Relevant bibliographies by topics / Heat sinks (Electronics)

Contents

  1. Journal articles
  2. Dissertations / Theses
  3. Books
  4. Book chapters
  5. Conference papers

Academic literature on the topic 'Heat sinks (Electronics)'

Author: Grafiati
Published: 4 June 2021
Last updated: 1 August 2024

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Journal articles on the topic "Heat sinks (Electronics)"

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Li, Yijun, Stéphane Roux, Cathy Castelain, Yilin Fan, and Lingai Luo. "Design and Optimization of Heat Sinks for the Liquid Cooling of Electronics with Multiple Heat Sources: A Literature Review." Energies 16, no. 22 (November 7, 2023): 7468. http://dx.doi.org/10.3390/en16227468.

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This paper presents a detailed literature review on the thermal management issue faced by electronic devices, particularly concerning uneven heating and overheating problems. Special focus is given to the design and structural optimization of heat sinks for efficient single-phase liquid cooling. Firstly, the paper highlights the common presence and detrimental consequences of electronics overheating resulting from multiple heat sources, supported by various illustrative examples. Subsequently, the emphasis is placed on single-phase liquid cooling as one of the effective thermal management technologies for power electronics, as well as on the enhancement of heat transfer in micro/mini channel heat sinks. Various studies on the design and structural optimization of heat sinks are then analyzed and categorized into five main areas: (1) optimization of channel cross-section shape, (2) optimization of channel flow passage, (3) flow distribution optimization for parallel straight channel heat sinks, (4) optimization of pin-fin shape and arrangement, and (5) topology optimization of global flow configuration. After presenting a broad and complete overview of the state of the art, the paper concludes with a critical analysis of the methods and results from the literature and highlights the research perspectives and challenges in the field. It is shown that the issue of uneven and overheating caused by multiple heat sources, which is commonly observed in modern electronics, has received less attention in the literature compared to uniform or single-peak heating. While several design and structural optimization techniques have been implemented to enhance the cooling performance of heat sinks, topology optimization has experienced significant advancements in recent years and appears to be the most promising technology due to its highest degree of freedom to treat the uneven heating problem. This paper can serve as an essential reference contributing to the development of liquid-cooling heat sinks for efficient thermal management of electronics.
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Bhattacharya, A., and R. L. Mahajan. "Finned Metal Foam Heat Sinks for Electronics Cooling in Forced Convection." Journal of Electronic Packaging 124, no. 3 (July 26, 2002): 155–63. http://dx.doi.org/10.1115/1.1464877.

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In this paper, we present recent experimental results on forced convective heat transfer in novel finned metal foam heat sinks. Experiments were conducted on aluminum foams of 90 percent porosity and pore size corresponding to 5 PPI (200 PPM) and 20 PPI (800 PPM) with one, two, four and six fins, where PPI (PPM) stands for pores per inch (pores per meter) and is a measure of the pore density of the porous medium. All of these heat sinks were fabricated in-house. The forced convection results show that heat transfer is significantly enhanced when fins are incorporated in metal foam. The heat transfer coefficient increases with increase in the number of fins until adding more fins retards heat transfer due to interference of thermal boundary layers. For the 20 PPI samples, this maximum was reached for four fins. For the 5 PPI heat sinks, the trends were found to be similar to those for the 20 PPI heat sinks. However, due to larger pore sizes, the pressure drop encountered is much lower at a particular air velocity. As a result, for a given pressure drop, the heat transfer coefficient is higher compared to the 20 PPI heat sink. For example, at a Δp of 105 Pa, the heat transfer coefficients were found to be 1169W/m2-K and 995W/m2-K for the 5 PPI and 20 PPI 4-finned heat sinks, respectively. The finned metal foam heat sinks outperform the longitudinal finned and normal metal foam heat sinks by a factor between 1.5 and 2, respectively. Finally, an analytical expression is formulated based on flow through an open channel and incorporating the effects of thermal dispersion and interfacial heat transfer between the solid and fluid phases of the porous medium. The agreement of the proposed relation with the experimental results is promising.
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Alhusseny, Ahmed, Qahtan Al-Aabidy, Nabeel Al-Zurfi, Adel Nasser, Mohammed Al-Edhari, and Hayder Al-Sarraf. "GRAPHITE FOAM STRUCTURES AS AN EFFECTIVE MEANS TO COOL HIGH-PERFORMANCE ELECTRONICS." Kufa Journal of Engineering 15, no. 2 (May 3, 2024): 39–60. http://dx.doi.org/10.30572/2018/kje/150204.

