Academic literature on the topic 'Grinding and polishing automation'

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Journal articles on the topic "Grinding and polishing automation"

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Zhu, Minjian, Tao Shang, Zelin Jin, Chunshan Liu, Wenbin Deng, and Yanli Chen. "Research on the Visual Guidance System of Zoning Casting Grinding Based on Feature Points." Applied Sciences 12, no. 17 (2022): 8771. http://dx.doi.org/10.3390/app12178771.

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Compared to traditional rough casting grinding (RCG), the individualization of castings is very different, which makes it difficult to realize the automation of casting grinding. At this stage, the primary method is manual grinding. In this study, the regional casting grinding system based on feature points is adopted to achieve the personalized grinding of castings and improve the grinding efficiency and the automation level of the manufacturing process. After preprocessing the point cloud, the fast point feature histogram (FPFH) descriptor is used to describe the features of each region and construct the local template. The position of the local region is obtained by template matching. The random sample consensus (RANSAC) algorithm is used to calculate the plane and fit the point cloud to obtain the contact point trajectory of the grinding head. Then, according to different polishing methods, different polishing poses are generated. The simulation experimental results show that the system has good adaptability, and the consistency of finished products is good.
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Wei, Frank. "Advancements in Phenomenological Understanding of Thinning and Planarization Processes for TSV-Enabled 2.5-3D Device Fabrications." International Symposium on Microelectronics 2014, no. 1 (2014): 000708–12. http://dx.doi.org/10.4071/isom-wp41.

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Innovations and novel development in substrate thinning and planarization processes driven by advanced packages fabrications are surveyed. For direct 3D die-stacking process approach, a novel methodology for bonded wafer grinding has been put in place based on feedforward wafer thickness metrology and in-situ Auto-TTV Adjustment grinding. This scheme can minimize post-thinning RST variations leading to downstream TSV process improvements. For over-mold facilitated, multi-functional packages and wafer-level fan-out packages, grinding process improved in ways of fixed abrasives and equipment automation. For glass devices processing, new grinding and polishing have been developed on existing Si-compatible equipment. For ductile materials planarization, the surface planer process is presented.
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Hsieh, Long-Chang, and Tzu-Hsia Chen. "THE SYSTEMATIC DESIGN OF PLANETARY-TYPE GRINDING DEVICES FOR OPTICAL FIBER FERRULES AND WAFERS." Transactions of the Canadian Society for Mechanical Engineering 40, no. 4 (2016): 619–30. http://dx.doi.org/10.1139/tcsme-2016-0049.

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The traditional planetary grinding device can only polish one optical fiber ferrule. The other grinding device with donut polishing trace is also proposed for polishing wafer. This grinding device has a problem, that is, “the polishing qualities of different points on the wafer are not the same”. Hence, this paper proposes a new planetary grinding device for polishing more optical fiber ferrules and more wafers. Based on the kinematics of planetary gear train, the equations of polishing trace and velocity are derived. Then, the velocity deviation percentage (Vdp) is calculated, which is an important design parameter. Area ratio (AR) is defined as polishing area divided by grinding pad area. The area ratio (AR) is another important design parameter for designing planetary grinding devices. In this paper, two design examples are used to illustrate the design process. The research results of this paper can provide an experience for the systematic design of planetary grinding devices.
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Dai, Zhe Min, and De Sheng Li. "The Analysis of Grinding and Polishing for the Tile Planetary Disc Griding Machine." Advanced Materials Research 538-541 (June 2012): 1235–39. http://dx.doi.org/10.4028/www.scientific.net/amr.538-541.1235.

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In this study, the polishing machine’s mathematical model of the movement has been established by analysis the several polishing machines’ grinding and polishing process for tile. Then according to the model to simulate the trajectory and compare the grinding grain uniformity and the size of the grinding area. The results show that the disc grinding machine in improving of the efficiency of grinding and grinding grain uniformity is better than the other motions.
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Zhao, Xin, and Xiao Ling Yang. "Effect of Hardness on Polishing Performance of Plastic Mold Steels in Prehardened Condition." Applied Mechanics and Materials 651-653 (September 2014): 16–19. http://dx.doi.org/10.4028/www.scientific.net/amm.651-653.16.

