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Dissertations / Theses on the topic 'Epoxy compositions'

Author: Grafiati

Published: 28 May 2022

Last updated: 30 July 2025

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1

Wainwright, Robin. "Mechanical properties of epoxy/alumina trihydrate-filled compositions." Thesis, Kingston University, 1991. http://eprints.kingston.ac.uk/20557/.

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The mechanical properties of alumina trihydrate (ATH)-filled epoxy resin at loadings of up to 100 parts by weight ATH per hundred of resin (epoxy and hardener) (pphr) have been investigated. A low peak exotherm, increased Young's modulus and increased critical strain energy release rate (G[sub]IC) and critical stress intensity factor (K[sub]IC) can be achieved by incorporating a dispersion of ATH into an epoxy resin. However, the high filler loadings required for effective fire resistance reduce tensile strength and elongation. Tensile modulus increases with filler loading in line with previou

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2

Мариняка, Катерина Анатоліївна. "Розробка технології та визначення властивостей наповнених епоксидних композитів функціонального призначення". Магістерська робота, Київський національний університет технологій та дизайну, 2021. https://er.knutd.edu.ua/handle/123456789/19309.

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Дипломну магістерську роботу присвячено розробці технології та визначенню властивостей наповнених епоксидних композитів функціонального призначення. В результаті проведених теоретичних та експериментальних досліджень рекомендовані склад та параметри технології та визначення властивостей наповнених епоксидних композитів функціонального призначення. Досліджено фізико-механічні властивості композицій на основі епоксидної смоли ЕД-20 та затверджувача триетилентетраміну та проведено аналіз впливу вмісту наповнювача на їх основні властивості. Обґрунтовано та обрано обладнання для виготовлення та дос

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3

Бардадим, Ю. В. "Фізична модифікація епоксидних композицій". Thesis, Сумський державний університет, 2016. http://essuir.sumdu.edu.ua/handle/123456789/53315.

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Висока хімічна стійкість до впливу агресивних середовищ, гарні діелектричні властивості, підвищена зносостійкість зумовлюють широке застосування епоксидних композитів. Вони ефективно використовують для захисту технологічного обладнання від корозії та з метою поліпшення фізико-механічних і теплофізичних властивостей деталей машин у багатьох галузях промисловості.

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4

Tidrick, Shari Lynne. "Investigations of the silane/epoxy matrix interphase for silane coupling agent blends of varying composition." Case Western Reserve University School of Graduate Studies / OhioLINK, 1991. http://rave.ohiolink.edu/etdc/view?acc_num=case1055857671.

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5

Cracknell, John Gordon. "Epoxy resin/polyethersulphone semi-interpenetrating polymer networks : the effect of curing and composition on structure and properties." Thesis, University of Ulster, 1993. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.334417.

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6

Biao, Qi. "Sanding, Grit Blasting and Plasma Etching: Effect on Surface Composition and Surface Energy of Graphite/Epoxy Composites." University of Cincinnati / OhioLINK, 2009. http://rave.ohiolink.edu/etdc/view?acc_num=ucin1244125510.

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7

Qi, Biao. "Sanding, grit blasting and plasma etching effect on surface composition and surface energy of graphite/epoxy composites /." Cincinnati, Ohio : University of Cincinnati, 2009. http://rave.ohiolink.edu/etdc/view.cgi?acc_num=ucin1244125510.

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8

ROBY, BENJAMIN JAMES. "EFFECT OF GRIT-BLASTING AND PLASMA ETCHING ON THE SURFACE COMPOSITION AND SURFACE ENERGY OF GRAPHITE/EPOXY COMPOSITES." University of Cincinnati / OhioLINK, 2005. http://rave.ohiolink.edu/etdc/view?acc_num=ucin1131650624.

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9

Nieves, Ian Ivan. "Effects of Electron Irradiation and Percent Composition on the Glass Transition Temperature and Damping of Boron-Epoxy Composites." W&M ScholarWorks, 1996. https://scholarworks.wm.edu/etd/1539626045.

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10

Bonner, J. K. "Kirk", and Silveira Carl de. "Thermal Cycling Fatigue Investigation of Surface Mounted Components with Eutectic Tin-Lead Solder Joints." International Foundation for Telemetering, 1996. http://hdl.handle.net/10150/611418.

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International Telemetering Conference Proceedings / October 28-31, 1996 / Town and Country Hotel and Convention Center, San Diego, California<br>Eutectic (63% tin-37% lead) or near-eutectic (40% tin-60% lead) tin-lead solder is widely used for creating electrical interconnections between the printed wiring board (PWB) and the components mounted on the board surface. For components mounted directly on the PWB mounting pads, that is, surface mounted components, the tin-lead solder also constitutes the mechanical interconnection. Eutectic solder has a melting point of 183°C (361°F). It is importa

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11

Chen, Yu Hsien, and 陳玉仙. "High Performance Bismaleimide-Cyanate Ester-Epoxy Resin Compositions." Thesis, 2004. http://ndltd.ncl.edu.tw/handle/22999451550540636094.

