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Journal articles on the topic 'Heat bonding'

Author: Grafiati
Published: 28 May 2022

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1

Jog, M. A., I. M. Cohen, and P. S. Ayyaswamy. "Heat Transfer in Wire Bonding Process." Journal of Electronic Packaging 116, no. 1 (March 1, 1994): 44–48. http://dx.doi.org/10.1115/1.2905492.

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We have analyzed an electric discharge between wire and planar electrodes with wire diameter and current densities that are typically used in upscaled experimental simulations of the wire bonding process employed in microelectronic manufacturing. A set of continuum conservation equations has been solved to obtain the variation of electric potential, temperature distributions, and the electrode heat fluxes. Results indicate that the main body of the discharge is quasineutral bounded by space charge sheaths at both electrodes. Strong electric fields are concentrated in the electrode sheaths. The heat flux to the wire is sharply peaked near the wire tip but on the plane it decays slowly away from the discharge axis. The model studied here may be used to establish optimum discharge parameters for wire bonding.
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2

Miller, Brett A., Thomas N. Ackerson, James T. Zellers, and Jennifer Breetz. "Inadvertent Diffusion Bonding During Heat Treatment." Journal of Failure Analysis and Prevention 13, no. 1 (December 11, 2012): 4–7. http://dx.doi.org/10.1007/s11668-012-9638-1.

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3

Yokura, Miyoshi, Kenichi Uehara, Guo Xiang, Kazuya Hanada, Yoshinobu Nakamura, Lakshmi Sanapa Reddy, Kazuhiro Endo, and Tamio Endo. "Ultralong Lifetime of Active Surface of Oxygenated PET Films by Plasma-irradiation and Bonding Elements." MRS Proceedings 1454 (2012): 201–6. http://dx.doi.org/10.1557/opl.2012.1128.

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ABSTRACTBiaxially oriented polyethylene terephthalate (PET) films can be bonded directly by oxygen plasma irradiation and low temperature heat press around 100°C. The irradiated films were kept in the atmosphere for six years, yet they can be bonded tightly as well. Dry- and wet-peel tests indicate that two bonding elements can be suggested, hydrogen bonding and chemical bonding. The films are bonded by these two elements at lower temperatures, but by the pure chemical bonding at higher temperatures. FTIR results on the non-irradiated, irradiated and bonded samples indicate that OH and COOH groups are created at the surface, they are responsible for the hydrogen and chemical bondings. Dehydrated condensation reaction is proposed for the chemical bonding. It is briefly mentioned on two origins for the long lifetime of irradiated active surface.
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4

SUZUKI, Yutaka, Takashi SAITO, and Yutaka ABE. "Microchannel Heat Exchanger Fabricated with Diffusion Bonding." Journal of the Japan Society for Technology of Plasticity 52, no. 603 (2011): 434–38. http://dx.doi.org/10.9773/sosei.52.434.

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5

Rathi, Shraddha, B. Chittaranjan, Hari Parkash, and Akshaya Bhargava. "Oxidation heat treatment affecting metal-ceramic bonding." Indian Journal of Dental Research 22, no. 6 (2011): 877. http://dx.doi.org/10.4103/0970-9290.94664.

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6

Liu, Zhao, Alexander Kraemer, Kai F. Karhausen, Holger Aretz, Marco Teller, and Gerhard Hirt. "A New Coupled Thermal Stress FE-Model for Investigating the Influence of Non-Isothermal Conditions on Bond Strength and Bonding Status of the First Pass in Roll Bonding." Key Engineering Materials 767 (April 2018): 301–8. http://dx.doi.org/10.4028/www.scientific.net/kem.767.301.

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Roll bonding is a joining-by-forming process to permanently join two or more layers of different materials by hot or cold rolling. One of the typical industrial applications is aluminium sheets for heat exchangers in automobiles. During roll bonding the layers are fed into the rolling stand with parallel surfaces. Due to the plastic deformation in the roll gap metallic bonds between the layers are achieved. Several theoretical models have been published to describe the process, e.g. Zhang & Bay. These models have mostly been developed for cold rolling and describe the bond strength based on surface enlargement, contact pressure and flow stress. Since these models are developed for cold rolling, they are not temperature depending. Heat exchange is usually neglected and de-bonding after the roll gap is not accounted for. However, for hot roll bonding the above mentioned assumptions do not hold true. To understand the mechanisms of hot roll bonding industrial and laboratory scale investigations have previously been conducted. Based on the findings a FE framework for hot roll bonding was developed. This FE framework accounts for the possibility of de-bonding after the roll gap but is restricted to isothermal conditions. However, for a roll bonding simulation it is essential to take the temperature influence into consideration. Therefore, this paper presents an extended version of the FE framework which accounts for temperature dependent material flow, compatible definition of thermal & mechanical interactions and bonding status related heat exchange. To verify the new features of the extended FE framework a roll bonding test case is employed. Mechanical and thermal interactions as well as the current flow stress are calculated in subroutines in order to enable a fully coupled thermal stress simulation. The results show that with this extended FE framework the influence of non-isothermal conditions on material flow and bonding status as well as the feedback effects of bonding status to heat exchange have been successfully integrated in hot roll bonding simulations. This fully coupled thermal stress simulation is the first step towards multi-pass roll bonding simulations.
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7

Oglezneva, Svetlana A., Maxim N. Kachenyuk, and Andrey A. Smetkin. "FGM Architecture with Heat-Resistant Properties." MATEC Web of Conferences 346 (2021): 02034. http://dx.doi.org/10.1051/matecconf/202134602034.

