Academic literature on the topic 'High-performance cooling'

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Journal articles on the topic "High-performance cooling"

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Yan, Zhibin, Mingliang Jin, Zhengguang Li, Guofu Zhou, and Lingling Shui. "Droplet-Based Microfluidic Thermal Management Methods for High Performance Electronic Devices." Micromachines 10, no. 2 (January 25, 2019): 89. http://dx.doi.org/10.3390/mi10020089.

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Advanced thermal management methods have been the key issues for the rapid development of the electronic industry following Moore’s law. Droplet-based microfluidic cooling technologies are considered as promising solutions to conquer the major challenges of high heat flux removal and nonuniform temperature distribution in confined spaces for high performance electronic devices. In this paper, we review the state-of-the-art droplet-based microfluidic cooling methods in the literature, including the basic theory of electrocapillarity, cooling applications of continuous electrowetting (CEW), electrowetting (EW) and electrowetting-on-dielectric (EWOD), and jumping droplet microfluidic liquid handling methods. The droplet-based microfluidic cooling methods have shown an attractive capability of microscale liquid manipulation and a relatively high heat flux removal for hot spots. Recommendations are made for further research to develop advanced liquid coolant materials and the optimization of system operation parameters.
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Colgan, E. G., B. Furman, M. Gaynes, N. LaBianca, J. H. Magerlein, R. Polastre, R. Bezama, K. Marston, and R. Schmidt. "High Performance and Subambient Silicon Microchannel Cooling." Journal of Heat Transfer 129, no. 8 (2007): 1046. http://dx.doi.org/10.1115/1.2724850.

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Maclaine-cross, I. L. "High-Performance Adiabatic Desiccant Open-Cooling Cycles." Journal of Solar Energy Engineering 107, no. 1 (February 1, 1985): 102–4. http://dx.doi.org/10.1115/1.3267637.

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Kang, T. S., and I. L. Maclaine-cross. "High Performance, Solid Desiccant, Open Cooling Cycles." Journal of Solar Energy Engineering 111, no. 2 (May 1, 1989): 176–83. http://dx.doi.org/10.1115/1.3268304.

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Solid desiccant, open cooling cycles use low temperature heat efficiently making them attractive for solar air conditioning. Advanced cycles using nearly reversible evaporative coolers have previously been proposed and shown to have high ideal performance. This parametric study shows that, with real components comparable to those used in studies of classical cycles, these open cycles can give more than twice the thermal coefficient of performance of a ventilation cycle.
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Dragoi, Mircea-Viorel, Dorin Mircea Rosca, Milena Flavia Folea, and Gheorghe Oancea. "A Fully Symmetrical High Performance Modular Milling Cutter." Symmetry 13, no. 3 (March 18, 2021): 496. http://dx.doi.org/10.3390/sym13030496.

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Milling cutters belong to a widely used category of cutting tools. In this category, modular milling cutters are a narrow niche, less studied, and developed. Usually, they are symmetrical cutting tools. A milling cutting tool that can be reconfigured due to its modularity and still keeps its symmetry becomes more interesting and useful for machining. The paper presents such a new concept in a computer aided design (CAD) model of a cutting tool based on some novel features. The tool itself is designed as a modular complex. The way the torque is transmitted from the shaft to the elementary cutters is an original one, as they are joined together based on a profiled assembling. The profile is one formed of filleted circular sectors and segments. The reaming of the elementary cutters has two sections each of them assuming a task: transmitting the torque, and precisely centring, respectively. The cooling system, which is a component of the tool, provides the cutting area with coolant both on the front and side face of the cutting tool. Some nozzles placed around the cutting tool send jets or curtains of coolant towards the side surface of the cutter, instead of parallel, as some existing solutions do. The source of the coolant supply is the inner cooling system of the machine tool. This provides the tool with coolant having proper features: high enough flow and pressure. The output of the research is a CAD-based model of the modular milling cutter with a high performance cooling system. All of this model’s elements were designed taking into account the design for manufacturing principles, so it will be possible to easily manufacture this tool. Several variants of milling cutters obtained by reconfiguring the complex tool are presented. Even if the tool is usually a symmetric complex, it can process asymmetric parts. Symmetry is intensively used to add some advantages to the modular cutting tool: balanced forces in the cutting process, the possibility of controlling the direction of the axial cutting force, and a good machinability of the grooves used to assemble the main parts of the cutting tool.
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Nakata, Naoki, Takashi Kuroki, Akio Fujibayashi, and Yoshio Utaka. "Cooling Performance of High Temperature Steel Plate in Intensive Cooling with High Water Flow Rate." Tetsu-to-Hagane 99, no. 11 (2013): 635–41. http://dx.doi.org/10.2355/tetsutohagane.99.635.

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Klocke, Fritz, Dieter Lung, Alexander Krämer, Tolga Cayli, and Hubertus Sangermann. "Potential of Modern Lubricoolant Strategies on Cutting Performance." Key Engineering Materials 554-557 (June 2013): 2062–71. http://dx.doi.org/10.4028/www.scientific.net/kem.554-557.2062.

