Academic literature on the topic 'Heatsinks Testing'

We have designed and tested an ultra high responsivity liquid helium-3 refrigerated bolometer for use in low-background applications. The bolometer consists of a single germanium crystal 1/4 x 1/4 x 1/4 mm with contacts at diagonally opposite corners. A short length of gold wire (0.7 mil diameter) is bonded to the contact which is soldered to 5 mm lengths of 1/2 mil stainless steel wire. The other end of each of the stainless steel wires is bonded to a metallized diamond heatsink for the 0.3°K bath. Secondary heatsinking of incoming electrical leads is with indium buried copper transformer wire. The result is a high sensitivity yet fast (10 ms time constant) bolometer suitable for use in low background environments with PB < 250 pw.

Unprecedented growth in the semiconductor industry has been enabled by decreasing transistor feature size. As silicon technology continues to scale per Moore’s law, multi-core and many-core are the new trends of the semiconductor industry. While bus speeds, features and functionalities are increasing, shrinking system volume, compact component placements on the board and system noise reduction are the trends. These silicon and system trends make the thermal design challenging. Validation platforms are used to validate processors/chipsets to ensure world-class quality and reliable Intel products. These platforms are usually open chassis to allow ease of accessibility. In this paper, we present an innovative methodology of active air cooling coupled with mechanical retention designs at the component level. Component level thermal testing data are correlated with computational fluid dynamics (CFD) simulations to provide guidance for system simulations. Well-validated and correlated active heatsink thermal model can be used in the system level thermal simulations for studying the mutual pre-heating effect among the components around the heatsink and other thermally critical components. System level thermal design incorporating the effects of memory cooling, voltage regulator module cooling, graphics card preheating, air blockages effect due to probing cables are presented. In addition, system level acoustic measurements methodology is shown. Finally, fan control methodologies to control the noise below safety guidelines while enhancing the validation customer’s experience are presented.

Deformation induced by thermal loading in a severe automotive environment, between an electronic ceramic substrate — bonded to an aluminum heatsink — and an adjacent nylon material, was investigated by numerical and experimental methods. The goal of this paper is to quantify the relative displacement of certain points of interest, where an aluminum wire bond exists. This displacement is caused by 1) coefficient of thermal expansion (CTE) mismatches of various parts of the assembly when temperature distribution is uniform, and 2) when temperature gradients exist in either steady-state or transient conditions due to thermal cycling (between +150°C and −40°C) as well as power cycling. ANSYS Workbench™ finite element analysis (FEA) software was used to model the system level deformation under various conditions. A unique, quick, and repeatable method of experimentally measuring displacement using a Differential Variable Reluctance Transducer (DVRT®) was utilized. The DVRT® and its signal conditioner provide an analog DC voltage output, which is proportional to linear displacement (resolution as fine as 1.5 micrometer). Error inherent to the DVRT® was adjusted by further testing using a modified sample of Invar. The numerical and experimental results showed good overall correlation.

Abstract In an effort to increase the performance ceiling and reduce the size of modern personal computers especially gaming computers and consequently data centers and supercomputers, mineral oil is proposed as the working fluid to cool the system. Mineral oil operates as an avenue for transmission rather than a liquid heatsink for heat storage, which differentiates this project from traditional mineral oil systems. Using non-conductive liquid as cooling fluid brings many advantages due to its higher convective heat transfer coefficient, which leads to more compact computers, higher speed of data transition, more efficient processors, lower noise levels, and less upkeep costs with respect to data centers. Modeling and simulations are done in NX to gauge temperature expectations; which is the most important limitation when designing and testing a computer before construction. The temperature range was found to be 34°C–50°C in the motherboard and 45°C–67°C in the graphic card. Based on the modeling results, a prototype of the proposed computer is built and tested. Ultimately, this project is trying to open up an avenue through which processor design can be reconsidered.