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Relevant bibliographies by topics / Flash-free

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Academic literature on the topic 'Flash-free'

Author: Grafiati

Published: 4 June 2021

Last updated: 1 February 2022

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Journal articles on the topic "Flash-free"

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Jung, Aurore, Benoit Egloff, Thierry Schweitzer, Lionel Aranda, Christophe Rapin, Eliane Albuisson, and Marie-Pierryle Filleul. "Comparaison du joint de colle entre les attaches préencollées APC™ PLUS et les attaches APC™ Flash-Free." L'Orthodontie Française 89, no. 2 (June 2018): 191–97. http://dx.doi.org/10.1051/orthodfr/2018012.

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Introduction : La nouvelle attache préencollée APC™ Flash-Free du groupe 3M Unitek® permet-elle une simplification du protocole de collage sans en diminuer la précision ? Objectifs : L’objectif de cette étude est de comparer la morphologie du joint de colle entre les attaches préencollées classiques APC™PLUS et les attaches APC™ Flash-Free. Matériels et méthodes : Le collage in vitro des attaches esthétiques de la gamme CLARITY™ ADVANCED permet de comparer la morphologie des excès de colle entre les attaches APC™ PLUS et APC™ Flash-Free. Résultats : Aucune différence statistiquement significative concernant la morphologie des excès de colle n’est constatée entre les attaches APC™ PLUS et APC™ Flash-Free. Une différence statistiquement significative concernant l’épaisseur de colle existe entre les deux types d’attaches. L’épaisseur de colle au niveau des attaches APC™ Flash-Free est significativement plus importante que l’épaisseur au niveau des attaches APC™ PLUS (P=0,0001). L’épaisseur de colle est également plus homogène au niveau des attaches APC™ Flash-Free (P=0,001 pour la différence relative). Conclusion : L’épaisseur de colle au niveau des attaches APC™ Flash-Free est plus importante mais plus homogène qu’au niveau des attaches APC™ PLUS.

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Shepard, S. M., Y. Hou, T. Ahmed, and J. R. Lhota. "Reference-free interpretation of flash thermography data." Insight - Non-Destructive Testing and Condition Monitoring 48, no. 5 (May 2006): 298–301. http://dx.doi.org/10.1784/insi.2006.48.5.298.

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Filippova, M. V., A. V. Bakhaev, V. N. Peretyat’ko, and A. A. Fedorov. "Flash-free stamping from a spherical blank." Steel in Translation 41, no. 10 (October 2011): 805–7. http://dx.doi.org/10.3103/s0967091211100068.

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Grünheid, Thorsten, and Brent E. Larson. "A comparative assessment of bracket survival and adhesive removal time using flash-free or conventional adhesive for orthodontic bracket bonding: A split-mouth randomized controlled clinical trial." Angle Orthodontist 89, no. 2 (September 19, 2018): 299–305. http://dx.doi.org/10.2319/030918-195.1.

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ABSTRACT Objectives: To compare bracket survival and adhesive removal time between a flash-free and a conventional adhesive for orthodontic bracket bonding. Materials and Methods: Forty-five consecutive patients had their maxillary incisors, canines, and premolars bonded with ceramic brackets using a flash-free adhesive (APC Flash-Free Adhesive, 3M Unitek, Monrovia, Calif) on one side and a conventional adhesive (APCII Adhesive, 3M Unitek) on the other side. The side allocation was randomized. Bracket failure was recorded at 4-week intervals. The adhesive remnant index (ARI) was scored on debond and adhesive removal timed to the nearest second. The primary outcome was adhesive removal time per quadrant. Secondary outcomes were bracket failure rate, time to first-time failure of a bracket, and ARI score on debond. Paired t-tests were used to compare adhesive removal times and ARI scores between the adhesives with P < .05 considered statistically significant. Results: Bracket failure rates were 4.3% for the flash-free adhesive and 1.9% for the conventional adhesive, with mean times to first-time failure of 31 weeks for the flash-free adhesive and 42 weeks for the conventional adhesive; neither failure rates nor times to first failure were significantly different. Although the flash-free adhesive left significantly more adhesive on the tooth surface after debonding, the adhesive removal times were 22.2% shorter than with the conventional adhesive. Conclusions: Bracket survival with the flash-free adhesive was equivalent to the conventional adhesive when ceramic brackets were bonded. Adhesive removal was significantly faster when using the flash-free adhesive, which may result in time savings of more than 20% compared with the conventional adhesive.