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A composite laminated heat-resistant material was manufactured by the method of spark plasma sintering. The architecture of a bonding layer between a substrate made of a heat-resistant superalloy and a ceramic coating containing sublayers of the intermetallic NiAl and a mixture of NiAl with 15 or 30 wt. % zirconia (8YSZ) is proposed. In a layered composite, the microhardness and thermal conductivity change monotonically on going from the substrate to the outer ceramic. The coefficient of linear thermal expansion of the bonding layer is close to that for ceramics in the operating temperature range.
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8

Mu, Guoqian, Wenqing Qu, Haiyun Zhu, Hongshou Zhuang, and Yanhua Zhang. "Low Temperature Cu/Ga Solid–Liquid Inter-Diffusion Bonding Used for Interfacial Heat Transfer in High-Power Devices." Metals 10, no. 9 (September 10, 2020): 1223. http://dx.doi.org/10.3390/met10091223.

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Interfacial heat transfer is essential for the development of high-power devices with high heat flux. The metallurgical bonding of Cu substrates is successfully realized by using a self-made interlayer at 10 °C, without any flux, by Cu/Ga solid-liquid inter-diffusion bonding (SLID), which can be used for the joining of heat sinks and power devices. The microstructure and properties of the joints were investigated, and the mechanism of Cu/Ga SLID bonding was discussed. The results show that the average shear strength of the joints is 7.9 MPa, the heat-resistant temperature is 200 °C, and the thermal contact conductance is 83,541 W/(m2·K) with a holding time of 30 h at the bonding temperature of 100 °C. The fracture occurs on one side of the copper wire mesh which is caused by the residual gallium. The microstructure is mainly composed of uniform θ-CuGa2 phase, in addition to a small amount of residual copper, residual gallium and γ3-Cu9Ga4 phase. The interaction product of Cu and Ga is mainly θ-CuGa2 phase, with only a small amount of γ3-Cu9Ga4 phase occurring at the temperature of 100 °C for 20 h. The process of Cu/Ga SLID bonding can be divided into three stages as follows: the pressurization stage, the reaction diffusion stage and the isothermal solidification stage. This technology can meet our requirements of low temperature bonding, high reliability service and interfacial heat transfer enhancement.
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9

Ren, Limei, Bei Li, Zhaoxiang Chen, Shan Gao, Yongqiang Quan, and Lihe Qian. "Interfacial Microstructure Analysis of AZ31 Magnesium Alloy during Plastic Deformation Bonding." Processes 9, no. 10 (October 19, 2021): 1857. http://dx.doi.org/10.3390/pr9101857.

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In this study, a plastic deformation process consisting of hot compression at 350 °C and heat treatment at 400 °C was performed to bond AZ31 magnesium alloy. Microstructural evolution around the bonding interface was systematically characterized to investigate the bonding process and clarify the bonding mechanism. When the plastic deformation strain reached 0.6, the bonding zone was full of fine dynamic recrystallized grains and the initial interface was eliminated. The post-heating treatments were conducted to achieve a sound interface bonding. The tensile tests and the corresponding fracture morphologies analysis indicated that the optimum holding time of heat treatment was 8 h. The interfacial bonding strength of the specimens holding for 8 h reached 164.7 MPa, an enhancement of about 9% compared with that of the specimens holding for 1 h. The microstructure analysis indicated that the bonding quality was affected by migration of the interfacial grain boundary (GB), the development of recrystallized grains and the evolution of interfacial oxides around the bonding area.
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10

Wan Yusoff, Wan Yusmawati, Azman Jalar, Norinsan Kamil Othman, and Irman Abdul Rahman. "Nanoindentation Study on Heat Treated Gold Wire Bonding." Materials Science Forum 857 (May 2016): 31–35. http://dx.doi.org/10.4028/www.scientific.net/msf.857.31.

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The effect of high temperature storage of gold ball bonds towards micromechanical properties has been investigated. Gold wire from thermosonic wire bonding exposed to high temperature storage at 150 °C for 10, 100 and 1000 hours. The nanoindentation test was used in order to evaluate the high temperature storage effect on wire bonding in more details and localized. Prior to nanoindentation test, the specimens were cross-sectioned diagonally. The constant load nanoindentation was performed at the center of gold ball bond to investigate the hardness and reduced modulus. The load-depth curve of nanoindentation for the high temperature storage gold wire has apparent the discontinuity during loading compared to as-received gold wire. The hardness value increased after subjected to high temperature storage. However, the hardness decreased when the storage period is extended. The decreasing in the hardness value may due to the grain size of Au metal which recrystallized after subjected to high temperature storage. The results obtained from nanoindentation is important in assessing the high temperature storage of wire bonding.
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11

Chen, Bin, Haitao Zhu, Kehan Zhao, Yanyu Song, Duo Liu, and Xiaoguo Song. "Effect of bonding time on the microstructure and mechanical properties of graphite/Cu-bonded joints." REVIEWS ON ADVANCED MATERIALS SCIENCE 60, no. 1 (January 1, 2021): 957–65. http://dx.doi.org/10.1515/rams-2021-0071.

