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Journal articles on the topic 'IMC structure'

Author: Grafiati

Published: 3 June 2025

Last updated: 31 July 2025

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1

Suay, Francisco. "Integrated marketing communications. The Coca-Cola Spain IMC model." Revista de Estudios Empresariales. Segunda Época, no. 2 (December 22, 2020): 18–31. http://dx.doi.org/10.17561/ree.v2020n2.2.

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In the development of the Integrated Marketing Communications (IMC), in these more than 30 years of evolution, multiple studies have been developed to understand the concept, its dimensions as well as the implication for consumers and companies. In this article we review the concept of the IMC taking a theoretical perspective and delve into each of its components. To complete the theoretical review, we analyze the dimensions that make up the IMC. One of the aspects that has received poor attention by the literature has been the involvement of consumers and how companies have adapte

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Hsueh, Hao-Wen, Fei-Yi Hung, Truan-Sheng Lui, Li-Hui Chen, and Kuan-Jen Chen. "Intermetallic Phase on the Interface of Ag-Au-Pd/Al Structure." Advances in Materials Science and Engineering 2014 (2014): 1–6. http://dx.doi.org/10.1155/2014/925768.

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Three wires, Au, Cu, and Ag-Au-Pd, were bonded on an Al pad, inducing IMC growth by a 155 hr high temperature storage (HTS) so that the electrical resistance was increased and critical fusing current density (CFCD) decreased. Observations of the Ag-Au-Pd wire after HTS (0–1000 hr) indicated that IMC between the Ag-Au-Pd wire and Al Pad was divided into three layers: Ag2Al layers above and below the bonding interface and a polycrystal thin layer above the total IMC. A high percentage of Pd and Au existed in this 200 nm thin layer, and could suppress Al diffusion into the Ag matrix to inhibit IM

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Kim, Sung-Gun, Yu-Jen Chen, Liliana Falzon, Jean Baum, and Masayori Inouye. "Mimicking cotranslational folding of prosubtilisin E in vitro." Journal of Biochemistry 167, no. 5 (2020): 473–82. http://dx.doi.org/10.1093/jb/mvaa004.

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Abstract Nascent polypeptides are synthesized on ribosomes starting at the N-terminus and simultaneously begin to fold during translation. We constructed N-terminal fragments of prosubtilisin E containing an intramolecular chaperone (IMC) at N-terminus to mimic cotranslational folding intermediates of prosubtilisin. The IMC-fragments of prosubtilisin exhibited progressive enhancement of their secondary structures and thermostabilities with increasing polypeptide length. However, even the largest IMC-fragment with 72 residues truncated from the C-terminus behaved as a molten globule, indicating

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Wang, Xiaoli, Chunyu Lv, Ying Guo, and Shuiqiao Yuan. "Mitochondria Associated Germinal Structures in Spermatogenesis: piRNA Pathway Regulation and Beyond." Cells 9, no. 2 (2020): 399. http://dx.doi.org/10.3390/cells9020399.

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Multiple specific granular structures are present in the cytoplasm of germ cells, termed nuage, which are electron-dense, non-membranous, close to mitochondria and/or nuclei, variant size yielding to different compartments harboring different components, including intermitochondrial cement (IMC), piP-body, and chromatoid body (CB). Since mitochondria exhibit different morphology and topographical arrangements to accommodate specific needs during spermatogenesis, the distribution of mitochondria-associated nuage is also dynamic. The most relevant nuage structure with mitochondria is IMC, also c

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Ren, Hang, Tao Hu, Yu Song, Hui Sun, Bo Liu, and Ming Gao. "An Improved Electronic Image Motion Compensation (IMC) Method of Aerial Full-Frame-Type Area Array CCD Camera Based on the CCD Multiphase Structure and Hardware Implementation." Sensors 18, no. 8 (2018): 2632. http://dx.doi.org/10.3390/s18082632.

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In this paper, the performance of the electronic conventional image motion compensation (IMC) method based on the time delay integration (TDI) mode was analyzed using the optical injection formula of charge coupled devices (CCDs). The result shows that the non-synchronous effect of charge packet transfer caused by line-by-line transfer during exposure makes the compensated image dissatisfying. Then an improved electronic IMC method based on the CCD multiphase structure was proposed. In this method, a series of proper driving clocks were applied to drive the charge packet to move electrode-by-e

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Wang, Chao-Hong, and Che-Yang Lin. "Interfacial Behavior During Reactions Between Sn and Electroplated Co–Zn Alloys." Materials 18, no. 12 (2025): 2680. https://doi.org/10.3390/ma18122680.

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This study investigates the electroplating characteristics of Co-Zn alloy coatings with varying Zn contents (0.55 wt.%~8.8 wt.%) and their influence on intermetallic compound (IMC) formation during reactions with Sn solder. Co-Zn alloy coatings were successfully fabricated by electroplating using cobalt plating solutions with different concentrations of zinc sulfate. The results reveal anomalous co-deposition behavior, where the less noble Zn preferentially deposits over Co. Surface morphologies and microstructures evolve significantly with increasing Zn content, transitioning from columnar to

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Li, Hui, and Bin Lu. "Effect of Adding Er on Interfacial Reactions between Sn-3.0Ag-0.5Cu Solder and Cu Substrate." Advanced Materials Research 136 (October 2010): 28–32. http://dx.doi.org/10.4028/www.scientific.net/amr.136.28.