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Besides developments in the area of dry machining and minimum quantity lubrication, the use of coolant lubricants is still essential when machining high alloyed steels or heat resistant materials like titanium and nickel based alloys. Experts agree that this fact will not change in the next decade. For this reason it is necessary to use coolant lubricants as effectively as possible to maximise their positive effect on productivity and process stability. High-performance cooling strategies like high-pressure cooling and cooling with cold gases (cryogenic cooling) have received increased attention in the last years. Through the targeted supply of coolant lubricants to the cutting site it is possible to decrease tool wear, increase cutting speeds, guarantee defined chip breakage and chip transport and – in terms of cryogenic cooling – waive part cleaning. This paper shows current research results in the above mentioned field. Since the performance of a high-pressure coolant lubricant supply in turning difficult to cut materials has been shown in many previous papers, this paper focuses on the quantification of the potential in turning different steels, namely quenched and tempered but also stainless steel in comparison to the conventional flood cooling. Since energy efficiency is very crucial, pressure and flow rate have to be adjusted carefully and in accordance with the cutting parameters to guarantee best results with less energy. Moreover the effects of cryogenic cooling will be evaluated in comparison to high-pressure cooling and conventional flood cooling. In latter field, cutting tests were carried out under variation of the flow rate in order to find the minimum required value for a certain machining task with the overall aim to prevent waste of the media used. Especially in cryogenic cooling technologies, many fundamental research regarding the working mechanisms but also further developments in cutting tool and machine tool technology are still necessary to make this technology ready for industrial use.
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Wang, Yunda, Ziyang Zhang, Tomoyasu Usui, Michael Benedict, Sakyo Hirose, Joseph Lee, Jamie Kalb, and David Schwartz. "A high-performance solid-state electrocaloric cooling system." Science 370, no. 6512 (October 1, 2020): 129–33. http://dx.doi.org/10.1126/science.aba2648.

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Electrocaloric (EC) cooling is an emerging technology that has broad potential to disrupt conventional air conditioning and refrigeration as well as electronics cooling applications. EC coolers can be highly efficient, solid state, and compact; have few moving parts; and contain no environmentally harmful or combustible refrigerants. We report a scalable, high-performance system architecture, demonstrated in a device that uses PbSc0.5Ta0.5O3 EC multilayer ceramic capacitors fabricated in a manufacturing-compatible process. We obtained a system temperature span of 5.2°C and a maximum heat flux of 135 milliwatts per square centimeter. This measured heat flux is more than four times higher than other EC cooling demonstrations, and the temperature lift is among the highest for EC systems that use ceramic multilayer capacitors.
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Brotz, Friedrich, Tobias Isermeyer, Conrad Pfender, and Thomas Heckenberger. "Cooling of high-performance batteries for hybrid vehicles." ATZ worldwide 109, no. 12 (December 2007): 13–16. http://dx.doi.org/10.1007/bf03224972.

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Simons, R. E. "The evolution of IBM high performance cooling technology." IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A 18, no. 4 (1995): 805–11. http://dx.doi.org/10.1109/95.477467.

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Dissertations / Theses on the topic "High-performance cooling"

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Sharmin, Afsana. "EMBEDDED COOLING OF HIGH PERFORMANCE ICS USING NOVEL NANOSTRUCTURED THERMOELECTRICS." OpenSIUC, 2013. https://opensiuc.lib.siu.edu/theses/1308.

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AN ABSTRACT OF THE THESIS OF AFSANA SHARMIN, for the Master of Science degree in Electrical and Computer Engineering, presented on November 1, 2013, at Southern Illinois University Carbondale. TITLE: EMBEDDED COOLING OF HIGH PERFORMANCE ICS USING NOVEL NANOSTRUCTURED THERMOELECTRICS MAJOR PROFESSOR: Dr. Shaikh S. Ahmed Site specific thermoelectric cooling in semiconductor materials is among the most promising approaches for the mitigation of on-chip hot spots resulting from the decreasing feature sizes and faster switching speeds of electronic components. The efficient usage of thermoelectric devices for hotspot cooling requires investigation and appropriate properties such as higher figure of merit, integration of these devices with electronic package, remedy of various obstacles such as parasitic contact resistances. A simulation model has been developed to investigate the effect of steady state operation of nanowire based thermoelectric cooler devices on hot-spot cooling considering the effect of crucial thermal and electrical contact resistances. The results suggest that active hotspot cooling of as much as 23ºC with a high (~1,300W/cm2) heat flux for nanowire based Bi2Te3 thermoelectric cooler. It has been observed from the results that thermal and electrical contact resistances play a very crucial role in the performance of nanowire based thermoelectric cooling devices as high values of these resistances can significantly degrade the effect of Peltier cooling.
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Pieskä, Henrikki. "Performance evaluations of high-temperature cooling systems in Mediterranean climate." Licentiate thesis, KTH, Hållbara byggnader, 2021. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-289578.

