Academic literature on the topic 'Hermetic area'
Create a spot-on reference in APA, MLA, Chicago, Harvard, and other styles
Consult the lists of relevant articles, books, theses, conference reports, and other scholarly sources on the topic 'Hermetic area.'
Next to every source in the list of references, there is an 'Add to bibliography' button. Press on it, and we will generate automatically the bibliographic reference to the chosen work in the citation style you need: APA, MLA, Harvard, Chicago, Vancouver, etc.
You can also download the full text of the academic publication as pdf and read online its abstract whenever available in the metadata.
Journal articles on the topic "Hermetic area"
Wu, Mei-Ling, and Jia-Shen Lan. "Investigation of Adhesive’s Material in Hermetic MEMS Package for Interfacial Crack between the Silver Epoxy and the Metal Lid during the Precondition Test." Materials 14, no. 19 (2021): 5626. http://dx.doi.org/10.3390/ma14195626.
Full textSödergård, J. "Decoding the Hermetic Discourse in Salomon Trismosin's Splendor Solis - A Semiotic Study of Three Ways of Reading." Scripta Instituti Donneriani Aboensis 16 (January 1, 1996): 313–44. http://dx.doi.org/10.30674/scripta.67236.
Full textSevekar, Shrirang, Poonam Shingare, Vivek Jogani, Mihir Jha, and Sonal D. Patil. "Pediatric Obturating Materials And Techniques." Journal of Contemporary Dentistry 1, no. 2 (2011): 27–32. http://dx.doi.org/10.5005/jcd-1-2-27.
Full textKoebel, Matthias M., Nancy El Hawi, Jia Lu, Felix Gattiker, and Jürg Neuenschwander. "Anodic bonding of activated tin solder alloys in the liquid state: A novel large-area hermetic glass sealing method." Solar Energy Materials and Solar Cells 95, no. 11 (2011): 3001–8. http://dx.doi.org/10.1016/j.solmat.2011.06.012.
Full textYamamoto, Michitaka, Takashi Matsumae, Yuichi Kurashima, et al. "Effect of Au Film Thickness and Surface Roughness on Room-Temperature Wafer Bonding and Wafer-Scale Vacuum Sealing by Au-Au Surface Activated Bonding." Micromachines 11, no. 5 (2020): 454. http://dx.doi.org/10.3390/mi11050454.
Full textRajbhandari, Santosh Man, and Bismita Pradhan. "Evaluation of Sealing Ability of Three Root-end Filling Materials." Orthodontic Journal of Nepal 5, no. 1 (2015): 27–30. http://dx.doi.org/10.3126/ojn.v5i1.14496.
Full textW, Yongki Hadinata, and Karlina Samadi. "Nonsurgical Endodontik Retreatment of Maxillary First Premolar." DENTA 11, no. 1 (2017): 88. http://dx.doi.org/10.30649/denta.v11i1.133.
Full textZhang, Dong, Xiao Dong Zhou, Lin Jun Wang, Qin Tong Zhao, and Tao Min Wei. "Experimental Study on the Multiple Energy Assisted Heat Pump." Advanced Materials Research 608-609 (December 2012): 969–73. http://dx.doi.org/10.4028/www.scientific.net/amr.608-609.969.
Full textMalinowska, Joanna. "Change of students’ activities in the process of becoming a teacher." Andragoška spoznanja 23, no. 3 (2017): 89–103. http://dx.doi.org/10.4312/as.23.3.89-103.
Full textMekonen, Tigist Kefale, and Biruk Yazie Wubetie. "Determinants of the Use of Hermetic Storage Bags for Maize Storage among Smallholder Farmers in Northwest Ethiopia." Advances in Agriculture 2021 (September 10, 2021): 1–11. http://dx.doi.org/10.1155/2021/6644039.
Full textDissertations / Theses on the topic "Hermetic area"
Sklenár, Ondrej. "Měření těsnosti hermetických prostor na JE." Master's thesis, Vysoké učení technické v Brně. Fakulta strojního inženýrství, 2011. http://www.nusl.cz/ntk/nusl-229745.
Full textMemon, Saim. "Design, fabrication and performance analysis of vacuum glazing units fabricated with low and high temperature hermetic glass edge sealing materials." Thesis, Loughborough University, 2013. https://dspace.lboro.ac.uk/2134/14562.
Full textBooks on the topic "Hermetic area"
Davies, Benjamin K. Fantasy, Denial, and Virtual Reality in Mahler’s Fourth Symphony. Oxford University Press, 2017. http://dx.doi.org/10.1093/oso/9780199316090.003.0001.
Full textBook chapters on the topic "Hermetic area"
Hawkey, Kerensa, John Brameld, Tim Parr, Andrew Salter, and Heidi Hall. "Suitability of insects for animal feeding." In Insects as animal feed: novel ingredients for use in pet, aquaculture and livestock diets. CABI, 2021. http://dx.doi.org/10.1079/9781789245929.0004.
