Relevant bibliographies by topics / In-situ stress curvature

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Academic literature on the topic 'In-situ stress curvature'

Author: Grafiati
Published: 5 June 2025
Last updated: 24 June 2025

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Journal articles on the topic "In-situ stress curvature"

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Sheth, Jay, Di Chen, Harry L. Tuller, Scott T. Misture, Sean R. Bishop, and Brian W. Sheldon. "Role of grain size on redox induced compositional stresses in Pr doped ceria thin films." Physical Chemistry Chemical Physics 19, no. 19 (2017): 12206–20. http://dx.doi.org/10.1039/c7cp00088j.

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Stafford, Gery. "(Invited) In-Situ Stress Measurement during Electrochemical Processing." ECS Meeting Abstracts MA2022-02, no. 30 (2022): 1086. http://dx.doi.org/10.1149/ma2022-02301086mtgabs.

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The electrochemical community often uses in situ wafer curvature and cantilever bending techniques to examine stress development during electrochemical processing. These techniques have been used to examine and quantify surface stress induced by surface charge (electrocapillarity), adsorption processes, and growth stress associated with underpotential deposition (UPD) and electrodeposition. The sensitivity of the stress measurement to surface processes makes this technique particularly relevant for electrochemical studies. For example, we have used in situ surface stress measurements to examine the underpotential deposition of a variety of metals (M) onto (111)-textured Au cantilever electrodes. The stress response clearly shows regions of anion desorption, M–Au bond formation, and in some cases, stress relaxation that can be attributed to surface alloying. This talk will focus on the surface and growth stress that develops during a variety of electrochemical processes, including metal deposition, the formation of elastically strained Pt films for electrocatalysis, and adsorbate-induced surface stress, such as carbon monoxide (CO) on Pt.
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Qiang, Jun, and Tao Peng. "Optimization of Substrate Sizes for In Situ Stress Measurement in Electrodeposits Relying on Nonlinear Effects." Coatings 13, no. 12 (2023): 2031. http://dx.doi.org/10.3390/coatings13122031.

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In situ stress measurements have been widely used in various deposition processes for stress detection. The substrate size can affect the uniformity of curvature across the entire surface, which is a major cause of incorrect stress measurements. However, because of the inherent concept of measurement theory and the complexities of the influence of substrate size on measurement accuracy, the underlying nonlinear effects of the rectangular substrate are still not fully understood. We discovered that increasing the substrate size caused an increase in nonlinear effect (nonuniform distribution of curvature radii and stresses in the x and y directions) and surface defects on the rectangular substrate using in situ stress measurement. Furthermore, the bending stiffness of the substrate, which was influenced by the substrate size, was established to illustrate the effect of substrate size on the nonlinear effect. The total stress of the deposit was concentrated at the edge in both the x and y directions, and the deposit at the edge was prone to delamination and cracking. When the substrate size was reduced, the deposit surface did not show obvious defects, and the stress errors in the x and y directions were only 2.34% and 2.54%, respectively. These findings will be beneficial to improve the accuracy of in situ stress measurement and further understand the causes of nonlinear effects.
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Phillips, M. A., V. Ramaswamy, B. M. Clemens, and W. D. Nix. "Stress and microstructure evolution during initial growth of Pt on amorphous substrates." Journal of Materials Research 15, no. 11 (2000): 2540–46. http://dx.doi.org/10.1557/jmr.2000.0364.

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An understanding of the relationship between stress and the corresponding microstructure at various stages of thin film growth might allow prediction and control of both microstructure and film stress during thin film deposition. In the present study, a combination of in situ curvature measurement and ex situ microstructural characterization was used to make correlations between stress and microstructure for the growth of Pt on SiO2. Plan view transmission electron micrographs of Pt films with average thicknesses ranging from 3 to 35 Å show the evolution of microstructure from isolated islands to a coalesced film, in agreement with models for stress behavior during the early stages of film growth. Quantitative measurements of grain size, island size, and areal fraction covered are extracted from these micrographs and, in conjunction with an island coalescence model, used to calculate the magnitude of the tensile stresses generated during coalescence. The predicted curvature is shown to compare favorably with the measured stresses.
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Bamberg, Simon, Tobias Bernhard (corresponding author), Laurence J. Gregoriades (presenting author), et al. "Strain in Electroless Copper Films: Analysis by in situ X-Ray Diffraction and Curvature Methods." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2013, DPC (2013): 001358–88. http://dx.doi.org/10.4071/2013dpc-wp14.