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Cooling demand in Europe is predicted to grow 25-50% between 2020-2050. Meanwhile, the EU aims to lower the greenhouse gas emissions from its building stock by 60%. Therefore, it is essential to find solutions that can meet the growing cooling demand with less energy and integrate renewable energy sources. The goal of this thesis is to technically evaluatehigh-temperature cooling systems and their contributions to the targets mentioned above. The study was conducted using advanced building energy simulations and developing analytical methods. IDA Indoor Climate and Energy 4.8was selected as the simulation tool. The study is a part of GEOFIT project, and the used building physics and measurement data were based on one of the project pilots. The selected building is a representative office building that is a part of a three-building school complex. The building is located in Sant Cugat near Barcelona, in an area which has a typical Mediterranean climate. The simulated building model was validated using onsite measurement data. Two types of high-temperature cooling systems were studied: a radiant cooling system and an all-air cooling system. For the study, the systems were designed to create equal thermal comfort conditions, so that their energy and exergy use could be compared. In the studied case, the radiant cooling system was found to use 40% less energy and consume 85% less exergy than a conventional low-temperature all-air cooling system. It was also found that a passive geothermal radiant cooling system requires 66% less electricity for pumps and fans than a passive geothermal all-air cooling system. The results demonstrate that radiant cooling systems have the potential to lower exergy consumption in cooling applications thanks to the high supply temperature and that using water as a heat transfer medium is more efficient than using air.
Kylningsefterfrågan i Europa förutses att växa 25-50% mellan 2020-2050. Samtidigt strävar EU efter att sänka utsläppen av växthusgaser från sina byggnader med 60%. Det är därför viktigt att hitta lösningar som kan tillgodose det växande kylbehovet med mindre energi och att integrera förnybara energikällor. Målet med denna avhandling är en teknisk evaluering av högtemperatur-kylsystem och deras bidrag till ovan nämnda mål. Studien genomfördes med avancerade simuleringar av byggnadsenergi och utvecklade analytiska metoder. IDA Indoor Climate and Energy 4.8 valdes som simuleringsverktyg. Studien är en del av GEOFIT-projektet och den använda byggnadsfysiken och mätdata baserades på en av projektpiloterna. Den valda byggnaden är en representativ kontorsbyggnad som ingår i ett skolbyggnad med tre byggnader. Byggnaden ligger i Sant Cugat nära Barcelona, i ett område som har ett typiskt medelhavsklimat. Den simulerade byggnadsmodellen validerades med hjälp av mätdata på plats. Två typer av högtemperatur-kylsystem studerades: ett strålande kylsystem och ett luftkylsystem. För studien designades systemen för att skapa lika termiska komfortförhållanden, så att deras energi och exergianvändning kunde jämföras. I det studerade fallet visade sig att det strålande kylsystemet använde 40% mindre energi och förbrukade 85% mindre exergi än ett konventionellt högtemperatur-kylsystem med låg temperatur. Man fann också att ett passivt geotermiskt strålkylsystem kräver 66% mindre el för pumpar och fläktar än ett passivt geotermiskt luftkylsystem. Resultaten visar att strålningskylsystem har potential att sänka exergiförbrukningen i kylapplikationer tack vare den höga framledningstemperaturen och att användning av vatten som värmeöverföringsmedium är effektivare än att använda luft.

QC 210204

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Zheng, Li. "Power distribution network modeling and microfluidic cooling for high-performance computing systems." Diss., Georgia Institute of Technology, 2015. http://hdl.handle.net/1853/54449.

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A silicon interposer platform with microfluidic cooling is proposed for high-performance computing systems. The key components and technologies for the proposed platform, including electrical and fluidic microbumps, microfluidic vias and heat sinks, and simultaneous flip-chip bonding of the electrical and fluidic microbumps, are developed and demonstrated. Fine-pitch electrical microbumps of 25 µm diameter and 50 µm pitch, fluidic vias of 100 µm diameter, and annular-shaped fluidic microbumps of 150 µm inner diameter and 210 µm outer diameter were fabricated and bonded. Electrical and fluidic tests were conducted to verify the bonding results. Moreover, the thermal and signaling benefits of the proposed platform were evaluated based on thermal measurements and simulations, and signaling simulations. Compared to the conventional air cooling, significant reductions in system temperature and thermal coupling are achieved with the proposed platform. Moreover, the signaling performance is improved due to the reduced temperature, especially for long interconnects on the silicon interposer. A numerical power distribution network (PDN) simulator is developed based on distributed circuit models for on-die power/ground grids, package- and board- level power/ground planes, and the finite difference method. The simulator enables power supply noise simulation, including IR-drop and simultaneous switching noise, for a full chip with multiple blocks of different power, decoupling capacitor, and power/ground pad densities. The distributed circuit model is further extended to include TSVs to enable simulations for 3D PDN. The integration of package- and board- level power/ground planes enables co-simulation of die-package-board PDN and exploration of new PDN configurations.
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JImenez, Lopez Carlos. "Performance analysis and validation of high-temperature cooling panels in passive geothermal system." Thesis, KTH, Hållbara byggnader, 2018. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-247915.

