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Journal articles on the topic 'Failure physics'

Author: Grafiati

Published: 1 February 2025

Last updated: 31 July 2025

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1

Pecht, Michael, and Abhijit Dasgupta. "Physics-of-Failure: An Approach to Reliable Product Development." Journal of the IEST 38, no. 5 (1995): 30–34. http://dx.doi.org/10.17764/jiet.2.38.5.y3561m03801h0082.

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Reliability assessments based on physics-of-failure methods incorporate reliability into the design process to prevent parts from failing in service. An understanding of the physics-of-failure is necessary in applications that afford little opportunity for testing, or for reliability growth. This paper presents an overview of physics-of-failure and a case study of the application of physics-of-failure to a specific failure mechanism called conductive filament formation.

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2

Williams, Hollis. "Physics of Brittle Failure during Impact." Physics Teacher 62, no. 7 (2024): 575–78. http://dx.doi.org/10.1119/5.0136324.

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THADURI, ADITHYA, A. K. VERMA, V. GOPIKA, RAJESH GOPINATH, and UDAY KUMAR. "FAILURE MODELING OF CONSTANT FRACTION DISCRIMINATOR USING PHYSICS OF FAILURE APPROACH." International Journal of Reliability, Quality and Safety Engineering 20, no. 03 (2013): 1340002. http://dx.doi.org/10.1142/s0218539313400020.

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Due to several advancements in the technology trends in electronics, the reliability prediction by the constant failure methods and standards no longer provide accurate time to failure. The physics of failure methodology provides a detailed insight on the operation, failure point location and causes of failure for old, existing and newly developed components with consideration of failure mechanisms. Since safety is a major criteria for the nuclear industries, the failure modeling of advanced custom made critical components that exists on signal conditioning module are need to be studied with h

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SATO, Atsuro, Mikio SAKAI, and Seiichi KOSHIZUKA. "450 Slope Failure in Physics Based CG." Proceedings of The Computational Mechanics Conference 2008.21 (2008): 774–75. http://dx.doi.org/10.1299/jsmecmd.2008.21.774.

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5

Torigoe, Eugene T., and Gary E. Gladding. "Connecting symbolic difficulties with failure in physics." American Journal of Physics 79, no. 1 (2011): 133–40. http://dx.doi.org/10.1119/1.3487941.

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6

Jiao, Jian, Xinlin De, Zhiwei Chen, and Tingdi Zhao. "Integrated circuit failure analysis and reliability prediction based on physics of failure." Engineering Failure Analysis 104 (October 2019): 714–26. http://dx.doi.org/10.1016/j.engfailanal.2019.05.021.

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7

Zhang, Ren Peng, Yi Yong Hu, and Jun Yao. "Reliability Enhancement Test on Undercarriage Signal Light Box." Applied Mechanics and Materials 291-294 (February 2013): 2403–7. http://dx.doi.org/10.4028/www.scientific.net/amm.291-294.2403.

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Based on the theory of failure physics, reliability enhancement test is a test technology of stimulation in order to improve reliability by discovering, researching and curing failure. In this paper, the main factors inducing failure modes of undercarriage light box were analyzed, and the environmental sensitive stresses affecting reliability were determined. The testing program was designed and test profiles were established based on the theory of reliability enhancement test. Additionally, the test results were analyzed based on failures of products in order to carry out improvement measures

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8

Rovelli, C., and I. A. Rybakova. "PHYSICS NEEDS PHILOSOPHY. PHILOSOPHY NEEDS PHYSICS." Metaphysics, no. 3 (December 15, 2021): 36–46. http://dx.doi.org/10.22363/2224-7580-2021-3-36-46.