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Strain in chemically deposited copper films on polymer substrates was determined by means of in situ X-ray diffraction (XRD), deposit stress analyzer (DSA) and spiral contractometer (SC). The strain evolution of the films was studied as a function of copper film thickness and electroless copper bath parameters, during and after deposition. The results are not indicative of a preferred crystallite orientation or texturing in the deposit. The copper film stress is controllable over a wide range of some 100 MPa from compressive to tensile stress by appropriate variation of bath parameters (e.g. temperature, concentration of bath components such as nickel, stabilizer and formaldehyde). A higher tendency of blister generation for relaxed or compressively stressed films is apparent, which implies that a sufficient level of tensile stress throughout the deposition promotes film adhesion. An observable change from tensile to compressive film stress during the cooling of the sample from bath operation to rinse water temperature is discussed in terms of substrate-induced thermal stress to the copper film. In this context, the difference in the substrate materials required for XRD (polymer), DSA (copper) and SC (stainless steel) may be a significant factor contributing to the diverging measured stress behaviors of the methods. Moreover, it is questionable whether SC stress data can be compared with XRD and DSA stress data, due to the low resolution of the SC method (~60 MPa).
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Çapraz, Ömer Özgür, Kurt R. Hebert, and Pranav Shrotriya. "In Situ Stress Measurement During Aluminum Anodizing Using Phase-Shifting Curvature Interferometry." Journal of The Electrochemical Society 160, no. 11 (2013): D501—D506. http://dx.doi.org/10.1149/2.025311jes.

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Welzel, U., and Eric J. Mittemeijer. "Stress Evolution in Thin Films; Diffusion and Reactions." Defect and Diffusion Forum 264 (April 2007): 71–78. http://dx.doi.org/10.4028/www.scientific.net/ddf.264.71.

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After a brief discussion of possible mechanisms of stress generation in thin film diffusion/reaction couples, two recent experimental examples are reviewed: (i) Thin film diffusion couples (Pd-Cu, individual layer thicknesses: 50nm) prepared by DC-magnetron sputtering on silicon substrates. The microstructural development, phase formation and the stress evolution during diffusion annealing have been investigated employing Auger-electron spectroscopy in combination with sputter depth profiling, transmission electron microscopy, in-situ wafer-curvature measurements and ex-situ and, in particular, in-situ X-ray diffraction measurements. (ii) Tin layers on copper substrates (layer thicknesses of some microns) prepared by electrodeposition. Upon storage at ambient temperatures, Cu diffuses into the Sn layer and forms the intermetallic phase η’- Cu6Sn5. The phase formation is accompanied by a volume expansion and as a consequence, compressive residual stresses can be generated in the Sn layers. These compressive residual stresses may drive the formation of Sn whiskers on the Sn surface. The microstructural development, phase formation and the stress evolution during diffusion annealing have been investigated employing scanning electron and focused ion beam microscopy, metallography and ex-situ and, in particular, in-situ X-ray diffraction measurements.
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Ryu, Sang, Kyungchun Lee, Seungwhan Ma, and Youngman Kim. "Stress Behavior of FCC Metallic Thin Films During Thermal Evaporation." Journal of Nanoscience and Nanotechnology 7, no. 11 (2007): 4081–83. http://dx.doi.org/10.1166/jnn.2007.089.

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The development of stress in metallic thin films, monitored by in-situ curvature measurements during deposition, is analyzed. Three distinct stress regions including initial compressive, broad tensile, and incremental compressive stress were reported in terms of the film thickness (deposition time) by F. Spaepen. An experimental set-up was assembled for the in-situ curvature measurements utilizing vacuum thermal evaporation and multi-beam laser reflection points arrayed in x- and y-axis. The change in the spacing of laser reflected points was converted to the curvature of specimen, in turn, to instantaneous stress levels in the growing films using Stoney's formula. To investigate the effect on the distinct stress regions, the flux of the depositing metallic atoms was used as an experimental variable in this study. For the lowest flux cases for Cu and Ag, an additional second compressive stress stages after tensile maximum stress was observed in this study. Initial compressive part and tensile maximum stress regions appeared in shorter period of time for the thin films deposited at higher flux of atoms. Thus the flux of depositing atoms may affect the mechanisms of each stage. The initial compressive stress is conjectured to stem from the state of thin film surfaces; dynamic and relaxed surface. Abroad tensile region is reported from the fact that the reduction of excess volume associated with grain boundaries and/or the coalescence of grains for high mobility materials. The incremental compressive stress region may be related to surface state and atomic mobilities.
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Chen, Han, Hua Rong, and Ming Wang. "A In Situ Measuring Method for Stress Gradient of a MEMS Film." Advanced Materials Research 60-61 (January 2009): 357–60. http://dx.doi.org/10.4028/www.scientific.net/amr.60-61.357.

