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Journal articles on the topic 'Flip Chip Ball Grid Array'

Author: Grafiati

Published: 3 June 2025

Last updated: 20 July 2025

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Reddy, Vishnu V. B., Jaimal Williamson, and Suresh K. Sitaraman. "Measurement Capability of Laser Ultrasonic Inspection System for Evaluation of Ball-Grid Array Package Solder Balls." Journal of Microelectronics and Electronic Packaging 18, no. 4 (2021): 183–89. http://dx.doi.org/10.4071/imaps.1501802.

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Abstract Laser ultrasonic inspection is a novel, noncontact, and nondestructive technique to evaluate the quality of solder interconnections in microelectronic packages. In this technique, identification of defects or failures in solder interconnections is performed by comparing the out-of-plane displacement signals, which are produced from the propagation of ultrasonic waves, from a known good reference sample and sample under test. The laboratory-scale dual-fiber array laser ultrasonic inspection system has successfully demonstrated identifying the defects and failures in the solder interconnections in advanced microelectronic packages such as chip-scale packages, plastic ball grid array packages, and flip-chip ball grid array packages. However, the success of any metrology system depends upon precise and accurate data to be useful in the microelectronic industry. This paper has demonstrated the measurement capability of the dual-fiber array laser ultrasonic inspection system using gage repeatability and reproducibility analysis. Industrial flip-chip ball grid array packages have been used for conducting experiments using the laser ultrasonic inspection system and the inspection data are used to perform repeatability and reproducibility analysis. Gage repeatability and reproducibility studies have also been used to choose a known good reference sample for comparing the samples under test.

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Su, Ay, and Yi-Wei Liu. "Thermal analysis of flip chip plastic ball grid array assembly." Heat Transfer?Asian Research 33, no. 6 (2004): 371–82. http://dx.doi.org/10.1002/htj.20026.

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Dudek, Rainer, Ralf Do¨ring, and Bernd Michel. "Reliability Prediction of Area Array Solder Joints." Journal of Electronic Packaging 125, no. 4 (2003): 562–68. http://dx.doi.org/10.1115/1.1604802.

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Packages for high pin counts using the ball grid array technology or its miniaturized version, the chip scale package, inherently require reliability concepts as an integral part of their development. This is especially true for the latter packages, if they are combined with the flip chip technology. Accordingly, thermal fatigue of the solder balls is frequently investigated by means of the finite element method. Various modeling assumptions and simplifications are common to restrict the calculation effort. Some of them, like geometric modeling assumptions, assumptions concerning the homogeneity of the cyclic temperature fields, simplified creep characterization of solder, and the related application of Manson-Coffin failure criteria, are discussed in the paper. The packages chosen for detailed analyses are a PBGA 272 and a FC-CSP 230.

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Arnold, Joelle, Steph Gulbrandsen, and Nathan Blattau. "Impact of Reprocessing Technique on First Level Interconnects of Pb-Free to SnPb Reballed Area Array Flip Chip Devices." International Symposium on Microelectronics 2014, no. 1 (2014): 000112–16. http://dx.doi.org/10.4071/isom-ta43.

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The risk of damage caused by reballing SnPb eutectic solder balls onto a commercial off-the-shelf (COTS) active flip chip with a ball grid array (BGA) of SAC305 was studied. The effects of reballing performed by five different reballers were examined and compared. The active flip chip device selected included manufacturer specified resistance between eight (8) differential port pairs. The path resistance between these pins following reballing, as compared to an unreballed device, was used to assess damage accumulation in the package. 2-dimensional x-ray microscopy, acoustic microscopy, and x-ray computer tomography were also used to characterize the effects of reballing. These studies indicated that no measureable damage was incurred by the reballing process, implying that reballed devices should function as well as non-reballed devices in the same application.

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Yuan, Guo Zheng, Xia Chen, and Xue Feng Shu. "Failure Analysis of the Solder Joints in Flip-Chip BGA Packages under Free-Drop Test." Advanced Materials Research 936 (June 2014): 628–32. http://dx.doi.org/10.4028/www.scientific.net/amr.936.628.

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The failure of plastic ball grid array under intense dynamic loading was studied in the project. This paper presents the drop test reliability results of SnPb flip-chip on a standard JEDEC drop reliability test board. The failure mode and mechanism of planar array package in the drop test was comprehensively analyzed. High acceleration dropping test method was used to research the reliability of BGA (ball grid array) packages during the free-drop impact process. The model RS-DP-03A drop device was used to simulate the falling behavior of BGA chip packages under the real conditions, The drop condition meets the JEDEC22-B111 standards (pulse peak 1500g, pulse duration 0.5 ms) when dropping from the 650mm height . In the testing, according to the real-time changes of dynamic voltage, the relationship between drop times and different phases of package failure was analyzed. With the dye-penetrated method and optical microscopy, it was easy to observe the internal crack and failure locations. The growth mechanism of the cracks in solder joints under the condition of drop-free was analyzed and discussed.

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Ramakrishna, K., and T. Y. Tom Lee. "Evaluation of Thermal Enhancements to Flip-Chip-Plastic Ball Grid Array Packages." Journal of Electronic Packaging 126, no. 4 (2004): 449–56. http://dx.doi.org/10.1115/1.1827260.