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Contrary to claims about the irrelevance of philosophy for science, I argue that philosophy has had, and still has, far more influence on physics than is commonly assumed. I maintain that the current anti-philosophical ideology has had damaging effects on the fertility of science. I also suggest that recent important empirical results, such as the detection of the Higgs particle and gravitational waves, and the failure to detect supersymmetry where many expected to find it, question the validity of certain philosophical assumptions common among theoretical physicists, inviting us to engage in

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THADURI, ADITHYA, A. K. VERMA, V. GOPIKA, RAJESH GOPINATH, and UDAY KUMAR. "STRESS FACTOR AND FAILURE ANALYSIS OF CONSTANT FRACTION DISCRIMINATOR USING DESIGN OF EXPERIMENTS." International Journal of Reliability, Quality and Safety Engineering 20, no. 03 (2013): 1340003. http://dx.doi.org/10.1142/s0218539313400032.

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Reliability prediction using traditional approaches were implemented at earlier stages of electronics. But due to advancements in science and technology, the above models are outdated. The alternative approach, physics of failure provides exhaustive information on basic failure phenomenon with failure mechanisms, failure modes and failure analysis becomes prominent because this method depends on factors like materials, processes, technology, etc., of the component. Constant fraction discriminators which is important component in NFMS needs to study failure characteristics and this paper provid

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10

Osterman, M. D. "A Physics of Failure Approach to Component Placement." Journal of Electronic Packaging 114, no. 3 (1992): 305–9. http://dx.doi.org/10.1115/1.2905455.

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Traditionally, placement techniques have focused on improving rotability based on minimizing the total wire length between interconnected components. However, electronic card assembly (ECA) reliability, which is measured in terms of time to failure, cycles to failure, or the hazard rates of the individual components, the interconnections, and the PWB, is also affected by component placement. This paper discusses component placement for reliability based on a failure model which incorporates component temperature, a base operating temperature, a threshold temperature, and change in temperature.

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11

Qiu, Wenhao, Guangyao Lian, Mingxi Xue, and Kaoli Huang. "Physics of failure-based failure mode, effects, and criticality analysis for Integrated Circuits." Systems Engineering 21, no. 6 (2018): 511–19. http://dx.doi.org/10.1002/sys.21451.

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12

Xu, Ming, Feng Ming Lu, and Chen Hui Zeng. "Research and Validation of ICs' TDDB Physics-of-Failure Model." Applied Mechanics and Materials 313-314 (March 2013): 281–86. http://dx.doi.org/10.4028/www.scientific.net/amm.313-314.281.

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In the new era, the reliability technology based on physics of failure (PoF) is playing an increasingly important role in development of electronic equipment. PoF models of electronic products, as the foundation and core of this advanced technology, are the main point of engineering application. With continual scaling of VLSI in electronic equipment, the electric field across gate oxide becomes higher and higher and affects the reliability of semiconductor device greatly. In this paper, TDDB failure mechanism and Physics-of-Failure model was researched firstly. Then the test sample was designe

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13

Watts, Milton, and K. Rob Harker. "Comparative Reliability Prediction Using Physics of Failure Models." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2011, HITEN (2011): 000189–95. http://dx.doi.org/10.4071/hiten-paper3-mwatts.

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Quartzdyne Electronics has invested millions of device test hours in life testing of circuits in both powered and un-powered tests. In addition to time at temperature, these tests include thermal cycling and high impact drop testing. Recent projects have required the use of larger packages and components as we have expanded the variety of circuits that we build. It is desirable to predict the effects of these changes on long-term reliability before investing in tooling. In this study we will compare a new design which contains these larger components to the simpler, smaller designs for which w

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14

Pecht, Michael, and Jie Gu. "Physics-of-failure-based prognostics for electronic products." Transactions of the Institute of Measurement and Control 31, no. 3-4 (2009): 309–22. http://dx.doi.org/10.1177/0142331208092031.

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15

Hall, Gavin D. R., and Derryl D. J. Allman. "Stress Migration Modeling Using Probabilistic Physics of Failure." IEEE Transactions on Device and Materials Reliability 18, no. 4 (2018): 508–19. http://dx.doi.org/10.1109/tdmr.2018.2880226.

