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Relevant bibliographies by topics / Fan out

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Academic literature on the topic 'Fan out'

Author: Grafiati

Published: 4 June 2021

Last updated: 13 February 2022

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Journal articles on the topic "Fan out"

1

Goodman, Joseph W. "Fan-in and Fan-out with Optical Interconnections." Optica Acta: International Journal of Optics 32, no. 12 (1985): 1489–96. http://dx.doi.org/10.1080/713821684.

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Becker, Karl-Friedrich, Tanja Braun, S. Raatz, et al. "On the Way from Fan-out Wafer to Fan-out Panel Level Packaging." International Symposium on Microelectronics 2016, S2 (2016): S1—S23. http://dx.doi.org/10.4071/isom-2016-slide-4.

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Fan-out Wafer Level Packaging (FOWLP) is one of the latest packaging trends in microelectronics. The technology has a high potential in significant package miniaturization concerning package volume but also in thickness. Main advantages of FOWLP are the substrate-less package, lower thermal resistance, higher performance due to shorter interconnects together with direct IC connection by thin film metallization instead of wire bonds or flip chip bumps and lower parasitic effects. Especially the inductance of the FOWLP is much lower compared to FC-BGA packages. In addition the redistribution lay

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Palesko, Chet, and Amy Lujan. "Cost Comparison of Fan-out Wafer-Level Packaging to Fan-out Panel-Based Packaging." International Symposium on Microelectronics 2016, no. 1 (2016): 000180–84. http://dx.doi.org/10.4071/isom-2016-wa32.

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Abstract Fan-out wafer-level packaging (FOWLP) offers many significant benefits over other packaging technologies. It is one of the smallest packaging options, but unlike fan-in wafer-level packaging, the IO count of FOWLP is not limited to the area of the die. Given these advantages, FOWLP continues to grow in popularity. While the cost of FOWLP is usually reasonable, there are still opportunities for future cost reduction. Many FOWLP suppliers are exploring panel-based manufacturing instead of the current wafer-based approach. Since many more packages can fit on a large panel than on a wafer

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Johnson, Donald W., and Bin-Hong Tsai. "SUEX Laminates for Fan-In, Fan-Out and eWLB Development." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2011, DPC (2011): 000635–65. http://dx.doi.org/10.4071/2011dpc-ta31.

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The focus of this presentation is on the use of SUEX epoxy Thick Dry Film Sheets (TDFS) as a photoimagable dielectric layer in fan-in, fan-out and e-WLP applications. The sheets can be laminated over severe topography from under 2 μm to over 200 μm in height yielding void free coatings with 100% planarization over the entire substrate. The TDFS are available in a range of thicknesses and wafer or panel sizes. This new material is prepared under a highly controlled solvent-less process, which provides uniform coatings between two throw-away layers of protective polyester film. SUEX sheets of 10

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Schneider, M. L., and K. Segall. "Fan-out and fan-in properties of superconducting neuromorphic circuits." Journal of Applied Physics 128, no. 21 (2020): 214903. http://dx.doi.org/10.1063/5.0025168.

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Wang, Yu-ying, Qing-shan Li, Ping Chen, and Chun-de Ren. "Dynamic fan-in and fan-out metrics for program comprehension." Journal of Shanghai University (English Edition) 11, no. 5 (2007): 474–79. http://dx.doi.org/10.1007/s11741-007-0507-2.

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Asthana, Praveen, Gregory P. Nordin, Armand R. Tanguay, and B. Keith Jenkins. "Analysis of weighted fan-out/fan-in volume holographic optical interconnections." Applied Optics 32, no. 8 (1993): 1441. http://dx.doi.org/10.1364/ao.32.001441.

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Kuixian, CHEN, WANG Yu, HE Taotao, et al. "Metasurface fan-out diffractive optical elements." Journal of Applied Optics 40, no. 2 (2019): 119–25. http://dx.doi.org/10.5768/jao201940.0205001.

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Zwenger, Curtis, Ron Huemoeller, JinHan Kim, DongJean Kim, WonChul Do, and SeongMin Seo. "Silicon Wafer Integrated Fan-out Technology." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2015, DPC (2015): 000217–47. http://dx.doi.org/10.4071/2015dpc-ta22.

