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Relevant bibliographies by topics / In-Sn

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Academic literature on the topic 'In-Sn'

Author: Grafiati

Published: 4 June 2021

Last updated: 6 February 2022

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Journal articles on the topic "In-Sn"

1

Mudryi, S. I., T. I. Lutsishin, and A. V. Korolyshin. "Structure of Sn-rich Sn?In melts." Inorganic Materials 40, no. 12 (December 2004): 1284–86. http://dx.doi.org/10.1007/s10789-005-0081-5.

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Peng, Weiqun. "An investigation of Sn pest in pure Sn and Sn-based solders." Microelectronics Reliability 49, no. 1 (January 2009): 86–91. http://dx.doi.org/10.1016/j.microrel.2008.11.001.

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3

Kitada, A., Y. Kang, Y. Uchimoto, and K. Murase. "Electrochemical Reactivity of Magnesium Ions with Sn-Based Binary Alloys (Cu-Sn, Pb-Sn, and In-Sn)." ECS Transactions 58, no. 36 (April 10, 2014): 75–80. http://dx.doi.org/10.1149/05836.0075ecst.

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4

Chen, Chih-chi, and Yan-lun Tseng. "Cross-Interaction in Cu/Sn/Co/Sn/Ni and Cu/Sn–Co/Co/Sn– Co/Ni Couples." Journal of Electronic Materials 44, no. 3 (January 8, 2015): 1021–27. http://dx.doi.org/10.1007/s11664-014-3620-5.

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5

Jensen, William P., Gus J. Palenik, and Edward R. T. Tiekink. "Bond valence sums in coordination chemistry. Sn(II), Sn(III), and Sn(IV) complexes containing SnS and/or SnN bonds." Polyhedron 20, no. 17 (July 2001): 2137–43. http://dx.doi.org/10.1016/s0277-5387(01)00787-2.

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Schneider, Jörg J., Jörg Hagen, Norbert Czap, Carl Krüger, Sax A. Mason, Robert Bau, Jürgen Ensling, Philipp Gütlich, and Bernd Wrackmeyer. "Hydroxo Hydrido Complexes of Iron and Cobalt (Sn−Fe−Sn, Sn−Co−Sn): Probing Agostic Sn⋅⋅⋅H−M Interactions in Solution and in the Solid State." Chemistry - A European Journal 6, no. 4 (February 18, 2000): 625–35. http://dx.doi.org/10.1002/(sici)1521-3765(20000218)6:4<625::aid-chem625>3.0.co;2-i.

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Naus, M. T., P. J. Lee, and D. C. Larbalestier. "The interdiffusion of Cu and Sn in internal Sn Nb/sub 3/Sn superconductors." IEEE Transactions on Appiled Superconductivity 10, no. 1 (March 2000): 983–87. http://dx.doi.org/10.1109/77.828396.

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Sarobol, Pylin, Aaron E. Pedigo, Peng Su, John E. Blendell, and Carol A. Handwerker. "Defect Morphology and Texture in Sn, Sn–Cu, and Sn–Cu–Pb Electroplated Films." IEEE Transactions on Electronics Packaging Manufacturing 33, no. 3 (July 2010): 159–64. http://dx.doi.org/10.1109/tepm.2010.2046172.

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HAYASAKA, Kenta, Katsuhiro SASAKI, Tomoharu TOKUNAGA, and Takahisa YAMAMOTO. "B23-P-17Microstructural Analysis of Lithiated Sn/Sn Interface in Gelatin-Coated Sn Particle." Microscopy 64, suppl 1 (November 2015): i120.1—i120. http://dx.doi.org/10.1093/jmicro/dfv291.

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Chen, Sinn-wen, Chih-yu Wu, Hsin-jay Wu, and Wan-ting Chiu. "Interfacial reactions in Sn/Bi2Te3, Sn/Bi2Se3 and Sn/Bi2(Te1−xSex)3 couples." Journal of Alloys and Compounds 611 (October 2014): 313–18. http://dx.doi.org/10.1016/j.jallcom.2014.05.127.

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Dissertations / Theses on the topic "In-Sn"

1

Benedict, Michael Scott. "Heterogeneous nucleation of Sn in Sn-Ag-Cu solder joints." Diss., Online access via UMI:, 2007.

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2

Yassin, Amal M. "Creep microstructure relationships in Sn-Sb and Sn-Sb-Cu alloys." Thesis, Heriot-Watt University, 1999. http://hdl.handle.net/10399/1182.