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High Temperature Cooling, HTC, is a thermal conditioning strategy, which aims to reducemixing and transfer heat losses. Cooling capacity strongly depends on heat transfer coefficientsand offers a great response and several advantages in terms of efficiency and sustainability.Among the advantages, there is evidence that HTC offers an increment of energy efficiency ofHVAC systems, provision of healthier and more comfortable indoor climate and provide widepotentials for the applications of renewable. This principle leads to a higher energy efficiency ofwater-based radiant cooling systems.This paper intends to focus on the research of the thermal capacity and performance of a newalternative. This is where Cooling Radiant Ceiling Panels, CRCP, becomes a major innovationwithin the sector and begin to take on certain relevance. The cooling capacity curve of thisparticular CRCP panels has been only measured in an idealized room environment according toDIN EN 14240. Thus, further studies of this key parameter through climate chamber testingand Computational Fluid Dynamics simulations, CFD, are necessary. CFD particularly focuseson fluids in motion, their behavior and their influences in complex processes such as heat transfer.The fluid motion can be described through fundamental mathematical equations and it isbecoming widely used within the building sector.Two different cases are going to be investigated. The first case will determine the mostoptimal peripheral gap to enhance cooling performance through Natural Convection, NC. Thisstudy states the existence of a peripheral gap around the panels has proven to be inefficientin terms of enhancing natural convection in the climate chamber. The second case is aboutcalculating the cooling capacity as a function of the internal heat loads. The cooling capacity ofthe CRCP panels followed an expected behavior. The R-squared factor of the linear regressionwas found to be 0.986, hence, it does not affect the performance of the CRCP panels dependingon the inclusion of the IHLs.This thesis provides the necessary information for the implementation of CRCP panels anddifferent possible operating environments, including considerations, limitations and recommendationsfor future implementation of this strategy.
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Ortéga, Benjamin. "HEV thermal management of high voltage battery with indirect air cooling and regarding customer performance." Thesis, KTH, Fordonsdynamik, 2020. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-293365.

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The automotive environment is quickly evolving due to increasingly stringent environmentalstandards and the gradual reduction of the volume of diesel motorized vehicles. The volumes of electrifiedvehicles are thus constantly growing and are brought to be more and more present in our streets. Thiselectrification of vehicles involves new specifics issues compared to conventional vehicles, depending on thedifferent levels of electrification, which includes notably Hybrid Electric Vehicles.Hybridization in cars is characterized by the addition of a electrical traction and/or electrical generation systemin addition to the conventional thermal engine. However, if the complexity of vehicles with thermal tractioncomes essentially from the internal combustion engine and its efficiency which are sometimes complex tooptimize, the complexity of electric traction is expressed on the other hand at the level of the battery whichsupplies high voltage electricity. Indeed, while an electric machine offers high efficiency and an easy control,the high voltage battery contains many issues linked to a complex chemistry which must be controlled, andcan be subject to overheating.This overheating phenomenon is particularly an issue on HEV, which have smaller batteries than BEV and PHEVapplications for a comparable power demand. The conception of an efficient high-voltage battery coolingsystem is therefore essential in order to avoid any danger of damaging the system or potential fires linked tothe overheating of the battery. The air cooling solution is the most common, but this could change with thenew standard of the Electric Vehicle Safety Global Technical Regulation (EVS-GTR) applicable in 2021prohibiting the rejection of the cooling air that was in contact with the battery cells inside the passengercompartment. Is this solution able to adapt in order to remain competitive with the water or air conditioningcooling solutions? This study's purpose is to bring an answer to this issue.
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Nasir, Shakeel. "Showerhead Film Cooling Performance of a Turbine Vane at High Freestream Turbulence in a Transonic Cascade." Diss., Virginia Tech, 2007. http://hdl.handle.net/10919/28560.

