Relevant bibliographies by topics / Hermetic seals

Contents

  1. Journal articles
  2. Dissertations / Theses
  3. Books
  4. Book chapters
  5. Conference papers
  6. Reports

Academic literature on the topic 'Hermetic seals'

Author: Grafiati
Published: 4 June 2021
Last updated: 13 February 2022

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Journal articles on the topic "Hermetic seals"

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Neilsen, M. K., L. A. Andrews, S. L. Monroe, and H. L. McCollister. "Development of Hermetic Microminiature Connectors." Journal of Electronic Packaging 113, no. 4 (December 1, 1991): 405–9. http://dx.doi.org/10.1115/1.2905427.

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Miniaturization of hermetic packages has provided the incentive to develop a new family of hermetic microminiature connectors. Microminiature connectors, with a pin spacing of 1.27 mm, have previously been available only in the nonhermetic form. New microminiature connectors with compression seal materials, 304 Stainless Steel housings, Alloy 52 pins, and TM-9 Glass insulators, were examined because compression seals are currently used in larger hermetic connectors and are typically designed to create a residual compressive stress state in the insulator during manufacturing. The new microminiature connectors with compression seals were evaluated analytically with two and three-dimensional finite element models and experimentally by fabrication of prototype connectors. The finite element analyses predicted the development of undesirable tensile stress in the insulator during manufacture and identified the mechanism responsible for the generation of tensile stress in the glass. The experimental investigation confirmed the existence of undesirable tensile stress in the glass with the observation of crack development during manufacture. Since the design requirements would not allow the geometric modifications needed to manufacture crack-free connectors with compression seals, insulator materials that generate a matched seal with 304 Stainless Steel housing were developed. Connectors with these matched seals were successfully manufactured.
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Radionov, Aleksander, Aleksander Podoltsev, and Grzegorz Peczkis. "The Specific Features of High-Velocity Magnetic Fluid Sealing Complexes." Open Engineering 8, no. 1 (December 31, 2018): 539–44. http://dx.doi.org/10.1515/eng-2018-0066.

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Abstract Studies on the impact of magnetic and centrifugal forces in hermetic magnetic-liquid seals were presented. The results of numerical calculations on the decrease of the impact of the centrifugal force through the use of magnetic flux concentrators on a rotating shaftwere shown. It has been demonstrated that there is a greater possibility for the use of hermetic magnetic-liquid seals in axially symmetrical clearances in gas-steam separation for coke gases.
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Loehman, R. E. "Glass Ceramics for Hermetic Metal-Insulator Seals." JOM 38, no. 12 (December 1986): 42. http://dx.doi.org/10.1007/bf03257598.

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Donaldson, P. E. K., and E. Sayer. "Technical note: testing hermetic seals of microelectronic packages." Journal of Medical Engineering & Technology 12, no. 1 (January 1988): 26–27. http://dx.doi.org/10.3109/03091908809030154.

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Negmatov, Sayibjan, Bahrom Rahmonov, Bakhodir Sobirov, Akbar Abdullaev, Yuldosh Salimsakov, Jakhongir Negmatov, Malika Negmatova, Rustam Soliev, and Dilshod Mahkamov. "Developing of Effective Multipurpose Polymer-Bitumen Compositions." Advanced Materials Research 413 (December 2011): 539–40. http://dx.doi.org/10.4028/www.scientific.net/amr.413.539.

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We researched and developed effective polymer bitumen composites for hermetic of deformities seals of concrete and asphalts roads, bridges, aerodrome and airfields used in hot climate conditions and high lands.
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Stack, J. G., and M. S. Acarlar. "Heat Transfer and Thermal Stress Analysis of an Optoelectronic Package." Journal of Electronic Packaging 113, no. 3 (September 1, 1991): 258–62. http://dx.doi.org/10.1115/1.2905404.

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The reliability and life of an Optical Data Link transmitter are inversely related to the temperature of the LED. It is therefore critical to have efficient packaging from the point of view of thermal management. For the ODL® 200H devices, it is also necessary to ensure that all package seals remain hermetic throughout the stringent military temperature range requirements of −65 to +150°C. For these devices, finite element analysis was used to study both the thermal paths due to LED power dissipation and the thermally induced stresses in the hermetic joints due to ambient temperature changes
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Murawski, K., K. Aristovich, and H. T. Lancashire. "Selective laser sintering of glass-ceramic bonds using a defocused Nd:YAG laser." International Symposium on Microelectronics 2020, no. 1 (September 1, 2020): 000286–90. http://dx.doi.org/10.4071/2380-4505-2020.1.000286.