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Lee, Moonyoung, and Georgios Kanavakis. "Comparison of shear bond strength and bonding time of a novel flash-free bonding system." Angle Orthodontist 86, no. 2 (September 23, 2015): 265–70. http://dx.doi.org/10.2319/011715-37.1.

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ABSTRACT Objective: To evaluate the bonding time, shear bond strength (SBS), and adhesive residue index (ARI) of APC(TM) Flash-Free bonding system. Materials and Methods: Thirty-six extracted human maxillary premolars were randomly divided into three groups (12 per group) and used for this in vitro study: group 1, APC Flash-Free Adhesive Coated Appliance System; group 2, Clarity ADVANCED Ceramic Bracket pasted manually; group 3 (control group), 3M APC PLUS Adhesive prepasted brackets bonded with the extruded flash removed. Bonding time was measured using a stopwatch. Bond strength was measured using an Instron at a cross-head speed of 1 mm/min. The ARI was graded on a scale from 1 to 5. Repeated-measures analysis of variance and post hoc Tukey tests were used for statistical analysis. Results: It took significantly (P < .001) less time to bond in the APC Flash-Free Adhesive group (30.7 ± 3.3 seconds) compared with the control group (41.8 ± 4.0 seconds) and the manual group (39.2 ± 2.8 seconds). The APC Flash-Free Adhesive coated bracket had significantly (P < .001) greater SBS (13.7 ± 2.2 MPa) compared with the control group (10.8 ± 2.0 MPa) and the manual group (10.4 ± 1.4 MPa). The ARI was significantly (P < .001) greater with the APC Flash-Free Adhesive coated bracket compared with that of the other two groups. Conclusions: Compared with other methods of bonding, the APC Flash-Free Adhesive Coated System can potentially reduce bonding time while increasing SBS.

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Golban, Denisa Maria, Radu Negru, Camelia Szuhanek, Meda Lavinia Negrutiu, Liviu Marsavina, Virgil Florin Duma, Cosmin Sinescu, and Liliana Porojan. "Flash-Free Orthodontic Adhesive System Bonded on CAD/CAM Produced Resin Restorations." Materiale Plastice 55, no. 4 (December 30, 2018): 606–8. http://dx.doi.org/10.37358/mp.18.4.5084.

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Flash-Free Orthodontic Adhesive System represents the latest technology in the field of orthodontics. In the present study the bonding technique is applied on CAD/CAM produced resin crowns. Ten resin blocks were shaped after an upper premolar crown design from the 3Shape Library, and they were divided ino two groups: on Group 1, control, Clarity Advanced braces (3M Unitek, Monrovia, CA, USA) were bonded using XT Adhesive Paste (3M Unitek, Monrovia, CA, USA), while on Groups 2 same aesthetic brackets were applied, using the APC Flash-Free Adhesive Coated Appliance System (3M Unitek, Monrovia, CA, USA). Bracket positioning time was recorded for each sample. Zwick Zoel Z005 testing machine was used to measure the shear bond strength (SBS) at which debonding takes place. Adhesive remnant index (ARI) was registered, as well as presence or absence of adhesive flash and accuracy of flash cleaning before curing. Group 1 showed a mean bonding time of 46.4 s, while Group 2 needed about 20.6 s for each bracket bonding. Mean SBS values for both groups are considered clinically acceptable (6.27 MPa for Group 1 and 7.77 MPa for Group 2). ARI scores were zero for all samples and after debonding, on group 1 can be observed the adhesive flash. In conclusion, APC Flash-Free Coated Appliance System showed reduced time for bracket positioning compared to the conventional technique. APC Flash-Free System showed acceptable SBS values, higher than the uncoated brackets. No composite was left on the resin crown after debonding, the adhesive flash resulted in the conventional technique remaining on the edges of the debonded brackets.

