Journal articles: 'High cycle fatigue solder'

1

Barker, D., J. Vodzak, A. Dasgupta, and M. Pecht. "Combined Vibrational and Thermal Solder Joint Fatigue—A Generalized Strain Versus Life Approach." Journal of Electronic Packaging 112, no. 2 (June 1, 1990): 129–34. http://dx.doi.org/10.1115/1.2904353.

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The combined effects of elastic and inelastic strains on solder joint reliability are investigated. Experimental data from high-cycle fatigue tests of solder are combined with data from low-cycle fatigue tests to obtain a plot of total strain amplitude against cycles to failure. The generalized Coffin-Manson fatigue equation is used to describe this relationship. The transition fatigue life of approximately 7000 cycles indicates that elastic strains play a significant role in the fatigue damage of solders at a life of 103 cycles or higher. The results suggest that the commonly adopted approach of relating only inelastic strain, or the total strain, to fatigue life with a single power law relationship may be inadequate when predicting solder joint reliability. Instead, both elastic strains and plastic strains should be considered, especially when the electronic assembly is subjected to a combination of large amplitude thermal loads and relatively lower amplitude vibrational loads. A methodology is presented to evaluate the combined effects of simultaneous vibration and thermal cycling of solder joints. This combined loading situation is simulated by superposing the effects of the vibrational and thermal loads. The damage due to each load-type acting individually is determined and then superposed to assess the overall effective fatigue life of the joint. As a first order approximation, a linear superposition rule is utilized, Miner’s rule. Reliability predictions from this simple superposition model are then compared to standard low cycle thermal fatigue models.

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SAITO, Takahiro, Masahiro HATANAI, Osamu KAMIYA, Takehiko TAKAHASHI, and Susumu HIOKI. "High Cycle Fatigue Behavior of Pb-free Solder." Proceedings of Autumn Conference of Tohoku Branch 2004.40 (2004): 25–26. http://dx.doi.org/10.1299/jsmetohoku.2004.40.25.

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KOBAYASHI, Hiroyuki, Syungo SATAKE, Takashi KAWAKAMI, Takahiro KINOSHITA, Tetsuya KUGIMIYA, and Toshiyuki MORIBAYASHI. "PS51 High cycle fatigue strength of solder materials." Proceedings of the Materials and Mechanics Conference 2010 (2010): 160–62. http://dx.doi.org/10.1299/jsmemm.2010.160.

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Solomon, H. D. "Low Cycle Fatigue of Sn96 Solder With Reference to Eutectic Solder and a High Pb Solder." Journal of Electronic Packaging 113, no. 2 (June 1, 1991): 102–8. http://dx.doi.org/10.1115/1.2905374.

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This paper describes the 35°C and 150°C low cycle fatigue behavior of Sn96 solder (96.5 Sn/3.5 AG), the tin silver eutectic. There is a considerable amount of anecdotal information which says that this solder is superior to eutectic solder in its fatigue resistance. This study generally supports this assertion, but not for all plastic strain ranges. This solder has an excellent balance of strength, ductility and fatigue life under strain cycling. Furthermore, it is also shown that this solder is superior to a high Pb solder (92.5 Pb/2.5 Ag/5.0 Sn). The only drawback of the tin silver eutectic is that it has a higher melting point than the melting point for the Sn/Pb eutectic (221°C versus 183°C), and this requires a higher soldering temperature. This higher temperature necessitates some process alterations in order to use this solder.

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Qi, Fang Juan, Li Xing Huo, Ya Ping Ding, and Zhan Lai Ding. "Study on the Mechanical Bend Fatigue of Micro-Joining Soldered Joint with Lead-Free Solder." Key Engineering Materials 353-358 (September 2007): 2573–76. http://dx.doi.org/10.4028/www.scientific.net/kem.353-358.2573.

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In recent years, several electronics manufacturers have been working toward introducing lead-free solder and halogen-free print circuit boards (PCBs) into their products. The key drivers for the change in materials have been the impending environmental legislations, particularly in Europe and Japan as well as the market appeal of ‘green’ products. The reliability of the new materials is an important determinant of the pace of adoption. Fairly extensive mechanical fatigue reliability data is also available for micro-joining soldered joint such as Ball Grid Array (BGA) with tin-lead solder. However, similar data is not available for BGAs assembled with lead-free solder. Mechanical reliability is a critical indicator for phone and BGA survival during repeated keypress, and to some extent during drop. In this paper, the mechanical bend fatigue of BGAs with tin-lead and lead-free solders on halogen-free substrates are examined respectively. A tin-silver-copper alloy was used as lead-free solder due to its increasing acceptance, and the results were compared to those from samples assembled with Sn63Pb37 solder. The reliability was examined at both low cycle and high cycle fatigue. Results show that the mechanical bend fatigue reliability of BGA assemblies with lead-free solder is higher than that of BGA assembly with tin-lead solder. Cross section and failure analysis indicated two distinct failure modes - solder joint and PCB failure. A 3-D parametric finite element model was developed to correlate the local PCB strains and solder joint plastic strains with the fatigue life of the assembly. The intermetallic compoumd (IMC) of micro-joining joint interface was analysised in the future in order to study on the effect of IMC on the reliability.

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Barry, N., I. P. Jones, T. Hirst, I. M. Fox, and J. Robins. "High‐cycle fatigue testing of Pb‐free solder joints." Soldering & Surface Mount Technology 19, no. 2 (April 17, 2007): 29–38. http://dx.doi.org/10.1108/09540910710836511.

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7

Stone, D. S. "The Creep-Fatigue Interaction in Solders and Solder Joints." Journal of Electronic Packaging 112, no. 2 (June 1, 1990): 100–103. http://dx.doi.org/10.1115/1.2904348.

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Two models are proposed for relating the metallurgy of the solder to the growth of fatigue cracks through solder joints. These models illustrate how different aspects of the creep behavior can contribute to the so-called “creep-fatigue interaction”. The first model treats fatigue crack growth through the solder, far from the interface between solder and substrate. Either an intragranular or intergranular path may be taken depending upon conditions of loading. Intragranular fatigue dominates when the cycle frequency is high, in which case failure life is governed by the Coffin-Manson law. Intergranular failure occurs at low frequencies because grain boundary sliding at low frequencies allows the grain boundaries to become exposed to the atmosphere, which in turn causes oxidation. This model predicts the effects of frequency, strain amplitude, and grain size on fatigue life. In the second model, the fatigue crack travels within the interface region between solder and substrate. Here, the strain introduced in the solder joint during fatigue is not relevant; instead, the stress transferred to the interface is more important. The second model considers the effect of solid solution concentration on fatigue life. The predictions of both models agree reasonably well with published fatigue data from solders and solder joints.

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Ross, R. G. "A Systems Approach to Solder Joint Fatigue in Spacecraft Electronic Packaging." Journal of Electronic Packaging 113, no. 2 (June 1, 1991): 121–28. http://dx.doi.org/10.1115/1.2905377.