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The stress gradient of a deposited thin-film is a mechanical parameter that affects the performance of MEMS devices, so in-situ measuring stress gradient of a thin-film is great significant. A new in-situ measuring method based on a center-anchored circular plate is presented. The Mirau interferometer has been used to measure the out-of-plane height at the edge of circular plate, then the curvature radius of the plate and the stress gradient of the film can be calculated. The measuring method has been verified by CoventorWare. The accuracy of the presented measuring method is ideal. The advantages of the method also have been discussed.
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Messerschmidt, Ulrich. "In situ straining experiments in the Transmission Electron Microscope." Proceedings, annual meeting, Electron Microscopy Society of America 48, no. 4 (1990): 518–19. http://dx.doi.org/10.1017/s0424820100175727.

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Recently a number of in situ straining experiments have been carried out at temperatures between about 80 K and 1200 K. A new HVEM straining stage was constructed for temperatures above 1300 K. Its design features are: top entry double tilting stage, thermal expansion drive of high stiffness, heating by electron bombardment, and water cooling to quickly reach a steady state.The following deformation phenomena have successfully been treated by in situ experiments:Determination of the effective stress from the curvature of bowed-out dislocation segments: As shown by in situ experiments on MgO crystals, the line tension of dislocations may differ from its theoretical value. Nevertheless, the anomalous temperature dependence of the effective stress in ordered alloys as well as for prismatic slip in Be has been determined in accordance with macroscopic experiments. Measurement of velocities and kinematic behaviour of dislocations: In situ experiments allow the coordination of the motion of individual dislocation segments with their geometrical configuration.
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Book chapters on the topic "In-situ stress curvature"

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"In-situ investigation by X-ray diffraction and wafer curvature of phase formation and stress evolution during metal thin film – silicon reactions." In Tenth European Powder Diffraction Conference. Oldenbourg Wissenschaftsverlag, 2007. http://dx.doi.org/10.1524/9783486992540-014.

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Conference papers on the topic "In-situ stress curvature"

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Husstedt, Hendrik, Udo Ausserlechner, and Manfred Kaltenbacher. "In-situ measurement of curvature and mechanical stress of packaged silicon." In 2010 Ninth IEEE Sensors Conference (SENSORS 2010). IEEE, 2010. http://dx.doi.org/10.1109/icsens.2010.5690142.

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Hudyncia, Hans, Jun Shi, Weizhou Li, and Xiaodong Li. "In-Situ and Ex-Situ Measurement of Stresses in Environmental Barrier Coatings." In ASME Turbo Expo 2024: Turbomachinery Technical Conference and Exposition. American Society of Mechanical Engineers, 2024. http://dx.doi.org/10.1115/gt2024-127938.

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Abstract Ceramic Matrix Composites (CMCs) offer a step improvement in temperature capability over the current best high temperature super alloys for gas turbine applications. Silicon Carbide (SiC) based CMCs react with water vapor at temperature and therefore need an Environmental Barrier Coating (EBC) for protection against the water vapor attack. EBC is typically deposited on a CMC component through Air Plasma Spray (APS) process, which involves melting and fast quenching of molten ceramic powders (such as ytterbium disilicate and ytterbium monosilicate). The fast quenching and subsequent cool down to room temperature introduce residual stress in the EBC. In addition, EBC coated CMC components often go through a heat treatment process afterwards. For Yb-silicates, this both stabilizes/crystalizes the EBC and increases hermiticity by healing cracks and pores. This heat treatment at elevated temperature changes the coating residual stress state. It is important to be able to measure the coating stresses during deposition and heat treatment so that APS process improvement and EBC coating life assessment can be made. This paper describes novel methods to measure coating stresses continuously during APS and during heat treatment up to 1400°C, using an optical deformation and curvature-based approach.
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Bianchi, L., F. Blein, N. Baradel, and M. Jeandin. "In-Situ Measurements of Residual Stress within Coatings Plasma-Sprayed Under Industrial Conditions." In ITSC 1997, edited by C. C. Berndt. ASM International, 1997. http://dx.doi.org/10.31399/asm.cp.itsc1997p0831.

