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Relevant bibliographies by topics / Heatsinks Testing

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Conference papers

Academic literature on the topic 'Heatsinks Testing'

Author: Grafiati

Published: 14 March 2023

Last updated: 19 July 2025

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Journal articles on the topic "Heatsinks Testing"

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Masrianto, Zulqifli, Lukas Kano Mangalla, and Yuspian Gunawan. "Pengujian Eksperimen Pembuang Panas dan Aliran Udara Pada Berbagai Bentuk Heatsink." Enthalpy : Jurnal Ilmiah Mahasiswa Teknik Mesin 6, no. 4 (2021): 190. http://dx.doi.org/10.55679/enthalpy.v6i4.22575.

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Heatsinks are widely used in heat exchangers to increase the rate of heat transfer between a surface and the working fluid. This study aims to determine the effect of surface shape and area, and air flow velocity on the rate of heat transfer of the three different heatsinks. The research was conducted experimentally by testing three forms of heatsinks with variations in air flow velocity in a small windtunell. The windtunnel is equipped with test equipment such as a handheld wind meter, K-Type thermocouple and a stopwatch. The heating source for the three model heatsinks is an electric heater

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Piumatti, Davide, Stefano Borlo, Matteo Quitadamo, Matteo Sonza Reorda, Eric Giacomo Armando, and Franco Fiori. "Test Solution for Heatsinks in Power Electronics Applications." Electronics 9, no. 6 (2020): 1020. http://dx.doi.org/10.3390/electronics9061020.

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Power electronics technology is widely used in several areas, such as in the railways, automotive, electric vehicles, and renewable energy sectors. Some of these applications are safety critical, e.g., in the automotive domain. The heat produced by power devices must be efficiently dissipated to allow them to work within their operational thermal limits. Moreover, numerous ageing effects are due to thermal stress, which causes mechanical issues. Therefore, the reliability of a circuit depends on its dissipation system, even if it consists of a simple passive heatsink mounted on the power devic

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Kökden, Dinçer, Adem Egi, Emre Bulut, Emre İsa Albak, İbrahim Korkmaz, and Ferruh Öztürk. "Prevention of the Fracture Problem Occurring in Automotive Alternator Heatsink Blocks Using Artificial Intelligence." Applied Sciences 14, no. 24 (2024): 11758. https://doi.org/10.3390/app142411758.

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In this study, prevention of fracture in vibration fatigue testing of automotive alternator heatsink blocks was investigated using an artificial neural network. Automotive components such as alternator heatsink blocks are subjected to high cyclic vibration fatigue loads throughout their lifespan, which can lead to the formation and propagation of fatigue cracks and ultimately component failure. The basic parameters affecting the resonant frequency of the heatsink blocks, including geometry and loading conditions, are determined. Data-driven decision making provides advanced predictive insights

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Merrikh, Ali A., Mike Eyman, David B. Walshak, Tom Dolbear, and Sridhar Sundaram. "Heatsink Mass Optimization Methodology for Desktop Microprocessor Cooling." Journal of Microelectronics and Electronic Packaging 5, no. 2 (2008): 87–93. http://dx.doi.org/10.4071/1551-4897-5.2.87.

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We present a novel modeling methodology for optimizing the mass of aluminum-extruded heatsinks for cooling desk-top microprocessors. The two-stage study aims at reducing mass of an aluminum-extrusion heatsink by taking advantage of the existing thermal resistance margin. In Stage 1, we investigated several possible combinations of base shapes to minimize the mass of the base region. Base shape is optimized by dividing the base volume into several blocks of equal width, with the objective of progressively minimizing the mass of the peripheral region while shaping the middle region to minimize s

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Reza Mardiansah suares, Ivan Maulana, Zaky Ikhsanudin, et al. "Cooling Machine Adapted Peltier Cooling Module TEC1-12706 to Understand Heat Transfer Application." BIOMEJ 4, no. 1 (2024): 12–19. https://doi.org/10.33005/biomej.v4i1.95.

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This paper discusses the development of a simple refrigeration system that utilizes a PSU (Power Supply Unit), Peltier TEC1-12706 module, axial fan, and heatsink. This system is designed to provide an efficient solution for cooling limited spaces or electronic devices at an affordable cost. The PSU is used as the main electrical power source, while the Peltier module functions as the main cooling element that utilizes the thermoelectric effect. An axial fan is integrated to improve heat transfer, increase cooling efficiency, and maintain operational temperatures at desired levels. Heatsinks ar

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Sundari, Delta, Mauludi Manfaluthy, Legenda Prameswono Pratama, et al. "Design of A Thermoelectric Generator for Battery Charging using Heat from A Steam Iron Base." Jurnal ELTIKOM 8, no. 2 (2024): 141–50. https://doi.org/10.31961/eltikom.v8i2.1307.