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Lowe, Geoffrey T. "The columnar to equiaxed transition in Pb-Sn and Sn-Pb alloys." Thesis, University of British Columbia, 1990. http://hdl.handle.net/2429/29658.

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The columnar to equiaxed transition has been studied experimentally using accurate temperature measurements and with a heat transfer mathematical model in Pb-1.5%Sn and Sn-10%Pb alloys. The behaviour of the two alloys was markedly different. In the Pb-1.5%Sn alloy, the transition did not occur until a large portion of the liquid thermally supercooled. At this point the temperature gradient in the liquid is very low, approximately O℃/mm. For Sn-10%Pb, the transition occurred at a positive temperature gradient of approximately 0.12℃/mm which confirms earlier work by Mahapatra and Weinberg. Supercooling was also found to occur in this alloy but it is not certain whether the supercooling is constitutional or thermal. The difference in the behaviour of the two alloys is related to the density of nuclei prior to directional solidification. Altering the method to release latent heat by using the Scheil equation or the Lever rule instead of the traditional linear assumption in the mathematical model did not have a significant effect on the predicted temperatures or temperature gradients in the Pb-1.5%Sn alloy. The effect was seen when the Sn-10%Pb alloy was considered. The difference is attributed to the total amount of latent heat to be released by a particular alloy.
Applied Science, Faculty of
Materials Engineering, Department of
Graduate

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4

Gruner, Thomas. "Neuartige RET2(Sn,In)-Systeme." Doctoral thesis, Saechsische Landesbibliothek- Staats- und Universitaetsbibliothek Dresden, 2016. http://nbn-resolving.de/urn:nbn:de:bsz:14-qucosa-205468.

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Die vorliegenden Dissertation berichtet von der Entdeckung ungewöhnlicher magnetischer, elektronischer und struktureller Eigenschaften in einer Reihe von neuen intermetallischen Verbindungen auf Selten-Erd-Basis. Die untersuchten Systeme vom Typ RET2X bestehen aus den Selten-Erd-Elementen (RE) Yb oder Lu, den Übergangsmetallen (T) Pt oder Pd sowie den weiteren Liganden (X) Sn oder In. Die Synthese der verwendeten Proben, deren kristallografische Analyse und die Untersuchung ihrer physikalischen Eigenschaften werden im Detail vorgestellt. Diese Arbeit liefert Resultate, die sowohl für die Grundlagenforschung als auch für technische Anwendungen eine große Relevanz besitzen. Die Untersuchungen der neuen Verbindungen YbPt2Sn und YbPt2In zeigen, dass die magnetische Kopplung zwischen benachbarten Yb-Ionen extrem schwach ist. Dies führt zu einem riesigen magnetokalorischen Effekt im Bereich von 0.05 K bis 2 K. Damit besitzen beide metallischen Materialien optimale Eigenschaften, um als Kühlkörper in Entmagnetisierungskryostaten Verwendung zu finden. Zwei zu Testzwecken aufgebaute Kühleinsätze auf YbPt2Sn-Basis bestätigen die Eignung dieser Verbindung als metallisches Kühlmaterial. Die Untersuchungen der Substitutionsreihe Lu(Pt1-xPdx)2In offenbaren einen Ladungsdichtewelle (CDW)-Phasenübergang mit außergewöhnlichen Eigenschaften. Im Gegensatz zu Beobachtungen in den meisten anderen bekannten CDW-Systemen ist der Übergang in LuPt2In kontinuierlich, d. h. zweiter Ordnung. Durch Ersetzen von Pt mit isovalenten Pd kann die Übergangstemperatur T_CDW kontinuierlich zum absoluten Temperaturnullpunkt geführt werden. Die beobachteten Eigenschaften zeigen, dass der Phasenübergang dabei zweiter Ordnung bleibt. Damit wird experimentell bewiesen, dass Lu(Pt1-xPdx)2In eines der seltenen Systeme ist, in denen ein CDW quantenkritischer Punkt in Erscheinung tritt. Noch außergewöhnlicher ist die Beobachtung von Supraleitung mit einem ausgeprägten Maximum in der Sprungtemperatur T_c genau am quantenkritischen Punkt. Das deutet auf eine neuartige Kopplung zwischen quantenkritischer CDW und Supraleitung hin.

