Relevant bibliographies by topics / Hermetic seal

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  1. Journal articles
  2. Dissertations / Theses
  3. Books
  4. Book chapters
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Academic literature on the topic 'Hermetic seal'

Author: Grafiati
Published: 4 June 2021
Last updated: 18 February 2022

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Journal articles on the topic "Hermetic seal"

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Neilsen, M. K., L. A. Andrews, S. L. Monroe, and H. L. McCollister. "Development of Hermetic Microminiature Connectors." Journal of Electronic Packaging 113, no. 4 (1991): 405–9. http://dx.doi.org/10.1115/1.2905427.

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Miniaturization of hermetic packages has provided the incentive to develop a new family of hermetic microminiature connectors. Microminiature connectors, with a pin spacing of 1.27 mm, have previously been available only in the nonhermetic form. New microminiature connectors with compression seal materials, 304 Stainless Steel housings, Alloy 52 pins, and TM-9 Glass insulators, were examined because compression seals are currently used in larger hermetic connectors and are typically designed to create a residual compressive stress state in the insulator during manufacturing. The new microminia
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Salzer, Tom. "Advances in Hermetic Projection Weld Sealing." International Symposium on Microelectronics 2019, no. 1 (2019): 000550–56. http://dx.doi.org/10.4071/2380-4505-2019.1.000550.

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Abstract In this article, we describe a novel process for hermetic projection weld sealing of semiconductor devices, considered by many to be an important legacy technology from decades gone bye, but not particularly relevant in today's arsenal of sealing technologies. We will demonstrate that with appropriate modifications to be described, this technology can used to seal various high power devices as well as high reliability semiconductors, crystals, hybrid packages, medical electronics, photonic devices, automotive electronics, etc. Its features primarily stem from the fact that it can be u
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ICHIRYU, Ken, Morio TAMURA, and Fujio SATOH. "Development of Plastic Hermetic Seal." Hydraulics & Pneumatics 26, no. 2 (1995): 203–13. http://dx.doi.org/10.5739/jfps1970.26.203.

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Terentyev, Vladimir, Aleksei Bausov, and Mihail Toropov. "STUDY OF HERMETIC ABILITY OF A COMBINED FERROFLUIDIC SEALED OF BEARING ASSEMBLIES." Bulletin Samara State Agricultural Academy 6, no. 1 (2021): 25–31. http://dx.doi.org/10.12737/44167.

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The purpose of the research is to increase the efficiency of hermetic ability of bearing assemblies by using com-bined ferrofluidic sealed. The research objective is theoretic justification of the maximum concentration of ferro-magnetic particles in fluid, investigation of hermatic ability of a combined ferrofluidic seal under conditions of tem-perature changing and speed of a shaft rotation of packing bearing assembly. The study of hermetic ability of lip and ferro-fluidic sealed was carried out on a test bench, allowing to determine the packing ability of seals both in static and dynamic mod
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Marinis, Thomas, and Berj Nercessian. "Hermetic Sealing of Stainless Steel Packages by Seam Seal Welding." International Symposium on Microelectronics 2010, no. 1 (2010): 000720–30. http://dx.doi.org/10.4071/isom-2010-wp5-paper6.

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Welded stainless steel packages offer a number of advantages relative to those fabricated from kovar or aluminum metals and braze sealed. They are highly resistant to corrosion, especially in aqueous or elevated temperature environments, are mechanically stronger, dramatically so at temperatures above 100°C, exhibit lower outgassing rates, and have better vibration characteristics. Since welded stainless steel packages do not require over plating to facilitate braze sealing, combined material and fabrication costs are lower than kovar or aluminum packages. Also, unlike kovar, stainless steel i
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Shiraishi, Akinori, Mitsutoshi Higashi, Kei Murayama, Yuichi Taguchi, and Kenichi Mori. "Wafer Level Package for MEMS with TSVs and Hermetic Seal." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2011, DPC (2011): 002314–35. http://dx.doi.org/10.4071/2011dpc-tha24.