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Due to their unique heat transfer features, graphite foams are used in the current analysis to form heat sinks effective enough to dissipate extreme heat generated within high-performance electronics. The heat sinks proposed are formed from foamed-baffles arranged either in parallel or perpendicular to the coolant paths through the staggered slots in between to alleviate the penalty of pressure drop while maintaining high heat dissipation capability. Two different sorts of dielectric coolants namely, air and the FC-3283 electronic liquid developed by 3MTM, have been utilized to directly dissipate the heat generated. The feasibility of the currently proposed heat sinks has been examined numerically based on the volume averaging concept of porous media employing the local thermal non-equilibrium model to account for interstitial heat exchange between the foam solid matrix and the fluid particles flowing across. A wide range of design parameters has been tested including the heat sink configuration along with structural characteristics of the graphite foam used. It has been found that foam baffles oriented perpendicular to the path of coolant flow can dissipate heat by about 50% better than those parallel to it, but with higher pressure losses. It has also been found that heat dissipation capability, for a certain orientation of baffles, can be improved by up to 100% when the foam pore size is doubled with outstanding saving in pressure losses by up to 300%. The impact of operating conditions, including the coolant flowrate and the heat flux applied, has also been inspected. The currently proposed heat sinks have been found efficient to meet the thermal demands of high-performance electronics and sweep away the extreme heat generated there with reasonable cost of pressure drop, where the proper selection of design parameters in light of the operating conditions applied can prevent the emergence of hot spots entirely. Extreme operating conditions, i.e. with heat density of up to 10W/cm2 for air-cooled heat sinks and 100W/cm2 for those cooled with FC-3283, can be well managed when a heat sink is configured from baffles that are oriented perpendicularly to the coolant flow path and formed of graphite foam having low porosity (∅=0.8) and larger pore size
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Ariyo, David Olugbenga, and Tunde Bello-Ochende. "Optimal design of subcooled triangular microchannel heat sink exchangers with variable heat loads for high performance cooling." Journal of Physics: Conference Series 2116, no. 1 (November 1, 2021): 012052. http://dx.doi.org/10.1088/1742-6596/2116/1/012052.

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Abstract Deionized water at a temperature of 25 °C was used as the cooling fluid and aluminium as the heat sink material in the geometric optimization and parameter modelling of subcooled flow boiling in horizontal equilateral triangular microchannel heat sinks. The thermal resistances of the microchannels were minimized subject to fixed volume constraints of the heat sinks and microchannels. A computational fluid dynamics (CFD) ANSYS code used for both the simulations and the optimizations was validated by the available experimental data in the literature and the agreement was good. Fixed heat fluxes between 100 and 500 W/cm2 and velocities between 0.1 and 7.0 m/s were used in the study. Despite the relatively high heat fluxes in this study, the base temperatures of the optimal microchannel heat sinks were within the acceptable operating range for modern electronics. The pumping power requirements for the optimal microchannels are low, indicating that they can be used in the cooling of electronic devices.
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Loganathan, Arulmurugan, and Ilangkumaran Mani. "Experimental investigations on Thermal Performance of Copper with Aluminium Based Finned Heat sinks for Electronics Cooling System." JOURNAL OF ADVANCES IN CHEMISTRY 12, no. 12 (June 15, 2016): 4582–87. http://dx.doi.org/10.24297/jac.v12i12.787.

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An Experimental investigation on the thermal performance of copper with aluminium based finned heat sinks for electronics cooling system was studied. The heat sinks have different material proportions containing major constituent of aluminium and minor constituent of copper. Considered with straight finned heat sink for the experiments for its easiness in fabrication and efficient heat transfer properties. The observational results for aluminium with copper alloy are compared with pure aluminium heat sink. Heat sink geometry, fin pitch and its height were taken from the commercially available heat sinks. In this research work best heat sink geometry is chosen and cooked up with different volume of copper added with aluminium. Selected four different spots of heat sinks and the temperature raising characteristics were measured for natural convection. also the temperature is raised to a fixed temperature and the temperature lowering characteristics were measured in forced convection as the air circulation takes more heat to keep the heat sink temperature within the desired level.
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Durgam, Shankar, Bharati Ghodake, and Suhas Mohite. "Numerical Investigation on Heat Sink Material for Temperature Control of Electronics." Journal of Physics: Conference Series 2312, no. 1 (August 1, 2022): 012016. http://dx.doi.org/10.1088/1742-6596/2312/1/012016.

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Abstract This article reports a numerical investigation on advanced heat sink material for thermal management of electronics. We investigated heat transfer enhancement using different heat sink materials. The cooling medium used for analysis is water. Forced water convection in copper alloy and aluminum alloy Al6060, Al6063 material micro-channel heat sinks cooling was studied numerically using Ansys Fluent. The heat sink is an essential element in a PC. The total efficiency, price, and size of the electronic device depend on the heat sink material. The heat transfer rate is a direct function of heat sink material. The simulation used three different velocities, 3, 5, and 7 m/s; the constant heat flux value taken is 8 × 105 W/m2. The parameters considered for heat sink material are thermal conductivity, thermal expansion coefficient, density, and cost. The ceramic materials have a low thermal expansion coefficient and higher thermal conductivity hence used as a substrate. Results show that aluminum alloys are suitable materials for heat sinks because of their cost, weight, and ease of machinability.
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Zhao, C. Y., and T. J. Lu. "Analysis of microchannel heat sinks for electronics cooling." International Journal of Heat and Mass Transfer 45, no. 24 (November 2002): 4857–69. http://dx.doi.org/10.1016/s0017-9310(02)00180-1.