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Differential expansion induced fatigue resulting from temperature cycling is a leading cause of solder joint failures in spacecraft. Achieving high reliability flight hardware requires that each element of the fatigue issue be addressed carefully. This includes defining the complete thermal-cycle environment to be experienced by the hardware, developing electronic packaging concepts that are consistent with the defined environments, and validating the completed designs with a thorough qualification and acceptance test program. This paper describes a useful systems approach to solder fatigue based principally on the fundamental log-strain versus log-cycles-to-failure behavior of fatigue. This fundamental behavior has been useful to integrate diverse ground test and flight operational thermal-cycle environments into a unified electronics design approach. Each element of the approach reflects both the mechanism physics that control solder fatigue, as well as the practical realities of the hardware build, test, delivery, and application cycle.

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Ekpu, M., R. Bhatti, M. I. Okereke, and K. C. Otiaba. "Fatigue life analysis of Sn96.5Ag3.0Cu0.5 solder thermal interface material of a chip-heat sink assembly in microelectronic applications." International Symposium on Microelectronics 2013, no. 1 (January 1, 2013): 000473–77. http://dx.doi.org/10.4071/isom-2013-wa23.

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The reliability of microelectronic devices during operation has been a major challenge in recent years. Microelectronics devices will fail if one or more components do not function properly. Thermal interface materials are more likely to fail because of the role they play in heat management. Lead free solders such as SAC305 solder (Sn96.5Ag3.0Cu0.5) have become the thermal materials of interest because of their high thermal conductivity and government legislations on the ban of lead. Ansys finite element software was used for the design and analysis of the microelectronic device studied. The bond line thicknesses of the SAC305 solder thermal interface material were varied from 0.035 mm to 0.175 mm and a thermal load was applied using commercial thermal cycle profile of −40°C to 80°C. The results obtained showed that stresses and strains reduce as the lead free solder thickness increases. The number of cycles to failure and plastic work density increased as the SAC305 solder thickness is increased. This research showed that an increase in SAC305 solder thickness will improve thermal conduction and reliability. However, the solder thickness is limited to the gap between the chip-heat sink surfaces in contact.

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10

Haiyu Qi, Qian Zhang, E. C. Tinsley, M. Osterman, and M. G. Pecht. "High Cycle Cyclic Torsion Fatigue of PBGA Pb-Free Solder Joints." IEEE Transactions on Components and Packaging Technologies 31, no. 2 (June 2008): 309–14. http://dx.doi.org/10.1109/tcapt.2007.898337.

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11

Basaran, C., and R. Chandaroy. "Nonlinear Dynamic Analysis of Surface Mount Interconnects: Part I—Theory." Journal of Electronic Packaging 121, no. 1 (March 1, 1999): 8–11. http://dx.doi.org/10.1115/1.2792663.

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Solder joints are commonly used in surface mount technology microelectronics packaging. It is well known that the dominant failure mode for solder joints is thermal fatigue. When semiconductor devices are used in a vibrating environment, such as in automotive and military applications, dynamic stresses contribute to the failure mechanism and in certain circumstances they can become the dominant failure cause. In this paper a unified constitutive model for Pb40/Sn60 solder joints is developed and then implemented in a finite element dynamic analysis procedure. The purpose of the material model and the implementation is to study the contribution of vibration induced strains to the fatigue life of solder interconnects in low cycle and high cycle fatigue. The proposed material model, which is based on the disturbed state concept (DSC), is used for a dynamic analysis of a solder joint in the following paper, Part II, Basaran and Chandaroy (1998).

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Dudek, Rainer, Peter Sommer, Andreas Fix, Joerg Trodler, Sven Rzepka, and Bernd Michel. "Reliability investigations for high temperature interconnects." Soldering & Surface Mount Technology 26, no. 1 (January 28, 2014): 27–36. http://dx.doi.org/10.1108/ssmt-10-2013-0030.

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Purpose – Because of the need for electronics use at temperatures beyond 150°C, high temperature resistant interconnection technologies like transient liquid phase (TLP) soldering and silver sintering are being developed which are not only replacements of high-lead solders, but also open new opportunities in terms of temperature resistance and reliability. The paper aims to address the thermo-mechanical reliability issues that have to be considered if the new interconnection technologies will be applied. Design/methodology/approach – A TLP soldering technique is briefly introduced and new challenges concerning the thermo-mechanical reliability of power devices are worked out by numerical analysis (finite element simulation). They arise as the material properties of the interconnect materials differ substantially from those known for soft solders. The effective material responses of the new materials are determined by localized unit cell models that capture the inhomogeneous structure of the materials. Findings – It is shown that both the TLP solder layer and the Ag-sinter layer have much less ductility and show less creep than conventional soft solders. The potential failure modes of an assembly made by TLP soldering or Ag sintering change. In particular, the characteristic low cycle fatigue solder failures become unlikely and are replaced either by metallization fatigue, brittle failure of intermetallic compound, components, or interfaces. Originality/value – A variety of new failure risks, which have been analyzed theoretically, can be avoided only if they are known to the potential user of the new techniques. It is shown that an optimal reliability will be strongly dependent on the actual assembly design.

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13

Nir, N., T. D. Dudderar, C. C. Wong, and A. R. Storm. "Fatigue Properties of Microelectronics Solder Joints." Journal of Electronic Packaging 113, no. 2 (June 1, 1991): 92–101. http://dx.doi.org/10.1115/1.2905390.

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Low cycle fatigue studies of solder joints designed and fabricated to represent generic interconnection structures typical of what might be used in packaging microelectronics have been carried out to assist in the development of a better understanding of the fundamental mechanical properties that determine the reliability of such structures. These studies involve micro scale joints (micro-joints) of both eutectic and 95/5 Pb/Sn solders fabricated by several different processes. In addition to a discussion of the results of recent tests reflecting specified loss-of-strength failure criteria and extensive post-test failure mode analysis of, primarily, 95/5 Pb/Sn micro-joints, descriptions of (1) the design and fabrication of the custom shear test vehicles and (2) the high-resolution electro-mechanical loading system used to apply cyclic loadings under isothermal conditions will be presented. This computer controlled system provides for the application of fully or partially reversed shear strains (with or without dwells) to either prototypes or custom test vehicles, and can be operated to maintain either total or plastic strain control during cycling.

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Kotas, Agnieszka Betzwar, Golta Khatibi, Farzad Khodabakhshi, and Andreas Steiger-Thrisfeld. "High Cycle Fatigue Behaviour of Cu/Sn Intermetallic Compounds Prepared by Transient Liquid Phase Bonding Process." Materials Science Forum 1016 (January 2021): 268–73. http://dx.doi.org/10.4028/www.scientific.net/msf.1016.268.

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Transient liquid phase (TLP) bonds using Cu-Sn system have been suggested as high strength and temperature resistant joints for power electronics applications. While the physical and mechanical properties of these joints has been investigated to some extent, studies on fatigue properties and long term reliability of TLP joints are scarce. In this work TLP bonding was performed to produce thin Cu-Sn intermetallic joints by using Cu and 97Sn3Cu solder alloy as interlayer. Different processing conditions resulted in three types of thin joints consisting of three phases (Cu3Sn/Cu6Sn5/solder remnants), two phases (Cu3Sn/Cu6Sn5) and a single phase (Cu3Sn) with an overall thickness of ≤ 20 μm. The shear strength of the TLP joint containing one or two high melting point IMC layers showed a significant temperature resistance up to 200°C. Fatigue studies of TLP joints were conducted by using a 3-point-cyclic bending test system operating at 20 kHz. The highest fatigue resistance was obtained for the single-phase Cu3Sn joints with superior shear and flexural resistance. The two phase joints (Cu3Sn/Cu6Sn5) showed a slightly lower lifetime than the three phase system containing IMCs and residual solder. Fracture surfaces analysis in correlation with static and cyclic mechanical properties, provided insight into the failure mechanism of the Cu-Sn TLP joints.