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16

Family, Fereydoon. "Physics of Cell Adhesion Failure and Human Diseases." Physics Procedia 57 (2014): 24–28. http://dx.doi.org/10.1016/j.phpro.2014.08.126.

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17

Tilgner, Rainer. "Physics of failure for interconnect structures: an essay." Microsystem Technologies 15, no. 1 (2008): 129–38. http://dx.doi.org/10.1007/s00542-008-0630-3.

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18

Pecht, Michael, Abhijit Dasgupta, Donald Barker, and Charles T. Leonard. "The reliability physics approach to failure prediction modelling." Quality and Reliability Engineering International 6, no. 4 (1990): 267–73. http://dx.doi.org/10.1002/qre.4680060409.

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19

Le, G. T., L. Mastropasqua, J. Brouwer, and S. B. Adler. "Simulation-Informed Machine Learning Diagnostics of Solid Oxide Fuel Cell Stack with Electrochemical Impedance Spectroscopy." Journal of The Electrochemical Society 169, no. 3 (2022): 034530. http://dx.doi.org/10.1149/1945-7111/ac59f4.

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This paper reports our initial development of simulation-informed machine learning algorithms for failure diagnostics in solid oxide fuel cell (SOFC) systems. We used physics-based models to simulate electrochemical impedance spectroscopy (EIS) response of a short SOFC stack under normal conditions and under three different failure modes: fuel maldistribution, delamination, and oxidant gas crossover to the anode channel. These data were used to train a support vector machine (SVM) model, which is able to detect and differentiate these failures in simulated data under various conditions. The SV

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20

Suhir, E. "Statistics-related and reliability-physics-related failure processes in electronics devices and products." Modern Physics Letters B 28, no. 13 (2014): 1450105. http://dx.doi.org/10.1142/s021798491450105x.

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The well known and widely used experimental reliability "passport" of a mass manufactured electronic or a photonic product — the bathtub curve — reflects the combined contribution of the statistics-related and reliability-physics (physics-of-failure)-related processes. When time progresses, the first process results in a decreasing failure rate, while the second process associated with the material aging and degradation leads to an increased failure rate. An attempt has been made in this analysis to assess the level of the reliability physics-related aging process from the available bathtub cu

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21

Felixfu2022 and Nicolas P. Avdelidis. "Hybrid Prognostics for Aircraft Fuel System: An Approach to Forecasting the Future." PHM Society European Conference 8, no. 1 (2024): 9. http://dx.doi.org/10.36001/phme.2024.v8i1.4130.

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The copious volumes of data collected incessantly from diverse systems present challenges in interpreting the data to predict system failures. The majority of large organizations employ highly trained experts who specialize in using advanced maintenance equipment and have specific certification in predictive maintenance (PdM). Prognostics and health management (PHM) connects research on deterioration models to strategies for PdM. Prognostics refer to the process of estimating the time until failure and the associated risk for one or more current and potential failure modes. Prognostics aim to

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22

Băjenescu, Titu-Marius I. "MEMS MANUFACTURING AND RELIABILITY." Journal of Engineering Science XXVI (1) (March 15, 2019): 65–82. https://doi.org/10.5281/zenodo.2640042.

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Today flexibility means to produce reasonably priced customized products of high quality that can be quickly delivered to customers. The article analyses issues related to physic, able to generating defects, affecting the reliability limits for MEMS (Micro-Electro-Mechanical Systems). The MEMS industry is currently at a much more vulnerable position than it appears, regardless of how wonderful its future may look like. A full understanding of the physics and statistics of the defect generation is required to investigate the ultimate reliability limitations for nan

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23

Caswell, Greg. "Using Physics of Failure to Predict System Level Reliability for Avionic Electronics." International Symposium on Microelectronics 2013, no. 1 (2013): 000031–38. http://dx.doi.org/10.4071/isom-2013-ta21.