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Abstract Protecting miniature implantable electronics may require mm scale hermetic packages. Glass-ceramic bonding by selective laser sintering of glass sealing paste using a defocused Nd:YAG laser is presented. Glass sealing paste (FX11-036, Ferro) is screen printed onto alumina ceramic, clamped in contact with borosilicate glass, and laser treated while heating to 250°C. With the addition of defocusing and a heat source the glass paste reflowed and wetted both the alumina and coverslip surfaces, with an optimal effect between 10 mm and 15 mm defocusing. This method is promising to create electrically non-conductive hermetic seals at the mm scale.
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Hung, Y. Y. "Technique for rapid inspection of hermetic seals of microelectronic packages using shearography." Optical Engineering 37, no. 5 (May 1, 1998): 1406. http://dx.doi.org/10.1117/1.601656.

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Calnan, Sonya, Stefan Aschbrenner, Fuxi Bao, Erno Kemppainen, Iris Dorbandt, and Rutger Schlatmann. "Prospects for Hermetic Sealing of Scaled-Up Photoelectrochemical Hydrogen Generators for Reliable and Risk Free Operation." Energies 12, no. 21 (November 1, 2019): 4176. http://dx.doi.org/10.3390/en12214176.

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Photo-electrochemical (PEC) systems have the potential to contribute to de-carbonation of the global energy supply because solar energy can be directly converted to hydrogen, which can be burnt without the release of greenhouse gases. However, meaningful deployment of PEC technology in the global energy system, even when highly efficient scaled up devices become available, shall only be a reality when their safe and reliable operation can be guaranteed over several years of service life. The first part of this review discusses the importance of hermetic sealing of up scaled PEC device provided by the casing and sealing joints from a reliability and risk perspective. The second part of the review presents a survey of fully functional devices and early stage demonstrators and uses this to establish the extent to which the state of the art in PEC device design address the issue of hermetic sealing. The survey revealed that current material choices and sealing techniques are still unsuitable for scale–up and commercialization. Accordingly, we examined possible synergies with related photovoltaic and electrochemical devices that have been commericalised, and derived therefrom, recommendations for future research routes that could accelerate the development of hermetic seals of PEC devices.
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Terentyev, Vladimir, Aleksei Bausov, and Mihail Toropov. "STUDY OF HERMETIC ABILITY OF A COMBINED FERROFLUIDIC SEALED OF BEARING ASSEMBLIES." Bulletin Samara State Agricultural Academy 6, no. 1 (May 20, 2021): 25–31. http://dx.doi.org/10.12737/44167.

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The purpose of the research is to increase the efficiency of hermetic ability of bearing assemblies by using com-bined ferrofluidic sealed. The research objective is theoretic justification of the maximum concentration of ferro-magnetic particles in fluid, investigation of hermatic ability of a combined ferrofluidic seal under conditions of tem-perature changing and speed of a shaft rotation of packing bearing assembly. The study of hermetic ability of lip and ferro-fluidic sealed was carried out on a test bench, allowing to determine the packing ability of seals both in static and dynamic mode. On the basis of theoretical data, formulas were determined to find the maximum concen-tration of hard and magnetic phases in a ferrofluid, and its composition based on a polyethylsiloxane liquid PES-5 with a 40 kA/m saturation magnetization and a 1.2 Pas dynamic viscosity coefficient was developed. A mixture of magnetite with powdered iron was used as the ferromagnetic phase. Oleic acid was used as a surfactant. Studies to determine hermetic capacity have shown a higher efficiency of the combined ferrofluidic seal compared to the lip one. During static test within the temperature range between 20 to 600C, the critical pressure difference of the com-bined seal was 4-16% higher than that of the lip seal. Temperature increase of the bearing assembly from 20 to 1200C causes a decrease in critical pressure difference of up to 50%. This is due to a decrease in the sedimentative stability of the magnetic fluid as a result of an increase in temperature. Studies show that the combined ferrofluidic seal has a higher hermetic tightness at the starting torque than the standard lip seal. In contrast to the lip seal (which tends to lose its tightness at the starting torque), no leakage of pressure fluid from the sealed unit was observed of the com-bined ferrofluidic one with a pressure drop of 0.094 MPa. The results obtained allow reasonably select the concen-tration of magnetic particles in the ferrofluid, and also prove the prospects of replacing standard lip seals with com-bined ferrofluidic ones.
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Dissertations / Theses on the topic "Hermetic seals"

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Staff, M. T. "The development and ageing of hermetic seals : a strontium boroaluminate glass-ceramic bonded to Ti-6Al-4V and Kovar." Thesis, University of Surrey, 2016. http://epubs.surrey.ac.uk/812551/.