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The formation and the growth of Cu-Sn intermetallic compound (IMC) layer at the interface between Sn-3.0Ag-0.5Cu-xEr(x=0, 0.1) solder and Cu substrate during soldering and aging were studied. The results show that Cu6Sn5 IMC is observed at the interface between solder and Cu substrate in all conditions. After aging for 120 h, the Cu3Sn IMC is then obtained. With increasing aging time, the scalloped Cu6Sn5 structure changes to a plate structure. The Cu3Sn film always forms with a relatively planar interface. By adding a small amount of the rare earth element Er (only 0.1%, mass fraction) into t

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8

Mai, Nghia Thi, Kou Yamada, Iwanori Murakami, et al. "A Design Method for Internal Model Controllers for Multiple-Input/Multiple-Output Unstable Plant." Key Engineering Materials 497 (December 2011): 210–20. http://dx.doi.org/10.4028/www.scientific.net/kem.497.210.

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In the present paper, we examine the parameterization of all stabilizing Internal Model Controllers(IMC) for multiple-input/multiple-output unstable plant. The parameterization problem is theproblem in which all stabilizing controllers for a plant are sought [1, 2, 3, 4, 5, 6, 7, 8, 9]. Since this parameterizationcan successfully search for all proper stabilizing controllers, it is used as a tool for manycontrol problems. However, there exists a problem whether or not stabilizing controllers for unstableplant can be represented by IMC structure. The IMC structure has advantages such as closed-

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9

Yakubov, M., I. Каrimov, and S. Мuminov. "OPTIMIZING THE STRUCTURE OF THE INFORMATION AND MEASUREMENT SYSTEM FOR DETECTING TRACTION POWER SUPPLY FACILITIES ON THE BASIS OF RELIABILITY." Journal of Science and Innovative Development 4, no. 6 (2021): 37–45. http://dx.doi.org/10.36522/2181-9637-2021-6-5.

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The paper discusses reliability of a multi-level information-measuring system (IMC), which ensures monitoring of technical condition of technological facilities and traction power supply devices and their diagnostics, which is essential for quality of control of its modes. The technical condition of the IMC is assessed using probability vectors of its condition by applying a linear graph that allows defining the time of failure and other reliability measures individually for each level and the IMC as a whole. Analytically and graphically, it is shown that the failure time of the IMC is highly

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10

Berthiol, Florian, Joseph Boissieras, Hugues Bonnet, et al. "Novel Synthesis of IMC-48 and Affinity Evaluation with Different i-Motif DNA Sequences." Molecules 28, no. 2 (2023): 682. http://dx.doi.org/10.3390/molecules28020682.

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During the last decade, the evidence for the biological relevance of i-motif DNA (i-DNA) has been accumulated. However, relatively few molecules were reported to interact with i-DNA, and a controversy concerning their binding mode, affinity, and selectivity persists in the literature. In this context, the cholestane derivative IMC-48 has been reported to modulate bcl-2 gene expression by stabilizing an i-motif structure in its promoter. In the present contribution, we report on a novel, more straightforward, synthesis of IMC-48 requiring fewer steps compared to the previous approach. Furthermo

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11

Jin, Yuhua, Bo Wu, Xuetian Lu, Yichu Xing, and Zizheng Zhou. "Effect of Post-Weld Annealing on Microstructure and Growth Behavior of Copper/Aluminum Friction Stir Welded Joint." Materials 13, no. 20 (2020): 4591. http://dx.doi.org/10.3390/ma13204591.

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Friction stir welding of 1016 pure aluminum and T2 pure copper with 2 mm thickness was carried out in the form of lap welding of copper on the upper side and aluminum on the lower side. The growth of interface microstructure between 1016 pure aluminum and T2 pure copper welded by friction stir welding was studied. The growth mechanism of the intermetallic compound (IMC) layer in the Cu-Al lap joint was revealed by annealing at 300, 350, 400 °C. The intermetallic compound (IMC) layer in the lap joint grows again during annealing, and only the original structure of the intermetallic compound (IM

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12

López, M. J., J. Terrón, and M. Haro. "Robust Roll Motion Regulator Based on IMC Structure." IFAC Proceedings Volumes 29, no. 1 (1996): 984–89. http://dx.doi.org/10.1016/s1474-6670(17)57792-7.

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13

Lee, Sanghyun, and Youngmin Kim. "Charge-Domain Static Random Access Memory-Based In-Memory Computing with Low-Cost Multiply-and-Accumulate Operation and Energy-Efficient 7-Bit Hybrid Analog-to-Digital Converter." Electronics 13, no. 3 (2024): 666. http://dx.doi.org/10.3390/electronics13030666.