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15

Guo, Q., E. C. Cutiongco, L. M. Keer, and M. E. Fine. "Thermomechanical Fatigue Life Prediction of 63Sn/37Pb Solder." Journal of Electronic Packaging 114, no. 2 (June 1, 1992): 145–51. http://dx.doi.org/10.1115/1.2906411.

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Isothermal and thermomechanical fatigue of 63Sn/37Pb solder is studied under total strain-controlled tests. A standard definition of failure is proposed to allow inter-laboratory comparison. Based on the suggested failure criterion, load drop per cycle, the Young’s modulus and the ratio of the maximum tensile to maximum compressive stresses remain constant, and the fatigue response of the solder is stable before failure, although cyclic softening was observed from the beginning. Experimental results of isothermal fatigue tests for a total strain range from 0.3 to 3 percent show that the log-log plot of the number of cycles to failure versus the plastic strain range has a kink at the point where the elastic strain is approximately equal to the plastic strain. In this paper, it is shown how the isothermal fatigue life of near-eutectic solder at lower strain ranges can be predicted by using the experimental data of fatigue tests at high strain ranges and early stage information of a fatigue test at the strain range in question. A thermomechanical fatigue life prediction is also given based on a dislocation pile-up model. Comparison with experimental results shows a good agreement.

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Basaran, C., and R. Chandaroy. "Nonlinear Dynamic Analysis of Surface Mount Interconnects: Part II—Applications." Journal of Electronic Packaging 121, no. 1 (March 1, 1999): 12–17. http://dx.doi.org/10.1115/1.2792654.

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Using the unified constitutive model and the finite element procedure presented in Part I (the preceding paper), a material nonlinear time domain dynamic analysis of a solder joint was studied for low cycle and high cycle fatigue. Thermal effects were not included in order to understand the dynamic behavior of a Pb40/Sn60 solder joint without noise-effects from thermal behavior. The latter decision was a result of observations reported in Steinberg (1988), that having in-phase or out-of-phase thermal loading in conjunction with vibrations makes a significant difference in the fatigue life. The study of fatigue under concurrent loading will be the subject of another paper.

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Kobayashi, Kyosuke, Ikuo Shohji, and Hiroaki Hokazono. "Tensile and Fatigue Properties of Miniature Size Specimens of Sn-5Sb Lead-Free Solder." Materials Science Forum 879 (November 2016): 2377–82. http://dx.doi.org/10.4028/www.scientific.net/msf.879.2377.

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Tensile and low cycle fatigue properties of Sn-5Sb (mass%) solder were investigated with miniature size tensile specimens. The effect of temperature and strain rate on tensile properties and the effect of temperature on low cycle fatigue properties were examined. Tensile strength increases with increasing strain rate regardless of temperature investigated. For elongation, the effect of temperature on it is negligible although it slightly increases with increasing strain rate. The low cycle fatigue life of Sn-5Sb obeys by the Manson-Coffin’s equation. The effect of temperature on the fatigue life is negligible in the temperature range from 25 oC to 150 oC. In the low cycle fatigue test with a high total strain range of 4%, cracking at phase boundary mainly occurs regardless of temperature investigated. In the case of a low total strain range of 0.4%, ductile fracture mainly occurs, and cracking at phase boundary with generation of grooves also occurs at high temperature.

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FUMIKURA, Tomoya, Takahiro OMORI, and Yoshiki ENDO. "Low-Cycle and High-Cycle Fatigue Properties by Strain Control of Sn-Ag-Cu Solder Alloy." Proceedings of the Materials and Mechanics Conference 2018 (2018): OS0812. http://dx.doi.org/10.1299/jsmemm.2018.os0812.

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Bhatkal, Ravi M., Ranjit Pandher, Anna Lifton, Paul Koep, and Hafez Raeisi Fard. "Evaluating Thermal Cycling Fatigue Resistance for LED Chip-on-Board Applications." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, DPC (January 1, 2012): 000706–37. http://dx.doi.org/10.4071/2012dpc-ta43.

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LED chip-on-board applications typically involve assembling an LED die stack directly on to a high thermal conductivity substrate such as a Metal Core PCB. If solder is used for die-substrate attach for such chip-on-board applications, one needs to consider the CTE mismatch between the die stack and the MCPCB and its impact on thermal cycle-induced creep fatigue of the solder material. This paper presents a methodology to compare relative performance of different solder materials with varying thermo-mechanical properties, and compare the impact of CTE mismatch and temperature swings on transient thermal properties and relative reliability of the solder attach materials. Implications for LED chip-on-board applications are discussed.

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Zhu, Hong Lai, Lin Weng, Yao Can, and Yong Li. "Fatigue Life Prediction of Electronic Chips Based on Singular Edge Field." Applied Mechanics and Materials 390 (August 2013): 601–5. http://dx.doi.org/10.4028/www.scientific.net/amm.390.601.

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Due to the initiate failure from the interface of solder and singularity of stress and strain field in the area, new fatigue life laws based on equivalent intensity ranges are proposed. The thermal fatigue tests are carried out. With observation by scanning electron microscope (SEM), the cracks begin from the interface of the chip, and propagate along the interface and/or grow with zigzag shape in the solder. Relative tube voltage drop (TVD) as a parameter is conducted to determine the fatigue damage accumulation and the number of thermal cycles for initiate crack growth. The singular field from the interface edge of the chip is obtained from numerical analyses by sub-modeling technique. Two types of solder materials of Sn-3Ag-0.5Cu and Pb-5Sn with new viscous creep constitutive relationship are used. The constitutive model compose of linear curve for small stress and hyperbolic sine form for high stress, respectively. Two shocks are found in one cycle from numerical simulation. Compared the fatigue life from the experiment observation with the numerical prediction, it is noticed that the new fatigue laws do not depend on an artificial point near the interface edge in a chip, and give reasonable and reliable results.

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Marinis, Thomas F., and Joseph W. Soucy. "Design of BGA Assemblies with Enhanced Thermal Cycle Capability Using Solder Coated Polymer Balls." International Symposium on Microelectronics 2016, no. 1 (October 1, 2016): 000123–33. http://dx.doi.org/10.4071/isom-2016-tp55.