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One way to increase cycle efficiency of a gas turbine engine is to operate at higher turbine inlet temperature (TIT). In most engines, the turbine inlet temperatures have increased to be well above the metallurgical limit of engine components. Film cooling of gas turbine components (blades and vanes) is a widely used technique that allows higher turbine inlet temperatures by maintaining material temperatures within acceptable limits. In this cooling method, air is extracted from the compressor and forced through internal cooling passages within turbine blades and vanes before being ejected through discrete cooling holes on the surfaces of these airfoils. The air leaving these cooling holes forms a film of cool air on the component surface which protects the part from hot gas exiting the combustor. Design optimization of the airfoil film cooling system on an engine scale is a key as increasing the amount of coolant supplied yields a cooler airfoil that will last longer, but decreases engine core flowâ diminishing overall cycle efficiency. Interestingly, when contemplating the physics of film cooling, optimization is also a key to developing an effective design. The film cooling process is shown to be a complex function of at least two important mechanisms: Increasing the amount of coolant injected reduces the driving temperature (adiabatic wall temperature) of convective heat transferâ reducing heat load to the airfoil, but coolant injection also disturbs boundary layer and augments convective heat transfer coefficient due to local increase in freestream turbulence. Accurate numerical modeling of airfoil film cooling performance is a challenge as it is complicated by several factors such as film cooling hole shape, coolant-to-freestream blowing ratio, coolant-to-freestream momentum ratio, surface curvature, approaching boundary layer state, Reynolds number, Mach number, combustor-generated high freestream turbulence, turbulence length scale, and secondary flows just to name a few. Until computational methods are able to accurately simulate these factors affecting film cooling performance, experimental studies are required to assist engineers in designing effective film cooling schemes. The unique contribution of this research work is to experimentally and numerically investigate the effects of coolant injection rate or blowing ratio and exit Reynolds number/Mach number on the film cooling performance of a showerhead film cooled first stage turbine vane at high freestream turbulence (Tu = 16%) and engine representative exit flow conditions. The vane was arranged in a two-dimensional, linear cascade in a heated, transonic, blow-down wind tunnel. The same facility was also used to conduct experimental and numerical study of the effects of freestream turbulence, and Reynolds number on smooth (without film cooling holes) turbine blade and vane heat transfer at engine representative exit flow conditions. The showerhead film cooled vane was instrumented with single-sided platinum thin film gauges to experimentally determine the Nusselt number and film cooling effectiveness distributions over the surface from a single transient-temperature run. Showerhead film cooling was found to augment Nusselt number and reduce adiabatic wall temperature downstream of injection. The adiabatic effectiveness trend on the suction surface was also found to be influenced by a favorable pressure gradient due to Mach number and boundary layer transition region at all blowing ratio and exit Mach number conditions. The experimental study was also complimented with a 3-D CFD effort to calculate and explain adiabatic film cooling effectiveness and Nusselt number distributions downstream of the showerhead film cooling rows of a turbine vane at high freestream turbulence (Tu = 16%) and engine design exit flow condition (Mex = 0.76). The research work presents a new three-simulations technique to calculate vane surface recovery temperature, adiabatic wall temperature, and surface Nusselt number to completely characterize film cooling performance in a high speed flow. The RANS based v2-f turbulence model was used in all numerical calculations. CFD calculations performed with experiment-matched boundary conditions showed an overall good trend agreement with experimental adiabatic film cooling effectiveness and Nusselt number distributions downstream of the showerhead film cooling rows of the vane.
Ph. D.
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Meinert, Jens. "Transport und Speicherung von Energie." Saechsische Landesbibliothek- Staats- und Universitaetsbibliothek Dresden, 2008. http://nbn-resolving.de/urn:nbn:de:bsz:14-ds-1200578310250-97598.

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Neben der Umwandlung von Energie gehören deren Transport und Speicherung zu den wichtigsten ingenieurwissenschaftlichen Problemfeldern. Die optimale Ausnutzung beider Mechanismen könnte entscheidend zur Überwindung der häufig existierenden örtlichen und zeitlichen Diskrepanz zwischen Notwendigkeit und Verfügbarkeit energetischer Ressourcen beitragen. Dies steht im Mittelpunkt von Forschungsarbeiten am Graduiertenkolleg Hochleistungsbauteilkühlung und der gleichnamigen Juniorprofessur am Institut für Thermodynamik und Technische Gebäudeausrüstung der TU Dresden. Sie beschäftigen sich zum einen mit der Optimierung von Wärmetransportmechanismen vor allem zur Kühlung und zum anderen mit der Speicherung stoffgebundener Energie. Die notwendigen strömungs- und wärmetechnischen Untersuchungen sind sowohl auf experimentellem als auch auf numerischem Gebiet angesiedelt
Alongside energy conversion, the transfer and storage of energy represent two of the most important research areas in the field of engineering sciences. The optimal use of both mechanisms could make a significant contribution to overcoming the frequently encountered local and temporal discrepancy between demand and the availability of energy resources. The research within the graduate college on high-performance cooling at the Institut für Thermodynamik und Technische Gebäudeausrüstung of TU Dresden, together with that of a corresponding junior professorship, is focussed on the optimisation of heat transfer processes for cooling purposes and for the storage of thermal energy. The necessary investigations of flow and heat transfer are based on experimental as well as numerical methods
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Mohammed, Awaizulla Shareef. "Investigation of Immersion Cooled ARM-Based Computer Clusters for Low-Cost, High-Performance Computing." Thesis, University of North Texas, 2017. https://digital.library.unt.edu/ark:/67531/metadc1011866/.

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This study aimed to investigate performance of ARM-based computer clusters using two-phase immersion cooling approach, and demonstrate its potential benefits over the air-based natural and forced convection approaches. ARM-based clusters were created using Raspberry Pi model 2 and 3, a commodity-level, single-board computer. Immersion cooling mode utilized two types of dielectric liquids, HFE-7000 and HFE-7100. Experiments involved running benchmarking tests Sysbench high performance linpack (HPL), and the combination of both in order to quantify the key parameters of device junction temperature, frequency, execution time, computing performance, and energy consumption. Results indicated that the device core temperature has direct effects on the computing performance and energy consumption. In the reference, natural convection cooling mode, as the temperature raised, the cluster started to decease its operating frequency to save the internal cores from damage. This resulted in decline of computing performance and increase of execution time, further leading to increase of energy consumption. In more extreme cases, performance of the cluster dropped by 4X, while the energy consumption increased by 220%. This study therefore demonstrated that two-phase immersion cooling method with its near-isothermal, high heat transfer capability would enable fast, energy efficient, and reliable operation, particularly benefiting high performance computing applications where conventional air-based cooling methods would fail.
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Newman, Andrew Samuel. "Performance of a Showerhead and Shaped Hole Film Cooled Vane at High Freestream Turbulence and Transonic Conditions." Thesis, Virginia Tech, 2010. http://hdl.handle.net/10919/76778.