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Abstract In order to determine residual stresses in industrial plasmasprayed coatings, a rather simple apparatus, which monitors the curvature of a beam substrate during the deposition process, has been developed. The experimental set-up consists of a water-cooled rotating cylinder, holding an initially plane substrate, whose curvature is continuously measured using a contacting displacement sensor disposed into the cylinder. The combination of the plasma gun translation and the cylinder rotation allows to reach industrial spraying velocities. Liquid argon cryogenic system is used to control the substrate temperature from about 50°C to more than 300°C independently from the process velocity. A typical recording is analyzed thoroughly and a theoretical approach to residual stress calculation discussed. This method is applied to partially stabilized zirconia coatings performed onto stainless steel substrates for spraying temperatures between 80°C and 210°C.
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Seshadri, R. C., and S. Sampath. "Characterization of the Deposition Formation Dynamics of Suspension Plasma Spray Coatings Using In-Situ Coating Property Measurements." In ITSC 2016, edited by A. Agarwal, G. Bolelli, A. Concustell, et al. DVS Media GmbH, 2016. http://dx.doi.org/10.31399/asm.cp.itsc2016p0085.

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Abstract In this investigation, submicron YSZ particles suspended in ethanol were sprayed on stainless steel substrates using a single-electrode cascaded arc-plasma torch. Various coating morphologies were produced by changing the input power, gas flow rate, and injection angle of the gun. Coating thicknesses between 500 and 600 μm were achieved for all experimental runs and stress evolution was monitored using an in situ coating property (ICP) sensor that measures changes in substrate curvature. Based on the stress-modulus relationship, there can be four microstructural zones in the coatings: a porous feathery zone, a dense columnar zone, a dense vertically cracked (DVC) zone, and a zone with cracked and defective columnar structures. From ICP curvatures, it was found that the porous columnar structures are highly compliant, the dense columnar structures are stiff, and the DVC structures are dense and compliant. The dense columnar and DVC microstructures displayed a twin stage curvature change which clearly indicated the stress build up, onset of cracking, and stress relief after axial crack propagation.
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Mutter, Markus, Georg Mauer, Robert Mücke, Robert Vaßen, Hyoung Chul Back, and Jens Gibmeier. "Stress Formation within the First Layer in Plasma Sprayed Coatings." In ITSC2015, edited by A. Agarwal, G. Bolelli, A. Concustell, et al. ASM International, 2015. http://dx.doi.org/10.31399/asm.cp.itsc2015p0669.

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Abstract The residual stresses within plasma sprayed coatings are an important factor which can influence the lifetime of the coatings. The investigation of the evolving stresses during deposition and post-deposition cooling of YSZ coatings by measuring in-situ the specimen’s curvature with the so-called ICP sensor is a powerful tool to identify the different stress generation factors. Under certain spray conditions one can observe that the first torch pass leads to a significantly higher increase in specimen´s curvature than the following deposition passes, which indicates significantly higher stresses within the interface coating region. The reason for this steep curvature increase was investigated. It is suggested to be a combination of a stronger bonding of those splats being connected directly to the substrate and the relief of compressive stress within the substrate. The slope of this increase depends on the spray parameters as well as on the substrate conditions, which was investigated also.
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Bolelli, G., L. Lusvarghi, T. Varis, et al. "Residual Stresses in HVOF- and APS-Deposited AI2O3 and Cr2O3 Coatings." In ITSC2008, edited by B. R. Marple, M. M. Hyland, Y. C. Lau, C. J. Li, R. S. Lima, and G. Montavon. Verlag für Schweißen und verwandte Verfahren DVS-Verlag GmbH, 2008. http://dx.doi.org/10.31399/asm.cp.itsc2008p0978.