Full textSwaminathan, Lakshmi. "RF MEMS Switch Fabrication and Packaging." In Nanofibers [Working Title]. IntechOpen, 2020. http://dx.doi.org/10.5772/intechopen.95003.
Full textCheshire, Paul. "Esoteric Romanticism." In William Gilbert and Esoteric Romanticism. Liverpool University Press, 2018. http://dx.doi.org/10.3828/liverpool/9781786941206.003.0010.
Full textKahn, Andrew. "‘Verses on Russian Poetry’." In Mandelstam's Worlds. Oxford University Press, 2020. http://dx.doi.org/10.1093/oso/9780198857938.003.0005.
Full textSchettino, Patrizia. "Where Is Hanuman?" In Virtual and Augmented Reality in Education, Art, and Museums. IGI Global, 2020. http://dx.doi.org/10.4018/978-1-7998-1796-3.ch015.
Full textGolubev, Alexey. "Techno-Utopian Visions of Soviet Intellectuals after Stalin." In The Things of Life. Cornell University Press, 2020. http://dx.doi.org/10.7591/cornell/9781501752889.003.0002.
Full textBortolani, Ljuba Merlina. "The Greek Magical Hymn to Hermes." In Tracking Hermes, Pursuing Mercury. Oxford University Press, 2019. http://dx.doi.org/10.1093/oso/9780198777342.003.0018.
Full textPesic, Peter. "Mersenne’s Universal Harmony." In Music and the Making of Modern Science. The MIT Press, 2014. http://dx.doi.org/10.7551/mitpress/9780262027274.003.0008.
Full textMcNeece, Lucy Stone. "Abdelkébir Khatibi." In Abdelkébir Khatibi. Liverpool University Press, 2020. http://dx.doi.org/10.3828/liverpool/9781789622331.003.0012.
Full textBurns, Dylan M. "Gnostic." In A Guide to Early Jewish Texts and Traditions in Christian Transmission. Oxford University Press, 2019. http://dx.doi.org/10.1093/oso/9780190863074.003.0023.
Full textConference papers on the topic "Hermetic area"
Choi, Won Kyoung, Moon Gi Cho, Sun Kyoung Seo, et al. "Hermetic Packaging of Micro Scanner for Laser Display Applications." In ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. ASMEDC, 2005. http://dx.doi.org/10.1115/ipack2005-73252.
Full textMariani, Viviana Cocco, and Alvaro Toubes Prata. "Computational Modelling of Fluid Flow in Radial Diffusers With Irregular Boundaries." In ASME 2006 International Mechanical Engineering Congress and Exposition. ASMEDC, 2006. http://dx.doi.org/10.1115/imece2006-15594.
Full textHuang, Annie T., Chung-Kuang Chou, and Chih Chen. "Self-Aligned Hermetic Packaging Using Eutectic SnPb Solder and Cr/Ni/Cu Metallization Layer." In ASME 2004 International Mechanical Engineering Congress and Exposition. ASMEDC, 2004. http://dx.doi.org/10.1115/imece2004-61026.
Full textBurke, Cillian, and Jeff Punch. "An Investigation of Capped Glass Frit Sealed MEMS Devices in Contemporary Accelerometers." In ASME 2009 International Mechanical Engineering Congress and Exposition. ASMEDC, 2009. http://dx.doi.org/10.1115/imece2009-12135.
Full textKuznetsov, Yu N., B. A. Gabaraev, V. A. Reshetov, and V. A. Moskin. "Leasing of Nuclear Power Plants With Using Floating Technologies." In 10th International Conference on Nuclear Engineering. ASMEDC, 2002. http://dx.doi.org/10.1115/icone10-22186.
Full textLee, James, and Tony Rogers. "Hermetic Packaging Technique Featuring Through-Wafer Interconnects and Low Temperature Direct Bond." In 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems. ASMEDC, 2008. http://dx.doi.org/10.1115/micronano2008-70288.
Full textFaheem, Faheem F., and Y. C. Lee. "Liquid Crystal Polymer for RF MEMS Packaging." In ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. ASMEDC, 2005. http://dx.doi.org/10.1115/ipack2005-73442.
Full textBhopte, Siddharth, Parthiban Arunasalam, Fadi Alsaleem, Arvind Rao, and Nataraj Hariharan. "Power Allocation Towards Hermetic Solder Joint Health of High Powered MEMS Chip for Harsh Environment Applications." In ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems. ASMEDC, 2011. http://dx.doi.org/10.1115/ipack2011-52296.
Full textFasoro, Abiodun A., Praveen Pandojirao-S., Dan O. Popa, Harry E. Stephanou, and Dereje A. Agonafer. "Die and Wafer-Level Hermetic Sealing for MEMS Applications." In ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference. ASMEDC, 2007. http://dx.doi.org/10.1115/ipack2007-33850.
Full textBaughn, Terry V., and Shea Chen. "Low Cycle Fatigue in RF Microwave Module Housings." In ASME 2003 International Electronic Packaging Technical Conference and Exhibition. ASMEDC, 2003. http://dx.doi.org/10.1115/ipack2003-35263.
Full text