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Fischer, David S. Ph D. Massachusetts Institute of Technology. "Novel approaches to low temperature transient liquid phase bonding in the In-Sn/Cu and In-Sn-Bi/Cu systems." Thesis, Massachusetts Institute of Technology, 2008. http://hdl.handle.net/1721.1/44424.

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Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 2008.
Vita.
Includes bibliographical references (leaves 112-113).
A fluxless low temperature transient liquid phase (LTTLP) bonding process was studied as a method of producing Cu/Cu joints below 125°C and 75°C using interlayer alloys from the In-Sn and In-Sn-Bi systems. Using thermodynamic models, three different compositions (wt. %) of base alloys were chosen to accomplish this task: 50In-43.6Sn-6.4Bi (Tm = 110°C) and eutectic 50.9In-49.1Sn (Tm = 120°C) alloys were used for bonding at 125°C and a eutectic 48.3In-15.6Sn-36.1Bi (Tm = 60°C) alloy was used for bonding at 75°C. In addition, novel approaches to TLP bonding, including the addition of base material to the interlayer alloy and application of an electroless Ni diffusion barrier layer, were employed in an attempt to optimize this joining method. The LTTLP processes were assessed based on their abilities to produce joints with minimal thickness, high reflow temperatures, and good mechanical properties at room/elevated temperatures. It was found that interlayer alloys containing higher Bi contents produced the thinnest joints, with the 48.3In-15.6Sn-36.1Bi alloy producing joints on the order of 10 gm. Increases in nominal Cu composition of the interlayer alloy tended to form larger joints. Application of the Ni layer was observed to decrease the growth rate of the eutectic In-Sn joints made with 5 wt % Cu additions. Shear tests were performed on the joints at room (25°C) and operating (service) temperatures (100°C). Most of the TLP joints had room temperature shear strengths around 13,000 - 17,000 psi (= 90 - 120 MPa), although increases in strength were observed for eutectic In-Sn joints with 2.5 and 5 wt% Cu additions. At operating temperature, TLP joints made within the In-Sn-Cu system were found to have strengths an order of magnitude higher than those made in the In-Sn-Bi-Cu system.
(cont.) Poor mechanical response of the Bicontaining joints was due to the presence of low melting In-Bi IPs present in the reaction zone. Eutectic In-Sn TLP joints made with 2.5 and 5 wt% Cu additions were found to have operational temperature shear strengths of 6,000 - 7,500 psi ( 40 - 50 MPa) and 7,500 - 9,500 psi (= 50 65 MPa), respectively.
by David S. Fischer.
S.M.

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6

Monterrubio, Martínez Carles. "Delivery of SN-38 in pediatric solid tumors." Doctoral thesis, Universitat de Barcelona, 2016. http://hdl.handle.net/10803/399596.

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A new combined microdialysis – tumor homogenate method for the determination of compartmental (vascular, extra- and intracellular) SN-38 distribution in patient-derived xenografts (PDX) generated from pediatric solid tumors from fresh tumor samples from patients of Sant Joan de Deu Barcelona Hospital was developed. SN-38 in late-stage (chemoresistant) tumors presented limited distribution into the intracellular compartment while drug distribution into this compartment was significantly higher in early-stage (sensitive) models when SN-38 was administered as its prodrug irinotecan. Furthermore, two polymeric drug delivery systems were developed for the local and systemic administration of SN-38. Poly(lactic) acid electrospun nanofiber matrices with microcrystals of SN-38 were developed for the local administration of SN-38. Matrices showed maintained release of SN-38 over 48 h with local distribution and efficacy delaying tumor growth over PDX models. Dialysates showed limited SN-38 diffusion from the matrices through the tumor tissue, suggesting this therapy could only be useful for the local tumor control after successful surgery of the tumor or where only microscopic tumor seeds are left. Systemic administration of SN-38 was possible by encapsulating the drug into poly(lactic-co-glycolic) acid with polyethylene glycol nanoparticles, which were decorated with 3F8 monoclonal antibody, an anti-GD2 antibody that recognizes the ganglioside GD2 overexpressed on the surface of neuroblastoma cells surface for active targeting. Nanoparticles released SN-38 over 2 days and tumor exposition to SN-38 was increased when compared with the administration of an equimolar dose of irinotecan, and that was correlated with improved efficacy over the conventional irinotecan where 10 administrations of the drug had reduced efficacy compared to the direct administration of SN-38 in the targeted nanoparticles. Both nanofiber matrices and nanoparticles showed to be good platforms for SN-38 administration reducing systemic exposition by localizing SN-38 at the tumor microenvironment and significantly delaying tumor growth as shown in the efficacy studies. Thus, polymeric local drug delivery systems strategy should be of high interest for the potential future treatment of chemoresistant tumors.

