Relevant bibliographies by topics / Flexible multi-layer films

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  1. Journal articles
  2. Dissertations / Theses
  3. Book chapters
  4. Conference papers

Academic literature on the topic 'Flexible multi-layer films'

Author: Grafiati
Published: 3 June 2025
Last updated: 31 July 2025

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Journal articles on the topic "Flexible multi-layer films"

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Tian, Hongxia, Xiong Zhang, Abdullah Alodhayb, Feng Wang, Jie Jian, and Jijie Huang. "Self-Assembled La0.67Sr0.33MnO3:CeO2 Vertically Aligned Nanocomposite Thin Films on Flexible Mica." Crystals 13, no. 11 (2023): 1595. http://dx.doi.org/10.3390/cryst13111595.

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Vertically aligned nanocomposite (VAN) thin film has attracted tremendous research interests owing to its multifunctionality, enhanced physical properties and multi-field coupling. However, VAN has rarely been demonstrated in flexible form, which hinders its further application in flexible devices. In this work, La0.67Sr0.33MnO3-CeO2 (LC) VAN film has been deposited on flexible mica with or without a buffer layer. The LC nanocomposite films show high quality following textured growth and form a typical, vertically aligned nanostructure. Magnetic, transport and magnetoresistance properties have
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Yu, Wen Xiu, Su Jie Qin, Zuo Ping Xiong, Zhong Qiang Ren, Xue Wen Wang, and Ting Zhang. "Controllable Fabrication of Flexible Multi-Walled Carbon Nanotubes/Reduced Graphene Oxide Hybrid Ultrathin Films." Applied Mechanics and Materials 748 (April 2015): 175–78. http://dx.doi.org/10.4028/www.scientific.net/amm.748.175.

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Multi-walled carbon nanotubes/reduced graphene oxide (MWCNT/rGO) hybrid films have attracted increasing massive attention due to their unique advantages such as high conductivity, superior mechanical property and thermal properties. In this work, a novel, facile and low cost method was developed to fabricate the MWCNT/rGO flexible ultrathin hybrid films with the thickness of about 55 nm. These hybrid films can be fabricated repeatedly through layer-by-layer exfoliation on the surface of liquids, and transferred to various substrates. The devices based on MWCNT/rGO hybrid films offer a unique p
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Kim, Seyul, Ahra Cho, Soyeon Kim, et al. "Multi-purpose overcoating layers based on PVA/silane hybrid composites for highly transparent, flexible, and durable AgNW/PEDOT:PSS films." RSC Advances 6, no. 23 (2016): 19280–87. http://dx.doi.org/10.1039/c5ra27311k.

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The highly flexible, transparent, and durable hybrid overcoating layer based on poly(vinyl alcohol) (PVA) and methyltrimethoxysilane (MTMS), that can be used as a multi-purpose protective coating for conducting films.
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Han, Ju-Hwan, Tae-Yeon Kim, Dong-Yeon Kim, Hae Lin Yang, and Jin-Seong Park. "Water vapor and hydrogen gas diffusion barrier characteristics of Al2O3–alucone multi-layer structures for flexible OLED display applications." Dalton Transactions 50, no. 43 (2021): 15841–48. http://dx.doi.org/10.1039/d1dt02989d.

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Al2O3/Alucone multi-layer films fabricated by alternate ALD/MLD process were evaluated for the gas diffusion barrier property for H2O and H2, indicating enhanced tortuosity and flexibility of multi-layer structure.
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Nazanin, Zand, and Jabbari Sharare. "Effect of Modified Atmosphere Packaging and Multilayer Flexible Films on pH of Fresh Quail Meat." Microbiology Research Journal International 20, no. 5 (2017): 1–11. https://doi.org/10.9734/MRJI/2017/29564.