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The tremendous growth in the mobile handset, tablet, and networking markets has been fueled by consumer demand for increased mobility, functionality, and ease of use. This, in turn, has been driving an increase in functional convergence and 3D integration of IC devices, resulting in the need for more complex and sophisticated packaging techniques. A variety of advanced IC interconnect technologies are addressing this growing need. These include Thru Silicon Via (TSV), Chip-on Chip (CoC), and Package-on-Package (PoP) approaches. In particular, emerging Wafer Level Fan-Out (WLFO) technology prov

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Zwenger, Curtis, George Scott, Ron Huemoeller, WonChul Do, WonGeol Lee, and JiHun Yi. "Silicon Wafer Integrated Fan-out Technology." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2017, DPC (2017): 1–23. http://dx.doi.org/10.4071/2017dpc-tp2_presentation4.

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The tremendous growth in the mobile handset, tablet, and networking markets has been fueled by consumer demand for increased mobility, functionality, and ease of use. This, in turn, has been driving an increase in functional convergence and 3D integration of IC devices, resulting in the need for more complex and sophisticated packaging techniques. A variety of advanced IC interconnect technologies are addressing this growing need. These include Through Silicon Via (TSV), Chip-on Chip (CoC), and Package-on-Package (PoP) approaches. In particular, emerging Wafer Level Fan-Out (WLFO) technology p

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Dissertations / Theses on the topic "Fan out"

1

Cawte, Paul Stephen. "The theory of volume holographic fan-out elements." Thesis, Imperial College London, 1995. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.283137.

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Roberts, M. W. "Logic circuit testability for reconvergent fan-out nodes." Thesis, University of York, 1986. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.374197.

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Abuelyaman, Eltayeb Salih. "Sequential circuits fault simulation using fan out stem based techniques." Diss., The University of Arizona, 1988. http://hdl.handle.net/10150/184466.

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This dissertation describes a new simulation technique for an automatic test generation system, SCIRTSS version 4.0 (Sequential Circuit Test Sequence System). This test generation system is driven by the hardware compiler AHPL, a Hardware Programming Language, and an intelligent heuristic-based search for test vector generation. Using a fault-injection gate-level simulator and the generated test vector, all the faulty states of the circuit are simulated in parallel and the simulator is thus able to find all detected faults by a particular input sequence. The major objective of this research wa

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Klink, Madeline LeNore. "Laugh out loud in real life : women's humor and fan identity." Thesis, Massachusetts Institute of Technology, 2010. http://hdl.handle.net/1721.1/59730.

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Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Comparative Media Studies, 2010.<br>Cataloged from PDF version of thesis.<br>Includes bibliographical references (p. 83-91).<br>The emerging field of fan studies has, until recently, been defined only by the research that has taken place within it. Almost universally, this research focuses on self-identified fans. However, scholars are beginning to examine and debate what the limits of the field should be. This study argues that self-identified fans are not the only group that ought to be examined under the heading of fan studies.

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Strömberg, Malin. "Paper dimensional stability in sheet-fed offset printing : Papperets dimensionsstabilitet i en arkoffsetpress." Thesis, Högskolan Dalarna, Grafisk teknik, 2005. http://urn.kb.se/resolve?urn=urn:nbn:se:du-1400.

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In offset printing, dampening solution is used to create a good balance in the process. If too much water is transferred to the paper, the sheet can change its size between the printing units, due to water absorption, and cause a problem with the colour register. This phenomenon is usually referred to as fanout. In this degree project, an investigation was made to see if the paper dimensions changed through its way in the sheet-fed printing process. The instrument Luchs Register Measuring Systems (Lynx) was used, and a method for measuring if the paper changed its dimensions with this instrume

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Berglund, Martin. "Optical measuring system using a camera and laser fan-out for narrow mounting on a miniaturized submarine." Thesis, Uppsala University, Ångström Space Technology Centre, ÅSTC, 2009. http://urn.kb.se/resolve?urn=urn:nbn:se:uu:diva-112681.