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In this paper, the comparisons of the polishing performance between prehardened P20 and S45C steels under the different hardness were carried out by using surface grinding, manual polishing and PVA grinding wheel polishing tests. The results show that the surface roughness of the two kind steels decrease with the increase of hardness and the roughness of S45C is lower than that of P20 during the surface grinding test. After polishing process, the surface roughness of the two kind steels decrease with the increase of hardness as well. However, the surface roughness of S45C is higher than that of P20 after both manual polishing and PVA grinding wheel polishing tests.
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Bao, Jiahui, Xiaoqiang Peng, Hao Hu, and Tao Lai. "A Method of Restraining the Adverse Effects of Grinding Marks on Small Aperture Aspheric Mirrors." Micromachines 13, no. 9 (2022): 1421. http://dx.doi.org/10.3390/mi13091421.

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The grinding method is used as the preliminary processing procedure for small aperture aspheric mirrors. Regular grinding marks produced in the grinding process significantly affect the mid-spatial frequency error; however, because of their small radius of surface curvatures and high steepness, they are difficult to polish using traditional methods. Therefore, in this study, the ultra-precision grinding and polishing process of fused quartz material was investigated, and the influence of grinding marks was analyzed, which achieved the purpose of restraining the grinding marks in the grinding process. The generation mechanisms of horizontal and vertical grinding marks were analyzed by means of simulation and experiment, and the relationship between different grinding process parameters and surface quality was explored. A magnetorheological finishing (MRF) spot method was used to explore the effects of grinding marks on subsurface damage (SSD). The elastic adaptive polishing method was used to polish an aspheric lens with high steepness and small caliber. Based on the principle of an elastic adaptive polishing mathematical model, the grinding marks were suppressed, and the mid-spatial frequency error of the lens was reduced by optimizing the polishing path and composition of the polishing fluid. The final roughness reached 10 nm Ra. In this paper, the source of wear marks and their influence on the mid-spatial frequency error of small aperture aspheric mirrors are analyzed, and the grinding marks were suppressed by elastic adaptive polishing.
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Shi, Shuang Ji, Jia Zhi Lin, Zhu Ji Jin, Xiao Guang Guo, Ping Zhou, and Ren Ke Kang. "Study of Grinding Wheel for Polishing Diamond by Dynamic Friction Polishing." Advanced Materials Research 1017 (September 2014): 304–9. http://dx.doi.org/10.4028/www.scientific.net/amr.1017.304.

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Diamond is widely used in the fields of precise and ultraprecise machining because of its superlative characters. Due to high hardness and great brittleness of diamond, the grinding of diamond needs a kind of high effective and stable polishing method. Dynamic friction polishing (DFP) is deemed to be an innovative method by means of a synergistic reaction of mechanical effect and chemical change. The condition of high pressure and high temperature puts forward a high requirement for mechanical property of the grinding wheel in DFP, other than that, the graphitization of diamond catalyzed by catalytic metal is also a focus of research. In this paper, the transition metals with unpaired d electrons were selected as polishing materials, and powder metallurgy technique was used to prepare alloy grinding wheel for polishing diamond by dynamic friction polishing.
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Jin, Zhu Ji, Ze Wei Yuan, Ren Ke Kang, and B. X. Dong. "Study on Two Kinds of Grinding Wheels for Dynamic Friction Polishing of CVD Diamond Film." Key Engineering Materials 389-390 (September 2008): 217–22. http://dx.doi.org/10.4028/www.scientific.net/kem.389-390.217.

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This paper investigates two kinds of grinding wheels prepared by the combination of mechanical alloy and hot-press sintering (MA-HPS). Scanning electro microscopy, Optical microscope, Talysurf surface profiler, X-Ray diffraction and Raman spectroscopy were used to characterize two kinds of grinding wheels and identify the removal mechanism. It was found that FeNiCr matrix-TiC (FMT) grinding wheel yielded higher removal rate than TiAl abrasiveless carbophile (TAC) grinding wheel, which conversely owned good polishing quality; diamond was removed by transformation diamond to non-diamond carbons and then removed by mechanically or diffusion to grinding wheel during polishing process with FMT grinding wheel. While TAC grinding wheel polishing CVD diamond film mainly depended on the reaction between diamond carbon and titanium.
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Kheur, Mohit, Tabrez Lakha, Saleha Shaikh, et al. "A Comparative Study on Simulated Chairside Grinding and Polishing of Monolithic Zirconia." Materials 15, no. 6 (2022): 2202. http://dx.doi.org/10.3390/ma15062202.