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Abstract The increasing serious heat dissipation problem faced by electronic equipment used in airplanes makes studies on new heat dissipation components urgent. The diffusion bonding of graphite and Cu was successfully realized by a Ti/Ag/Nb interlayer at the bonding conditions applied (850°C, 4 MPa with bonding time varying from 30 to 90 min). The influence of bonding time on the microstructure and mechanical properties of the joints was studied. When the bonding time was 30 min, the typical microstructure of the joints was as follows: graphite/TiC reaction layer/residual Ti layer/Ti2Ag layer/TiAg/Ti[Ag,Nb]/Cu. As the bonding time increased, the thickness of the residual Ti layer decreased, whereas the thickness of the Ti[Ag,Cu] layer increased. When the bonding time was extended to 90 min, Ti–Cu intermetallic compounds were detected adjacent to the Cu. The shear strength showed an increasing trend with the extension of the bonding time. When the bonding time was 90 min, the maximum shear strength of the joints was 13.4 MPa.
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12

Mao, Zhentao, and Bhuvenesh C. Goswami. "Studies on the Process of Ultrasonic Bonding of Nonwovens: Part 1 — Theoretical Analysis." International Nonwovens Journal os-10, no. 2 (June 2001): 1558925001OS—01. http://dx.doi.org/10.1177/1558925001os-01000210.

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A model has been developed to predict the bonding behavior of nonwovens during the ultrasonic bonding process. The model includes the following subprocesses: mechanics and vibrations of the web and horn, viscoelastic behavior of webs and heat generation, and heat transfer. Each subprocess was modeled first and then combined together with the boundary conditions to develop an overall process model. The compressional behavior and thermal conductivity of webs will be discussed and their appropriate equations have been chosen for model. A Finite Element Method (FEM) was used to solve the above coupled model. Subsequently, the heat generation rate and the temperature change during the bonding process were calculated.
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13

Nakahashi, Masako, Tatsuo Yamazaki, Hiromitsu Takeda, and Masakatsu Haga. "Transient Liquid Phase Bonding for Heat Resistant Steels." Journal of the Japan Institute of Metals 49, no. 4 (1985): 285–90. http://dx.doi.org/10.2320/jinstmet1952.49.4_285.

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14

Ramalingam, T., P. Srinivas Yadav, and S. Bhaskar. "Shell on shell bonding of composite heat shield." Materials Today: Proceedings 5, no. 13 (2018): 27155–60. http://dx.doi.org/10.1016/j.matpr.2018.09.025.

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15

Hamilton, S. "A New Adhesive System for Heat Sink Bonding." Circuit World 17, no. 2 (January 1991): 16–17. http://dx.doi.org/10.1108/eb046122.

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16

SUN, Li-ning, Yue-tao LIU, and Yan-jie LIU. "Factors governing heat affected zone during wire bonding." Transactions of Nonferrous Metals Society of China 19 (September 2009): s490—s494. http://dx.doi.org/10.1016/s1003-6326(10)60095-7.

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17

ISHII, Kosuke, Masashi KOYAMA, Hiroshi HATTA, Ichiro SHIOTA, and Ken GOTO. "10112 Heat-resistant bonding between C/C substrates." Proceedings of Conference of Kanto Branch 2005.11 (2005): 205–6. http://dx.doi.org/10.1299/jsmekanto.2005.11.205.

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18

Shariza, S., T. Joseph Sahaya Anand, A. R. M. Warikh, Lee Cher Chia, Chua Kok Yau, and Lim Boon Huat. "Bond strength evaluation of heat treated Cu-Al wire bonding." Journal of Mechanical Engineering and Sciences 12, no. 4 (December 27, 2018): 4275–84. http://dx.doi.org/10.15282/jmes.12.4.2018.21.0367.

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Bond strength evaluation of wire bonding in microchips is the key study in any wire bonding mechanism. The quality of the wire bond interconnection relates very closely to the reliability of the microchip during performance of its function in any application. In many reports, concerns regarding the reliability of the microchip are raised due to formation of void at the wire-bond pad bonding interface, predominantly after high temperature storage (HTS) annealing conditions. In this report, the quality of wire bonds prepared at different conditions, specifically annealed at different HTS durations are determined by measurements of the strength of the interface between the bond wire and the bond pad. The samples are tested in pull test and bond shear test. It was observed that the higher bonding temperature as well as the longer duration of HTS increased the bond strength. This is represented through the analysis of the measurements of ball shear strength. This is due to the fact that higher bonding temperature and longer HTS promoted better growth of the Cu-Al IMC layer. A transmission electron microscopy - energy dispersive X-ray analysis (TEM-EDX) has been carried out to observe the formation of the Cu-Al IMC layer in the sample.
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19

Wada, Hiroshi, and Takeshi Kamijoh. "Effects of Heat Treatment on Bonding Properties in InP-to-Si Direct Wafer Bonding." Japanese Journal of Applied Physics 33, Part 1, No. 9A (September 15, 1994): 4878–79. http://dx.doi.org/10.1143/jjap.33.4878.

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20

Fukuzawa, Yasushi, Shigeru Nagasawa, Masahiro Watanabe, and Shigehiko Takaoka. "Joining of Tungsten-Copper Using Pulse Electric Current Sintering Method." Materials Science Forum 502 (December 2005): 443–48. http://dx.doi.org/10.4028/www.scientific.net/msf.502.443.

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To develop the new bonding method under low bonding temperature and short holding duration, pulse electric current sintering (PECS) method is applied. The Ni plating layer was used as the interlayer. The following experimental factors were researched:(1) Thickness of Ni plating layer, (2) Bonding temperature, (3) Bonding pressure and (4) Heat treatment after plating. The bonding strength of W-Ni plate-Cu joint could be obtained under low bonding temperature of 773 K and short bonding duration of 10 min.
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21

Wang, Guo Wei, Ze Hua Zhou, Ze Hua Wang, Han Liu, Jia Shao, Yu Yi, and Xin Zhang. "Influence of Air Heat Treatment on Bonding Strength and Microstructure of Al2O3-13wt%TiO2/NiCrAl Coating." Materials Science Forum 817 (April 2015): 158–63. http://dx.doi.org/10.4028/www.scientific.net/msf.817.158.

