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Journal articles on the topic 'Eutectic tin-lead solder'

Author: Grafiati

Published: 4 June 2021

Last updated: 1 February 2022

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1

Zubelewicz, A., Q. Guo, E. C. Cutiongco, M. E. Fine, and L. M. Keer. "Micromechanical Method to Predict Fatigue Life of Solder." Journal of Electronic Packaging 112, no. 2 (1990): 179–82. http://dx.doi.org/10.1115/1.2904360.

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Fatigue lifetimes of low-tin high-lead and tin-lead eutectic solders under total strain controlled tension-tension tests were studied in this paper. Based on the stress and strain micro-macro correlations, a modified Coffin-Manson law is obtained. The modified lifetime prediction formulas which had been used to predict the fatigue lifetime for low-tin high-lead solder, exhibiting cyclic hardening and then saturation, was found to apply to the eutectic solder, where substantial cyclic softening has been observed. This micromechanically based approach allows one to model the known physical pheno

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2

George, Elviz, Michael Osterman, Michael Pecht, and Richard Coyle. "Effects of Extended Dwell Time on Thermal Fatigue Life of Ceramic Chip Resistors." International Symposium on Microelectronics 2012, no. 1 (2012): 000127–35. http://dx.doi.org/10.4071/isom-2012-ta44.

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The understanding of the effects of temperature cycling parameters, such as dwell and ramp times, mean cyclic temperature, and temperature range, on the fatigue life of solder interconnects is critical for qualification and reliability testing. After the solder achieves complete stress relaxation, a further increase in dwell time does not decrease the fatigue life of solder interconnects. Studies have shown that an increase in dwell time beyond a certain limit (10–20 minutes) has no effect on the fatigue life of eutectic tin-lead solder when cycled at peak cycle temperatures at or above 100°C.

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3

Ghosh, G., and M. E. Fine. "Interfacial Reaction Between Tin-Zinc Based Solders and Copper." Microscopy and Microanalysis 3, S2 (1997): 715–16. http://dx.doi.org/10.1017/s1431927600010461.

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Due to the interfacial reaction between the solder and substrate, either during manufacturing or in service, the solder joints may contain one or more intermetallic layers at the interface. While such intermetallic layers may provide strong bonding, they may also be responsible for problems associated with solderability and reliability of joints. Certain physical and mechanical properties of the intermetallic may determine the integrity and reliability of solder assembly. So far detailed analysis, modelling, and testing of simulated and actual joints have been performed with Pb-Sn solders. How

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4

Jen, K. P., and J. N. Majerus. "Stress-Strain Equations for Some Near-Eutectic Tin-Lead Solders." Journal of Engineering Materials and Technology 113, no. 4 (1991): 475–84. http://dx.doi.org/10.1115/1.2904128.

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This paper presents the evaluation of the stress-strain behavior, as a function of strain-rate, for three tin-lead solders at room temperature. This behavior is critically needed for reliability analysis of printed circuit boards (PCB) since handbooks list minimal mechanical properties for the eutectic solder used in PCBs. Furthermore, most handbook data are for stable eutectic microstructure whereas PCB solder has a metastable microstructure. All three materials were purchased as “eutectics.” However, chemical analysis, volume fraction determination, and microhardness tests show some major va

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5

Chen, Fang, Yun Fei Du, Rong Chang Zeng, Gui Sheng Gan, and Chang Hua Du. "Thermodynamics of Oxidation on Pb-Free Solders at Elevated Temperature." Materials Science Forum 610-613 (January 2009): 526–30. http://dx.doi.org/10.4028/www.scientific.net/msf.610-613.526.

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Based on the available thermodynamic and phase equilibria data, the thermodynamic criteria for oxidation in tin-based lead-free solders under soldering condition was deduced. The dependence of Gibbs free energy on temperature in Pb-free solder oxidation reaction was calculated by applying MATLAB program. The characteristics of oxidation reaction of a varity of solder alloy systems such as Sn-Ag, Sn-Cu, Sn-Sb, Sn-Zn, Sn-Ag-Cu and Sn-Pb eutectic alloys at elevated temperature were analyzed. The results suggested that zinc preferentially oxidized in Sn-Zn solder alloys in the elevated temperature

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6

George, Elviz, Michael Osterman, Michael Pecht, Richard Coyle, Richard Parker, and Elizabeth Benedetto. "Thermal Cycling Reliability of Alternative Low-Silver Tin-Based Solders." Journal of Microelectronics and Electronic Packaging 11, no. 4 (2014): 137–45. http://dx.doi.org/10.4071/imaps.424.