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<p>The aim was to develop, manufacture and evaluate diffractive lenses, or diffractive optical elements (DOE), for use in correlation with a camera to add perspective in pictures. The application is a miniaturized submarine developed in order to perform distant exploration and analysis in harsh and narrow environments. The idea is to project a laser pattern upon the observed structure and thereby add geometrical information to pictures acquired with an onboard CMOS camera. The design of the DOE-structures was simulated using the optimal rotational angle method (ORA). A set of prototype DOEs we

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Whetten, Jonathan M. "Using Operator Teams for Supervisory Control." BYU ScholarsArchive, 2009. https://scholarsarchive.byu.edu/etd/2033.

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Robots and other automated systems have potential use in many different fields. As the scope of robot applications that robots are used for increases, there is a growing desire to have human operators manage multiple robots. Typical methods of enabling operators to multi-task in this way involve some combination of user interfaces that support human cognition and advanced robot autonomy. Our research explores a complementary method of managing multiple robots by utilizing operator teams. The evidence suggests that for appropriate task scenarios, two cooperating operators can be more than twice

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Pelini, Nicholas Michael. "Netlist Security Algorithm Acceleration Using OpenCL on FPGAs." University of Dayton / OhioLINK, 2017. http://rave.ohiolink.edu/etdc/view?acc_num=dayton1501861339318045.

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Barnard, Timothy L. ""Far out past": Hemingway, manhood, and modernism." W&M ScholarWorks, 2005. https://scholarworks.wm.edu/etd/1539623462.

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This dissertation investigates Ernest Hemingway's authorship as an instance of international modernisms forming as sustained engagements with gender and sexuality. By focusing on four of Hemingway's most experimental texts it shows how a figure of both "high" and "popular" modernism sought to occupy a heterogeneous space of cultural queerness vitalized by masculinity, national and ethnic identities, and writing.;The introduction discusses how post-war gender, sexual, and literary discourses reflected period obsessions with authenticity in the face of a rising commodity culture. It also introdu

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Murray, Delaney. "DAUGHTERS OF THE DIGITAL: A PORTRAIT OF FANDOM WOMEN IN THE CONTEMPORARY INTERNET AGE." Ohio University Honors Tutorial College / OhioLINK, 2020. http://rave.ohiolink.edu/etdc/view?acc_num=ouhonors1587738612384951.

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Books on the topic "Fan out"

1

Lau, John H. Fan-Out Wafer-Level Packaging. Springer Singapore, 2018. http://dx.doi.org/10.1007/978-981-10-8884-1.

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Xia, Wang, ed. Zuo chu hei dong: Wu bi fang fan yu shi bie zhi dao = Get out of the trap : to identify & prevent fraudulent practices. Guangdong jing ji chu ban she, 2006.

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Nellist, M. E. A comparison of fan and heater control policies for near-ambient drying: Astudy carried out for the Electricity Council and ADAS Mechanisation. AFRC Institute of Engineering Research, 1988.

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Zhao, Yiheng. The River Fans Out. Springer Singapore, 2020. http://dx.doi.org/10.1007/978-981-15-7724-6.

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Kurtzweil, Paula. Taking the fat out of food. Dept. of Health and Human Services, Public Health Service, Food and Drug Administration, 1997.

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Kurtzweil, Paula. Taking the fat out of food. Dept. of Health and Human Services, Public Health Service, Food and Drug Administration, 1996.

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Kurtzweil, Paula. Taking the fat out of food. Dept. of Health and Human Services, Public Health Service, Food and Drug Administration, 1997.

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8

Rob, Merrills, ed. "Dicks out!": The definitive work on British football songs. Chatsby Publishing, 1992.

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Hobbs, Suzanne Havala. Get the Trans Fat Out. Crown Publishing Group, 2010.

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Shaw, Chris. Our Liverpool. Grosvenor House Pub., 2010.

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Book chapters on the topic "Fan out"

1

Weik, Martin H. "fan-out." In Computer Science and Communications Dictionary. Springer US, 2000. http://dx.doi.org/10.1007/1-4020-0613-6_6793.