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Enhancements to thermal performance of FC-PBGA packages due to underfill thermal conductivity, controlled collapse chip connection (C4) pitch, package to printed wiring board (PWB) interconnection through thermal balls, a heat spreader on the backside of the die, and an overmolded die with and without a heat spreader have been studied by solving a conjugate heat transfer problem. These enhancements have been investigated under natural and forced convection conditions for freestream velocities up to 2 m/s. The following ranges of parameters have been covered in this study: substrate size: 25–35 mm, die size: 6.19×7.81 mm (48 mm2 area) and 9.13×12.95 mm (118 mm2 area), underfill thermal conductivity: 0.6–3.0 W/(m K), C4 pitch: 250 μm and below, no thermal balls to 9×9 array of thermal balls on 1.27 mm square pitch, and with copper heat spreader on the back of a bare and an overmolded die. Based on our previous work, predictions in this study are expected to be within ±10% of measured data. The conclusions of the study are: (i) Thermal conductivity of the underfill in the range 0.6 to 10 W/(m K) has negligible effect on thermal performance of FC-PBGA packages investigated here. (ii) Thermal resistances decrease 12–15% as C4 pitch decreases below 250 μm. This enhancement is smaller with increase in die area. (iii) Thermal balls connected to the PTHs in the PWB decrease thermal resistance of the package by 10–15% with 9×9 array of thermal balls and PTHs compared to no thermal balls. The effect of die size on this enhancement is more noticeable on junction to board thermal resistance, Ψjb, than the other two package thermal metrics. (iv) Heat spreader on the back of the die decreases junction-to-ambient thermal resistance, Θja, by 6% in natural convection and by 25% in forced convection. (v) An overmolded die with a heat spreader provides better a thermal enhancement than a heat spreader on a bare die for freestream velocities up to about 1 m/s. Beyond 1 m/s, a heat spreader on bare die has better thermal performance.

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Hung, Hao-Hsi, Yu-Chi Cheng, Sheng-Jye Hwang, et al. "Effect of flip-chip ball grid array structure on capillary underfill flow." Results in Engineering 23 (September 2024): 102527. http://dx.doi.org/10.1016/j.rineng.2024.102527.

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Kandasamy, Ravi, and A. S. Mujumdar. "Thermal analysis of a flip chip ceramic ball grid array (CBGA) package." Microelectronics Reliability 48, no. 2 (2008): 261–73. http://dx.doi.org/10.1016/j.microrel.2007.05.005.

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Jen, Ming-Hwa R., Lee-Cheng Liu, and Jenq-Dah Wu. "Flip-Chip Ball Grid Array Lead-Free Solder Joint Under Reliability Test." Journal of Electronic Packaging 127, no. 4 (2005): 446–51. http://dx.doi.org/10.1115/1.2070090.

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The work is aimed to investigate the mechanical responses of bare dies of the combination of pure tin∕Al–NiV–Cu Under bump metallization (UBM) and packages of pure tin∕Al–NiV–Cu UBM/substrate of standard thickness of aurum. The mechanical properties under multiple reflow and long term high temperature storage test (HTST) tests at different temperatures and the operational life were obtained. A scanning electron microscope was used to observe the growth of IMC and the failure modes in order to realize their reaction and connection. From the empirical results of bare dies, the delamination between IMC and die was observed due to the tests at 260 °C multiple reflow. However, their mechanical properties were not affected. Nevertheless, the bump shear strength of bare dies were decreased by HTST tests. In package, all the results of mechanical properties by multiple reflow test and HTST test were significantly lowered. It was shown that the adhesion between bump and die reduced obviously as tests going on. As for high temperature operational life test in the conditions of 150 °C and 320 mA (5040A∕cm2), the average stable service time of the package was 892 h, and the average ultimate service time of the package was 1053 h.

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Bachman, Mark A., Jerry Liao, John Osenbach, Zafer Kutlu, Jaeyun Gim, and Danny Brady. "Large Die Size Lead Free Flip Chip Ball Grid Array Packaging Considerations for 40nm Fab Technology." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, DPC (2012): 000570–85. http://dx.doi.org/10.4071/2012dpc-ta23.

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To reduce the RC latency, leading edge silicon nodes employ porous SiO2 dielectrics in the interconnect stack. Introduction of porosity lowers the dielectric constant, k, but also significantly decreases both the elastic modulus and fracture toughness of the dielectric. As such, devices manufactured in silicon processes that use low K (90nm, 65nm, and 55nm) and even more so extremely low K ( 45nm, 40nm, and 28nm) interlayer dielectrics are substantially more prone to fracture as a result of package induced stresses than non porous higher K dielectrics. Since the package stresses scale with die size and package body size and inversely with bump pitch, manufacture of large die and package size flip chip devices made with extremely low K dielectrics has proven to be challenging. The stress challenge is further exacerbated by the RoHS requirements for lead free packaging which requires higher process temperatures and somewhat higher yield point solders. The combination of increased stress and reduced mechanical robustness of porous dielectrics has lead to significant reliability and assembly yield issues that have in some cases slowed the introduction of 45nm and 40nm large die lead free flip chip into the market. The work summarized in this paper shows that devices designed to withstand stresses in combination with appropriate assembly processes and bill of materials, yield highly reliable, lead free flip chip packaged devices, with die sizes greater than 400mm2 and package sizes greater than 42.5mm on a side in commercial assembly production lines.

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Kornain, Zainudin, Azman Jalar, Rozaidi Rashid, and Shahrum Abdullah. "An Optimization of Two-Steps Curing Profile to Eliminate Voids Formation in Underfill Epoxy for Hi-CTE Flip Chip Packaging." Advanced Materials Research 97-101 (March 2010): 23–27. http://dx.doi.org/10.4028/www.scientific.net/amr.97-101.23.

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Underfilling is the preferred process to reduce the impact of the thermal stress that results from the mismatch in the coefficient of thermal expansion (CTE) between the silicon chip and the substrate in Flip Chip Packaging. Voids formation in underfill is considered as failure in flip chip manufacturing process. Voids formation possibly caused by several factors such as poor soldering and flux residue during die attach process, voids entrapment due moisture contamination, dispense pattern process and setting up the curing process. This paper presents the optimization of two steps curing profile in order to reduce voids formation in underfill for Hi-CTE Flip Chip Ceramic Ball Grid Array Package (FC-CBGA). A C-Mode Scanning Aqoustic Microscopy (C-SAM) was used to scan the total count of voids after curing process. Statistic analysis was conducted to analyze the suitable curing profile in order to minimize or eliminate the voids formation. It was shown that the two steps curing profile provided solution for void elimination.