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Sn-3.0Ag-0.5Cu (SAC305) alloy is the most widely used solder in electronic assemblies. However, issues associated with cost and drop/shock durability have resulted in a search for alternative lead-free solder alloys. One approach to improve the drop/shock reliability has been to reduce the silver content in Sn-Ag-Cu alloys. Another approach is doping Sn-Ag-Cu solder with additional elements. In 2008, the International Electronics Manufacturing Initiative (iNEMI) started the “Characterization of Pb-Free Alloy Alternatives” project to provide a comprehensive study of 15 tin-based solder intercon

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7

Palmer, Mark A., Christy N. Alexander, and Brian Nguyen. "Forming solder joints by sintering eutectic tin-lead solder paste." Journal of Electronic Materials 28, no. 7 (1999): 912–15. http://dx.doi.org/10.1007/s11664-999-0219-3.

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8

Kang, Sung K., and Thomas G. Ference. "Nickel-alloyed tin-lead eutectic solder for surface mount technology." Journal of Materials Research 8, no. 5 (1993): 1033–40. http://dx.doi.org/10.1557/jmr.1993.1033.

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A new ternary solder alloy of tin-lead-nickel was developed for solder joints. It has an optimum composition range of (60–65)% Sn, (35–40)% Pb, (0.5–1.0)% Ni by weight. The alloy exhibits a higher strength and longer fatigue life than the pure 63% Sn−37% Pb eutectic. Melting point, wettability, and fatigue life were the key properties used to determine this composition. In particular, the melting point of the alloyed eutectic solder did not change for rapidly solidified samples when up to 2 wt. % Ni was added. Instead of modifying the solution melting temperature, the majority of the Ni precip

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9

Mei, Z., J. W. Morris, and M. C. Shine. "Superplastic Creep of Eutectic Tin-Lead Solder Joints." Journal of Electronic Packaging 113, no. 2 (1991): 109–14. http://dx.doi.org/10.1115/1.2905375.

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The creep behavior of air-cooled and liquid nitrogen-quenched soldered joints of 60/40 Sn-Pb at 65°C has been studied. The stress exponent, n, in the power law, γ˙ (steady state strain rate) ∝σn (applied stress), changes from a value of about 6 to values of 2 to 3, as γ˙ decreases below 10−4 in/in per second. This result, combined with the authors’ previous stepped load creep test results, indicates a transition of the creep deformation mechanism from conventional dislocation climb to superplastic grain boundary sliding. The superplastic creep of the soldered joints is ascribed to their non-la

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10

Hare, E. W., and R. G. Stang. "Stress relaxation behavior of eutectic tin-lead solder." Journal of Electronic Materials 24, no. 10 (1995): 1473–84. http://dx.doi.org/10.1007/bf02655466.

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11

George, Elviz, Michael Osterman, Michael Pecht, Richard Coyle, Richard Parker, and Elizabeth Benedetto. "Thermal Cycling Reliability of Alternative Low-Silver Tin-based Solders." International Symposium on Microelectronics 2013, no. 1 (2013): 000120–27. http://dx.doi.org/10.4071/isom-2013-ta45.

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Sn-3.0Ag-0.5Cu (SAC305) alloy is the most widely used solder in electronic assemblies. However, issues associated with cost and drop/shock durability have resulted in a continued search for alternative solder alloys. One approach to improve the drop/shock reliability has been to reduce the silver content in Sn-Ag-Cu alloys. Another approach is doping Sn-Ag-Cu solder with additional elements. Moreover, conflicting results have been reported in literature on the effects of aging on Sn-Ag-Cu alloys. In 2008, International Electronics Manufacturing Initiative (iNEMI) started the “Characterization

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12

Kim and, Taejin, and D. D. L. Chung. "Thermoelectric Behavior of Solder." Journal of Electronic Packaging 125, no. 1 (2003): 161–62. http://dx.doi.org/10.1115/1.1536952.

