Journal articles: 'Heat sinks (Electronics)'

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Li, Yijun, Stéphane Roux, Cathy Castelain, Yilin Fan, and Lingai Luo. "Design and Optimization of Heat Sinks for the Liquid Cooling of Electronics with Multiple Heat Sources: A Literature Review." Energies 16, no. 22 (November 7, 2023): 7468. http://dx.doi.org/10.3390/en16227468.

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This paper presents a detailed literature review on the thermal management issue faced by electronic devices, particularly concerning uneven heating and overheating problems. Special focus is given to the design and structural optimization of heat sinks for efficient single-phase liquid cooling. Firstly, the paper highlights the common presence and detrimental consequences of electronics overheating resulting from multiple heat sources, supported by various illustrative examples. Subsequently, the emphasis is placed on single-phase liquid cooling as one of the effective thermal management technologies for power electronics, as well as on the enhancement of heat transfer in micro/mini channel heat sinks. Various studies on the design and structural optimization of heat sinks are then analyzed and categorized into five main areas: (1) optimization of channel cross-section shape, (2) optimization of channel flow passage, (3) flow distribution optimization for parallel straight channel heat sinks, (4) optimization of pin-fin shape and arrangement, and (5) topology optimization of global flow configuration. After presenting a broad and complete overview of the state of the art, the paper concludes with a critical analysis of the methods and results from the literature and highlights the research perspectives and challenges in the field. It is shown that the issue of uneven and overheating caused by multiple heat sources, which is commonly observed in modern electronics, has received less attention in the literature compared to uniform or single-peak heating. While several design and structural optimization techniques have been implemented to enhance the cooling performance of heat sinks, topology optimization has experienced significant advancements in recent years and appears to be the most promising technology due to its highest degree of freedom to treat the uneven heating problem. This paper can serve as an essential reference contributing to the development of liquid-cooling heat sinks for efficient thermal management of electronics.

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Bhattacharya, A., and R. L. Mahajan. "Finned Metal Foam Heat Sinks for Electronics Cooling in Forced Convection." Journal of Electronic Packaging 124, no. 3 (July 26, 2002): 155–63. http://dx.doi.org/10.1115/1.1464877.

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In this paper, we present recent experimental results on forced convective heat transfer in novel finned metal foam heat sinks. Experiments were conducted on aluminum foams of 90 percent porosity and pore size corresponding to 5 PPI (200 PPM) and 20 PPI (800 PPM) with one, two, four and six fins, where PPI (PPM) stands for pores per inch (pores per meter) and is a measure of the pore density of the porous medium. All of these heat sinks were fabricated in-house. The forced convection results show that heat transfer is significantly enhanced when fins are incorporated in metal foam. The heat transfer coefficient increases with increase in the number of fins until adding more fins retards heat transfer due to interference of thermal boundary layers. For the 20 PPI samples, this maximum was reached for four fins. For the 5 PPI heat sinks, the trends were found to be similar to those for the 20 PPI heat sinks. However, due to larger pore sizes, the pressure drop encountered is much lower at a particular air velocity. As a result, for a given pressure drop, the heat transfer coefficient is higher compared to the 20 PPI heat sink. For example, at a Δp of 105 Pa, the heat transfer coefficients were found to be 1169W/m2-K and 995W/m2-K for the 5 PPI and 20 PPI 4-finned heat sinks, respectively. The finned metal foam heat sinks outperform the longitudinal finned and normal metal foam heat sinks by a factor between 1.5 and 2, respectively. Finally, an analytical expression is formulated based on flow through an open channel and incorporating the effects of thermal dispersion and interfacial heat transfer between the solid and fluid phases of the porous medium. The agreement of the proposed relation with the experimental results is promising.

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Alhusseny, Ahmed, Qahtan Al-Aabidy, Nabeel Al-Zurfi, Adel Nasser, Mohammed Al-Edhari, and Hayder Al-Sarraf. "GRAPHITE FOAM STRUCTURES AS AN EFFECTIVE MEANS TO COOL HIGH-PERFORMANCE ELECTRONICS." Kufa Journal of Engineering 15, no. 2 (May 3, 2024): 39–60. http://dx.doi.org/10.30572/2018/kje/150204.

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Due to their unique heat transfer features, graphite foams are used in the current analysis to form heat sinks effective enough to dissipate extreme heat generated within high-performance electronics. The heat sinks proposed are formed from foamed-baffles arranged either in parallel or perpendicular to the coolant paths through the staggered slots in between to alleviate the penalty of pressure drop while maintaining high heat dissipation capability. Two different sorts of dielectric coolants namely, air and the FC-3283 electronic liquid developed by 3MTM, have been utilized to directly dissipate the heat generated. The feasibility of the currently proposed heat sinks has been examined numerically based on the volume averaging concept of porous media employing the local thermal non-equilibrium model to account for interstitial heat exchange between the foam solid matrix and the fluid particles flowing across. A wide range of design parameters has been tested including the heat sink configuration along with structural characteristics of the graphite foam used. It has been found that foam baffles oriented perpendicular to the path of coolant flow can dissipate heat by about 50% better than those parallel to it, but with higher pressure losses. It has also been found that heat dissipation capability, for a certain orientation of baffles, can be improved by up to 100% when the foam pore size is doubled with outstanding saving in pressure losses by up to 300%. The impact of operating conditions, including the coolant flowrate and the heat flux applied, has also been inspected. The currently proposed heat sinks have been found efficient to meet the thermal demands of high-performance electronics and sweep away the extreme heat generated there with reasonable cost of pressure drop, where the proper selection of design parameters in light of the operating conditions applied can prevent the emergence of hot spots entirely. Extreme operating conditions, i.e. with heat density of up to 10W/cm2 for air-cooled heat sinks and 100W/cm2 for those cooled with FC-3283, can be well managed when a heat sink is configured from baffles that are oriented perpendicularly to the coolant flow path and formed of graphite foam having low porosity (∅=0.8) and larger pore size

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Ariyo, David Olugbenga, and Tunde Bello-Ochende. "Optimal design of subcooled triangular microchannel heat sink exchangers with variable heat loads for high performance cooling." Journal of Physics: Conference Series 2116, no. 1 (November 1, 2021): 012052. http://dx.doi.org/10.1088/1742-6596/2116/1/012052.