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This study presents a charge-domain SRAM-based in-memory computing (IMC) architecture. The multiply-and-accumulate (MAC) operation in the IMC structure is divided into current- and charge-domain methods. Current-domain IMC has high-power consumption and poor linearity. Charge-domain IMC has reduced variability compared with current-domain IMCs, achieving higher linearity and enabling energy-efficient operation with fewer dynamic current paths. The proposed IMC structure uses a 9T1C bitcell considering the trade-off between the bitcell area and the threshold voltage drop by an NMOS access trans

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14

Du, Chang Hua, Hai Jian Zhao, Li Meng Yin, and Fang Chen. "Formation and Evolution of Intermetallic Compounds in Solder Joint for Electronic Interconnect." Materials Science Forum 687 (June 2011): 80–84. http://dx.doi.org/10.4028/www.scientific.net/msf.687.80.

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As solder joints become increasingly miniaturized to meet the severe demands of future electronic packaging, the thickness of intermetallic compounds (IMC) in solder joint continuously decreases, while, the IMC proportion to the whole solder joint increases. So IMC plays a more and more important role in the reliability of microelectronic structure and microsystems. In this paper, the formation and growth behavior, along with the composition of IMC at the interface of Sn-based solders/Cu substrate in soldering were reviewed comprehensively. The effect of isothermal aging, thermal-shearing cycl

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15

Itoh, Z., T. Suzuki, M. Nakaya, M. Inoue, H. Arai, and K. Wakabayashi. "Structure-activity relation among macrolide antibiotics in initiation of interdigestive migrating contractions in the canine gastrointestinal tract." American Journal of Physiology-Gastrointestinal and Liver Physiology 248, no. 3 (1985): G320—G325. http://dx.doi.org/10.1152/ajpgi.1985.248.3.g320.

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The relation between the chemical structure of commercially available macrolide antibiotics and their activity in inducing interdigestive migrating contractions (IMC) was studied in conscious dogs. It was found that the 14-membered macrolides erythromycin and oleandomycin are active in inducing IMC in the stomach in association with the endogenous release of motilin. These erythromycin- and oleandomycin-induced contractions in the stomach migrated through the small intestine in a caudad direction. Conversely, 16-membered macrolide antibiotics such as leucomycin, acetylspiramycin, and tylosin d

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16

Shao, Wei-Quan, Wen-Cai Lu, and Sha-Ou Chen. "First-principles investigation of the structural stability and electronic properties of Pd doped monoclinic Cu6Sn5 intermetallic compounds." Materials Science-Poland 32, no. 4 (2014): 592–96. http://dx.doi.org/10.2478/s13536-014-0233-x.

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AbstractTri-layer Au/Pd/Ni(P) films have been widely used as surface finish over the Cu pads in high-end packaging applications. It was found that a thin (Cu,Pd)6Sn5 IMC layer was beneficial in effective reducing inter-diffusion between a Cu substrate and a solder, and therefore the growth of the IMC layer and the EM (electromigration) processes. In this study, the structural properties and phase stability of monoclinic Cu6Sn5-based structures with Pd substitutions were studied by using the first-principles method. The (Cu,Pd)6Sn5 structure with the 4e site substituted by Pd has the lowest hea

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17

Tawfiq, Kotb B., Mohamed N. Ibrahim, and Peter Sergeant. "A Simple Commutation Method and a Cost-Effective Clamping Circuit for Three-to-Five-Phase Indirect-Matrix Converters." Electronics 11, no. 5 (2022): 808. http://dx.doi.org/10.3390/electronics11050808.

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This article presents and analyzes a three-to-five-phase indirect matrix converter (IMC) structure for directly supplying a five-phase static R–L load from a three-phase supply. The IMC topology offers a lower number of switches, a simple commutation procedure and a cost-effective clamping circuit in comparison to the direct matrix converter (DMC). A simple clamping circuit with one ultrafast diode and one small capacitor is proposed to protect the switches of the IMC from overvoltage. The issues of powering up the IMC with the simple clamping circuit is discussed in detail. The instructions f

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18

Zhang, Yinglong, Tianxiang Zhao, Xiaoquan Yu, and Jiankang Huang. "The Al-Fe Intermetallic Compounds and the Atomic Diffusion Behavior at the Interface of Aluminum-Steel Welded Joint." Metals 13, no. 2 (2023): 334. http://dx.doi.org/10.3390/met13020334.

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The formation of intermetallic compounds (IMC) at the Al/Fe interface determined the mechanical property of steel-aluminum welded joint. To understand the interfacial microstructure evolution and relate diffusion mechanism of atoms cross the Al/Fe interface, the effect of welding parameters on the interfacial IMC was studied, and the molecular dynamics method (MD) was used to simulate the diffusion process of Al and Fe atoms. Four temperatures (950 K, 1000 K, 1050 K, and 1100 K) were selected in the simulation model. The interfacial IMC are distributed in a laminar pattern, and their physical

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19

Wang, Jing Ze, Ming Lu Liu та Da Yong Li. "Structure and Property Stability of Rapidly Solidified In-Sn γ-Phase Alloy". Advanced Materials Research 981 (липень 2014): 918–22. http://dx.doi.org/10.4028/www.scientific.net/amr.981.918.