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13

Weinbel, R. C., J. K. Tien, R. A. Pollak, and S. K. Kang. "Creep-fatigue interaction in eutectic lead-tin solder alloy." Journal of Materials Science 22, no. 11 (1987): 3901–6. http://dx.doi.org/10.1007/bf01133338.

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14

Galib, Roisul Hasan, Ahmed Sharif, M. A. Gafur, Md Rakibul Qadir, Md Ashif Anwar, and Md Abdul Aziz Antor. "Mechanical and Thermal Properties of Zn-xMg Solder Alloys." Applied Mechanics and Materials 860 (December 2016): 173–78. http://dx.doi.org/10.4028/www.scientific.net/amm.860.173.

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Zn based Lead-free solder is considered to be a promising alternatives of tin-lead solder because of its competitive price and mechanical properties. In this research zinc-based lead-free solder alloys were developed by addition of magnesium. Bulk mechanical and thermal properties of Zn-Mg alloys were investigated. The solder alloys were prepared by casting. Chemical composition of these prepared alloys were confirmed by XRF analysis. The microstructures of the solders changed significantly on increasing Mg content. FESEM images showed an increase in eutectic phase. These microstructural chang

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15

Depiver, Joshua A., Sabuj Mallik, and Emeka H. Amalu. "Effective Solder for Improved Thermo-Mechanical Reliability of Solder Joints in a Ball Grid Array (BGA) Soldered on Printed Circuit Board (PCB)." Journal of Electronic Materials 50, no. 1 (2020): 263–82. http://dx.doi.org/10.1007/s11664-020-08525-9.

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AbstractBall grid array (BGA) packages have increasing applications in mobile phones, disk drives, LC displays and automotive engine controllers. However, the thermo-mechanical reliability of the BGA solder joints challenges the device functionality amidst component and system miniaturisation as well as wider adoption of lead-free solders. This investigation determines the effective BGA solders for improved thermo-mechanical reliability of the devices. It utilised a conducted study on creep response of a lead-based eutectic Sn63Pb37 and four lead-free Tin–Silver–Copper (SnAgCu) [SAC305, SAC387

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16

Lee, C. F., and T. J. Shieh. "Theory of Endochronic Cyclic Viscoplasticity of Eutectic Tin/Lead Solder Alloy." Journal of Mechanics 22, no. 3 (2006): 181–91. http://dx.doi.org/10.1017/s1727719100000824.

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AbstractIn this paper, a theory of Endochronic cyclic viscoplasticity of eutectic Tin/Lead (60Sn/40Pb) solder alloy under cyclically thermomechanical strain histories had been established. Under the conditions of isotropic and inelastically incompressible small deformation, the constitutive equation of deviatoric behavior was expressed as:here and the strain rate dependent intrinsic time scale and . Employing the experimental cyclic shear stress-strain curves of various testing temperature and frequency, all temp. dependent material parameters and ; and the temp.-freq. dependent material funct

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17

Shen, Y. L., W. Li, and H. E. Fang. "Phase Structure and Cyclic Deformation in Eutectic Tin-Lead Alloy: A Numerical Analysis." Journal of Electronic Packaging 123, no. 1 (2000): 74–78. http://dx.doi.org/10.1115/1.1324673.

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This study is devoted to providing a mechanistic rationale of coarsening induced failure in solder alloys during thermomechanical fatigue. Micromechanical modeling of cyclic deformation of eutectic tin-lead alloy was undertaken using the finite element method. The models consist of regularly arranged tin-rich and lead-rich phases, simulating the lamellar array and colony structure in a typical eutectic system. A fine structure and a coarse structure, bearing the same phase fraction but different in the aspect ratio of each lead-rich layer and in the number of lead-rich layers in each colony, a

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18

Long, Xu, Shaobin Wang, Xu He, and Yao Yao. "Annealing optimization for tin–lead eutectic solder by constitutive experiment and simulation." Journal of Materials Research 32, no. 16 (2017): 3089–99. http://dx.doi.org/10.1557/jmr.2017.166.

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19

Knecht, S., and L. R. Fox. "Constitutive relation and creep-fatigue life model for eutectic tin-lead solder." IEEE Transactions on Components, Hybrids, and Manufacturing Technology 13, no. 2 (1990): 424–33. http://dx.doi.org/10.1109/33.56179.