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Abstract Deionized water at a temperature of 25 °C was used as the cooling fluid and aluminium as the heat sink material in the geometric optimization and parameter modelling of subcooled flow boiling in horizontal equilateral triangular microchannel heat sinks. The thermal resistances of the microchannels were minimized subject to fixed volume constraints of the heat sinks and microchannels. A computational fluid dynamics (CFD) ANSYS code used for both the simulations and the optimizations was validated by the available experimental data in the literature and the agreement was good. Fixed heat fluxes between 100 and 500 W/cm2 and velocities between 0.1 and 7.0 m/s were used in the study. Despite the relatively high heat fluxes in this study, the base temperatures of the optimal microchannel heat sinks were within the acceptable operating range for modern electronics. The pumping power requirements for the optimal microchannels are low, indicating that they can be used in the cooling of electronic devices.

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Loganathan, Arulmurugan, and Ilangkumaran Mani. "Experimental investigations on Thermal Performance of Copper with Aluminium Based Finned Heat sinks for Electronics Cooling System." JOURNAL OF ADVANCES IN CHEMISTRY 12, no. 12 (June 15, 2016): 4582–87. http://dx.doi.org/10.24297/jac.v12i12.787.

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An Experimental investigation on the thermal performance of copper with aluminium based finned heat sinks for electronics cooling system was studied. The heat sinks have different material proportions containing major constituent of aluminium and minor constituent of copper. Considered with straight finned heat sink for the experiments for its easiness in fabrication and efficient heat transfer properties. The observational results for aluminium with copper alloy are compared with pure aluminium heat sink. Heat sink geometry, fin pitch and its height were taken from the commercially available heat sinks. In this research work best heat sink geometry is chosen and cooked up with different volume of copper added with aluminium. Selected four different spots of heat sinks and the temperature raising characteristics were measured for natural convection. also the temperature is raised to a fixed temperature and the temperature lowering characteristics were measured in forced convection as the air circulation takes more heat to keep the heat sink temperature within the desired level.

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Durgam, Shankar, Bharati Ghodake, and Suhas Mohite. "Numerical Investigation on Heat Sink Material for Temperature Control of Electronics." Journal of Physics: Conference Series 2312, no. 1 (August 1, 2022): 012016. http://dx.doi.org/10.1088/1742-6596/2312/1/012016.

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Abstract This article reports a numerical investigation on advanced heat sink material for thermal management of electronics. We investigated heat transfer enhancement using different heat sink materials. The cooling medium used for analysis is water. Forced water convection in copper alloy and aluminum alloy Al6060, Al6063 material micro-channel heat sinks cooling was studied numerically using Ansys Fluent. The heat sink is an essential element in a PC. The total efficiency, price, and size of the electronic device depend on the heat sink material. The heat transfer rate is a direct function of heat sink material. The simulation used three different velocities, 3, 5, and 7 m/s; the constant heat flux value taken is 8 × 105 W/m2. The parameters considered for heat sink material are thermal conductivity, thermal expansion coefficient, density, and cost. The ceramic materials have a low thermal expansion coefficient and higher thermal conductivity hence used as a substrate. Results show that aluminum alloys are suitable materials for heat sinks because of their cost, weight, and ease of machinability.

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Zhao, C. Y., and T. J. Lu. "Analysis of microchannel heat sinks for electronics cooling." International Journal of Heat and Mass Transfer 45, no. 24 (November 2002): 4857–69. http://dx.doi.org/10.1016/s0017-9310(02)00180-1.

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8

Singh, Reeti. "Hybrid Heat Sink Manufacturing by Cold Spray." AM&P Technical Articles 179, no. 3 (April 1, 2021): 37–38. http://dx.doi.org/10.31399/asm.amp.2021-03.p037.

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Sathe, Anilkumar, and Sudarshan Sanap. "Augmentation of Thermal Performance of Plate Fin Heat Sink." International Journal of Engineering and Advanced Technology 8, no. 6s (September 6, 2019): 1087–94. http://dx.doi.org/10.35940/ijeat.f1213.0886s19.

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Heat sinks are popularly used in various industrial applications to cool electrical, electronics and automobile components. They are useful in removing the heat from the surfaces at elevated temperatures. The life of such devices depends on their operating temperature. Heat sinks are important parts of thermal management systems of most of these devices eg: Diods, thyristers, high power semiconductor devices such as integrated circuits of inverters, audio amplifier, microprocessors, microcontrollers etc. In many situations where heat transfer is by free convection where convective heat transfer coefficient is low, fins are the best solution because of their less cost and trouble free operation. The weight and size of equipment are the most important parameters of design. Present day demand, the use of compact systems in every application which leads to higher packing density. The failure rate of electronic equipments increase exponentially with the temperature. Also the high thermal stresses in the solder joints of electronic components mounted on circuit boards resulting from temperature variation are major causes of failure. Therefore thermal control has become an important factor in the design and operation of electronic equipment. The most preferred method for cooling these systems is passive cooling because it is cost effective and reliable. This leads to focus on development of effective fin heat sink. To make heat sink effective, geometry and orientation of the heat sink as well as heat transfer augmentation techniques plays important role. This paper highlights the use of heat sinks in electronic cooling applications and review of related literature of improving the heat transfer performance of plate fin heat sinks by surface modifications, interrupting the boundary layer and changing the orientation.

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Bhattacharya, A., and R. L. Mahajan. "Metal Foam and Finned Metal Foam Heat Sinks for Electronics Cooling in Buoyancy-Induced Convection." Journal of Electronic Packaging 128, no. 3 (September 23, 2005): 259–66. http://dx.doi.org/10.1115/1.2229225.