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碩士<br>國立高雄應用科技大學<br>化學工程系碩士班<br>92<br>Epoxy resins, which represent some of the most widely used resins in electronics applications, are characterized by easy processability, good adhesion to various substrates, high chemical and corrosion resistance, and excellent electric and mechanical properties. However, epoxy resins have relatively poor performance at high temperatures, have high dielectric constants, and exhibit significant water absorption. Generally, bismaleimide is combined with cyanate ester to create a resin class generally known as BT resins using in the fabrication of flip chips,

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12

Sheng-ChanLi and 李昇展. "Latent Heat-curable Epoxy Compositions and Vapor Grown Carbon Nanofibers Reinforced Epoxy Composites For Electrical and Mechanical Applications." Thesis, 2013. http://ndltd.ncl.edu.tw/handle/44952786253326103010.

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碩士<br>國立成功大學<br>材料科學及工程學系碩博士班<br>101<br>The dissertation is divided into two parts: Part 1: The development of a new latent heat-curable epoxy composition. The Lab composition 3(D) has been developed for the demand from Ming-An Company. The Lab composition 3(D)’s curing temperature and glass transition temperature (Tg) are close to the composition provided by Ming-An Company, but its pot life is more stable than the Ming-An composition. From DSC isothermal curing kinetics, we found out that the Lab composition 3(D)’s activation energy is a little higher than the Ming-An composition, but its cu

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13

Lin, Ching Yao, and 林敬堯. "Synthesis and properties of phosphinated crosslinkable polyesters and compositions of phosphinated active ester and epoxy." Thesis, 2016. http://ndltd.ncl.edu.tw/handle/40703051302110661151.

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碩士<br>國立中興大學<br>化學工程學系所<br>104<br>Part Ⅰ. Using the previously successful synthesis of phosphorated diol (1) in the laboratory, phosphinated copolyesters based on the alcoholysis and polycondensation of (1) with poly(ethylene terephthalate) (PET) and poly(butylene terephthalate) (PBT) were prepared. The crystallinity of copolyesters decreased gradually with the content of (1), as shown in wide-angle X-ray diffractograms and differential scanning calorimetry thermograms. Dynamic mechanical analysis show Tg increased with the content of (1). UL-94 flame retardant test shows that the flame resist

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14

Oommen, Charlie. "Phase Modification And Combustion Studies On Ammonium Nitrate And Propellant Compositions." Thesis, 1997. https://etd.iisc.ac.in/handle/2005/1769.

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15

Oommen, Charlie. "Phase Modification And Combustion Studies On Ammonium Nitrate And Propellant Compositions." Thesis, 1997. http://etd.iisc.ernet.in/handle/2005/1769.

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16

Huang, Chun-Kai, and 黃俊凱. "PARTⅠ The Effect of Compositions on the physical properties of the Hydrogel、PARTⅡ The Curing Properties of Epoxy/Clay Nanocomposite." Thesis, 2001. http://ndltd.ncl.edu.tw/handle/91694383587847911250.

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碩士<br>元智大學<br>化學工程研究所<br>89<br>PARTⅠ The Effect of Compositions on the physical properties of the Hydrogel Abstract The effects of constituents on the dimensional change, water absorbability, and ultra-violet (UV) absorption of the hydrogel are studied. A modified UV absorbing compound is successfully synthesized. The UV absorbing power of the hydrogel can reach class I and class II standard with the addition of 2.0 and 1.2 parts per hundred of this UV compound, respectively. In addition, the modified UV stabilizer has very good thermal stability and remains

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17

HSU, WEN-CHENG, and 許文政. "The influence on electric performance of epoxy resin inkjet printing composition." Thesis, 2009. http://ndltd.ncl.edu.tw/handle/01551453839440267567.

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碩士<br>國立臺灣科技大學<br>高分子系<br>97<br>The thesis selected Diglycidyl Ether of Bisphenol A epoxy resin(DGEBA) as base material, curning by the addition of NMA. The curning temperature was approximately 180~200℃ while merely adding NMA; this research was to join different proportion (1.0PHR, 1.5PHR, 2.0PHR, 2.5PHR) of benzyldimethylamine (BDMA) to accelerate the entire curning process, and by implementing the test of Rigid-body Pendulum Rheometer to observe crosslinking curning response. Since the base material appeared better curning response under 2.5PHR of benzyldimethylamine, this research applied

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18

Cheng, Ming-Feng, and 鄭名峯. "Study of Fillers Effect on Epoxy Resin Composition for PCB Application." Thesis, 2006. http://ndltd.ncl.edu.tw/handle/52vpry.