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20

Matienzo, L. J., and R. R. Schaffer. "Wetting behaviour of eutectic tin/lead solder and fluxes on copper surfaces." Journal of Materials Science 26, no. 3 (1991): 787–91. http://dx.doi.org/10.1007/bf00588316.

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21

Vaynman, S., G. Ghosh, and M. E. Fine. "Effects of palladium and solder aging on mechanical and fatigue properties of tin-lead eutectic solder." Journal of Electronic Materials 27, no. 11 (1998): 1223–28. http://dx.doi.org/10.1007/s11664-998-0073-8.

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22

AL-ALbawee, Abbas. "Development of Sn-9Zn Solder Alloy by Adding Bismuth." Diyala Journal of Engineering Sciences 13, no. 4 (2020): 37–43. http://dx.doi.org/10.24237/djes.2020.13405.

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Tin-Zinc based on solder is a probable changing of lead element solder as a result of its enhanced mechanical characteristics. This alloy needs to be studied and explored to get a usable solder alloy having better properties. In this work Our objective of the accompanying investigation for alteration the warm, physical and bind qualities of eutectic tin-9Zinc fastening alloy by expansion various ratios of bismuth content to give elective without lead solder alloy to utilize this compound for efferent electronic ventures. We found that the addition of bismuth element content improved the therma

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23

Chen, Xu, De-Hua Yu, and Kwang Soo Kim. "Experimental study on ratcheting behavior of eutectic tin–lead solder under multiaxial loading." Materials Science and Engineering: A 406, no. 1-2 (2005): 86–94. http://dx.doi.org/10.1016/j.msea.2005.06.013.

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24

VU, Truong V., Hideyuki TAKAKURA, John C. WELLS, and Takashi MINEMOTO. "Production of Hollow Spheres of Eutectic Tin-Lead Solder through a Coaxial Nozzle." Journal of Solid Mechanics and Materials Engineering 4, no. 10 (2010): 1530–38. http://dx.doi.org/10.1299/jmmp.4.1530.

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25

Liu, Pi Lin, and Jian Ku Shang. "A comparative fatigue study of solder/electroless-nickel and solder/copper interfaces." Journal of Materials Research 15, no. 11 (2000): 2347–55. http://dx.doi.org/10.1557/jmr.2000.0338.

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The fatigue resistance of the interface between electroless–nickel and the eutectic tin–lead solder alloy was examined in the as-reflowed and aged conditions and compared to fatigue behavior of the copper/solder interface under the same conditions. In the as-reflowed state, the fatigue resistance of the solder/electroless-nickel interface was slightly superior to that of the solder/copper interface. However, after long-term aging, the fatigue resistance of the solder/electroless-nickel interface became far worse in the high crack growth rate regime. Examinations of interfacial microstructures

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26

Zakel, E., G. Azdasht, and H. Reichl. "Degradation of TAB outer lead contacts due to the Au-concentration in eutectic tin/lead solder." IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B 17, no. 4 (1994): 569–77. http://dx.doi.org/10.1109/96.338725.

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27

Yang, Chih-han, Shiqi Zhou, Shih-kang Lin, and Hiroshi Nishikawa. "A Computational Thermodynamics-Assisted Development of Sn-Bi-In-Ga Quaternary Alloys as Low-Temperature Pb-Free Solders." Materials 12, no. 4 (2019): 631. http://dx.doi.org/10.3390/ma12040631.

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Low-temperature lead (Pb)-free solders are demanding in the electronic packaging industry, because it would open the door for various economic choices of polymeric materials as substrates and also revives the lower cost processes. Here, we proposed a tin–bismuth–indium–gallium (Sn-52.5Bi-2.68In-1Ga, SBIG (in wt.%)) quaternary low-temperature solder, designed based on systematic CALPHAD (CALculation of PHAse Diagram)-type thermodynamic calculations and corresponding key experiments. The solidification behavior of SBIG was carefully elaborated based on the computations using the lever rule and t

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28

Josell, D., W. E. Wallace, J. A. Warren, D. Wheeler, and A. C. Powell. "Misaligned Flip-Chip Solder Joints: Prediction and Experimental Determination of Force-Displacement Curves." Journal of Electronic Packaging 124, no. 3 (2002): 227–33. http://dx.doi.org/10.1115/1.1463732.