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The crystallization characteristics of the binary alloys which have InSn4 intermetallic compounds(IMC) were investigated.The influence which high undercooling had caused to the process of lattice formation,the lattice evolution in the later period of solidification,the stabilization process of the alloy property were mainly studied.The results show that the solute redistribution is restrained intensely in the rapidly solidified condition,the components of InSn4 IMC distribute uniformly,the highly undercooling structure have small sub-grain structure.X-ray diffraction analysis show that strong

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20

Ozuem, Wilson, Kerry Howell, and Geoff Lancaster. "Exploring the relationship between integrated marketing communications and decentralised organisational structure: a heuristics perspective." Qualitative Market Research: An International Journal 25, no. 2 (2022): 272–92. http://dx.doi.org/10.1108/qmr-07-2021-0098.

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Purpose The concept of integrated marketing communications (IMC) was developed in the 1990s and has gained significant interest from academics and practitioners, yet it is seldom achieved in practice. The purpose of this paper is to investigate the reasons behind this assertion. Design/methodology/approach Knowledge needed for this study was generated from a case study of a global company, operating a decentralized organizational structure in the health-care industry. Findings Thirty semi-structured interviews were performed with marketing employees and management. This paper contributes to fa

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Sedmihradská, Lucie. "Inter-Municipal Cooperation in the Czech Republic: A Public Finance Perspective." NISPAcee Journal of Public Administration and Policy 11, no. 2 (2018): 153–70. http://dx.doi.org/10.2478/nispa-2018-0017.

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Abstract Inter-municipal cooperation (IMC) in the Czech Republic is common and flexible and is generally viewed as a means to reduce problems related to the highly fragmented local government structure. The paper utilizes financial and accounting data of public entities to evaluate the character and magnitude of inter-municipal cooperation in the Czech Republic. It concludes that the extent of public services provided based on the service contracts or through institutionalized forms of IMC is quite limited and that the majority of the IMC is somewhat informal and soft , e.g. exchange of experi

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22

Gain, Asit Kumar, and Liangchi Zhang. "Nanoindentation Creep, Elastic Properties, and Shear Strength Correlated with the Structure of Sn-9Zn-0.5nano-Ag Alloy for Advanced Green Electronics." Metals 10, no. 9 (2020): 1137. http://dx.doi.org/10.3390/met10091137.

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This work investigates the influence of an Ag nanoparticle addition on the microstructure, microhardness, creep, temperature-dependent elastic properties, damping capacity, and shear strength of an environmentally friendly eutectic Sn-9Zn (wt.%) material. A microstructure analysis confirmed that adding Ag nanoparticles significantly altered the morphologies of the Zn-rich phase, which includes the size and shape in the presence of fine spherical-shaped AgZn3 intermetallic compound (IMC) particles in the β-Sn matrix. These fine microstructures positively impact on microhardness, creep, damping

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Osypiuk, Rafael, Bernd Finkemeyer, and Stanislaw Skoczowski. "Simple two degree of freedom structures and their properties." Robotica 24, no. 3 (2006): 365–72. http://dx.doi.org/10.1017/s0263574705002286.

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A two-degree of freedom control system that is most frequently encountered in practice is the so-called Internal Model Control (IMC) structure. However, the design procedure of such a structure does not present an easy task, which implies a limited utility of IMC. In this paper two alternative solutions are proposed that may be lumped together as Model-Following Control (MFC). These are two-loop control systems being easy to implement and offering interesting properties. Theoretical assumptions have been verified experimentally on a two-joint robot manipulator. Both qualitative and quantitativ

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Zahrotul Azizah. "Simulasi Steady State dan Dynamic pada Kolom De-isobutanizer dengan Penambahan Invers Decoupling pada Sistem Closedloop." Journal of Research and Technology 7, no. 1 (2021): 27–40. http://dx.doi.org/10.55732/jrt.v7i1.376.

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Degenerative Control in the Multi Input Multi Output (MIMO) system is an important topic of process control in industry. The interaction between variables in the process becomes a challenge in designing controllers for MIMO systems. Unwanted interactions cause reduced system performance which results in waste. The addition of inverse decoupling is a new strategy in reducing interactions in the process. The proposed strategy was tested on a de-isobutanizer distillation column. The results obtained were that the IAE value in the inverse decoupling added to the 2DoF IMC structure using the Mp-GM

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25

Lushnikov, S. A., V. N. Verbetsky, V. P. Glazkov, and V. A. Somenkov. "Structure, chemical bonds and anisotropy in hydrides IMC with CeNi3 and PuNi3 structure." Journal of Alloys and Compounds 446-447 (October 2007): 28–33. http://dx.doi.org/10.1016/j.jallcom.2007.01.027.

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26

Wang, Jiangtao, Longlong Qian, Songwei Wang, Li Shi, and Zhizhong Wang. "Directional Preference in Avian Midbrain Saliency Computing Nucleus Reflects a Well-Designed Receptive Field Structure." Animals 12, no. 9 (2022): 1143. http://dx.doi.org/10.3390/ani12091143.

