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Relevant bibliographies by topics / In-Mold Electronics

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Journal articles

Academic literature on the topic 'In-Mold Electronics'

Author: Grafiati

Published: 21 December 2024

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Journal articles on the topic "In-Mold Electronics"

1

Beltrão, Mariana, Fernando M. Duarte, Júlio C. Viana, and Vitor Paulo. "A review on in‐mold electronics technology." Polymer Engineering & Science 62, no. 4 (2022): 967–90. http://dx.doi.org/10.1002/pen.25918.

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2

Madadnia, Behnam, Jan Vanfleteren, and Frederick Bossuyt. "Methods to Improve Accuracy of Electronic Component Positioning in Thermoformed Electronics." Micromachines 14, no. 12 (2023): 2248. http://dx.doi.org/10.3390/mi14122248.

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Three new methods for accurate electronic component positioning for thermoformed electronics are presented in this paper. To maintain the mechanical and electrical properties of printed-ink tracks, prevent deformation and stretching during thermoforming, and ensure reproducibility, the component positioning principle for all three proposed methods is based on keeping the temperature of some regions in the thermoplastic substrate less than the glass transition temperature of the thermoplastic carrier, to keep those regions resistant to plastic deformation. We have verified the accuracy of the d

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3

Srinivasan, KP, and T. Muthuramalingam. "In-depth scrutinization of In- Mold Electronics for Automotive applications." Journal of Physics: Conference Series 1969, no. 1 (2021): 012064. http://dx.doi.org/10.1088/1742-6596/1969/1/012064.

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4

Holdford, Becky, and Roger Stierman. "What “Green” Means: Challenges for Failure Analysis." EDFA Technical Articles 8, no. 4 (2006): 12–14. http://dx.doi.org/10.31399/asm.edfa.2006-4.p012.

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Abstract With the July 2006 implementation of RoHS (the restriction of the use of certain hazardous substances in electrical and electronic equipment), the electronics reliability industry has seen a changeover to lead-free solders and “green” mold compounds that have no bromine- or antimony-based flame retardants. This article addresses some of the challenges caused by implementation of the new requirements.

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5

Morishige, Koichi. "Special Issue on Dies and Molds." International Journal of Automation Technology 2, no. 6 (2008): 417. http://dx.doi.org/10.20965/ijat.2008.p0417.

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Mass-produced items such as cars, consumer electronics, electronic parts, precision instruments, office supplies, daily necessities, toys, etc., are invariably connected to dies and molds, basic manufacturing technology whose quality determines product quality. Die and mold production is difficult due to the complexity of structures and the requirement for high precision. Advances in both processing and elemental technology such as machine tool and CAD/CAM software determine the results of die and mold acceptability and the level of productive techniques in the country of manufacture. This spe

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6

Rusyana, Mohammad Purwa, and Rizky Maulana. "PENGARUH REKONDISI MOLD TYPE-2186 TERHADAP PENINGKATAN PRODUKTIVITAS DAN KUALITAS HASIL PRODUKSI." Jurnal Permadi: Perancangan, Manufaktur, Material dan Energi 3, no. 1 (2021): 54–62. http://dx.doi.org/10.52005/permadi.v3i1.47.

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PT. STAR COMGISTIC INDONESIA is a company engaged in household electronics production field that makes 3 types of electronic products namely cooking utensils, electric iron and coffee pot. In the production process must pay attention to the quality at each stage in order to get the best production results optimal. Internship practice shows that the process of making a product that used in the production process must be done carefully and activities according to the existing standard operating procedures (SOP), so that the results of production can be of good quality or the results of productio

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7

Anzai, Masahiro. "Special Issue on Die and Mold Technology." International Journal of Automation Technology 4, no. 5 (2010): 414. http://dx.doi.org/10.20965/ijat.2010.p0414.

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Mass-produced items such as cars, consumer electronics, electronic parts, precision instruments, office supplies, and daily necessities are invariably connected to dies and molds – basic manufacturing technology whose quality determines product quality. Die and mold production is difficult due to product complexity and high-precision requirement. Advances in processing and elemental technology such as machine tools and CAD/CAM software determine whether die and mold products are acceptability and the level of production techniques in the country of manufacture. This special issue focuses on ad

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8

Chen, Feng Jun, Shao Hui Yin, Jian Wu Yu, Ke Jun Zhu, and Yu Wang. "Ultra-Precision Fabrication of Small-Size Aspherical Glass Lens Mold." Key Engineering Materials 487 (July 2011): 29–33. http://dx.doi.org/10.4028/www.scientific.net/kem.487.29.

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With the rapid development of opto-electronics communications, optics, aerospace and other industries, ultra-precision aspheric glass lenses are widely used in middle/high-grade optical opponent because of its high resolution and imaging quality. To achieve ultra-precision molding pressing of micro-lens, ultra-precision mold must be fabricated firstly. In this paper, some key new technologies were proposed for fabricating ultra-precision mold of small-size aspheric optical lens. A method of finite element simulation was employed to predict mould pressing process of the glass lens for correctin

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9

Zhang, Sam, Xianting Zeng, Zhenggui Tang, and Ming Jen Tan. "EXPLORING THE ANTISTICKING PROPERTIES OF SOLID LUBRICANT THIN FILMS IN TRANSFER MOLDING." International Journal of Modern Physics B 16, no. 06n07 (2002): 1080–85. http://dx.doi.org/10.1142/s0217979202010890.

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In the plastic molding industry, plastic parts like pager and handphone cases, plastic containers, etc. are formed in a mold by applying temperature and pressure. The transfer molding is the standard workhorse for the electronics industry. Although the transfer molding is widely used, it is far from being optimized. Mold sticking is a serious practical problem in this industry. A solution to the problem is to apply mold-releasing agents on the mold to act as a lubricant layer between the plastic and the mold. This easily results in stains and degraded surface finish. This paper investigates th

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10

Hwang, Chul Jin, Y. B. Ko, Hyung Pil Park, S. T. Chung, and Byung Ohk Rhee. "Development of Dental Scaler Tip Mold with Powder Injection Molding Process." Materials Science Forum 534-536 (January 2007): 345–48. http://dx.doi.org/10.4028/www.scientific.net/msf.534-536.345.

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With the capability of net shaping for complex 3D geometry, powder injection molding (PIM) is widely used for automotive parts, electronics and medical industry. In this study, an ultrasonic dental scaler tip produced by machining process was redesigned for the PIM process. An injection mold was designed and machined to produce the dental scaler tip by the PIM process. The mold design was aided by CAE analysis. A PIM feedstock was made of SUS316L powder and a wax based binder. The filling balance in the mold was checked by a short shot test with LDPE and the PIM feedstock. Production capabilit

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