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Relevant bibliographies by topics / Heat bonding

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Academic literature on the topic 'Heat bonding'

Author: Grafiati

Published: 28 May 2022

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Journal articles on the topic "Heat bonding"

1

Jog, M. A., I. M. Cohen, and P. S. Ayyaswamy. "Heat Transfer in Wire Bonding Process." Journal of Electronic Packaging 116, no. 1 (March 1, 1994): 44–48. http://dx.doi.org/10.1115/1.2905492.

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We have analyzed an electric discharge between wire and planar electrodes with wire diameter and current densities that are typically used in upscaled experimental simulations of the wire bonding process employed in microelectronic manufacturing. A set of continuum conservation equations has been solved to obtain the variation of electric potential, temperature distributions, and the electrode heat fluxes. Results indicate that the main body of the discharge is quasineutral bounded by space charge sheaths at both electrodes. Strong electric fields are concentrated in the electrode sheaths. The heat flux to the wire is sharply peaked near the wire tip but on the plane it decays slowly away from the discharge axis. The model studied here may be used to establish optimum discharge parameters for wire bonding.

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Miller, Brett A., Thomas N. Ackerson, James T. Zellers, and Jennifer Breetz. "Inadvertent Diffusion Bonding During Heat Treatment." Journal of Failure Analysis and Prevention 13, no. 1 (December 11, 2012): 4–7. http://dx.doi.org/10.1007/s11668-012-9638-1.

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Yokura, Miyoshi, Kenichi Uehara, Guo Xiang, Kazuya Hanada, Yoshinobu Nakamura, Lakshmi Sanapa Reddy, Kazuhiro Endo, and Tamio Endo. "Ultralong Lifetime of Active Surface of Oxygenated PET Films by Plasma-irradiation and Bonding Elements." MRS Proceedings 1454 (2012): 201–6. http://dx.doi.org/10.1557/opl.2012.1128.

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ABSTRACTBiaxially oriented polyethylene terephthalate (PET) films can be bonded directly by oxygen plasma irradiation and low temperature heat press around 100°C. The irradiated films were kept in the atmosphere for six years, yet they can be bonded tightly as well. Dry- and wet-peel tests indicate that two bonding elements can be suggested, hydrogen bonding and chemical bonding. The films are bonded by these two elements at lower temperatures, but by the pure chemical bonding at higher temperatures. FTIR results on the non-irradiated, irradiated and bonded samples indicate that OH and COOH groups are created at the surface, they are responsible for the hydrogen and chemical bondings. Dehydrated condensation reaction is proposed for the chemical bonding. It is briefly mentioned on two origins for the long lifetime of irradiated active surface.

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SUZUKI, Yutaka, Takashi SAITO, and Yutaka ABE. "Microchannel Heat Exchanger Fabricated with Diffusion Bonding." Journal of the Japan Society for Technology of Plasticity 52, no. 603 (2011): 434–38. http://dx.doi.org/10.9773/sosei.52.434.

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Rathi, Shraddha, B. Chittaranjan, Hari Parkash, and Akshaya Bhargava. "Oxidation heat treatment affecting metal-ceramic bonding." Indian Journal of Dental Research 22, no. 6 (2011): 877. http://dx.doi.org/10.4103/0970-9290.94664.

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Liu, Zhao, Alexander Kraemer, Kai F. Karhausen, Holger Aretz, Marco Teller, and Gerhard Hirt. "A New Coupled Thermal Stress FE-Model for Investigating the Influence of Non-Isothermal Conditions on Bond Strength and Bonding Status of the First Pass in Roll Bonding." Key Engineering Materials 767 (April 2018): 301–8. http://dx.doi.org/10.4028/www.scientific.net/kem.767.301.

