Relevant bibliographies by topics / High cycle fatigue solder

Contents

  1. Journal articles
  2. Dissertations / Theses
  3. Books
  4. Book chapters
  5. Conference papers
  6. Reports

Academic literature on the topic 'High cycle fatigue solder'

Author: Grafiati
Published: 4 June 2021
Last updated: 1 February 2022

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Journal articles on the topic "High cycle fatigue solder"

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Barker, D., J. Vodzak, A. Dasgupta, and M. Pecht. "Combined Vibrational and Thermal Solder Joint Fatigue—A Generalized Strain Versus Life Approach." Journal of Electronic Packaging 112, no. 2 (June 1, 1990): 129–34. http://dx.doi.org/10.1115/1.2904353.

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The combined effects of elastic and inelastic strains on solder joint reliability are investigated. Experimental data from high-cycle fatigue tests of solder are combined with data from low-cycle fatigue tests to obtain a plot of total strain amplitude against cycles to failure. The generalized Coffin-Manson fatigue equation is used to describe this relationship. The transition fatigue life of approximately 7000 cycles indicates that elastic strains play a significant role in the fatigue damage of solders at a life of 103 cycles or higher. The results suggest that the commonly adopted approach of relating only inelastic strain, or the total strain, to fatigue life with a single power law relationship may be inadequate when predicting solder joint reliability. Instead, both elastic strains and plastic strains should be considered, especially when the electronic assembly is subjected to a combination of large amplitude thermal loads and relatively lower amplitude vibrational loads. A methodology is presented to evaluate the combined effects of simultaneous vibration and thermal cycling of solder joints. This combined loading situation is simulated by superposing the effects of the vibrational and thermal loads. The damage due to each load-type acting individually is determined and then superposed to assess the overall effective fatigue life of the joint. As a first order approximation, a linear superposition rule is utilized, Miner’s rule. Reliability predictions from this simple superposition model are then compared to standard low cycle thermal fatigue models.
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SAITO, Takahiro, Masahiro HATANAI, Osamu KAMIYA, Takehiko TAKAHASHI, and Susumu HIOKI. "High Cycle Fatigue Behavior of Pb-free Solder." Proceedings of Autumn Conference of Tohoku Branch 2004.40 (2004): 25–26. http://dx.doi.org/10.1299/jsmetohoku.2004.40.25.

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KOBAYASHI, Hiroyuki, Syungo SATAKE, Takashi KAWAKAMI, Takahiro KINOSHITA, Tetsuya KUGIMIYA, and Toshiyuki MORIBAYASHI. "PS51 High cycle fatigue strength of solder materials." Proceedings of the Materials and Mechanics Conference 2010 (2010): 160–62. http://dx.doi.org/10.1299/jsmemm.2010.160.

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Solomon, H. D. "Low Cycle Fatigue of Sn96 Solder With Reference to Eutectic Solder and a High Pb Solder." Journal of Electronic Packaging 113, no. 2 (June 1, 1991): 102–8. http://dx.doi.org/10.1115/1.2905374.

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This paper describes the 35°C and 150°C low cycle fatigue behavior of Sn96 solder (96.5 Sn/3.5 AG), the tin silver eutectic. There is a considerable amount of anecdotal information which says that this solder is superior to eutectic solder in its fatigue resistance. This study generally supports this assertion, but not for all plastic strain ranges. This solder has an excellent balance of strength, ductility and fatigue life under strain cycling. Furthermore, it is also shown that this solder is superior to a high Pb solder (92.5 Pb/2.5 Ag/5.0 Sn). The only drawback of the tin silver eutectic is that it has a higher melting point than the melting point for the Sn/Pb eutectic (221°C versus 183°C), and this requires a higher soldering temperature. This higher temperature necessitates some process alterations in order to use this solder.
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Qi, Fang Juan, Li Xing Huo, Ya Ping Ding, and Zhan Lai Ding. "Study on the Mechanical Bend Fatigue of Micro-Joining Soldered Joint with Lead-Free Solder." Key Engineering Materials 353-358 (September 2007): 2573–76. http://dx.doi.org/10.4028/www.scientific.net/kem.353-358.2573.

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In recent years, several electronics manufacturers have been working toward introducing lead-free solder and halogen-free print circuit boards (PCBs) into their products. The key drivers for the change in materials have been the impending environmental legislations, particularly in Europe and Japan as well as the market appeal of ‘green’ products. The reliability of the new materials is an important determinant of the pace of adoption. Fairly extensive mechanical fatigue reliability data is also available for micro-joining soldered joint such as Ball Grid Array (BGA) with tin-lead solder. However, similar data is not available for BGAs assembled with lead-free solder. Mechanical reliability is a critical indicator for phone and BGA survival during repeated keypress, and to some extent during drop. In this paper, the mechanical bend fatigue of BGAs with tin-lead and lead-free solders on halogen-free substrates are examined respectively. A tin-silver-copper alloy was used as lead-free solder due to its increasing acceptance, and the results were compared to those from samples assembled with Sn63Pb37 solder. The reliability was examined at both low cycle and high cycle fatigue. Results show that the mechanical bend fatigue reliability of BGA assemblies with lead-free solder is higher than that of BGA assembly with tin-lead solder. Cross section and failure analysis indicated two distinct failure modes - solder joint and PCB failure. A 3-D parametric finite element model was developed to correlate the local PCB strains and solder joint plastic strains with the fatigue life of the assembly. The intermetallic compoumd (IMC) of micro-joining joint interface was analysised in the future in order to study on the effect of IMC on the reliability.
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Barry, N., I. P. Jones, T. Hirst, I. M. Fox, and J. Robins. "High‐cycle fatigue testing of Pb‐free solder joints." Soldering & Surface Mount Technology 19, no. 2 (April 17, 2007): 29–38. http://dx.doi.org/10.1108/09540910710836511.