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Abstract Solder coated polymer balls have been successfully employed for attaching packages to circuit boards with minimum standoff height, while accommodating large mismatches in thermal expansion coefficients. Dramatic improvements in temperature cycling performance are often realized by using them in place of solid solder balls, with five-fold increases in mean cycles to failure reported by a number of investigators. The sales literature, provided by suppliers of solder coated solder balls, attribute this superior temperature cycling performance to the soft, compliant polymer core of the product. Our study of the mechanics of solder coated polymer balls has revealed that their stiffness is in fact comparable to that of solid solder balls. Their rigidity results from a composite construction in which a nearly incompressible polymer material is surrounded by a copper shell that is not easily deformed from its spherical shape. We have employed finite element analysis and mechanical measurements to obtain load versus deflection curves for both normal compression and shear displacements of solder coated polymer ball connections. The enhanced temperature cycling performance of solder coated polymer ball connections is also derived from their composite construction. A cross-section through one reveals that near the solder pads, the ratio of copper to polymer is quite high, and consequently so is its resistance to shear. At the mid-plane of the connection, the ratio of copper to polymer is low, which minimizes its shear resistance. Thus, when a solder coated polymer ball connection is subjected to a shear load, as in temperature cycling, most of its deformation occurs around its mid-section. By contrast, when a solid solder ball is subjected to a shear load, most of its deformation occurs near its attachment pads, where its cross-sectional area and hence its stiffness are minimal. In either type of attachment, failure occurs when sufficient plastic strain damage accumulates in the solder to initiate a fracture. By distributing its shear strain over its midsection, a solder coated polymer ball minimizes plastic strain in its solder, where as a solder ball concentrates it near its bond pads. We have used finite element analysis to compute the cumulative plastic strain in various solder coated polymer ball assemblies subjected to cyclic shear loading induced by thermal excursions. By combining these results with an Engelmaier solder fatigue model, we predicted mean number of temperature cycles to failure of the solder connections. Our results compare favorably with published experimental data from temperature cycle tests. We have employed this analysis technique to examine how fatigue life is impacted by various connection parameters such as package size, stand-off height and solder composition, as well as those specific to solder coated polymer balls, which include size and mechanical properties of the core and ratios of solder and copper thicknesses to core diameter. Our overall objective is to enable design of complex stacked assemblies of multichip modules that meet customer reliability requirements for various use environments.

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Fekih, Lassaad Ben, Georges Kouroussis, and Olivier Verlinden. "Spectral-Based Fatigue Assessment of Ball Grid Arrays under Aerospace Vibratory Environment." Key Engineering Materials 569-570 (July 2013): 425–32. http://dx.doi.org/10.4028/www.scientific.net/kem.569-570.425.

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Ball grid arrays (BGAs) embedded in aerospace devices should satisfy strict standards in the purpose to ensure their mechanical safety, particularly in fatigue. In fact, critical phases of BGAs service life such as launch lead to high cycle fatigue (HCF) failure due to severe random accelerations.To face this problem, designers are still using experimental qualifications based on deterministic time-domain fatigue methods. This work is motivated principally to study the applicability of the principal spectral fatigue models as cost effective alternative to assess BGA HCF. The study includes an assembly made up of a BGA chip and a support board. Finite element spectrum analysis brings out that the fatigue failure is expected to occur at different interconnect locations like for instance a critical solder joint made of a ductile tin-lead alloy. Among all the studied spectral models, it emerges that the Dirlik’s fatigue prediction is the most relevant in the typical range of the solder fatigue coefficients.

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Wong, T. E., L. A. Kachatorian, and H. M. Cohen. "J-Lead Solder Joint Thermal Fatigue Life Model." Journal of Electronic Packaging 121, no. 3 (September 1, 1999): 186–90. http://dx.doi.org/10.1115/1.2792682.

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A thermal fatigue life prediction model of J-lead solder joint assembly has been developed. This model is evolved from an empirically derived formula based on modified Manson-Coffin fatigue life Prediction theory. To estimate solder joint fatigue life, nonlinear finite element analysis (FEA) was conducted using the ABAQUS™ computer code. The analysis results show that cracks are initiated and propagated from both the heel and the toe of the solder joint toward the center portion of the joint. This condition results in the solder joint fatigue life degradation and is included in the model development. The fatigue life prediction model is then calibrated to life cycling test results, which were provided by Jet Propulsion Laboratory (JPL/NASA). The developed life prediction model, combined with the nonelastic strains derived from FEA and Miner’s cumulative damage law, was used to predict the cumulative damage index of the solder joint under NASA’s thermal cycling environment (between −55°C and 100°C). The analysis results indicate that this solder joint has a 50 percent failure probability when the solder joint is exposed up to 5206 thermal cycles. To shorten the test time, a modified thermal cycling profile was proposed. This profile is the same as the NASA thermal cycling environment except using the high end of the dwell temperature at 125°C. The analysis results show that a 50 percent failure probability of the solder joint would occur after the solder joint is exposed to 3500 cycles of the NASA thermal environment and followed by 1063 cycles of the modified thermal profile. In conclusion, the developed life prediction model is recommended to serve as an effective tool to integrate the process of design selection, quality inspection, and qualification testing in a concurrent engineering process. It is also recommended to conduct a micro-section in the solder joint to verify the solder crack paths and further validate the life prediction model. When additional thermal cycles have been added into the test specimens, recalibrating this model by test is also recommended.

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Wu, Mei-Ling. "Design of experiments to investigate reliability for solder joints PBGA package under high cycle fatigue." Microelectronics Reliability 50, no. 1 (January 2010): 127–39. http://dx.doi.org/10.1016/j.microrel.2009.09.007.

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Thambi, J., U. Tetzlaff, A. Schiessl, K.-D. Lang, and M. Waltz. "High cycle fatigue behaviour and generalized fatigue model development of lead-free solder alloy based on local stress approach." Microelectronics Reliability 66 (November 2016): 98–105. http://dx.doi.org/10.1016/j.microrel.2016.10.004.

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Zhu, Yongxin, Xiaoyan Li, Ruiting Gao, and Chao Wang. "Low-cycle fatigue failure behavior and life evaluation of lead-free solder joint under high temperature." Microelectronics Reliability 54, no. 12 (December 2014): 2922–28. http://dx.doi.org/10.1016/j.microrel.2014.08.016.

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Wong, E. H., S. K. W. Seah, and V. P. W. Shim. "Frequency-Dependent Low Cycle Fatigue of Sn1Ag0.1Cu(In/Ni) Solder Joints Subjected to High-Frequency Loading." Journal of Electronic Materials 43, no. 2 (November 23, 2013): 586–93. http://dx.doi.org/10.1007/s11664-013-2889-0.

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Kato, Fumiki, Hiroki Takahashi, Hidekazu Tanisawa, Kenichi Koui, Shinji Sato, Yoshinori Murakami, Hiroshi Nakagawa, Hiroshi Yamaguchi, and Hiroshi Sato. "Identification of thermo-mechanical fatigue fracture location by transient thermal analysis for high-temperature operating SiC power module assembled with ZnAl eutectic solder." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2018, HiTEC (May 1, 2018): 000028–31. http://dx.doi.org/10.4071/2380-4491-2018-hiten-000028.

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Abstract In this paper, we demonstrate that the structural degradation of a silicon carbide (SiC) power module corresponding to thermal cycles can be detected and tracked non-destructively by transient thermal analysis method. The purpose of this evaluation is to analyze the distribution of the thermal resistance in the power module and to identify the structure deterioration part. The power module with SiC-MOSFET were assembled using ZnAl eutectic solder as device under test. The individual thermal resistance of each part such as the SiC-die, the die-attachment, the AMCs, and the baseplate was successfully evaluated by analyzing the structure function graph. A series of thermal cycle test between −40 and 250°C was conducted, and the power modules were evaluated their thermal resistance taken out from thermal cycle test machine at 100, 200, 500 and 1000 cycles. We confirmed the increase in thermal resistance between AMCs and base plate in each thermal cycle. The portion where the thermal resistance increased is in good agreement with the location of the structural defect observed by scanning acoustic tomography (SAT) observation.