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Roll bonding is a joining-by-forming process to permanently join two or more layers of different materials by hot or cold rolling. One of the typical industrial applications is aluminium sheets for heat exchangers in automobiles. During roll bonding the layers are fed into the rolling stand with parallel surfaces. Due to the plastic deformation in the roll gap metallic bonds between the layers are achieved. Several theoretical models have been published to describe the process, e.g. Zhang & Bay. These models have mostly been developed for cold rolling and describe the bond strength based on surface enlargement, contact pressure and flow stress. Since these models are developed for cold rolling, they are not temperature depending. Heat exchange is usually neglected and de-bonding after the roll gap is not accounted for. However, for hot roll bonding the above mentioned assumptions do not hold true. To understand the mechanisms of hot roll bonding industrial and laboratory scale investigations have previously been conducted. Based on the findings a FE framework for hot roll bonding was developed. This FE framework accounts for the possibility of de-bonding after the roll gap but is restricted to isothermal conditions. However, for a roll bonding simulation it is essential to take the temperature influence into consideration. Therefore, this paper presents an extended version of the FE framework which accounts for temperature dependent material flow, compatible definition of thermal & mechanical interactions and bonding status related heat exchange. To verify the new features of the extended FE framework a roll bonding test case is employed. Mechanical and thermal interactions as well as the current flow stress are calculated in subroutines in order to enable a fully coupled thermal stress simulation. The results show that with this extended FE framework the influence of non-isothermal conditions on material flow and bonding status as well as the feedback effects of bonding status to heat exchange have been successfully integrated in hot roll bonding simulations. This fully coupled thermal stress simulation is the first step towards multi-pass roll bonding simulations.

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Oglezneva, Svetlana A., Maxim N. Kachenyuk, and Andrey A. Smetkin. "FGM Architecture with Heat-Resistant Properties." MATEC Web of Conferences 346 (2021): 02034. http://dx.doi.org/10.1051/matecconf/202134602034.

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A composite laminated heat-resistant material was manufactured by the method of spark plasma sintering. The architecture of a bonding layer between a substrate made of a heat-resistant superalloy and a ceramic coating containing sublayers of the intermetallic NiAl and a mixture of NiAl with 15 or 30 wt. % zirconia (8YSZ) is proposed. In a layered composite, the microhardness and thermal conductivity change monotonically on going from the substrate to the outer ceramic. The coefficient of linear thermal expansion of the bonding layer is close to that for ceramics in the operating temperature range.

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Mu, Guoqian, Wenqing Qu, Haiyun Zhu, Hongshou Zhuang, and Yanhua Zhang. "Low Temperature Cu/Ga Solid–Liquid Inter-Diffusion Bonding Used for Interfacial Heat Transfer in High-Power Devices." Metals 10, no. 9 (September 10, 2020): 1223. http://dx.doi.org/10.3390/met10091223.

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Interfacial heat transfer is essential for the development of high-power devices with high heat flux. The metallurgical bonding of Cu substrates is successfully realized by using a self-made interlayer at 10 °C, without any flux, by Cu/Ga solid-liquid inter-diffusion bonding (SLID), which can be used for the joining of heat sinks and power devices. The microstructure and properties of the joints were investigated, and the mechanism of Cu/Ga SLID bonding was discussed. The results show that the average shear strength of the joints is 7.9 MPa, the heat-resistant temperature is 200 °C, and the thermal contact conductance is 83,541 W/(m2·K) with a holding time of 30 h at the bonding temperature of 100 °C. The fracture occurs on one side of the copper wire mesh which is caused by the residual gallium. The microstructure is mainly composed of uniform θ-CuGa2 phase, in addition to a small amount of residual copper, residual gallium and γ3-Cu9Ga4 phase. The interaction product of Cu and Ga is mainly θ-CuGa2 phase, with only a small amount of γ3-Cu9Ga4 phase occurring at the temperature of 100 °C for 20 h. The process of Cu/Ga SLID bonding can be divided into three stages as follows: the pressurization stage, the reaction diffusion stage and the isothermal solidification stage. This technology can meet our requirements of low temperature bonding, high reliability service and interfacial heat transfer enhancement.