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Owing to typical weaknesses of Al2O3-13wt%TiO2/NiCrAl coating (AT13), appropriate air heat treatment is an effective method in improving the bonding strength and microstructure of AT13. AT13 was air heat-treated with varying holding times and cooling methods. The aims are not only to ascertain the changes of the bonding strength and micro-structure of AT13 under various conditions, but also to understand the influence of holding time and cooling method on the bonding strength and microstructure of the coating. The experimental results showed that the best bonding strength and lowest porosity of AT13 were obtained using proper heat treatment of heating up to 560°C for 6 h along with two-step cooling. The two-step cooling is better than normal furnace cooling in improving properties of the coating, which is attributed to the densification of AT13 and release of residual stress.
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22

Kim, Kyung Hoon, Sung Chul Lim, and Hyouk Chon Kwon. "The Effects of Heat Treatment on the Bonding Strength of Surface-Activated Bonding (SAB)-Treated Copper-Nickel Fine Clad Metals." Materials Science Forum 654-656 (June 2010): 1932–35. http://dx.doi.org/10.4028/www.scientific.net/msf.654-656.1932.

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Surface activated bonding (SAB) is a novel method for the precise joining of dissimilar materials. It is based on the concept that two atomically clean solid surfaces can develop a strong adhesive force between them when they are brought into contact at high vacuum condition without high deformation at a 40~90%. With this SAB process, the effects of heat treatment on the bonding strength of surface-activated bonding (SAB)-treated copper-nickel fine clad metals were investigated. An increase in the SAB rolling load of the copper-nickel fine clad metals increased the peel strength after heat treatment, indicating that increases in the SAB rolling load decreased the interface voids formed by initial micro-range surface roughness between the clad materials in the SAB cladding process. Unlike conventional cold rolling, outstanding interface diffusion between the clad materials was not observed after heat treatment. In addition, the peel strength increase of the clad metals compare with initial peel strength increased with SAB rolling load (<1% reduction ratio at a roll load of 5000 kgf ) up to 3.99 N/mm after heat treatment.
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23

Wang, Ming Zhi, Liang Sheng Qiu, Liang Hu Cheng, Xiang Liu, Jian Shao, Xin Cao, Tao Sha Song, Han Tao Kou, and Jie Tao. "Fabrication of Al/Ni Multilayer Composite by Electrodeposition and Hot Press Bonding and Investigation of its Bending Property." Key Engineering Materials 793 (January 2019): 3–8. http://dx.doi.org/10.4028/www.scientific.net/kem.793.3.

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The Al/Ni multilayer composite with highly exothermic reactions and good plasticity was fabricated by electrodeposition and hot press bonding process. The Al/Ni multilayer composite consisted of the microscale Al and Ni layers. The Ni layers were electroplated on Al foils for a certain time and DC current, and then a mounts of deposited foils were stacked and combined as a whole bulk Al/Ni multilayer composite. In this study, the microstructure evolution, phase transformation, exothermic heat and bending property of the Al/Ni multilayer composite during various hot press bonding were studied by SEM, XRD, DSC and bending test. Under the hot press bonding condition of 400°C and 1h, the exothermic heat, the bending strength and the bending displacement reached 916J/g, 614.5MPa and 4mm, respectively. The results showed that by the increasing time of hot press bonding, the bending displacement of the Al/Ni multilayer composite improved firstly and then declined sharply. It was also found that when the time of hot press bonding increased, the bending strength and the exothermic heat decreased simultaneously, owing to the nucleation and growth of the Al3Ni phases in the interfaces between Al and Ni layers.
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24

Pokorný, Václav, Vojtěch Štejfa, Květoslav Růžička, and Ctirad Červinka. "Decay of hydrogen bonding in mixtures of aliphatic heptanols and bistriflimide ionic liquids." Physical Chemistry Chemical Physics 23, no. 47 (2021): 26874–86. http://dx.doi.org/10.1039/d1cp03717j.

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There is a distinct hierarchy of hydrogen bonding strength and stability among various constituent isomers of heptanol. The presence of aprotic ionic liquids affects hydrogen bonding similarly to a significant temperature increase. Decay of this hydrogen bonding propagates curious shapes due to the excess heat capacity of these mixtures.
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25

Liu, Yang, Fenglian Sun, Cadmus A. Yuan, and Guoqi Zhang. "Thermal analysis of chip-on-flexible LED packages with Cu heat sinks by SnBi soldering." Microelectronics International 33, no. 1 (January 4, 2016): 42–46. http://dx.doi.org/10.1108/mi-04-2015-0034.