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In this paper, we present our recent experimental results on buoyancy-induced convection in aluminum metal foams of different pore densities [corresponding to 5, 10, 20, and 40 pores per in. (PPI)] and porosities (0.89–0.96). The results show that compared to a heated surface, the heat transfer coefficients in these heat sinks are five to six times higher. However, when compared to commercially available heat sinks of similar dimensions, the enhancement is found to be marginal. The experimental results also show that for a given pore size, the heat transfer rate increases with porosity, suggesting the dominant role played by conduction in enhancing heat transfer. On the other hand, if the porosity is held constant, the heat transfer rate is found to be lower at higher pore densities. This can be attributed to the higher permeability with the larger pores, which allows higher entrainment of air through the porous medium. New empirical correlations are proposed for the estimation of Nusselt number in terms of Rayleigh and Darcy numbers. We also report our results on novel finned metal foam heat sinks in natural convection. Experiments were conducted on aluminum foams of 90% porosity with 5 and 20 PPI with one, two, and four aluminum fins inserted in the foam. All of these heat sinks were fabricated in-house. The results show that the finned metal foam heat sinks are superior in thermal performance compared to the normal metal foam and conventional finned heat sinks. The heat transfer increases with an increase in the number of fins. However, the relative enhancement is found to decrease with each additional fin. The indication is that there exists an optimum number of fins beyond which the enhancement in heat transfer, due to increased surface area, is offset by the retarding effect of overlapping thermal boundary layers. Similar to normal metal foams, the 5 PPI samples are found to give higher values of h compared to the 20 PPI samples due to higher permeability of the porous medium. Future work is planned to arrive at the optimal heat sink configuration for even larger enhancement in heat transfer.

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11

Ganesan, Dhanushkodi, Venkata Madhavan, and Velraj Ramalingam. "Thermal studies on heat sinks exposed to solar irradiation." Thermal Science, no. 00 (2023): 81. http://dx.doi.org/10.2298/tsci230110081g.

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The effect of solar irradiation on the temperature of an electronic device attached to a heat sink is studied. Heat sinks with different surface treatments are considered for this study. The contribution of absorbed solar heat by the Alumina coated fin surface varies from 2.1 % to 12.4 % of the heat generated by the electronic devices and it reveals that the amount of solar heat absorbed by the black painted heat sink is almost equal to the heat generated by the electronics system. It is also found that the percentage of heat transfer by radiation varies from 6.2 % to 11.0 % for commercial finish heat sinks and is as high as 58.7% for a black painted heat sink. The combined effect of emissivity and solar absorptivity is studied to optimize the heat sink. For 10 mm fin height, the black painted heat sink illustrates better performance and for 20 mm and 30 mm fin height, the Alumina coated heat sink exhibits better performance. The temperature of the electronic device increases when the base area of the heat sink is increased beyond 700 cm2, which is the optimum base area. When the fin height is increased to 20 mm, the optimum base area for the black painted and Alumina coated heat sink is also increased to 780 cm2 and 850 cm2 respectively, thus reducing the device temperature further. The CFD results are validated with the temperature measurement conducted on the heat sink exposed to solar irradiation.

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Madhaiyan, Rajasekaran, Kannan Thannir Pandal Palayam Kandasamy, Kumaragurubaran Balasubramanian, and Mohan Raman. "Experimental study on heat transfer performance of variable area straight fin heat sinks with PCM." Thermal Science 26, no. 2 Part A (2022): 983–89. http://dx.doi.org/10.2298/tsci201013299m.

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The thermal performance of heat sinks with variable area straight fins with and without PCM is quantitatively explored in this article. The effects of diverse fin geometries (constant area straight fin, variable area straight fin, circular pin fin, hemispherical pin fin, and elliptical pin fin), varying Reynolds numbers, and fin densities on boosting electronics cooling performance were investigated. The goal of this research is to develop the best fin geometry for electronics cooling technologies. This research demonstrates that altering fin density can improve heat sink thermal performance while also reducing heat sink weight. The base temperature of the heat sink is found to be lower in variable area straight fins. In comparison to alternative configurations for heat transfer with PCM, the results show that variable area straight fin heat sinks are the most effective. The thermal resistance of the improved heat sink with variable fin density was reduced by 9%.

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Pilagatti, Adriano Nicola, Gabriele Piscopo, Eleonora Atzeni, Luca Iuliano, and Alessandro Salmi. "Design of additive manufactured passive heat sinks for electronics." Journal of Manufacturing Processes 64 (April 2021): 878–88. http://dx.doi.org/10.1016/j.jmapro.2021.01.035.

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C M, Arun kumar, Mukesh kumar P C, and Kavitha C. "Investigating the thermal effect of channel heatsink using MWCNTs nanofluids." E3S Web of Conferences 399 (2023): 06002. http://dx.doi.org/10.1051/e3sconf/202339906002.

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The utilisation of Multi-walled carbon nanotubes (MWCNTs) nanofluids is considered to be a highly efficient approach in the field of thermal engineering, specifically for the purpose of cooling electronic processors. The usage of a microchannel along with an electronic chip for liquid cooling of electronics presents a compelling substitute to the conventional bulky aluminium heat sinks. A minichannel heat sink employing MWCNTs nanofluid as a coolant is further enhanced in thermal and hydraulic performance. In order to analyze the performance of the minichannel heat sinks, a conjugate heat transfer model has been solved using the commercial software ANSYS-CFD. Theoretically, it showed that the presence of MWCNTs reduced thermal resistance and increased the thermal conductivity of liquid cooling system. The results reveal a maximum enhancement of in average heat transfer coefficient ( h ) for minichannel heat sink using MWCNTs as a coolant at volume 40%, 46%, and 52% concentrations of 0.25%, 0.5% and 0.75%. The performance evaluation shows that the overall performance of the minichannel heat sink using MWCNTs cooled minichannel heat sink at 0.75% volume concentration is roughly enhanced more as compared to water.

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Whitt, Reece, and David Huitink. "THERMAL VALIDATIONS OF ADDITIVE MANUFACTURED NON-METALLIC HEAT SPREADING DEVICE FOR HOT SPOT MITIGATION IN POWER MODULES." International Symposium on Microelectronics 2019, no. 1 (October 1, 2019): 000398–403. http://dx.doi.org/10.4071/2380-4505-2019.1.000398.