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He, Qinlu, Genqing Bian, Weiqi Zhang, Fenglang Wu, and Zhen Li. "TCFTL: Improved Real-Time Flash Memory Two Cache Flash Translation Layer Algorithm." Journal of Nanoelectronics and Optoelectronics 16, no. 3 (March 1, 2021): 403–13. http://dx.doi.org/10.1166/jno.2021.2970.

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The traditional flash translation layer (FTL) algorithm is mainly aimed at optimizing the average response time of flash reading and writing. Since it cannot be updated in place, for the traditional FTL algorithm, it is necessary to find a free page for writing each time. When a block is full, it will redistribute a free block. Therefore, when the flash memory is almost full, a written request will lead to a garbage collection, which will have many write copies, which will lead to a substantial decline in response time. This paper proposes an algorithm that makes full use of spatial locality and temporal locality to optimize the address cache in Demand-based Flash Translation Layer (DFTL) algorithm. In the experiment, this algorithm experiment and good results are obtained.

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Tatterson, David F., Ken K. Robinson, Terry L. Marker, and Rick Guercio. "Coal flash pyrolysis in a free-jet reactor." Industrial & Engineering Chemistry Research 27, no. 9 (September 1988): 1606–13. http://dx.doi.org/10.1021/ie00081a009.

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Çokakoğlu, Serpil, and Ayten Tan. "Effects of adhesive flash-free brackets on debonding pain and time: A randomized split-mouth clinical trial." Angle Orthodontist 90, no. 6 (September 3, 2020): 758–65. http://dx.doi.org/10.2319/030820-162.1.

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ABSTRACT Objectives To evaluate the effects of adhesive precoated (APC) flash-free brackets on the level of pain, amount of remnant adhesive, and removal time during the debonding procedure. Materials and Methods Thirty patients (20 female, 10 male) aged 12 to 18 years undergoing nonextraction fixed orthodontic treatment were included in this study. APC flash-free and conventional ceramic brackets were bonded with a split-mouth study design. Bracket types were randomly allocated to quadrants. During the removal of the brackets, the visual analogue scale (VAS) was used to assess the level of pain for each tooth. The adhesive remnant index (ARI) was used to determine the amount of adhesive remaining on the tooth surface. Adhesive removal times were calculated per quadrant. The data were analyzed using the Wilcoxon test for comparisons between groups. Results Pain scores were generally higher for the conventional group than for the flash-free group. There were no differences in VAS scores across most tooth types during debonding. Overall, ARI results showed more adhesive remnants in the conventional bracket group (P < .001). Except for the right maxillary quadrant, the times required to remove the adhesive were significantly longer for the flash-free brackets than the conventional brackets (P ≤ .005). Conclusions Although removal time was slightly longer for the flash-free adhesive than for the conventional adhesive, lower pain scores were generally observed for the flash-free adhesive brackets during the debonding procedure. Both time and pain differences could be considered clinically insignificant.

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Kim, Julia, Georgios Kanavakis, Matthew D. Finkelman, and Moonyoung Lee. "Microleakage under ceramic flash-free orthodontic brackets after thermal cycling." Angle Orthodontist 86, no. 6 (May 16, 2016): 905–8. http://dx.doi.org/10.2319/021016-115.1.

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ABSTRACT Objective: To compare microleakage under 3M Unitek's APC Flash-Free Adhesive Coated System bracket and the APC PLUS Adhesive Coated System bracket after thermal cycling. Materials and Methods: Forty freshly extracted human maxillary premolars were randomly divided into two groups and bonded with either a Flash-Free bracket or a PLUS bracket. After bonding, the samples were incubated in a water bath at 37°C for 24 hours and thermocycled for 5000 cycles between 5°C and 50°C. All teeth were immersed in a 2% methylene blue solution for 24 hours, embedded in acrylic and sectioned in a buccolingual direction at approximately the center of the bracket. Microleakage was observed at the enamel-adhesive interface from the occlusal and gingival margins of the bracket base. Statistical analysis was conducted using the Mann-Whitney U-test. Results: The median microleakage was higher in the Flash-Free group, but the difference between the two groups was not statistically significant (P > .05). Conclusion: In a laboratory setting, there is no significant difference between the extent of microleakage under the APC Flash-Free Adhesive Coated System bracket and the APC PLUS Adhesive Coated System bracket after thermal cycling.