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7

Ma, Xiang. "Willmore surfaces in Sn: transforms and vanishing theorems." [S.l.] : [s.n.], 2005. http://edocs.tu-berlin.de/diss/2005/ma_xiang.pdf.

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8

Imaz, Inigo. "The search for CC SN in unobscured AGN." Thesis, Uppsala universitet, Observationell astrofysik, 2016. http://urn.kb.se/resolve?urn=urn:nbn:se:uu:diva-297458.

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9

Belyakov, Sergey Aleksandrovich. "Microstructure formation and soldering in Sn-Ni alloys." Thesis, Imperial College London, 2013. http://hdl.handle.net/10044/1/17998.

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This thesis develops the understanding of microstructure formation in binary Sn-Ni alloys during solidification and during soldering. Where past research has found metastable NixSny phases after solid-state ageing of Ni-Sn couples, it has been shown for the first time in this work that metastable NiSn4 forms in the Sn-Ni system during (i) solidification of Sn-rich Sn-Ni alloys as both a primary and a eutectic phase, (ii) soldering of Sn-Ni alloys to Ni-containing substrates as the βSn-NiSn4 eutectic and (iii) during storage of Sn-Ni electroplated couples as the interfacial intermetallic layer. It has been shown that NiSn4 is an orthorhombic phase with a superstructure closely related to oC20-NiSn4 and that NiSn4 is a metastable compound at all temperatures relevant to soldering. Furthermore, it has been shown that a second metastable phase, Ni3Sn7, forms occasionally during solidification. The research has concluded on the following reasons for NiSn4 formation: (i) NiSn4 has growth advantages over equilibrium Ni3Sn4 due to easier interface attachment kinetics; (ii) the existence of a low planar lattice disregistry (~5%) between NiSn4 and Sn results in highly reproducible low energy NiSn4/Sn orientation relationships; and (iii) Fe impurity levels typical for commercial purity solders result in FeSn2 crystals that act as heterogeneous nucleation sites for NiSn4. Investigation of Sn-Ni electroplated couples showed that the interfacial layer is metastable NiSn4 initially and that Ni3Sn4 nucleates and grows to consume the NiSn4 layer with time at temperature. A similar study on Sn-Ni solder joints showed that the interfacial layer is always Ni3Sn4. The results suggest that, in electroplated couples, metastable NiSn4 nucleates on βSn due to the low planar disregistry between the phases. In contrast, during soldering the interfacial intermetallic nucleates on the Ni substrate when the solder is liquid and the metastable NiSn4 has no nucleation advantages over equilibrium Ni3Sn4.

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10

Linnen, Robert L. "Contrasting origins of Sn-W mineralization in western Thailand." Thesis, McGill University, 1992. http://digitool.Library.McGill.CA:80/R/?func=dbin-jump-full&object_id=70272.

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Investigations of pegmatite, stockwork and replacement deposits, using geological, whole-rock and mineral chemistry, fluid inclusion, and stable isotope data, were undertaken to establish some of the controls of mineralization in the western Thai Sn-W belt.
Cassiterite was saturated in the late-stage melt in the Nong Sua granitic pegmatite and subsequently with wolframite in orthomagmatic fluids. The latter mixed with external aqueous and aqueous-carbonic fluids of evolved meteoric or metamorphic origin at $ le$650$ sp circ$C and $ le$3.8 kbar. Hydrothermal cassiterite and wolframite crystallized as a result of increasing $fO sb2,$ fluid mixing, and cooling. At the Pilok stockwork deposits tourmalinization was followed by successive wolframite-K-feldspar deposition and cassiterite-sulphide greisen mineralization. Tin was remobilized by reduced metamorphic or evolved magmatic-meteoric aqueous-carbonic fluids. Cassiterite was deposited at 300-450$ sp circ$C in response to increasing $fO sb2,$ pH, or decreasing temperature. Limited data on the Takua Pit Thong replacement suggest that cassiterite was deposited from aqueous fluids at $ ge$500$ sp circ$C, but metamorphic aqueous-carbonic fluids were also involved.
The depth of emplacement was one of the major controls on mineralization style. Aqueous-carbonic fluids in the western Thai, and other Sn-W belts, are a consequence of a moderately deep level of emplacement; hypersaline orthomagmatic fluids are associated with sub-volcanic Sn-W mineralization.