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Abstract As energy demands and power electronics density scale concurrently, reliability of such devices is being challenged. Inadequate thermal management can cause system-wide failures due to thermal run-away, thermal expansion induced stresses, interconnect fractures and many more. Conventional techniques used to cool devices consist of heavy, metallic systems such as cold plates and large heat sinks, which can significantly reduce the overall system power density. Moreover, the manufacturing of such components is expensive and often requires custom-made cold plates for improved integration with the electronic system. Although used as a standard practice, these metallic thermal management systems have the potential to intensify electro-magnetic interference (EMI) when coupling with high frequency switching power electronics, and the material density increases the weight of the system, which is detrimental in mobile applications. Lastly, cold plates and heat sinks can create non-uniform cooling profiles in the electronics due to the insufficient management of hot-spots. To combat these drawbacks, a new heat spreader design has been proposed which reduces weight and EMI effects while eliminating hot-spots through localized fluid impingement. This current study describes the methodology and construction of the experimental test setup to characterize the performance of the heat spreading device compared to an off-the-shelf cold plate. Through infrared imagining, the viability of two heated test sections are evaluated in their ability to replicate power module temperature profiles during operation.

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Chen, Han-Ting, Jenn-Tsong Horng, Po-Li Chen, and Ying-Huei Hung. "Optimal Design for PPF Heat Sinks in Electronics Cooling Applications." Journal of Electronic Packaging 126, no. 4 (December 1, 2004): 410–22. http://dx.doi.org/10.1115/1.1826078.

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An effective method for predicting and optimizing the thermal performance of heat sinks with Parallel-Plain Fin under a given design constraint of pressure drop has been successfully developed in the study. The thermal and hydrodynamic performance analyzers for PPF heat sinks have been developed. A screening experimental design using the Taguchi method is performed to determine key factors that are critical to the design and screen out unimportant design factors; and a Response Surface Methodology is then applied to establish analytical models for the thermal resistance and pressure drop in terms of the key design factors with a CCD experimental design. By employing the Sequential Quadratic Programming technique, a series of constrained optimal designs can be efficiently performed. Comparisons between these predicted optimal designs and those evaluated by the theoretical calculations are made with satisfactory agreement.

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Hegde, Pradeep, and K. N. Seetharamu. "Effects of Nonuniform Base Heating on Single Stack and Multi-Stack Microchannel Heat Sinks Used for Electronics Cooling." Journal of Microelectronics and Electronic Packaging 7, no. 2 (April 1, 2010): 90–98. http://dx.doi.org/10.4071/1551-4897-7.2.90.

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Numerical investigations with regard to the thermal characteristics of water cooled single stack and multistack microchannel heat sinks subjected to nonuniform base heating are conducted. Nonuniformities in base heating are accomplished by applying gradually increasing and gradually decreasing base heat fluxes with respect to coolant flow direction in the heat sink. The effects of heat concentration upstream, downstream, and in the center half of the microchannel heat sinks (similar to a hotspot) are also studied. Both parallel flow and counter coolant flow conditions in the heat sink are considered and the results are compared. The results are presented in the form of base temperature distribution and heat sink thermal resistance. The finite element method is used for the analysis.

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Klett, J. W., and M. Trammell. "Addendum: Modular Heat Sinks for Desktop Computers and Other Electronics." IEEE Transactions on Device and Materials Reliability 4, no. 4 (December 2004): 638–40. http://dx.doi.org/10.1109/tdmr.2004.836731.

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YUKI, Kazuhisa, Kio TAKAI, Ken-taro ANJU, Risako KIBUSHI, Noriyuki UNNO, Tetsuro OGUSHI, Masaaki MURAKAMI, and Takuya IDE. "Thermal management of electronics by uni-directional porous heat sinks." Proceedings of Mechanical Engineering Congress, Japan 2017 (2017): J0330103. http://dx.doi.org/10.1299/jsmemecj.2017.j0330103.

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Fathi, Mostafa, Mohammad Mahdi Heyhat, Mohammad Zabetian Targhi, and Sajjad Bigham. "Porous-fin microchannel heat sinks for future micro-electronics cooling." International Journal of Heat and Mass Transfer 202 (March 2023): 123662. http://dx.doi.org/10.1016/j.ijheatmasstransfer.2022.123662.

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Brighenti, Flavio, Natrah Kamaruzaman, and Juergen J. Brandner. "Investigation of self-similar heat sinks for liquid cooled electronics." Applied Thermal Engineering 59, no. 1-2 (September 2013): 725–32. http://dx.doi.org/10.1016/j.applthermaleng.2013.01.001.

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Mani, Premkumar, Santhanakrishnan Radhakrishnan, Arulprakasajothi Mahalingam, and Suresh Vellaiyan. "Heat dissipation effects of different nanocoated lateral fins: An experimental investigation." Thermal Science, no. 00 (2023): 234. http://dx.doi.org/10.2298/tsci230715234m.

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Electrical batteries, mobile phones, central processing units of computing systems, and scientific instruments lose life due to improper heat transfer. Thermal management enables these electronics to run smoothly. This experiment measures heat sink temperature fluctuations during heating and cooling using lateral fins coated with graphene and carbon nanotubes. The study examined 15 W, 25 W, 35 W, and 45 W heat inputs to record the time to reach 40, 50, and 60?C. Regardless of the coating material used in the heat sink, the time taken by the heat sinks to attain 60?C was more than 3000 s. Heat input reduced the time to below 3000 s. Heat sinks dissipated heat until 32?C during cooling. Infrared spectroscopy showed fins and heat sinks' energy retention. Convective heat transfer cooled the middle row of fins, and coated and uncoated heat sinks were evaluated for enhancement ratio. Coating the heat sink with graphene resulted in an enhancement in heat transfer by 1.15. While heating at 15 W, the CNT-coated heat sink exhibited a 1.9 enhancement ratio. The graphene-coated heat sink had an enhancement ratio for 25 W, 35 W, and 45 W heat inputs. The study found that operating temperature, input energy, and nano-coatings affect heat sink performance. This work can help optimise heat transfer from the heat sink to the atmosphere by determining nanocoating thickness. Mixed-material coating studies can disclose heat sink performance.

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Lehmann, G. L., and S. J. Kosteva. "A Study of Forced Convection Direct Air Cooling in the Downstream Vicinity of Heat Sinks." Journal of Electronic Packaging 112, no. 3 (September 1, 1990): 234–40. http://dx.doi.org/10.1115/1.2904372.