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This study evaluated the effects of different simulated chairside grinding and polishing protocols on the physical and mechanical properties of surface roughness, hardness, and flexural strength of monolithic zirconia. Sintered monolithic zirconia specimens (15 mm × 3 mm × 3 mm) were abraded using three different burs: diamond bur, modified diamond bur (zirconia specified), and tungsten carbide bur, along with a group of unprepared specimens that served as a control group. The study was divided into two phases, Phase 1 and Phase 2. Surface roughness, surface hardness, and flexural strength were assessed before and after the grinding procedure to determine the ‘best test group’ in Phase 1. The best abrasive agent was selected for Phase 2 of the study. The specimens in Phase 2 underwent grinding with the best abrasive agent selected. Following the grinding, the specimens were then polished using commercially available diamond polishing paste, a porcelain polishing kit, and an indigenously developed low-temperature sintered zirconia slurry. The physical and mechanical properties were again assessed. Results were analyzed using one-way ANOVA test. Specimens were observed under scanning electron microscopy (SEM) and X-ray diffraction (XRD) for their microstructure and crystalline phases, respectively. Grinding with diamond burs did not weaken zirconia (p > 0.05) but produced rougher surfaces than the control group (p < 0.05). Tungsten carbide burs did not significantly roughen the zirconia surface. However, specimens ground by tungsten carbide burs had a significantly reduced mean flexural strength (p < 0.05) and SEM revealed fine surface cracks. Phase transformation was not detected by XRD. Polishing with commercially available polishing agents, however, restored the surface roughness levels to the control group. Dental monolithic zirconia ground with tungsten carbide burs had a significantly reduced flexural strength and a smooth but defective surface. However, grinding with diamond burs roughened the zirconia surface. These defects may be reduced by polishing with commercially available polishing agents. The use of tungsten carbide burs for grinding dental zirconia should not be advocated. Grinding with diamond abrasives does not weaken zirconia but requires further polishing with commercially available polishing agents.
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Mizobuchi, Akira, Takeshi Hamada, Atsuyoshi Tashima, Keita Horimoto, and Tohru Ishida. "Polishing Performance of a Recycled Grinding Wheel Using Grinding Wheel Scraps for the Wet Polishing of Stainless-Steel Sheets." International Journal of Automation Technology 16, no. 1 (2022): 60–70. http://dx.doi.org/10.20965/ijat.2022.p0060.

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The surfaces of large austenitic stainless-steel sheets, which have side lengths of at least 1 m a sheet thickness of at least 6 mm, used for food tanks and sliding plates in seismic isolation devices, must be finished to a mirror surface. Polishing is performed to improve the surface quality of such sheets and dry machining is typically applied. The problems associated with dry machining are the exhaust heat of machining and treatment of chips. A transition to wet machining is required to solve these problems. In our laboratory, we have developed a wet polishing machine and researched the selection of grinding wheels to develop wet polishing technology for large stainless-steel sheets. In this study, to reduce tool cost and reuse resources, we attempted to manufacture a recycled grinding wheel using snippets of grinding wheel scraps. A polyvinyl alcohol (PVA) aqueous solution was used as the bonding agent for the recycled grinding wheel to reduce environmental load. To overcome the ease of dissolution of PVA in water, we attempted to improve the water resistance of the PVA aqueous solution by incorporating an organic titanium compound. This is one of our efforts to contribute to sustainable development goals. The results are summarized below. (1) A recycled grinding wheel was fabricated by kneading crushed pieces of grinding wheel scrap with a bonding agent. (2) The maintenance of the shape of the recycled grinding wheel was controlled by the concentration of the bonding agent. (3) The recycled grinding wheel with a PVA bonding agent was vulnerable to water. In contrast, the recycled grinding wheel to which the organic titanium compound was added exhibited improved water resistance. (4) The polishing of stainless-steel sheets using the plain PVA recycled wheel was relatively ineffective, but polishing using the recycled wheel with the titanium additive was comparable to polishing with a new grinding wheel.
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Dissertations / Theses on the topic "Grinding and polishing automation"

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Hives, Paul, of Western Sydney Nepean University, and of Mechatronic Computer and Electrical Engineering School. "Automation and modelling of robotic polishing." THESIS_XXX_MCEE_Hives_P.xml, 2000. http://handle.uws.edu.au:8081/1959.7/297.