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Whitchurch, Nathan, Glenn Rinne, Wei Lin, and Devarajan Balaraman. "Direct Measurement of Silicon Strain in a Fine Pitch Flip Chip BGA Package." International Symposium on Microelectronics 2017, no. 1 (2017): 000176–81. http://dx.doi.org/10.4071/isom-2017-wa14_097.

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Abstract A method for directly measuring the silicon strain in a flip chip ball grid array (FCBGA) package is disclosed. The method uses anisotropically etched holes in the die backside to reveal fiducial crosses on the front side of the die. A geometric model is proposed that allows extraction of the strain component of the measured displacement. A finite element model is described which correctly predicts the sign and magnitude of the strain.

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Ricky Lee, Shi‐Wei, and John H. Lau. "Solder joint reliability of plastic ball grid array with solder bumped flip chip." Soldering & Surface Mount Technology 12, no. 2 (2000): 16–23. http://dx.doi.org/10.1108/09540910010312401.

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Jen, Yi-Ming, Hsi Hsin Chien, Tsung-Shu Lin, and Shih Hsiang Huang. "Effect of Lid Materials on the Solder Ball Reliability of Thermally Enhanced Flip-Chip Plastic Ball Grid Array Packages." Key Engineering Materials 306-308 (March 2006): 1043–48. http://dx.doi.org/10.4028/www.scientific.net/kem.306-308.1043.

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This research studied the thermal fatigue life for eutectic solder balls of thermally enhanced flip-chip plastic ball grid array (FC-PBGA) packages with different lid materials under thermal cycling tests. Three FC-PBGA packages with different lid materials, i.e., Al, AlSiC, and Cu, were utilized to examine the lid material effect on solder ball reliability. The cyclic stress/strain behavior for the packages was estimated by using the nonlinear finite element method. The eutectic solder was assumed to be elastic-plastic-creep. The stable stress/strain results obtained from FEM analysis were utilized to predict the thermal fatigue life of solder balls by using the Coffin-Manson prediction model. Simulation results showed that the fatigue life of the FC-PBGA package with a Cu lid was much shorter than FC-PBGA packages with other lid materials. The relatively shorter fatigue life for the FC-PBGA package with a Cu lid was due to the complex constrained behavior caused by the thermal mismatch between the lid, substrate and the printed circuit board. The difference was insignificant in the fatigue lives between the package with an Al lid and the conventional package.

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Bagetti Jeronimo, Mateus, Jens Schindele, Hubert Straub, Przemyslaw Jakub Gromala, Bernhard Wunderle, and André Zimmermann. "On the influence of lid materials for flip-chip ball grid array package applications." Microelectronics Reliability 140 (January 2023): 114869. http://dx.doi.org/10.1016/j.microrel.2022.114869.

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Boon Kar, Yap, Noor Azrina Talik, Zaliman Sauli, Jean Siow Fei, and Vithyacharan Retnasamy. "Finite element analysis of thermal distributions of solder ball in flip chip ball grid array using ABAQUS." Microelectronics International 30, no. 1 (2013): 14–18. http://dx.doi.org/10.1108/13565361311298187.

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Cheng, Hung-Hsiang, Cheng-Yu Wu, Hung-Chun Kuo, et al. "Alternative FCBGA Package Solution Evaluation: High-speed Design Optimization and Electrical Characterization of FOBGA." International Symposium on Microelectronics 2021, no. 1 (2021): 000119–23. http://dx.doi.org/10.4071/1085-8024-2021.1.000119.

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Abstract There are 2 potentially alternative package solutions proposed to replace Flip-Chip Ball Grid Array (FCBGA) with Ajinomoto build-up film (ABF) substrate. First one is ABF-free solution, Flip-Chip Scale Packages (FCCSP) with laminate-based prepreg material. FCCSP is a mature package solution, and there are various prepreg materials which can be selected to match the original ABF characterization. The focused FCBGA size for FCCSP is from 10 mm x 10 mm to 21 mm x 21 mm, and substrate layer count from 1+2+1L to 2+2+2L. The applications cover memory controllers, Wi-Fi processors, and DTV SoCs. The other package solution is Fan-out Ball Grid Array (FOBGA) which is targeting larger FCBGA with high ABF layer count. The focused maximum package size and layer count of FCBGA are 55 mm x 55 mm and 6+2+6L individually. The potential applications are CPUs, AI accelerators, and networking switches which require extremely high electrical performance. The design concept of FOBGA is to redistribute signal bump locations on FO die, and make an ABF substrate layer accommodate more I/O signals to further reduce the layer count of the ABF substrate. The package signal integrity (SI) and power integrity (PI) analyses are performed to validate the electrical performance of proposed package solutions. Finally, we come out with design guidelines of FOBGA to mitigate the performance degradation due to substrate layer reduction.

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Kornain, Zainudin, Azman Jalar, Rozaidi Rashid, and Shahrum Abdullah. "The Study of Underfill Epoxy Hardness in Reducing Curing Process Time for Flip Chip Packaging." Key Engineering Materials 462-463 (January 2011): 1194–99. http://dx.doi.org/10.4028/www.scientific.net/kem.462-463.1194.