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Feed-through connectors are used in the electronics industry to route electrical current into isolated environments. Electrically insulating glasses are used to separate metals from each other to form leak tight glass-to-metal seals. The coefficients of thermal expansion (CTE) are controlled to reduce thermomechanical stresses in the seal. The majority of glass-to-metal seals consist of stainless steel housings and pins bonded to silicate-based glasses. Titanium and its alloys are alternative housing materials due to their low density and thus weight saving potential. Silicate-based glasses form weak and brittle interlayers when bonded to titanium, so borate-based glasses are used instead. Glasses are replaced with glass-ceramics due to improved toughness and refractory performance whilst allowing the CTE to be controlled. A knowledge gap is present as few heat treatments are published to manufacture robust glass-ceramic-to-metal seals with a Ti-6Al-4V housing. Hermetic glass-ceramic-to-metal seals were required to incorporate a Ti-6Al-4V housing and an electrically conducting pin, to survive for up to 30 years at standard laboratory conditions (20 ± 10 °C / 30 ± 20 %RH). The manufacture and testing of glass-ceramic-to-metal seals was divided into three parts: seal development, characterisation, and ageing. Hermetic seals were made between Ti-6Al-4V, a strontium boroaluminate glass-ceramic and an oxidised Kovar pin with a helium leak rate less than 1 × 10-9 mbar l s-1. Kovar was selected as the pin material predominantly due to the low CTE. Differential thermal analysis and push-rod dilatometry were used to tailor the CTE of the glass-ceramic (8.4 ± 0.1 × 10-6 °C-1) between the Ti-6Al-4V housing (10.1 ± 0.1 × 10-6 °C-1) and the oxidised Kovar pin (7.4 ± 0.1 × 10-6 °C-1). The CTEs were measured between 30 °C and 600 °C. The Kovar pin was oxidised in air at 700 °C for 10 minutes. The seal was heat treated in an argon atmosphere that peaked with an isothermal hold at 800 °C for 20 minutes, specifically to tailor the CTE of the glass-ceramic. Seals were reproducible in terms of hermeticity, microstructure and mechanical strength. Reproducible leak tight seals were manufactured in batches of 5 seals. A reproducible microstructure of the seal was confirmed with scanning electron microscopy, energy dispersive X-ray spectroscopy and X-ray diffraction. The seals had a load at failure of 1510 ± 10 N. Seals were aged between 20 – 85 °C, 35 – 93 %RH, for up to 32 weeks. There was no change in the hermeticity of the seals as a function of ageing time or temperature. The surface of the glass-ceramic aged at 85 °C / 93 %RH was degraded by contact with water vapour at a rate of 5 ± 1 μm yr-1. The resulting strontium enriched layer was mechanically weak. There was a 1 % change in the load at failure of the seals, aged as a function of time and temperature, which was accounted for by natural variation within the samples. Thus, the seals developed in this study are expected to remain hermetic following tens of years of ageing at standard laboratory conditions.
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Gibney, Matthew Joseph IV. "Predicting Package Defects: Quantification of Critical Leak Size." Thesis, Virginia Tech, 2000. http://hdl.handle.net/10919/34857.

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Threshold leak sizes and leak rates were calculated for a number of liquid food products exhibiting a wide range of surface tension and viscosity values. From this data, one can see that mathematically, under typical pressure differentials generated in food packages (less than or equal to ±34.5 kPa), a leak will never start through a 2 μm defect. The calculated leak rates were compared to calculated evaporation rates. The evaporation rate exceeds the leak rate at lower sized microholes (2, and 5 μm diameter) under typical pressure differentials found in food packages. If the liquid, typically aqueous in food products, is evaporating off faster than the leak itself, then there will be solids left behind that could effectively plug the leak.