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Yeung, Betty. "BGA Board Level Reliability Analysis & Optimization." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2015, DPC (January 1, 2015): 000958–72. http://dx.doi.org/10.4071/2015dpc-tp51.

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The solder joint reliability of semiconductor package interconnects to printed circuit boards is critical for product durability. A dominant failure mode is solder fatigue due to the CTE mismatch between the BGA component and PCB at thermal cycling. However, it is well known that other factors can impact fatigue behavior and time to failure such as solder joint geometry, die geometry, solder system, etc. Finite element modeling (FEM) and simulation can play an integral role in providing deeper insight into the impact of these package parameters on the overall assembly. However, a major challenge of accurately modeling these systems includes simulation of multiple length scales from the package, substrate, and solder joints. The FEM approach addressing these can lead to reduced cycle time, accurate simulation, and improved package performance. In this work, the finite element modeling and simulation procedure is demonstrated for a BGA package at accelerated temperature cycling conditions. At the component level, key details regarding the properties and constituents of the BGA package mold compound and substrate are established by coupling measured experimental warpage data and finite element modeling. Comparison of simulated & Thermoire measurements shows excellent agreement at the package level, with warpage correlation achieved over the entire temperature range. At the assembly level, the truncated sphere model is used to arrive at precise solder joint profiles for accurate representation to tie the package to the board. The combined validated package-level results and solder joint profiles are employed towards a subsequent thermo-mechanical analysis of the full BGA assembly. The entire simulation procedure is demonstrated for a BGA design, where inelastic creep and reliability test data are compared. High strain regions in the solder joint array are shown to compare closely with regions of failure from experimental reliability test data. The validated FEM model allows for extrapolating to similar package conditions allowing faster design cycle time and less time consuming experimental work.

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KARIYA, YOSHIHARU, and TADATOMO SUGA. "Low-cycle fatigue properties of eutectic solders at high temperatures." Fatigue & Fracture of Engineering Materials and Structures 30, no. 5 (May 2007): 413–19. http://dx.doi.org/10.1111/j.1460-2695.2006.01091.x.

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Dasgupta, Arnab, Fengying Zhou, Christine LaBarbera, Weiping Liu, Paul Bachorik, and Ning-Cheng Lee. "Reliability of PCB Solder Joints Assembled with SACm™ Solder Paste." International Symposium on Microelectronics 2014, no. 1 (October 1, 2014): 000367–73. http://dx.doi.org/10.4071/isom-tp65.

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The solder alloy SACm™0510 has been reported to be a superior alloy when used as BGA balls, exhibiting not only an outstanding drop test performance when compared to SAC105, but also as having high thermal fatigue reliability when compared to high Ag SAC solders. In this study, SACm0510 solder was evaluated as a solder paste. The voiding behavior of SGA solder joints was comparable for SACm0510, SAC105, and SC305. When evaluating SGA assemblies on a customized drop test, SACm0510 outperformed SAC105 considerably, which in turn was much better than SAC305. The drop test performance was found to improve upon thermal aging at 150°C, and the difference between the alloys reduced significantly. This was explained by the speculated grain coarsening which resulted in a softened solder joint, and consequently, a shift of fracture mode from brittle failure toward ductile failure. This model was supported by the observation of the fractured surface moving away from the interface upon thermal aging. The improvement in drop test performance upon thermal aging can be further explained by the large solder joint size of the SGA employed in this study, where the bulk property of solder weighed more than a small solder joint. When the assembled chip resistors were evaluated with a −55°C/+125°C TCT test, no failure was observed after 369 cycles for all three alloys. SAC305 appeared to be the best in maintaining the integrity of the interfacial IMC layer. SACm0510 showed a few crack lines, but less than that of SAC105. SACm0510 solder paste was found to be very compatible with BGAs with SAC305 solder joints, and no abnormal microstructure was observed after thermal aging at 150°C for 1000 hours.

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Yamamoto, Mizuki, Ikuo Shohji, Tatsuya Kobayashi, Kohei Mitsui, and Hirohiko Watanabe. "Effect of Small Amount of Ni Addition on Microstructure and Fatigue Properties of Sn-Sb-Ag Lead-Free Solder." Materials 14, no. 14 (July 7, 2021): 3799. http://dx.doi.org/10.3390/ma14143799.

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The effect of the addition volume of Ni on the microstructures and tensile and fatigue properties of Sn-6.4Sb-3.9Ag (mass%) was investigated using micro-size specimens. The addition of Ni into Sn-6.4Sb-3.9Ag tends to increase the number of grains formed in the solidification process and produce a high-angle grain boundary. An amount of 0.1% proof stress of Sn-6.4Sb-3.9Ag decreases with an increase in the Ni addition volume at a strain rate of 2.0 × 10−1 s−1. The effect of the addition of Ni into Sn-6.4Sb-3.9Ag on tensile strength is negligible at both 25 °C and 175 °C. The elongation of Sn-6.4Sb-3.9Ag decreases with an increase in the Ni addition volume at 25 °C according to the fracture mode change from ductile chisel point fracture to shear fracture. The effect of the addition of Ni into Sn-6.4Sb-3.9Ag on the elongation is negligible at 175 °C. The low cycle fatigue test result shows that the fatigue life does not degrade even at 175 °C in all alloys investigated. The fatigue life of Sn-6.4Sb-3.9Ag-0.4Ni (mass%) is superior to those of Sn-6.4Sb-3.9Ag and Sn-6.4Sb-3.9Ag-0.03Ni (mass%) in the high cycle fatigue area. The electron back scattering diffraction (EBSD) analysis result shows that fine recrystallized grains are generated at the cracked area in Sn-6.4Sb-3.9Ag-0.4Ni in the fatigue test at 175 °C, and the crack progresses in a complex manner at the grain boundaries.

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Koncsik, Zsuzsanna, and János Lukács. "Design Curves for High-Cycle Fatigue Loaded Structural Elements." Materials Science Forum 752 (March 2013): 135–44. http://dx.doi.org/10.4028/www.scientific.net/msf.752.135.

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Frequently, the cause of the failure of different structures or structural elements is the cyclic loading. Both fatigue design curves and methods for determination of these curves can be found in the literature. Even so, there are structural details whereabouts executing of examinations is necessary. The aims of the study are as follows: to give a short summary of important design curves can be found in different standards or specifications; and to demonstrate of own high cycle fatigue tests on a soldered structural element and the comparing of our results and the results of an empirical method.

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Arifeen, S., G. Potirniche, A. Elshabini, and F. Barlow. "Modeling of Failure in Aluminum Alloy Braze for a High Temperature Thermoelectric Assembly." International Symposium on Microelectronics 2013, no. 1 (January 1, 2013): 000957–63. http://dx.doi.org/10.4071/isom-2013-thp63.