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Ren, Limei, Bei Li, Zhaoxiang Chen, Shan Gao, Yongqiang Quan, and Lihe Qian. "Interfacial Microstructure Analysis of AZ31 Magnesium Alloy during Plastic Deformation Bonding." Processes 9, no. 10 (October 19, 2021): 1857. http://dx.doi.org/10.3390/pr9101857.

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In this study, a plastic deformation process consisting of hot compression at 350 °C and heat treatment at 400 °C was performed to bond AZ31 magnesium alloy. Microstructural evolution around the bonding interface was systematically characterized to investigate the bonding process and clarify the bonding mechanism. When the plastic deformation strain reached 0.6, the bonding zone was full of fine dynamic recrystallized grains and the initial interface was eliminated. The post-heating treatments were conducted to achieve a sound interface bonding. The tensile tests and the corresponding fracture morphologies analysis indicated that the optimum holding time of heat treatment was 8 h. The interfacial bonding strength of the specimens holding for 8 h reached 164.7 MPa, an enhancement of about 9% compared with that of the specimens holding for 1 h. The microstructure analysis indicated that the bonding quality was affected by migration of the interfacial grain boundary (GB), the development of recrystallized grains and the evolution of interfacial oxides around the bonding area.

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Wan Yusoff, Wan Yusmawati, Azman Jalar, Norinsan Kamil Othman, and Irman Abdul Rahman. "Nanoindentation Study on Heat Treated Gold Wire Bonding." Materials Science Forum 857 (May 2016): 31–35. http://dx.doi.org/10.4028/www.scientific.net/msf.857.31.

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The effect of high temperature storage of gold ball bonds towards micromechanical properties has been investigated. Gold wire from thermosonic wire bonding exposed to high temperature storage at 150 °C for 10, 100 and 1000 hours. The nanoindentation test was used in order to evaluate the high temperature storage effect on wire bonding in more details and localized. Prior to nanoindentation test, the specimens were cross-sectioned diagonally. The constant load nanoindentation was performed at the center of gold ball bond to investigate the hardness and reduced modulus. The load-depth curve of nanoindentation for the high temperature storage gold wire has apparent the discontinuity during loading compared to as-received gold wire. The hardness value increased after subjected to high temperature storage. However, the hardness decreased when the storage period is extended. The decreasing in the hardness value may due to the grain size of Au metal which recrystallized after subjected to high temperature storage. The results obtained from nanoindentation is important in assessing the high temperature storage of wire bonding.

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Dissertations / Theses on the topic "Heat bonding"

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Dadgostari, Soheila. "Bone-bonding to alkali/heat treated titanium." Thesis, National Library of Canada = Bibliothèque nationale du Canada, 2000. http://www.collectionscanada.ca/obj/s4/f2/dsk1/tape4/PQDD_0028/MQ50336.pdf.

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Kato, Hirofumi. "Bonding of alkali-and heat-treated tantalum implants to bone." Kyoto University, 2001. http://hdl.handle.net/2433/150541.

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Kawai, Toshiyuki. "Bone-bonding properties of Ti metal subjected to acid and heat treatments." Kyoto University, 2013. http://hdl.handle.net/2433/174787.

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Nishiguchi, Shigeru. "Bone-bonding Abilities of Alkali- and Heat-treated Titanium and Titaniumu Alloys." Kyoto University, 2000. http://hdl.handle.net/2433/180814.

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Cristescu, Carmen. "Bonding veneers using only heat and pressure : focus on bending and shear strength /." Luleå, 2008. http://epubl.luth.se/1402-1757/2008/43.

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Peksen, Murat. "Numerical modelling of nonwoven thermal bonding process & machinery." Thesis, Loughborough University, 2008. https://dspace.lboro.ac.uk/2134/14703.