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Singh, Reeti. "Hybrid Heat Sink Manufacturing by Cold Spray." AM&P Technical Articles 179, no. 3 (April 1, 2021): 37–38. http://dx.doi.org/10.31399/asm.amp.2021-03.p037.

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Sathe, Anilkumar, and Sudarshan Sanap. "Augmentation of Thermal Performance of Plate Fin Heat Sink." International Journal of Engineering and Advanced Technology 8, no. 6s (September 6, 2019): 1087–94. http://dx.doi.org/10.35940/ijeat.f1213.0886s19.

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Heat sinks are popularly used in various industrial applications to cool electrical, electronics and automobile components. They are useful in removing the heat from the surfaces at elevated temperatures. The life of such devices depends on their operating temperature. Heat sinks are important parts of thermal management systems of most of these devices eg: Diods, thyristers, high power semiconductor devices such as integrated circuits of inverters, audio amplifier, microprocessors, microcontrollers etc. In many situations where heat transfer is by free convection where convective heat transfer coefficient is low, fins are the best solution because of their less cost and trouble free operation. The weight and size of equipment are the most important parameters of design. Present day demand, the use of compact systems in every application which leads to higher packing density. The failure rate of electronic equipments increase exponentially with the temperature. Also the high thermal stresses in the solder joints of electronic components mounted on circuit boards resulting from temperature variation are major causes of failure. Therefore thermal control has become an important factor in the design and operation of electronic equipment. The most preferred method for cooling these systems is passive cooling because it is cost effective and reliable. This leads to focus on development of effective fin heat sink. To make heat sink effective, geometry and orientation of the heat sink as well as heat transfer augmentation techniques plays important role. This paper highlights the use of heat sinks in electronic cooling applications and review of related literature of improving the heat transfer performance of plate fin heat sinks by surface modifications, interrupting the boundary layer and changing the orientation.
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Bhattacharya, A., and R. L. Mahajan. "Metal Foam and Finned Metal Foam Heat Sinks for Electronics Cooling in Buoyancy-Induced Convection." Journal of Electronic Packaging 128, no. 3 (September 23, 2005): 259–66. http://dx.doi.org/10.1115/1.2229225.

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In this paper, we present our recent experimental results on buoyancy-induced convection in aluminum metal foams of different pore densities [corresponding to 5, 10, 20, and 40 pores per in. (PPI)] and porosities (0.89–0.96). The results show that compared to a heated surface, the heat transfer coefficients in these heat sinks are five to six times higher. However, when compared to commercially available heat sinks of similar dimensions, the enhancement is found to be marginal. The experimental results also show that for a given pore size, the heat transfer rate increases with porosity, suggesting the dominant role played by conduction in enhancing heat transfer. On the other hand, if the porosity is held constant, the heat transfer rate is found to be lower at higher pore densities. This can be attributed to the higher permeability with the larger pores, which allows higher entrainment of air through the porous medium. New empirical correlations are proposed for the estimation of Nusselt number in terms of Rayleigh and Darcy numbers. We also report our results on novel finned metal foam heat sinks in natural convection. Experiments were conducted on aluminum foams of 90% porosity with 5 and 20 PPI with one, two, and four aluminum fins inserted in the foam. All of these heat sinks were fabricated in-house. The results show that the finned metal foam heat sinks are superior in thermal performance compared to the normal metal foam and conventional finned heat sinks. The heat transfer increases with an increase in the number of fins. However, the relative enhancement is found to decrease with each additional fin. The indication is that there exists an optimum number of fins beyond which the enhancement in heat transfer, due to increased surface area, is offset by the retarding effect of overlapping thermal boundary layers. Similar to normal metal foams, the 5 PPI samples are found to give higher values of h compared to the 20 PPI samples due to higher permeability of the porous medium. Future work is planned to arrive at the optimal heat sink configuration for even larger enhancement in heat transfer.
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Dissertations / Theses on the topic "Heat sinks (Electronics)"

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Mutlu, Imren. "Thermal behaviour of heat sinks." Thesis, Staffordshire University, 1993. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.358462.

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Lee, Man. "Forced convection heat transfer in integrated microchannel heat sinks /." View abstract or full-text, 2006. http://library.ust.hk/cgi/db/thesis.pl?MECH%202006%20LEE.

