for structural design with thick adherends." Thesis, University of Glasgow, 1992. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.318869.

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40

Moretti, Laure. "Simulation des distorsions de cuisson de pièces composites élaborées par co-bonding en autoclave." Thesis, Ecole nationale des Mines d'Albi-Carmaux, 2019. http://www.theses.fr/2019EMAC0009.

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Les composites stratifiés en fibres de carbone et à matrices thermodurcissables sont, grâce à leurs propriétés spécifiques, des matériaux très performants pour les pièces de structure primaire en aéronautique. Cependant, durant leur élaboration, de nombreux phénomènes multi-physiques conduisent à l’apparition de contraintes et de déformations résiduelles qui impactent la géométrie finale de la pièce. Ces écarts de géométrie sont critiques pour les pièces de grandes dimensions et les assemblages. Il est donc primordial de prédire ces déformations par la simulation. Le travail effectué au cours
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MAGGIORE, SOFIA. "Studio e caratterizzazione di sistemi adesivi polimerici da utilizzare in processi di giunzione innovativi." Doctoral thesis, Università degli studi di Genova, 2022. http://hdl.handle.net/11567/1073669.

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This study was dealt with the development of polymeric adhesive systems to be used in innovative junction processes based on friction stir welding (FSW) technology, and in particular on the hybrid technique FSW-bonding, for joining elements composed of metal alloys. The addition of suitable additives, such as inorganic fillers, to the most promising formulations was aimed at obtaining materials not only leading to a stronger adhesion between the phases, but also characterized by improved thermal properties and good resistance to oxidation and chemical attacks. Furthermore, due to their relevan
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Jackson, Mitchell L. "Investigation of Adhesive and Electrical Performance of Waterborne Epoxies for Interlayer Dielectric Material." Diss., Virginia Tech, 1999. http://hdl.handle.net/10919/40359.

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The primary differences between the solventborne and waterborne epoxy printed circuit board (PCB) impregnating resins arise from the distinct physical compositions and drying characteristics of the polymer solution and the latex emulsion. The presence of residual surfactant from the waterborne epoxy emulsion poses a concern for dielectric performance and adhesive durability. Another problem involves the crystallization of insoluble solid dicyandiamide (DICY), which is significantly different in morphology than that found in solution cast resins. A two-stage drying model was employed to ga
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Liptak, Stephen C. "Modification, curing and flame retardation of epoxy resin networks." Diss., This resource online, 1995. http://scholar.lib.vt.edu/theses/available/etd-11082006-133628/.

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44

Phung, Huong Lan. "Grenzflächenuntersuchungen an geklebten Fügeteilen und Entwicklung von Methoden zur Verbesserung der Klebfestigkeit." Doctoral thesis, Saechsische Landesbibliothek- Staats- und Universitaetsbibliothek Dresden, 2005. http://nbn-resolving.de/urn:nbn:de:swb:14-1130926872239-10629.

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Neuere Erzeugnisse zeichnen sich häufig durch eine Werkstoffvielfalt aus. Teilweise sind die Werkstoffe thermisch empfindlich. Aus allen diesen Gründen wird das weitgehend werkstoffunspezifische und wärmearme Verfahren Kleben für das Fügen von Bauteilstrukturen immer wichtiger. Es ist seit langem bekannt, dass die Festigkeit und vor allem die Alterungsbeständigkeit der Klebverbindungen neben der Art des gewählten Klebstoffes in ganz wesentlichem Umfang von den physikalischen, chemischen und morphologischen Eigenschaften der Fügeteiloberflächen abhängig ist. Die Eigenschaft der Klebverbindung w
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45

Wong, King Jye. "Moisture absorption characteristics and effects on mechanical behaviour of carbon/epoxy composite : application to bonded patch repairs of composite structures." Phd thesis, Université de Bourgogne, 2013. http://tel.archives-ouvertes.fr/tel-00949293.