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In recent years, downsizing of MEMS package and high accuracy MEMS device mounting have been strongly required from expanding applications that using MEMS not only for industrial and automobile but also for consumer typified mobile phone. In order to achieve that, it is appropriate to use Silicon package that can be mounted at wafer level packaging. Silicon package is made of monocrystal silicon wafer. The deep cavity is fabricated on monocrystal silicon wafer by Wet or Dry etching. And MEMS device can be mounted on the cavity. The electrical connecting between front side and back side of cavi
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Lenzen, M., and R. E. Collins. "Hermetic indium metal-to-glass-tube seal." Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 18, no. 2 (2000): 552–53. http://dx.doi.org/10.1116/1.582222.

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Nayak, Ankit, Prashant K. Jain, Pavan K. Kankar, and Niharika Jain. "Effect of volumetric shrinkage of restorative materials on tooth structure: A finite element analysis." Proceedings of the Institution of Mechanical Engineers, Part H: Journal of Engineering in Medicine 235, no. 5 (2021): 493–99. http://dx.doi.org/10.1177/0954411921990138.

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Post-treatment coronal hermetic seal of the root canal opening prevents the food or saliva which assist to achieve successful endodontic treatment. Gutta-percha is filled in the inner canal, that is, from cervical third to apical third. Gutta-percha does not provide the hermetic seal because it does not bound with dentine walls. Various new restorative materials have been developed in the last 6–7 decade but drawback related to the polymerization shrinkage of the composite resin remains a clinical problem. In general, dental composites having volumetric shrinkage of the material depends on its
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Dionet, Clara, Goran Perosevic, Jeff Javier, et al. "Dark Current Leakage in Optoelectronic Hermetic Packages." International Symposium on Microelectronics 2017, no. 1 (2017): 000669–74. http://dx.doi.org/10.4071/isom-2017-poster5_154.

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Abstract In this work, the root cause of the increase in dark current occurring over time at high temperature in hermetic packages, such as those used in optoelectronic devices, was investigated. It was observed that hermetic Receiver Optical Subassembly (ROSA) devices show continuously increasing dark current when stressed and monitored at 85°C over an extended period of time, reaching, in some cases, values greater than 500nA. However, this increase in leakage current was recoverable once the package seal is broken, and this behavior was found to be very repeatable. Photodetectors from two d
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Mathieu, Barry, and Abhijit Dasgupta. "A Fractional-Factorial Numerical Technique for Stress Analysis of Glass-To-Metal Lead Seals." Journal of Electronic Packaging 116, no. 2 (1994): 98–104. http://dx.doi.org/10.1115/1.2905512.

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Fracture of glass seals in metallic hermetic electronic packaging is a significant failure mode because it may lead to moisture ingress and also to loss of load carrying capacity of the glass seal. Seal glasses are intrinsically brittle and their fracture is governed by the stresses generated. This study investigates stresses in lead seals caused by handling, testing, mechanical vibration, and thermal excursions. Loads considered are axial tension, bending, and twisting of the lead. More general loading can be handled by superposition of these results. Factorial techniques, commonly used in mu
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Dissertations / Theses on the topic "Hermetic seal"

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Gibney, Matthew Joseph IV. "Predicting Package Defects: Quantification of Critical Leak Size." Thesis, Virginia Tech, 2000. http://hdl.handle.net/10919/34857.

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Threshold leak sizes and leak rates were calculated for a number of liquid food products exhibiting a wide range of surface tension and viscosity values. From this data, one can see that mathematically, under typical pressure differentials generated in food packages (less than or equal to ±34.5 kPa), a leak will never start through a 2 μm defect. The calculated leak rates were compared to calculated evaporation rates. The evaporation rate exceeds the leak rate at lower sized microholes (2, and 5 μm diameter) under typical pressure differentials found in food packages. If the liquid, typ
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Memon, Saim. "Design, fabrication and performance analysis of vacuum glazing units fabricated with low and high temperature hermetic glass edge sealing materials." Thesis, Loughborough University, 2013. https://dspace.lboro.ac.uk/2134/14562.