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Stone, D. S. "The Creep-Fatigue Interaction in Solders and Solder Joints." Journal of Electronic Packaging 112, no. 2 (June 1, 1990): 100–103. http://dx.doi.org/10.1115/1.2904348.

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Two models are proposed for relating the metallurgy of the solder to the growth of fatigue cracks through solder joints. These models illustrate how different aspects of the creep behavior can contribute to the so-called “creep-fatigue interaction”. The first model treats fatigue crack growth through the solder, far from the interface between solder and substrate. Either an intragranular or intergranular path may be taken depending upon conditions of loading. Intragranular fatigue dominates when the cycle frequency is high, in which case failure life is governed by the Coffin-Manson law. Intergranular failure occurs at low frequencies because grain boundary sliding at low frequencies allows the grain boundaries to become exposed to the atmosphere, which in turn causes oxidation. This model predicts the effects of frequency, strain amplitude, and grain size on fatigue life. In the second model, the fatigue crack travels within the interface region between solder and substrate. Here, the strain introduced in the solder joint during fatigue is not relevant; instead, the stress transferred to the interface is more important. The second model considers the effect of solid solution concentration on fatigue life. The predictions of both models agree reasonably well with published fatigue data from solders and solder joints.
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Ross, R. G. "A Systems Approach to Solder Joint Fatigue in Spacecraft Electronic Packaging." Journal of Electronic Packaging 113, no. 2 (June 1, 1991): 121–28. http://dx.doi.org/10.1115/1.2905377.

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Differential expansion induced fatigue resulting from temperature cycling is a leading cause of solder joint failures in spacecraft. Achieving high reliability flight hardware requires that each element of the fatigue issue be addressed carefully. This includes defining the complete thermal-cycle environment to be experienced by the hardware, developing electronic packaging concepts that are consistent with the defined environments, and validating the completed designs with a thorough qualification and acceptance test program. This paper describes a useful systems approach to solder fatigue based principally on the fundamental log-strain versus log-cycles-to-failure behavior of fatigue. This fundamental behavior has been useful to integrate diverse ground test and flight operational thermal-cycle environments into a unified electronics design approach. Each element of the approach reflects both the mechanism physics that control solder fatigue, as well as the practical realities of the hardware build, test, delivery, and application cycle.
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Ekpu, M., R. Bhatti, M. I. Okereke, and K. C. Otiaba. "Fatigue life analysis of Sn96.5Ag3.0Cu0.5 solder thermal interface material of a chip-heat sink assembly in microelectronic applications." International Symposium on Microelectronics 2013, no. 1 (January 1, 2013): 000473–77. http://dx.doi.org/10.4071/isom-2013-wa23.

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The reliability of microelectronic devices during operation has been a major challenge in recent years. Microelectronics devices will fail if one or more components do not function properly. Thermal interface materials are more likely to fail because of the role they play in heat management. Lead free solders such as SAC305 solder (Sn96.5Ag3.0Cu0.5) have become the thermal materials of interest because of their high thermal conductivity and government legislations on the ban of lead. Ansys finite element software was used for the design and analysis of the microelectronic device studied. The bond line thicknesses of the SAC305 solder thermal interface material were varied from 0.035 mm to 0.175 mm and a thermal load was applied using commercial thermal cycle profile of −40°C to 80°C. The results obtained showed that stresses and strains reduce as the lead free solder thickness increases. The number of cycles to failure and plastic work density increased as the SAC305 solder thickness is increased. This research showed that an increase in SAC305 solder thickness will improve thermal conduction and reliability. However, the solder thickness is limited to the gap between the chip-heat sink surfaces in contact.
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Haiyu Qi, Qian Zhang, E. C. Tinsley, M. Osterman, and M. G. Pecht. "High Cycle Cyclic Torsion Fatigue of PBGA Pb-Free Solder Joints." IEEE Transactions on Components and Packaging Technologies 31, no. 2 (June 2008): 309–14. http://dx.doi.org/10.1109/tcapt.2007.898337.

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Dissertations / Theses on the topic "High cycle fatigue solder"

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Barry, Nathan. "Lead-free solders for high-reliability applications : high-cycle fatigue studies." Thesis, University of Birmingham, 2008. http://etheses.bham.ac.uk//id/eprint/198/.

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The use of lead (Pb) in solders for electronic connections is now extensively restricted in Europe, with its use likely to be phased out completely in the medium term. Although Pb-free solders have been the subject of much research, little investigation has been carried out into their reliability for applications exposed to vibration in service. Aerospace applications, which have service lives measured in decades, are of particular pertinence. The present work shows the development and validation of a method for testing small, model solder joints in high-cycle fatigue. The tests are conducted using common equipment yet provide fast results and objective comparisons between solders without the influence of PCBs or components, which typically obscure the solders’ intrinsic contribution. S-N diagrams are presented which compare the performance of traditional Sn-Pb solder to that of Pb-free alloys at room and high temperatures and with copper and nickel substrates. It is found that in all situations the Pb-free alloys offer lower lifetimes to failure than the traditional Sn-Pb, an unexpected result when considering the inferior mechanical properties of the latter. The large disparity at room temperatures and with copper substrates is significantly reduced by elevated temperatures and by soldering to nickel substrates. In order to investigate these results, a number of techniques are employed. In addition to extensive fractography, the damping capacity of the solders is investigated and a scanning acoustic microscope is used in conjunction with resonant decay tracking of specimens to study the crack propagation paths prior to complete failure. The analysis of results focuses on the possible causes for this performance difference, drawing on existing soldering literature and wider engineering principles. It is concluded that the overall pattern of results presents contradictory evidence for the contribution of various factors, such as yield strength or interfacial adhesion, which are hard to reconcile. It is thought likely that more numerous fatigue initiation sites in the Pb-free alloys are responsible to some degree for their lower cycles to failure, although more research into the effect of substrate and interfacial intermetallics is necessary to determine the mechanism by which these influence the results, in the absence of relevant fractographic evidence.
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Perkins, Andrew Eugene. "Investigation and Prediction of Solder Joint Reliability for Ceramic Area Array Packages under Thermal Cycling, Power Cycling, and Vibration Environments." Diss., Georgia Institute of Technology, 2007. http://hdl.handle.net/1853/14518.