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Purpose – The purpose of this paper is to discuss the possibility of using soldering process for the bonding of chip-on-flexible (COF) light-emitting diode (LED) packages to heat sinks. The common bonding materials are thermal conductive adhesives. For thermal performance and reliability concerns, Tin-Bismuth (SnBi) lead-free solder paste was used for the connection of the COF packages and the Cu heat sinks by a soldering process in this study. Meanwhile, the geometrical effect of the SnBi solder layer on the thermal performance was also investigated. Design/methodology/approach – The effects of the bonding materials and the area of the solder layers on the thermal performance of the LED modules were investigated by finite element simulation and experimental tests. Findings – The SnBi soldered modules show much lower thermal resistance at the bonding layers than the adhesive-bonded LED module. Vertical heat transfer from the LED chips to the heat sinks is the primary heat dissipation mode for the SnBi soldered modules. Thus, the LED module with local solder layer shows similar LED thermal performance with the full-area soldered module. Meanwhile, the local soldering process decreases the possibility to form randomly distributed defects such as the large area voids and residue flux in the solder layers. Research limitations/implications – The research is still in progress. Further studies mainly focus on the reliability of the samples with different bonding materials. Practical implications – COF package is a new structure for LED packages. This study provides a comparison between SnBi solder and adhesive material on the thermal performance of the LED. Meanwhile, the authors optimized the geometrical design for the solder layer. The study provides a feasible bonding process for COF packages onto heat sinks. Originality/value – This study provides a soldering process for the COF LED packages. The thermal performance of the LED light source was improved significantly by the new process.
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26

Jahn, Simon, Felix Gemse, Udo Broich, and Sabine Saendig. "Efficient Diffusion Bonding of Large Scale Parts." Materials Science Forum 838-839 (January 2016): 500–505. http://dx.doi.org/10.4028/www.scientific.net/msf.838-839.500.

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Worldwide there is a trend to use diffusion bonding for more and more applications, for example for large scale micro channel heat exchangers and heat sinks. For large scaled parts there is only a limited range of systems commercially available today. One most important criterion for large scale diffusion bonding is a homogeneous load distribution. To achieve this, different concepts can be used, e.g. multiple supports around pressing plates or using very thick pressing plates. In the presentation an overview of bonded examples, made of different materials, is given as well as a detailed description of the used diffusion bonding systems. In addition, the methods for characterization of the systems and bonded parts are included as well.
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27

Rauter, Lukas, Johanna Zikulnig, Taulant Sinani, Hubert Zangl, and Lisa-Marie Faller. "Evaluation of Standard Electrical Bonding Strategies for the Hybrid Integration of Inkjet-Printed Electronics." Electronic Materials 1, no. 1 (August 30, 2020): 2–16. http://dx.doi.org/10.3390/electronicmat1010002.

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Different conductive bonding strategies for the hybrid integration of flexible, inkjet-printed electronics are investigated. The focus of the present work lies on providing a practical guide comprising standard techniques that are inexpensive, easily implementable and frequently used. A sample set consisting of identical conductive test structures on different paper and plastic substrates was prepared using silver (Ag) nanoparticle ink. The sintered specimens were electrically contacted using soldering, adhesive bonding and crimping. Electrical and mechanical characterization before and after exposing the samples to harsh environmental conditions was performed to evaluate the reliability of the bonding methods. Resistance measurements were done before and after connecting the specimens. Afterwards, 85 °C/85% damp-heat tests and tensile tests were applied. Adhesive bonding appears to be the most suitable and versatile method, as it shows adequate stability on all specimen substrates, especially after exposure to a 85 °C/85% damp-heat test. During exposure to mechanical tensile testing, adhesive bonding proved to be the most stable, and forces up to 12 N could be exerted until breakage of the connection. As a drawback, adhesive bonding showed the highest increase in electrical resistance among the different bonding strategies.
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28

Dai, Jiahong, Bin Jiang, Qiong Yan, Hongmei Xie, Zhongtao Jiang, Qingshan Yang, Qiaowang Chen, Cheng Peng, and Fusheng Pan. "Microstructures and Mechanical Properties of Mg-9Al/Ti Metallurgical Bonding Prepared by Liquid-Solid Diffusion Couples." Metals 8, no. 10 (September 29, 2018): 778. http://dx.doi.org/10.3390/met8100778.

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Microstructures and mechanical properties of Mg-9Al/Ti metallurgical bonding prepared by liquid-solid diffusion couples were investigated. The results indicate that a metallurgical bonding was formed at the interface Mg-9Al/Ti, and the Mg17Al12 phase growth coarsening at the interfaces with the increase in heat treatment time. Push-out testing was used to investigate the shear strength of the Mg-9Al/Ti metallurgical bonding. It is shown that the shear strength presents an increasing tendency with the increased heat treatment time. The sequence is characterized, and the results show that the fracture takes place along the Mg-9Al matrix at the interface. The diffusion of Al and Ti elements play a dominant role in the interface reaction of Mg-9Al/Ti metallurgical bonding. By energy-dispersive spectroscopy (EDS), X-ray diffraction (XRD) and thermodynamic analysis, it was found that Al3Ti is the only intermetallic compound at the interface of Mg-9Al/Ti metallurgical bonding. These results clearly show that chemical interaction at the interface formation of Al3Ti improves the mechanical properties of Mg-9Al/Ti metallurgical bonding.
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29

ONODERA, Masanori, and Tadatomo SUGA. "The Influence of the Heat after Bonding on the Separability at Gold Wire Bonding Area." Journal of Japan Institute of Electronics Packaging 6, no. 1 (2003): 68–72. http://dx.doi.org/10.5104/jiep.6.68.

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30

Zhang, Feng, Chuan Qi Hu, Shi Chao Zhang, Hao Ran Sun, Yuan Tian, Xian Kai Sun, Kai Fang, Da Chen Yan, and Yu Feng Chen. "Effect of B4C and SiO2 on Bond Property for Phenolic Resin-Based Adhesive." Solid State Phenomena 281 (August 2018): 959–63. http://dx.doi.org/10.4028/www.scientific.net/ssp.281.959.