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Duan, Zhipeng. "Impingement air cooled plate fin heat sinks /." Internet access available to MUN users only, 2003. http://collections.mun.ca/u?/theses,161910.

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Burzynski, Katherine Morris. "Printed Nanocomposite Heat Sinks for High-Power, Flexible Electronics." University of Dayton / OhioLINK, 2021. http://rave.ohiolink.edu/etdc/view?acc_num=dayton1619702252056433.

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Al-Neama, Ahmed Fouad Mahmood. "Serpentine minichannel liquid-cooled heat sinks for electronics cooling applications." Thesis, University of Leeds, 2018. http://etheses.whiterose.ac.uk/20318/.

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The increasing density of transistors in electronic components is leading to an inexorable rise in the heat dissipation that must be achieved in order to preserve reliability and performance. Hence, improving the thermal management of electronic devices is a crucial goal for future generations of electronic systems. Therefore, a complementary experimental and numerical investigation of single-phase water flow and heat transfer characteristics of the benefits of employing three different configurations of serpentine minichannel heat sink (MCHS) designs has been performed, to assess their suitability for the thermal management of electronic devices. These heat sinks are termed single (SPSMs), double (DPSMs) and triple path serpentine rectangular minichannels (TPSMs), and their performance is compared, both experimentally and numerically, with that of a design based on an array of straight rectangular minichannels (SRMs) in terms of pressure drop (ΔP), average Nusselt number (Nuavg) and total thermal resistance (Rth). The results showed that the serpentine channel bends are very influential in improving heat transfer by preventing both the hydrodynamic and thermal boundary layers from attaining a fully-developed state. The SPSM design provides the most effective heat transfer, followed by the DPSM and TPSM ones, both of which out-performed the SRM heat sink. The SPSM heat sink produced a 35% enhancement in Nuavg and a 19% reduction in Rth at a volumetric flow rate (Qin) of 0.5 l/min compared to the conventional SRM heat sink. These improvements in the heat transfer are, however, achieved at the expense of significantly larger ΔP. It was found that the incorporation of serpentine minichannels into heat sinks will significantly increase the heat-removal ability, but this must be balanced with the pressure drop requirement. Therefore, an experimental and numerical investigation of the benefit of introducing chevron fins has been carried out to examine the potential of decreasing pressure drop along with further thermal enhancement. This novel design is found to significantly reduce both the ΔP across the heat sink and the Rth by up to 60% and 10%, respectively, and to enhance the Nuavg by 15%, compared with the SPSM heat sink without chevron fins. Consequently, the design of the SPSM with and without chevron fins was then optimised in terms of the minichannel width (Wch) number of minichannels (Nch) and chevron oblique angle (θ). The optimisation process uses a 30 (without chevron fins) and 50 (with chevron fins) point Optimal Latin Hypercubes Design of Experiment, generated from a permutation genetic algorithm, and accurate metamodels built using a Moving Least Square (MLS) method. A Pareto front is then constructed to enable the compromises available between designs with a low pressure drop and those with low thermal resistance to be explored and appropriate design parameters to be chosen. These techniques have then been used to explore the feasibility of using serpentine MCHS and heat spreaders to cool GaN HEMTs.
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Crockett, Dean D. "Direct measurement of parallel plate heat sink bypass flow." Online access for everyone, 2006. http://www.dissertations.wsu.edu/Thesis/Fall2006/d_crockett_121206.pdf.

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Simionescu, Florentina. "Considerations on optimum design of micro heat pipe sinks using water as working fluid." Auburn, Ala., 2006. http://repo.lib.auburn.edu/Send%2012-15-07/SIMIONESCU_FLORENTINA_33.pdf.

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Farnam, Dylan Sean. "Comparative analysis of microchannel heat sink configurations subject to a pressure constraint." Diss., Online access via UMI:, 2007.

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Pate, Daniel Thomas Bhavnani S. H. "Experimental investigation of cavity induced two phase flow in silicon microchannels." Auburn, Ala., 2006. http://repo.lib.auburn.edu/2006%20Summer/Theses/PATE_DANIEL_19.pdf.

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Nagarathnam, Premkumar. "Novel carbon nanotube thermal interfaces for microelectronics." Thesis, Atlanta, Ga. : Georgia Institute of Technology, 2009. http://hdl.handle.net/1853/31720.

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Thesis (M. S.)--Mechanical Engineering, Georgia Institute of Technology, 2010.
Committee Chair: Graham, Sam; Committee Member: Joshi, Yogendra; Committee Member: Kalaitzidou, Kyriaki. Part of the SMARTech Electronic Thesis and Dissertation Collection.
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Books on the topic "Heat sinks (Electronics)"

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United States. National Aeronautics and Space Administration., ed. Heat sink effects on weld bead: VPPA process. Wichita, Kan: National Institute for Aviation Research, Wichita State University, 1990.

