Relevant bibliographies by topics / Fluoborates

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  1. Journal articles
  2. Books
  3. Book chapters
  4. Conference papers

Academic literature on the topic 'Fluoborates'

Author: Grafiati
Published: 4 June 2021
Last updated: 21 June 2025

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Journal articles on the topic "Fluoborates"

1

Andrews, B. A. Kottes, and Robert M. Reinhardt. "Fluoborates in Catalysis of Durable Press Finishing Treatments for Cotton Fabrics." Textile Research Journal 55, no. 6 (1985): 363–67. http://dx.doi.org/10.1177/004051758505500606.

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2

Silaimani, Sm, Malathy Pushpavanam, and K. C. Narasimham. "Electrochemically Prepared Tin-Lead Fluoborates for the Deposition of Sn-Pb (60:40) Alloy." Transactions of the IMF 78, no. 3 (2000): 120–23. http://dx.doi.org/10.1080/00202967.2000.11871322.

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3

Chen, C. J., and C. C. Wan. "Electrochemical synthesis of tin fluoborate." Electrochimica Acta 30, no. 10 (1985): 1307–12. http://dx.doi.org/10.1016/0013-4686(85)85007-6.

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4

TSURU, Toshiaki, Shigeo KOBAYASHI, Takeshi OHGAI, Tetsuya AKIYAMA, and Hisaaki FUKUSHIMA. "Electrodeposition of Rhenium from Fluoborate Baths." Journal of the Surface Finishing Society of Japan 47, no. 10 (1996): 883–84. http://dx.doi.org/10.4139/sfj.47.883.

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5

Bortle, Walt. "Operating tips for tin-lead fluoborate plating." Metal Finishing 94, no. 1 (1996): 38–39. http://dx.doi.org/10.1016/s0026-0576(96)96927-5.

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6

Xu, L., D. Xu, Y. Xu, and J. Gu. "Diamminebis[dimethylglyoximato(1–)]cobalt(III) Fluoborate and Perchlorate." Acta Crystallographica Section C Crystal Structure Communications 52, no. 5 (1996): 1119–22. http://dx.doi.org/10.1107/s010827019501568x.

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7

URAKAWA, Takayuki, Yoshiharu SUGIMOTO, Tetsuya AKIYAMA, and Hisaaki FUKUSHIMA. "Electrodeposition Behavior of Zinc-Manganese Alloys from Fluoborate Baths." Journal of the Surface Finishing Society of Japan 47, no. 8 (1996): 714–19. http://dx.doi.org/10.4139/sfj.47.714.

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8

Pewnim, Naray, and Sudipta Roy. "The Role of Fluorosurfactant on Cu-Sn Electrodeposition from Methanesulfonic Acid." Key Engineering Materials 658 (July 2015): 125–28. http://dx.doi.org/10.4028/www.scientific.net/kem.658.125.

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Methanesulfonic acid (MSA) is an environmentally benign supporting electrolyte that is an attractive alternative to traditional copper and tin plating baths based on cyanide or fluoborate. This is mainly due to its low toxicity, volatility, and good biodegradability as well as other desirable characteristics for electrodeposition such as high metal salt solubility and conductivity. The role of fluorosurfactant on Cu-Sn electrodeposition from methanesulfonic acid was explored through the use of an electrochemical quartz crystal nanobalance to monitor surfactant adsorption and desorption from the electrode surface. It was found that the surfactant adsorbs on the surface and inhibits copper deposition by blocking the reduction and oxidation reaction for copper.
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9

Lu, Zheng, Khalil A. Abboud, and W. M. Jones. "Bis(triphenylphosphine)platinum cycloheptadienynylium fluoborate: the tropylium equivalent of benzyne." Journal of the American Chemical Society 114, no. 27 (1992): 10991–92. http://dx.doi.org/10.1021/ja00053a063.

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10

Xu, Xiao Yan, Guo Tong Qian, Jian Zhou, Yao Yao, and Xu Chen. "Wettability of Sn-Zn Lead-Free Solder on Aluminum Substrate." Advanced Materials Research 815 (October 2013): 48–54. http://dx.doi.org/10.4028/www.scientific.net/amr.815.48.

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The effects of flux components and compositions of solder alloys on the wettability of the Sn-Zn alloys on aluminum surface was investigated. The results show that the wettability of the Sn-9Zn solder on aluminum substrate improved with flux of double solvents composed of diethanolamine and triethanolamine, which is better than single solvent. When flux is composed of 3% zinc fluoborate as activator and 30% triethanolamine plus 67% diethanolamine as double solvents, the spreading area of the Sn-9Zn solder reaches to 75%. Trace addition (0.002%-0.005%) of Al results in significant improvement of the wettability of the Sn-9Zn based solder. However, additions of Bi or Sb are not beneficial to the wettability of the solder on aluminum substrate.
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Books on the topic "Fluoborates"

1

W, Liskowitz John, and Hazardous Waste Engineering Research Laboratory, eds. Removal and recovery of fluoborates and metal ions from electroplating wastewater. U.S. Environmental Protection Agency, Hazardous Waste Engineering Research Laboratory, 1985.

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Book chapters on the topic "Fluoborates"

1

Van Der Meulen, P. A., H. L. Van Mater, M. Josetta Butler, and L. F. Audrieth. "Potassium Fluoborate." In Inorganic Syntheses. John Wiley & Sons, Inc., 2007. http://dx.doi.org/10.1002/9780470132326.ch9.

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2

Enna, S. J., and David B. Bylund. "Fluoborate." In xPharm: The Comprehensive Pharmacology Reference. Elsevier, 2007. http://dx.doi.org/10.1016/b978-008055232-3.61762-3.

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Conference papers on the topic "Fluoborates"

1

Varma, Ravi, H. Shimotake, T. L. Hoeller, and V. Agarwala. "Electrodeposition of Cadmium from Aqueous Fluoborate Electrolytes." In CORROSION 1988. NACE International, 1988. https://doi.org/10.5006/c1988-88388.

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Abstract A new method of electroplating cadmium on high-strength steel from aqueous fluoborate electrolytes has been developed at Argonne National Laboratory. The cadmium coatings are fine grained, coherent, and strongly adherent to the substrate. With this method, a high-rate electrodeposition is achieved in an electrolyte-flow cell using an optimized pulse-nucleation step followed by deposit growth under a DC or pulsed current. This method results in minimal hydrogen codeposition during plating, which can lead to steel embrittlement.
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