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Dissertations / Theses on the topic "Flash-free"

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Smith, M. J. C. "Flash photolysis studies of gas phase free radical reactions." Thesis, University of Oxford, 1985. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.355811.

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Roychowdhury, Sayak. "Investigation of Flash-free Die Casting by Overflow Design Optimization." The Ohio State University, 2014. http://rave.ohiolink.edu/etdc/view?acc_num=osu1406121850.

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Simpson, Nigel J. K. "Studies of transient free radicals in solution by flash photolysis E.S.R." Thesis, University of Oxford, 1990. http://ora.ox.ac.uk/objects/uuid:dd9a8aa9-f68a-4362-af7e-6c052fa3a5fe.

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An introduction is presented to the nature of polarized and non-polarized transient spin resonance signals, produced by flash-photolysis e.s.r., followed by a description of the equipment used for experimental work. Theories of Chemically Induced Dynamic Electron Spin Polarization are reviewed and various models introduced to illustrate these concepts. A description is given of the first thorough investigation into the effect of CIDEP polarization transfer down a free radical chain and expands upon the consequences of hyperfine-dependent relaxation and the relative signs of coupling constants in various radical species. It concludes with an account of two methods of kinetic analysis which are the first practical demonstrations of their kind, and employ extension of expressions developed in earlier chapters. Studies are made of the CIDEP behaviour of radicals in high viscosity paraffins. A reassessment of previous published work is made: anomalous polarization behaviour was found to have been over-compensated for. A new method of extracting values for T₁ and T_{2,/sub> is demonstrated for strong transient e.s.r. signals. A collection of experimental data relating to the previously unexplained absorptive polarization observed in the spectrum of ketyl radicals and the longer-time phase inversion of hyperfine-dependent CIDEP is given. The operation of Triplet Mechanism CIDEP in the ketyl radical systems is ruled out and a division of radicals into geminately formed and free-encounter pairs is shown to be incapable of explaining the observed phase changes. In its place a cross-relaxational mechanism, drawing upon simultaneously generated nuclear spin polarization is advanced. Conclusions are drawn that this may account for both anomalies. Lastly a photochemical application of CIDEP is demonstrated; two different reaction intermediates are identified upon photolysis of ortho phthalaldehyde, depending upon the quenching conditions. A reaction scheme consistent with all experimental data is proposed. A brief comment upon the photo-chemistry of indan 2-one concludes this work.}

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Macpherson, Andrew D. "Cyclisation reactions of aromatic free radicals generated by flash vacuum pyrolysis." Thesis, University of Edinburgh, 1994. http://hdl.handle.net/1842/12528.

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Friedline, Robert Alan. "The Reaction Kinetics of Neutral Free Radicals and Radical Ions Studied by Laser Flash Photolysis." Diss., Virginia Tech, 2004. http://hdl.handle.net/10919/11157.