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An experimental study of forced convection heat transfer is reported. Direct air cooling of an electronics packaging system is modeled by a channel flow, with an array of uniformly sized and spaced elements attached to one channel wall. The presence of a single or complete row of longitudinally finned heat sinks creates a modified flow pattern. Convective heat transfer rates at downstream positions are measured and compared to that of a plain array (no heat sinks). Heat transfer rates are described in terms of adiabatic heat transfer coefficients and thermal wake functions. Empirical correlations are presented for both variations in Reynolds number (5000 < Re < 20,000) and heat sink geometry. It is found that the presence of a heat sink can both enhance and degrade the heat transfer coefficient at downstream locations, depending on the relative position.

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Schwarzer-Fischer, Eric, Uwe Scheithauer, and Alexander Michaelis. "CerAMfacturing of Aluminum Nitride with High Thermal Conductivity via Lithography-Based Ceramic Vat Photopolymerization (CerAM VPP)." Ceramics 6, no. 1 (February 2, 2023): 416–31. http://dx.doi.org/10.3390/ceramics6010024.

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Aluminum nitride (AlN) is an excellent material for heat sinks and is used, for example, in high-performance electronics, high-power LEDs and photovoltaics. In order to meet the constantly increasing demands on substrate materials and heat sinks resulting from the permanent increase in power density and resulting heat in electronic components, new types of components made of high-performance materials with highly complex geometries are required. In this work, AlN based on a commercial powder (“TOYALNITE®”-JCGA-BLY5 by Toyal Europe), was successfully qualified for an AM technology through suspension and process development for CerAM VPP—a DLP-based vat photo polymerization technology. The properties of the components were characterized along the entire process chain, achieving densities of 3.33 g/cm3 (>99% Th.D.) and excellent thermal conductivities of more than 180 W/mK, which are comparable to state-of-the-art for conventionally manufactured AlN components. Homogeneous microstructures of good quality confirm the measured density and thermal conductivity. A complex-shaped component usable for an exemplary heating–cooling application demonstrates the potential of this development.

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Yeh, Lian-Tuu. "Optimized Finned Heat Sinks for Natural Convection Cooling of Outdoor Electronics." Journal of Electronics and Information Science 3, no. 2 (2018): 22–33. http://dx.doi.org/10.23977/jeis.2018.32011.

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BHAVNANI, SUSHIL H., STACEY E. BALCH, and RICHARD C. JAEGER. "CONTROL OF INCIPIENCE HYSTERESIS EFFECTS IN LIQUID COOLED ELECTRONICS HEAT SINKS." Journal of Electronics Manufacturing 09, no. 02 (June 1999): 179–90. http://dx.doi.org/10.1142/s0960313199000106.

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Petroski, J., M. Arik, and M. Gursoy. "Optimization of Piezoelectric Oscillating Fan-Cooled Heat Sinks for Electronics Cooling." IEEE Transactions on Components and Packaging Technologies 33, no. 1 (March 2010): 25–31. http://dx.doi.org/10.1109/tcapt.2009.2023859.

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Lampio, K., and R. Karvinen. "Multi-objective optimization of electronics heat sinks cooled by natural convection." Journal of Physics: Conference Series 745 (September 2016): 032068. http://dx.doi.org/10.1088/1742-6596/745/3/032068.

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Bhavnani, S. H., G. Fournelle, and R. C. Jaeger. "Immersion-cooled heat sinks for electronics: insight from high-speed photography." IEEE Transactions on Components and Packaging Technologies 24, no. 2 (June 2001): 166–76. http://dx.doi.org/10.1109/6144.926379.

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Fathi, Mostafa, Mohammad Mahdi Heyhat, Mohammad Zabetian Targhi, and Arash Emadi. "Semi-porous-fin microchannel heat sinks for enhanced micro-electronics cooling." International Communications in Heat and Mass Transfer 157 (September 2024): 107814. http://dx.doi.org/10.1016/j.icheatmasstransfer.2024.107814.

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Soloveva, Olga V., Sergei A. Solovev, and Rozalina Z. Shakurova. "Numerical Study of the Thermal and Hydraulic Characteristics of Plate-Fin Heat Sinks." Processes 12, no. 4 (April 6, 2024): 744. http://dx.doi.org/10.3390/pr12040744.

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One of the main trends in the development of the modern electronics industry is the miniaturization of electronic devices and components. Miniature electronic devices require compact cooling systems that can dissipate large amounts of heat in a small space. Researchers are exploring ways to improve the design of the heat sink of the cooling system in such a way that it increases the heat flow while at the same time reducing the size of the heat sink. Researchers have previously proposed different designs for heat sinks with altered fin shapes, perforations, and configurations. However, this approach to optimizing the design of the heat sink results in an increase in the labor intensity of its production. Our goal is to optimize the heat sink design to reduce its size, reduce metal consumption, and increase heat flow. This goal is achieved by changing the number of fins and the distance between them. In this case, there is no significant difference in the geometry of a conventional plate-fin heat sink, and a low labor intensity of production is ensured. A numerical investigation of heat flow and pressure drop in models of plate-fin heat sinks of various sizes and metal volumes was conducted using the ANSYS Fluent software package (v. 19.2) and computational fluid dynamics employing the control volume method. We used the SST k-ω turbulence model for the calculations. The research results showed that by changing the number of fins and the distance between them, it is possible to increase the heat flow from the heat sink to 24.44%, reduce its metal consumption to 6.95%, and reduce its size to 30%. The results of this study may be useful to manufacturers of cooling systems who seek to achieve a balance between the compactness of the heat sink and its ability to remove large amounts of heat.

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Kang, Soo-Jin, Sung-Woo Park, Hye-Yoon Choi, Gu-Hyun Ryu, Jong-Pil Kim, Sung-Hoon Jung, Se-Young Kim, Hyon-Ik Lee, and Hyun-Ung Oh. "Thermo-Mechanical Design and Validation of Spaceborne High-Speed Digital Receiver Unit for Synthetic Aperture Radar Application." Aerospace 8, no. 10 (October 16, 2021): 305. http://dx.doi.org/10.3390/aerospace8100305.