The critical leak size is the size micro-defect that allows microbial penetration into the package. The critical leak size of air-filled defects was found to be 7 μm at all pressures tested. This size is considerably important to food packagers because this is when sterility of the package is lost. Previous leak studies have shown that the critical leak size for liquid-filled defects coincide with the threshold leak size and pressure. If this is in fact true, then air-filled defects should exhibit a larger critical leak size than the liquid-filled defects. In this study, air-filled defects were examined. A bioaerosol exposure chamber was used to test micro-defects, nickel microtubes of known diameters 2, 5, 7, 10, 20, and 50 μm hydraulic diameters, against pressure differentials of 0, -6.9, -13.8, and -34.5 kPa.
Master of Science

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Memon, Saim. "Design, fabrication and performance analysis of vacuum glazing units fabricated with low and high temperature hermetic glass edge sealing materials." Thesis, Loughborough University, 2013. https://dspace.lboro.ac.uk/2134/14562.

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Vacuum glazing is a vital development in the move to more energy efficient buildings. In vacuum glazing, an evacuated cavity supresses gaseous conduction and convection to provide high thermal resistance. A high vacuum pressure (less than 0.1 Pa) is required and must be maintained by a hermetic seal around the periphery, currently formed with either indium (i.e. low temperature sealing method) or solder glass (i.e. high temperature sealing method). This thesis reports the results of an experimental and theoretical investigation into the development of new low temperature (less than 200°C) and novel high temperature (up to 450°C) glass edge seals. A new low temperature composite edge seal was developed in which double and triple vacuum glazings each of dimensions 300x300mm were fabricated with measured vacuum pressures of 4.6x10-2Pa and 4.8x10-2Pa achieved respectively. A three dimensional finite element model of the fabricated design of composite edge sealed triple vacuum glazing was developed.
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Agarwal, Rahul. "Low temperature hermetically sealed 3-D MEMS device for wireless optical communication." [Tampa, Fla] : University of South Florida, 2007. http://purl.fcla.edu/usf/dc/et/SFE0002181.

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Zahr, Abedel Halim. "Optimisation et réalisation d’un package pour MEMS-RF." Thesis, Limoges, 2016. http://www.theses.fr/2016LIMO0106.

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Le packaging des MEMS-RF est un sujet de recherche qui a été étudié de manière intensive ces dernières années. En effet, la fiabilité des composants micromécaniques est directement dépendante de l’humidité et de la poussière avoisinant la structure. C’est pourquoi la recherche d'un package parfaitement hermétique à très faible coût, sans influence sur les performances RF reste d’actualité, même si un grand nombre de publications et de solutions ont été présentées auparavant. Ces travaux de recherche porte sur la conception, la réalisation et la caractérisation de commutateurs MEMS-RF ohmiques packagés par deux techniques différentes. La première partie de cette thèse a été consacrée d’étudier une encapsulation par film mince. Une couche métallique d’or électrolysée est utilisée pour former le capot, ensuite le nitrure de silicium est utilisé pour sceller le capot. Cette technique a présenté plusieurs avantages où nous obtenons une petite taille, l’augmentation du nombre de composants par substrat tout en réduisant le cout de fabrication. Malgré tous ces avantages, cette technique engendre aux composants des faibles effets parasites sur leurs performances RF. La deuxième technique qui a été étudié dans ce travail, est l’encapsulation par collage de tranche. Le principe de cette encapsulation est de sceller un substrat de capots micro-usinés en silicium avec un substrat contenant les composants MEMS-RF. Ensuite, une découpe de deux substrats est nécessaire pour obtenir les commutateurs MEMS-RF encapsulés. Le scellement utilisé durant cette thèse était le glass frit qui garantit une très bonne herméticité. Des mesures d’herméticité sont faites par le cnes montrent que les commutateurs mems-rf sont encapsulés hermétiquement en indiquant un taux de fuite de 8.8e-12 atm.cc/s. Les performances RF du commutateur MEMS-RF sont déjà présentées et qui montrent que cette technique d’encapsulation ne présente aucune influence sur ces performances
RF MEMS packaging is an important research topic that is intensively studied for years. Indeed, Micro-mechanical devices that are protected from humidity, dust and working in a clean controlled atmosphere consequently improve their reliability. Meanwhile, the search for a perfectly hermetic package at very low cost with no influence on the RF performances is still a challenge even if a lot of publications and solutions have been presented so far. This research focuses on the design, realization and characterization of encapsulated RF MEMS switches using two different techniques. The first part of this thesis has been to study a Wafer Level Thin Film Packaging (WLTFP) using a metallic cap, then we have utilize the silicon nitride to seal this cap. This encapsulation technique presents several advantages where we have extremely small volume cavity, no double-wafer alignment required, and substantial increase in the number of devices per wafer reducing cost. Despite all these advantages, this technique generates to the components a low parasitic effects on their RF performances. Another type of packaging has been studied during this thesis is Wafer to Wafer Packaging. The principle of this encapsulation is to seal a micro-machined wafer of caps on the wafer containing RF MEMS switches to be protected. The both wafers are then cut together and we obtain directly the packaged switches. The RF MEMS packaging using this technique permits to obtain a hermetic package (leak rate of 8.8e-12 atm.cc/s measured by the French Space Agency-CNES) with no influence on the device characteristics. The RF characterization of the switch having a silicon cap bonded using a dielectric sealing paste have shown that the insertion loss in the ON state and the isolation in the OFF state is practically the same before and after capping
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Books on the topic "Hermetic seals"