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Vacuum glazing is a vital development in the move to more energy efficient buildings. In vacuum glazing, an evacuated cavity supresses gaseous conduction and convection to provide high thermal resistance. A high vacuum pressure (less than 0.1 Pa) is required and must be maintained by a hermetic seal around the periphery, currently formed with either indium (i.e. low temperature sealing method) or solder glass (i.e. high temperature sealing method). This thesis reports the results of an experimental and theoretical investigation into the development of new low temperature (less than 200°C) and
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Agarwal, Rahul. "Low temperature hermetically sealed 3-D MEMS device for wireless optical communication." [Tampa, Fla] : University of South Florida, 2007. http://purl.fcla.edu/usf/dc/et/SFE0002181.

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Staff, M. T. "The development and ageing of hermetic seals : a strontium boroaluminate glass-ceramic bonded to Ti-6Al-4V and Kovar." Thesis, University of Surrey, 2016. http://epubs.surrey.ac.uk/812551/.

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Feed-through connectors are used in the electronics industry to route electrical current into isolated environments. Electrically insulating glasses are used to separate metals from each other to form leak tight glass-to-metal seals. The coefficients of thermal expansion (CTE) are controlled to reduce thermomechanical stresses in the seal. The majority of glass-to-metal seals consist of stainless steel housings and pins bonded to silicate-based glasses. Titanium and its alloys are alternative housing materials due to their low density and thus weight saving potential. Silicate-based glasses fo
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Zahr, Abedel Halim. "Optimisation et réalisation d’un package pour MEMS-RF." Thesis, Limoges, 2016. http://www.theses.fr/2016LIMO0106.

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Le packaging des MEMS-RF est un sujet de recherche qui a été étudié de manière intensive ces dernières années. En effet, la fiabilité des composants micromécaniques est directement dépendante de l’humidité et de la poussière avoisinant la structure. C’est pourquoi la recherche d'un package parfaitement hermétique à très faible coût, sans influence sur les performances RF reste d’actualité, même si un grand nombre de publications et de solutions ont été présentées auparavant. Ces travaux de recherche porte sur la conception, la réalisation et la caractérisation de commutateurs MEMS-RF ohmiques
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Pedrosa, Rita da Cunha. "Potential of prepupae meal of Black Soldier Fly (Hermetia illucens) as fish meal substitute in European sea bass juveniles (Dicentrarchus labrax): Implication in flesh quality." Dissertação, 2016. https://repositorio-aberto.up.pt/handle/10216/98956.

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Pedrosa, Rita da Cunha. "Potential of prepupae meal of Black Soldier Fly (Hermetia illucens) as fish meal substitute in European sea bass juveniles (Dicentrarchus labrax): Implication in flesh quality." Master's thesis, 2016. https://repositorio-aberto.up.pt/handle/10216/98956.

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Books on the topic "Hermetic seal"

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McLaren, Andrew. The neither/either world .... or all four (loopholes/hermetic seals). The Author, 2000.

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E, Norton Don, ed. Temple and cosmos: Beyond this ignorant present. Deseret Book Co., 1992.

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Llewellyn, Matthew P., and John Gleaves. The Global Games and the Intransigent Dictator. University of Illinois Press, 2017. http://dx.doi.org/10.5406/illinois/9780252040351.003.0007.

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This chapter discusses the decline amateurism during the Cold War era. The Cold War realpolitik, rising global commerce, interorganizational friction, and the advent of television converged to deliver debilitating blows to the amateur ideal. Still, International Olympic Committee (IOC) president Avery Brundage had the opportunity to position Olympic amateurism on a more favorable and defensible footing. By lifting the hermetic seals to the IOC's financial coffers, undertaking professional and jurisdictional restructuring, and adopting an uncompromising stance toward known violators, he might h
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Center, Langley Research, ed. Fiber optic cable feedthrough and sealing. National Aeronautics and Space Administration, Lewis Research Center, 1998.