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<strong>Aim: </strong>In this study, the effect of different concentrations of three gas mixture (Carbon dioxide, Nitrogen, Oxygen), and also vacuum and ordinary conditions and using different flexible multi-layer pouches were studied for evaluating pH changes of quail meat at (4°C). <strong>Methodology:</strong> Ordinary conditions (control conditions) were compared with four types of modified atmosphere packaging: (N<sub>2</sub>70%+ CO<sub>2</sub>30%), (N<sub>2</sub>30% + CO<sub>2</sub>70%), (45%CO<sub>2</sub>+45%N<sub>2</sub>+10%O<sub>2</sub>), and vacuum conditions. Samples of quail meat w
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Li, Y., Y. J. Liu, H. T. Dai, X. H. Zhang, D. Luo, and X. W. Sun. "Flexible cholesteric films with super-reflectivity and high stability based on a multi-layer helical structure." J. Mater. Chem. C 5, no. 41 (2017): 10828–33. http://dx.doi.org/10.1039/c7tc03915h.

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The growing demand for flexible low-power reflective photonics and display devices has fueled research into high quality flexible materials with super-reflectivity and high stability to environmental influences including broad working temperature ranges and excellent mechanical stress insensitivity.
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Wang, Guishan, Can Yang, Bowen Liu, Xinlei Zou, and Chengguo Yu. "Sensitive Mechanism and Instability Modeling Methods of Flexible Sensing Films Based on 2D Materials." Crystals 15, no. 2 (2025): 130. https://doi.org/10.3390/cryst15020130.

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This paper examines sensing mechanisms and stability issues of flexible sensors used in morphing wing applications. A key challenge is the lack of theoretical frameworks that accurately predict sensor behavior during complex deformation. Current models struggle to fully capture the relationships between mechanical strain, electrical response, and material properties. We first analyze the microscopic mechanisms and macroscopic sensing characteristics of 2D material-based sensitive films, developing strain-sensitive models based on crack effects and pressure-sensitive models based on slip effect
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Gupta, Vaibhav, John A. Sellers, Charles D. Ellis, et al. "Minimizing Film Stress and Degradation in Thin-Film Niobium Superconducting Cables." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2017, DPC (2017): 1–25. http://dx.doi.org/10.4071/2017dpc-tha3_presentation4.

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The future of superconducting and cryogenic electronic systems can significantly benefit from densely integrated superconducting multi-layer and multi-signal flexible cables due to the massive number of electrical interconnects needed in systems such as superconducting quantum computers and cryogenic detector arrays. In order to maintain superconductivity in niobium (Nb) thin films, film stress and degradation must be minimized. We are working towards configurations with embedded traces, where it is expected that the superconductor material will be subjected to subsequent fabrication steps tha
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Goto, Toichiro, Tetsuhiko F. Teshima, Koji Sakai, and Masumi Yamaguchi. "Three-dimensional self-folding assembly of multi-layer graphene at the interface with a polymeric film." AIP Advances 12, no. 7 (2022): 075002. http://dx.doi.org/10.1063/5.0096473.

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Three-dimensional (3D) architectures of graphene are of great interest for applications in flexible electronics, supercapacitors, and biointerfaces. Here, we demonstrate that multi-layer graphene (MLG), like single-layer graphene (SLG), can self-fold to form 3D architectures at the interface with a polymeric film. Bilayers composed of graphene and polymeric film tightly adhere to each other and possess a sloped internal strain, which leads to spontaneous rolling to predetermined 3D microscale architectures. The curvature radii of self-folding films can be controlled by changing the thicknesses
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Akedo, Kunio, Atsushi Miura, Hisayoshi Fujikawa, and Yasunodi Taga. "Flexible OLEDs for Automobiles using SiNx/CNx:H Multi-layer Barrier Films and Epoxy Substrates." Journal of Photopolymer Science and Technology 19, no. 2 (2006): 203–8. http://dx.doi.org/10.2494/photopolymer.19.203.

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Dissertations / Theses on the topic "Flexible multi-layer films"

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Chuang, Yuh-Suan, and 莊育軒. "Flexible gas sensors fabricated by layer-by-layer self-assembly thin film of multi-walled carbon nanotubes and modified with metal catalyst nanoparticles." Thesis, 2010. http://ndltd.ncl.edu.tw/handle/28940562692038425198.