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This study explores an alternative method of generating electrical energy using a thermoelectric generator that utilizes heat from the soleplate of a steam iron and six thermoelectric units connected in series. Based on the Seebeck effect, the thermoelectric modules convert the temperature difference into voltage. An increase in the heat source temperature leads to higher voltage production by the series-connected thermoelectric modules, although the electrical power output depends on the connected load. The power generator design includes thermoelectric modules, a buck-boost converter, an 186

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Handayani, Dwi Yulia, James Julian, Fitri Wahyuni, and Ridwan Daris Naufal. "Comparative analysis of solar panel output power with variations of Heatsink type cooling systems." Journal of Energy, Mechanical, Material, and Manufacturing Engineering 8, no. 2 (2023): 113–26. https://doi.org/10.22219/jemmme.v8i2.30152.

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The heatsink is installed on the back sheet of the solar panel in the form of a fin so that the air under the solar module helps the heatsink perform cooling. Temperature testing uses a thermocouple temperature sensor at several calibrated points, taking volt and current data using a multimeter. The results of this test obtained a deviation comparison value between solar panels without a heat sink and using a heat sink of ±1%. So, the similarity of deviation values from the research is used as a control variable. From all the data that has been taken, using heat sinks on solar panels can reduc

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Perwira, Wisnu Yoga, Nyenyep Sri Wardani, and Husin Bugis. "EFFECT OF HEATSINK FIN AND THERMAL INSULATORS ON OUTPUT OF THERMOELECTRIC POWER OF HEAT OF MOTORCYCLE EXHAUST GAS." Journal of Mechanical Engineering and Vocational Education (JoMEVE) 1, no. 2 (2019): 53. http://dx.doi.org/10.20961/jomeve.v1i2.25064.

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Thermoelectric can be utilized to convert exhaust heat into electricity. This study aims to determine the effect of heatsink height and thermal insulation on electric power generated from thermal powered thermoelectric plants. This research is using an experimental method. The technically of data analysis is descriptive comparative. In this research were used 10 mm, 20 mm, and 30 mm heatsink fin. Thermal insulator materials are glass wool and aluminum foil. Electrical power obtained from multiplication of electrical voltage and electric current. The data analysis was indicated the increasing e

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Eka Saputra, Yuli Mafendro Dedet, and Mochamamd Tendi Noer Ramadhan. "Performance Study of Monocrystalline Type Solar Panels for Street Lighting in Sibolga Area." MOTIVECTION : Journal of Mechanical, Electrical and Industrial Engineering 5, no. 2 (2023): 205–16. http://dx.doi.org/10.46574/motivection.v5i2.206.

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In the Sibolga area, there is still a shortage of electricity supply, especially for street lighting, so accidents often occur, meanwhile there has a relatively large average solar radiation intensity is 4,784 Wh/m2/day so that potential for PLTS installation. This research aims to determine the performance of monocrystalline solar panels with the addition of a heatsink cooling fan in street lighting. The method used is an experimental. The test begins with the survey, potential calculation, design, testing, data collection and analysis. The solar panel used monocrystalline 10 WP with a heatsi

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Yang, Tung Sheng, and Yong Nan Chen. "Study on Cylindrical Heatsink Forging Process Considering Friction Condition." Key Engineering Materials 823 (September 2019): 141–44. http://dx.doi.org/10.4028/www.scientific.net/kem.823.141.

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The feasibility of forging of AL-1050 alloy of cylindrical heatsink under warm conditions is demonstrated in the present work. The stress-strain curves and friction factor play an important role in the cylindrical heatsink forging. The purpose of forging lubrication is to reduce friction between blank and die, and to decrease resistance of metal flow to die. The stress-strain curves at different temperatures are obtained by compressing tests. The friction factor between 1050 aluminum alloy and die material are determined at different temperatures by ring compression tests with graphite lubrica

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Dissertations / Theses on the topic "Heatsinks Testing"

1

QUITADAMO, MATTEO VINCENZO. "Optimal Tuning of AGDs Parameters and a Technique for Testing the Correct Mounting of Heatsinks on Power Transistors." Doctoral thesis, Politecnico di Torino, 2021. http://hdl.handle.net/11583/2957732.