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Nonwoven-fabrics have been in use since 1930s. Their advantages over other web fonnation methods like knitting and weaving have attracted many industries such as aerospace, automotive, sports, geotextiles, composites, battery separators etc. to explore and increase their usage. During nonwoven manufacturing, most of the laid loose webs have an insufficient strength as fonned, and require an additional bonding procedure in order to provide the produced nonwoven with its intended properties. To achieve the desired properties of the nonwoven web, the bonding process is therefore, the most important part during production. The thennal bonding through air is one of the modem techniques which is incrementally improved to increase the yield of manufactured nonwoven properties. The system has a disadvantage which is, that the production capacity and energy efficiency is very low. The entitled research aims an industrial optimisation of the thermal bonding through air by entailing a strategic approach and encompassing the whole process chain of the thennal bonding process. The comprehensive and flexible optimisation opportunities provided by the CFD has been used to aid in the control and optimisation of the thermal bonding process and machinery. To optimise the process and product quality, the complex system composing of several components and various physical phenomena occurring during processing is simulated using a hierarchical methodology. More specifically a hierarchical decomposition procedure to recast the original multi scale problem as a sequence of three scale decoupled macro-, meso-, and micro scale subproblems is exploited. The methodology is applied in conjunction with the validation of experiments on through-air bonding product lines. 2D and 3D computational fluid dynamics (CFD) models based on the continuum modelling approach and the theory of porous media coupled with the theory of mixtures are developed to treat the flow behavior, heat transfer, phase change and air moisture transport within the whole through-air bonding system. The model is concluded to be an economic computational tool hence providing rapid process optimisation and valuable infonnation early in the process, which can replace costly experiments and ensure product consistency under variable process and climate conditions. 2D and 3D hybrid modelling considering parametric discrete and continuum parts is also perfonned using conjugate heat transfer analyses. The approach precisely permits the optimisation of the machine component design and the associated optimisation of consistent process and product properties.

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Alobaid, Baleegh. "SYNTHESIS AND CHARACTERIZATION OF MAGNESIUM - TITANIUM COMPOSITES BY SEVERE PLASTIC DEFORMATION." UKnowledge, 2018. https://uknowledge.uky.edu/cme_etds/91.

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Magnesium alloys are widely used in engineering applications, including aerospace and automobile industries, due to their desirable properties, such as lower density, high damping capacity, relatively high thermal conductivity, good machinability, and recyclability. Researchers have, therefore, been developing new magnesium materials. However, mechanical and corrosion properties are still limiting many commercial applications of magnesium alloys. In this Ph.D. thesis research, I developed Mg-Ti composite materials to offer some solutions to further improve the mechanical behavior of magnesium, such as titanium-magnesium (Ti-Mg) claddings, Mg-Ti multilayers, and Ti particle enforced Mg alloys. Low cost manufacturing processes, such as hot roll-bonding (RB) and accumulative roll-bonding (ARB) techniques, were used to produce Mg-Ti composites and sheets. The microstructural evolution and mechanical properties of composites were investigated using optical microscopy (OM), X-ray diffraction (XRD), scanning electron microscopy (SEM), energy dispersive spectroscopy (EDS), electron backscatter diffraction (EBSD), nanoindentation, and tensile tests. In the first part of this study, I investigated the bonding strength of the AZ31/Ti to understand the mechanical properties of Mg/Ti composites. Using a single pass RB process, I fabricated AZ31/Ti multilayers with the thickness reduction in a range of 25% to 55%. The hot-rolled AZ31/Ti multilayers were heat-treated at 400 °C for 6, 12, and 24 hours, respectively, in an argon atmosphere. Tensile-shear tests were designed to measure the bonding strength between AZ31/Ti multilayers. Furthermore, the experimental results revealed good bonding of the AZ31/Ti multilayers without forming any intermetallic compounds in the as-rolled and heat-treated AZ31/Ti multilayers. The good bonding between Ti and AZ31 is the result of diffusion bonding whose thickness increases with increasing heat-treatment time and thickness reduction. The shear strength of the Ti/AZ31 multilayer increases with increasing bonding layer thickness. In the second part of this study, I characterized the microstructure and texture of three-layered Ti/AZ31/Ti clad sheets which were produced by single-pass hot rolling with a reduction of thickness 38% (sheet I) and 50% (sheet II). The AZ31 layer in sheets I and II exhibited shear bands and tensile twins {1012}⟨1001⟩ . The shear bands acted as local strain concentration areas which led to failure of the clad sheets with limited elongation. Heat treatment caused changes in the microstructure and mechanical properties of clad sheets due to static recrystallization (SRX) on twins and shear bands in the AZ31 layer. Recrystallized grains usually randomize the texture which causes weaken the strong deformed (0001) basal texture. Twins served as nucleation sites for grain growth during SRX. Tensile tests at room temperature showed significantly improved ductility of the clad sheets after heat treatment at 400°C for 12h. The results showed that the mechanical properties of clad sheets II are better than clad sheet I: The clad sheet II shows elongation 13% and 35% along the rolling direction (RD) for as-rolled and annealed clad sheet, respectively whereas the clad sheet I shows elongation 10% and 22% along RD for as-rolled and annealed clad sheet, respectively. In the final part of this study, I examined the effects of dispersed pure titanium particles (150 mesh) with 0, 2.3, 3.5, 4.9, and 8.6 wt. % on the microstructure and mechanical properties of AZ31-Mg alloy matrix. Mg-Ti composites were processed through three accumulative roll bonding (ARB) steps using thickness reductions of 50% in each pass followed by heat treatment at 400 °C for 12 h in an argon atmosphere. ARB is an efficient process to fabricate Mg-Ti composites. Mechanical properties of Mg- 0Ti and Mg-2.3Ti composite were enhanced by ~ 8% and 13 % in yield strength and ~ 30% and 32 % in ultimate tensile strength, respectively. Meanwhile, the elongation of the composites were decreased by 63% and 70%, respectively. After heat treatment, the results showed a decrease in yield strength and increase in elongation to fracture. The mechanical properties of the Mg-0 and Mg-2.3Ti composite were enhanced: ultimate tensile strength by 9% and 7%, and elongation by 40% and 67%, while the yield strength was decreased by 28% and 36% compared with the initial AZ31. Enhancements of strength and ductility were the results of two mechanisms: a random matrix texture by ARB and ductile titanium particle dispersion.