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This research effort highlights emerging areas in the field of robotic polishing and includes an extensive literature survey conducted by the author. This survey shows that areas in need of further investigation for achieving automated polishing are surface measurement, CAD/CAM integration and polishing mechanics. The work conducted has been based on the use of an available robot end-effector for polishing unknown three-dimensional surfaces. A model for determining the mass of material removed during the polishing process is based on hardness testing, surface grinding and milling theory. Using this model the material removed during the polishing process is compared to results from practical experiments. Polishing trajectory for a robot-end effector to follow has been produced using CAD files in Initial Graphics Exchange Specification (IGES) format. Using these files and two types of polishing patterns, the surface roughness of polished surfaces has been compared for simple planar polygonal surfaces.<br>Master of Engineering (Hons)
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Hives, Paul. "Automation and modelling of robotic polishing." Thesis, View thesis, 2000. http://handle.uws.edu.au:8081/1959.7/297.

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This research effort highlights emerging areas in the field of robotic polishing and includes an extensive literature survey conducted by the author. This survey shows that areas in need of further investigation for achieving automated polishing are surface measurement, CAD/CAM integration and polishing mechanics. The work conducted has been based on the use of an available robot end-effector for polishing unknown three-dimensional surfaces. A model for determining the mass of material removed during the polishing process is based on hardness testing, surface grinding and milling theory. Using this model the material removed during the polishing process is compared to results from practical experiments. Polishing trajectory for a robot-end effector to follow has been produced using CAD files in Initial Graphics Exchange Specification (IGES) format. Using these files and two types of polishing patterns, the surface roughness of polished surfaces has been compared for simple planar polygonal surfaces.
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Hives, Paul. "Automation and modelling of robotic polishing /." View thesis, 2000. http://library.uws.edu.au/adt-NUWS/public/adt-NUWS20030617.081601/index.html.

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Thesis (M.Sc. (Hons)) -- University of Western Sydney, Nepean, 2000.<br>"Thesis submitted for the degree of Master of Engineering (Hons), School of Mechatronic, Computer & Electrical Engineering, University of Western Sydney, Nepean" Bibliography : leaves 129-141.
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Tse, Shuetfung. "Models of micro positioning and methods for surface grinding process control /." View abstract or full-text, 2008. http://library.ust.hk/cgi/db/thesis.pl?MECH%202008%20TSE.

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Chandran, Sarath, and Mathews Jithin Abraham. "Simulation and Optimization of CNC controlled grinding processes : Analysis and simulation of automated robot finshing process." Thesis, Högskolan i Halmstad, Maskinteknisk produktframtagning (MTEK), 2016. http://urn.kb.se/resolve?urn=urn:nbn:se:hh:diva-30709.

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Products with complicated shapes require superior surface finish to perform the intended function. Despite significant developments in technology, finishing operations are still performed semi automatically/manually, relying on the skills of the machinist. The pressure to produce products at the best quality in the shortest lead time has made it highly inconvenient to depend on traditional methods. Thus, there is a rising need for automation which has become a resource to remain competitive in the manufacturing industry. Diminishing return of trading quality over time in finishing operations signifies the importance of having a pre-determined trajectory (tool path) that produces an optimum surface in the least possible machining time. Tool path optimization for finishing process considering tool kinematics is of relatively low importance in the present scenario. The available automation in grinding processes encompass around the dynamics of machining. In this paper we provide an overview of optimizing the tool path using evolutionary algorithms, considering the significance of process dynamics and kinematics. Process efficiency of the generated tool movements are studied based on the evaluation of relative importance of the finishing parameters. Surface quality is analysed using MATLAB and optimization is performed on account of peak to valley height. Surface removal characteristics are analysed based on process variables that have the most likely impact on surface finish. The research results indicated that tool path is the most significant parameter determining the surface quality of a finishing operation. The inter-dependency of parameters were also studied using Taguchi design of experiments. Possible combinations of various tool paths and tool influencing parameters are presented to realize a surface that exhibits lowest errors.<br>European Horizon 2020 Project SYMPLEXITY
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Zhang, Xiaohong. "Chemical mechanical polishing and grinding of silicon wafers." Diss., Manhattan, Kan. : Kansas State University, 2007. http://hdl.handle.net/2097/475.

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Pena-Diaz, Hernan R. "Experimental validation of an atomization model for fluids used in the grinding process." Thesis, Georgia Institute of Technology, 2001. http://hdl.handle.net/1853/18999.

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Hekman, Keith Alan. "Precision control in compliant grinding via depth-of-cut manipulation." Diss., Georgia Institute of Technology, 1997. http://hdl.handle.net/1853/16627.