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In this paper, the modified phenolic resin-based adhesive was prepared by dissolving different components. After low temperature curing, SiC samples were bonded by the binder. The samples were treated at different temperatures (400°C, 800°C, 1200°C, 1500°C) under an inert atmosphere. The bonding strength of samples was tested after heat treatment at room temperature. The results showed that the bonding strength of the B4C modified phenolic resin (PF) based adhesive is the highest. When the heat treatment temperature was above 1200°C, the bond strength increased with the additive amount of boron carbide at room temperature. The microstructures of the samples were observed by optical microscope and scanning electron microscope. The effects of the modified filler and heat treatment temperature on the bonding strength of the phenolic resin based adhesive were investigated. The bonding strength of boron carbide-modified phenolic resin-based binder was tested under high temperature. It was found that the bond strength at high temperature was lower than that at room temperature, and the bond strength decreased with the increase of temperature.
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31

TOKURA, Hitoshi, and Masanori YOSHIKAWA. "Heat treatment of diamond grains for bonding strength improvement." Journal of the Japan Society for Precision Engineering 53, no. 4 (1987): 595–600. http://dx.doi.org/10.2493/jjspe.53.595.

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32

Krishnan, J., K. Bhanumurthy, P. S. Gawde, J. Derose, G. B. Kale, and G. Srikrushnamurthy. "Manufacture of a matrix heat exchanger by diffusion bonding." Journal of Materials Processing Technology 66, no. 1-3 (April 1997): 85–89. http://dx.doi.org/10.1016/s0924-0136(96)02499-5.

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33

Dilik, Tuncer, and Salim Hiziroglu. "Bonding strength of heat treated compressed Eastern redcedar wood." Materials & Design 42 (December 2012): 317–20. http://dx.doi.org/10.1016/j.matdes.2012.05.050.

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34

TAJIMA, T. "New type of zinc heat switch by diffusion bonding." Physica B: Condensed Matter 329-333 (May 2003): 1647–48. http://dx.doi.org/10.1016/s0921-4526(02)02440-7.

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35

Kariz, Mirko, and Milan Sernek. "Bonding of Heat-Treated Spruce with Phenol-Formaldehyde Adhesive." Journal of Adhesion Science and Technology 24, no. 8-10 (January 2010): 1703–16. http://dx.doi.org/10.1163/016942410x507768.

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36

Losego, Mark D., Martha E. Grady, Nancy R. Sottos, David G. Cahill, and Paul V. Braun. "Effects of chemical bonding on heat transport across interfaces." Nature Materials 11, no. 6 (April 22, 2012): 502–6. http://dx.doi.org/10.1038/nmat3303.

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37

Vesborg, Peter C. K., Jakob L. Olsen, Toke R. Henriksen, Ib Chorkendorff, and Ole Hansen. "Note: Anodic bonding with cooling of heat-sensitive areas." Review of Scientific Instruments 81, no. 1 (January 2010): 016111. http://dx.doi.org/10.1063/1.3277117.

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38

Tokura, Hitoshi, and Masanori Yoshikawa. "Heat treatment of diamond grains for bonding strength improvement." Journal of Materials Science 24, no. 6 (June 1989): 2231–38. http://dx.doi.org/10.1007/bf02385446.

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39

Sernek, Milan, Michiel Boonstra, Antonio Pizzi, Aurelien Despres, and Philippe Gérardin. "Bonding performance of heat treated wood with structural adhesives." Holz als Roh- und Werkstoff 66, no. 3 (December 14, 2007): 173–80. http://dx.doi.org/10.1007/s00107-007-0218-0.

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40

Ciardiello, Raffaele. "The Mechanical Performance of Re-Bonded and Healed Adhesive Joints Activable through Induction Heating Systems." Materials 14, no. 21 (October 24, 2021): 6351. http://dx.doi.org/10.3390/ma14216351.

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This work aims to study the healing potential properties of a reversible thermoplastic adhesive. The adhesive is activable by using induction heating systems that can induce thermal heat in the particles throughout the electromagnetic field so they can melt the adhesive for bonding or separation procedures. The healing procedure consists of damaging single lap joint (SLJ) specimens with quasi-static and fatigue tests and then using an inductor to generate an electromagnetic field able to heat the adhesive to its melting point in order to heal the damaged SLJ specimens. SLJ tests were performed on damaged and healed specimens to assess, respectively, the residual mechanical properties of the damaged specimens and the mechanical properties after healing. SLJ tests showed that the healing procedure can completely recover the joint stiffness of the damaged adhesive joints, a huge part of the maximum shear strength and the SLJ absorbed energy. This work shows also the possibility of re-bonding completely failed or separated SLJs by using the same procedure. The mechanical properties of SLJs after healing and re-bonding are compared to the SLJ compared on virgin specimens to assess the recovered mechanical properties.
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41

Peng, Jun Song, Ying Jun Pan, and Heng Zhang. "The Influence of Heat Treatment on the Interface and Properties of Mo2FeB2 Cermets-Steel Clad Material." Applied Mechanics and Materials 541-542 (March 2014): 199–203. http://dx.doi.org/10.4028/www.scientific.net/amm.541-542.199.

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Using B, Mo, and Fe powders as raw materials, Mo2FeB2 cermets-steel clad material has been prepared on steel 45 substrate by means of in-situ reaction vacuum and liquid phase sintering technology, and the influence of heat treatment on microstructure and properties has been studied. The influence of heat treatment on microstructure, and distribution of elements of the cladding-substrate bonding interface area has been investigated by SEM, EDS. Results show that there is an excellent metallurgic bonding between the cladding layer and steel substrate both before and after heat treatment, and heat treatment not only brings the cladding material grain size and microstructure refinement but also increases the thickness of the transition layer.
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42

Roh, J. W., J. S. Yang, S. H. Ok, Deok Ha Woo, Young Tae Byun, Young Min Jhon, Tetsuya Mizumoto, Woo Young Lee, and Seok Lee. "Low Temperature O2 Plasma-Assisted Wafer Bonding of InP and a Garnet Crystal for an Optical Waveguide Isolator." Solid State Phenomena 124-126 (June 2007): 475–78. http://dx.doi.org/10.4028/www.scientific.net/ssp.124-126.475.

