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Relevant bibliographies by topics / Eutectic tin-lead solder

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Journal articles
Dissertations / Theses
Conference papers

Academic literature on the topic 'Eutectic tin-lead solder'

Author: Grafiati

Published: 4 June 2021

Last updated: 1 February 2022

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Journal articles on the topic "Eutectic tin-lead solder"

1

Zubelewicz, A., Q. Guo, E. C. Cutiongco, M. E. Fine, and L. M. Keer. "Micromechanical Method to Predict Fatigue Life of Solder." Journal of Electronic Packaging 112, no. 2 (1990): 179–82. http://dx.doi.org/10.1115/1.2904360.

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Fatigue lifetimes of low-tin high-lead and tin-lead eutectic solders under total strain controlled tension-tension tests were studied in this paper. Based on the stress and strain micro-macro correlations, a modified Coffin-Manson law is obtained. The modified lifetime prediction formulas which had been used to predict the fatigue lifetime for low-tin high-lead solder, exhibiting cyclic hardening and then saturation, was found to apply to the eutectic solder, where substantial cyclic softening has been observed. This micromechanically based approach allows one to model the known physical pheno

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George, Elviz, Michael Osterman, Michael Pecht, and Richard Coyle. "Effects of Extended Dwell Time on Thermal Fatigue Life of Ceramic Chip Resistors." International Symposium on Microelectronics 2012, no. 1 (2012): 000127–35. http://dx.doi.org/10.4071/isom-2012-ta44.

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The understanding of the effects of temperature cycling parameters, such as dwell and ramp times, mean cyclic temperature, and temperature range, on the fatigue life of solder interconnects is critical for qualification and reliability testing. After the solder achieves complete stress relaxation, a further increase in dwell time does not decrease the fatigue life of solder interconnects. Studies have shown that an increase in dwell time beyond a certain limit (10–20 minutes) has no effect on the fatigue life of eutectic tin-lead solder when cycled at peak cycle temperatures at or above 100°C.

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Ghosh, G., and M. E. Fine. "Interfacial Reaction Between Tin-Zinc Based Solders and Copper." Microscopy and Microanalysis 3, S2 (1997): 715–16. http://dx.doi.org/10.1017/s1431927600010461.

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Due to the interfacial reaction between the solder and substrate, either during manufacturing or in service, the solder joints may contain one or more intermetallic layers at the interface. While such intermetallic layers may provide strong bonding, they may also be responsible for problems associated with solderability and reliability of joints. Certain physical and mechanical properties of the intermetallic may determine the integrity and reliability of solder assembly. So far detailed analysis, modelling, and testing of simulated and actual joints have been performed with Pb-Sn solders. How

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Jen, K. P., and J. N. Majerus. "Stress-Strain Equations for Some Near-Eutectic Tin-Lead Solders." Journal of Engineering Materials and Technology 113, no. 4 (1991): 475–84. http://dx.doi.org/10.1115/1.2904128.

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This paper presents the evaluation of the stress-strain behavior, as a function of strain-rate, for three tin-lead solders at room temperature. This behavior is critically needed for reliability analysis of printed circuit boards (PCB) since handbooks list minimal mechanical properties for the eutectic solder used in PCBs. Furthermore, most handbook data are for stable eutectic microstructure whereas PCB solder has a metastable microstructure. All three materials were purchased as “eutectics.” However, chemical analysis, volume fraction determination, and microhardness tests show some major va

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Chen, Fang, Yun Fei Du, Rong Chang Zeng, Gui Sheng Gan, and Chang Hua Du. "Thermodynamics of Oxidation on Pb-Free Solders at Elevated Temperature." Materials Science Forum 610-613 (January 2009): 526–30. http://dx.doi.org/10.4028/www.scientific.net/msf.610-613.526.

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Based on the available thermodynamic and phase equilibria data, the thermodynamic criteria for oxidation in tin-based lead-free solders under soldering condition was deduced. The dependence of Gibbs free energy on temperature in Pb-free solder oxidation reaction was calculated by applying MATLAB program. The characteristics of oxidation reaction of a varity of solder alloy systems such as Sn-Ag, Sn-Cu, Sn-Sb, Sn-Zn, Sn-Ag-Cu and Sn-Pb eutectic alloys at elevated temperature were analyzed. The results suggested that zinc preferentially oxidized in Sn-Zn solder alloys in the elevated temperature

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George, Elviz, Michael Osterman, Michael Pecht, Richard Coyle, Richard Parker, and Elizabeth Benedetto. "Thermal Cycling Reliability of Alternative Low-Silver Tin-Based Solders." Journal of Microelectronics and Electronic Packaging 11, no. 4 (2014): 137–45. http://dx.doi.org/10.4071/imaps.424.