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Kraus, Allan D. Design and analysis of heat sinks. New York: Wiley, 1995.

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D, Agonafer, Fulton Robert E, American Society of Mechanical Engineers. Electrical and Electronic Packaging Division., and International Mechanical Engineering Congress and Exposition (1994 : Chicago, Ill.), eds. CAE/CAD application to electronic packaging: Presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994. New York, N.Y: American Society of Mechanical Engineers, 1994.

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D, Agonafer, Fulton Robert E, American Society of Mechanical Engineers. Electrical and Electronic Packaging Division., and International Mechanical Engineering Congress and Exposition (1994 : Chicago, Ill.), eds. CAE/CAD application to electronic packaging: Presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994. New York, N.Y: American Society of Mechanical Engineers, 1994.

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International Conference on Microchannels and Minichannels (3rd 2005 Toronto, Ont.). Proceedings of the 3rd International Conference on Microchannels and Minichannels, 2005: Presented at 3rd International Conference on Microchannels and Minichannels, June 13-15, 2005, Toronto, Ontario, Canada. New York: American Society of Mechanical Engineers, 2005.

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Zhang, Lian. Silicon Microchannel Heat Sinks: Theories and Phenomena. Berlin, Heidelberg: Springer Berlin Heidelberg, 2004.

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Favreau, Marc. Hot markets: Thermal management technology for electronics. Norwalk, CT: Business Communications Co., 1996.

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Hienonen, Risto. Reliability of materials for the thermal management of electronics. [Espoo, Finland]: VTT Technical Research Centre of Finland, 2006.

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N, Hayner Clifford. Contemporary perspectives on liquid cold plate design: Design and manufacturing liquid cooled heat sinks for electronics cooling. New York: Begell House, Inc, 2014.

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International, Conference on Nanochannels Microchannels and Minichannels (9th 2011 Edmonton Canada). Proceedings of the 9th International Conference on Nanochannels, Microchannels and Minichannels--2011: Presented at 9th International Conference on Nanochannels, Microchannels and Minichannels, June 19-22, 2011, Edmonton, Canada. New York: American Society of Mechanical Engineers, 2012.

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Book chapters on the topic "Heat sinks (Electronics)"

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Ellison, Gordon N. "Natural Convection Heat Transfer II: Heat Sinks." In Thermal Computations for Electronics, 183–95. Second edition. | Boca Raton, FL : CRC Press/Taylor & Francis Group, 2020.: CRC Press, 2020. http://dx.doi.org/10.1201/9781003029328-9.

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Lehmann, Gary L. "Heat Sinks in Forced Convection Cooling." In Electronics Packaging Forum, 209–28. Dordrecht: Springer Netherlands, 1991. http://dx.doi.org/10.1007/978-94-009-0439-2_6.

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Ismaeel, Muyassar E., N. Kapur, Z. Khatir, and H. M. Thompson. "Robust Optimisation of Serpentine Fluidic Heat Sinks for High-Density Electronics Cooling." In Advances in Heat Transfer and Thermal Engineering, 583–90. Singapore: Springer Singapore, 2021. http://dx.doi.org/10.1007/978-981-33-4765-6_101.

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Arshad, Adeel, Pouyan Talebizadehsardari, Muhammad Anser Bashir, Muhammad Ikhlaq, Mark Jabbal, Kuo Huang, and Yuying Yan. "Transient Simulation of Finned Heat Sinks Embedded with PCM for Electronics Cooling." In Advances in Heat Transfer and Thermal Engineering, 527–31. Singapore: Springer Singapore, 2021. http://dx.doi.org/10.1007/978-981-33-4765-6_91.

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Kalra, Kapil, and Amit Arora. "Electronic Heat Dissipation and Thermal Management by Finned Heat Sinks." In Lecture Notes in Mechanical Engineering, 111–23. Singapore: Springer Nature Singapore, 2022. http://dx.doi.org/10.1007/978-981-19-3410-0_10.

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Krane, Robert J., Iqballudin Ahmed, and J. Roger Parsons. "The Cooling of Electronic Components with Flat Plate Heat Sinks." In Cooling of Electronic Systems, 391–414. Dordrecht: Springer Netherlands, 1994. http://dx.doi.org/10.1007/978-94-011-1090-7_19.

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Aranyosi, A., L. Bolle, and H. Buyse. "High-Performance Air-Cooled Heat Sinks for Power Packages." In Thermal Management of Electronic Systems II, 243–52. Dordrecht: Springer Netherlands, 1997. http://dx.doi.org/10.1007/978-94-011-5506-9_23.