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Underfilling is the vital process to reduce the impact of the thermal stress that results from the mismatch in the co-efficient of thermal expansion (CTE) between the silicon chip and the substrate in Flip Chip Packaging. This paper reported the pattern of underfill’s hardness during curing process for large die Ceramic Flip Chip Ball Grid Array (FC-CBGA). A commercial amine based underfill epoxy was dispensed into HiCTE FC-CBGA and cured in curing oven under a new method of two-step curing profile. Nano-identation test was employed to investigate the hardness of underfill epoxy during curing steps. The result has shown the almost similar hardness of fillet area and centre of the package after cured which presented uniformity of curing states. The total curing time/cycle in production was potentially reduced due to no significant different of hardness after 60 min and 120 min during the period of second hold temperature.

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Wang, Tong Hong, Yi-Shao Lai, and Jenq-Dah Wu. "Effect of Underfill Thermomechanical Properties on Thermal Cycling Fatigue Reliability of Flip-Chip Ball Grid Array." Journal of Electronic Packaging 126, no. 4 (2004): 560–64. http://dx.doi.org/10.1115/1.1827271.

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Plane two-dimensional finite element analysis was applied to study the effect of underfill thermomechanical properties on the potential of thermal fatigue failure for flip-chip ball grid array. Two-stage as well as constant thermomechanical properties of underfills were manipulated to represent extremes of practical underfills. The steady-state creep model was incorporated for the eutectic solder bump to represent its real behavior. It was found from the parametric studies that the underfill with high Young’s modulus, low coefficient of thermal expansion, and high glass transition temperature leads to the longest service life.

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Goldmann, Lewis S. "A Model for Deformation of Solder Bumps From Ramp Loading." Journal of Electronic Packaging 118, no. 1 (1996): 37–40. http://dx.doi.org/10.1115/1.2792125.

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A simple model is presented to predict the mechanical squashing or stretching of an axisymmetric solder joint when subjected to a ramp loading. This is a situation which can frequently arise, accidentally or by design, in the processing of flip chip solder bumps, or in surface mounted Ball Grid Array modules. Excessive squashing can have ramifications for subsequent processing or for joint reliability. The proposed method, while involving an extremely simple algorithm, has been found to agree well with experimental data, and is very general in its applicability.

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Leung, Dennis, and Guna Selvaduray. "Effect of Design Factors on Microvia Reliability of Flip Chip Ball Grid Array Polymeric Substrates." Journal of Microelectronics and Electronic Packaging 5, no. 3 (2008): 104–15. http://dx.doi.org/10.4071/1551-4897-5.3.104.

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Microvia failures in flip chip ball grid array (FCBGA) polymeric substrates have been a major concern in the development of reliable packages for high-performance and high-density chips. To determine the relationship between reliability and design factors of the microvias, a 10-layer substrate was used to investigate these contrasting design factors: “stack-on-core” vs. “non–stack-on-core,” “high” vs. “low” aspect ratio, “stacked” vs. “staggered,” and “fillet” vs. “non-fillet.” Temperature cycling was used to generate stresses on the microvias. Electrical resistance was measured and analyzed, using design of experiment (DOE), to determine the effects of these design factors on microvia reliability. The significant single factors for a robust microvia were “non–stack-on-core” and “staggered.” Cross-sectioning was employed to understand the failure pattern. Cracks occurred on “stack-on-core” and “stacked” designs only. All the cracks were located at the interface between the capture pad and the bottom of the microvia, where stress is the highest due to the CTE mismatch of different materials.

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Kpobie, W., N. Bonfoh, C. Dreistadt, M. Fendler, and P. Lipinski. "Three-Dimensional Thermomechanical Simulation of Fine-Pitch High-Count Ball Grid Array Flip-Chip Assemblies." Journal of Electronic Materials 43, no. 3 (2013): 671–84. http://dx.doi.org/10.1007/s11664-013-2669-x.

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Jie-Hua Zhao. "A probabilistic mechanics approach to die cracking prediction in flip-chip ball grid array package." IEEE Transactions on Components and Packaging Technologies 28, no. 3 (2005): 390–96. http://dx.doi.org/10.1109/tcapt.2005.853590.

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Thrasher, Bradley A., William E. McKinzie, Deepukumar M. Nair, et al. "A 10 MHz to 80 GHz BGA Transition from Chip to LTCC Interposer for Chip Scale Packages." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2015, CICMT (2015): 000067–72. http://dx.doi.org/10.4071/cicmt-tp14.

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Presented here are the design, fabrication, and measurement results of a low temperature cofired ceramic (LTCC) chip-to-interposer transition utilizing a flip-chip ball grid array (BGA) interconnect that provides excellent electrical performance up to and including 80 GHz. A test board fabricated in LTCC is used as the interposer substrate and another smaller LTCC part is used as a surrogate chip for demonstration purposes. The BGA chip-to-interposer transition is designed as a back-to-back pair of transitions with an assembly consisting of an LTCC interposer, an LTCC test chip, and a BGA interconnect constructed with 260 μm diameter polymer core solder balls. The LTCC material employed is DuPont™ GreenTape™ 9K7. Full-wave simulation results predict excellent electrical performance from 10 MHz to 80 GHz, with the chip-to-interposer BGA transition having less than 0.5 dB insertion loss at 60 GHz and less than 1 dB insertion loss up to 80 GHz. In an assembled package (back-to-back BGA transitions), the insertion loss was measured to be 1 dB per transition at 60 GHz and less than 2 dB per transition for all frequencies up to 80 GHz.

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Choi, Hyun-Seok, Jeong-Hyun Park, and Jong-Hee Lee. "The Effect of Porosity on the Thermal Conductivity of Highly Thermally Conductive Adhesives for Advanced Semiconductor Packages." Polymers 15, no. 14 (2023): 3083. http://dx.doi.org/10.3390/polym15143083.