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Skiles, Jean Ann. "Chromic acid anodized Ti-6Al-4V: its characterization and its single lap bond strength to heat resistant adhesives." Diss., Virginia Polytechnic Institute and State University, 1987. http://hdl.handle.net/10919/53661.

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Anodized Ti-6Al-HV/adhesive bonds exhibit improved corrosion resistance and a higher strength-to-weight ratio compared to conventional metal bonding techniques for primary and/or secondary structural applications. This work was conducted to identify chromic acid (CA) anodization and bond process conditions which produced durable, structural anodized Ti-6Al-4V/heat resistant single lap bonds and to understand why these conditions were necessary. A structural single lap bond was defined as a bond tested at 298K ≤ 0.5 month after bonding and with a strength ≥ 6.9 MPa, based upon values reported in structural adhesive manufacturers' product literature. A durable, structural single lap bond was defined as a bond with a strength ≥ 6.9 MPa strength at 298K after 9 months aging at 433K. Heat resistant adhesives tested had reported service temperatures ≥ 423K, and were: polysulfone; eolyethersulfone; polyphenylquinoxaline; polyetherimide, both unfilled and 20% glass filled; and 50% calcium carbonate filled polyimide. Hydrofluoric acid (HF) added to the CA anodization solution was necessary to produce structural bonds. CA/HF oxide was more porous, and thicker than the CA anodic oxide (140 nm vs. 20 nm), perhaps promoting physical and oxide/adhesive interphase mechanical interlock. Structural, durable CA/HF anodized Ti-6Al-4V-adhesive bonds were produced for all adhesives tested except for the filled polyimide (5.5 MPa). The filler may have occluded oxide pores and prevented optimal adhesive/oxide interphase interlock, and there may have been competition of polyimide for calcium carbonate filler and for oxide. Average oxide thickness values of 65 to 410 nm did not affect bond strength; structural bonds were produced in all cases. CA/HF initial current density of 20 Amperes per square meter produced 33% stronger polysulfone bonds than 30 Amperes per square meter. Polysulfone microstructure may have been chemically degraded by the unnecessarily high fluoride concentration in the oxide from the higher current density. Lica® 44 titanate primer did not significantly influence bond strength or durability, except when unfilled polyetherimide was the adhesive. Polyphenylquinoxaline bond processing influenced bond strength. Structural bonds resulted for all the CA/HF anodization and process conditions described above. Single Iap bond fracture initiated in the adhesive (polymer) fillet. Fracture propagation in the bond overlap was through the polymer/anodic oxide interphase and/or cohesively in the polymer.
Ph. D.