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The objective of this work is to design a commercially viable thermoelectric generator (TEG) assembly that can be used in passenger vehicles to be able to withstand extreme environmental conditions. Since the operating temperatures of the TEGs can reach temperature levels higher than 500 °C, aluminum braze alloys offer a good high temperature solution for die attach. However, the evolution of fatigue damage in the aluminum braze must be understood in order to ensure an acceptable reliability of the TEG. In this paper, the proposed design of TEG package assembly was evaluated under extreme temperature conditions. Three-dimensional models of full scale TEG were analyzed using finite element analysis (FEA). The failures of aluminum alloy based braze (high temperature form of solder) material in the TEG application was investigated. Low cycle fatigue using direct cyclic approach was considered for the reliability analysis. Continuum damage mechanics approach was used to study the fatigue failure due to power cycling. Different TEG assembly designs were investigated and compared to determine the best possible solution for the extreme environment application.

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Zhang, Dianhao, Xiao-guang Huang, Bin-liang Cheng, and Neng Zhang. "Numerical analysis and thermal fatigue life prediction of solder layer in a SiC-IGBT power module." Frattura ed Integrità Strutturale 15, no. 55 (December 28, 2020): 316–26. http://dx.doi.org/10.3221/igf-esis.55.24.

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Limited by the mechanical properties of materials, silicon (Si) carbide insulated gate bipolar transistor (IGBT) can no longer meet the requirements of high power and high frequency electronic devices. Silicon carbide (SiC) IGBT, represented by SiC MOSFET, combines the excellent performance of SiC materials and IGBT devices, and becomes an ideal device for high-frequency and high-temperature electronic devices. Even so, the thermal fatigue failure of SiC IGBT, which directly determines its application and promotion, is a problem worthy of attention. In this study, the thermal fatigue behavior of SiC-IGBT under cyclic temperature cycles was investigated by finite element method. The finite element thermomechanical model was established, and stress-strain distribution and creep characteristics of the SnAgCu solder layer were obtained. The thermal fatigue life of the solder was predicted by the creep, shear strain and energy model respectively, and the failure position and factor of failure were discussed.

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Gong, J., C. Liu, P. P. Conway, and Vadim V. Silberschmidt. "Analysis of Stress Distribution in SnAgCu Solder Joint." Applied Mechanics and Materials 5-6 (October 2006): 359–66. http://dx.doi.org/10.4028/www.scientific.net/amm.5-6.359.

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SnAgCu solder is a promising lead-free material for interconnections in electronic packages. However, its melting temperature (490°K) is considerably higher than that of the traditional SnPb solder (456°K). At the same time, SnAgCu has much better creep resistance at high temperature. These properties may cause large residual stresses during manufacturing processes due to the mismatch of thermal properties of electronic components that can influence the reliability of solder joints in electronic packages. This paper studies the residual stresses in solder joints in a flip chip package under different cooling conditions and their influence on the subsequent cyclic test by means of a finite element approach. The results show that the initial temperature of 453°K is high enough to induce residual stresses due to manufacturing procedures. Simulations, based on traditional creep-fatigue models, demonstrate that the residual stresses affect the mechanical behaviour of solder joints in several initial thermal cycles but have little effect on their reliability.

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Hsu, Hsiang Chen, and Wei Mao Hung. "Reliability Prediction for 95.5Sn3.9Ag0.6Cu Solder Bump and Thermal Design for Lead Free System in Package with Polymer-Based Material." Materials Science Forum 505-507 (January 2006): 289–94. http://dx.doi.org/10.4028/www.scientific.net/msf.505-507.289.

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This paper demonstrates the thermal-induced mechanical problems resulted from various temperature profiles of reliability test for a system-in-package (SIP) assembly process. The package includes two flip chip mounted chips (underfilled), two memory CSPs, some passive SMDs and 4-layer BT substrate. The flip-chip specimen was taken and the Moiré Interferometry was used as methodology to verify the developed Finite Element Model and material property. It also shows that the developed finite element model is capable to simulate the JEDEC standard JESD22-A104 reliability thermal cycle test and then to predict solder fatigue life and to summarize design rules for thermal optimization of package based on the creep model and viscoplastic model of solder while the SIP package design is proceeded. Thermal design for SIP depends on the placement of FC chip (high power) and memory CSP components. Passive SMDs are also included to study the effect of thermal-induced stress. A series of comprehensive parametric studies were conducted in this paper.

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Kung, Chieh. "Robust Design Analysis on Fatigue Life of Lead-Free Sn0.5Ag Solder in a Multichip Module Package." Applied Mechanics and Materials 284-287 (January 2013): 375–79. http://dx.doi.org/10.4028/www.scientific.net/amm.284-287.375.

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System-in-package (SiP) has become a mainstream technology in IC package industry as it provides the solutions to the growing needs of high speed functions, mobility/portability, energy efficiency, and miniaturization of electronic products. One special form of SiP is the multi-chip module (MCM) in which multiple integrated circuits (ICs), semiconductor dies or other discrete components are packaged onto a unifying substrate. Thus, the reliability of package integrity becomes one of the major reliability concerns. In the present paper, a robust design analysis on the thermo-mechanical reliability of an MCM package with flip-chip technology is demonstrated. Our results show that for the specific package, the CTE of the substrate is the most influential factor to the fatigue reliability of the package. The optimal combination of the parameters is recommended. The robust design analysis optimizes the fatigue life from 165 cycles to 1080 cycles which is a 554.5% gain on the fatigue life.

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Yang, Ping, Xiusheng Tang, Yu Liu, Shuting Wang, and Jianming Yang. "Dynamic reliability approach of chip scale package assembly under vibration environment." Microelectronics International 31, no. 2 (April 29, 2014): 71–77. http://dx.doi.org/10.1108/mi-11-2013-0061.

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Purpose – The purpose of this paper is to perform experimental tests on fatigue characteristics of chip scale package (CSP) assembly under vibration. Some suggestions for design to prolong fatigue life of CSP assembly are provided. Design/methodology/approach – The CSP assembly which contains different package structure modes and chip positions was manufactured. The fatigue characteristics of CSP assembly under vibration were tested. The fatigue load spectrum of CSP assembly was developed under different excitation. The fatigue life of chips can be estimated by using the high-cycle fatigue life formula based on different stress conditions. The signal–noise curve shows the relationship between fatigue life and key factors. The design strategy for improving the fatigue life of CSP assembly was discussed. Findings – The CSP chip has longer fatigue life than the ball grid array chip under high cyclic strain. The closer to fixed point the CSP chip, the longer fatigue life chips will have. The chip at the edge of the printed circuit board (PCB) has longer fatigue life than the one in the middle of the PCB. The greater the excitation imposed on the assembly, the shorter the fatigue life of chip. Research limitations/implications – It is very difficult to set up a numerical approach to illustrate the validity of the testing approach because of the complex loading modes and the complex structure of CSP assembly. The research on an accurate mathematical model of the CSP assembly prototype is a future work. Practical implications – It builds a basis for high reliability design of high-density CSP assembly for engineering application. In addition, vibration fatigue life prediction method of chip-corner solder balls is deduced based on three-band technology and cumulative damage theory under random vibration so as to verify the accuracy of experimental data. Originality/value – This paper fulfils useful information about the dynamic reliability of CSP assembly with different structural characteristics and material parameters.

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Khan, M. Ashraf, Jason M. Kulick, David Kopp, Patrick Fay, Alfred M. Kriman, and Gary H. Bernstein. "Design and Robustness of Quilt Packaging Superconnect." Journal of Microelectronics and Electronic Packaging 10, no. 1 (January 1, 2013): 8–14. http://dx.doi.org/10.4071/imaps.358.