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Microelectronic systems are subjected to thermal cycling, power cycling, and vibration environments in various applications. These environments, whether applied sequentially or simultaneously, affect the solder joint reliability. Literature is scarce on predicting solder joint fatigue failure under such multiple loading environments. This thesis aims to develop a unified modeling methodology to study the reliability of electronic packages subjected to thermal cycling, power cycling, and vibration loading conditions. Such a modeling methodology is comprised of an enriched material model to accommodate time-, temperature-, and direction-dependent behavior of various materials in the assembly, and at the same time, will have a geometry model that can accommodate thermal- and power-cycling induced low-cycle fatigue damage mechanism as well as vibration-induced high-cycle fatigue damage mechanism. The developed modeling methodology is applied to study the reliability characteristics of ceramic area array electronic packages with lead-based solder interconnections. In particular, this thesis aims to study the reliability of such solder interconnections under thermal, power, and vibration conditions individually, and validate the model against these conditions using appropriate experimental data either from in-house experiments or existing literature. Once validated, this thesis also aims to perform a design of simulations study to understand the effect of various materials, geometry, and thermal parameters on solder joint reliability of ceramic ball grid array and ceramic column grid array packages, and use such a study to develop universal polynomial predictive equations for solder joint reliability. The thesis also aims to employ the unified modeling methodology to develop new understanding of the acceleration factor relationship between power cycling and thermal cycling. Finally, this thesis plans to use the unified modeling methodology to study solder joint reliability under the sequential application of thermal cycling and vibration loading conditions, and to validate the modeling results with first-of-its-kind experimental data. A nonlinear cumulative damage law is developed to account for the nonlinearity and effect of sequence loading under thermal cycling, power cycling, and vibration loading.
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Kumbhat, Nitesh. "New Carbon-Silicon Carbide Composite Board Material for High Density and High Reliability Packaging." Thesis, Georgia Institute of Technology, 2005. http://hdl.handle.net/1853/7100.

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Current board technologies are inherently performance-limited (FR-4) or cost-prohibitive (Al2O3/AlN). Next-generation high-density packaging applications would necessitate a new base substrate material to achieve ultra-fine pitch solder-joint reliability and multiple layers of fine-line wiring at low cost. The NEMI 2000 roadmap defines the need for 4-8 layers of 5-10 m wiring for future system boards. The 2003 ITRS roadmap calls for organic substrates with less than 100-m area-array pitch in the package or board by year 2010. Solder-joint reliability at such fine-pitch is a matter of concern for the industry. Use of underfills reduces thermal stresses but increases cost and, in addition, their dispensing becomes increasingly more complicated with the shorter gaps required for future interconnects. Therefore, there is a pronounced need to evaluate board materials with CTE close to that of Si for reliable flip-chip on board without underfill. Recently, a novel manufacturing process (using polymeric precursor) has been demonstrated to yield boards that have the advantages of organic boards in terms of large-area processability and machinability at potentially low-cost while retaining the high stiffness (~250 GPa) and Si-matched CTE (~2.5 ppm/㩠of ceramics. This work reports the evaluation of novel SiC-based ceramic composite board material for ultra-fine pitch solder-joint reliability without underfill and multilayer support. FE models were generated to model the behavior of flip-chips assembled without underfill and subjected to accelerated thermal cycling. These models were used to calculate solder-joint strains which have a strong direct influence on fatigue life of the solder. Multilayer structures were also simulated for thermal shock testing so as to assess via strains for microvia reliability. Via-pad misregistration was derived from the models and compared for different boards. Experiments were done to assemble flip-chips on boards without underfill followed by thermal shock testing so as to get the number of cycles to failure. To assess microvia reliability, 2 layer structures containing vias of different diameters were fabricated and subjected to thermal cycling. Via-pad misalignment was also studied experimentally. Modeling and experimental results were corroborated so as to evaluate thermomechanical suitability of C-SiC for high-density packaging requirements.
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Thambi, Joel Luther [Verfasser], Klaus-Dieter [Akademischer Betreuer] Lang, Klaus-Dieter [Gutachter] Lang, Ulrich [Gutachter] Tetzlaff, and Bernhard [Gutachter] Wunderle. "Reliability assessment of lead- free solder joint, based on high cycle fatigue & creep studies on bulk specimen / Joel Luther Thambi ; Gutachter: Klaus-Dieter Lang, Ulrich Tetzlaff, Bernhard Wunderle ; Betreuer: Klaus-Dieter Lang." Berlin : Technische Universität Berlin, 2018. http://d-nb.info/1162540451/34.

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Knipling, Keith Edward. "High-cycle fatigue / low-cycle fatigue interactions in Ti-6Al-4V." Thesis, Virginia Tech, 2002. http://hdl.handle.net/10919/41290.