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9

Tsukanaka, Masako. "Evaluation of bioactivity of alkali- and heat-treated titanium using fluorescent mouse osteoblasts." Kyoto University, 2014. http://hdl.handle.net/2433/188658.

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Fujibayashi, Shunsuke. "Bioactive titanium : Effect of sodium removal on the bone-bonding ability of bioactive titanium prepared by alkali and heat treatment." Kyoto University, 2003. http://hdl.handle.net/2433/148689.

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Books on the topic "Heat bonding"

1

Technology), International Conference on Diffusion Bonding (2nd 1990 Cranfield Institute of. Diffusion bonding 2. London: Elsevier Applied Science, 1991.

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2

Dadgostari, Soheila. Bone-bonding to alkali/heat treated titanium. [Toronto: University of Toronto, Faculty of Dentistry, 2000.

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Office, Energy Efficiency. A compact titanium heat exchanger made by superplastic forming and diffusion bonding. London: Dept of the Environment, 1994.

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Collins, Georgia Lee. Bonding with the heart: [Xi qing]. Taipei: Taiwan Power Co., 1998.

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Smith, Deborah DeMoss. Reflections of the Heart. New York: John Wiley & Sons, Ltd., 2004.

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Graham, Bernie. Creature comfort: Animals that heal. Amherst, N.Y: Prometheus Books, 2000.

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1955-, McCormick Marlena Deborah, ed. Horse sense and the human heart: What horses can teach us about trust, bonding, creativity, and spirituality. Deerfield Beach, FL: Health Communications, 1997.

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Guyer, Evelyn A. From the hand to heart: Bonding and relaxation techniques (B.A.R.T.) for individuals with combined auditory and visual impairments. [New York?]: E.A. Guyer, 1992.

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Whole heart, whole horse: Building trust between horse and rider. New York: Skyhorse Pub., 2009.

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United States. National Aeronautics and Space Administration., ed. Sulfur impurities and the microstructure of alumina scales. [Washington, DC]: National Aeronautics and Space Administration, 1997.

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Book chapters on the topic "Heat bonding"

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Ageorges, C., and L. Ye. "Heat Transfer in Fusion Bonding." In Engineering Materials and Processes, 65–103. London: Springer London, 2002. http://dx.doi.org/10.1007/978-1-4471-0171-0_3.

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Jackson, Mark J., and Michael P. Hitchiner. "Vitrified Bonding Systems and Heat Treatment." In High Performance Grinding and Advanced Cutting Tools, 45–93. New York, NY: Springer New York, 2012. http://dx.doi.org/10.1007/978-1-4614-3116-9_2.

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Mitolo, Massimo. "Grounding Systems and Interaction with Heat Networks." In Analysis of Grounding and Bonding Systems, 139–44. First edition. | Boca Raton : CRC Press, 2020.: CRC Press, 2020. http://dx.doi.org/10.1201/9780429329357-9.

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Kang, S. B., H. W. Kim, C. Y. Lim, and Z. P. Xing. "Microstructure and Mechanical Properties of Non-Heat Treatable Aluminum Alloys Produced by Accumulative Roll Bonding Process." In Ultrafine Grained Materials II, 661–68. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2013. http://dx.doi.org/10.1002/9781118804537.ch74.

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Roth, Martin, and C. Wortman. "Relaxation of Shot Peening Residual Stresses in the 7050-T7451 Aluminium Alloy after Heat Cycles for Adhesive Bonding." In Shot Peening, 208–14. Weinheim, FRG: Wiley-VCH Verlag GmbH & Co. KGaA, 2006. http://dx.doi.org/10.1002/3527606580.ch28.