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McLaren, Andrew. The neither/either world .... or all four (loopholes/hermetic seals). Halifax, N.S: The Author, 2000.

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Center, Langley Research, ed. Fiber optic cable feedthrough and sealing. [Cleveland, Ohio]: National Aeronautics and Space Administration, Lewis Research Center, 1998.

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Llewellyn, Matthew P., and John Gleaves. The Global Games and the Intransigent Dictator. University of Illinois Press, 2017. http://dx.doi.org/10.5406/illinois/9780252040351.003.0007.

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This chapter discusses the decline amateurism during the Cold War era. The Cold War realpolitik, rising global commerce, interorganizational friction, and the advent of television converged to deliver debilitating blows to the amateur ideal. Still, International Olympic Committee (IOC) president Avery Brundage had the opportunity to position Olympic amateurism on a more favorable and defensible footing. By lifting the hermetic seals to the IOC's financial coffers, undertaking professional and jurisdictional restructuring, and adopting an uncompromising stance toward known violators, he might have given amateurism a greater chance of survival. However, Brundage's lack of administrative foresight inadvertently pushed amateurism further down the path toward dissolution and decline.
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Book chapters on the topic "Hermetic seals"

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Jamison, Ryan D., Pierrette H. Gorman, Jeffrey Rodelas, Danny O. MacCallum, Matthew Neidigk, and J. Franklin Dempsey. "Analysis of Laser Weld Induced Stress in a Hermetic Seal." In Residual Stress, Thermomechanics & Infrared Imaging, Hybrid Techniques and Inverse Problems, Volume 9, 199–207. Cham: Springer International Publishing, 2016. http://dx.doi.org/10.1007/978-3-319-21765-9_25.

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Müller, Heinz K., and Bernard S. Nau. "Hermetic Seals." In Fluid Sealing Technology, 393–408. Routledge, 2019. http://dx.doi.org/10.1201/9780203755716-22.

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"Nicolas Appert and the Development of the Hermetic Seal." In Historic Bottle and Jar Closures, 91–96. Routledge, 2016. http://dx.doi.org/10.4324/9781315427454-12.

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Jamaladdin Nuraddin, Aslanov, and Huseynli Zenfira Seyidi. "CALCULATION METHOD OF HERMETIC SEAL ASSEMBLY ARAMETERS OF THE PACKER USED DURING REPAIRING WELLS." In New stages of development of modern science in Ukraine and EU countries. Publishing House “Baltija Publishing”, 2019. http://dx.doi.org/10.30525/978-9934-588-15-0-49.

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Conference papers on the topic "Hermetic seals"

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White, Maurice A., S. Grant Emigh, and Peter Riggle. "Hermetic Bellows Seals for Stirling Engines." In 22nd Intersociety Energy Conversion Engineering Conference. Reston, Virginia: American Institute of Aeronautics and Astronautics, 1987. http://dx.doi.org/10.2514/6.1987-9217.

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Hung, Y. Y., and Dahuan Shi. "Rapid evaluation of hermetic seals using digital shearography." In SPIE's 1995 International Symposium on Optical Science, Engineering, and Instrumentation, edited by Ryszard J. Pryputniewicz, Gordon M. Brown, and Werner P. O. Jueptner. SPIE, 1995. http://dx.doi.org/10.1117/12.212667.