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Book chapters on the topic "Hermetic seal"

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Jamison, Ryan D., Pierrette H. Gorman, Jeffrey Rodelas, Danny O. MacCallum, Matthew Neidigk, and J. Franklin Dempsey. "Analysis of Laser Weld Induced Stress in a Hermetic Seal." In Residual Stress, Thermomechanics & Infrared Imaging, Hybrid Techniques and Inverse Problems, Volume 9. Springer International Publishing, 2016. http://dx.doi.org/10.1007/978-3-319-21765-9_25.

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"Nicolas Appert and the Development of the Hermetic Seal." In Historic Bottle and Jar Closures. Routledge, 2016. http://dx.doi.org/10.4324/9781315427454-12.

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Jamaladdin Nuraddin, Aslanov, and Huseynli Zenfira Seyidi. "CALCULATION METHOD OF HERMETIC SEAL ASSEMBLY ARAMETERS OF THE PACKER USED DURING REPAIRING WELLS." In New stages of development of modern science in Ukraine and EU countries. Publishing House “Baltija Publishing”, 2019. http://dx.doi.org/10.30525/978-9934-588-15-0-49.

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Müller, Heinz K., and Bernard S. Nau. "Hermetic Seals." In Fluid Sealing Technology. Routledge, 2019. http://dx.doi.org/10.1201/9780203755716-22.

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Conference papers on the topic "Hermetic seal"

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Guillet, Pierre. "An improved hermetic storage bag for the control of boring insects that break the hermetic seal of current bags." In 2016 International Congress of Entomology. Entomological Society of America, 2016. http://dx.doi.org/10.1603/ice.2016.105534.

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Petrie, Charles, and Harold Beattie. "Hermetically Sealed Thermocouples." In ASME 1993 International Gas Turbine and Aeroengine Congress and Exposition. American Society of Mechanical Engineers, 1993. http://dx.doi.org/10.1115/93-gt-036.

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This paper presents the results of a certification test to incorporate hermetic glass seals into thermocouple sensors utilized for Power Turbine Inlet Temperature sensing in a gas turbine engine in commuter aircraft service. Failure modes found in field service returns are characterized and the general procedure for installing a glass compression seal are outlined.
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Kovtun, I., J. Boiko, and S. Petrashchuk. "Nondestructive hermetic seal diagnostics and prediction method for super-high-frequency modules." In 2018 14th International Conference on Advanced Trends in Radioelecrtronics, Telecommunications and Computer Engineering (TCSET). IEEE, 2018. http://dx.doi.org/10.1109/tcset.2018.8336314.

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Garafolo, Nicholas G., and Christopher C. Daniels. "The Quantification of Seal-Interface Leakage of an Elastomer Face Seal." In ASME 2011 International Mechanical Engineering Congress and Exposition. ASMEDC, 2011. http://dx.doi.org/10.1115/imece2011-63620.

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Current gas leak rate prediction methods for elastomeric face seals rely heavily on the assumption that all leakage is permeation, rather than leakage across the seal interface [1–3]. To date, there has been no definitive evidence that this is indeed the case. It is essential to investigate the magnitude of interface leakage to facilitate the validation of the current compressible permeation model and to quantify the interfacial leakage for the design of future state-of-the-art face seals. To this end, a series of leak rate experiments is presented on a square-ring seal, manufactured from sili
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Coico, Patrick A., Amilcar Arvelo, Gaetano P. Messina, Frank L. Pompeo, and Donald W. Scheider. "Hermetic Encapsulation Technique Developed for the IBM Z-Server Multi-Chip Module." In ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference. ASMEDC, 2007. http://dx.doi.org/10.1115/ipack2007-33440.

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The large MCM developed to package the main processor unit used in the IBM z9 Server makes use of a novel sealing design that imparts many desirable characteristics to the module assembly process, performance and reliability. These packages consist of a large ceramic chip carrier encapsulated using a copper cooling cap and a metal sealing ring. The sealing technique not only provides the hermetic environment needed to protect the non-underfilled devices contained within the module, but also allows for easy rework of the assembly. The seal used can withstand the thermally induced stresses and s
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Fasoro, Abiodun A., Praveen Pandojirao-S., Dan O. Popa, Harry E. Stephanou, and Dereje A. Agonafer. "Die and Wafer-Level Hermetic Sealing for MEMS Applications." In ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference. ASMEDC, 2007. http://dx.doi.org/10.1115/ipack2007-33850.