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Neurons responding sensitively to motions in several rather than all directions have been identified in many sensory systems. Although this directional preference has been demonstrated by previous studies to exist in the isthmi pars magnocellularis (Imc) of pigeon (Columba livia), which plays a key role in the midbrain saliency computing network, the dynamic response characteristics and the physiological basis underlying this phenomenon are unclear. Herein, dots moving in 16 directions and a biologically plausible computational model were used. We found that pigeon Imc’s significant responses

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27

Liu, Wei Wei, Berdy Weng, and Scott Chen. "FCCSP IMC growth under reliability stress follows automotive criteria." PSU Research Review 3, no. 1 (2019): 70–83. http://dx.doi.org/10.1108/prr-12-2017-0046.

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Purpose The Kirkendall void had been a well-known issue for long-term reliability of semiconductor interconnects; while even the KVs exist at the interfaces of Cu and Sn, it may still be able to pass the condition of unbias long-term reliability testing, especially for 2,000 cycles of temperature cycling test and 2,000 h of high temperature storage. A large number of KVs were observed after 200 cycles of temperature cycling test at the intermetallic Cu3Sn layer which locate between the intermetallic Cu6Sn5 and Cu layers. These kinds of voids will grow proportional with the aging time at the in

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28

Gad, Omar Mohamed, Raouf Fareh, Sofiane Khadraoui, Maamar Bettayeb, and Mohammad Habibur Rahman. "Intelligent Fuzzy Logic-Based Internal Model Control for Rotary Flexible Robots." Processes 12, no. 9 (2024): 1908. http://dx.doi.org/10.3390/pr12091908.

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Recently, there has been widespread and vital adoption of flexible manipulators due to their increased prevalence. This is attributed to the growing demand for flexibility in various tasks like refueling operations, inspections, and maintenance activities. Nevertheless, these robots are under-actuated systems characterized by a nonlinear behavior and present dynamic coupling interactions that contribute to the complexity of the control process. The main control objective is to achieve an accurate tracking of the desired position while simultaneously reducing oscillations occurring in the link.

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Xiong, Ming-Yue, Liang Zhang, Peng He, and Wei-Min Long. "Stress analysis and structural optimization of 3-D IC package based on the Taguchi method." Soldering & Surface Mount Technology 32, no. 1 (2019): 42–47. http://dx.doi.org/10.1108/ssmt-04-2019-0016.

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Purpose The transistor circuit based on Moore's Law is approaching the performance limit. The three-dimensional integrated circuit (3-D IC) is an important way to implement More than Moore. The main problems in the development of 3-D IC are Joule heating and stress. The stresses and strains generated in 3-D ICs will affect the performance of electronic products, leading to various reliability issues. The intermetallic compound (IMC) joint materials and structures are the main factors affecting 3-D IC stress. The purpose of this paper is to optimize the design of the 3-D IC. Design/methodology/

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Li, Ruobing, Quanmin Zhu, Pritesh Narayan, Alex Yue, Yufeng Yao, and Mingcong Deng. "U-Model-Based Two-Degree-of-Freedom Internal Model Control of Nonlinear Dynamic Systems." Entropy 23, no. 2 (2021): 169. http://dx.doi.org/10.3390/e23020169.

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This paper proposes a U-Model-Based Two-Degree-of-Freedom Internal Model Control (UTDF-IMC) structure with strength in nonlinear dynamic inversion, and separation of tracking design and robustness design. This approach can effectively accommodate modeling error and disturbance while removing those widely used linearization techniques for nonlinear plants/processes. To assure the expansion and applications, it analyses the key properties associated with the UTDF-IMC. For initial benchmark testing, computational experiments are conducted using MATLAB/Simulink for two mismatched linear and nonlin

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Pietrusewicz, Krzysztof, Paweł Waszczuk, and Michał Kubicki. "MFC/IMC Control Algorithm for Reduction of Load Torque Disturbance in PMSM Servo Drive Systems." Applied Sciences 9, no. 1 (2018): 86. http://dx.doi.org/10.3390/app9010086.

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The following article presents the MFC/IMC cascade for velocity control of permanent magnet synchronous motor (PMSM) with the aim of reducing the influence of torque load disturbance. A brief description of the MFC/IMC control scheme is given, its structure is an expansion of a classical cascade control loop; the PMSM model was linearized in order for it to be applicable to the proposed solution. Numerical analysis of sensitivity for both systems (i.e. the MFC/IMC cascade and the classical one) is given with regards to their robustness to torque load disturbance. The behavior of these two cont

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Wang, Jiaxing, Pengrong Lin, Quanbin Yao, et al. "Transient liquid phase bonding of Sn-Pb solder with added Cu particles." Journal of Physics: Conference Series 2671, no. 1 (2024): 012022. http://dx.doi.org/10.1088/1742-6596/2671/1/012022.

