Books on the topic 'Grinding circuits'

Hoffman, Alan Donald. A soft-wall permeameter for online characterization of grinding circuits. [s.l: s.n.], 1989.

International Symposium on Chemical Mechanical Planarization in Integrated Circuit Device Manufacturing (4th 2000 Phoenix, Ariz.). Chemical mechanical planarization IV: Proceedings of the International Symposium. Edited by Opila R. L, Electrochemical Society. Dielectric Science and Technology Division., Electrochemical Society Electronics Division, and Electrochemical Society Meeting. Pennington, NJ: Electrochemical Society, Inc., 2001.

International Symposium on Chemical Mechanical Planarization in Integrated Circuit Device Manufacturing (6th 2003 Orlando, Fla.). Chemical mechanical planarization VI: Proceedings of the international symposium. Edited by Seal S, Electrochemical Society Electronics Division, and Electrochemical Society Meeting. Pennington, NJ: Electrochemical Society, 2003.

International, Symposium on Chemical Mechanical Planarization in Integrated Circuit Device Manufacturing (5th 2002 Philadelphia Pa ). Chemical mechanical planarization V: Proceedings of the International Symposium. Pennington, NJ: Electrochemical Society, Inc., 2002.

Rajamani, Kuppuswamy. Optimal control of closed circuit ball mill grinding. Ann Arbor, MI: UMI Dissertation Services, 1990.

Lachapelle, Daniel J. Grinding circuit simulation of St Andrew Goldfields Stock Mill. Sudbury, Ont: Laurentian University, School of Engineering, 2000.

Xiao, Zhixian. Developing simple regression for predicting gold gravity recovery in grinding circuit. Montreal, QC: McGill University, Dept. of Mining, Metals and Materials Engineering, 2001.

Canada Centre for Mineral and Energy Technology. Spoc Simulated Processing of Ore and Coal: Chapter 2.2 Grinding Circuit Sampling. S.l: s.n, 1985.

Borst, Christopher L. Chemical-mechanical polishing of low dielectric constant polymers and organosilicate glasses: Fundamental mechanisms and application to IC interconnect technology. Boston: Kluwer Academic Publishers, 2002.

Lounsbury, David Michael. Optimization of the Kidd Creek Mine primary grinding circuit and subsequent model development. Sudbury, Ont: Laurentian University, School of Engineering, 1995.

International Symposium on Chemical Mechanical Planarization (2nd 1998 San Diego, Calif.). Proceedings of the Second International Symposium on Chemical Mechanical Planariarization [sic] in Integrated Circuit Device Manufacturing. Edited by Raghavan S, Opila Robert Leon 1953-, Zhang L, Electrochemical Society Electronics Division, Electrochemical Society. Dielectric Science and Technology Division., and Electrochemical Society Meeting. Pennington, New Jersey: Electrochemical Society, 1998.

Dresler, Amos Robert. Metallurgical pre-feasibility assessment of a cyanide based grinding circuit and of a carbon-in-column gold recovery system for Placer Dome Ltd., Musselwhite mine. Sudbury, Ont: Laurentian University, School of Engineering, 1998.

Cheng, Jie. Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect. Springer, 2019.

Cheng, Jie. Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect. Springer, 2017.

Li, Yuzhuo. Microelectronic Applications of Chemical Mechanical Planarization. Wiley-Interscience, 2007.

Li, Yuzhuo. Microelectronic Applications of Chemical Mechanical Planarization. Wiley & Sons, Incorporated, John, 2007.

Gill, William N., Ronald J. Gutmann, and Christopher Lyle Borst. Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses: Fundamental Mechanisms and Application to IC Interconnect Technology. Springer, 2002.

Gill, William N., Ronald J. Gutmann, and Christopher Lyle Borst. Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses: Fundamental Mechanisms And Application To Ic Interconnect Technology. Springer, 2014.

Gill, William N., Ronald J. Gutmann, and Christopher Lyle Borst. Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses: Fundamental Mechanisms and Application to IC Interconnect Technology. Springer London, Limited, 2013.

S, Boning Duane, Materials research Society Meeting, and Symposium on Chemical-Mechanical Planarization (2003 : San Francisco, Calif.), eds. Chemical-mechanical planarization: Symposium held April 22-24, 2003, San Francisco, California, U.S.A. Warrendale, Pa: Materials Research Society, 2003.

Vos, Ingrid, Michael R. Oliver, Duane S. Boning, Katia Devriendt, and David J. Stein. Chemical-Mechanical Planarization: Volume 767. University of Cambridge ESOL Examinations, 2014.