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An experimental study was performed to measure surface Nusselt number and film cooling effectiveness on a film cooled first stage nozzle guide vane using a transient thin film gauge (TFG) technique. The information presented attempts to further characterize the performance of shaped hole film cooling by taking measurements on a row of shaped holes downstream of leading edge showerhead injection on both the pressure and suction surfaces (hereafter PS and SS) of a 1st stage NGV. Tests were performed at engine representative Mach and Reynolds numbers and high inlet turbulence intensity and large length scale at the Virginia Tech Transonic Cascade facility. Three exit Mach/Reynolds number conditions were tested: 1.0/1,400,000; 0.85/1,150,000; and 0.60/850,000 where Reynolds number is based on exit conditions and vane chord. At Mach/Reynolds numbers of 1.0/1,450,000 and 0.85/1,150,000 three blowing ratio conditions were tested: BR = 1.0, 1.5, and 2.0. At a Mach/Reynolds number of 0.60/850,000, two blowing ratio conditions were tested: BR = 1.5 and 2.0. All tests were performed at inlet turbulence intensity of 12% and length scale normalized by leading edge diameter of 0.28. Film cooling effectiveness and heat transfer results compared well with previously published data, showing a marked effectiveness improvement (up to 2.5x) over the showerhead only NGV and agreement with published showerhead-shaped hole data. NHFR was shown to increase substantially (average 2.6x increase) with the addition of shaped holes, with only a small increase (average 1.6x increase) in required coolant mass flow. Heat transfer and effectiveness augmentation with increasing blowing ratio was shown on the pressure side, however the suction side was shown to be less sensitive to changing blowing ratio. Boundary layer transition location was shown to be within a consistent region on the suction side regardless of blowing ratio and exit Mach number.
Master of Science
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Franceschelli, Luca. "Cooling Performance Analysis and Design of an Instrumented Radiator in a MotoGP Wind Tunnel Model." Master's thesis, Alma Mater Studiorum - Università di Bologna, 2021.

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The present thesis work was developed in collaboration with the Ducati Corse Aerodynamic Department. It is focused on the measurement system employed on the MotoGP Wind Tunnel model in order to evaluate the cooling performances at the radiators. As first, an analysis of the current methodology is conducted. Based on the arrangement of hybrid-Kiel probes behind the radiators, it was observed that an improvement in the calibration procedure is required in order to account for inter-probe and support frame interference. Furthermore, a correlation process with the CFD simulation was carried out. A good agreement in trend with CFD results was displayed, despite a low accuracy. The need for higher spatial resolution was stated. In order to update the CFD implementation of the actual water radiator, the latter has been characterized in terms of pressure drop on a dedicate radiator test bench, provided by Dallara Automobili. A suitable convergent frame has been designed for the purpose. Finally, a new methodology for cooling performance evaluation was developed and calibrated. The method exploits a set of static and Kiel probes in a dummy radiator core. An honeycomb structure and a perforated plate are implemented to reproduce the real radiator behaviour. Experiments have been performed with half-radiator equipped with the new set up and the other half instrumented with Pitot tubes, showing good agreement between the two probe-types. A set of plates have been characterized. It allowed also to highlight the relevance of the solid part distribution - and related holes' diameter - on the pressure drop and the effect on the measured pressures from the probes.
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Books on the topic "High-performance cooling"

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United States. National Aeronautics and Space Administration., ed. Performance analysis of radiation cooled DC transmission lines for high power space systems. [Washington, DC]: National Aeronautics and Space Administration, 1985.

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United States. National Aeronautics and Space Administration., ed. Effects of turbine cooling assumptions on performance and sizing of high-speed civil transport. [Washington, DC]: National Aeronautics and Space Administration, 1992.

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1934-, Hoffman Joe D., and United States. National Aeronautics and Space Administration., eds. The prediction of nozzle performance and heat transfer in hydrogen/oxygen rocket engines with transpiration cooling, film cooling, and high area ratios. [Washington, DC]: National Aeronautics and Space Administration, 1994.

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1934-, Hoffman Joe D., and United States. National Aeronautics and Space Administration., eds. The prediction of nozzle performance and heat transfer in hydrogen/oxygen rocket engines with transpiration cooling, film cooling, and high area ratios. [Washington, DC]: National Aeronautics and Space Administration, 1994.

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Validation of high aspect ratio cooling in a 89 kN (20,000 lb[sub f]) thrust combustion chamber. [Washington, DC]: National Aeronautics and Space Administration, 1996.

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Mavrigian, Mike. High Performance Fasteners & Plumbing: A Guide to Nuts, Bolts, Fuel, Brake, Oil & Coolant Lines, Hoses, Clamps, RacingHardware and Plumbing Techniques. HP Trade, 2008.