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t-Butoxyl radical has been used as a chemical model for hydrogen abstractions in many enzymatic and biological systems. However, the question has arisen as to how well this reactive intermediate mimics these systems. In addressing this concern, absolute rate constants and Arrhenius parameters for hydrogen abstraction by t-butoxyl radical were measured for a broad class of substrates including amines, hydrocarbons, and alcohols using laser flash photolysis. Initially, no obvious reactivity relationship between rate constant and substrate structure was observed for these homolytic reactions. However, by closely examining the Arrhenius parameters for hydrogen abstraction, a pattern was revealed. For substrates with C-H bond dissociation energy (BDE) > 92 kcal/mole, activation energy increases with increasing BDE (as expected). However, for substrates with a lower BDE, the activation energy levels out at approximately 2 kcal/mole, essentially independent of structure. Viscosity studies with various solvents were conducted, ruling out the possibility of diffusion-controlled reactions. Entropy rather than enthalpy appears to be the dominating factor at 25°C, contributing to the free energy barrier for these reactions. Laser flash photolysis was also used to study radical anions. Using an indirect photoexcitation method, the properties of radical anions, generated from aryl ketones, were investigated. These radical anions, such as t-butyl phenyl ketone and cyclopropyl phenyl ketone, measured to have decay rate constants of 1.0 x 106 s-1, although they are known to be persistent when studied electrochemically. They also had measured activation energies around 6.0 kcal/mole and log A values close to 9.5. By extending the molecules's conjugation, the decay rate constants increased to greater than 107 s-1, decreased their activation energy by half, and lowered the log A values to 8.0. This trend was observed in aryl ketones such as trans-1-benzoyl-3-phenyl cyclopropane. It is believed that the generation of a benzyl radical during the decay that facilitates the enhancement of the unimolecular decays. These unimolecular decays were also observed with the previously studied hypersensitive SET probes, 5,7-di-tert-butylspiro[2.5]octa-4,7-dien-6-one and 1,1,-dimethyl-5,7-di-tert-butylspiro[2.5]octa-4,7-dien-6-one. The decay rate constants for these radical anions were measured to be greater than 108 s-1, driven by the formation of an aromatic ring.
Ph. D.

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Zhao, Zhijun. "Laser flash photolysis studies of some gas phase reactions of atmospheric interest." Diss., Atlanta, Ga. : Georgia Institute of Technology, 2009. http://hdl.handle.net/1853/31790.

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Thesis (Ph.D)--Earth and Atmospheric Sciences, Georgia Institute of Technology, 2010.
Committee Chair: Wine, Paul; Committee Member: Huey, Greg; Committee Member: Mulholland, James; Committee Member: Nenes, Athanasios; Committee Member: Weber, Rodney. Part of the SMARTech Electronic Thesis and Dissertation Collection.

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Britton, Steven Todd. "AN ANALYSIS OF INTERNAL VOIDS OF ORTHODONTIC ADHESIVES VIA MICRO-CT." Master's thesis, Temple University Libraries, 2019. http://cdm16002.contentdm.oclc.org/cdm/ref/collection/p245801coll10/id/598784.

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Oral Biology
M.S.
Objectives: While bracket debonding has been explored through shear bond-strength tests with debonding linked to the type of material used, the technique of adhesive application, and contamination, the contribution of internal voids in orthodontic adhesives is unknown. Voids may result in fracture or bond-failure, either within the adhesive or at the tooth-adhesive-bracket interfaces. The aim of this thesis is to quantify the internal volumetric voids and bonding strength of three generations of bracket adhesives. Methods: Extracted third molars were bonded with three groups of orthodontic brackets including conventionally-pasted (CP), pre-coated (PC), or pre-coated flash-free (FF) (n=5 per group). The three-dimensional internal structure of the adhesive was evaluated with Micro Computed Tomography (micro-CT) using the Skyscan micro-CT (maximum resolution of 5 microns). Data from the micro-CT were analyzed with SkyScan software to perform 3D reconstructions, image processing, and qualitative and quantitative analysis of the adhesive’s structure. The amount of void was determined by measuring the percentage of voids at the bonded interfaces (Vint) and within the adhesive (Vbulk). The total amount of void was also calculated (Vtot= Vint+ Vbulk). Differences in void between the groups were assessed using one-way ANOVA with post-hoc Tukey tests (α=0.05). The bonding strength of the three adhesives systems was evaluated via shear bond strength tests. Results: Our void quantification results showed that FF brackets had a statistically higher (p0.05) for any the analyzed locations (Vint, Vbulk). Our results indicate the majority of voids were found at bonded interfaces (Vint) compared to within the bulk (Vbulk) for all three groups, with statistically significant (p<0.05) differences for CP and FF. Our bonding strength evaluation revealed the pre-coated group (PC) to have on average the highest bond strength compared to conventionally-pasted (CP) and pre-coated flash-free (FF) groups. Conclusions: The overall amount of void in the pre-coated flash-free adhesive brackets is significantly higher compared to conventionally-pasted and pre-coated groups. The majority of the void was identified to be located at the bonded interfaces (tooth/adhesive and bracket/adhesive) rather than within the bulk of the adhesive for all groups. Our bonding strength results indicate the pre-coated brackets to have the highest bond strength compared to pre-coated flash-free and conventionally-pasted. Our preliminary set of results indicate an inverse relationship between bonding strength and amount of void of brackets adhesives, with the pre-coated exhibiting the highest bond strength and least void. However, due to a limited sample size additional data are needed to validate these conclusions and find solid relationships between adhesive voids and bonding strength.
Temple University--Theses

