Academic literature on the topic 'IEC 61000-4-4'
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Journal articles on the topic "IEC 61000-4-4"
Musolino, F., and F. Fiori. "Modeling the IEC 61000-4-4 EFT Injection Clamp." IEEE Transactions on Electromagnetic Compatibility 50, no. 4 (November 2008): 869–75. http://dx.doi.org/10.1109/temc.2008.2004603.
Full textKim, Seok-Gon, Chang-Ho Park, Dong-Yeol Shin, Tae-Seung Song, and Yong-Sung Choi. "A Study About the Application Feasibility of EMS IEC 61000-4-6 Test Standard on Electronic Power Meter." Transactions of The Korean Institute of Electrical Engineers 60, no. 6 (June 1, 2011): 1261–67. http://dx.doi.org/10.5370/kiee.2011.60.6.1261.
Full textJavor, Vesna. "New function for representing IEC 61000-4-2 standard electrostatic discharge current." Facta universitatis - series: Electronics and Energetics 27, no. 4 (2014): 509–20. http://dx.doi.org/10.2298/fuee1404509j.
Full textLodetti, Stefano, Izaskun Azcarate, José Gutiérrez, Luis Leturiondo, Koldo Redondo, Purificación Sáiz, Julio Melero, and Jorge Bruna. "Flicker of Modern Lighting Technologies Due to Rapid Voltage Changes." Energies 12, no. 5 (March 5, 2019): 865. http://dx.doi.org/10.3390/en12050865.
Full textWang, Yize, Yuan Wang, Guangyi Lu, Jian Cao, and Xing Zhang. "A novel TLP-based method to deliver IEC 61000-4-2 ESD stress." IEICE Electronics Express 14, no. 9 (2017): 20170163. http://dx.doi.org/10.1587/elex.14.20170163.
Full textGarcía-Fernández, M. A., C. Decroze, D. Carsenat, N. Arsalane, and G. Andrieu. "On the Relationship between Field Amplitude Distribution, Its Maxima Distribution, and Field Uniformity inside a Mode-Stirred Reverberation Chamber." International Journal of Antennas and Propagation 2012 (2012): 1–7. http://dx.doi.org/10.1155/2012/483287.
Full textYuan, Qingyun, Shanghe Liu, Yongwei Sun, and Xijun Zhang. "Causes of the ESD immunity testing problems in the IEC 61000-4-2 standard." Journal of Physics: Conference Series 418 (March 22, 2013): 012049. http://dx.doi.org/10.1088/1742-6596/418/1/012049.
Full textMarathe, Shubhankar, Giorgi Maghlakelidze, Hossein Rezaei, David Pommerenke, and Mike Hertz. "Software-Assisted Detection Methods for Secondary ESD Discharge During IEC 61000-4-2 Testing." IEEE Transactions on Electromagnetic Compatibility 60, no. 4 (August 2018): 1129–36. http://dx.doi.org/10.1109/temc.2018.2791284.
Full textBurghardt, Felix, and Heyno Garbe. "Validation of GTEM Cells According to IEC 61000-4-20: Real World Field Measurements." IEEE Letters on Electromagnetic Compatibility Practice and Applications 3, no. 3 (September 2021): 88–91. http://dx.doi.org/10.1109/lemcpa.2021.3097076.
Full textHui, Jin, Honggeng Yang, Wilsun Xu, and Yamei Liu. "A Method to Improve the Interharmonic Grouping Scheme Adopted by IEC Standard 61000-4-7." IEEE Transactions on Power Delivery 27, no. 2 (April 2012): 971–79. http://dx.doi.org/10.1109/tpwrd.2012.2183394.
Full textDissertations / Theses on the topic "IEC 61000-4-4"
Monteiro, Henrique Luis Moreira. "Cálculo de harmônicos e inter-harmônicos baseado na norma IEC 61000-4-7." Universidade Federal de Juiz de Fora, 2014. https://repositorio.ufjf.br/jspui/handle/ufjf/703.