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碩士<br>中國文化大學<br>應用化學研究所<br>98<br>A novel flexible H2 gas sensor was fabricated by the layer-by-layer (LBL) self-assembly of thin film surface-oxidized multi-walled nanotubes (MWCNTs) on a polyester (PET) substrate. Then, a Pd-based complex was self-assembled in situ on the as-prepared MWCNTs thin film, which was reduced to form an MWCNT-Pd thin film. The thin films were characterized by scanning electron microscopy (SEM) coupled with energy dispersive spectrometry (EDS). The gas sensing properties, such as strength of the response, sensing linearity, reproducibility, response time, recovery ti
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Book chapters on the topic "Flexible multi-layer films"

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Valori, Marcello, Vito Basile, Simone Pio Negri, Paolo Scalmati, Chiara Renghini, and Irene Fassi. "Towards the Automated Coverlay Assembly in FPCB Manufacturing: Concept and Preliminary Tests." In IFIP Advances in Information and Communication Technology. Springer International Publishing, 2021. http://dx.doi.org/10.1007/978-3-030-72632-4_3.

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AbstractIn modern electronics, flexible and rigid-flex PCBs are largely used due to their intrinsic versatility and performance, allowing to increase the available volume, or enabling connection between unconstrained components. Rigid-flex PCBs consists of rigid board portions with flexible interconnections and are commonly used in a wide variety of industrial applications. However, the assembly process of these devices still has some bottlenecks. Specifically, they require the application of cover layers (namely, coverlays), to provide insulation and protection of the flexible circuits. Due t
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Conference papers on the topic "Flexible multi-layer films"

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Pretorius, Louis. "New Application Technology for Internal Pipeline Coatings in Situ Pipeline Protection Using Pigging Techniques." In CORROSION 2006. NACE International, 2006. https://doi.org/10.5006/c2006-06061.

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Abstract Pipe pigging techniques for refurbishment of pipe work have existed for many years. The advantage being considerably reduced costs when compared to the logistics of transporting new pipes to site, trenching, cranage etc. The method can be used for new projects on fully welded pipe lines avoiding internal coating problems associated with flange joints, couplings or welds, or for refurbishment of old pipelines. Pipes varying from 150-900 mm diameter, up to 20 km long can be treated. The pipes or pipelines can be buried, submerged, continuously welded or flanged. Many different pipes, su
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Kim, Byoung-Joon, Hae-A.-Seul Shin, In-Suk Choi, and Young-Chang Joo. "Electrical Failure and Damage Analysis of Multi-Layer Metal Films on Flexible Substrate during Cyclic Bending Deformation." In ISTFA 2011. ASM International, 2011. http://dx.doi.org/10.31399/asm.cp.istfa2011p0001.

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Abstract The electrical resistance Cu film on flexible substrate was investigated in cyclic bending deformation. The electrical resistance of 1 µm thick Cu film on flexible substrate increased up to 120 % after 500,000 cycles in 1.1 % tensile bending strain. Crack and extrusion were observed due to the fatigue damage of metal film. Low bending strain did not cause any damage on metal film but higher bending strain resulted in severe electrical and mechanical damage. Thinner film showed higher fatigue resistance because of the better mechanical property of thin film. Cu film with NiCr under-lay
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Byoung-Joon Kim, Hae-A-Seul Shin, In-Suk Choi, and Young-Chang Joo. "Electrical failure and damage analysis of multi-layer metal films on flexible substrate during cyclic bending deformation." In 2011 18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2011). IEEE, 2011. http://dx.doi.org/10.1109/ipfa.2011.5992725.

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Ueta, Nobuki, Shunsuke Sato, Masakazu Sato, Yoshio Nakao, Joshua Magnuson, and Rocky Ishizuka. "Flexible Circuit Board Package Embedded With Multi-Stack Dies." In 2020 Design of Medical Devices Conference. American Society of Mechanical Engineers, 2020. http://dx.doi.org/10.1115/dmd2020-9032.

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Abstract Miniaturization of electronics modules is always required for various medical applications including wearable technology, such as hearing aids, and implantable devices. Many types of high-density packaging technologies, such as package-on-package, bare-die stack, flex folded package and Through Si Via (TSV) technologies, have been proposed and used to fulfill the request. Among them, embedded die technology is one of the promising technologies to realize miniaturization and high-density packaging. We have developed WABE™ (wafer and board level device embedded) technology for embedding
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Chen, Hsi-Chao, Xin-Ya Zheng, Sheng-Bin Chen, Ming-Ying Wu, and Szu-Hui Lee. "Finite Element Method Analyzes the Residual Stress of HfO2/SiO2 Multi-Layer on Flexible Substrate Evaporated with Ion-beam Assisted Deposition." In Optical Interference Coatings. Optica Publishing Group, 2022. http://dx.doi.org/10.1364/oic.2022.tb.7.