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This paper presents the effectiveness of the thermo-mechanical design of a high-speed digital receiver unit (HSDRU) developed for spaceborne synthetic aperture radar applications. The main features of HSDRU’s thermo-mechanical design include the thermal management of high-heat dissipation units by adopting heat sinks with the additional function of structural stiffeners and securing the heat rejection path to the upper side of electronics that interfaces the foil radiator for the on-orbit passive thermal control of electronics exposed to deep space environments. The thermal design, which adopts a thermal gap pad, is closely related to the solder joint fatigue life in a launch vibration environment, owing to its initial compressive static load between the heat sink and heat dissipation units that enhances the heat transfer capability. The effectiveness of the design was validated via the qualification level of launch environment tests.

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Patra, Ayush Kumar, Aditya Tripathi, and N. Vijay Krishna. "Design and simulation of heat sink for exhaust heat recovery system using thermoelectric generator." Journal of Physics: Conference Series 2054, no. 1 (October 1, 2021): 012037. http://dx.doi.org/10.1088/1742-6596/2054/1/012037.

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Abstract Heat sinks are a classification of heat exchangers ideally utilised in electronics to cool them. They can be simply fabricated, have low cost and are reliable for heat dissipation purpose. The protruding surfaces from them are called fins. They can be flat-plate or pin shaped. The aim of the present study is to investigate the performance characteristics of a heat sink. The materials and the fin design will be used as two major factors to increase the heat dissipation from the test apparatus. The project will show a three-dimensional analysis, using COMSOL 5.3a, which will verify with accessible exploratory information in the existing data for a continued finned heat sink. It will also identify the heat dissipation and mean temperature distribution of the heat sink for natural convection. Before moving on to design and simulation of heat sink, the first aim was to construct and simulate a leg of a thermoelectric generator model for obtaining the optimum working region of the thermoelectric generator taking into consideration the properties such as temperature difference and heat transfer coefficient. Therefore, available research techniques are briefed upon which enhance the heat removal from heat sinks.

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Hsieh, Chien-Te, Cheng-En Lee, Yu-Fu Chen, Jeng-Kuei Chang, and Hsi-sheng Teng. "Thermal conductivity from hierarchical heat sinks using carbon nanotubes and graphene nanosheets." Nanoscale 7, no. 44 (2015): 18663–70. http://dx.doi.org/10.1039/c5nr04993h.

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The relationship between thermal conductivity (k) and electrical conductivity (ε) values was well described by two empirical equations. The experimental results were obtained within the 323–373 K range, suitably complementing the thermal management of chips for consumer electronics.

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Krishnan, Shankar, and Suresh V. Garimella. "Thermal Management of Transient Power Spikes in Electronics—Phase Change Energy Storage or Copper Heat Sinks?" Journal of Electronic Packaging 126, no. 3 (September 1, 2004): 308–16. http://dx.doi.org/10.1115/1.1772411.

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A transient thermal analysis is performed to investigate thermal control of power semiconductors using phase change materials, and to compare the performance of this approach to that of copper heat sinks. Both the melting of the phase change material under a transient power spike input, as well as the resolidification process, are considered. Phase change materials of different kinds (paraffin waxes and metallic alloys) are considered, with and without the use of thermal conductivity enhancers. Simple expressions for the melt depth, melting time and temperature distribution are presented in terms of the dimensions of the heat sink and the thermophysical properties of the phase change material, to aid in the design of passive thermal control systems. The simplified analytical expressions are verified against numerical simulations, and are shown to be excellent tools for design calculations. The suppression of junction temperatures achieved by the use of phase change materials when compared to the performance with copper heat sinks is illustrated. Merits of employing phase change materials for pulsed power electronics cooling applications are discussed.

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Arshad, Adeel, Mark Jabbal, Pouyan Talebizadeh Sardari, Muhammad Anser Bashir, Hamza Faraji, and Yuying Yan. "Transient simulation of finned heat sinks embedded with PCM for electronics cooling." Thermal Science and Engineering Progress 18 (August 2020): 100520. http://dx.doi.org/10.1016/j.tsep.2020.100520.

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Kandasamy, Ravi, Xiang-Qi Wang, and Arun S. Mujumdar. "Transient cooling of electronics using phase change material (PCM)-based heat sinks." Applied Thermal Engineering 28, no. 8-9 (June 2008): 1047–57. http://dx.doi.org/10.1016/j.applthermaleng.2007.06.010.

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Nmadu, D., N. C. Eli-Chukwu, U. U. Uma, O. E. Ogah, A. A. Parshuto, M. I. Eheduru, S. I. Ezichi, and C. N. Ogbonna-Mba. "Using High Voltage Electrochemical Oxidation (HVEO) to obtain protective coatings, surface finishing on electronic materials." Digest Journal of Nanomaterials and Biostructures 17, no. 2 (April 2022): 569–77. http://dx.doi.org/10.15251/djnb.2022.172.569.

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Electronics and microelectronic components such as printed circuit board, capacitors, CPU heat sinks, hard drive, etc. commonly encounter harsh environmental conditions during their operational lifetime. To protect the electronics materials from conditions like corrosion, wear, humidity and contaminants, aluminium protective coating materials can be used. However, the behavior of materials in harsh environments and their effect on the reliability of electronics in industrial products has been studied only very little. Moreover, the changes in the parameters (current density, temperature and time) of commonly used aluminium under various conditions remain largely unknown. In this paper, High Voltage Electrochemical Oxidation (HVEO) was used to produce a high microhardness of 440HV and high surface thickness of up to 44µm oxide coatings on aluminum alloy AMg2 (analogues of 5052-H32 alloy) for electronic components protection. The process was carried out in electrolyte of tartaric acid and sulfuric acid as an electrolyte under constant duration for each sample and various anodizing temperatures and current densities. The samples used in the study were aluminum used for commercial electronics devices designed for use in harsh conditions.

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Zhang, Yichi, Shinichi Saito, Yoshishige Tsuchiya, and Yeliang Wang. "Theoretical calculation and simulation of surface-modified scalable silicon heat sink for electronics cooling." Thermal Science 25, no. 6 Part A (2021): 4181–87. http://dx.doi.org/10.2298/tsci2106181z.