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Agarwal, Reena. "Degradation of polymers in chemical mechanical polishing." Thesis, Georgia Institute of Technology, 2000. http://hdl.handle.net/1853/11828.

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Mess, Francis McCarthy. "Wear model for chemo-mechanical polishing of single crystal silicon." Thesis, Georgia Institute of Technology, 1997. http://hdl.handle.net/1853/15984.

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Books on the topic "Grinding and polishing automation"

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1938-, Jones Robert A., ed. Selected papers on computer-controlled optical surfacing. SPIE Optical Engineering Press, 1991.

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Shichao, Yu, ed. Xian dai dao ju yu shu kong mo xiao ji shu. Ji xie gong ye chu ban she, 2009.

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Krar, Stephen F. Grinding technology. 2nd ed. Delmar Publishers, 1995.

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Barstow, Philippa. French polishing. B.T. Batsford, 1993.

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Modern grinding process technology. McGraw-Hill, 1992.

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D, Marinescu Ioan, Tönshoff H. K, and Inasaki Ichiro, eds. Handbook of ceramic grinding and polishing. Noyes Publications, 2000.

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Kibbe, Richard R. Grinding machine operations. Wiley, 1985.

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International, Grinding Conference (3rd 1988 Fontana Wis ). Third International Grinding Conference. Society of Manufacturing Engineers, 1988.

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Lynch, Alban J. The history of grinding. Society for Mining, Metallurgy & Exploration, 2005.

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Metzger, J. L. Superabrasive grinding. Butterworths, 1986.

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Book chapters on the topic "Grinding and polishing automation"

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Li, Shengqian, Xiaopeng Xie, and Litian Yin. "Research on Robotic Trajectory Automatic Generation Method for Complex Surface Grinding and Polishing." In Intelligent Robotics and Applications. Springer International Publishing, 2014. http://dx.doi.org/10.1007/978-3-319-13963-0_13.

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Fiedler, Knut Holger. "Processing (Grinding and Polishing)." In The Properties of Optical Glass. Springer Berlin Heidelberg, 1998. http://dx.doi.org/10.1007/978-3-642-57769-7_7.

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Xu, Xiao Cun, Zhe Jun Yuan, and Bing Lin. "Optimize Parameters of Floating Polishing with Tri-Polishing-Disk." In Advances in Grinding and Abrasive Technology XIV. Trans Tech Publications Ltd., 2007. http://dx.doi.org/10.4028/0-87849-459-6.305.

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Yates, John T. "Single Crystal Orientation, Grinding, and Polishing." In Experimental Innovations in Surface Science. Springer New York, 1998. http://dx.doi.org/10.1007/978-1-4612-2304-7_71.

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Liu, Judong, Jinkui Xiong, and Wei Yuan. "Experiment Study on Grinding Force of 65Mn Steel in Grinding-Hardening Machining." In Future Control and Automation. Springer Berlin Heidelberg, 2012. http://dx.doi.org/10.1007/978-3-642-31003-4_30.

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Kawai, Akihito. "Dicing, Grinding, and Polishing (Kiru Kezuru and Migaku)." In Handbook of 3D Integration. Wiley-VCH Verlag GmbH & Co. KGaA, 2014. http://dx.doi.org/10.1002/9783527670109.ch18.

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Dong, Li Hua, C. H. Fan, Ju Long Yuan, Z. W. Wang, and H. Yang. "Study on the Grinding Mechanism of Polishing Film." In Advances in Grinding and Abrasive Technology XIII. Trans Tech Publications Ltd., 2006. http://dx.doi.org/10.4028/0-87849-986-5.330.

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Yin, Shao Hui, Takeo Shinmura, and D. Wang. "Magnetic Field-Assisted Polishing for Ferromagnetic Metallic Material." In Advances in Grinding and Abrasive Technology XIII. Trans Tech Publications Ltd., 2006. http://dx.doi.org/10.4028/0-87849-986-5.320.

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Zhai, Wen Jie, Chang Xiong Liu, and Pei Lian Feng. "Hydrodynamic Analysis of Circular Translational Polishing under Mixed Lubrication." In Advances in Grinding and Abrasive Technology XIV. Trans Tech Publications Ltd., 2007. http://dx.doi.org/10.4028/0-87849-459-6.264.

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Ji, Shi Ming, Xian Zhang, Li Zhang, Qiao Ling Yuan, Y. H. Wan, and Ju Long Yuan. "Form and Texture Control of Free-Form Surface Polishing." In Advances in Grinding and Abrasive Technology XIII. Trans Tech Publications Ltd., 2006. http://dx.doi.org/10.4028/0-87849-986-5.113.