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The largest single cause of failure in fan and compressor components in the cold frontal sections of commercial and military gas turbine engines has been attributed to high cycle fatigue (HCF). Additionally, both high-cycle fatigue (HCF) and lowcycle fatigue (LCF) loadings are widely recognized as unavoidable during operation of these components and because the classic Linear Damage Rule (LDR) neglects to account for the synergistic interaction between these damage contributors, dangerous over predictions of lifetime can result. Combined low-cycle fatigue / high-cycle fatigue (HCF/LCF) loadings were investigated in smooth Ti-6Al-4V. The specimens were subjected to a variable amplitude block loading history comprised of completely-reversed (R = -1) tensioncompression overloads followed by constant-amplitude zero-tension (R = 0) minor cycles. Axial specimens were excised from forgings representative of turbine engine fan blade forgings, and consisted of approximately 60% primary α in a matrix of lamellar α + β. Data are reported for smooth specimens of Ti-6Al-4V subjected to both constant amplitude and variable amplitude loadings. The axial specimens were prepared according to two distinct specimen conditions: low stress ground and longitudinallypolished (LSG+LP) and stress-relieved and chemically milled (SR+CM) conditions. Significantly longer lives were observed for the LSG+LP specimen condition under both constant and variable amplitude loading, due to the presence of a beneficial compressive surface residual stress. The presence of this residual stress was confirmed by x-ray diffraction, and its magnitude was of the order of 180 MPa (~20% of the yield stress). In either specimen condition, no appreciable effect of periodic overloads on the life of subsequent minor cycles was observed.
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Kazymyrovych, Vitaliy. "Very high cycle fatigue of high performance steels." Licentiate thesis, Karlstad University, Faculty of Technology and Science, 2008. http://urn.kb.se/resolve?urn=urn:nbn:se:kau:diva-3066.

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Many engineering components reach a finite fatigue life well above 109 load cycles. Some examples of such components are found in airplanes, automobiles or high speed trains. For some materials the fatigue failures have lately been found to occur well after 107 load cycles, namely in the Very High Cycle Fatigue (VHCF) range. This finding contradicted the established concept of fatigue limit for these materials, which postulates that having sustained 107 load cycles the material is capable of enduring an infinite number of cycles provided that the service conditions are unchanged. With the development of modern ultrasonic fatigue testing equipment it became possible to experimentally establish VHCF behaviour of various materials. For most of them the existence of the fatigue limit at 107 load cycles has been proved wrong and their fatigue strength continues to decrease with increasing number of load cycles.

 

One important group of materials used for the production of high performance components subjected to the VHCF is tool steels. This study explores the VHCF phenomenon using experimental data of ultrasonic fatigue testing of some tool steel grades. The causes and mechanisms of VHCF failures are investigated by means of high resolution scanning electron microscopy, and in relation to the existing theories of fatigue crack initiation and growth. The main type of VHCF origins in steels are slag inclusions.

However, other microstructural defects may also initiate fatigue failure. A particular attention is paid to the fatigue crack initiation, as it has been shown that in the VHCF range crack formation consumes the majority of the total fatigue life. Understanding the driving forces for the fatigue crack initiation is a key to improve properties of components used for very long service lives. Finite element modelling of VHCF testing was added as an additional perspective to the study by enabling calculation of local stresses at the fatigue initiating defects.

 

 

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Kazymyrovych, Vitaliy. "Very high cycle fatigue of tool steels." Doctoral thesis, Karlstads universitet, Avdelningen för maskin- och materialteknik, 2010. http://urn.kb.se/resolve?urn=urn:nbn:se:kau:diva-5877.

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An increasing number of engineering components are expected to have fatigue life in the range of 107 - 1010 load cycles. Some examples of such components are found in airplanes, automobiles and high speed trains. For many materials fatigue failures have lately been reported to occur well after 107 load cycles, namely in the Very High Cycle Fatigue (VHCF) range. This finding contradicts the established concept of a fatigue limit, which postulates that having sustained around 107 load cycles the material is capable of enduring an infinite number of cycles provided that the service conditions are unchanged. With the development of modern ultrasonic fatigue testing equipment it became possible to experimentally establish VHCF behaviour of various materials. For many of them the existence of the fatigue limit at 107 load cycles has been proved wrong and their fatigue strength continues to decrease with increasing number of load cycles. High performance steels is an important group of materials used for the components subjected to VHCF. This study explores the VHCF phenomenon using experimental data generated by ultrasonic fatigue testing of selected tool steels. The overall aim is to gain knowledge of VHCF behaviour of some common tool steel grades, while establishing a fundamental understanding of mechanisms for crack development in the very long life regime. The study demonstrates that VHCF cracks in tested steels initiate from microstructural defects like slag inclusions, large carbides or voids. It is established that VHCF life is almost exclusively spent during crack formation at below threshold stress intensity values which results in a unique for VHCF morphology on the fracture surface. Significant attention is devoted in the thesis to the ultrasonic fatigue testing technique, i.e. the validity and applicability of its results. FEM is employed to give an additional perspective to the study. It was used to calculate local stresses at fatigue initiating defects; examine the effect of material damping on ultrasonic stresses; and to evaluate various specimen geometries with respect to resulting stress gradient and maximum stressed material volume.
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Berchem, Klaus Herbert Hans. "High cycle fatigue and corrosion fatigue performance of two car body steels." Thesis, Imperial College London, 2005. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.414711.

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Hall, Rodney H. F. "Crack growth under combined high and low cycle fatigue." Thesis, University of Portsmouth, 1991. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.290404.

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Suresh, Shyam. "Topology Optimization for Additive Manufacturing Involving High-Cycle Fatigue." Licentiate thesis, Linköpings universitet, Mekanik och hållfasthetslära, 2020. http://urn.kb.se/resolve?urn=urn:nbn:se:liu:diva-165503.