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Quilt packaging (QP) is a novel high-speed super-connect (i.e., direct interchip interconnect), developed to improve electrical performance—signal delay, power loss, and so on. Ultrahigh bandwidth has already been demonstrated for QP, but its unique structure requires thermal reliability issues to be studied. To this end, simulation models were developed to study the robustness of QP. QP structures were fabricated, and thermal cycling tests were performed focusing on the reliability for various shapes of nodules, the basic physical interconnect unit of QP. Simulations were performed to determine stress over a range of temperatures and estimate low cycle fatigue lifetimes. Simulations considered two types of solder and several adhesives. Thermal cycling experiments indicate that QP provides a robust structure, in agreement with the simulation results.

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Khan, M. Ashraf, Jason M. Kulick, Alfred M. Kriman, and Gary H. Bernstein. "Design and Robustness of Quilt Packaging Superconnect." International Symposium on Microelectronics 2012, no. 1 (January 1, 2012): 000524–30. http://dx.doi.org/10.4071/isom-2012-poster_khan.

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Quilt Packaging (QP) is a novel high-speed superconnect (i.e. direct interchip interconnect), developed to improve electrical performance — signal delay, power loss, etc. Ultrahigh bandwidth has already been demonstrated for QP, but its unique structure requires thermal reliability issues to be studied. To this end, simulation models were developed to study the robustness of QP. QP structures were fabricated, and thermal cycling tests were performed focusing on the reliability for various shapes of nodules, the basic physical interconnect unit of QP. Simulations were performed to determine stress over a range of temperatures and estimate low cycle fatigue lifetimes. Simulations considered two types of solder and several adhesives. Thermal cycling experiments indicate that QP provides a robust structure, in agreement with the simulation results.

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Kato, Fumiki, Fengqun Lang, Simanjorang Rejeki, Hiroshi Nakagawa, Hiroshi Yamaguchi, and Hiroshi Sato. "Precise Chip Joint Method with Sub-micron Au Particle for High-density SiC Power Module Operating at High Temperature." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2013, HITEN (January 1, 2013): 000254–59. http://dx.doi.org/10.4071/hiten-wa17.

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In this work, a novel precise chip joint method using sub-micron Au particle for high-density silicon carbide (SiC) power module operating at high temperature is proposed. A module structure of SiC power devices are sandwiched between two silicon nitride-active metal brazed copper (SiN-AMC) circuit boards. To make a precise position and height control of the chip bonding, the top side (gate/source or anode pad side) of SiC power devices are flip-chip bonded to circuit electrodes using sub-micron Au particle with low temperature (250°C) and pressure-less sintering. The accuracy of the bonding position of chips was less than 10 μm and the accuracy of the height after bonding chips was less than 15 μm. Mechanical shear fatigue tests for flip-chip bonded SiC Schottky barrier diode (SBD) were carried out. As a result, initial shear strength of the joint was 36 MPa. The shear strength of 43 MPa is obtained after storage life test (500 hours at 250°C), and also 35 MPa is obtained even after thermal cycle stress test (1000 cycles between −40°C and 250°C). The flip-chip bonding of SiC-JFET is successfully realizedon the substrate without short or open failure electrically. Finally we joint the backside of the SiC-JFET (drain side) and the SiC-SBD (cathode side) to each circuit electrodes at once by means of reflow process with Au-12%Ge solder. The structured sandwich SiC power module was also successfully formed.

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Pinti, Federica, Alberto Belli, Lorenzo Palma, Massimo Gattari, and Paola Pierleoni. "Validation of Forward Voltage Method to Estimate Cracks of the Solder Joints in High Power LED." Electronics 9, no. 6 (June 1, 2020): 920. http://dx.doi.org/10.3390/electronics9060920.

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The Light Emitting Diode (LED) has many advantages compared to traditional lamps, such as a long lifetime, color rendering and energy saving. It requires good thermal management, since as the temperature increases, the lifetime decreases. Furthermore, the presence of cracks in the Solder Joint of an LED (SJL) compromises the correct dispersion of heat and causes the joint fatigue. This can lead to a decrease in the lifetime of the assembled LED. In this study, we validated that an SJL can be considered faulty if the Forward Voltage (Vf) acquired before and after thermal cycles increases by more than 2%. The voltage measurement method was validated by comparing the results with the techniques commonly used to evaluate the defects of a solder joint as the X-ray analysis and the metallographic section. The failure analysis results present the probability of failure and the lifetime of the SJL achieved by analyzing the data using the Norris–Landberg Model. The lifetime calculated over 1800 SJLs considered in the validation process is greater than 20 years for 95.9% of the tested LEDs.

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Kim, Sang Ha, Chika Kakegawa, Hiroshi Tabuchi, and Han Park. "Second- and Third-Level BGA Solder Joint Reliability of High-End Flip Chip System in Package (FCSiP)." Journal of Microelectronics and Electronic Packaging 5, no. 4 (October 1, 2008): 180–87. http://dx.doi.org/10.4071/1551-4897-5.4.180.

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The major concerns posed by system-in-package (SiP) designs for network applications are the interconnection reliability between the memory plastic ball grid array (PBGA) package and the SiP module, which we refer to as 2nd-level interconnection, and between the SiP module and the system board, which we refer to as 3rd-level interconnection, induced by thermomechanical stress to the large SiP module, i.e., 55 × 55 mm2 package body size. In this paper, finite element analysis (FEA) and design of experiment (DOE) case studies were used to evaluate the 2803-pin flip chip SiP (FCSiP) and to determine the best construction of the SiP module and optimize the assembly material set. Heat spreader (lid) thickness, heat spreader material, and under-fill implementation were considered in the stress and fatigue lifetime FEA case studies and long-term solder joint reliability, which was accelerated thermal cycle (ATC) tested at operating temperatures from 0 to 100°C. Another important factor in the system-level reliability is an external heat sink, and its compressive force effect was also investigated in the ATC test. In addition, short-term mechanical reliability tests, such as the 4-point monotonic bend test based on the IPC-9702 specification and mechanical shock test based on the JESD22-B110A standard, were also evaluated for the 2803-pin FCSiP qualification. Finally, the results of these experiments were compared with the FEA data in a correlation process.

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Schambeck, Simon, Matthias Hutter, Johannes Jaeschke, Andrea Deutinger, and Martin Schneider-Ramelow. "Sporadic Early Life Solder Ball Detachment Effects on Subsequent Microstructure Evolution and Fatigue of Solder Joints in Wafer-Level Chip-Scale Packages." Journal of Microelectronics and Electronic Packaging 17, no. 1 (January 1, 2020): 13–22. http://dx.doi.org/10.4071/imaps.966816.

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Abstract The combination of continuous miniaturization of electronics and the demanding reliability requirements for industrial and automotive electronics is one big challenge for emerging packaging technology. One aspect is to increase the understanding of the damage under environmental loading. Therefore, the solder joints of a wafer-level chip-scale package assembled on a printed circuit board (PCB) have been analyzed after a temperature cycling test. In the case of the investigated package, a limited number of joints did not form a proper mechanical connection with the PCB copper pad. Although not intended in the first place, these circumstances cause a detachment of those joints within the first few thermal cycles. However, this constellation offers a unique opportunity to compare the solder joint microstructure after thermomechanical loading (connected joints) with pure thermal loading (detached joints) located directly next to each other. It is shown that microstructure aging effects can be directly linked to regions in the joint with increased loading. This is particularly the case for detached joints, which could almost retain their initial microstructure up to the effect of the high-temperature part of the thermal profile. By means of finite element simulation, it is further possible to quantify the increased loading on adjacent joints if isolated solder balls detach from the board. In one case presented, the lifetime of the corner joint was calculated to reduce up to 85% only.