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Gong, H. F., and T. M. Shao. "Influence of Heat Treatment on Hardness, Elastic Modulus and Bonding Strength of Ti/Ta/TiN/TaN Nanomultilayer Coatings." In Advanced Tribology, 808–11. Berlin, Heidelberg: Springer Berlin Heidelberg, 2009. http://dx.doi.org/10.1007/978-3-642-03653-8_268.

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Zejun, Chen, Chen Quanzhong, Kawunga Nyirenda, and Liu Qing. "The Effect of Heat Treatment Technology on Mechanical Properties of Al/Al Alloys Multilayer Sheet Fabricated by Hot Roll Bonding." In ICAA13 Pittsburgh, 1705–11. Cham: Springer International Publishing, 2012. http://dx.doi.org/10.1007/978-3-319-48761-8_255.

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Zejun, Chen, Chen Quanzhong, Kawunga Nyirenda, and Liu Qing. "The Effect of Heat Treatment Technology on Mechanical Properties of Al/Al Alloys Multilayer Sheet Fabricated by Hot Roll Bonding." In ICAA13: 13th International Conference on Aluminum Alloys, 1705–11. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2012. http://dx.doi.org/10.1002/9781118495292.ch255.

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"Bonding of Heat-Treated Spruce with Phenol-Formaldehyde Adhesive." In Wood Adhesives, 221–34. CRC Press, 2011. http://dx.doi.org/10.1201/b12180-18.

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"Lasers." In Using Lasers as Safe Alternatives for Adhesive Bonding, 99–135. IGI Global, 2020. http://dx.doi.org/10.4018/978-1-7998-4634-5.ch005.

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This chapter describes basic issues concerning lasers (i.e., the phenomenon of laser action, features of laser radiation, construction of laser devices, and various types of lasers). Additionally, selected areas of laser applications in the modern industry were presented. Laser techniques related to the melting of the material, laser melting, various types of laser heat treatment, laser welding, drilling, cutting, and marking of materials with laser were discussed. In addition, laser strengthening techniques developed intensively in recent years and various additive manufacturing techniques using lasers were presented. The advantages and disadvantages of laser processing were also specified in this chapter.

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Conference papers on the topic "Heat bonding"

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Valdes, Julio R., and Douglas D. Cortes. "Heat-Induced Bonding of Sands." In Geo-Congress 2014. Reston, VA: American Society of Civil Engineers, 2014. http://dx.doi.org/10.1061/9780784413272.361.

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Liu, Yuetao, Yanjie Liu, and Lining Sun. "Heat Affected Zone in the MEMS Wire Bonding." In 2009 International Conference on Measuring Technology and Mechatronics Automation. IEEE, 2009. http://dx.doi.org/10.1109/icmtma.2009.560.

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Dragomir, Alina, and Alexandra Luca. "Influence of the Heat Bonding on Air Permeability." In The 6th International Conference on Advanced Materials and Systems. INCDTP - Division: Leather and Footwear Research Institute, Bucharest, RO, 2016. http://dx.doi.org/10.24264/icams-2016.i.7.

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Kuball, Martin, and James W. Pomeroy. "Heat Transport across Interfaces for the Optimization of Heat Sinking in Device Applications." In 2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D). IEEE, 2021. http://dx.doi.org/10.1109/ltb-3d53950.2021.9598428.

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Chu, Rong-Shiuan, Yang Zhao, and Arun Majumdar. "Characterization of Carbon Nanotube Array Based Thermal Interface Material After Bonding Process." In 2010 14th International Heat Transfer Conference. ASMEDC, 2010. http://dx.doi.org/10.1115/ihtc14-22989.