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Additive Manufacturing (AM) is gaining popularity in aerospace and automotive industries. This is a versatile manufacturing process, where highly complex structures are fabricated and together with topology optimization, a powerful design tool, it shares the property of providing a very large freedom in geometrical form. The main focus of this work is to introduce new developments of Topology Optimization (TO) for metal AM. The thesis consists of two parts. The first part introduces background and theory, where TO and adjoint sensitivity analysis are described. Furthermore, methodology used to identify surface layer and high-cycle fatigue are introduced. In the second part, three papers are appended, where the first paper presents the treatment of surface layer effects, while the second and third papers provide high-cycle fatigue constraint formulations. In Paper I, a TO method is introduced to account for surface layer effects, where different material properties are assigned to bulk and surface regions. In metal AM, the fabricated components in as-built surface conditions significantly affect mechanical properties, particularly fatigue properties. Furthermore, the components are generally in-homogeneous and have different microstructures in bulk regions compared to surface regions. We implement two density filters to account for surface effects, where the width of the surface layer is controlled by the second filter radius. 2-D and 3-D numerical examples are treated, where the structural stiffness is maximized for a limited mass. For Papers II and III, a high-cycle fatigue constraint is implemented in TO. A continuous-time approach is used to predict fatigue-damage. The model uses a moving endurance surface and the development of damage occurs only if the stress state lies outside the endurance surface. The model is applicable not only for isotropic materials (Paper II) but also for transversely isotropic material properties (Paper III). It is capable of handling arbitrary load histories, including non-proportional loads. The anisotropic model is applicable for additive manufacturing processes, where transverse isotropic properties are manifested not only in constitutive elastic response but also in fatigue properties. Two optimization problems are solved: In the first problem the structural mass is minimized subject to a fatigue constraint while the second problem deals with stiffness maximization subjected to a fatigue constraint and mass constraint. Several numerical examples are tested with arbitrary load histories.
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Books on the topic "High cycle fatigue solder"

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Van, Ky Dang, and Ioannis Vassileiou Papadopoulos, eds. High-Cycle Metal Fatigue. Vienna: Springer Vienna, 1999. http://dx.doi.org/10.1007/978-3-7091-2474-1.

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Herda, D. A. A comparison of high cycle fatigue methodologies. [Marshall Space Flight Center, Ala.]: National Aeronautics and Space Administration, George C. Marshall Space Flight Center, 1992.

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Hall, Rodney H. F. Crack growth under combined high and low cycle fatigue. Portsmouth: Portsmouth Polytechnic, School of Systems Engineering, 1991.

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Kolenda, Janusz. Analytical procedures of high-cycle fatigue assessment of structural steel elements. Gdańsk: Technical University of Gdańsk, 1997.

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Taghani, Nourberdi. Crack growth in gas turbine alloys due to high cycle fatigue. Portsmouth: Portsmouth Polytechnic, Dept. of Mechanical Engineering, 1989.

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Berkovits, Avraham. Estimation of high temperature low cycle fatigue on the basis of inelastic strain and strainrate. [Washington, DC] : National Aeronautics and Space Administration: For sale by the National Technical Information Service, 1986.

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Kensche, Christoph W. High cycle fatigue of glass fibre reinforced epoxy materials for wind turbines. Köln: Deutsche Forschungsanstalt für Luft- Und Raumfahrt, 1992.

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Rosenberg, T. D. A compilation of fatigue test results for welded joints subjected to high stress/low cycle conditions: Stage 1. London: HMSO, 1991.

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Zhu, Dongming. Influence of high cycle thermal loads on thermal fatigue behavior of thick thermal barrier coatings. Washington, D.C: National Aeronautics and Space Administration, 1997.

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High Cycle Fatigue. Elsevier, 2006. http://dx.doi.org/10.1016/b978-0-08-044691-2.x5000-0.

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Book chapters on the topic "High cycle fatigue solder"

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Solomon, Harvey D. "Predicting Thermal and Mechanical Fatigue Lives from Isothermal Low Cycle Data." In Solder Joint Reliability, 406–54. Boston, MA: Springer US, 1991. http://dx.doi.org/10.1007/978-1-4615-3910-0_14.

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Zimmermann, Martina. "Very High Cycle Fatigue." In Handbook of Mechanics of Materials, 1879–916. Singapore: Springer Singapore, 2019. http://dx.doi.org/10.1007/978-981-10-6884-3_43.

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Zimmermann, Martina. "Very High Cycle Fatigue." In Handbook of Mechanics of Materials, 1–38. Singapore: Springer Singapore, 2017. http://dx.doi.org/10.1007/978-981-10-6855-3_43-1.

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Sander, Manuela. "Very high cycle fatigue." In Sicherheit und Betriebsfestigkeit von Maschinen und Anlagen, 155–86. Berlin, Heidelberg: Springer Berlin Heidelberg, 2018. http://dx.doi.org/10.1007/978-3-662-54443-3_4.

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Davoli, P. "Principles of Current Methodologies in High-Cycle Fatigue Design of Metallic Structures." In High-Cycle Metal Fatigue, 1–56. Vienna: Springer Vienna, 1999. http://dx.doi.org/10.1007/978-3-7091-2474-1_1.

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Van, K. Dang. "Introduction to Fatigue Analysis in Mechanical Design by the Multiscale Approach." In High-Cycle Metal Fatigue, 57–88. Vienna: Springer Vienna, 1999. http://dx.doi.org/10.1007/978-3-7091-2474-1_2.

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Papadopoulos, I. V. "Multiaxial Fatigue Limit Criterion of Metals." In High-Cycle Metal Fatigue, 89–143. Vienna: Springer Vienna, 1999. http://dx.doi.org/10.1007/978-3-7091-2474-1_3.

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Bignonnet, A. "Fatigue Design in Automotive Industry." In High-Cycle Metal Fatigue, 145–67. Vienna: Springer Vienna, 1999. http://dx.doi.org/10.1007/978-3-7091-2474-1_4.

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Maitournam, H. "Finite Elements Applications." In High-Cycle Metal Fatigue, 169–87. Vienna: Springer Vienna, 1999. http://dx.doi.org/10.1007/978-3-7091-2474-1_5.