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Tong, Xingcun Colin. "Materials and Design for Advanced Heat Spreader and Air Cooling Heat Sinks." In Advanced Materials for Thermal Management of Electronic Packaging, 373–420. New York, NY: Springer New York, 2010. http://dx.doi.org/10.1007/978-1-4419-7759-5_9.

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Wirtz, R. A., Weiming Chen, and Dan Colban. "Convection in Arrays of Electronic Packages Containing Longitudinal Fin Heat Sinks." In Cooling of Electronic Systems, 145–63. Dordrecht: Springer Netherlands, 1994. http://dx.doi.org/10.1007/978-94-011-1090-7_7.

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Md Adil, Asif Khan, Abhishek Gupta, Sohail Ahmad, and M. Altamush Siddiqui. "Experimental and Numerical Studies of Heat Transfer Through Heat Sinks in Electronic Devices." In Lecture Notes in Mechanical Engineering, 299–307. Singapore: Springer Singapore, 2021. http://dx.doi.org/10.1007/978-981-15-8025-3_30.

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Conference papers on the topic "Heat sinks (Electronics)"

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Gururatana, Suabsakul, and Xianchang Li. "Performance of a Heat Sink With Interrupted and Staggered Elliptic Fins." In 2010 14th International Heat Transfer Conference. ASMEDC, 2010. http://dx.doi.org/10.1115/ihtc14-22890.

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The power density of electronic devices has been increasing along with the rapid technology development. Cooling of electronic systems is therefore essential in controlling the component temperature and avoiding any hot spot. Heat sinks are commonly adopted in electronics cooling together with different technologies to enhance heat transfer process. Fin-based heat sinks are commonly designed so that coolants (gas or liquid) are forced to pass through the narrow straight channel. A driving fan is then needed to overcome the viscous pressure loss and maintain the coolant flow. As part of effort to improve the heat sink performance, this study simulated the details of the flow and temperature fields of heat sinks with interrupted and staggered elliptic fins cooled by forced convection. The focus of this study lies on three scenarios: Heat transfer before the flow reaches the periodic condition in the flow direction; effect of the heat sink base surface on flow and heat transfer; and conjugate heat transfer between convection and heat conduction inside the fins. In addition, studies were also conducted on the effect of the Reynolds number. The results of this paper can help design heat sinks for electronics cooling by employing the new concept of interrupted and staggered fins.
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Ramos-Alvarado, Bladimir, Peiwen Li, Hong Liu, and Abel Hernandez-Guerrero. "CFD Analysis of Flow and Heat Transfer in a Novel Heat Sink for Electronic Devices." In ASME 2010 International Mechanical Engineering Congress and Exposition. ASMEDC, 2010. http://dx.doi.org/10.1115/imece2010-39935.

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Novel flow channel configurations in heat sinks for electronics cooling were proposed in this paper. Computational analyses were carried out to better understand the heat transfer performance, the uniformity of temperature fields of the heat sinking surface, as well as the pressure losses and pumping power in the operation of heat sinks. Comparison of the overall performance regarding to temperature uniformity on the heat sink surface and pumping power consumption was made for heat sinks having novel flow channel configurations and having traditional flow channel configurations. It has been found that the novel flow channel configuration dramatically reduces the pressure loss in the flow field. Giving the same pumping power consumption of an electronics cooling process, the temperature difference on surface of the heat sink which has novel flow channel configuration can be much lower than that of the heat sinks which have traditional flow channel configurations.
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Subbuswamy, Ganesh, and Xianchang Li. "Simulation of Fluid Flow and Heat Transfer of Flat Plate Heat Sinks With Spiral Inserts." In 2010 14th International Heat Transfer Conference. ASMEDC, 2010. http://dx.doi.org/10.1115/ihtc14-22898.

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High performance electronic chips are finding applications in almost all equipments in the modern world. However, these chips are coupled with potential overheating, which has been a serious concern for manufacturers as well as researchers ever. One of the best options for electronics cooling is to take advantage of heat sinks. Over years, many studies are focused on optimal designs of heat sinks, while some are also targeted at heat transfer enhancement. To explore how the heat sink performance can be further improved, this study integrates spiral tape inserts into the narrow channel of plate-finned heat sinks. Numerical simulation is carried out to examine the flow and heat transfer behavior of heat sinks with spiral inserts. Different parameters such as insert width, twist ratio, and the flow Reynolds number are investigated. It is observed that the inserts significantly increase the heat transfer rate with a penalty of higher pressure loss. In one of the cases studied, the heat transfer is increased by 368% with a rise of 810% in pressure drop. However, the inserts can produce a net benefit when the same pressure loss or fan power is considered. Therefore, the inserts can help make the heat sink more effective by reducing its size.
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Elkholy, Ahmed, and Roger Kempers. "A Compact Integrated Thermosyphon Heat Sink for Power Electronics Cooling." In ASME 2019 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2019. http://dx.doi.org/10.1115/imece2019-11777.