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Le travail présenté dans ce mémoire avait pour objectif d'étudier le processus de la pénétration d'eau dans les composites en carbone/époxyde dans un premier temps, et dans un deuxième temps, d'étudier l'effet de la prise en eau par ces matériaux sur les performances mécaniques des composites et leur joints collés. L'intégration de ces phénomènes physiques dans la modélisation numérique est d'une grande importance dans la prédiction de la durabilité d'une structure en composite subissant un vieillissement hygrothermique. Par conséquent, ce travail consiste non seulement en des observations exp
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46

Phung, Huong Lan. "Grenzflächenuntersuchungen an geklebten Fügeteilen und Entwicklung von Methoden zur Verbesserung der Klebfestigkeit." Doctoral thesis, Technische Universität Dresden, 2004. https://tud.qucosa.de/id/qucosa%3A24590.

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Neuere Erzeugnisse zeichnen sich häufig durch eine Werkstoffvielfalt aus. Teilweise sind die Werkstoffe thermisch empfindlich. Aus allen diesen Gründen wird das weitgehend werkstoffunspezifische und wärmearme Verfahren Kleben für das Fügen von Bauteilstrukturen immer wichtiger. Es ist seit langem bekannt, dass die Festigkeit und vor allem die Alterungsbeständigkeit der Klebverbindungen neben der Art des gewählten Klebstoffes in ganz wesentlichem Umfang von den physikalischen, chemischen und morphologischen Eigenschaften der Fügeteiloberflächen abhängig ist. Die Eigenschaft der Klebverbindung w
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47

Roberts, Graeme. "An investigation into silver filled insulating resins as a conductive adhesive for solder replacement." Thesis, Edinburgh Napier University, 2000. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.327662.

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48

Li, Jing. "ELECTRICAL AND MECHANICAL CHARACTERIZATION OF MWNT FILLED CONDUCTIVE ADHESIVE FOR ELECTRONICS PACKAGING." UKnowledge, 2008. http://uknowledge.uky.edu/gradschool_diss/594.

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Lead-tin solder has been widely used as interconnection material in electronics packaging for a long time. In response to environmental legislation, the lead-tin alloys are being replaced with lead-free alloys and electrically conductive adhesives in consumer electronics. Lead-free solder usually require higher reflow temperatures than the traditional lead-tin alloys, which can cause die crack and board warpage in assembly process, thereby impacting the assembly yields. The high tin content in lead-free solder forms tin whiskers, which has the potential to cause short circuits failure. Conduct
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O'Brien, Emmett P. "Durability of Adhesive Joints Subjected to Environemntal Stress." Diss., Virginia Tech, 2003. http://hdl.handle.net/10919/29139.

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Environmental stresses arising from temperature and moisture changes, and/or other aggressive fluid ingressions can degrade the mechanical properties of the adhesive, as well as the integrity of an adhesive interface with a substrate. Therefore such disruptions can significantly reduce the lifetime and durability of an adhesive joint.1-4 In this research, the durability of certain epoxy adhesive joints and coatings were characterized using a fracture mechanics approach and also by constant frequency impedance spectroscopy. The shaft-loaded blister test (SLBT) was utilized to measure the strai
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Devaux, Ophélie. "Analysis and optimization of mixed-mode conical adhesively bonded joints under thermo-mechanical loadings." Thesis, Brest, 2015. http://www.theses.fr/2015BRES0048/document.

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Dans I'industrie spatiale, I'optimisation des structures composites du point de vue cycles de fabrication, gain de masse et amélioration des performances passe aujourd'hui par I'introduction de jonctions collées en remplacement/complément de liaisons boulonnées ou rivetées. Les lanceurs sont des structures complexes qui nécessitent de prendre en compte les contraintes liées à la fabrication de structures de grandes tailles, I'influence des conditions de transport et de stockage, ainsi que les différents spectres de chargements thermo-mécaniques rencontrés au cours de la phase de lancement. Le
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