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KIM, Young Bae. "Finite element analysis for the frequency effects on the high cycles fatigue lifes of a solder ball under vibration." Proceedings of The Computational Mechanics Conference 2003.16 (2003): 695–96. http://dx.doi.org/10.1299/jsmecmd.2003.16.695.

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Zhou, Y., G. Plaza, A. Dasgupta, and M. Osterman. "Vibration Durability of Sn3.0Ag0.5Cu (SAC305) Solder Interconnects: Harmonic and Random Excitation." Journal of the IEST 52, no. 1 (April 1, 2009): 63–86. http://dx.doi.org/10.17764/jiet.52.1.980053067640204j.

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In this study, the durability of lead (Pb)-free tin(Sn3.0)silver(Ag0.5)copper(Cu) (SAC305) printed wiring assemblies (PWAs) is investigated under constant amplitude, narrow-band (harmonic) excitation and under step-stress broad-band (random) excitation, and compared to the durability of Pb-based Sn37Pb PWAs. The results show that Sn37Pb assemblies last longer than SAC305 assemblies at similar excitation levels, for both harmonic and random excitations used in this study. The test specimens are identical for all tests, consisting of a PWA with plastic ball grid array components, quad flat pack components, leadless ceramic chip carriers, and leadless chip resistors. The test matrix includes test boards with different kinds of finishes and different aging conditions. Both the harmonic and random vibration tests are conducted on single-axis electrodynamic shakers. The harmonic vibration excitation is applied to a single specimen at a time, while the random vibration excitation is applied simultaneously to 20 test specimens using a specially designed test fixture. The flexural response of each test specimen mounted in the fixture is first thoroughly characterized before conducting the durability experiment. The flexural strain histories, measured on the PWAs, are used to compare the performance of the assemblies at different excitation conditions and also as inputs in other studies for stress analysis to quantify the damage in the solder joints.1 The durability tests are then conducted and time-to-failure is documented for the entire test matrix. The random durability tests are conducted at three temperatures: 125 °Centigrade (C), 25 °C (room temperature), and -40 °C. The harmonic tests are conducted only at room temperature. Destructive failure analysis (cross-sectioning, polishing, and microscopy) is conducted to confirm the failure modes. The test results presented here are analyzed in related publications1 to extract the high-cycle fatigue properties of the SAC305 and Sn37Pb solder materials.

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Wileman, Andrew, Suresh Perinpanayagam, and Sohaib Aslam. "Physics of Failure (PoF) Based Lifetime Prediction of Power Electronics at the Printed Circuit Board Level." Applied Sciences 11, no. 6 (March 17, 2021): 2679. http://dx.doi.org/10.3390/app11062679.

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This paper presents the use of physics of failure (PoF) methodology to infer fast and accurate lifetime predictions for power electronics at the printed circuit board (PCB) level in early design stages. It is shown that the ability to accurately model silicon–metal layers, semiconductor packaging, printed circuit boards (PCBs), and assemblies allows, for instance, the prediction of solder fatigue failure due to thermal, mechanical, and manufacturing conditions. The technique allows a life-cycle prognosis of the PCB, taking into account the environmental stresses it will encounter during the period of operation. Primarily, it involves converting an electronic computer aided design (eCAD) circuit layout into computational fluid dynamic (CFD) and finite element analysis (FEA) models with accurate geometries. From this, stressors, such as thermal cycling, mechanical shock, natural frequency, and harmonic and random vibrations, are applied to understand PCB degradation, and semiconductor and capacitor wear, and accordingly provide a method for high-fidelity power PCB modelling, which can be subsequently used to facilitate virtual testing and digital twinning for aircraft systems and sub-systems.

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Hamdani, Hamid, Bouchaïb Radi, and Abdelkhalak El Hami. "Optimization of solder joints in embedded mechatronic systems via Kriging-assisted CMA-ES algorithm." International Journal for Simulation and Multidisciplinary Design Optimization 10 (2019): A3. http://dx.doi.org/10.1051/smdo/2019002.

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In power electronics applications, embedded mechatronic systems (MSs) must meet the severe operating conditions and high levels of thermomechanical stress. The thermal fatigue of the solder joints remains the main mechanism leading to the rupture and a malfunction of the complete MS. It is the main failure to which the lifetime of embedded MS is often linked. Consequently, robust and inexpensive design optimization is needed to increase the number of life cycles of solder joints. This paper proposes an application of metamodel-assisted evolution strategy (MA-ES) which significantly reduces the computational cost of ES induced by the expensive finite element simulation, which is the objective function in optimization problems. The proposed method aims to couple the Kriging metamodel with the covariance matrix adaptation evolution strategy (CMA-ES). Kriging metamodel is used to replace the finite element simulation in order to overcome the computational cost of fitness function evaluations (finite element model). Kriging is used together with CMA-ES and sequentially updated and its fidelity (quality) is measured according to its ability in ranking of the population through approximate ranking procedure (ARP). The application of this method in the optimization of MS proves its efficiency and ability to avoid the problem of computational cost.

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Khanna, Sumeer, Patrick McCluskey, Avram Bar-Cohen, Bao Yang, and Michael Ohadi. "Thin Thermally Efficient ICECool Defense Semiconductor Power Amplifiers." Journal of Microelectronics and Electronic Packaging 14, no. 3 (July 1, 2017): 77–93. http://dx.doi.org/10.4071/imaps.456518.

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Abstract Traditional power electronics for military and fast computing applications are bulky and heavy. The “mechanical design” of electronic structure and “materials” of construction of the components have limitations in performance under very high temperature conditions. The major concern here is “thermal management.” To be more specific, this refers to removal of high-concentration hotspot heat flux >5 kW/cm2, background heat flux >1 kW/cm2, and “miniaturization” of device within a substrate thickness of <100 μm. We report on the novel applications of contact-based thermoelectric cooling (TEC) to successful implementations of high-conductivity materials - diamond substrate grown on gallium nitride (GaN)/AlGaN transistors to keep the hotspot temperature rise of device below 5 K. The requirement for smarter and faster functionality along with a compact design is considered here. These efforts have focused on the removal of higher levels of heat flux, heat transfer across interface of junction and substrate, advanced packaging and manufacturing concepts, and integration of TEC of GaN devices to nanoscale. The “structural reliability” is a concern and we have reported the same in terms of mean time to failure (cycles) of SAC305 (96.5% tin, 3% silver, 0.5% cu) solder joint by application of Engelmaier's failure model and evaluation of stresses in the structure. The mathematical equation of failure model incorporates the failure phenomena of fatigue and creep in addition to the dwell time, average solder temperature, and plastic strain accumulation. The approach to this problem is a nonlinear finite element analysis technique, which incorporates thermal, mechanical, and thermoelectric boundary conditions.

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Journal articles on the topic 'High cycle fatigue solder'

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