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Sorgenfrei, Florian [Verfasser]. "Time-Resolved Jitter-Free Experiments at FLASH: From Longitudinal Coherence Studies to Nonlinear Dynamics / Florian Sorgenfrei." München : Verlag Dr. Hut, 2013. http://d-nb.info/1042308047/34.

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Plath, Tim [Verfasser], and Jörg [Akademischer Betreuer] Rossbach. "Measurements and Detailed Analysis of Seeded High-Gain Free-Electron Lasers at FLASH / Tim Plath ; Betreuer: Jörg Rossbach." Hamburg : Staats- und Universitätsbibliothek Hamburg, 2017. http://d-nb.info/1141904993/34.

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Ackermann, Sven [Verfasser], and Jörg [Akademischer Betreuer] Roßbach. "Experimental and numerical investigations on seeding options for the multi-beam line Free-Electron Laser facility FLASH / Sven Ackermann ; Betreuer: Jörg Roßbach." Hamburg : Staats- und Universitätsbibliothek Hamburg, 2017. http://d-nb.info/1124591184/34.

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Books on the topic "Flash-free"

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Education, Ontario Ministry of. MemoryShot: Flash Games, Social Networking, Chat, Free SMS: MemoryShot: Flash Games, Social Networking, Chat, Free SMS. Toronto, Ont: Ministry of Education, 1990.

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Chemistry in microtime: Selected writings on flash photolysis, free radicals, and the excited state. London: Imperial College Press, 1997.

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J, Land E., and Truscott T. G, eds. Excited states and free radicals in biology and medicine: Contributions from flash photolysis and pulse radiolysis. Oxford: Oxford University Press, 1993.

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Prac Parentg/icl Flash Card Free. Egmont Books Ltd, 1998.

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flash 55 PROMOTIONS: 55 FREE Ways to Promote Your CLNC Business. Vickie Milazzo Institute, 2004.

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Pre-Algebra: Over 100 Educational Activity Pages Plus Free Flash Cards. W E L S Board for Parish Education, 2002.

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Reading Comprehension Grade 4: Over 100 Educational Activity Pages Plus Free Flash Cards. Carson-Dellosa Publishing Company, 2002.

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Publishing, Oakwood. Esl Flash Card Sets Includes: Toefl, Top 500 Words And a Free Pocket Dictionary. Oakwood Publishing Company, 2003.

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Reading Comprehension and Skills Grade 3: Over 100 Educational Activity Pages Plus Free Flash Cards. Carson-Dellosa Publishing Company, 2002.

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Book chapters on the topic "Flash-free"

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Rossbach, Joerg. "FLASH: The First Superconducting X-Ray Free-Electron Laser." In Synchrotron Light Sources and Free-Electron Lasers, 323–48. Cham: Springer International Publishing, 2020. http://dx.doi.org/10.1007/978-3-030-23201-6_10.

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Rossbach, Joerg. "FLASH: The First Superconducting X-Ray Free-Electron Laser." In Synchrotron Light Sources and Free-Electron Lasers, 303–28. Cham: Springer International Publishing, 2016. http://dx.doi.org/10.1007/978-3-319-14394-1_10.