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This study suggests promising candidates as highly thermally conductive adhesives for advanced semiconductor packaging processes such as flip chip ball grid array (fcBGA), flip chip chip scale package (fcCSP), and package on package (PoP). To achieve an extremely high thermal conductivity (TC) of thermally conductive adhesives of around 10 Wm−1K−1, several technical methods have been tried. However, there are few ways to achieve such a high TC value except by using spherical aluminum nitride (AlN) and 99.99% purified aluminum oxide (Al2O3) fillers. Herein, by adapting highly sophisticated blending and dispersion techniques with spherical AlN fillers, the highest TC of 9.83 Wm−1K−1 was achieved. However, there were big differences between theoretically calculated TCs that were based on the conventional Bruggeman asymmetric model and experimentally measured TCs due to the presence of voids or pores in the composites. To narrow the gaps between these two TC values, this study also suggests a new experimental model that contains the porosity effect on the effective TC of composites in high filler loading ranges over 80 vol%, which modifies the conventional Bruggeman asymmetric model.

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Chen, C. I., S. C. Wu, D. S. Liu, C. Y. Ni, and T. D. Yuan. "Global-to-Local Modeling and Experiment Investigation of HFCBGA Package Board-Level Solder Joint Reliability." Journal of Microelectronics and Electronic Packaging 4, no. 4 (2007): 186–94. http://dx.doi.org/10.4071/1551-4897-4.4.186.

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Due to the high speed and high I/O count requirements for semiconductor packages, thousands of soldered interconnections are indispensable, and this situation renders traditional finite element method (FEM) analysis a formidable challenge. This paper presents a 3D-equivalent global model and local submodeling technique to investigate board-level solder joint reliability under cyclic temperature loading. The equivalent global model is capable of addressing critical solder failure locations. An individual local solder ball is used to predict the number of cycles to failure. The high performance flip-chip ball grid array (HFCBGA) package case was studied with the provided experimental data. According to FEM results, the predicted solder ball life is close to that observed experimentally. Therefore, the global-to-local modeling technique can be concluded to provide an efficient methodology for evaluating very high pin count HFCBGA package reliability.

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Jalar, A., Zainudin Kornain, Rozaidi Rasid, Saifollah Abdullah, and Norinsan Kamil Othman. "The Effect of Underfill Fillet Geometry to Die Edge Stress for Flip Chip Packaging." Advanced Materials Research 148-149 (October 2010): 1108–11. http://dx.doi.org/10.4028/www.scientific.net/amr.148-149.1108.

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The possible source of die edge cracking for Flip Chip Ceramic Ball Grid Array (FC-CBGA) package due to thermal cycling have been investigated in this study. Finite Element Analysis (FEA) models were used to analyze the effect of underfill fillet geometry on interfacial stresses between die edge and the underfill fillet. The input parameters of FC-CBGA from industry was used for simulation and the properties of commercial underfill were extracted by using Thermal Mechanical Analyzer (TMA) and Dynamic Mechanical Analyzer (DMA). Die stress distribution for different fillet height were generated to depict variation of stress due thermal loading. The variation of tensile stress due different fillet height and width were discussed for parameters optimization.

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Chiang, Kuo-Ning, and Chang-Ming Liu. "A Comparison of Thermal Stress/Strain Behavior of Elliptical/Round Solder Pads." Journal of Electronic Packaging 123, no. 2 (1999): 127–31. http://dx.doi.org/10.1115/1.1339196.

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As electronic packaging technology moving to the CSP, wafer level packaging, fine pitch BGA (ball grid array) and high density interconnections, the wireability of the PCB/substrate and soldering technology are as important as reliability issues. In this work, a comparison of elliptical/round pads of area array type packages has been studied for soldering, reliability, and wireability requirements. The objective of this research is to develop numerical models for predicting reflow shapes of solder joint under elliptical/round pad boundary conditions and to study the reliability issue of the solder joint. In addition, a three-dimensional solder liquid formation model is developed for predicting the geometry, the restoring force, the wireability, and the reliability of solder joints in an area array type interconnections (e.g., ball grid array, flip chip) under elliptical and round pad configurations. In general, the reliability of the solder joints is highly dependent on the thermal-mechanical behaviors of the solder and the geometry configuration of the solder ball. These reliability factors include standoff height/contact angle of the solder joint, and the geometry layout/material properties of the package. An optimized solder pad design cannot only lead to a good reliability life of the solder joint but also can achieve a better wireability of the substrate. Furthermore, the solder reflow simulation used in this study is based on an energy minimization engine called Surface Evolver and the finite element software ABAQUS is used for thermal stress/strain nonlinear analysis.

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Xu, Yu Wen, Liang Jun Liu, and Kun Jia. "Preparation and Performance Study of Thermally Conductive Silicone Adhesive Applying in Flip Chip Ball Grid Array." Key Engineering Materials 994 (November 5, 2024): 47–54. http://dx.doi.org/10.4028/p-t10ife.

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A thermally conductive silicone adhesive UB-5715 was prepared using vinyl silicone oil of medium viscosity, hydrogen-containing silicone oil and micron alumina powder. The results revealed that UB-5715 demonstrated superior thermal and mechanical properties. Specifically, its thermal decomposition temperature exceeded 400 °C, the thermal conductivity coefficient surpassed 1.80 W/m·K, the thermal resistance was under 12.0 °C·cm2/W, the shear strength reached achieved was over 5.00 MPa. Meanwhile, after being subjected to uHAST for 384 hours, thermal cycle for 1000 times and heat aging for 1000 hours respectively, UB-5715 still maintained its high thermal conductivity coefficient and mechanical properties. The thermal conductivity coefficient still exceeded 1.70 W/m·K, shear strength still surpassed 5.00 MPa, the tensile modulus remained below 100 MPa, the linear expansion coefficient was less than 160 ppm/°C, and its comprehensive performance met the reliability requirements for advanced packaging process substrates and heat dissipation cover assemblies.