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Today's analyses of electronics reliability at the system level typically use a “black box approach”, with relatively poor understanding of the behaviors and performances of such “black boxes” and how they physically and electrically interact. Box level analyses tend to use simplistic empirical predictive models, and the effort is typically driven by cost and time constraints. The incorporation of more rigorous and more informative approaches and techniques needs to better understand and to take advantage of the advances in user interfaces and intelligent data capture, which will allow for a b

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24

Tosney, William, and Andrew Quintero. "Orbital Experience from an Integration and Test Perspective." Journal of the IEST 41, no. 6 (1998): 34–41. http://dx.doi.org/10.17764/jiet.41.6.731317376m64t38u.

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Space vehicle schedule and cost reduction strategies tend to focus on test optimization without a comprehensive analytical approach to the impact on mission success. This study provides valuable stochastic insights into orbital physics of failure while identifying potential relationships to ground integration and test processes by analyzing data across a large population of space vehicle programs. Failure data analysis uses reliability growth modeling techniques to provide greater insight into environmental test effectiveness. Results show correlations between orbital failures, environmental t

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25

Guo, Xiao Xi, Chuan Ri Li, and Long Tao Liu. "Vibration Fatigue Analysis of the Solder Connector." Applied Mechanics and Materials 105-107 (September 2011): 294–98. http://dx.doi.org/10.4028/www.scientific.net/amm.105-107.294.

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With the increasing problems of fatigue failure of PCB in aeronautic and astronautic electronic chassis, the paper proposes a life prediction method of the solder connector based on physics of failure by simulation and physical test. The virtual modal and random vibration response of the box should be solved by finite element method in the ANSYS software, and these results have been verified by modal test and random vibration test. While the structure parameter and the environment stress of the box, the results of the simulation as the input of the vibration fatigue physics of failure model, t

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26

Zheng, Wei, Mingtao Feng, Ruishi Lin, Yue Yu, Kaiwen Xiao, and Guofu Zhai. "Reliability Prediction of Mixed-Signal Module Based on Multi-Stress Field Failure Mechanisms." Applied Sciences 15, no. 8 (2025): 4356. https://doi.org/10.3390/app15084356.

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The communication module is crucial for control systems. Under thermal, electrical, and mechanical stresses, sensitive digital and analog components may degrade in performance or fail, compromising the module’s long-term stability. Existing reliability-prediction methods, however, do not fully leverage multi-physics simulations to model stress-induced failure modes, leading to limited confidence in their predictions. This article proposes a systematic method to enhance the reliability prediction of mixed-signal electronic systems under complex operating conditions. First, we identify the key C

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27

Oyewole, O. K., D. O. Oyewole, M. G. Zebaze Kana, and W. O. Soboyejo. "Reliability and Physics Failure of Stretchable Organic Solar Cells." MRS Advances 1, no. 1 (2016): 21–26. http://dx.doi.org/10.1557/adv.2016.21.

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ABSTRACTOrganic solar (OPV) cells are cheap electronics that can replace the widely used high cost silicon-based electronics for electricity generation. They are cheap because of the easy techniques involved in their fabrication processes and they can be produced to cover a large surface area. However, the current low performance of organic electronics has been traced to failure due to interfacial adhesion problems, material processes, and service conditions. Therefore, transportation of charge carriers across the bulk heterojunction system of OPV cells becomes very difficult in the presence o

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28

Gassner, Gert, Franz Langmayr, and Peter Prenninger. "Physics of Failure based Damage Modeling for SOFC Development." ECS Transactions 25, no. 2 (2019): 1263–72. http://dx.doi.org/10.1149/1.3205655.

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29

Billah, K. Yusuf, and Robert H. Scanlan. "Resonance, Tacoma Narrows bridge failure, and undergraduate physics textbooks." American Journal of Physics 59, no. 2 (1991): 118–24. http://dx.doi.org/10.1119/1.16590.