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Heat transfer and pressure drop performance of a finned-tube heat exchanger proposed for use in the NASA Lewis altitude wind tunnel. [Cleveland, Ohio: National Aeronautics and Space Administration, Lewis Research Center, 1985.

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Book chapters on the topic "High-performance cooling"

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Chu, R. C., and R. E. Simons. "Cooling Technology for High Performance Computers: Design Applications." In Cooling of Electronic Systems, 71–95. Dordrecht: Springer Netherlands, 1994. http://dx.doi.org/10.1007/978-94-011-1090-7_4.

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Tang, Jie, Yu Feng Chen, Ji Guo Sun, Hua Wang, and Hai Lin Liu. "Transpirational Performance of Oriented Porous SiC Transpiration Cooling Materials." In High-Performance Ceramics V, 837–39. Stafa: Trans Tech Publications Ltd., 2008. http://dx.doi.org/10.4028/0-87849-473-1.837.

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Incropera, F. P., and S. Ramadhyani. "Single-Phase, Liquid Jet Impingement Cooling of High-Performance Chips." In Cooling of Electronic Systems, 457–506. Dordrecht: Springer Netherlands, 1994. http://dx.doi.org/10.1007/978-94-011-1090-7_21.

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Chu, R. C., and R. E. Simons. "Cooling Technology for High Performance Computers: IBM Sponsored University Research." In Cooling of Electronic Systems, 97–122. Dordrecht: Springer Netherlands, 1994. http://dx.doi.org/10.1007/978-94-011-1090-7_5.

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Ou, Meigui, Song Zhang, Hongchao Song, and Yilong Liang. "Effects of Different Cooling Methods on Microstructure and Mechanical Properties of TC4 Alloy." In High Performance Structural Materials, 539–47. Singapore: Springer Singapore, 2018. http://dx.doi.org/10.1007/978-981-13-0104-9_57.

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Levin, Ilya, Alexey Dordopulo, Alexander Fedorov, and Yuriy Doronchenko. "High-Performance Reconfigurable Computer Systems with Immersion Cooling." In Communications in Computer and Information Science, 62–76. Cham: Springer International Publishing, 2018. http://dx.doi.org/10.1007/978-3-319-99673-8_5.

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Wang, Junqiang, Guanmei Niu, Zhongyu Yang, Hailong Cao, and Cheng Liu. "Influence of Cooling Intensity Difference Between Upper and Lower Surface to the Residual Stress Distribution of 7050 Aluminum Alloy Plates." In High Performance Structural Materials, 221–33. Singapore: Springer Singapore, 2018. http://dx.doi.org/10.1007/978-981-13-0104-9_24.

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Peter, Johannes M. F., and Markus J. Kloker. "Numerical Simulation of Film Cooling in Supersonic Flow." In Notes on Numerical Fluid Mechanics and Multidisciplinary Design, 79–95. Cham: Springer International Publishing, 2020. http://dx.doi.org/10.1007/978-3-030-53847-7_5.

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Abstract High-order direct numerical simulations of film cooling by tangentially blowing cool helium at supersonic speeds into a hot turbulent boundary-layer flow of steam (gaseous H2O) at a free stream Mach number of 3.3 are presented. The stagnation temperature of the hot gas is much larger than that of the coolant flow, which is injected from a vertical slot of height s in a backward-facing step. The influence of the coolant mass flow rate is investigated by varying the blowing ratio F or the injection height s at kept cooling-gas temperature and Mach number. A variation of the coolant Mach number shows no significant influence. In the canonical baseline cases all walls are treated as adiabatic, and the investigation of a strongly cooled wall up to the blowing position, resembling regenerative wall cooling present in a rocket engine, shows a strong influence on the flow field. No significant influence of the lip thickness on the cooling performance is found. Cooling correlations are examined, and a cooling-effectiveness comparison between tangential and wall-normal blowing is performed.
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Rossi, Maurizio, Luca Rizzon, Matteo Fait, Roberto Passerone, and Davide Brunelli. "Self-powered Active Cooling System for High Performance Processors." In Lecture Notes in Electrical Engineering, 25–33. Cham: Springer International Publishing, 2015. http://dx.doi.org/10.1007/978-3-319-20227-3_4.

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Gräf, Lars, and Leonhard Kleiser. "Large-Eddy Simulation of Double-Row Compound-Angle Film-Cooling: Computational Aspects." In High Performance Computing on Vector Systems 2010, 185–96. Berlin, Heidelberg: Springer Berlin Heidelberg, 2010. http://dx.doi.org/10.1007/978-3-642-11851-7_14.

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Conference papers on the topic "High-performance cooling"

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Zhornik, V. A., Yu A. Prokopenko, A. A. Rybinskaya, and P. A. Savochka. "Ring-shaped crack propagation in a cylinder under nonsteady cooling." In HIGH PERFORMANCE STRUCTURES AND MATERIALS 2006. Southampton, UK: WIT Press, 2006. http://dx.doi.org/10.2495/hpsm06051.