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Hsieh, Ming-Che, Chien Chen Lee, and Li Chiun Hung. "Comprehensive Thermo-Mechanical Stress Analyses and Underfill Selection of Large Die Flip Chip Ball Grid Array." IEEE Transactions on Components, Packaging and Manufacturing Technology 3, no. 7 (2013): 1155–62. http://dx.doi.org/10.1109/tcpmt.2012.2232712.

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Zhang, H. Y., D. Pinjala, T. N. Wong, and Y. K. Joshi. "Development of liquid cooling techniques for flip chip ball grid array packages with High Heat flux dissipations." IEEE Transactions on Components and Packaging Technologies 28, no. 1 (2005): 127–35. http://dx.doi.org/10.1109/tcapt.2004.843164.

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Kim, D. H., and J. Joo. "Deformation behaviors of flip chip plastic ball grid array packages subjected to temperature change using moiré interferometry." Materialwissenschaft und Werkstofftechnik 54, no. 4 (2023): 391–400. http://dx.doi.org/10.1002/mawe.202300008.

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Su, F., W. J. Li, T. B. Lan, and W. Shang. "Investigation on Hygro-Thermo-Mechanical Stress of a Plastic Electronic Package." Journal of Mechanics 30, no. 6 (2014): 625–30. http://dx.doi.org/10.1017/jmech.2014.52.

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AbstractPlastic packaging materials tend to absorb moisture from ambient environment and get swollen, this may raise hygro-stress in plastic electronic package and redistribute the internal stress. In this paper, we reviewed the dramatic deformation of a plastic package (Flip Chip Plastic Ball Grid Array-FCPBGA) due to moisture absorption first, then hygro-thermo-mechanical stress of the plastic package and its evolution during a period of three months were investigated with finite element method, user development was performed for this investigation. The finite element model was verified with hygro-thermal deformation of the FCPBGA measured with a 3-D moiré interferometry system. Following findings were obtained: A. Thermal stress field was changed a lot due to moisture absorption; B. Thermal stress of chip was released to some extent, but peal stress up to 62.2MPa occurred to the solder bump, thus the danger of Under Bump Metal (UBM) opening increased.

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Vanam, Kiran, Anthony Newman, Mori Poustinchi, and Stephen Stewart. "Quality Monitors and Inspection Criteria for Bare Die Flip Chip Ball Grid Array and Bare Die PoP Packages." International Symposium on Microelectronics 2014, no. 1 (2014): 000533–36. http://dx.doi.org/10.4071/isom-wa61.

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Package form factor and cost are one of the key drivers in smart phone and tablet landscape. In order to meet these requirements hand held market has seen emergence of bare die flip chip ball grid array (BD FCBGA) and bare die package on package (BD PoP). As the name implies, these packages don't have a mold cap or heat spreader surrounding the silicon die resulting in lower cost and smaller form factor. Further package thickness reduction is possible by thinning of silicon die without significantly affecting high temperature (HT) warpage or coplanarity. One of the main concerns with aforementioned bare die package (BDP) configurations is die crack failure during assembly, testing, shipping or surface mount operation (SMT). The propensity of die crack failures further increases as thinner die is employed to meet overall package height requirements. This work focusses on evaluating various inspection tools for detecting gross die cracks to fine line cracks up to ~ 0.7 μm wide. Some of the key considerations for inspection tools, at assembly and test operations will be presented.

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Kornain, Zainudin, A. Jalar, Rozaidi Rasid, C. S. Foong, and T. L. Wong. "Estimation of Curing Profile's Parameters for Flip Chip Packaging Using DSC and TGA." Key Engineering Materials 467-469 (February 2011): 950–55. http://dx.doi.org/10.4028/www.scientific.net/kem.467-469.950.

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This paper presents the method to estimate curing profile's parameters for curing process of Moisture Resistance Cyanate Ester (MRCE) based underfill used in Flip Chip Ceramic Ball Grid Array (FC-CBGA). The two steps curing profile was found to eliminate voids formation in underfill during curing process. The important parameters in two steps curing profile such as first fixed temperature and duration of second temperature rise were estimated by superimposed of cure initiation curve and weight percentage loss curve of underfill epoxy material. Differential Scanning Calorimeter (DSC) analysis was carried out to characterize the cure kinetics reaction of underfill epoxy and produced the cure initiation curve. Thermal Gravimetric Analysis (TGA) was performed to characterize the weight loss of underfill and produced the weight loss curve. It was estimated that the first fixed temperature and duration of second temperature rise for two steps curing profile were 100 oC and 60-80 minutes respectively. The simulation experiment was conducted to verify the profile and no voids formation observed along this curing process.

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Azid, Ishak Abdul, Lee Kor Oon, Ong Kang Eu, K. N. Seetharamu, and Ghulam Abdul Quadir. "Application of Artificial Neural Network for Fatigue Life Prediction." Key Engineering Materials 297-300 (November 2005): 96–101. http://dx.doi.org/10.4028/www.scientific.net/kem.297-300.96.

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An extensively published and correlated solder joint fatigue life prediction methodology is incorporated by which finite element simulation results are translated into estimated cycles to failure. This study discusses the analysis methodologies as implemented in the ANSYSTM finite element simulation software tool. Finite element models are used to study the effect of temperature cycles on the solder joints of a flip chip ball grid array package. Through finite element simulation, the plastic work or the strain-energy density of the solder joints are determined. Using an established methodology, the plastic work obtained through simulation is translated into solder joint fatigue life [1]. The corresponding results for the solder joint fatigue life are used for parametric studies. Artificial Neural Network (ANN) has been used to consolidate the parametric studies.