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The four-layer anti-reflection films of HfO2/SiO2 was prepared on flexible substrate by E-gun evaporation with ion-beam assisted deposition. Finite element method combined the shell theory to investigate the residual stress.
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Chen, Sheng-Bin, Hsi-Chao Chen, Chun-Hao Chang, Yu-Ru Lu, and Wei-Lin Chen. "Optical and stress properties of flexible Nb2O5/SiO2 multi layer films deposited by E-gun evaporation with ion-beam assisted deposition." In Optical Technology and Measurement for Industrial Applications Conference, edited by Takeshi Hatsuzawa, Rainer Tutsch, and Toru Yoshizawa. SPIE, 2020. http://dx.doi.org/10.1117/12.2574756.

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Vittoe, Robert L., Tung Ho, Sudhir Shrestha, Mangilal Agarwal, and Kody Varahramyan. "All Solution-Based Fabrication of CIGS Solar Cell." In ASME 2013 International Manufacturing Science and Engineering Conference collocated with the 41st North American Manufacturing Research Conference. American Society of Mechanical Engineers, 2013. http://dx.doi.org/10.1115/msec2013-1239.

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This paper presents fabrication of copper indium gallium di-selenide (CIGS) solar cells using all solution-based deposition processes. CIGS nanoparticles were synthesized through multi-step chemical process using copper chloride, indium chloride, gallium chloride, and selenium in oleyamine. CIGS thin films were constructed through layer-by-layer (LbL) self-assembly and spray-coating techniques. Chemical-bath-deposition and spray-coating methods were used for cadmium sulfide and zinc oxide film depositions, respectively. Initial thin film solar cell devices exhibited promising 0.3 mA short circ
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Kim, Daehyeon, Youngjin Kim, Hyeongrae Kim, Juyeon Kim, Jongmo Kang, and Dongho Oh. "Alignment and Error Analysis to Improve Overlay Accuracy in Roll-to-Roll Screen Printing." In ASME 2023 32nd Conference on Information Storage and Processing Systems. American Society of Mechanical Engineers, 2023. http://dx.doi.org/10.1115/isps2023-109321.

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Abstract Products with printed electronics technology can be easily found around us. It is a technology used in various fields such as RFID, flexible displays, and solar panels. Such products feature multi-layer structures rather than using a single pattern layer for printing. A product with excellent performance can be obtained only when overlay printing is performed well in a multi-layer structure. Therefore, to improve overlay accuracy, the effect of film deformation should be considered and compensated. However, deformation of the film is caused by tension applied to the film or heat durin
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Sakurai, Daisuke, Norihito Tsukahara, Kazuhiro Nishikawa, et al. "Development of Film Module With Embedded Actives." In ASME 2003 International Electronic Packaging Technical Conference and Exhibition. ASMEDC, 2003. http://dx.doi.org/10.1115/ipack2003-35162.

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Since electric products need more effective features in terms of being compact, small, thin and highly performant, a new concept to create the advanced JISSO is required. We have invented the film module manufacturing process, in which the semiconductor is embedded into the thermo-elastic film and wired directly to exposed bumps. In this device, the fundamental process which is the embedded semiconductor into the thermoplastic film PETG, has been developed. This process is essential for the embedded active components film. This technique can be applied to packaging, memory cards, smart cards,
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Lu, Yumin, Marc Madou, William Crumly, and Eric Jensen. "Non-Silicon Mass Production of Micromachined Biosensors." In ASME 2000 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2000. http://dx.doi.org/10.1115/imece2000-1159.

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Abstract Sophisticated integrated circuit processing of silicon materials has been promoted as the optimum methodology for miniaturized mechanical and chemical sensors for over two decades. However, in micro biomedical applications, advantages of using Si are often not as clear as in mechanical sensors. The high cost of Si, difficulties in packaging, need for modularity and biocompatibility all encourage investigation of non-silicon materials and semi-continuous processing. Metal/polymer hybrid structures are preferred as the substrate materials in this application. The two manufacturing techn
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