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30

Squiller, D., H. Greve, E. Mengotti, and F. P. McCluskey. "Physics-of-failure assessment methodology for power electronic systems." Microelectronics Reliability 54, no. 9-10 (2014): 1680–85. http://dx.doi.org/10.1016/j.microrel.2014.07.123.

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31

Kimseng, K., M. Hoit, N. Tiwari, and M. Pecht. "Physics-of-failure assessment of a cruise control module." Microelectronics Reliability 39, no. 10 (1999): 1423–44. http://dx.doi.org/10.1016/s0026-2714(99)00018-9.

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32

Shinn, Terry. "Failure or Success? Interpretations of 20th Century French Physics." Historical Studies in the Physical and Biological Sciences 16, no. 2 (1986): 353–69. http://dx.doi.org/10.2307/27757569.

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33

Shinn, Terry. "Failure or Success? Interpretations of 20th Century French Physics." Historical Studies in the Physical and Biological Sciences 17, no. 2 (1987): 361. http://dx.doi.org/10.2307/27757588.

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34

Ryspaeva, Cholpon, Gulmira Belekova, Kakhramonzhon Shakirov, Gulzat Mukambetova, and Mahfuza Ahunjanova. "Competence-based approach to formation of students� learning motivation." Scientific Herald of Uzhhorod University Series Physics 2024, no. 55 (2024): 1880–89. http://dx.doi.org/10.54919/physics/55.2024.188ot0.

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Relevance. Building an educational process that can serve as a basis for the formation and growth of motivational spheres of students is one of the urgent problems facing modern education in the context of improving training in higher and secondary vocational educational institutions.Purpose. The research aims to study the process of formation of motivation in students of higher educational institutions of Kyrgyzstan, on the example of Pedagogical College of the Kyrgyz State University named after I. Arabaev, International University of Innovative Technologies and Batken State University.Metho

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35

Băjenescu, Titu-Marius I. "SOME RELIABILITY ASPECTS OF MEMS AND NEMS MANUFACTURING." Journal of Engineering Science XXVIII (2) (June 16, 2021): 91–102. https://doi.org/10.52326/jes.utm.2021.28(2).07.

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A full understanding of the physics and statistics of the defect generation is required to investigate the ultimate reliability limitations of manufacturability of MEMS and NEMS. In order that the user can include electronic components in circuits to achieve errorfree and reliable functional units, assemblies or devices, must he has understood the mode of operation of these components. Only knowledge of their parameters and special properties allows, according to data sheet specifications and manufacturer's documents the optimal components for a specific application, to select. Both for th

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36

Qin, Li, and An Li Shi. "Reliability Test and Evaluation Analysis of Silicon Pressure Sensor under Vibration Stress." Advanced Materials Research 383-390 (November 2011): 6969–74. http://dx.doi.org/10.4028/www.scientific.net/amr.383-390.6969.

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The model silicon pressure sensor was taken as the object; in this paper, we built failure physics equation of sensor under the vibration stress based on the failure modes and failure mechanism of pressure sensor, and using vibration stress as the acceleration factor to process accelerated life testing under invariableness stress. The results show that failure physics equation of sensor yields the inverse power law relationship. The estimated value of reliability character and accelerated life equation of sensor under the vibration stress was attained through analyzing testing data and the ave

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37

Barela, Phillip, and Steven Cornford. "A Systematic Approach to Hardware Qualification." Journal of the IEST 39, no. 4 (1996): 33–39. http://dx.doi.org/10.17764/jiet.2.39.4.k557h02814259621.

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A systematic approach for the development of a hardware qualification approach is described. This approach stems from the need to address the "Catch-22" of not flying new technology because it has not flown. A physics of failure approach is used to identify failure modes, and the impact and likelihood of these failures on the mission requirements is plotted in a Requirements Matrix. These same failure modes are plotted against the effectiveness of the available preventions, analyses, control, and tests (PACTs) at screening for, or eliminating, these failure modes in a test effectiveness matrix

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38

Zhang, F., Z. Zhou, Y. Wang, D. Wang, M. Wu, and L. Zhu. "An SEU fault injection platform for radiation-harden design debugging in the FPGA." Journal of Instrumentation 17, no. 08 (2022): P08007. http://dx.doi.org/10.1088/1748-0221/17/08/p08007.