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Kaneshiro, Kenneth Y., and Alan T. Ohta. "7. The Flies Fan Out." In The Natural History Reader in Evolution, edited by Niles Eldredge. Columbia University Press, 1987. http://dx.doi.org/10.7312/eldr92092-011.

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Lau, John H. "Fan-Out Panel-Level Packaging (FOPLP)." In Fan-Out Wafer-Level Packaging. Springer Singapore, 2018. http://dx.doi.org/10.1007/978-981-10-8884-1_9.

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Lau, John H. "Patent Issues of Fan-Out Wafer-Level Packaging." In Fan-Out Wafer-Level Packaging. Springer Singapore, 2018. http://dx.doi.org/10.1007/978-981-10-8884-1_1.

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Lau, John H. "3D Integration." In Fan-Out Wafer-Level Packaging. Springer Singapore, 2018. http://dx.doi.org/10.1007/978-981-10-8884-1_10.

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Lau, John H. "3D IC Heterogeneous Integration by FOWLP." In Fan-Out Wafer-Level Packaging. Springer Singapore, 2018. http://dx.doi.org/10.1007/978-981-10-8884-1_11.

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Lau, John H. "Flip Chip Technology Versus FOWLP." In Fan-Out Wafer-Level Packaging. Springer Singapore, 2018. http://dx.doi.org/10.1007/978-981-10-8884-1_2.

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Lau, John H. "Fan-in Wafer-Level Packaging Versus FOWLP." In Fan-Out Wafer-Level Packaging. Springer Singapore, 2018. http://dx.doi.org/10.1007/978-981-10-8884-1_3.

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Lau, John H. "Embedded Chip Packaging." In Fan-Out Wafer-Level Packaging. Springer Singapore, 2018. http://dx.doi.org/10.1007/978-981-10-8884-1_4.

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Lau, John H. "FOWLP: Chip-First and Die Face-Down." In Fan-Out Wafer-Level Packaging. Springer Singapore, 2018. http://dx.doi.org/10.1007/978-981-10-8884-1_5.

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Conference papers on the topic "Fan out"

1

Olsen, Dan R., and Stephen Bart Wood. "Fan-out." In the 2004 conference. ACM Press, 2004. http://dx.doi.org/10.1145/985692.985722.

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Braun, T., K. F. Becker, S. Raatz, et al. "From fan-out wafer to fan-out panel level packaging." In 2015 European Conference on Circuit Theory and Design (ECCTD). IEEE, 2015. http://dx.doi.org/10.1109/ecctd.2015.7300046.

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Schwab, Markus, Norbert Lindlein, Johannes Schwider, Yaakov Amitai, Asher A. Friesem, and Silviu Reinhorn. "Achromatic diffractive fan-out systems." In OE/LASE '94, edited by Ivan Cindrich and Sing H. Lee. SPIE, 1994. http://dx.doi.org/10.1117/12.178071.

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Wang, Tie, and Raymond Arrathoon. "Limits of optical and electrical fan-out versus power and fan-out versus bandwidth." In Hybrid Image and Signal Processing II, edited by David P. Casasent and Andrew G. Tescher. SPIE, 1990. http://dx.doi.org/10.1117/12.21307.

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Kar, Ajoy Kumar. "Laser-inscribed multicore fan-out devices." In 2012 Opto-Electronics and Communications Conference (OECC). IEEE, 2012. http://dx.doi.org/10.1109/oecc.2012.6276571.

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Braun, T., K. F. Becker, S. Raatz, et al. "Foldable Fan-Out Wafer Level Packaging." In 2016 IEEE 66th Electronic Components and Technology Conference (ECTC). IEEE, 2016. http://dx.doi.org/10.1109/ectc.2016.90.

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Zhan, Lihua, Hao Li, Fuguo Zhu, and Zhipeng Zhou. "3D Module in Fan-out Packaging." In 2018 19th International Conference on Electronic Packaging Technology (ICEPT). IEEE, 2018. http://dx.doi.org/10.1109/icept.2018.8480828.