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Two of the primary causes of MEMS failure are stiction of the moving microparts due to moisture from environment and particulate contamination due to the degradation of organic materials. The use of getters such as sputtered Ti and Ba to maintain a moisture free environment within the MEMS package has been proposed and is well documented. Though getters ensure a moisture free environment within the package, they do not ensure hermeticity over long periods of time. Hermetic packaging is sometimes desirable for MEMS and optical MEMS (especially those that require long shelf lives) in order to gu
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Garafolo, Nicholas G., and Christopher C. Daniels. "An Empirical Investigation on Seal-Interface Leakage of an Elastomer Face Seal." In ASME 2012 Fluids Engineering Division Summer Meeting collocated with the ASME 2012 Heat Transfer Summer Conference and the ASME 2012 10th International Conference on Nanochannels, Microchannels, and Minichannels. American Society of Mechanical Engineers, 2012. http://dx.doi.org/10.1115/fedsm2012-72026.

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For the application of seals used in space, a common assumption is that all leakage is attributed to permeation, that is the gas flows through the porous seal material. In this case, leakage across any seal interfaces are assumed negligible. In fact, state-of-the-art gas leak rate prediction methods rely heavily on this assumption. A recent study into the quantification of the seal-interface leakage of elastomer face seals, however, has revealed that this is not the case. As the preliminary study previously presented, with moderate contact pressure the interface leakage components were found t
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Baughn, Terry V., and Shea Chen. "Low Cycle Fatigue in RF Microwave Module Housings." In ASME 2003 International Electronic Packaging Technical Conference and Exhibition. ASMEDC, 2003. http://dx.doi.org/10.1115/ipack2003-35263.

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Hermetic housings are required for the vast majority of electronics used in RF microwave electronics to protect the gallium arsenide and silicon devices from the environment. A common housing style includes a metal ring frame that is brazed onto a metal or ceramic base. The housing is populated with electronic devices and circuits and then hermetically sealed with a thin metal lid. For high volume manufacturing, lids are often attached by a resistance weld using a seam seal process. The interior hermitic volume is sealed at or near one atmosphere internal pressure. Since the housing may be sub
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Lee, James, and Tony Rogers. "Hermetic Packaging Technique Featuring Through-Wafer Interconnects and Low Temperature Direct Bond." In 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems. ASMEDC, 2008. http://dx.doi.org/10.1115/micronano2008-70288.

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A novel wafer level packaging method suitable for low production volumes, R&D, and multi-project wafers is presented, providing a hermetic seal suitable for vacuum encapsulation with wafers bonded at a low temperature. Hermetic through-wafer interconnects are bump bonded to a CMOS chip encapsulated by bonding a cap wafer after activating surfaces with free radicals, the Silicon-Silicon direct bond is then annealed to a high strength at 200°C to avoid chip damage. The application for which this system is proposed is an implantable multi-contact active nerve electrode for the treatment of ep
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Kazemi, Alex A., Eric Chan, and Dennis Koshinz. "Micro packaging of hermetic seal mini dual in line laser diode module for aerospace applications." In SPIE Optical Engineering + Applications, edited by Alex A. Kazemi, Bernard C. Kress, and Edgar A. Mendoza. SPIE, 2014. http://dx.doi.org/10.1117/12.2061788.

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Reports on the topic "Hermetic seal"

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Kit, Kevin. Development and Evaluation of Integrity Assessment Tests for Polymeric Hermetic Seals. Defense Technical Information Center, 2006. http://dx.doi.org/10.21236/ada468015.

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Brow, R. K., D. R. Tallant, and S. V. Crowder. Advanced materials for aerospace and biomedical applications: New glasses for hermetic titanium seals. Office of Scientific and Technical Information (OSTI), 1996. http://dx.doi.org/10.2172/510597.

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