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Panoskaltsis, V. P. "Gradient Dependent Fatigue Limit Criterion." In High-Cycle Metal Fatigue, 189–209. Vienna: Springer Vienna, 1999. http://dx.doi.org/10.1007/978-3-7091-2474-1_6.

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Conference papers on the topic "High cycle fatigue solder"

1

Lall, Pradeep, and Geeta Limaye. "High Cycle Fatigue Life-Prediction for Lead-Free Interconnects Under Simultaneous High Temperature and Vibration." In ASME 2013 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2013. http://dx.doi.org/10.1115/imece2013-66820.

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Current trends in the automotive industry warrant a variety of electronics for improved control, safety, efficiency and entertainment. Many of these electronic systems like engine control units, variable valve sensor, crankshaft-camshaft sensors are located under-hood. Electronics installed in under-hood applications are subjected simultaneously to mechanical vibrations and thermal loads. Typical failure modes caused by vibration induced high cycle fatigue include solder fatigue, copper trace or lead fracture. The solder interconnects accrue damage much faster when vibrated at elevated temperatures. Industry migration to lead-free solders has resulted in a proliferation of a wide variety of solder alloy compositions. Presently, the literature on mechanical behavior of lead-free alloys under simultaneous harsh environment of high-temperature vibration is sparse. In this paper, the reduction in stiffness of the PCB with temperature has been demonstrated by measuring the shift in natural frequencies. The test vehicle consisting of a variety of lead-free SAC305 daisy chain components including BGA, QFP, SOP and TSOPs has been tested to failure by subjecting it to two elevated temperatures and harmonic vibrations at the corresponding first natural frequency. The test matrix includes three test temperatures of 25C, 75C and 125C and simple harmonic vibration amplitude of 10G which are values typical in automotive testing. PCB deflection has been shown to increase with increase in temperature. The full field strain has been extracted using high speed cameras operating at 100,000 fps in conjunction with digital image correlation. Material properties of the PCB at test temperatures have been measured using tensile tests and dynamic mechanical analysis. FE simulation using global-local finite element models is thus correlated with the system characteristics such as modal shapes, natural frequencies and displacement amplitudes for every temperature. The solder level stresses have been extracted from the sub-models. Stress amplitude versus cycles to failure curves are obtained at all the three test temperatures. A comparison of failure modes for different surface mount packages at elevated test temperatures and vibration has been presented in this study.
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Di Maio, D., C. Murdoch, O. Thomas, and C. Hunt. "The degradation of solder joints under high current density and low-cycle fatigue." In Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE, 2010. http://dx.doi.org/10.1109/esime.2010.5464601.

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Andersson, C., Peng Sun, and J. Liu. "Low cycle fatigue of Sn-based lead-free solder joints and the analysis of fatigue life prediction uncertainty." In Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. IEEE, 2006. http://dx.doi.org/10.1109/hdp.2006.1707606.

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4

Lall, Pradeep, and Geeta Limaye. "A Methodology for High Cycle Fatigue Characterization of Lead-Free Interconnects Under Simultaneous Harsh Environments of High Temperature and Vibration." In ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. American Society of Mechanical Engineers, 2013. http://dx.doi.org/10.1115/ipack2013-73245.

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Current trends in the automotive industry warrant a variety of electronics for improved control, safety, efficiency and entertainment. Many of these electronic systems like engine control units, variable valve sensor, crankshaft-camshaft sensors are located under-hood. Electronics installed in under-hood applications are subjected simultaneously to mechanical vibrations and thermal loads. Typical failure modes caused by vibration induced high cycle fatigue include solder fatigue, copper trace or lead fracture. The solder interconnects accrue damage much faster when vibrated at elevated temperatures. Industry migration to lead-free solders has resulted in a proliferation of a wide variety of solder alloy compositions. Presently, the literature on mechanical behavior of lead-free alloys under simultaneous harsh environment of high-temperature vibration is sparse. In this paper, the reduction in stiffness of the PCB with temperature has been demonstrated by measuring the shift in natural frequencies. The test vehicle consisting of a variety of lead-free SAC305 daisy chain components including BGA, QFP, SOP and TSOPs has been tested to failure by subjecting it to two elevated temperatures and harmonic vibrations at the corresponding first natural frequency. The test matrix includes three test temperatures of 25C, 75C and 125C and simple harmonic vibration amplitude of 10G which are values typical in automotive testing. PCB deflection has been shown to increase with increase in temperature. The full field strain has been extracted using high speed cameras operating at 100,000 fps in conjunction with digital image correlation. Material properties of the PCB at test temperatures have been measured using tensile tests and dynamic mechanical analysis. FE simulation using global-local finite element models is thus correlated with the system characteristics such as modal shapes, natural frequencies and displacement amplitudes for every temperature. The solder level stresses have been extracted from the sub-models. Stress amplitude versus cycles to failure curves are obtained at all the three test temperatures. A comparison of failure modes for different surface mount packages at elevated test temperatures and vibration has been presented in this study.
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Kontani, Hiroyuki, Yoshiharu Kariya, and Tomoya Fumikura. "Microstructural Analysis of Low-Cycle Fatigue Damage Process of Sn-Ag-Cu Solder Joint." In ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. American Society of Mechanical Engineers, 2013. http://dx.doi.org/10.1115/ipack2013-73192.

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In this study, the relationship between microstructural change and fracture in the process of low-cycle fatigue of Sn-Ag-Cu solder joint was investigated using the solder ball of 630μm and 100μm in diameter by analysis of crystallographic orientation by means of EBSD. The 630μm specimen has subgrain boundaries formed by dynamic recovery in the stress concentration region, and the subgrain boundaries become high-angle random grain boundaries by additional cycles. The fatigue crack stably propagates along the random grain boundary in the stress concentration region. In contrast, the 100μm specimen has subgrain boundaries and high-angle random grain boundaries formed across the entire joint area. Since the occurrence of grain boundary fracture across the entire joint area by the connection of high energy grain boundaries, the crack propagation life of the 100μm specimen shortens without the stable crack growth compared to the 630μm specimen.
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Lin, Heng Cheng, Chieh Kung, and Rong Shen Chen. "Taguchi Robust Analysis of Fatigue of Lead-Free Sn3.5Ag Solders." In ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference. ASMEDC, 2007. http://dx.doi.org/10.1115/ipack2007-33597.