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The results of wetting experiments between eutectic lead-tin solder and copper pads on silicon substrates in geometries relevant to flip-chip applications are presented. Measurements of solder joint dimensions, specifically stand-off height and lateral offset (i.e., misalignment), as functions of the applied force (normal and shear), solder volume and pad diameter are presented. The experimentally-measured force-displacement relationships are compared with predictions obtained from the minimum energy model of the Surface Evolver computer code. For the case of the axisymmetric joint (zero shear

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29

Kim, Jong Woong, Jeong Won Yoon, and Seung Boo Jung. "Influence of Shear Speed on the Shear Force of Eutectic Sn-Pb and Pb-Free BGA Solder Joints." Materials Science Forum 449-452 (March 2004): 897–900. http://dx.doi.org/10.4028/www.scientific.net/msf.449-452.897.

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The experimental investigation and non-linear finite element analysis using elastic-viscoplastic constitutive model were conducted to study the effect of ball shear speed on shear force of BGA solder joints. The Ag3Sn intermetallic compound (IMC) particles were found inside the Sn-3.5Ag solder, while the fine intermixed structure of lead-rich phases and tin-rich phases was investigated inside the eutectic Sn-37Pb solder. The shear force linearly increased with shear speed and reached to the maximum value at the highest shear speed in both experimental and computational results. All of the test

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30

Mei, Z., J. W. Morris, M. C. Shine, and T. S. E. Summers. "Effects of cooling rate on mechanical properties of near-eutectic tin-lead solder joints." Journal of Electronic Materials 20, no. 10 (1991): 599–608. http://dx.doi.org/10.1007/bf02669524.

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31

Jin, Howard (Hwail), Kewei Xu, Loreto Naungayan, and Jose Quinones. "High Thermal Conductive Die Attach Paste Using Polymer and Micron Size Silver for Power Semiconductor Package." International Symposium on Microelectronics 2016, no. 1 (2016): 000326–31. http://dx.doi.org/10.4071/isom-2016-wp41.

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Abstract Power semiconductor package manufactures and electronic device suppliers have been looking for Pb-free alternative to traditional high Pb solder die attach adhesives. Lead solders have high thermal conductivity, 30–50W/mK, and known process with some difficulties in high volume mass production such as void, bond line control, and requiring reducing atmosphere such as forming gas. Lead is now categorized as hazardous substance to human body and environment and its products are scheduled to be banned within a few years. Standard silver epoxy pastes and Electrically Conductive Adhesives

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32

Clough, Roger B., Alexander J. Shapiro, Andrew J. Bayba, and George K. Lucey. "Boundary Layer Fracture in Composite Solder Joints." Journal of Electronic Packaging 117, no. 4 (1995): 270–74. http://dx.doi.org/10.1115/1.2792104.

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Composite solder connections, modeled as miniature single-lap shear layers between copper plates, were fabricated and pulled to fracture. The solder layers (3.1 × 3.1 × 0.50 mm) were eutectic lead-tin/particulate Cu6Sn5 composites. Under load, shear fractures extended along paths about 10 µm inside of the interfaces from opposite edges. These boundary layer fractures were characterized and a fracture model was developed. A corresponding test method for measuring JII and δII, the crack extension energy and crack tip shear displacement for Mode II crack growth, is given, and the results are disc

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33

Mattila, T. T., V. Vuorinen, and J. K. Kivilahti. "Impact of printed wiring board coatings on the reliability of lead-free chip-scale package interconnections." Journal of Materials Research 19, no. 11 (2004): 3214–23. http://dx.doi.org/10.1557/jmr.2004.0436.

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When lead-free solder alloys mix with lead-free component and board metallizations during reflow soldering, the solder interconnections become multicomponent alloy systems whose microstructures cannot be predicted on the basis of the SnPb metallurgy. To better understand the influences of these microstructures on the reliability of lead-free electronics assemblies, SnAgCu-bumped components were reflow-soldered with near-eutectic SnAgCu solder pastes on Ni(P)|m.Au- and organic solderability preservative (OSP)-coated printed wiring boards and tested under cyclic thermal shock loading conditions.