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Rossbach, Joerg. "FLASH: The First Superconducting X-Ray Free-Electron Laser." In Synchrotron Light Sources and Free-Electron Lasers, 1–22. Cham: Springer International Publishing, 2015. http://dx.doi.org/10.1007/978-3-319-04507-8_10-2.

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Plönjes, E., and K. Tiedtke. "The Soft X-ray Free-Electron Laser FLASH at DESY." In Springer Series in Optical Sciences, 1–21. Berlin, Heidelberg: Springer Berlin Heidelberg, 2015. http://dx.doi.org/10.1007/978-3-662-47443-3_1.

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Chapman, H. N., S. Bajt, A. Barty, W. H. Benner, M. J. Bogan, S. Boutet, A. Cavalleri, et al. "Ultrafast coherent X-ray diffractive imaging with the FLASH Free-Electron Laser." In Springer Series in Chemical Physics, 143–45. Berlin, Heidelberg: Springer Berlin Heidelberg, 2009. http://dx.doi.org/10.1007/978-3-540-95946-5_47.

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Parravano, A. "Photo-Ionizing Flash as a Trigger for Efficient H2 Cooling in Metal-Free Clouds." In Plasma Physics, 393–97. Dordrecht: Springer Netherlands, 1998. http://dx.doi.org/10.1007/978-94-011-4758-3_41.

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Kim, Nam Hoon, Hae Young Yoo, and Eui Goo Chang. "Dislocation-Free Shallow Trench Isolation (STI) Chemical Mechanical Polishing (CMP) Process for Embedded Flash Memory." In Solid State Phenomena, 29–32. Stafa: Trans Tech Publications Ltd., 2007. http://dx.doi.org/10.4028/3-908451-31-0.29.

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Rossbach, Joerg. "FLASH: The First Superconducting X-Ray FEL." In Synchrotron Light Sources and Free-Electron Lasers, 1–22. Cham: Springer International Publishing, 2014. http://dx.doi.org/10.1007/978-3-319-04507-8_10-1.

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"Flash-Free Welding." In Handbook of Plastics Joining, 127–30. Elsevier, 2009. http://dx.doi.org/10.1016/b978-0-8155-1581-4.50015-9.

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"Free and Open?" In Flash. The MIT Press, 2014. http://dx.doi.org/10.7551/mitpress/9833.003.0008.

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Conference papers on the topic "Flash-free"

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Stasicki, Boleslaw, G. E. A. Meier, and J. Renschke. "Flash-free high-speed video stroboscope." In 22nd Int'l Congress on High-Speed Photography and Photonics, edited by Dennis L. Paisley and ALan M. Frank. SPIE, 1997. http://dx.doi.org/10.1117/12.273432.

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Shepard, Steven M., Yulin Hou, Tasdiq Ahmed, and James R. Lhota. "Reference-free analysis of flash thermography data." In Defense and Security Symposium, edited by Jonathan J. Miles, G. Raymond Peacock, and Kathryn M. Knettel. SPIE, 2006. http://dx.doi.org/10.1117/12.669396.

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Hang-Ting Lue, Erh-Kun. Lai, Y. H. Hsiao, S. P. Hong, M. T. Wu, F. H. Hsu, N. Z. Lien, et al. "A novel junction-free BE-SONOS NAND flash." In 2008 Symposium on VLSI Technology. IEEE, 2008. http://dx.doi.org/10.1109/vlsit.2008.4588594.

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Li, Ruixue, and Huazhou Andy Li. "A Robust Three-Phase Isenthalpic Flash Algorithm Based on Free-Water Assumption." In ASME 2017 36th International Conference on Ocean, Offshore and Arctic Engineering. American Society of Mechanical Engineers, 2017. http://dx.doi.org/10.1115/omae2017-61193.