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This paper presents a study of the effects of selected geometry features on the fatigue life of the Sn3.5Ag lead-free solder ball on a multi-chip module (MCM) package. The features considered are both the upper and lower solder pad radii, the thickness of the substrate and that of the PC board. The components constituting the MCM include a heat spreader, thermal adhesive, chips, an underfill/Sn3.5Ag lead-free solder bumps mixture, structural adhesive, a substrate, a PC board, and Sn3.5Ag lead-free solder balls. To account for the time- and temperature-dependent behavior of the lead-free solders, a multi-linear isotropic hardening rule and a creep constitutive relation are considered. Linear elastic models are assumed for the rest components. In this study, the Surface Evolver is employed to determine the shape, including the height and pad radii, of the solder ball. A sliced 3D model is proposed using the finite element method to demonstrate the structural responses of the package subjected to ten temperature cycles between the high dwell temperature of 125°C and the low of −40°C. The structural responses of interest are deformation, stress distribution, and strain range of the solder ball having the greatest distance from the neutral point (DNP). A modified Coffin-Manson fatigue model is adopted to calculate the fatigue life cycle for the solders. In the course of the study, a parametric analysis is firstly conducted to characterize the influence of the geometry features on the fatigue life of the solders. An analysis of variation based on the Taguchi robust method is then exploited to investigate the optimal design for the fatigue life of the solders. Our results show that due to the mismatch of the coefficients of thermal expansion of the components, local deformations that do not comply with the global deformation are realized. Both the upper and lower pad radii have an opposite effect on the fatigue life of the solders. The fatigue life of the solders decreases as the thickness of the substrate or the PC board increases. The results using the Taguchi method reveal that among the four selected geometry features, both the upper pad radius and the PC board thickness are the most dominating factors. An optimal combination of the four features is recommended. This combination of the four features yields a fatigue life of 843 cycles that is a gain of 7.88 times of that of a reference package model.
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Maniar, Youssef, Georg Konstantin, Alexander Kabakchiev, Peter Binkele, and Siegfried Schmauder. "Experimental Investigation of Temperature and Mean Stress Effects on High Cycle Fatigue Behavior of SnAgCu-Solder Alloy." In 2018 IEEE 68th Electronic Components and Technology Conference (ECTC). IEEE, 2018. http://dx.doi.org/10.1109/ectc.2018.00249.

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Schoeller, Harry, Shubhra Bansal, Aaron Knobloch, David Shaddock, and Junghyun Cho. "Constitutive Relations of High Temperature Solders." In ASME 2007 International Mechanical Engineering Congress and Exposition. ASMEDC, 2007. http://dx.doi.org/10.1115/imece2007-42215.

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This study focuses on microelectronic package design for the oil and natural gas drilling of wells with depths in excess of 20,000 ft, where package temperatures can exceed 204°C. At these high temperatures, solder interconnect sites are subject to fatigue and creep failures due to the stress generated by the thermal expansion mismatch between various components in the package. Typically this phenomenon is modeled by finite element analysis (FEA) to predict the number of cycles to failure. To ensure meaningful model results, however, accurate time and temperature-dependent mechanical properties are needed. This study examines five solders suitable for high temperature: 90Pb-10Sn, 95Sn-5Sb, 92.5Pb-5Sn-2.5Ag, 95Pb-5In, and 93Pb-3Sn-2Ag-2In. Uniaxial tension tests of the solder wires are carried out on a MTS servohydraulic machine using wedge grips. To evaluate the time-dependence on deformation, a strain rate study was carried out at 0.5%/sec, 1%/sec, and 5%/sec. Nanoindentation of solder wire is performed and compared to the corresponding solder wires tested through uniaxial tension tests. Dynamic nanoindentation through continuous stiffness measurement is performed on the wires to obtain the indentation data less sensitive to creep of the material, as well as to assess the effect of indentation depth on elastic modulus for each solder. One purpose of nanoindentation testing is to determine its suitability for the mechanical testing of soft solders. Mechanical properties obtained from these tests will be used in future modeling studies to estimate the cyclic fatigue life of these solders under thermal loading.
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Sayama, Toshihiko, Hiroyuki Tsuritani, Yoshiyuki Okamoto, Masayoshi Kinoshita, and Takao Mori. "Evaluation of Fatigue Crack Initiation and Propagation in Thin Solder Joints Using a Lap-Joint Shear Specimen With High Stiffness Fixtures." In ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels. American Society of Mechanical Engineers, 2015. http://dx.doi.org/10.1115/ipack2015-48605.