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Abstract In this paper, the 1%-20% Cu particles were uniformly distributed in SnPb solder by mechanical mixing method to prepare composite solder. The solder was welded by eutectic welding and the high temperature failure test was carried out. The melting point and internal structure of solder were observed before reflow, after welding and after aging, and the existence of high-temperature resistant skeleton was found. It could be seen from the DSC curve that the solder absorption peak changes in a step-like manner, and the proportion of the high melting point absorption peak gradually increas

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Anand, T. Joseph Sahaya, Chua Kok Yau, and A. Jalar. "Micro-Structural Studies of Thermosonic Cu-Al Bonding Interface." Advanced Materials Research 925 (April 2014): 154–58. http://dx.doi.org/10.4028/www.scientific.net/amr.925.154.

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Thermosonic Copper (Cu) wire interconnection has been under an extensive research and development to replace expensive Gold (Au) wire material in the semiconductor industry. However, a reliability concern is raised due to void formation at the bonding interface of Copper wire-Aluminum bond pad (Cu-Al) after High Temperature Storage (HTS) annealing condition. It is believed that the Intermetallic Compound (IMC) layer growth and evolution lead to a volumetric shrinkage which in turn results in the void formation. Annealing conditions influence the development of the IMC at the bonding interface

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Tonkin, Michelle L., Shannon Brown, Josh R. Beck, Peter J. Bradley, and Martin J. Boulanger. "Purification, crystallization and preliminary X-ray diffraction analysis of inner membrane complex (IMC) subcompartment protein 1 (ISP1) fromToxoplasma gondii." Acta Crystallographica Section F Structural Biology and Crystallization Communications 68, no. 7 (2012): 832–34. http://dx.doi.org/10.1107/s174430911202297x.

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The protozoan parasites of the Apicomplexa phylum are devastating global pathogens. Their success is largely due to phylum-specific proteins found in specialized organelles and cellular structures. The inner membrane complex (IMC) is a unique apicomplexan structure that is essential for motility, invasion and replication. The IMC subcompartment proteins (ISP) have recently been identified inToxoplasma gondiiand shown to be critical for replication, although their specific mechanisms are unknown. Structural characterization ofTgISP1 was pursued in order to identify the fold adopted by the ISPs

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Morozov, A., A. B. Freidin, V. A. Klinkov, A. V. Semencha, W. H. Müller, and T. Hauck. "Experimental and Theoretical Studies of Cu-Sn Intermetallic Phase Growth During High-Temperature Storage of Eutectic SnAg Interconnects." Journal of Electronic Materials 49, no. 12 (2020): 7194–210. http://dx.doi.org/10.1007/s11664-020-08433-y.

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AbstractIn this paper, the growth of intermetallic compound (IMC) layers is considered. After soldering, an IMC layer appears and establishes a mechanical contact between eutectic tin-silver solder bumps and Cu interconnects in microelectronic components. Intermetallics are relatively brittle in comparison with copper and tin. In addition, IMC formation is typically based on multi-component diffusion, which may include vacancy migration leading to Kirkendall voiding. Consequently, the rate of IMC growth has a strong implication on solder joint reliability. Experiments show that the intermetall

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Bouzid, Yasser, Houria Siguerdidjane, and Elmehdi Zareb. "Improved IMC-filter design and IMC-PI equivalence: Application to quadrotor under gust of wind." Proceedings of the Institution of Mechanical Engineers, Part I: Journal of Systems and Control Engineering 234, no. 9 (2020): 1060–72. http://dx.doi.org/10.1177/0959651819894188.

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As known, internal model control is equivalent to a PI or a PID controller provided that the mathematical model associated to the process to be controlled is of first or second order respectively. So, to go beyond these particular cases and to make an extension in bringing more theoretical results, the article proposes a method to reach the equivalence between an internal model control and a PI controller regardless of the model order. To this end, the key idea consists of using a specific filter that exhibits superior robustness level compared to the classical filter and further leads to get

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Chuang, Chuan Lung, Min-Fong Shu, and Yi-Hsiu Tseng. "The Effect of Nickel Oxidation Formed in the Interface of ENEPIG Structure for Flip Chip Technology." International Symposium on Microelectronics 2018, no. 1 (2018): 000146–52. http://dx.doi.org/10.4071/2380-4505-2018.1.000146.

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Abstract In flip chip assembly, the smaller solder ball is used in chip and substrate joint. This may have an adverse influence on the reliability of electronic products. Thus, the mechanical strength of solder joint is an important topic for the major reliability in electronic assembly technology. We found the intermetallic compound (IMC) crack issue for Electroless Ni(P) / Electroless Pd(P) / Immersion Au (ENEPIG) Interposer product. In this study, we analyzed the failure samples, for ENEPIG processes verified to find out the IMC crack root cause. The interposer pad structure for these sampl

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Jing, Zhicheng, Xiangyu Liu, Wenbo Wang, Nuo Xu, Guojian Xu, and Fei Xing. "Laser Additive Manufacturing of TC4/AlSi12 Bimetallic Structure via Nb Interlayer." Materials 15, no. 24 (2022): 9071. http://dx.doi.org/10.3390/ma15249071.