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博士<br>國立臺灣科技大學<br>高分子系<br>94<br>Abstract The object of this study is fillers effect on epoxy resin composition for PCB application. There are three mainly parts of research have investigated in this thesis: First part is study of comparative tracking index (CTI) on brominated epoxy and its application of Copper Clad Laminate. Influence of different type of epoxy and addition of various fillers effect on characteristic of copper clad laminate has investigated. The second part is effeteness of various fillers and its application on CEM-1 laminate punchability improvement. The result of decreasi

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19

Wu, Yu-Mei, and 吳裕美. "Study on curing behavior、aggregate structure、Mechanical Properties of Epoxy/PEL Composition." Thesis, 2006. http://ndltd.ncl.edu.tw/handle/bkuz99.

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碩士<br>國立臺灣科技大學<br>高分子系<br>94<br>The polypropylene oxide-polyethylene oxide copolymer (PEL) and epoxy resin were blended by the method of simultaneous polymerization. It was exploring the toughened mechanism of the PEL-Epoxy resin with some tests. The compatibility of the blend system was discussed by TGA and DMA. In the results, the tensile strength would be promoted with increasing the PEL content. While the PEL content was 30PHR, the elongation ratio would go to a maximum. Because that there was not any chemical bond between the pure PEL and Epoxy resin. This made the flaws in cross-linki

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20

Shu, Hung Kuo, and 黃國書. "A study on the Composition ,Flow Behavior and Porperties of Underfilling Epoxy for Flip Chip Encapsulation Application." Thesis, 1999. http://ndltd.ncl.edu.tw/handle/52475061446568442750.

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碩士<br>國立臺灣科技大學<br>纖維及高分子工程研究所<br>87<br>In this study the effect of naphthalene structure on Epoxy resin properties were studied ,The thermal properties ,moisture absorption ,flame resistance With Nylon Powder moldified epoxy resin were also investigated. Due to ,the molding compound apply to liquid encapsulated, and it ask very strict for process of term ,so the research tested to improve resin properties with the temperature of low melting of Nylon Powder.

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21

Kao, Hong-Hane, and 高弘翰. "A study on the composition, flow behavior and physical properties of Epoxy Molding Compound used in IC Encapsulation." Thesis, 1999. http://ndltd.ncl.edu.tw/handle/95291072656441095519.

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碩士<br>國立臺灣科技大學<br>纖維及高分子工程研究所<br>87<br>Abstract The effect of the nylon powder on the curing procedure and physical properties of integrated circuit packages sealed with an epoxy molding compound was studied. For the purpose, five sets of epoxy molding compound with different content of nylon powder having mean size of 6.5mm were prepared. DSC measurement obtained the curing temperature that applied to Rigid-Body Pendulum Rheometer for the curing behavior measurement. The result reveals that the gel time is around 5 minutes, the degree of network is 0.3, the glass t

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22

Chen, Sin-Nan, and 陳幸男. "Effect of Silver Nanoparticle/Silver Nanowire Composition on the Electric Properties of UV-curable Conductive Epoxy-Acrylic Adhesives." Thesis, 2011. http://ndltd.ncl.edu.tw/handle/71887299980393306337.

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碩士<br>國立高雄應用科技大學<br>化學工程與材料工程系<br>99<br>Epoxy-acrylic based UV-light-curable electrically conductive adhesives (Ag-ECAs) were formulated from epoxy-acrylic resin, silver nanoparticle and silver nanowire in which silver nanoparticle was prepared by in-suit reduction of silver nitrate (AgNO3) with N,N’-dimethylformamide (DMF). As for 1 ~ 3M AgNO3/DMF solution, silver nanoparticles are efficiently reduced by DMF with diamteter of about 30 ~ 40 nm, the surface plasma resonance characteristic peak appeared in the UV-vis spectrum in the vicinity of 420 nm. The particle size of prepared silver nanopa

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23

Hsu, Meng-Chieh, and 徐盟傑. "A Study on the composition,flow behavior and physical properties of Silicone blend No-Flow Underfilling Epoxy for Flip Chip Encapsulation Application." Thesis, 1999. http://ndltd.ncl.edu.tw/handle/42648906426423801064.

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碩士<br>國立臺灣科技大學<br>纖維及高分子工程研究所<br>87<br>Here we explored the curing reaction of epoxy with three acid-anhydride type of curing agents. For the reaction mechanism naphthalene epoxy resin and curing agents, we measure the conversion of resin by constant heating and isothermal reaction, to study the relationship of conversion rate-time-temperature .We also used cone & plate rheometer to study the gel time and viscosity under different temperature . Blased on the DSC conversion time and gel time detected ,Methyl Tetrahydro Phthalic Anhydride(MTPA) is the most efficient curing agent. So,we chose MTP

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24

Колосов, Олександр Євгенович. "Обгрунтування процесів та обладнання для одержання виробів з композицій епоксиполімерів ультразвуковою модифікацією". Doctoral thesis, 2010. https://ela.kpi.ua/handle/123456789/653.

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