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Conference papers on the topic "Heatsinks Testing"

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Lu, Jun, Michelle C. Lin, and Bernie Short. "Measuring and Optimizing Thermal Interface Material Performance for VR Heatsink Designs." In ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels. American Society of Mechanical Engineers, 2015. http://dx.doi.org/10.1115/ipack2015-48146.

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With increasingly high powers on processors, memories, and chipsets, the voltage regulators (VR) become heavily loaded and a heatsink is often required to prevent overheating the surrounding components on the board. For VR heatsink designs, thermal interface silicone gap filler pads are often used and there is an increasing need to improve VR thermal solutions by reducing thermal resistance of the TIM. A series of TIM2 thickness and performance measurements based on thermal testing was performed in order to understand gap filler characteristics, optimize TIM performance, and utilize best reten

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2

Goebel, J. H., W. F. Brooks, and P. Kittel. "Ultra High Responsivity 3He-Cooled Bolometers." In Optical Fabrication and Testing. Optica Publishing Group, 1990. http://dx.doi.org/10.1364/oft.1980.ffc1.

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We have designed and tested an ultra high responsivity liquid helium-3 refrigerated bolometer for use in low-background applications. The bolometer consists of a single germanium crystal 1/4 x 1/4 x 1/4 mm with contacts at diagonally opposite corners. A short length of gold wire (0.7 mil diameter) is bonded to the contact which is soldered to 5 mm lengths of 1/2 mil stainless steel wire. The other end of each of the stainless steel wires is bonded to a metallized diamond heatsink for the 0.3°K bath. Secondary heatsinking of incoming electrical leads is with indium buried copper transformer wir

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Piumatti, Davide, Matteo Vincenzo Quitadamo, Matteo Sonza Reorda, and Franco Fiori. "Testing Heatsink Faults in Power Transistors by means of Thermal Model." In 2020 IEEE Latin American Test Symposium (LATS). IEEE, 2020. http://dx.doi.org/10.1109/lats49555.2020.9093674.

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Mohammed, Rahima K., Ridvan A. Sahan, and Ying-Feng Pang. "System Level Thermal Design Challenges in Validation Platforms." In ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability. ASMEDC, 2009. http://dx.doi.org/10.1115/interpack2009-89412.

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Unprecedented growth in the semiconductor industry has been enabled by decreasing transistor feature size. As silicon technology continues to scale per Moore’s law, multi-core and many-core are the new trends of the semiconductor industry. While bus speeds, features and functionalities are increasing, shrinking system volume, compact component placements on the board and system noise reduction are the trends. These silicon and system trends make the thermal design challenging. Validation platforms are used to validate processors/chipsets to ensure world-class quality and reliable Intel product

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Asghari, Tony A., and Joseph Janas. "Analysis of Thermal Displacements Due to CTE Mismatches Using FEA Simulation and Experimental Validation With a Differential Variable Reluctance Transducer." In ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference. ASMEDC, 2007. http://dx.doi.org/10.1115/ipack2007-33217.

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Deformation induced by thermal loading in a severe automotive environment, between an electronic ceramic substrate — bonded to an aluminum heatsink — and an adjacent nylon material, was investigated by numerical and experimental methods. The goal of this paper is to quantify the relative displacement of certain points of interest, where an aluminum wire bond exists. This displacement is caused by 1) coefficient of thermal expansion (CTE) mismatches of various parts of the assembly when temperature distribution is uniform, and 2) when temperature gradients exist in either steady-state or transi

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Estejab, Bahareh, and John Tobin. "Mineral Oil As an Alternative Cooling Method." In ASME 2021 30th Conference on Information Storage and Processing Systems. American Society of Mechanical Engineers, 2021. http://dx.doi.org/10.1115/isps2021-65201.

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Abstract In an effort to increase the performance ceiling and reduce the size of modern personal computers especially gaming computers and consequently data centers and supercomputers, mineral oil is proposed as the working fluid to cool the system. Mineral oil operates as an avenue for transmission rather than a liquid heatsink for heat storage, which differentiates this project from traditional mineral oil systems. Using non-conductive liquid as cooling fluid brings many advantages due to its higher convective heat transfer coefficient, which leads to more compact computers, higher speed of

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