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Kornain. "Comparative Study of Different Underfill Material on Flip Chip Ceramic Ball Grid Array Based on Accelerated Thermal Cycling." American Journal of Engineering and Applied Sciences 3, no. 1 (2010): 83–89. http://dx.doi.org/10.3844/ajeassp.2010.83.89.

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Suhir, Ephraim, and Reza Ghaffarian. "Flip-Chip (FC) and Fine-Pitch-Ball-Grid-Array (FPBGA) Underfills for Application in Aerospace Electronics—Brief Review." Aerospace 5, no. 3 (2018): 74. http://dx.doi.org/10.3390/aerospace5030074.

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Ho, Cheng-Yu, Hung-Hsiang Cheng, Po-Chih Pan, Chen-Chao Wang, and Chih-Pin Hung. "A Novel Channel Characteristics Estimation Methodology for High-Speed SerDes Interface on Flip-Chip Ball Grid Array Packages." IEEE Transactions on Components, Packaging and Manufacturing Technology 5, no. 12 (2015): 1784–92. http://dx.doi.org/10.1109/tcpmt.2015.2478480.

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Lu, Hua, Rasha Hussain, Ming Zhou, and Xijia Gu. "Fiber Bragg Grating Sensors for Failure Detection of Flip Chip Ball Grid Array in Four-Point Bend Tests." IEEE Sensors Journal 9, no. 4 (2009): 457–63. http://dx.doi.org/10.1109/jsen.2009.2014419.

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Lau, J. H. "Solder joint reliability of flip chip and plastic ball grid array assemblies under thermal, mechanical, and vibrational conditions." IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B 19, no. 4 (1996): 728–35. http://dx.doi.org/10.1109/96.544363.

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Shidore, S., V. Adams, and T. T. Lee. "A study of compact thermal model topologies in CFD for a flip chip plastic ball grid array package." IEEE Transactions on Components and Packaging Technologies 24, no. 2 (2001): 191–98. http://dx.doi.org/10.1109/6144.926382.

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Kim, J. Y., and J. S. Yoon. "Image Distortion Compensation by Using a Polynomial Model in an X-Ray Digital Tomosynthesis System." Key Engineering Materials 297-300 (November 2005): 2034–39. http://dx.doi.org/10.4028/www.scientific.net/kem.297-300.2034.

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X-ray technology has been widely used in a number of industrial applications for monitoring and inspecting inner defects which can hardly be found by normal vision systems as a ball grid array (BGA) or a flip chip array (FCA). Digital tomosynthesis (DT) is one of the most useful X-ray cross-sectional imaging methods for PCB inspection, and it usually uses an X-ray image intensifier. However, the image intensifier distorts X-ray images severely both of shape and intensity. This distortion breaks the correspondences between those images and prevents us from acquiring accurate cross-section images. Therefore, image distortion compensation is one of the most important issues in realizing a DT system. In this paper, an image distortion compensation method for an X-ray DT system is presented. It is to use a general distortion polynomial model on two dimensional plane that can cope with arbitrary, complex and various forms of distortion. Experimental results show a great improvement in compensation speed and accuracy.

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Aguirre, Jerry, Paul Garland, Marcos Vargas, Heather Tallo, and Joseph Tallo. "Comparison Between Multilayer Ceramic and Organic Package Substrates Based Upon Signal and Power Integrity." International Symposium on Microelectronics 2011, no. 1 (2011): 000905–13. http://dx.doi.org/10.4071/isom-2011-tha1-paper6.

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Comparisons between organic and ceramic packaging is a difficult task given the considerable number of differences in material properties and potential tradeoffs between cost, electrical performance, thermal performance, and environmental factors. This paper presents a power and signal integrity comparison between a select set of multilayer organic technologies (HDBU and CPCore) and multilayer ceramic technologies (HTCC and LTCC). The geometry and material property impact on electrical performance for the flip-chip first level interconnect are qualitatively discussed and compared. The broadband frequency performance for the ball grid array (BGA) second-level interconnect to a PWB is simulated and characterized to 40 GHz for a differential pair using full-wave simulation. The impedance of the power distribution network (PDN) for a ceramic package is characterized by measurement to correlate with full-wave simulation to then subsequently compare with an organic substrate PDN.

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Shih, Meng-Kai, Yu-Hao Liu, Calvin Lee, and C. P. Hung. "Reliability Evaluation of Board-Level Flip-Chip Package under Coupled Mechanical Compression and Thermal Cycling Test Conditions." Materials 16, no. 12 (2023): 4291. http://dx.doi.org/10.3390/ma16124291.

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Flip Chip Ball Grid Array (FCBGA) packages, together with many other heterogeneous integration packages, are widely used in high I/O (Input/Output) density and high-performance computing applications. The thermal dissipation efficiency of such packages is often improved through the use of an external heat sink. However, the heat sink increases the solder joint inelastic strain energy density, and thus reduces the board-level thermal cycling test reliability. The present study constructs a three-dimensional (3D) numerical model to investigate the solder joint reliability of a lidless on-board FCBGA package with heat sink effects under thermal cycling testing, in accordance with JEDEC standard test condition G (a thermal range of −40 to 125 °C and a dwell/ramp time of 15/15 min). The validity of the numerical model is confirmed by comparing the predicted warpage of the FCBGA package with the experimental measurements obtained using a shadow moiré system. The effects of the heat sink and loading distance on the solder joint reliability performance are then examined. It is shown that the addition of the heat sink and a longer loading distance increase the solder ball creep strain energy density (CSED) and degrade the package reliability performance accordingly.

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Chen, Chi-Han, Kuan-Chung Lu, Chang-Ying Hung, et al. "GHz High Frequency TSV for 2.5D IC Packaging." International Symposium on Microelectronics 2012, no. 1 (2012): 001215–20. http://dx.doi.org/10.4071/isom-2012-thp62.