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Acun, Bilge, Eun Kyung Lee, Yoonho Park, and Laxmikant V. Kale. "Support for Power Efficient Proactive Cooling Mechanisms." In 2017 IEEE 24th International Conference on High Performance Computing (HiPC). IEEE, 2017. http://dx.doi.org/10.1109/hipc.2017.00020.

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Nemec, Patrik, and Milan Malcho. "Experimental evaluation of cooling efficiency of the high performance cooling device." In THE APPLICATION OF EXPERIMENTAL AND NUMERICAL METHODS IN FLUID MECHANICS AND ENERGY 2016: XX. Anniversary of International Scientific Conference. AIP Publishing LLC, 2016. http://dx.doi.org/10.1063/1.4953729.

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Buttay, Cyril, Jeremy Rashid, C. Mark Johnson, Peter Ireland, Florin Udrea, Gehan Amaratunga, and Rajesh K. Malhan. "High performance cooling system for automotive inverters." In 2007 European Conference on Power Electronics and Applications. IEEE, 2007. http://dx.doi.org/10.1109/epe.2007.4417363.

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Nonaka, Hirotaka, Hirotoshi Terada, Tomonori Nakamura, Hiroyuki Matsuura, and Akihiro Nakamura. "Cooling mechanism for high performance device analysis." In 2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA). IEEE, 2020. http://dx.doi.org/10.1109/ipfa49335.2020.9260887.

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Hochkönig, Manfred, and Rauser Michael. "Cooling System Layout for High Performance Cars." In International Congress & Exposition. 400 Commonwealth Drive, Warrendale, PA, United States: SAE International, 1992. http://dx.doi.org/10.4271/920789.

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Kim, Jungsoo, Martino Ruggiero, and David Atienza. "Free cooling-aware dynamic power management for green datacenters." In 2012 International Conference on High Performance Computing & Simulation (HPCS). IEEE, 2012. http://dx.doi.org/10.1109/hpcsim.2012.6266903.

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Ditri, John, Michael K. McNulty, and Suzanne Igoe. "S3-P10: Embedded microfluidic cooling of high heat flux electronic components." In 2014 Lester Eastman Conference on High Performance Devices (LEC). IEEE, 2014. http://dx.doi.org/10.1109/lec.2014.6951565.

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Zobel, Werner, Michael Ehlers, and Bernhard Stephan. "High Performance Compact Cooling System CCS for Trucks." In 1995 Vehicle Thermal Management Systems Conference and Exhibition. 400 Commonwealth Drive, Warrendale, PA, United States: SAE International, 1997. http://dx.doi.org/10.4271/971826.

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Colgan, E. G., B. Furman, M. Gaynes, N. LaBianca, J. H. Magerlein, R. Polastre, R. Bezama, K. Marston, and R. Schmidt. "High Performance and Sub-Ambient Silicon Microchannel Cooling." In ASME 4th International Conference on Nanochannels, Microchannels, and Minichannels. ASMEDC, 2006. http://dx.doi.org/10.1115/icnmm2006-96094.

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High performance single-phase Si microchannel coolers have been designed and characterized in single chip modules in a laboratory environment using either water at 22°C or a fluorinated fluid at temperatures between 20 and −40°C as the coolant. Compared to our previous work, key performance improvements were achieved through reduced channel pitch (from 75 to 60 microns), thinned channel bases (from 425 to 200 microns of Si), improved thermal interface materials, and a thinned thermal test chip (from 725 to 400 microns of Si). With multiple heat exchanger zones and 60 micron pitch microchannels with a water flow rate of 1.25 lpm, an average unit thermal resistance of 15.9 C-mm2/W between the chip surface and the inlet cooling water was demonstrated for a Si microchannel cooler attached to a chip with Ag epoxy. Replacing the Ag epoxy layer with an In solder layer reduced the unit thermal resistance to 12.0 C-mm2/W. Using a fluorinated fluid with an inlet temperature of −30°C and 60 micron pitch microchannels with an Ag epoxy thermal interface layer, the average unit thermal resistance was 25.6 C-mm2/W. This fell to 22.6 C-mm2/W with an In thermal interface layer. Cooling >500 W/cm2 was demonstrated with water. Using a fluorinated fluid with an inlet temperature of −30°C, a chip with a power density of 270 W/cm2 was cooled to an average chip surface temperature of 35°C. Results using both water and a fluorinated fluid are presented for a range of Si microchannel designs with a channel pitch from 60 to 100 microns.
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Reports on the topic "High-performance cooling"

1

Sickinger, David E., David Martinez, and Bob Bolz. Energy Performance Evaluation of Aquila's Aquarius Fixed Cold Plate Cooling System at NREL's High Performance Computing Center. Office of Scientific and Technical Information (OSTI), February 2019. http://dx.doi.org/10.2172/1497991.

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Conklin, J. C. Modeling and performance of the MHTGR (Modular High-Temperature Gas-Cooled Reactor) reactor cavity cooling system. Office of Scientific and Technical Information (OSTI), April 1990. http://dx.doi.org/10.2172/7013277.

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