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Uemura, Hitoshi, Katsushiro Takenaga, Teijiro Ori, Shoichiro Matsuo, Kunimasa Saitoh, and Masanori Koshiba. "Fused Taper Type Fan-in/Fan-out Device for Multicore EDF." In OptoElectronics and Communications Conference and Photonics in Switching. OSA, 2013. http://dx.doi.org/10.1364/oecc_ps.2013.tus1_4.

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Jung, Y., J. R. Hayes, S. U. Alam, and D. J. Richardson. "Multicore Fibre Fan-In/Fan-Out Device using Fibre Optic Collimators." In 2017 European Conference on Optical Communication (ECOC). IEEE, 2017. http://dx.doi.org/10.1109/ecoc.2017.8345892.

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Thomson, R. R., G. Brown, A. K. Kar, T. A. Birks, and J. Bland-Hawthorn. "An Integrated Fan-Out Device for Astrophotonics." In Frontiers in Optics. OSA, 2010. http://dx.doi.org/10.1364/fio.2010.pdpa3.

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Reports on the topic "Fan out"

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Revina, Shintia, Rezanti Putri Pramana, Rizki Fillaili, and Daniel Suryadarma. Systemic Constraints Facing Teacher Professional Development in a Middle-Income Country: Indonesia’s Experience Over Four Decades. Research on Improving Systems of Education (RISE), 2020. http://dx.doi.org/10.35489/bsg-rise-wp_2020/054.

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Despite government efforts to reform teacher professional development (TPD) in the past four decades, Indonesian teacher quality remains low. Why have the improvement efforts failed? In the present study we investigate what caused these reforms to fail from two angles. First, we examine the efficacy of the latest teacher professional development (TPD) initiative in Indonesia, Pengembangan Keprofesian Berkelanjutan or PKB (Continuing Professional Development), and identify the factors affecting its efficacy. We found that some essential features of effective TPD are missing in PKB. The PKB prog

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Revina, Shintia, Rezanti Putri Pramana, Rizki Fillaili, and Daniel Suryadarma. Systemic Constraints Facing Teacher Professional Developmentin a Middle-Income Country: Indonesia’s Experience Over Four Decades. Research on Improving Systems of Education (RISE), 2020. http://dx.doi.org/10.35489/bsgrisewp_2020/054.

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Despite government efforts to reform teacher professional development (TPD) in the past four decades, Indonesian teacher quality remains low. Why have the improvement efforts failed? In the present study we investigate what caused these reforms to fail from two angles. First, we examine the efficacy of the latest teacher professional development (TPD) initiative in Indonesia, Pengembangan Keprofesian Berkelanjutan or PKB (Continuing Professional Development), and identify the factors affecting its efficacy. We found that some essential features of effective TPD are missing in PKB. The PKB prog

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Sayers, Dave, Rui Sousa-Silva, Sviatlana Höhn, et al. The Dawn of the Human-Machine Era: A forecast of new and emerging language technologies. Open Science Centre, University of Jyväskylä, 2021. http://dx.doi.org/10.17011/jyx/reports/20210518/1.

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New language technologies are coming, thanks to the huge and competing private investment fuelling rapid progress; we can either understand and foresee their effects, or be taken by surprise and spend our time trying to catch up. This report scketches out some transformative new technologies that are likely to fundamentally change our use of language. Some of these may feel unrealistically futuristic or far-fetched, but a central purpose of this report - and the wider LITHME network - is to illustrate that these are mostly just the logical development and maturation of technologies currently i

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Chen, Sunny, Emily Schwartz, Cindy Le, and Elizabeth Davidson Pisacreta. Right in Your Backyard: Expanding Local Community College Transfer Pathways to High-Graduation-Rate Institutions. Ithaka S+R, 2021. http://dx.doi.org/10.18665/sr.315695.