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TSV (Through Silicon Via) is the key enabling technology for 2.5D & 3D IC stacking solution in FCBGA (Flip Chip Ball Grid Array). As the 2.5D interposer design pushing toward smaller & shorter via due to high I/O density and high frequency requirement, the electrical performance of thinner interposer is therefore much more challenging in low signal loss performance for high frequency application and process. From the structure point of view, the silicon interposer is an additive layer between top side chip(s) and bottom side substrate, it is therefore an additional electrical interconnection which affects the signal propagation between chip(s) and substrate. Therefore, the performance of the TSV insertion loss in silicon interposer becomes critical, especially for above GHz application. Real measurement is conducted to validate the electrical performance of TSV interconnection up to 67GHz, and the wideband scalable model of TSV is also proposed and compared with the measured data. The measurement of this TSV structure has demonstrated the advantages with low parasitic capacitance and low insertion loss at high frequency. Full validated reliability test is also presented to verify interposer fabrication, assembly process optimization, and interconnection stability of the 2.5D IC package.

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Kim, Jichul, Jae Choon Kim, Mina Choi, et al. "Simultaneous Characterization of Theta-JC and Theta-JB Using Through-Package 1-D Heat Flow." International Symposium on Microelectronics 2011, no. 1 (2011): 000947–52. http://dx.doi.org/10.4071/isom-2011-tha2-paper5.

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A new technique is proposed for simultaneous, in-situ characterization of in-package thermal resistances (junction-to-case and junction-to-board) in a single test. A thin resistive heater is patterned on package top surface to establish one-dimensional heat conduction along the package vertical direction. Accompanying temperature rise at the heater is measured using a thermocouple and analyzed to estimate equivalent thermal R-C network model of the package. Due to the one-dimensionality of the probing thermal wave, the derived R-C network model represents physical package thermal structure, enabling simultaneous estimation of both thermal resistances (theta-JC and theta-JB). The proposed technique is validated by measuring theta-JC and JB of an overmolded flip-chip ball grid array package. The proposed method eliminates need for a separate test setup for the characterization of each thermal resistance, enhancing the accuracy and efficiency of the package thermal characterization. In addition, use of the external heater and sensing element, instead of on-chip heater and temperature sensor, enables in-situ thermal characterization of a real package mounted on the set board.

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Chen, Ming-Kun, Cheng-Chi Tai, and Yu-Jung Huang. "Electrical Characterization of FCBGA Package Based on Measurement Approach for High-speed SOC Applications." Journal of Microelectronics and Electronic Packaging 3, no. 4 (2006): 216–25. http://dx.doi.org/10.4071/1551-4897-3.4.216.

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With high-speed computers and wireless communications system become more popular in the electronic market, these communication-oriented products require high packaging densities, clock rates and higher switching speeds over Gb/s. A multilayer flip-chip Ball grid array (FCBGA) package used for applications running at more than 1 Gb/s has been characterized in this work. Electrical characterization of the package becomes essential beyond 1 GHz considering that the interconnections on the package behave not only just as interconnections but also as transmission lines. In this paper, we present the measurement and simulation results for interconnection of an FCBGA package using the time domain reflectometry (TDR) method. Simulation and measurement results are compared to establish a proper equivalent circuit model of the FCBGA interconnections. The parasitics of the power network can be measured through TDR, vector network analyzer (VNA) and impedance analyzer (IA). The complete models generated in this work are targeted for high-speed system-on-chip (SOC) devices that have a wide range of uses across commercial electronic applications.

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Hackler, Doug, and Ed Prack. "Advanced Protected Fan-In WLCSP." International Symposium on Microelectronics 2021, no. 1 (2021): 000089–92. http://dx.doi.org/10.4071/1085-8024-2021.1.000089.

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ABSTRACT With the advent of bumped die new IC packages evolved: for low IO WLCSP (wafer level chip scale package), for high IO FC (flip chip) CBGA (ceramic ball grid array) and PBGA (plastic ball grid array). For low IO, protected CSP is an emerging and rapidly growing market. In 2020 the market exceeded $2B and is ramping to a forecast $2.5B by 2025.1 Initially WLCSP, also known as FI (fan in), packages were built on the wafer with no active side protection evolving to single sided protection from a package built on the wafer2 which transition to redistribution PSB (passivation stress buffer)3, PSBs were used on FC wafers for high IO BGA packages. These provided acceptable performance initially, however as devices became more complex and reliability requirements increased, these processes no longer provided the required reliability. To attain higher IO capability and better reliability performance evolved to CSP4 (non-WL) which allowed larger area for bump distribution and additional protection to the rest of the exposed die surfaces. Fully protected die CSP (without substrates or leadframes) was initially implemented with processes such as M-series utilizing a FO (fan out) process.5 To obtain higher reliability 6-sided die protection afforded by M-series type processes require die reconstitution, expensive tapes, molding, and other operations generally required in a FO process which can feasibly be eliminated in a WLCSP protected FI process. American Semiconductor's Semiconductor-on-Polymer™ (SoP™) 300mm FleX-TM WLCSP is an advanced packaging process optimized for protected fan-in. FleX-TM produces the thinnest and lowest cost protected FI the industry today. Protected FI process innovations can improve performance in power devices, RF switches, die stacking and thin board applications. This article includes background on the evolution of CSP and the comparison of SOTA (state of the art) FI processes including FleX-TM.

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Ding, Shanjun, Jingyi Zhao, Xiaomeng Wu, Chuan Chen, Zhidan Fang, and Qidong Wang. "Curing kinetics of a novel commercial epoxy-phenolic composite build-up film for flip-chip ball grid array (FCBGA) substrates." Microelectronics Journal 161 (July 2025): 106717. https://doi.org/10.1016/j.mejo.2025.106717.

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