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34

Yang, D., Y. C. Chan, B. Y. Wu, and M. Pecht. "Electromigration and thermomigration behavior of flip chip solder joints in high current density packages." Journal of Materials Research 23, no. 9 (2008): 2333–39. http://dx.doi.org/10.1557/jmr.2008.0305.

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The electromigration and thermomigration behavior of eutectic tin-lead flip chip solder joints, subjected to currents ranging from 1.6 to 2.0 A, at ambient temperatures above 100 °C, was experimentally and numerically studied. The temperature at the chip side was monitored using both a temperature coefficient of resistance method and a thermal infrared technique. The electron wind force and thermal gradient played the dominant role in accelerated atomic migration. The atomic flux of lead due to electromigration and thermomigration was estimated for comparison. At the current crowding region, e

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35

Watanabe, Jun, Kenji Hatsuzawa, Shigeyuki Ogata, Shinichi Yoshida, and Ikuo Shohji. "Erosion Resistance Properties of Iron–Carbon Composite Plating to Molten Lead-Free Solder." Applied Sciences 9, no. 13 (2019): 2724. http://dx.doi.org/10.3390/app9132724.

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The use of Sn-3mass%Ag-0.5mass%Cu lead-free solder (SAC305) has become common. Since SAC305 has a higher content of tin than conventional tin–lead eutectic solder, erosion of the Fe plating layer used in the solder iron tip and the point soldering machine nozzle frequently occurs. In this study, to prolong the life of the Fe plating layer, the applicability of composite plating in which a carbon-type filler is compounded with Fe was studied. Graphite and a multi-walled carbon nanotube (MWCNT) were used as filler materials in the composite plating layer. For both Fe-graphite and Fe-MWCNT compos

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36

Pan, Tsung-Yu. "Thermal Cycling Induced Plastic Deformation in Solder Joints—Part I: Accumulated Deformation in Surface Mount Joints." Journal of Electronic Packaging 113, no. 1 (1991): 8–15. http://dx.doi.org/10.1115/1.2905373.

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When an electronic package is subjected to thermal cycling, the solder joint interconnects are subjected to a complex stress system. If the stress is sufficiently large, the solder joint will show evidence of plastic flow along with microstructure coarsening and possible fatigue crack initiation and propagation. Plastic flow has not been studied as thoroughly as the later two phenomena although it is often observed at surface mount or through-hole solder joints. The thermal expansion mismatch between different materials in the package is responsible for the plastic deformation which accumulate

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37

Yang, Dan, B. Y. Wu, Y. C. Chan, and K. N. Tu. "Microstructural evolution and atomic transport by thermomigration in eutectic tin-lead flip chip solder joints." Journal of Applied Physics 102, no. 4 (2007): 043502. http://dx.doi.org/10.1063/1.2769270.

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38

Caswell, Greg, and Joelle Arnold. "The Reliability Impact of Reballing COTS Pb-Free BGAs to Sn/Pb for Military Applications." International Symposium on Microelectronics 2011, no. 1 (2011): 000703–10. http://dx.doi.org/10.4071/isom-2011-wp2-paper3.

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The electronics assembly market has experienced a material shift from lead (Pb) based solders to Pb-free solders. This is a result of the widespread adoption of Reduction of Hazardous Substances (RoHS) legislation and practices in commercial industry. As a result, it is becoming increasingly difficult to procure commercial off-the-shelf (COTS) components with tin-lead (SnPb) solder balls or finish. There are essentially three responses to the scarcity of acceptable SnPb parts: custom order, post process or adapt. Custom ordering parts with SnPb finishes negates the benefits of COTS based acqui

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39

Anicai, Petica, Costovici, Moise, Brincoveanu, and Visan. "Electrodeposition of Sn–In Alloys Involving Deep Eutectic Solvents." Coatings 9, no. 12 (2019): 800. http://dx.doi.org/10.3390/coatings9120800.

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Tin–indium alloys represent attractive lead-free solder candidates. They show lower values of melting point than pure indium, so that they are investigated as materials with significant applications potential in the electronic industry. Electrodeposition is a very convenient route to prepare Sn–In alloys. The paper presents several experimental results regarding the electrodeposition of Sn–In alloy coatings involving deep eutectic solvents (DESs), namely using choline chloride-ethylene glycol eutectic mixtures. The influence of the main operating parameters on the Sn–In alloy composition and c

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40

Hsiao, Li‐Yin, and Jenq‐Gong Duh. "Intermetallic compound formation and diffusion path evolution in eutectic tin‐lead flip chip solder bumps after aging." Soldering & Surface Mount Technology 18, no. 2 (2006): 18–26. http://dx.doi.org/10.1108/09540910610665099.