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Conference papers on the topic "Grinding and polishing automation"

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Kim, HyungTae, HaeJeong Yang, and SungChul Kim. "Nano Control Algorithm for Grinding and Polishing Aspherical Surface." In 2006 IEEE Conference on Emerging Technologies and Factory Automation. IEEE, 2006. http://dx.doi.org/10.1109/etfa.2006.355342.

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Deng, Yuxin, Guilian Wang, Xu Yue, and Kuntao Zhou. "A Review of Robot Grinding and Polishing Force Control Mode." In 2022 IEEE International Conference on Mechatronics and Automation (ICMA). IEEE, 2022. http://dx.doi.org/10.1109/icma54519.2022.9855998.

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Li, Daqi, Lei Zhang, Xu Yang, Heran Yang, and Tongzhan Li. "Research on the double-sided grinding and polishing machine tool system." In 2010 International Conference on Information and Automation (ICIA). IEEE, 2010. http://dx.doi.org/10.1109/icinfa.2010.5512495.

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Tongying Guo, Daokui Qu, Fang Xu, and Xiao Li. "Application of Fuzzy Reasoning in the Robot Partial Grinding and Polishing." In 2006 6th World Congress on Intelligent Control and Automation. IEEE, 2006. http://dx.doi.org/10.1109/wcica.2006.1713741.

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Sedore, Mitchell J. "Applications of automation in optical manufacturing process chain: grinding, polishing, and metrology." In Optifab 2021, edited by Jessica DeGroote Nelson and Blair L. Unger. SPIE, 2021. http://dx.doi.org/10.1117/12.2602846.

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McDonald, Todd. "Semi-Automated Cross-Section Preparation Process for Complex Multi-Face Perimeter Samples." In ISTFA 2003. ASM International, 2003. http://dx.doi.org/10.31399/asm.cp.istfa2003p0278.

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Abstract The fixed position sample mover plates currently offered to the industry only facilitate two sided grinding and polishing. 3 and 4-sided requests cannot be accommodated with these fixed position mover plates. Ultimately this means performing some or all of the work manually. Described here is a fixture and process solution that makes semi-automation possible through the entire process.
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Wolfs, Franciscus, Edward Fess, Scott DeFisher, Josh Torres, and James Ross. "Freeform grinding and polishing with PROSurf." In SPIE Optifab, edited by Julie L. Bentley and Sebastian Stoebenau. SPIE, 2015. http://dx.doi.org/10.1117/12.2195899.

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Fess, Edward M., Scott DeFisher, Frank Wolfs, and Dave Mohring. "Grinding, Polishing, and Metrology of Freeform Optics." In Freeform Optics. OSA, 2013. http://dx.doi.org/10.1364/freeform.2013.fw1b.5.

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Parks, Robert E., and Reid Greenberg. "Load distributions beneath grinding and polishing laps." In OSA Annual Meeting. Optica Publishing Group, 1989. http://dx.doi.org/10.1364/oam.1989.thf4.

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It is well known that when two hard bodies are rubbed together with an abrasive slurry introduced to promote wear, the two wearing surfaces become complementary mating spherical surfaces. In addition, it is known empirically that the radii of the surfaces depend on the relative motion between the two bodies. We assume the wear rates of the surfaces obey Preston's equation, that is, wear is proportional to the relative velocity times the pressure between the surfaces. We then calculate the pressure between the surfaces as a function of the shapes of the surfaces and their relative motion.
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Namba, Y., and Y. Takehara. "Ultraprecision grinding of optical components." In The European Conference on Lasers and Electro-Optics. Optica Publishing Group, 1998. http://dx.doi.org/10.1364/cleo_europe.1998.cthc7.

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Grinding has been used in the optics industry as a typical figuring process for optical glass components. Conventional grinding requires a final polishing process for getting optical-quality surfaces. This paper present a new technology for making optical surfaces using ultraprecision grinding without a polishing process.
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Reports on the topic "Grinding and polishing automation"

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Suratwala, T., P. Miller, J. Menapace, et al. FY07 LDRD Final Report A Fracture Mechanics and Tribology Approach to Understanding Subsurface Damage on Fused Silica during Grinding and Polishing. Office of Scientific and Technical Information (OSTI), 2008. http://dx.doi.org/10.2172/926036.

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