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Abstract Residual stresses in plasma-sprayed Al2O3 and Cr2O3 coatings, deposited using commercial powders, and in HVOF-sprayed ceramic coatings, deposited using conventional Al2O3 and Cr2O3 feedstock and nanostructured- Al2O3 feedstock, were studied by combining X-ray diffraction, substrate chemical removal technique and analytical modelling. The in-situ curvature technique was also employed for HVOF-sprayed Al2O3 coatings, for further verification. Both HVOF-sprayed Al2O3-based coatings display similar, tensile residual stresses (≈120 MPa) near the top surface and possess moderate through-thickness stress gradients (≈10 - 20 MPa). Plasma-sprayed Al2O3 possesses a smaller through-thickness stress gradient and a larger near-surface stress (≈220 MPa): this latter result seems to be due to higher quenching stresses in APS Al2O3, as determined by analytical computation The analytical model is validated by its fairly good agreement to the experimental results obtained both by substrate chemical removal and by in-situ curvature. Cr2O3-based coatings possess a lower near-surface residual stress (≈20 MPa); the HVOF one also exhibits a very large stress gradient (≈80 MPa). Machining and sliding processes (like polishing and dry sliding tribological testing) change their surface residual stresses to compressive ones.
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Bovard, Bertrand G., Xavier Colonna de Lega, and H. Angus Macleod. "In situ measurements of stress in titanium dioxide thin films produced by ion-assisted deposition." In OSA Annual Meeting. Optica Publishing Group, 1991. http://dx.doi.org/10.1364/oam.1991.tupp4.

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A stressometer has been developed to measure the evolution of total stress in thin films during growth. The instrument is based on a cat’s eye interferometer which measures the variations of curvature of a thin substrate during deposition. This instrument is installed on a Balzers-760 box coater equipped with a 12-cm Kaufman ion source. We have used this experimental setup to study stress in thin films of titanium dioxide grown on silicon substrates as a function of bombardment conditions. In this paper, we describe the experimental setup, present the stress measurements for different growth conditions, and discuss the results. In particular, we show how the stress evolves with increasing levels of bombardment, and how it varies with physical thickness.
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Baradel, N., L. Bianchi, F. Blein, A. Freslon, and M. Jeandin. "In Situ Measurement Within Plasma-Sprayed Zirconia Coatings Under Industrial Conditions." In ITSC 1998, edited by Christian Coddet. ASM International, 1998. http://dx.doi.org/10.31399/asm.cp.itsc1998p0563.

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Abstract The thermomechanical properties of plasma-sprayed deposits strongly depend on residual stress distribution. This latter is mainly attributed to the relative torch/substrate velocity as well as to the cooling system location and efficiency. The determining of both quenching and thermal stresses, which are generated respectively during spraying stage and cooling stage, is then required to improve coatings quality. A rather simple apparatus, which consists in monitoring the curvature of a beam substrate during the whole deposition process, has been developed to work under industrial conditions. It has been applied to partially stabilized zirconia coatings performed onto stainless steel and cast iron substrates. Spraying temperature and plasma gun velocity have been selected as relevant parameters for this study about stress generation and mechanical release. Finally, four point bend tests have been performed on deposited samples to measure coating mechanical properties and to evaluate damage level.
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Bailly, O., T. Laguionie, L. Bianchi, M. Vardelle, and A. Vardelle. "Residual Stress Measurements in Cold Sprayed Tantalum Coatings." In ITSC 2012, edited by R. S. Lima, A. Agarwal, M. M. Hyland, et al. ASM International, 2012. http://dx.doi.org/10.31399/asm.cp.itsc2012p0271.

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Abstract The residual stress level in coatings is a main issue in controlling in-service deformation, spallation or cracking. Residual stress generation has been widely studied for plasma and HVOF sprayed coatings, but only scare data are available for cold sprayed coatings. This paper describes the measurement and analysis of residual stresses in tantalum cold sprayed coatings. Residual stress measurements were performed by the hole-drilling and curvature methods. The former provided a through-thickness residual stress profile in the coating while the latter was used to investigate the in-situ residual stress evolution during the deposition process. The results from both methods were consistent and showed compressive stress of 350 MPa for a tantalum coating deposited on a 3 mm thick copper substrate at 80°C.
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Thomas, Norman L. "Methods of Determining Thin Film Stress." In Optical Interference Coatings. Optica Publishing Group, 1988. http://dx.doi.org/10.1364/oic.1988.tuc2.

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Thin film stress can play an important part in the fabrication of flat media on thin substrates, and can cause unwanted deformations and failure. The stress parameter has been shown to be adjustable by varying the deposition parameters during thermal evaporation or sputtering. For example, ion assisted reactive evaporation is a deposition technique which has been shown to be useful in controlling stress, in addition to other thin film parameters. The successful application of these techniques requires that the stress be monitored, in situ, during a coating run, or, by means of a piggy-backed stress monitor disk whose curvature is measured after the coating run.
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Reports on the topic "In-situ stress curvature"

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Vackel, Andrew. Residual stress of controlled atmosphere plasma spray blended metal deposits measured via in-situ substrate curvature method. Office of Scientific and Technical Information (OSTI), 2023. http://dx.doi.org/10.2172/2430332.

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