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CAPES - Coordenação de Aperfeiçoamento de Pessoal de Nível Superior
O cálculo de componentes harmônicos e inter-harmônicos é efetuado geralmente através do cálculo da FFT (Fast Fourier Transform). Porém, com a utilização desta ferramenta, alguns problemas podem ser ocasionados de modo que a energia do sinal original se espalhe ao longo do espectro de frequência. Isto proporciona o surgimento de componentes que na realidade não existem. Este fenômeno é definido como espalhamento espectral e acontece pelo fato de haver algum componente interharmônico fora da resolução da frequência da FFT ou pelo fato do sinal ser amostrado de forma assíncrona. Para o primeiro caso, utiliza-se a norma IEC 61000-4-7 que apresenta uma abordagem de grupos e subgrupos a fim de englobar a energia dos interharmônicos espalhada ao longo do espectro de frequência. Quanto ao sinal amostrado de forma assíncrona, são apresentados métodos de interpolação no domínio da frequência e no domínio do tempo para corrigir o resultado obtido através da FFT. Dessa forma, este trabalho faz uma abordagem da norma IEC e de cada método de interpolação, comparando-os com intuito de se conhecer o melhor método a ser aplicado para o cálculo dos componentes contidos no sinal, de acordo com a norma IEC 61000-4-7.
The harmonic and interharmonic components calculation is usually performance by using the FFT ( Fast Fourier Transform). However, through the use of this tool, some problems may arise due the fact that the original signal energy can spread over the frequency spectrum, promoting the appearance of not actually existing components. This phenomenon is defined as spectral leakage and happens because either there is some interharmonic component whose frequency does not match the frequency resolution of the FFT, or because the signal is sampled asynchronously. In the first case, IEC 61000-4-7 provides the groups and subgroups approaches to include the interharmonic energy spreads over the frequency spectrum. In the case of asynchronous sampled rate, interpolation methods are presented both in the frequency domain and in time domain for correcting the result obtained through the FFT. Thus, this work addresses IEC approach and presents how the time and frequency interpolation can be used to improve the IEC criteria. The interpolation methods are compared in order to find the best method to be applied for the calculation of the components contained in the signal, in accordance with IEC 61000-4-7.
Bacher, Yann. "Étude et modélisation des perturbations produites au sein des microcontrôleurs STM32 soumis à des stress en impulsion." Thesis, Université Côte d'Azur (ComUE), 2017. http://www.theses.fr/2017AZUR4021/document.
Full textThe reliability of the microcontrollers is crucial considering their massive use in numerous domains, especially in severe environments. Therefore, the robustness in the electromagnetic disturbances, in particular for the power supply network, is a major development, whether it is to acquire a comparative advantage on the market, or simply to assure the goods and people safety. Therefore, we studied the Fast Transient Burst test of integrated circuits, as defined by the IEC 61000-4-4 standard. The specific propagation mechanisms of the disturbance in common mode are highlighted, as well as their conversion in differential mode. Several measurements methods, among which certain novel, were developed to validate this conversion, as well as the propagation modes. Based on this, the power distribution network was particularly studied and its influence on the robustness of the circuit was highlighted. Finally, this work opens new perspectives of improvement of the microcontrollers’ robustness, for this kind of aggression, and thus their reliability
Giraldo, Sandra. "Étude de la robustesse d'amplificateurs embarqués dans des applications portables soumis à des décharges électrostatiques (ESD) au niveau système." Toulouse 3, 2013. http://thesesups.ups-tlse.fr/2189/.
Full textWith improvement in electronic technology shrinking, electronic components are increasingly becoming sensitive to ElectroStatic Discharge (ESD). Nowadays, the reliability of integrated circuits in the manufacturing field are guaranteed by a set of standards that define levels of robustness. Nevertheless the protection strategies implemented in integrated circuits, designed to meet these standards, are not always enough to ensure the robustness of the components in their final application. The new reliability problems are not well understood, given the complexity of the phenomena involved in real systems in operation. Taking into account these facts, we can question the effectiveness of the strategies used to protect against " classical ESD " and system-type stresses. All the work presented in this thesis aims to improve the robustness with respect to these new requirements, in the case study of analog components dedicated to portable applications (telephony, multimedia). Starting from a concrete case, for which there is a large difference in the system ESD robustness between the biased and unbiased product, we will present the various results of analysis (failure analysis, electrical characterization by impulse like TLP VFTLP, SPICE-type simulations) that led us to the proposal of an integrated security solution that meets the requirements
Diatta, Marianne Amemagne. "Fiabilité des diodes de protection ESD soumises à des décharges électrostatiques répétitives." Toulouse 3, 2012. http://thesesups.ups-tlse.fr/4126/.