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Sn-3.0Ag-0.5Cu (SAC305) alloy is the most widely used solder in electronic assemblies. However, issues associated with cost and drop/shock durability have resulted in a search for alternative lead-free solder alloys. One approach to improve the drop/shock reliability has been to reduce the silver content in Sn-Ag-Cu alloys. Another approach is doping Sn-Ag-Cu solder with additional elements. In 2008, the International Electronics Manufacturing Initiative (iNEMI) started the “Characterization of Pb-Free Alloy Alternatives” project to provide a comprehensive study of 15 tin-based solder intercon

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Palmer, Mark A., Christy N. Alexander, and Brian Nguyen. "Forming solder joints by sintering eutectic tin-lead solder paste." Journal of Electronic Materials 28, no. 7 (1999): 912–15. http://dx.doi.org/10.1007/s11664-999-0219-3.

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Kang, Sung K., and Thomas G. Ference. "Nickel-alloyed tin-lead eutectic solder for surface mount technology." Journal of Materials Research 8, no. 5 (1993): 1033–40. http://dx.doi.org/10.1557/jmr.1993.1033.

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A new ternary solder alloy of tin-lead-nickel was developed for solder joints. It has an optimum composition range of (60–65)% Sn, (35–40)% Pb, (0.5–1.0)% Ni by weight. The alloy exhibits a higher strength and longer fatigue life than the pure 63% Sn−37% Pb eutectic. Melting point, wettability, and fatigue life were the key properties used to determine this composition. In particular, the melting point of the alloyed eutectic solder did not change for rapidly solidified samples when up to 2 wt. % Ni was added. Instead of modifying the solution melting temperature, the majority of the Ni precip

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Mei, Z., J. W. Morris, and M. C. Shine. "Superplastic Creep of Eutectic Tin-Lead Solder Joints." Journal of Electronic Packaging 113, no. 2 (1991): 109–14. http://dx.doi.org/10.1115/1.2905375.

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The creep behavior of air-cooled and liquid nitrogen-quenched soldered joints of 60/40 Sn-Pb at 65°C has been studied. The stress exponent, n, in the power law, γ˙ (steady state strain rate) ∝σn (applied stress), changes from a value of about 6 to values of 2 to 3, as γ˙ decreases below 10−4 in/in per second. This result, combined with the authors’ previous stepped load creep test results, indicates a transition of the creep deformation mechanism from conventional dislocation climb to superplastic grain boundary sliding. The superplastic creep of the soldered joints is ascribed to their non-la

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Hare, E. W., and R. G. Stang. "Stress relaxation behavior of eutectic tin-lead solder." Journal of Electronic Materials 24, no. 10 (1995): 1473–84. http://dx.doi.org/10.1007/bf02655466.

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Dissertations / Theses on the topic "Eutectic tin-lead solder"

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Kobe, Bradley A. "Metallurgical interactions of palladium with lead-tin eutectic solder." Thesis, National Library of Canada = Bibliothèque nationale du Canada, 1999. http://www.collectionscanada.ca/obj/s4/f2/dsk1/tape8/PQDD_0002/MQ42077.pdf.

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Bonner, J. K. "Kirk", and Silveira Carl de. "Thermal Cycling Fatigue Investigation of Surface Mounted Components with Eutectic Tin-Lead Solder Joints." International Foundation for Telemetering, 1996. http://hdl.handle.net/10150/611418.

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International Telemetering Conference Proceedings / October 28-31, 1996 / Town and Country Hotel and Convention Center, San Diego, California<br>Eutectic (63% tin-37% lead) or near-eutectic (40% tin-60% lead) tin-lead solder is widely used for creating electrical interconnections between the printed wiring board (PWB) and the components mounted on the board surface. For components mounted directly on the PWB mounting pads, that is, surface mounted components, the tin-lead solder also constitutes the mechanical interconnection. Eutectic solder has a melting point of 183°C (361°F). It is importa

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Xing, Yan. "Study of thermal and chemical factors which influence solidification of tin in near eutectic Sn-3.0Ag-XCu lead free solder." Diss., Online access via UMI:, 2006.