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41

Bernt, Marvin, and Adam McClure. "Consumable Anode Process for SnAg Electroplating." International Symposium on Microelectronics 2014, no. 1 (2014): 000117–21. http://dx.doi.org/10.4071/isom-ta44.

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Near eutectic tin-silver (SnAg) is currently the alloy of choice for electroplated lead-free solder bumping and Cu pillar capping. While lead-tin (PbSn) is still used in some applications, there has been considerable momentum in moving away from the use of lead in semiconductor packaging. Both solders are normally electroplated as alloys with specific compositions to target a desired melting point. Since the deposition potentials of lead and tin are very close together, they plate with similar characteristics. This makes it possible for PbSn plating systems to use a consumable anode system whe

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42

Syed, Ahmer R. "Creep Crack Growth Prediction of Solder Joints During Temperature Cycling—An Engineering Approach." Journal of Electronic Packaging 117, no. 2 (1995): 116–22. http://dx.doi.org/10.1115/1.2792077.

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A model is developed which predicts the creep damage accumulation in solder joints during temperature cycling. The model relates the crack growth rate to the rate of creep energy density dissipated using the C* parameter of nonlinear fracture mechanics for extensive creep damage. For a eutectic tin-lead solder joint, the damage due to both grain boundary sliding and matrix creep is considered. The validity of the model is proved by correlating the predicted fatigue life of solder joints for 84 I/O leadless ceramic chip carriers with the published measured data for a number of test conditions.

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Majerus, J. N., K. P. Jen, and H. Gong. "Quantitative Comparison Between Precision Closed-Die Forging-Force Data and Computer Simulations." Journal of Engineering Materials and Technology 114, no. 4 (1992): 465–71. http://dx.doi.org/10.1115/1.2904200.

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This paper presents a study of precision closed-die, isothermal, forgings via both experiments and computer simulation. The closed-die cross-section was an “H” shape and Tin/Lead eutectic solder was used for the billet material. Extensive statistical analysis of the axial force versus displacement history was conducted using replicated forging experiments. The purpose of the experiment was to obtain statistically significant data so that accuracy tests could be conducted on different FEM computer models, e.g., ALPID, EPIC2D, NIKE2D, and DYNA2D. Overall, the forging history exhibited complex be

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Lei, Thomas G., Jesus Calata, Shu Fang Luo, Guo Quan Lu, and Xu Chen. "Low-Temperature Sintering of Nanoscale Silver Paste for Large-Area Joints in Power Electronics Modules." Key Engineering Materials 353-358 (September 2007): 2948–53. http://dx.doi.org/10.4028/www.scientific.net/kem.353-358.2948.

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Today, reflow soldering is a commonly used technique to establish large-area joints in power electronics modules. These joints are needed to attach large-area (>1 cm2) power semiconductor chips to the substrate, e.g., a direct-bond copper substrate, and the multichip module substrate to a copper base plate for heat spreading. Thermal performance, specifically thermal conductivity and thermomechanical reliability, of these large-area joints are critical to the electrical performance and lifetime of the power modules. Soft solder alloys, including the lead-tin eutectic and lead-free alternati

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Burkhardt, T., M. Hornaff, A. Acker, et al. "Die-Attach Technologies for Ultraviolet LED Multichip Module Based on Ceramic Substrate." Journal of Microelectronics and Electronic Packaging 9, no. 3 (2012): 113–19. http://dx.doi.org/10.4071/imaps.334.

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A high power UV light emitting diode (LED) multichip module package based on aluminum nitride (AlN) and alumina (Al2O3) is presented. The AlN substrate with a high thermal conductivity of up to 180 W/(m·K) and LED chips based on a copper alloy provide superb thermal management and heat extraction. Efficient cooling is an important prerequisite for the increase of extractable optical power and for the reduction of thermally induced wavelength shift. A design of a stackable module featuring arrays of 7×2 indium-gallium-aluminum-nitride UV LED chips at 395 nm is developed. This configuration of s

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Burkhardt, T., M. Hornaff, A. Acker, et al. "Ultraviolet LED Multi-Chip Module Based on Ceramic Substrate." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, CICMT (2012): 000238–45. http://dx.doi.org/10.4071/cicmt-2012-tp61.