Full textThe sensitiveness of components towards electrostatic discharges (ESD) remains a key point in the frame of shrinked technologies. Indeed, industrial developments associated to a harsh environment for more and more smart electronic applications lead to aggressive reliability requirements by customer. Hence, specifications initially dedicated to electronic systems extends to integrated circuits then discrete components. In fact, customers require, in addition to the 15kV robustness for IEC 61000-4-2 norm, to withstand ESD reliability level by specifying immunity of the integrated circuit after applying 1000 discharges of 15kV level. To guarantee this ESD reliability level, especially in a repetitive mode, the methodology developed in this study consists in the understanding of failure mechanisms through physical and electrical characterizations associated to electro-thermal simulations. In integrated circuits, bidirectional diodes often localized at the input and output ensure a protection towards ESD that could occurs during system lifetime. In this context, the study particularly focuses on this discrete protection diode. Physical investigations on repetitive ESD failures describe the failure mechanism from structural defect creation to destruction. Moreover, gathering electro-thermal simulations to experimental results confirms appearance of electro-thermo-migration physical phenomenon during repetitive ESD. As a conclusion, removing the structural defects through a metal barrier considerably improves the ESD endurance and fully satisfy customer requirements while preserving intrinsic performances
Giraldo, Torres Sandra. "Etude de la robustesse d'amplificateurs embarqués dans des applications portables soumis à des décharges électrostatiques (ESD) au niveau système." Phd thesis, Université Paul Sabatier - Toulouse III, 2013. http://tel.archives-ouvertes.fr/tel-00849735.
Full textJurka, Tomáš. "Nestandardní testy elektroměrů." Master's thesis, Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií, 2015. http://www.nusl.cz/ntk/nusl-221217.
Full textYi-Ying, Chen, and 陳怡縈. "Implementation of IEC 61000-4-15 Flickermeter Based on DSP." Thesis, 2013. http://ndltd.ncl.edu.tw/handle/9d9g62.
Full text國立中正大學
電機工程研究所
101
Voltage fluctuation can be regarded as the primary cause of flicker and is the time variation of the reactive power component of fluctuating loads. Such loads typically include, for example, arc furnaces, rolling mill drives, and welders. Moreover, flicker may result in the luminance variations of lamps, which can cause uncomfortable and irritative perception or even give rise to vision problems. Many countries have established or adopted the regulation standards to limit the flicker levels. Currently, IEC flickermeter standard is the one used most widely. However, is utilized in Taiwan to evaluate the flicker. With the global trend, the implementation of IEC standard is necessary and is with indices of Pst and Plt that are calculated based on statistical analysis to estimate the flicker severity. IEC Standard 61000-4-15 gives functional and design specifications for a flickermeter which is the simulation process based on the response of human’s visual perception to the fluctuation of light. The simulation process, which includes square multiplier, band-pass filter, weighting filter, first-order smoothing filter and statistic calculation of instantaneous flicker level curve (IFL), can effectively estimates Pst value to assess the severity of voltage flicker. In order to verify the digital measurement scheme of IEC 61000-4-15, a DSP-based digital flickermeter is developed. According to the functions and design criteria suggested by IEC, an analog model of the flickermeter is developed and simulated with MATLAB, Simulink, and Code Composer Studio. Finally, the developed flickermeter will be applied to perform actual measurement based on IEC Standard 61000-4-15 test procedures to validate its usefulness.
Fang, Chin-Hsien, and 方進賢. "Design of Power Virtual Harmonic Analyzer Based on IEC Std. 61000-4-7." Thesis, 2012. http://ndltd.ncl.edu.tw/handle/01537492290699139781.