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A surface-modified scalable heat sink that can be fabricated by applying silicon microfabrication technology has been proposed in this paper. Theoretical estimation of the heat sink thermal resistance is based on the heat sink with overall size of 1 cm ? 1 cm ? 1 cm, and four kinds of structure with various total number of grooves on the surface of fins have been investigated. Finite element analysis has been conducted by using COMSOL Multiphysics where fluid dynamics and heat transfer are taken into account. As a result, the lowest heat sinks thermal resistance of 6.84?C per Watt is achieved for the structure with a larger fin area (13.1 cm2) and a higher inlet air flow rate (4 m/s), suggesting an optimum fin area depending on the air flow rate.

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Mane, Shreya. "Theoretical Aspects on Heat Transfer and Fluid Flow in Micro Channels." 3 1, no. 3 (December 1, 2022): 16–21. http://dx.doi.org/10.46632/jame/1/3/3.

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The past ten years have seen a lot of research on the issues of heat transfer and fluid flow in micro-channels. With an emphasis on upcoming research requirements, a critical analysis of the state of research as it stands is offered. Following a brief introduction, the study discusses six themes related to transport phenomena in micro-channels: condensation, cooling of electronics, single-phase gas flow, augmentation of single-phase liquid flow and flow boiling, and micro-scale heat exchangers. In this study, we investigate the three-dimensional heat transfer and water flow properties in a set of rectangular micro-channel heat sinks for advanced electronic systems. Over the past ten years, mini/micro channel type compact heat exchangers have received a lot of attention. The ability to make heat exchangers smaller, lighter, and cheaper than those in use now is the primary motivator. Additionally, emerging applications that call for the cooling of small things, such electronics and micro-electro-mechanical devices, need for heat exchangers with tiny channels. Theoretically, it is examined how a nanofluid moves and transfers heat through a horizontal micro channel while being affected by a magnetic field and an electric double layer (EDL). The flow problem for a micro channel with a large aspect ratio is handled as a two-dimensional nonlinear system. The magnetic field and EDL body force are taken into account while calculating momentum equation

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Mozafari, M., Ann Lee, and Javad Mohammadpour. "Thermal management of single and multiple PCMs based heat sinks for electronics cooling." Thermal Science and Engineering Progress 23 (June 2021): 100919. http://dx.doi.org/10.1016/j.tsep.2021.100919.

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Ji, Xinyu, Xiaoping Yang, Yuantong Zhang, Yonghai Zhang, and Jinjia Wei. "Experimental study of ultralow flow resistance fractal microchannel heat sinks for electronics cooling." International Journal of Thermal Sciences 179 (September 2022): 107723. http://dx.doi.org/10.1016/j.ijthermalsci.2022.107723.

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Baby, R., and C. Balaji. "Thermal management of electronics using phase change material based pin fin heat sinks." Journal of Physics: Conference Series 395 (November 26, 2012): 012134. http://dx.doi.org/10.1088/1742-6596/395/1/012134.

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Wu, Xincheng, An Zou, Qiang Zhang, and Zhaoguang Wang. "Impact of jet intermittency on surface-structured heat sinks for electronics liquid cooling." Applied Thermal Engineering 236 (January 2024): 121911. http://dx.doi.org/10.1016/j.applthermaleng.2023.121911.

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BĂJENESCU, Titu-Marius. "Miniaturisation of Electronic Components and the Problem of Device Overheating." Electrotehnica, Electronica, Automatica 69, no. 2 (May 15, 2021): 53–58. http://dx.doi.org/10.46904/eea.21.69.2.1108006.

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With the ever-increasing rate of data generation and communication, as well as the constant push to reduce the size and costs of industrial converter systems, the power density of electronics has risen. Consequently, cooling, with its enormous energy and water consumption, has an increasingly large environmental impact, and new technologies are needed to extract the heat in a more sustainable way-that is, requiring less water and energy. Embedding liquid cooling directly inside the chip is a promising approach for more efficient thermal management. However, the electronics and cooling are treated separately, leaving the full energy-saving potential of embedded cooling untapped. By removing the need for large external heat sinks, this approach should enable the realization of very compact power converters integrated on a single chip.

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Bhobe, Alpesh, Herman Chu, Lynn Comiskey, Xiangyang Jiao, and Xiao Li. "Thermal and EMI Performance of Composite Plastic Molded Heat Sinks and Hybrid TIM Materials." International Symposium on Microelectronics 2014, no. 1 (October 1, 2014): 000222–28. http://dx.doi.org/10.4071/isom-tp24.

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Heat sinks are widely used in thermal management of electronics. However, it is also well established that a heat sink can couple and radiate electro-magnetic (EM) energy from the same component that it is cooling. As the frequency of these devices continues to increase, it is more crucial to try to suppress the EM radiation at the source. The component suppliers for thermal management and EMI products have been developing materials that are thermally conductive and also have EM absorbing properties. The thermal and EMI material properties of the additives can change the properties of the final material and they may not always be complementary between thermal and EM absorbing behaviors. In this paper, two such hybrid solutions are investigated to understand the thermal and EM absorbing characteristics and interactions. These are: (1) heat sinks made of composite plastic materials; and (2) hybrid RF/thermal interface materials (HRTIMs). For the heat sink study, three heat sinks of the same physical design (40mm square x 8.25mm tall) but with different materials are tested and analyzed. Two of the heat sinks are molded from two different composite plastics (Materials A and B), while the third one is constructed from aluminum and used as the baseline heat sink for comparison. The results presented in Figure 7 show EMI improvement for composite material heat sinks over the traditional aluminum heat sink. Material A provides a broadband reduction of 2–3 dB power whereas Material B heat sink provides significant reduction at lower frequency range of 1–8 GHz. The thermal performance results are plotted in Figure 11 – Figure 14, and the results show that the composite plastic materials are more suitable for applications that have lower power and power density. For the HRTIMs, two different base materials at different thicknesses are investigated and the material details are given in Table 2 . Similar to the heat sink EMI study, Total Radiated Power (TRP) measurements are performed for the HRTIMs in an Electromagnetic Reverberation Chamber in the frequency range of 5–40 GHz show improvement for material TIM 1. The EMI results are plotted in Figure 9 and Figure 10. For thermal performance characterizations, an ASTM D-5470 compliance test stand (Figure 6) is used. The thermal impedance results of these materials are plotted in Figure 15.