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Abstract An SEU fault injection platform was designed to ease the debugging of radiation-harden design in FPGA. The platform includes the FPGA being tested, the functional firmware being debugged, the essential-bit extraction algorithm based on Python, and the random fault injection algorithm. The platform can inject single-bit SEU failures, adjacent two-bit SEU failures, and three-bit SEU failures. It works in two modes: normal injection mode and essential-bit injection mode. Functional failure rate is the performance metric which used to evaluate the development. It is the probability of tri

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39

Zhang, Lingjie, Ning Hu, Zhe Lai, Jieyi Zhang, and Hongqi Yang. "Reliability simulation analysis technology for electronic products based on failure physics and failure propagate models." IET Conference Proceedings 2024, no. 12 (2025): 338–44. https://doi.org/10.1049/icp.2024.3455.

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40

Lee, Hoyong, and Ighoon Lee. "Requirements Development for Intermittent Failure Detection of an Avionics Backplane based on Physics-of-Failure." Journal of the Korean Society for Aviation and Aeronautics 27, no. 3 (2019): 15–23. http://dx.doi.org/10.12985/ksaa.2019.27.3.015.

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41

Thaduri, Adithya, Ajit Kumar Verma, and Uday Kumar. "Comparison of failure characteristics of different electronic technologies by using modified physics-of-failure approach." International Journal of System Assurance Engineering and Management 6, no. 2 (2014): 198–205. http://dx.doi.org/10.1007/s13198-014-0301-y.

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42

Shao, Jiang, Cheng Hui Zeng, and Yong Hong Li. "Application of Physics of Failure Method in Reliability Design of Electronic Products." Applied Mechanics and Materials 44-47 (December 2010): 819–23. http://dx.doi.org/10.4028/www.scientific.net/amm.44-47.819.

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Based on reliability theory on physics of failure, reliability information of electronic products is predicted by modeling and simulation methods. Various engineering analysis techniques are utilized and the product’s reliability is analyzed and designed. Analysis results on an electronic product example show that physics of failure method can find week problems of reliability design, advance prevention measures, mend the design to eliminate potential faults, thus improve the inherent reliability of electronic product ultimately.

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43

Xu, Ren Xiao, and Yang Liu. "Failure Modes Mechanisms Effects Analysis for Refrigeration Device." Applied Mechanics and Materials 288 (February 2013): 69–74. http://dx.doi.org/10.4028/www.scientific.net/amm.288.69.

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FMMEA (failure mode, mechanisms, and effects analysis) is an effective tool for the life-cycle management of products and devices. We conducted an FMMEA for a refrigeration device at the request of a corporation. This paper demonstrates the process of our analysis of the compressor by employing Ganesan’s methodology. The results are listed in a table, including the physics of failures, risk priorities and parameters for monitoring. This paper also provides health-state assessment approaches based on FMMEA results and values of relevant parameters using fusion approach. Such assessment can be u

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44

Burgess, David L. "Lessons from Sudoku." EDFA Technical Articles 8, no. 1 (2006): 25–28. http://dx.doi.org/10.31399/asm.edfa.2006-1.p025.

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Abstract Failure analysis requires a working knowledge of physics, technology, materials, manufacturing practices, analytical techniques, and more. It is difficult to imagine what failure analysis would be like if all the laws of physics were perfectly apparent and all the challenges of sample preparation and testing were removed. Eliminating those considerations, failure analysis would be more like Sudoku. Sudoku is a simple number puzzle enjoyed by both children and adults. The simplicity of Sudoku compared to failure analysis is the point. Although Sudoku is starkly simple, the process is c

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45

Snook, Ian, Jane Marshall, and Robert Newman. "Physics of Failure as an Integrated Part of Design for Reliability." Journal of the IEST 47, no. 1 (2004): 67–73. http://dx.doi.org/10.17764/jiet.47.1.74q481n144708775.