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Zhan, Sheng. "Surface insulation resistance degradation and electrochemical migration : the susceptibility of lead-free & eutectic tin-lead solder to electrochemical migration on printed circuit boards /." College Park, Md. : University of Maryland, 2007. http://hdl.handle.net/1903/6736.

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Thesis (Ph. D.) -- University of Maryland, College Park, 2007.<br>Thesis research directed by: Mechanical Engineering. Title from t.p. of PDF. Includes bibliographical references. Published by UMI Dissertation Services, Ann Arbor, Mich. Also available in paper.

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Conference papers on the topic "Eutectic tin-lead solder"

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Yang, Dan, M. Alam, B. Wu, and Y. Chan. "Thermomigration in eutectic tin-lead flip chip solder joints." In 2006 8th Electronics Packaging Technology Conference. IEEE, 2006. http://dx.doi.org/10.1109/eptc.2006.342775.

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Nurmi, Sami T., Janne J. Sundelin, Eero O. Ristolainen, and Toivo K. Lepisto¨. "The Effect of Multiple Reflow Times on Lead-Free Solder Joint Microstructure." In ASME 2003 International Electronic Packaging Technical Conference and Exhibition. ASMEDC, 2003. http://dx.doi.org/10.1115/ipack2003-35150.

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As environmental issues are raising more interest and are becoming crucial factors in all parts of the world, more and more environmental-friendly electronics products are emerging. Usually this means the introduction of products with lead-free solders. However, the reliability of lead-free solders is still a serious concern despite the vast research done in this field. This paper will describe the interconnect reliability of three kinds of solder joints respectively prepared with lead-free solder paste and lead-free PBGA components, lead-free solder paste and tin-lead-silver PBGA components,

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Goray, Kunal, Saketh Mahalingam, Amit Shah, and Abhijit Dasgupta. "Thermal Shock Testing as a Reliability Qualification Test for Lead-Free Solder." In ASME 2006 International Mechanical Engineering Congress and Exposition. ASMEDC, 2006. http://dx.doi.org/10.1115/imece2006-15561.

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Accelerated thermal cycling tests are used to ascertain the reliability of solder interconnects in electronics assemblies. These tests typically last a few months and therefore, are highly resource intensive. Thermal shock tests on the other hand are faster but have been found to be ineffective in accelerating thermal cycling failures for eutectic tin lead solder. In this paper, thermal shock testing is proposed as an alternative to conventional thermal cycling testing for lead-free solder interconnects using Sn, Ag and Cu (SAC) solder. Results from the thermal shock and thermal cycling testin

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Tunga, Krishna, James Pyland, Raghuram V. Pucha, and Suresh K. Sitaraman. "Study on the Choice of Constitutive and Fatigue Models in Solder Joint Life Prediction." In ASME 2002 International Mechanical Engineering Congress and Exposition. ASMEDC, 2002. http://dx.doi.org/10.1115/imece2002-39676.

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Various constitutive and fatigue-life predictive models for lead-tin solders in SBGA (Super Ball Grid Array) packages are studied and compared with the results from experimental data. Two solder compositions, 62Sn/36Pb/2Ag and 63Sn/37Pb are studied in this work. The fatigue life of 62Sn/36Pb/2Ag solder is studied using different constitutive models that take into consideration both the time-independent and time-dependent behavior of the solder. The fatigue life of 62Sn/36Pb/2Ag solder is predicted using an energy-based predictive model and compared with the experimental data. The choice of var

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Shen, Y. L., K. C. R. Abell, and S. E. Garrett. "Effects of Grain Boundary Sliding on Microstructural Evolution and Damage Accumulation in Tin-Lead Alloy." In ASME 2002 International Mechanical Engineering Congress and Exposition. ASMEDC, 2002. http://dx.doi.org/10.1115/imece2002-32885.