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Abstract The trend in miniaturization of power electronic components requires the development of new robust and passive cooling methods to meet increased heat flux demands. Conventional heat sinks encounter inherent shortcomings due to heat spreading resistance of the heat sink baseplate particularly in natural convection heat sinks used to cool small localized heat sources. Heat pipes embedded within the base of heat sinks can be used to improve spreading performance but are limited by the ability to conduct heat into and out of the heat pipes. In the current study, a small, naturally aspirated two-phase thermosyphon heat sink was developed and characterized experimentally. The proposed architecture integrates all thermosyphon components into one compact device, where the evaporator, riser and the downcomer are incorporated at the heat sink base. The downcomer also serves as the condenser within the base of a vertical finned natural convection heat sink. The side-heated evaporator consists of an array mini-channels configuration which can operate in either pool boiling or flow boiling configuration, which allows the thermosyphon heat sink to operate in either reflux mode or looped mode, respectively. Experiments were carried out using HFE 7000 as the working fluid. The effect of the of input power on the thermal performance is examined for both modes for powers ranging from 10 to 80 W. Results demonstrate that this approach significantly reduces the spreading resistance resulting in a net improvement which can be traded-off for a decrease the overall size or weight of the heat sink.
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Garimella, Suresh V., and Vishal Singhal. "Single-Phase Flow and Heat Transport in Microchannel Heat Sinks." In ASME 2003 1st International Conference on Microchannels and Minichannels. ASMEDC, 2003. http://dx.doi.org/10.1115/icmm2003-1018.

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Microchannel heat sinks are widely regarded as being amongst the most effective heat removal techniques from space-constrained electronic devices. However, the fluid flow and heat transfer in microchannels is not fully understood. The pumping requirements for flow through microchannels are also very high and none of the micropumps in the literature are truly suitable for this application. A wide-ranging research program on microchannel heat sinks and micropumps is underway in the Electronics Cooling Laboratory at Purdue University. This article provides an overview of the research being conducted to understand fluid flow and heat transfer in microchannels and to identify pumping requirements and suitable mechanisms for pumping in microchannels.
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Egan, V., P. Walsh, E. Walsh, and R. Grimes. "On the Characterisation of Finned and Finless Heat Sinks for Portable Electronics." In ASME 2007 5th International Conference on Nanochannels, Microchannels, and Minichannels. ASMEDC, 2007. http://dx.doi.org/10.1115/icnmm2007-30089.

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Reliable and efficient cooling solutions for portable electronic devices are now at the forefront of research due to consumer demand for manufacturers to downscale their existing technologies. The power required for these technologies now has to be dissipated over smaller areas resulting in elevated heat fluxes. The most popular choice among engineers in terms of cooling solutions is to integrate a fan with a heat sink and for portable electronic devices this involves the use of a low profile solution. In this paper an experimental investigation on the thermal performance of a finned and finless heat sink integrated with an axial fan, for the purpose of cooling a microchip, is presented. The objective is to characterise the performance of each heat sink in terms of thermal resistance and to develop an understanding of the flow structures in such systems. One of the smallest commercially available fans is used in conjunction with each heat sink giving a total footprint area of 465m2 and profile height of 5mm. Thermal resistances are measured over a range of fan speeds and detailed velocity measurements were taken of the flow within the heat sinks using Particle Image Velocimetry (PIV). The thermal analysis results indicate that the thermal resistance of the system is of order 30 deg C/W for both heat sinks. However, the finless heat sink resulted in slightly lower values over a range of intermediate fan speeds. Hence, indicating that the maximum heat transfer density, for a range of fan speeds, can be achieved with a finless heat sink. The results also define the limiting heat fluxes that can be dissipated in low profile miniature applications.
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Sadeghipour, Sadegh M., and Mehdi Asheghi. "Students Design Competition, Best Heat Sinks for Electronics Cooling." In ASME 2004 International Mechanical Engineering Congress and Exposition. ASMEDC, 2004. http://dx.doi.org/10.1115/imece2004-62482.

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The Thermal Fluids Engineering, a junior course required by the mechanical engineering students at Carnegie Mellon University, is offered in the spring semesters. The students who take this course have previous background in thermodynamics, heat transfer, and fluid mechanics. Therefore, the emphases of this course are mainly on the applications, including design of the thermal systems. Included in the course is a design project competition for which the students design and manufacture a heat sink for electronic cooling. The heat sinks are then tested and ranked according to their performance in cooling a mock processor. Students are usually very excited about this competition and work very hard and zealously to present the best design and, they sometimes come up with very novel ideas. The design project has proven to be of great pedagogical value to the students. In this paper we will report on the competition of the spring semester 2004, which has been between twenty-seven student groups. We will review the competition as a whole and discuss in more detail the projects that particularly performed the best and the worst. We will share our observations about the educational benefits of the design projects, as well.
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Bharadwaj, Bharath, Prashant Singh, and Roop L. Mahajan. "Optimal Design of Additively Manufactured Metal Lattice Heat Sinks for Electronics Cooling." In ASME 2022 Heat Transfer Summer Conference collocated with the ASME 2022 16th International Conference on Energy Sustainability. American Society of Mechanical Engineers, 2022. http://dx.doi.org/10.1115/ht2022-85400.