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The TC4/AlSi12 bimetallic structures (BS) with Nb interlayer transition were fabricated by laser additive manufacturing (LAM). The results showed that the TC4/AlSi12 BS with Nb interlayer prepared with optimized process parameters can be divided into three regions (the TC4 region, Nb region and the AlSi12 region) and two interfaces (the TC4/Nb interface and the Nb/AlSi12 interface). The high melting point (Ti, Nb) solid solution formed in the Nb region acted as a diffusion barrier between the TC4 alloy and the AlSi12 alloy, thereby effectively inhibiting the formation of Ti-Al intermetallic co

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Kim, Kee Hyun, Benny van Daele, Gustaaf Van Tendeloo, and Jong Kyu Yoon. "Observations of Intermetallic Compound Formation of Hot Dip Aluminized Steel." Materials Science Forum 519-521 (July 2006): 1871–76. http://dx.doi.org/10.4028/www.scientific.net/msf.519-521.1871.

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A hot dip aluminizing process to simulate the continuous galvanizing line (CGL) was carried out in three successive steps by a hot dip simulator: the pre-treatment for removing scales on the 200 × 250 mm2 and 1mm in thickness cold rolled steel sheet, the dipping in 660°C Al-Si melt for 3s and the cooling. In a pre-treatment, the steel specimen was partly coated by Au to confirm the mechanism of intermetallic compound (IMC) formation. Scanning electron microscopy (SEM), energy dispersive X-ray spectroscopy (EDX), and transmission electron microscopy (TEM) analyses were followed to observe the c

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Chew, C. S., R. Durairaj, A. S. M. A. Haseeb, and B. Beake. "Mechanical properties of interfacial phases between Sn-3.5 Ag solder and Ni-18 at. % W barrier film by nanoindentation." Soldering & Surface Mount Technology 27, no. 2 (2015): 90–94. http://dx.doi.org/10.1108/ssmt-01-2015-0001.

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Purpose – The purpose of this paper is to investigate the hardness and elastic modulus on interfacial phases formed between Sn-3.5Ag solder and Ni-18 at. % W alloy film by nanoindentation. It has been found that a ternary amorphous Sn-Ni-W layer formed below Ni3Sn4 IMC at the interface. In this study, mechanical properties of the IMC formed between SA solder and Ni-18 at. % W film after six times reflows were performed by nanoindentation. Design/methodology/approach – The characterization was carried at 25°C, and 100 indents were generated. The elastic modulus and hardness were investigated. F

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Kuett, Laura, Raúl Catena, Alaz Özcan, et al. "Three-dimensional imaging mass cytometry for highly multiplexed molecular and cellular mapping of tissues and the tumor microenvironment." Nature Cancer 3, no. 1 (2021): 122–33. http://dx.doi.org/10.1038/s43018-021-00301-w.

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AbstractA holistic understanding of tissue and organ structure and function requires the detection of molecular constituents in their original three-dimensional (3D) context. Imaging mass cytometry (IMC) enables simultaneous detection of up to 40 antigens and transcripts using metal-tagged antibodies but has so far been restricted to two-dimensional imaging. Here we report the development of 3D IMC for multiplexed 3D tissue analysis at single-cell resolution and demonstrate the utility of the technology by analysis of human breast cancer samples. The resulting 3D models reveal cellular and mic

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Rai, Adarsh, Sumit Chaudhary, Surya Prakash Dube, et al. "Green Solid-State Synthesis of Antibacterial Binary Organic Material: Crystal Growth, Physicochemical Properties, Thermal Study, Antibacterial Activity, and Hirshfeld Surface Analysis." International Journal of Molecular Sciences 26, no. 12 (2025): 5509. https://doi.org/10.3390/ijms26125509.

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The organic compounds 2-aminopyrimidine (AP) and 4-aminobenzoic acid (PABA) were selected for the synthesis of a compound by establishing the phase diagram and adopting the solid-state synthesis method. The phase diagram analysis suggested the formation of a novel intermolecular compound (IMC) at a 1:1 stoichiometric ratio of AP and PABA, along with two eutectics at 0.25 and 0.90 mole fractions of AP. FTIR and NMR spectroscopy were used for the structure elucidation of the intermolecular compound. The powder X-ray diffraction analysis revealed the novel nature of IMC (APPABA) and the mechanica

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Huang, Chien-Sheng, and Jenq-Gong Duh. "Interface reactions and phase equilibrium between Ni/Cu under-bump metallization and eutectic SnPb flip-chip solder bumps." Journal of Materials Research 18, no. 4 (2003): 935–40. http://dx.doi.org/10.1557/jmr.2003.0128.

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Ni-based under-bump metallization (UBM) for flip-chip application is widely used in today's electronics packaging. In this study, electroplated Ni UBM with different thickness was used to evaluate the interfacial reaction during multiple reflow between Ni/Cu UBM and eutectic Sn–Pb solders in the 63Sn–37Pb/Ni/Cu/Ti/Si3N4/Si multilayer structure. During the first cycle of reflow, Cu atoms diffused through electroplated Ni and formed the intermetallic compound (IMC) (Ni1−x, Cux)3Sn4. After more than three times of reflow, Cu atoms further diffused through the boundaries of (Ni1−x, Cux)3Sn4 IMC an

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Burtseva, Tatyana, Nataliya Mironova, Olga Ageeva, and Boris Turutin. "Joint analysis of IMC resources: value for sustainable development." E3S Web of Conferences 376 (2023): 05060. http://dx.doi.org/10.1051/e3sconf/202337605060.