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A study of the use of Physics of Failure (PoF) methods was undertaken as part of a collaboratively funded United Kingdom Government Department of Industry (UK DTI) project for developing a holistic methodology and assessment model for the enhancement of electronics reliability. Several case studies were conducted to review the use of PoF techniques. The study concluded PoF methods, and in particular life modeling, are essential tools in design for reliability. PoF analysis can also be used to establish reliability enhancement testing (RET) and environmental stress screening (ESS) conditions. A

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46

Shao, Jiang, and Chen Hui Zeng. "Application of Physics-of-Failure Method in Reliability Engineering of Electronic Products." Applied Mechanics and Materials 313-314 (March 2013): 697–701. http://dx.doi.org/10.4028/www.scientific.net/amm.313-314.697.

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Physics-of-Failure (PoF) represents one approach to reliability assessment based on modeling and simulation that relies on understanding the physical processes contributing to the appearance of the critical failures. Firstly the connotation and meaning of PoF method were analyzed here, the inherence relation between PoF and reliability was expatiated, the PoF based reliability method and current reliability method based on probability statistics were compared, their differences and relationships were discussed here. Then the application condition of PoF method in reliability engineering in Eur

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47

Nakarmi, Upama, Mahshid Rahnamay Naeini, Md Jakir Hossain, and Md Abul Hasnat. "Interaction Graphs for Cascading Failure Analysis in Power Grids: A Survey." Energies 13, no. 9 (2020): 2219. http://dx.doi.org/10.3390/en13092219.

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Understanding and analyzing cascading failures in power grids have been the focus of many researchers for years. However, the complex interactions among the large number of components in these systems and their contributions to cascading failures are not yet completely understood. Therefore, various techniques have been developed and used to model and analyze the underlying interactions among the components of the power grid with respect to cascading failures. Such methods are important to reveal the essential information that may not be readily available from power system physical models and

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48

Wallace, David. "Naturalness and Emergence." Monist 102, no. 4 (2019): 499–524. http://dx.doi.org/10.1093/monist/onz022.

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Abstract I develop an account of naturalness (that is, approximately: lack of extreme fine-tuning) in physics which demonstrates that naturalness assumptions are not restricted to narrow cases in high-energy physics but are a ubiquitous part of how interlevel relations are derived in physics. After exploring how and to what extent we might justify such assumptions on methodological grounds or through appeal to speculative future physics, I consider the apparent failure of naturalness in cosmology and in the Standard Model. I argue that any such naturalness failure threatens to undermine the en

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Orozco, Antonio. "Magnetic Current Imaging in Failure Analysis." EDFA Technical Articles 11, no. 4 (2009): 14–21. http://dx.doi.org/10.31399/asm.edfa.2009-4.p014.

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Abstract Magnetic current imaging is a proven fault-isolation technique. Its unsurpassed sensitivity and resolution coupled with the fact that magnetic fields are unaffected by packaging and die materials make it a valuable FA tool for a wide variety of ICs and devices. This article reviews the basic measurement physics of magnetic current imaging, describes the general implementation, and presents several practical examples of its use.

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Strizich, Michael. "Voltage Contrast and EBIC Failure Isolation Techniques." EDFA Technical Articles 9, no. 1 (2007): 20–23. http://dx.doi.org/10.31399/asm.edfa.2007-1.p020.

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Abstract:

Abstract Voltage contrast followed by electron beam induced current imaging is an effective approach for isolating IC failures. This article briefly reviews the physics of signal generation for both techniques and presents several examples illustrating how this powerful combination contributes to advanced defect localization.

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