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Fatigue damage in solder joints is one of the most significant factors in the failure of electronic components. Accordingly, many research studies on the fatigue lifetime evaluation of solder joints have been undertaken to improve the reliability of the components. The authors have devised a lap-joint specimen with high stiffness fixtures in order to carry out shear fatigue testing on thin solder joints, which have thickness of a few hundred μm and are manufactured via a reflow process similar to that used in actual printed circuit boards (PCBs). In this work, using the developed lap-joint specimen, the fatigue properties, including crack initiation and propagation of Sn-3.0Ag-0.5Cu solder joints were evaluated under low cycle shear loading conditions with creep deformation. The lap-joint specimen was fabricated by the reflow soldering of two copper adherend, and was assembled with high stiffness loading fixtures. The dimensions of the solder joint are 4 mm (length) × 2 mm (width), with a thickness ranging from 100 to 400 μm. In the shear fatigue test, under the assumption of thermal loading conditions of actual PCBs, the inelastic strain amplitude and total strain rate were set to from 0.5 to 1.2 % and 1×10−4 s−1, respectively. In addition, the fatigue crack initiation lifetime is defined as the number of cycles N20% at which the load amplitude has decreased by 20 % from the initial value. As the first study result, the experimental relations between the fatigue crack initiation lifetime and the inelastic strain range were obtained. Next, in order to apply the experimental data to the evaluation of fatigue crack initiation in actual solder joints via finite element analyses, the lifetime data were related to the calculated inelastic strain at the interface corners of the solder joint of the specimen, where fatigue cracks initiate due to strain concentration. Finally, assuming that the reduction of the load amplitude corresponds linearly to the fatigue crack length, the experimental relations between the fatigue crack propagation rate and J-integral range were also obtained. The experimental data are regarded to be valid, given a comparison to other crack propagation curves for solder obtained by tensile cyclic loading of a flat specimen with a center crack. Consequently, the developed lap-joint specimen with high rigidity is effective for acquiring the material properties regarding fatigue crack initiation and propagation in actual thin solder joints.
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Serebreni, Maxim, Patrick McCluskey, David Hillman, Nathan Blattau, and Craig Hillman. "Experimental and Numerical Investigation of Underfill Materials on Thermal Cycle Fatigue of Second Level Solder Interconnects Under Mean Temperature Conditions." In ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. American Society of Mechanical Engineers, 2018. http://dx.doi.org/10.1115/ipack2018-8338.

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With the larger size of Ball Grid Array (BGA) solder joints, the available volume for underfilling is significantly increased. Although the size of the solder joints and package dimension governs the volume of underfill material, the larger 2nd level solder interconnects are more susceptible to thermal fatigue with certain underfills and thermal profiles. In this study, BGA packages were underfilled with two dedicated underfill materials and two soft materials used as conformal coatings and encapsulants in electronic products. Each of the selected materials was subjected to two thermal profiles, one with low mean temperature and a second with a high mean temperature. The variation in mean cyclic temperature demonstrates the influence of temperature dependent behavior of each underfill material on the loads solder joints experience in a BGA package. Material characterization was performed on the package and underfill materials and incorporated into finite element models. The influence of underfill material glass transition temperature (Tg) was found to be a critical factor on fatigue endurance of solder interconnects. Fatigue crack orientation within solder joints were found to be aligned with axial (normal) direction for BGAs with high CTE underfill materials. Simulations determined the magnitude of axial loading associated with each underfill material properties responsible for reducing fatigue life. The results developed in this paper reveal the factors associated with reduced fatigue endurance of certain underfill materials under temperature profiles with mean temperature conditions and contribute to the development of new criteria of underfill material selection for 2nd level interconnects.
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Reports on the topic "High cycle fatigue solder"

1

Davidson, David L. Damage Mechanisms in High Cycle Fatigue. Fort Belvoir, VA: Defense Technical Information Center, January 1999. http://dx.doi.org/10.21236/ada359744.

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Gallagher, J. P., R. H. van Stone, R. E. deLaneuville, P. Gravett, and R. S. Bellows. Improved High-Cycle Fatigue (HCF) Life Prediction. Fort Belvoir, VA: Defense Technical Information Center, January 2001. http://dx.doi.org/10.21236/ada408467.

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Shockey, Donald A., Takao Kobayashi, Naoki Saito, Jean-Marie Aubry, and Alberto Grunbaum. Fractographic Analysis of High-Cycle Fatigue in Aircraft Engines. Fort Belvoir, VA: Defense Technical Information Center, January 2000. http://dx.doi.org/10.21236/ada386670.

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Bartsch, Thomas M. High Cycle Fatigue (HCF) Science and Technology Program, 2001 Annual Report. Fort Belvoir, VA: Defense Technical Information Center, May 2002. http://dx.doi.org/10.21236/ada408071.

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Feng, Jinwei, Ricardo Burdisso, Wing Ng, and Ted Rappaport. Turbine Engine Control Using MEMS for Reduction of High Cycle Fatigue. Fort Belvoir, VA: Defense Technical Information Center, March 2001. http://dx.doi.org/10.21236/ada387429.

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Lin, T. H. Development of a Micromechanic Theory of Crack Initiation Under High-Cycle Fatigue. Fort Belvoir, VA: Defense Technical Information Center, September 1999. http://dx.doi.org/10.21236/ada368833.

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Troiano, E., J. H. Underwood, D. Crayon, and R. T. Abbott. Low Cycle Notched Fatigue Behavior and Life Predictions of A723 High Strength Steels. Fort Belvoir, VA: Defense Technical Information Center, April 1995. http://dx.doi.org/10.21236/ada299469.

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Rogers, Lynn, I. R. Searle, R. Ikegami, R. W. Gordon, and D. Conley. Durability Patch: Application of Passive Damping to High Cycle Fatigue Cracking on Aircraft. Fort Belvoir, VA: Defense Technical Information Center, March 1997. http://dx.doi.org/10.21236/ada468821.

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Zha, Ge-Chenga, Ming-Ta Yang, and Fariba Fahroo. High Cycle Fatigue Prediction for Mistuned Bladed Disks with Fully Coupled Fluid-Structural Interaction. Fort Belvoir, VA: Defense Technical Information Center, June 2006. http://dx.doi.org/10.21236/ada452028.

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Powell, B. E., I. Henderson, and R. F. Hall. The Growth of Corner Cracks Under the Conjoint Action of High and Low Cycle Fatigue. Fort Belvoir, VA: Defense Technical Information Center, February 1988. http://dx.doi.org/10.21236/ada190510.

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