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Each year, our country’s most selective four-year institutions invest significant resources to recruit talented high school students from across the country. Before the COVID-19 pandemic, admissions representatives traveled far and wide to convince these prospective students that the academic rigor, amenities, and opportunities at their institution are unparalleled. These students, mostly affluent and white, contemplate admission offers and consider moves to new locales to pursue their postsecondary plans. Yet, many of these selective institutions are overlooking a talented and diverse pool of

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Stelmakh, Marta. HISTORICAL CONTEXT IN THE COLLECTION OF ARTICLES BY TIMOTHY SNYDER «UKRAINIAN HISTORY, RUSSIAN POLITICS, EUROPEAN FUTURE». Ivan Franko National University of Lviv, 2021. http://dx.doi.org/10.30970/vjo.2021.50.11098.

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The article examines the problem of the image formation of Ukraine in the international arena in the historical journalism of Timothy Snyder. The subject of the research is the historical context in the journalistic collection «Ukrainian History, Russian Politics, European Future». It identifies the main considerations of the author on the past of Russian-Ukrainian relations and the need to develop historical consciousness in the fight against Russian manipulation. Methodology: the comparative, historical, system analysis and other methods are used in the process of scientific research. The re

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Schulz, Jan, Daniel Mayerhoffer, and Anna Gebhard. A Network-Based Explanation of Perceived Inequality. Otto-Friedrich-Universität, 2021. http://dx.doi.org/10.20378/irb-49393.

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Across income groups and countries, the public perception of economic inequality and many other macroeconomic variables such as inflation or unemployment rates is spectacularly wrong. These misperceptions have far-reaching consequences, as it is perceived inequality, not actual inequality informing redistributive preferences. The prevalence of this phenomenon is independent of social class and welfare regime, which suggests the existence of a common mechanism behind public perceptions. We propose a network-based explanation of perceived inequality building on recent advances in random geometri

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Perdigão, Rui A. P., and Julia Hall. Spatiotemporal Causality and Predictability Beyond Recurrence Collapse in Complex Coevolutionary Systems. Meteoceanics, 2020. http://dx.doi.org/10.46337/201111.

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Causality and Predictability of Complex Systems pose fundamental challenges even under well-defined structural stochastic-dynamic conditions where the laws of motion and system symmetries are known. However, the edifice of complexity can be profoundly transformed by structural-functional coevolution and non-recurrent elusive mechanisms changing the very same invariants of motion that had been taken for granted. This leads to recurrence collapse and memory loss, precluding the ability of traditional stochastic-dynamic and information-theoretic metrics to provide reliable information about the n

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Beiker, Sven. Unsettled Issues Regarding Communication of Automated Vehicles with Other Road Users. SAE International, 2020. http://dx.doi.org/10.4271/epr2020023.

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The focus of this SAE EDGE™ Research Report is to address a topic overlooked by many who choose to view automated driving systems and AVs from a “10,000-foot” perspective: how automated vehicles (AVs) will actually communicate with other road users. Conventional (human-driven) vehicles, bicyclists, and pedestrians already have a functioning system of understating each other while on the move. Adding automated vehicles to the mix requires assessing the spectrum of existing modes of communication – both implicit and explicit, biological and technological, and how they will interact with each oth

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Idris, Iffat. Documentation of Survivors of Gender-based Violence (GBV). Institute of Development Studies (IDS), 2021. http://dx.doi.org/10.19088/k4d.2021.103.

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This review is largely based on grey literature, in particular policy documents and reports by international development organizations. While there was substantial literature on approaches and principles to GBV documentation, there was less on remote service delivery such as helplines – much of this only in the wake of the COVID-19 pandemic. In addition, very little was found on actual examples of GBV documentation in developing contexts. By definition, gender featured strongly in the available literature; the particular needs of persons with disabilities were also addressed in discussions of

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Horgan, John. Deradicalization Programs: Recommendations for Policy and Practice. RESOLVE Network, 2021. http://dx.doi.org/10.37805/pn2021.18.vedr.

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Involvement in violent extremism is not a one-way street. People can, and do, leave violent extremist movements. Understanding how and why they leave (or want to leave) constitutes actionable knowledge that brings immense practical benefits. Such knowledge may help in designing initiatives aimed at persuading people to leave violent extremist groups as well as reducing the risk of re-engagement in violent extremism in the future. Deradicalization programs have much to offer but they are not a magic solution to a highly complex, fluid problem. Not everyone who engages in violent extremism is ne

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