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Hung, Y. Y., and Dahuan Shi. "Rapid evaluation of hermetic seals in microelectronic packages using shearography." In Intl. Conf. on Experimental Mechanics: Advances and Applications, edited by Fook S. Chau and C. T. Lim. SPIE, 1997. http://dx.doi.org/10.1117/12.269788.

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Hung, Y. Y., and Dahuan Shi. "Rapid Evaluation of Hermetic Seals in Automotive Microelectronic Packages Using Shearography." In International Congress & Exposition. 400 Commonwealth Drive, Warrendale, PA, United States: SAE International, 1996. http://dx.doi.org/10.4271/960975.

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Hung, S. Y., Y. H. Huang, and L. Liu. "Optical system for fast inspection of hermetic seals in electronic packages." In 2010 International Symposium on Optomechatronic Technologies (ISOT 2010). IEEE, 2010. http://dx.doi.org/10.1109/isot.2010.5687311.

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Petrie, Charles, and Harold Beattie. "Hermetically Sealed Thermocouples." In ASME 1993 International Gas Turbine and Aeroengine Congress and Exposition. American Society of Mechanical Engineers, 1993. http://dx.doi.org/10.1115/93-gt-036.

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This paper presents the results of a certification test to incorporate hermetic glass seals into thermocouple sensors utilized for Power Turbine Inlet Temperature sensing in a gas turbine engine in commuter aircraft service. Failure modes found in field service returns are characterized and the general procedure for installing a glass compression seal are outlined.
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Curtis, Bret, Cody Lough, Robert Landers, Doug Bristow, and Edward Kinzel. "Fabrication of Glass to Metal Connections Using a Laser Heated Additive Approach." In ASME 2019 14th International Manufacturing Science and Engineering Conference. American Society of Mechanical Engineers, 2019. http://dx.doi.org/10.1115/msec2019-3048.

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Abstract Glass-to-metal seals are important in hermetic electrical feedthroughs for high-temperature and high-pressure applications. Traditionally, glass-to-metal seals are created using a high temperature furnace with controlled pressure and atmosphere. Current manufacturing techniques for glass-to-metal seals require precise fixturing (limiting unitization) and face restrictions in terms of the coefficient of thermal expansion for the glass/metal system. This paper explores the potential to use a laser to locally heat the glass as the first step toward the additive manufacturing of glass to metal seals. Studies are conducted fusing both frit and preforms under ambient conditions. The effects of process parameters on the process are quantified. The paper shows the potential of the process using Selective Laser Melting equipment, which can lead to greater flexibility for glass-to-metal seals with respect to geometry, materials, and spatially varying properties.
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Garafolo, Nicholas G., and Christopher C. Daniels. "The Quantification of Seal-Interface Leakage of an Elastomer Face Seal." In ASME 2011 International Mechanical Engineering Congress and Exposition. ASMEDC, 2011. http://dx.doi.org/10.1115/imece2011-63620.

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Current gas leak rate prediction methods for elastomeric face seals rely heavily on the assumption that all leakage is permeation, rather than leakage across the seal interface [1–3]. To date, there has been no definitive evidence that this is indeed the case. It is essential to investigate the magnitude of interface leakage to facilitate the validation of the current compressible permeation model and to quantify the interfacial leakage for the design of future state-of-the-art face seals. To this end, a series of leak rate experiments is presented on a square-ring seal, manufactured from silicone elastomer S0383-70. The unique experimental design affords the ability to quantify both a metal-elastomer interface, as well as an elastomer-elastomer interface. The experiments utilized two square-ring test specimens, each with a common width but different in height. The test apparatus consisted of stainless steel platens, near-hermetic plumbing, programmable environmental chamber, and the required instrumentation. The initial data reduction was accomplished by the mass point leak rate technique; whereas mass was calculated through measurements of gas pressure, temperature, and volume and a regression analysis yielded the leak rate of the seal. A secondary reduction of the leak rates in the unique experimental configuration further distinguished the total leakage into permeation and interface leak components, accomplished through the algebraic solution of the design of experiments guided matrix. Results showed that, with modest contact pressure, permeation was the largest component of the total leakage. In addition, the interface leakage for the various seal mating conditions (i.e., seal-on-flange, seal-on-seal) was quantified for the contact pressure investigated. Contrary to previous conclusions, the interface leakages were found to be significant. In the application of space docking seals, a common example of elastomeric face seals, the significance of quantifying the interfacial leakages guides the design of the seal for incomplete seal compression conditions as well has for the androgynous docking configuration.
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Bhopte, Siddharth, Parthiban Arunasalam, Fadi Alsaleem, Arvind Rao, and Nataraj Hariharan. "Power Allocation Towards Hermetic Solder Joint Health of High Powered MEMS Chip for Harsh Environment Applications." In ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems. ASMEDC, 2011. http://dx.doi.org/10.1115/ipack2011-52296.