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The article studies issue of the optimal structure of the IMC (integrated marketing communications) budget in order to improve the sustainability of the company's development. Authors propose the original technique for the most optimal resource allocation structure based on the joint analysis procedure. This statistical method considers indicators of relative importance of attributes and related utilities. Particular attention is paid to the issues of assessing the reliability of the joint analysis results, as well as the possibility of their visualization. In addition, the article also consid

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Karama, Karama Khamis, and Cenk Ulu. "Internal Model Control Design for Nonlinear Systems Based on Inverse Dynamic Takagi–Sugeno Fuzzy Model." Processes 12, no. 7 (2024): 1334. http://dx.doi.org/10.3390/pr12071334.

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In recent years, applications of inverse model-based control techniques have experienced significant growth in popularity and have been widely used in engineering applications, mainly in nonlinear control system design problems. In this study, a novel fuzzy internal model control (IMC) structure is presented for single-input-single-output (SISO) nonlinear systems. The proposed structure uses the forward and inverse dynamic Takagi–Sugeno (D-TS) fuzzy models of the nonlinear system within the IMC framework for the first time in literature. The proposed fuzzy IMC is obtained in a two-step procedu

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Sun, Jianjun, Yalin Ding, Hongwen Zhang, Guoqin Yuan, and Yuquan Zheng. "Conceptual Design and Image Motion Compensation Rate Analysis of Two-Axis Fast Steering Mirror for Dynamic Scan and Stare Imaging System." Sensors 21, no. 19 (2021): 6441. http://dx.doi.org/10.3390/s21196441.

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In order to enable the aerial photoelectric equipment to realize wide-area reconnaissance and target surveillance at the same time, a dual-band dynamic scan and stare imaging system is proposed in this paper. The imaging system performs scanning and pointing through a two-axis gimbal, compensating the image motion caused by the aircraft and gimbal angular velocity and the aircraft liner velocity using two two-axis fast steering mirrors (FSMs). The composition and working principle of the dynamic scan and stare imaging system, the detailed scheme of the two-axis FSM and the image motion compens

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Li, Jun, Wei Wei Li, Peng Qi, and Qing Bin Yu. "Applied Research on Main Steam Temperature Control Based on Internal Model Control." Advanced Materials Research 507 (April 2012): 91–95. http://dx.doi.org/10.4028/www.scientific.net/amr.507.91.

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Principles and characteristics of internal model control (IMC) are illustrated. It has a simple and general structure such as that of a PID controller. Applications of IMC based on single loop PID controller tuning in main steam temperature of boiler in power plant were investigated. It can also become easier to achieve in a distributed control system (DCS) via control module configuration. It was applied in boiler of power plant to tune the main steam temperature PID parameters. The application results demonstrate the validity of the proposed method.

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Kim, Byung-Joo, Ha-Yoon Lim, Saif Haider Kayani, Yun-Soo Lee, Su-Hyeon Kim, and Joon-Hyeon Cha. "Formation and Evolution of Interfacial Structure in Al–Si–Mg/Stainless Steel Bimetals during Hot-Dipping Process." Crystals 14, no. 4 (2024): 387. http://dx.doi.org/10.3390/cryst14040387.

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Understanding trends in the formation of the intermetallic compound (IMC) layer in Al/Fe bimetallic composites can aid in significantly improving their mechanical properties. However, it is currently challenging to predict IMC layer formation during hot-dip aluminizing. Furthermore, the results from previous studies are difficult to compare owing to the variation in the process parameters used. Therefore, to understand how temperatures and holding times affect the thickness and hardness properties of IMC layers, we investigated the interfacial properties of aluminized stainless steel in molten

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Chu, Minghui, Chi Xu, and Jizheng Chu. "Graphic IMC-PID tuning based on maximum sensitivity for uncertain systems." Transactions of the Institute of Measurement and Control 41, no. 8 (2018): 2196–204. http://dx.doi.org/10.1177/0142331218775491.

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Obtaining all feasible parameters of the proportional-integral-differential (PID) controller is the key goal in uncertain systems. This paper proposes a graphical tuning method based on an internal model control (IMC) strategy for uncertain systems with time delay. Specifically, the Kharitonov theorem is introduced first to simplify the uncertain system into 32 polynomials. Then, for each polynomial, the IMC structure is applied to reduce the tuning parameters of the PID controller in order to rapidly determine the controller parameters. Finally, the maximum sensitivity (Ms) is used to further

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Kumbasar, Tufan, Ibrahim Eksin, Mujde Guzelkaya, and Engin Yesil. "Interval type-2 fuzzy inverse controller design in nonlinear IMC structure." Engineering Applications of Artificial Intelligence 24, no. 6 (2011): 996–1005. http://dx.doi.org/10.1016/j.engappai.2011.04.016.

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