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Abstract:

Multiphase isenthalpic flash calculations are often required in compositional simulations of steam-based enhanced oil recovery methods. These flash calculations are challenging in the narrow-boiling regions and in the determination of the correct number of existing phases. Based on the free-water assumption that the aqueous phase is pure water, a robust and efficient algorithm is proposed to perform isenthalpic three-phase flash calculations in this work. Multiphase equilibria can be considered by this algorithm, including single-phase equilibria, two-phase equilibria, and three-phase vapor-liquid-aqueous equilibria. Isenthalpic flash is a type of flash calculation conducted at given pressure and enthalpy for a feed mixture. In the proposed algorithm, assuming the feed is stable, the temperature is first determined by solving the energy conservation equation. Then the stability test on the feed mixture is conducted at the calculated temperature and the given pressure. If the mixture is found unstable, the two-phase and three-phase vapor-liquid-aqueous isenthalpic flash calculations can be simultaneously initiated without resorting to stability tests. To achieve simultaneous flashes, the outer loop is used to update the temperature by solving the energy conservation equation. The inner loop is used to obtain phase fractions and compositions by performing a three-phase free-water isothermal flash. Note that a two-phase isothermal flash will be initiated if an open feasible region in the phase fractions appears in any iteration during the three-phase isothermal flash or any of the ultimately calculated phase fractions from the three-phase flash do not belong to [0,1]. Negative flash is allowed in the three-phase free-water isothermal flash. A number of example calculations for water/hydrocarbon mixtures are carried out to test the robustness of the proposed algorithm. At low to medium pressures, a good agreement can be achieved between the results obtained by this algorithm and those obtained by the conventional algorithm. This algorithm performs well for the narrow-boiling regions, for example, the three-phase vapor-liquid-aqueous equilibrium region encountered for the water/hydrocarbon mixtures. During the iteration, the new algorithm can readily handle the appearance and disappearance of phases in the inner loop as temperature updates in the outer loop. The number of stability tests involved in the new algorithm is significantly reduced, helping to boost its computational efficiency.

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Chang, Yu-Ming, Yung-Chun Li, Ping-Hsien Lin, Hsiang-Pang Li, and Yuan-Hao Chang. "Realizing erase-free SLC flash memory with rewritable programming design." In ESWEEK'16: TWELFTH EMBEDDED SYSTEM WEEK. New York, NY, USA: ACM, 2016. http://dx.doi.org/10.1145/2968456.2968462.

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Shirota, Riichiro, Chen-Hao Huang, and Hideki Arakawa. "A new disturb free programming scheme in scaled NAND Flash memory." In 2011 IEEE International Electron Devices Meeting (IEDM). IEEE, 2011. http://dx.doi.org/10.1109/iedm.2011.6131520.

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Coignus, Jean, Alexandre Vernhet, Gilles Reimbold, Giulio Torrente, Sophie Renard, and David Roy. "Relaxation-free characterization of Flash programming dynamics along P-E cycling." In 2015 IEEE International Integrated Reliability Workshop (IIRW). IEEE, 2015. http://dx.doi.org/10.1109/iirw.2015.7437082.

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Zastrau, U., S. M. Vinko, J. S. Wark, S. Toleikis, T. Tschentscher, S. H. Glenzer, R. W. Lee, et al. "Warm dense aluminum plasma generated by the free-electron-laser FLASH." In THE 17TH INTERNATIONAL CONFERENCE ON ATOMIC PROCESSES IN PLASMAS (ICAPIP). AIP, 2012. http://dx.doi.org/10.1063/1.4707856.

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Hsiao, Yi-Hsuan, Hang-Ting Lue, Kuang-Yeu Hsieh, Rich Liu, and Chih-Yuan Lu. "Modeling and scaling evaluation of junction-free charge-trapping NAND flash devices." In 2009 International Symposium on VLSI Technology, Systems, and Applications (VLSI-TSA). IEEE, 2009. http://dx.doi.org/10.1109/vtsa.2009.5159311.

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Ho, Chien-Chung, Yung-Chun Li, Yuan-Hao Chang, and Yu-Ming Chang. "Achieving Defect-Free Multilevel 3D Flash Memories with One-Shot Program Design." In 2018 55th ACM/ESDA/IEEE Design Automation Conference (DAC). IEEE, 2018. http://dx.doi.org/10.1109/dac.2018.8465858.

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