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Solders have been utilized extensively in the MEMS packaging industry to create vacuum or hermetic seals in a variety of applications. MEMS technology is finding applications in wide range of products like pressure sensors, actuators, flow control devices etc. For many harsh low temperature environment applications, like commercial refrigeration systems, MEMS based pressure sensors and flow actuators are directly mounted on to metal substrates using solders to create hermetic sealing. Solders attaching silicon devices directly to metal substrates may be subjected to very high thermal stresses due to significant difference in thermal expansion coefficients during chip operation or environment temperatures. In this paper, case study of a high powered MEMS chip (referred in the paper as die) operating in a commercial refrigeration system is presented. Accelerated test method for qualifying solder joint for high pressure applications is briefly discussed. Lab experiments showing typical refrigeration cycle thermal load on solder joint are presented. Based on the study, concepts of die power toggling and power allocation towards enhancing hermetic solder joint reliability are discussed. Detailed numerical case studies are presented to quantify the improvement in solder joint reliability due to the proposed concept.
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Garafolo, Nicholas G., and Christopher C. Daniels. "An Empirical Investigation on Seal-Interface Leakage of an Elastomer Face Seal." In ASME 2012 Fluids Engineering Division Summer Meeting collocated with the ASME 2012 Heat Transfer Summer Conference and the ASME 2012 10th International Conference on Nanochannels, Microchannels, and Minichannels. American Society of Mechanical Engineers, 2012. http://dx.doi.org/10.1115/fedsm2012-72026.

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Abstract:
For the application of seals used in space, a common assumption is that all leakage is attributed to permeation, that is the gas flows through the porous seal material. In this case, leakage across any seal interfaces are assumed negligible. In fact, state-of-the-art gas leak rate prediction methods rely heavily on this assumption. A recent study into the quantification of the seal-interface leakage of elastomer face seals, however, has revealed that this is not the case. As the preliminary study previously presented, with moderate contact pressure the interface leakage components were found to be significant and distinct from zero. The objective of the research presented herein was to further quantify both the elastomer-metal and elastomer-elastomer interface leakages for various contact pressures. To this end, a series of leak rate experiments is presented on a square-ring seal, manufactured from silicone elastomer S0383-70. The unique experimental design affords the ability to quantify both the elastomer-metal interface, as well as an elastomer-elastomer interface. The experiments utilized matched sets of test specimens, each with a common width but different height. The test apparatus contained both a flow fixture capable of quantifying ultra-low leak rates and an electro-mechanical actuated load frame for precision contact pressure control. The leak rate apparatus consisted of stainless steel platens, near-hermetic plumbing, and the required instrumentation. The initial data reduction was accomplished by the mass point leak rate technique; whereas mass was calculated through measurements of gas pressure, temperature, and volume and a regression analysis yielded the leak rate of the seal. A secondary reduction of the leak rates in the unique experimental configuration further distinguished the total leakage into permeation and interface leak components, accomplished through the algebraic solution of the design of experiments guided matrix. Foremost, results confirmed that the interface leakage is non-negligible and distinct from zero, as with previous studies. Furthermore, results suggested that the interface leakage was drastically decreased with modest seal contact pressure.
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Reports on the topic "Hermetic seals"

1

Kit, Kevin. Development and Evaluation of Integrity Assessment Tests for Polymeric Hermetic Seals. Fort Belvoir, VA: Defense Technical Information Center, February 2006. http://dx.doi.org/10.21236/ada468015.

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2

Brow, R. K., D. R. Tallant, and S. V. Crowder. Advanced materials for aerospace and biomedical applications: New glasses for hermetic titanium seals. Office of Scientific and Technical Information (OSTI), November 1996. http://dx.doi.org/10.2172/510597.

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