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Vertically Aligned Carbon Nanotube (CNT) Arrays are promising to use as advanced thermal interface material. While possessing high thermal conductivity for an individual tube, carbon nanotube array based thermal interface materials (TIMs) fell short of expectations due to poor CNTs-target surface contacts. Investigations suggested that the overall resistance can be potentially reduced to less than 1 m2-K/MW by increasing the number of tubes to target surface contacts. This paper use chromium/gold/indium assisted thermal pressure-bonding to enhance contacts. A CNT array with 12.7% areal density was bonded to an experimental glass surface with 2-μm indium bonding layer and 10 nm-chromium/150 nm-gold adhesion layers under pressure of 196 KPa and temperature of 350 °C. Phase sensitive photothermal reflectance method was used for thermal measurement. The overall resistance, including CNTs-glass contact resistance and effective CNT array thermal resistance, is 1.1 m2-K/MW ± 27%. Although the contact resistance was reduced to 0.39 m2-K/MW ± 15%, the effective thermal conductivity of the post-bonded 80 μm long CNTs was 114 W/m-K ± 22%, which was lower than the expected lower bound of the thermal conductivity of 12.7% filled CNT array. It was suggested that the deformation of CNT array after mechanical bonding reduced its performance.

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Li, Xiuqing. "Development and Qualification of Diffusion Bonding Procedures for Microchannel Heat Exchangers." In ASME 2012 31st International Conference on Ocean, Offshore and Arctic Engineering. American Society of Mechanical Engineers, 2012. http://dx.doi.org/10.1115/omae2012-84007.

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One of the unique features of Heatric’s heat exchangers is to join flat metal plates through diffusion bonding. Extensive work has been carried out on developing and qualifying robust process procedures for manufacturing this type of heat exchanger. This paper discusses the important factors affecting diffusion bonding. These include material properties, surface preparation, bonding parameters (pressure, temperature, time and atmosphere) and post bond heat treatment. Material properties will focus on SS316L, 22Cr duplex and alloy 617. To get ASME approval for using diffusion bonding in the construction of heat exchangers (U stamp certification), the bonding procedure qualification tests must be carried out in accordance with the code requirements. As an example, results from 22Cr duplex test blocks are presented in this paper.

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Greenberg, T., H. Sang, and T. J. Lewis. "Mechanism of Roll Bonding of Aluminum Heat Exchanger Panels." In SAE International Congress and Exposition. 400 Commonwealth Drive, Warrendale, PA, United States: SAE International, 1986. http://dx.doi.org/10.4271/860077.

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Duckham, Alan, and Zhaojuan He. "Method for solder bonding CPV receiver to heat sink." In 2009 34th IEEE Photovoltaic Specialists Conference (PVSC). IEEE, 2009. http://dx.doi.org/10.1109/pvsc.2009.5411529.

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Oleksiienko, Serhii V., Oleh O. Novomlynets, and Svitlana M. Yushchenko. "Diffusion bonding technique concerning production of microchannel heat exchangers." In 2016 IEEE 36th International Conference on Electronics and Nanotechnology (ELNANO). IEEE, 2016. http://dx.doi.org/10.1109/elnano.2016.7493009.

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Veldman, Roger L., and Dennis J. VandenBrink. "Heat Transfer Finite Element Analysis of an Adhesive Bonding Process." In ASME 1995 Design Engineering Technical Conferences collocated with the ASME 1995 15th International Computers in Engineering Conference and the ASME 1995 9th Annual Engineering Database Symposium. American Society of Mechanical Engineers, 1995. http://dx.doi.org/10.1115/detc1995-0150.

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Abstract The finite element method was used to model an adhesive bonding process between a sheet of glass and a long strip of flexible PVC. The effect of the thickness of the PVC strip, the number of heat sources, the temperature of the heat sources, the size of the heat sources, and convection on the steady state temperature distribution in the adhesive layer was studied. The time required to reach the steady-state condition was also determined.

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Reports on the topic "Heat bonding"

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McAllister, J. E. Jr. Heat Transfer Characteristics of Mark 15 Slugs for Different Bonding Conditions. Office of Scientific and Technical Information (OSTI), August 2001. http://dx.doi.org/10.2172/785015.

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