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A novel process of wafer bonding between InP and a garnet crystal (Gd3Ga5O12, CeY2Fe5O12) based on O2 plasma surface-activation and low temperature heat treatment is presented. The O2 plasma assisted wafer bonding process was found to be very effective in bonding of InP and Gd3Ga5O12, providing good bonding strength and hydrophilicity as well as no voids in the interface, which is crucial for fabrication of an integrated optical waveguide isolator. The isolation ratio of an integrated optical waveguide isolator fabricated by the O2 plasma assisted wafer bonding process was obtained to be 2.9 dB.
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43

Hossain, M., M. Acar, and W. Malalasekera. "Modelling of the Through-air Bonding Process." Journal of Engineered Fibers and Fabrics 4, no. 2 (June 2009): 155892500900400. http://dx.doi.org/10.1177/155892500900400202.

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A computational fluid dynamics (CFD) modelling of the through-air bonding process of nonwoven fabric production is reported in this article. In the through-air process, hot air is passed through the fibrous web to heat and melt polymer fibers. Molten polymer subsequently flows to the point of contact between any two fibers to produce a bond. Two different modelling strategies are adapted to produce a comprehensive understanding of the through-air bonding process. In macroscale modelling, a CFD model is developed treating the whole web as a porous media in order to investigate the effect of process parameters. Results reveal that the time required to heat and melt the fibers decreases with the increasing porosity of the web and the velocity of hot air. The CFD modelling technique is then used to analyze the bonding process at a more fundamental level by considering the bonding of individual fibers at microscale. The effects of the fiber diameter, bonding temperature and contact angle between two fibers on the bonding time are investigated. Results show that the time required to bond fibers is weakly related to bonding temperature and fiber diameter. Fiber orientation angle, on the other hand, has significant effect on the progression of bond formation.
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44

Zhang, Chengcong, and Amir Shirzadi. "Fail-Safe Joints between Copper Alloy (C18150) and Nickel-Based Superalloy (GH4169) Made by Transient Liquid Phase (TLP) Bonding and Using Boron-Nickel (BNi-2) Interlayer." Metals 11, no. 10 (September 23, 2021): 1504. http://dx.doi.org/10.3390/met11101504.

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Joining heat conducting alloys, such as copper and its alloys, to heat resistant nickel-based superalloys has vast applications in nuclear power plants (including future fusion reactors) and liquid propellant launch vehicles. On the other hand, fusion welding of most dissimilar alloys tends to be unsuccessful due to incompatibilities in their physical properties and melting points. Therefore, solid-state processes, such as diffusion bonding, explosive welding, and friction welding, are considered and commercially used to join various families of dissimilar materials. However, the solid-state diffusion bonding of copper alloys normally results in a substantial deformation of the alloy under the applied bonding load. Therefore, transient liquid phase (TLP) bonding, which requires minimal bonding pressure, was considered to join copper alloy (C18150) to a nickel-based superalloy (GH4169) in this work. BNi-2 foil was used as an interlayer, and the optimum bonding time (keeping the bonding temperature constant as 1030 °C) was determined based on microstructural examinations by optical microscopy (OM), scanning electron microscopy (SEM), energy dispersive spectrometry (EDS), tensile testing, and nano-hardness measurements. TLP bonding at 1030 °C for 90 min resulted in isothermal solidification, hence obtained joints free from eutectic phases. All of the tensile-tested samples failed within the copper alloy and away from their joints. The hardness distribution across the bond zone was also studied.
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45

Wang, Qun Jiao, Qi Chi Le, W. W. Zou, Jin Geng Chen, and Jian Zhong Cui. "Study on the Process and Mechanism of Rolling-Bonding between Magnesium and Aluminum." Materials Science Forum 546-549 (May 2007): 467–70. http://dx.doi.org/10.4028/www.scientific.net/msf.546-549.467.

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Application of magnesium alloy is restricted by its bad formability and low corrosion resistance. In order to resolve these problems, rolling-bonding has been tried as a new method. Pre-heating, rolling and annealing were used in the process of bonding, and aluminum cladding magnesium alloys obtained. The effects of many parameters in the processes of pre-heating, rolling and heat-treatment on bonding strength have been analyzed, and the mechanism of rolling-bonding been studied. It was found that intermediate phase played an important role in the bonding. Good bonding of aluminum cladding magnesium alloys achieved after annealing at 200oC for 1 hour.
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46

Lewinsohn, Charles, Joseph Fellows, and Merrill Wilson. "Compact, Ceramic Heat Exchangers and Microchannel Devices: Joining and Integration." Advances in Science and Technology 88 (October 2014): 148–55. http://dx.doi.org/10.4028/www.scientific.net/ast.88.148.