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Abstract With increasing thermal footprint in electronic packages, metal lattices offer avenues for better thermal management in passively cooled heat sinks. Combined with the advances in metal additive manufacturing, these can be leveraged to realize complex designs that offer superior heat transfer characteristics with smaller and lighter components. In this work, design, analysis, and optimization of metal lattice-based heat sinks for passive cooling by buoyancy-driven convection is presented. Heat sinks based on three types of lattice structures — Simple Cubic, Voronoi and Octet — have been studied by varying lattice parameters such as thickness and height to obtain the optimal design. Numerical computations using the ANSYS® commercial package have been carried out and the steady state junction temperature at the base of the heat sink monitored. The Voronoi lattice structure provides the best enhancement in heat transfer with ∼18% reduction in junction-to-ambient temperature difference as compared to a standard baseline longitudinal heat sink (LHS), while simultaneously reducing the mass of the heat sink by ∼2.1 times. This behavior is attributed to the enhanced surface area, open-celled lattice structure with lower flow resistance and enhanced thermal dissipation due to local flow disturbances. Based on the junction-to-ambient temperature difference and mass of each heat sink, a Figure of Merit (FOM) is defined to quantify the relative performance of all the designs. The Voronoi lattice at 0.8 mm thickness and 25.4 mm height was found to be the optimal design. It provides the best improvement of ∼3 times compared to the baseline LHS. Also, a Design for Additive Manufacturing (DFAM) approach has been implemented. Virtual build-up simulation indicated suitability of the design for fabrication. The predicted deviation after printing was within the commercially acceptable tolerance limits for use in applications. The workflow presented here from design to analysis, optimization and preparation for fabrication is useful for rapid development of customized passive cooling solutions and determination of optimal designs. We believe that the analysis and methodology presented in this paper would be helpful in the development of better thermal management devices aided by additive manufacturing in future.
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Xu, Guoping, Chakravarthy Akella, and Lee Follmer. "High Dense Plate Fin Heat Sinks Characterization and Validation." In ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. ASMEDC, 2005. http://dx.doi.org/10.1115/ipack2005-73128.

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Plate fin heat sinks are commonly used in electronics cooling including high end processors. A number of empirical and analytical methods are available to predict their performance but most of the models are valid for fin pitch larger than 3 mm heat sinks in laminar flow. The present work is to investigate high dense plate fin heat sink in both laminar and turbulent regimes. Thermal and hydraulic performance of several dense plate-fin heat sinks were characterized for high end processors in a fully-ducted wind tunnel. All the three heat sinks tested have the same dimensions of 89 mm (L) × 56 mm (W) × 50 mm (H), and fin number varied between 23 and 33. Heat sink base for all heat sinks was made of solid copper, while different fin materials of Aluminum and Copper are used. Several analytical methods for laminar flow from literature were reviewed in this study. A new heat transfer analytical method was proposed for both laminar and turbulent flows. The characterization data from these three parallel plate heat sinks were compared with the analytical methods. Finally, empirical heat transfer correlations were developed for both laminar and turbulent flows.
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White, Andrew Scott, David Saltzman, and Stephen Lynch. "Performance Analysis of Heat Sinks Designed for Additive Manufacturing." In ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. American Society of Mechanical Engineers, 2020. http://dx.doi.org/10.1115/ipack2020-2532.

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Abstract Significant levels of heat are generated in contemporary electronics, and next generation devices will continue to demand higher power despite decreasing size; therefore, highly effective cooling schemes are needed. Simultaneously, advances in metal additive manufacturing have enabled production of complex heat transfer devices previously impossible to traditionally manufacture. This paper introduces three novel prototypes, originally designed for a prior ASME Student Heat Sink Design Competition sponsored by the K-16 (Heat Transfer in Electronic Devices) technical committee, to demonstrate the abilities of selective laser melting processes in the fabrication of A357 aluminum, EOS aluminum, and copper heat sinks. The performance of each of these prototypes has been determined experimentally, and the effects of specific material and design choices are analyzed. Comparisons of experimental results show that the copper and EOS aluminum prototypes performed better than the A357 aluminum due to increased thermal conductivity; however, the gains in thermal performance from EOS aluminum to copper were much lower despite the large difference in thermal conductivity.
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