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Zahid, Imran, Muhammad Farooq, Muhammad Farhan, Muhammad Usman, Adnan Qamar, Muhammad Imran, Mejdal A. Alqahtani, Saqib Anwar, Muhammad Sultan, and Muhammad Yasar Javaid. "Thermal Performance Analysis of Various Heat Sinks Based on Alumina NePCM for Passive Cooling of Electronic Components: An Experimental Study." Energies 15, no. 22 (November 10, 2022): 8416. http://dx.doi.org/10.3390/en15228416.

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In the modern digital world, electronic devices are being widely employed for various applications where thermal performance represents a significant technical challenge due to continued miniaturization, high heat generated in the system, and non-uniform high-temperature causing failure. Phase change materials (PCMs) owing to the immense heat of fusion are primarily considered for thermal management, but their insulating properties hedge their applications in electronics cooling. Nano-enhanced phase change materials (NePCMs) have the ability to improve the thermal conductivity of PCM, decrease system temperature and escalate the operating time of devices. Accordingly, the current study focused on the experimental investigations for the thermal performance of three heat sinks (HS) with different configurations such as a simple heat sink (SHS), a square pin-fins heat sink (SpfHS), and Cu foam integrated heat sink (CufmHS) with various alumina nanoparticles mass concentrations (0.15, 0.20 and 0.25 wt%) incorporated in PCM (RT-54HC) and at heat flux (0.98–2.94 kW/m2). All HSs reduced the base temperature with the insertion of NePCM compared to the empty SHS. The experimental results identified that the thermal performance of CufmHS was found to be superior in reducing base temperature and enhancing working time at two different setpoint temperatures (SPTs). The maximum drop in base temperature was 36.95%, and a 288% maximum working time enhancement was observed for CufmHS. Therefore, NePCMs are highly recommended for the thermal management of the electronic cooling system.

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Akula, Rajesh, and Chakravarthy Balaji. "Effect of PCM fill ratio and heat sink orientation on the thermal management of transient power spikes in electronics." Journal of Physics: Conference Series 2116, no. 1 (November 1, 2021): 012077. http://dx.doi.org/10.1088/1742-6596/2116/1/012077.

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Abstract The goal of this paper is to investigate the usefulness of Phase Change Material based heat sinks in power surge operations. Experiments have been carried out on a PCM based heat sink for different fill ratios (0, 33, 66, and 99%) of the PCM and different orientations (0, 90, 180°) of the heat sink under constant and power surge heat loads. The heat sink with a fill ratio of 0% is considered as the baseline case for comparison. The heat sink with a fill ratio of 66% at 0° orientation recorded lower temperatures among all the fill ratios and orientations under both constant and power surge heat loads. Partial filling (66% fill ratio) of the PCM in the cavity is more effective than complete filling (99% fill ratio) in handling both constant and power surge heat loads.

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Chen, Peijia, Xin Ge, Zhicong Zhang, Shuang Yin, Weijie Liang, and Jianfang Ge. "Silicone-Based Thermally Conductive Gel Fabrication via Hybridization of Low-Melting-Point Alloy–Hexagonal Boron Nitride–Graphene Oxide." Nanomaterials 13, no. 3 (January 25, 2023): 490. http://dx.doi.org/10.3390/nano13030490.

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Thermal contact resistance between the microprocessor chip and the heat sink has long been a focus of thermal management research in electronics. Thermally conductive gel, as a thermal interface material for efficient heat transfer between high-power components and heat sinks, can effectively reduce heat accumulation in electronic components. To reduce the interface thermal resistance of thermally conductive gel, hexagonal boron nitride and graphene oxide were hybridized with a low-melting-point alloy in the presence of a surface modifier, humic acid, to obtain a hybrid filler. The results showed that at the nanoscale, the low-melting-point alloy was homogeneously composited and encapsulated in hexagonal boron nitride and graphene oxide, which reduced its melting range. When the temperature reached the melting point of the low-melting-point alloy, the hybrid powder exhibited surface wettability. The thermal conductivity of the thermally conductive gel prepared with the hybrid filler increased to 2.18 W/(m·K), while the corresponding thermal contact resistance could be as low as 0.024 °C/W. Furthermore, the thermal interface material maintained its excellent electric insulation performance, which is necessary for electronic device applications.

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McCay, Oisín, Rajesh Nimmagadda, Syed Mughees Ali, and Tim Persoons. "A Parametric Design Study of Natural-Convection-Cooled Heat Sinks." Fluids 8, no. 8 (August 21, 2023): 234. http://dx.doi.org/10.3390/fluids8080234.

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Effective natural-convection-cooled heat sinks are vital to the future of electronics cooling due to their low energy demand in the absence of an external pumping agency in comparison to other cooling methods. The present numerical study was carried out with ANSYS Fluent and aimed at identifying a more-effective fin design for enhancing heat transfer in natural convection applications for a fixed base-plate size of 100 mm × 100 mm under an applied heat flux of 4000 W/m2. The Rayleigh number used in the present study lied within the range of 2.6 × 106 to 4.5 × 106. Initially, a baseline case with rectangular fins was considered in the present study, and it was optimized with respect to fin spacing. This optimized baseline case was then validated against the semi-empirical correlation from the scientific literature. Upon good agreement, the validated model was used for comparative analysis of different heat sink configurations with rectangular, trapezoidal, curved, and angled fins by constraining the surface area of the heat transfer. The optimized fin spacing obtained for the baseline case was also used for the other heat sink configurations, and then, the fin designs were further optimized for better performance. However, for the angled fin case, the optimized configuration found in the scientific literature was adopted in the present study. The proposed novel curved fin design with a shroud showed a 4.1% decrease in the system’s thermal resistance with an increase in the heat transfer coefficient of 4.4% when compared to the optimized baseline fin case. The obtained results were further non-dimensionalized with the proposed scaling in terms of the baseline case for the two novel heat sink cases (trapezoidal, curved).

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Journal articles on the topic 'Heat sinks (Electronics)'

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