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Experiments on the eutectic tin-lead alloy were conducted to study the effects of grain boundary sliding on the deformation and damage processes at the microscopic level. The primary objective is to gain mechanistic understandings of solder joint reliability in microelectronic packaging. Bulk specimens were subject to relatively fast deformations of tension, compression and bending, for the purposes of examining the pure mechanical effect without the influence of diffusion related phenomena. Grain realignment and phase redistribution were characterized by microscopy and microhardness indentati

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Gowda, Arun, Anthony Primavera, and K. Srihari. "Site Redressing Techniques and Rework of Lead-Free Chip Scale Packages." In ASME 2003 International Mechanical Engineering Congress and Exposition. ASMEDC, 2003. http://dx.doi.org/10.1115/imece2003-55637.

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The implementation of lead-free solder into an electronics assembly process necessitates the reassessment of the individual factors involved in component attachment and rework. A component assembly undergoes multiple thermal cycles during rework. With the use of lead-free solder, the assemblies are subjected to higher assembly and rework temperatures than those required for eutectic tin-lead assemblies. The rework of lead-free area array components involves the removal of defective component, preparation of the printed circuit board attachment pad (site redressing), solder paste replenishment

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Heaslip, Greg M., Jeff M. Punch, Bryan A. Rodgers, and Claire Ryan. "Board Level Drop Tests Comparing Lead-Free and Eutectic Solder Interconnects on a BGA Package for Mobile ICT Applications." In ASME 2004 International Mechanical Engineering Congress and Exposition. ASMEDC, 2004. http://dx.doi.org/10.1115/imece2004-59162.

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There is considerable reported evidence that a large percentage of failures which afflict portable electronic products are due to impact or shock during use. Failures of the external housing, internal electronic components, package-to-board interconnects, and liquid crystal display panels may occur as the result of accidental drops. Moreover, the introduction of lead-free solder to the electronics industry will bring additional design implications for future generations of mobile information and communication technology (ICT) applications. In this paper, drop tests performed on printed circuit

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Ma, Hongtao, Jeffrey C. Suhling, Yifei Zhang, Pradeep Lall, and Michael J. Bozack. "Evolution of Lead Free Solder Material Behavior Under Elevated Temperature Aging." In ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference. ASMEDC, 2007. http://dx.doi.org/10.1115/ipack2007-33545.

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The microstructure, mechanical response, and failure behavior of lead free solder joints in electronic assemblies are constantly evolving when exposed to isothermal aging and/or thermal cycling environments. In our prior work on aging effects (Ma, et al., ECTC 2006), we demonstrated that the observed material behavior variations of SAC405 and SAC305 lead free solders during room temperature aging (25 °C) were unexpectedly large and universally detrimental to reliability. Such effects for lead free solder materials are much more dramatic at the higher aging temperatures (e.g. 100–150 °C) typica

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Ege, E. S., and Y. L. Shen. "Deformation and Damage in Solder During Fast Cyclic Loading." In ASME 2003 International Electronic Packaging Technical Conference and Exhibition. ASMEDC, 2003. http://dx.doi.org/10.1115/ipack2003-35030.

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Experimental and numerical studies on fast cyclic loading of eutectic tin-lead solder and relevant micromechanical issues are presented. High-frequency twin-lap shear tests on solder joints show cracking inside the solder but often connecting the intruded tips of the intermetallic. Finite element modeling was carried out to study the effect of intermetallic morphology. Without the influence of local phase coarsening, the intrusion of intermetallic into the solder alloy is seen to trigger strain localization which promotes failure. The effect of local phase coarsening was also studied numerical

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Subbarayan, Guhan, Robert Kinyanjui, Pei Fang Tsai, and Krishnaswami Srihari. "Mechanical Reliability Evaluation of Stripped and Replated Component Termination Finishes." In ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference. ASMEDC, 2007. http://dx.doi.org/10.1115/ipack2007-33666.

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The termination finish of Small Output Integrated Circuit (SOIC) and Small Output Transistor (SOT) chip components were converted from Pb-free to Sn-Pb (backward conversion) and vice versa (forward conversion). The motivation for these conversions is due to a combination of factors such as the supply chain constraints on component availability, European Union’s (EU) legislation on “Restriction of Hazardous Substances” (or RoHS), and the growth of tin whiskers on matte tin finish components. The conversions were performed using a “Robotic Stripping and Solder Dipping Process”, and the mechanica

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