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Many energy conversion systems use thermal processes to convert chemical energy to mechanical or electrical energy. In these situations, microchannel components can be used to make heat exchangers and microreactors to make processes more energy efficient. Ceramic heat exchangers permit operation at higher temperatures than with other materials. Additionally, compact heat exchangers are highly efficient and cost-effective. This talk will describe principles of design, methods of fabrication, and joining methods for ceramic, compact heat exchangers for integration of such heat exchangers into practical applications. Particular emphasis will be placed on methods for joining silicon carbide to itself and the results of a novel bonding method that can be performed art relatively low temperatures in air. The mechanical behavior, at room temperature and elevated temperature, of this bonding method will be compared to that of diffusion bonded joints.
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47

Kang, Gyeong Tae, Jae Sook Song, and Sun Ig Hong. "Mechanical Properties of Cu-Ni-Zn/Cu-Cr/Cu-Ni-Zn Composite Plate Processed by Explosive Bonding and Cold Rolling." Advanced Materials Research 951 (May 2014): 83–86. http://dx.doi.org/10.4028/www.scientific.net/amr.951.83.

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Mechanical properties of 3-ply Cu-Ni-Zn/Cu-Cr/Cu-Ni-Zn clad composite plates prepared by explosive bonding and cold-rolling. No intermetallic compounds were observed at the Cu-Ni-Zn/Cu-Cr interface after explosive bonding and cold-rolling and heat-treatment at 723K. The strength of as-rolled clad plate reached up to 575MPa with the ductility of 30% after heat treatment at 723K for 1 hour. The strength dropped to 510MPa and the ductility increased to 48% after heat treatment at 723K for 1.5 hour. There are no stepwise drops of the flow stress before final fracture, meaning three plates were bonded together until the last moment of the stress-strain curve. The observation of the fractured specimens revealed no interface separation even after fracture. The excellent mechanical reliability and the good interfacial bonding strength can be attributed to the absence of detrimental interfacial reaction compounds between Cu-Ni-Zn and Cu-Cr after annealing.
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48

Ding, Cheng Gang, Ya Qi Ni, Chuan Jun Guo, and Gao Feng Quan. "Study on Microstructure and Performance of Bonding-FSSW Hybrid Joints of AZ31 Magnesium Alloy." Advanced Materials Research 295-297 (July 2011): 1915–18. http://dx.doi.org/10.4028/www.scientific.net/amr.295-297.1915.

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In this paper a bonding-FSSW hybrid method is proposed and the performance and microstructure of bonding-FSSW joints of AZ31 aluminum alloy is examined . The results show that the bonding agent has little influence on the forming and mechanical property of FSSW nugget, the shear-resisting property of joints resulted from bonding with sealing glue and FSSW is equivalent to FSSW joints, in bonding-FSSW with high-strength bonding agent, the shear-resisting property of joints are apparently superior to that of pure FSSW or bonding joints. Tiny and uniform equiaxial grains are formed in the WN(Welding nugget zone) and coarse grains are formed in TMAZ (Thermomechanically affected zone) and HAZ (Heat affected zone), but with unequal size.
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49

Qi, Xian Sheng, Xiang Yi Xue, Bin Tang, Chuan Yun Wang, Hong Chao Kou, and Jin Shan Li. "Microstructure Evolution at the Diffusion Bonding Interface of High Nb Containing TiAl Alloy." Materials Science Forum 817 (April 2015): 599–603. http://dx.doi.org/10.4028/www.scientific.net/msf.817.599.

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A series of diffusion bonding tests were conducted on high Nb containing TiAl alloy with duplex microstructure, the evolution of microstructure at bonding interface was investigated. Bonding process was performed by using vacuum hot press furnace at the temperature range from 850 to 1150°C with the pressure of 30MPa for 45min. The microstructure observation indicates that sound joint without unbounded area can be obtained when bonded above 950°C. Recrystallization happens in bonding interface when bonded at 1150°C and the recrystallized grain prior nucleated at bonding interface between the lamella colonies. Nucleation and growth of recrystallized grains promote migration of bonding interface and thus improve bonding quality. Besides, the post-bonding heat treatment (PBHT) was also performed to promote the evolution of bonding interface. The experimental results reveal that the bonding interface disappears after PBHT at 1135°Cfor 12h, and exhibits near gamma microstructure.
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50

Yamaguchi, Seiji, Koji Akeda, Koichiro Murata, Norihiko Takegami, Mikinobu Goto, Akihiro Sudo, Tomiharu Matsushita, and Tadashi Kokubo. "Chemical and Heat Treatments for Inducing Bone-Bonding Ability of Ti-6Al-4V Pedicle Screw." Key Engineering Materials 631 (November 2014): 225–30. http://dx.doi.org/10.4028/www.scientific.net/kem.631.225.

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Pedicle screw (PS) system using Ti-6Al-4V PSs became popular in spinal instrumentation system. However, they sometimes case loosening and back-out from bone because of their poor bone-bonding ability. In the present study, Ti-6Al-4V alloy was subjected to the acid-heat or calcium-heat treatments that are effective for inducing high capacities of apatite formation and bone bonding on pure Ti. When the alloy was subjected to the acid-heat treatment, a surface layer composed of rutile and anatase TiO2 enriched with Al and V was produced. Thus the treated alloy was neutrally charged and did not form apatite in a simulated body fluid (SBF) even after 3 day. In contrast, when the alloy was subjected to the Ca-heat treatment, a surface layer composed of calcium titanate, anatase and rutile free from Al and V was produced. The treated alloy formed apatite in SBF within 3 days. When the Ti-6Al-4V PSs subjected to the Ca-heat treatment was implanted into vertebra of beagle dogs, they showed higher bone-bonding ability as well as bone contact area than those without the treatment. This kind of bioactive Ti-6Al-4V PSs might be useful for spinal instrumentation since they could prevent loosening and back-out from bone.
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