Full text亞洲大學
光電與通訊學系碩士班
100
With the widespread use of nonlinear loads in the power system, the problems associated with harmonics are of great concern. Harmonics would cause extra power losses in the transmission system. For the general end users, it may only cause the short-term power interruption in the electrical apparatus. But for the large electrical equipments, harmonics could lead to fault and even cause economical problem and decrease the life of power devices. Therefore, the detection of power quality is a noticeable issue. This paper intends to develop a harmonic/interharmonic virtual instrument based on the adaptive linear neural network (ADALINE) technique for accurately measuring the harmonic and interharmonic currents generated by the nonlinear loads in the power systems. With the advantages of simple structure and efficient computation in ADALINE, the design of virtual instrument is proposed to mitigate the leakage and picket-fence effects came from the direct usage of ADALINE according to the requirements of IEC Std. 61000-4-7. Finally, the performance of proposed method can be verified through a simple test system implemented with LabVIEW program.
Book chapters on the topic "IEC 61000-4-4"
"IEC 61000-4-2." In ESD Testing, 130–46. Chichester, UK: John Wiley & Sons Ltd, 2016. http://dx.doi.org/10.1002/9781118707128.ch7.
Full text"IEC 61000-4-5." In ESD Testing, 163–73. Chichester, UK: John Wiley & Sons Ltd, 2016. http://dx.doi.org/10.1002/9781118707128.ch9.
Full textConference papers on the topic "IEC 61000-4-4"
Kunkel, H., and S. Klezar. "Electric fast transients (EFT): the revision of IEC 61000-4-4." In 8th International Conference on Electromagnetic Interference and Compatibility. IEEE, 2003. http://dx.doi.org/10.1109/icemic.2003.238091.
Full textChen, Y. Y., G. W. Chang, and S. C. Lin. "A digital implementation of IEC 61000-4-15 flickermeter." In 2015 IEEE Power & Energy Society General Meeting. IEEE, 2015. http://dx.doi.org/10.1109/pesgm.2015.7286254.
Full textXian, Zhang, Wu Liaolan, Wang Long, and Lu Minhua. "Differences in Specifications of Field Uniformity for GTEM Cell between the Standard IEC 61000-4-3: 2002 and IEC 61000-4-20: 2003." In 2006 4th Asia-Pacific Conference on Environmental Electromagnetics. IEEE, 2006. http://dx.doi.org/10.1109/ceem.2006.258069.
Full textSlezingr, J., and J. Drapela. "Verification of flickermeters under new edition of IEC 61000-4-15." In 2011 IEEE PES PowerTech - Trondheim. IEEE, 2011. http://dx.doi.org/10.1109/ptc.2011.6019416.
Full textBroshi, Amir. "Monitoring Power Quality beyond EN 50160 and IEC 61000-4-30." In 2007 IEEE Power Engineering Society Conference and Exposition in Africa (PowerAfrica 2007). IEEE, 2007. http://dx.doi.org/10.1109/pesafr.2007.4498120.
Full textBroshi, Amir. "Monitoring power quality beyond EN 50160 and IEC 61000-4-30." In 9th International Conference - Electrical Power Quality and Utilisation. IEEE, 2007. http://dx.doi.org/10.1109/epqu.2007.4424114.
Full textHui, Jin, Honggeng Yang, Wilsun Xu, and Yamei Liu. "An improved interharmonic grouping scheme based on IEC 61000-4-7." In 2012 IEEE 15th International Conference on Harmonics and Quality of Power (ICHQP). IEEE, 2012. http://dx.doi.org/10.1109/ichqp.2012.6381213.
Full textBroshi, Amir. "Monitoring Power Quality beyond en 50160 AND IEC 61000-4-30." In Exposition. IEEE, 2008. http://dx.doi.org/10.1109/tdc.2008.4517297.
Full textHeidemann, M., and H. Garbe. "Using TEM waveguides according to the new IEC 61000-4-20." In 2003 IEEE International Symposium on Electromagnetic Compatibility, 2003. EMC '03. IEEE, 2003. http://dx.doi.org/10.1109/icsmc2.2003.1428290.
Full textMaloney, Timothy J. "Versatile models and expanded application of the IEC 61000-4-2 test." In 2015 37th Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD). IEEE, 2015. http://dx.doi.org/10.1109/eosesd.2015.7314788.
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