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A high power ultraviolet (UV) light emitting diode (LED) multi-chip module package based on aluminum nitride (AlN) and alumina (Al2O3) is presented. The AlN substrate with a high thermal conductivity of up to 180 W/(m· K) and LED chips based on a copper alloy provide superb thermal management and heat extraction. Efficient cooling is an important prerequisite for the increase of extractable optical power and decrease of thermally induced wavelength shift. A design of a stackable module featuring arrays of 7×2 indium-gallium-aluminum- nitride UV LED chips at 395 nm is developed. This configurat

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Sutliff, John A. "A TEM investigation of a hyper-eutectic lead-tin alloy." Proceedings, annual meeting, Electron Microscopy Society of America 46 (1988): 562–63. http://dx.doi.org/10.1017/s042482010010487x.

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Near-eutectic Pb-Sn alloys are important solders used by the electronics industry. In these solders, the eutectic mixture, which solidifies last, is the important microstructural consituent. The orientation relation (OR) between the eutectic phases has previously been determined for directionally solidified (DS) eutectic alloys using x-ray diffraction or electron chanelling techniques. In the present investigation the microstructure of a conventionally cast, hyper-eutectic Pb-Sn alloy was examined by transmission electron microscopy (TEM) and the OR between the eutectic phases was determined b

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Das, Rabindra N., Frank D. Egitto, Barry Bonitz, Erich Kopp, Mark D. Poliks, and Voya R. Markovich. "Package-Interposer-Package (PIP): A Breakthrough Package-on-Package (PoP) Technology for 3D-Integration." International Symposium on Microelectronics 2012, no. 1 (2012): 000561–67. http://dx.doi.org/10.4071/isom-2012-wa15.

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Package on Package (PoP) stacking has become an attractive method for 3D integration to meet the demands of higher functionality in ever smaller packages, especially when coupled with the use of stacked die. To accomplish this, new packaging designs need to be able to integrate more dies with greater function, higher I/O counts, smaller pitches, and greater heat densities, while being pushed into smaller and smaller footprints. A new 3D “Package Interposer Package” (PIP) solution is suitable for combining multiple memory, ASICs, stacked die, stacked packaged die, etc., into a single package. T

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Stahley, Matthew, John Osenbach, Brenda Gogue, Byong Il Heo, Byung Cheol Lee, and Dongmei Meng. "Temperature Cycling Induced Warpage of Packages with Embedded Copper Heatspreaders." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, DPC (2012): 001579–96. http://dx.doi.org/10.4071/2012dpc-wa25.

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Temperature cycling is an important reliability qualification test given the differences in thermal expansion coefficients for the materials in integrated circuit packages. In this work, leadfree Plastic-Ball-Grid-Array (PBGA) packages with embedded C1100 copper heatspreaders were exposed to standard qualification testing including MSL3 Moisture Preconditioning with leadfree reflows at 245C followed by Temperature Cycling (TC) with ranges of −55/+125C (TC-B) and 0/+125C (TC-K) per JEDEC JESD47. Electrical performance and package warpage were characterized on as-received, post-preconditioning,

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Das, Rabindra, Frank D. Egitto, Steven G. Rosser, Erich Kopp, and Barry Bonitz. "3D Integration of System-in-Package (SiP): Toward SiP-Interposer-SiP for High-End Electronics." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2013, DPC (2013): 000618–34. http://dx.doi.org/10.4071/2013dpc-tp12.

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The demand for high-performance, lightweight, portable computing power is driving the industry toward 3D integration to meet the demands of higher functionality in ever smaller packages. To accomplish this, new packaging needs to be able to integrate multiple substrates, multiple dies with greater function, higher I/O counts, smaller pitches, and greater heat densities, while being pushed into smaller and smaller footprints. The approaches explored in this paper include eliminating active chip packages by directly attaching the chip to the System-in-Package (SiP) with flip chip technology. Add

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