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Books on the topic "In-Sn"

1

Culhane, Michael. Hydrogen molecules in SN 1987A. [Washington, DC: National Aeronautics and Space Administration, 1997.

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2

Gorton, Jonathan Andrew. Electroplated miralloy(cu-sn) for the prevention of scc in brass. Manchester: UMIST, 1998.

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Syntaktische und semantische Funktionen des adverbalen Syntagmas [a+SN] in altitalienischen Texten. Frankfurt am Main: P. Lang, 1999.

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4

Tiedje, Niels. Formation of microstructures in gas-atomised Cu-6wt percent Sn and 316L powders. Roskilde, Denmark: Risø National Laboratory, 1994.

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Warnock, J. M. A statistical model to estimate the refractivity turbulence structure constant Cp2sn in the free atmosphere. Boulder, Colo: National Oceanic and Atmospheric Administration, Environmental Research Laboratories, Aeronomy Laboratory, 1985.

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6

Dzhelepov, B. S. Izobarnye i͡a︡dra s massovym chislom A=124: ¹²⁴Cd-->¹²⁴In-->¹²⁴Sn; ¹²⁴Sb-->¹²⁴Te<--¹²⁴I; ¹²⁴Xe<--¹²⁴Cs<--¹²⁴Ba<--¹²⁴La<--¹²⁴Ce. Leningrad: Izd-vo "Nauka," Leningradskoe otd-nie, 1985.

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Marchandise, H. The certification of the impurity contents (Ag, As, Bi, Cd, Cu, Ni, Sb, Se, Sn, Te, Tl and Zn) in three grades of lead: Electrolytically refined lead BCR No 286, thermally refined lead BCR No 287, lead with added impurities BCR No 288. Luxembourg: Commission of the European Communities, 1985.

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United States. National Aeronautics and Space Administration., ed. Macrosegregation and nucleation in undercooled Pb-Sn alloys. [Washington, DC]: National Aeronautics and Space Administration, 1989.

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V, Laxmanan, and United States. National Aeronautics and Space Administration., eds. Gravitational macrosegregation in binary Pb-Sn alloy ingots. [Washington, DC: National Aeronautics and Space Administration, 1987.

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(Pisa), Scuola Normale Superiore. SN/G: Report on data processing projects in art : Indexes. 1988.

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Book chapters on the topic "In-Sn"

1

Benz, Willy, and F. C. Thielemann. "Mixing in SN 1987A." In Supernovae, 249–53. New York, NY: Springer New York, 1991. http://dx.doi.org/10.1007/978-1-4612-2988-9_34.

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Burzo, E. "Extraframework cation distribution in Sn-X and Sn-Y faujasites." In Magnetic Properties of Non-Metallic Inorganic Compounds Based on Transition Elements, 1048–49. Berlin, Heidelberg: Springer Berlin Heidelberg, 2017. http://dx.doi.org/10.1007/978-3-662-49337-3_37.

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Yang, Kichoon. "Compact Minimal Surfaces in Sn." In Complete and Compact Minimal Surfaces, 46–79. Dordrecht: Springer Netherlands, 1989. http://dx.doi.org/10.1007/978-94-009-1015-7_2.

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Kong, Lingxin, Junjie Xu, Baoqiang Xu, Shuai Xu, Bin Yang, Yifu Li, Dachun Liu, and Ruibo Hu. "Application of MIVM for Sn-Ag and Sn-In Alloys in Vacuum Distillation." In TMS 2016: 145thAnnual Meeting & Exhibition: Supplemental Proceedings, 367–74. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2016. http://dx.doi.org/10.1002/9781119274896.ch44.

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Kong, Lingxin, Junjie Xu, Baoqiang Xu, Shuai Xu, Bin Yang, Yifu Li, Dachun Liu, and Ruibo Hu. "Application of MIVM for Sn-Ag and Sn-In Alloys in Vacuum Distillation." In TMS 2016 145th Annual Meeting & Exhibition, 367–74. Cham: Springer International Publishing, 2016. http://dx.doi.org/10.1007/978-3-319-48254-5_44.

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Rösch, L. "Formation of the Sn-In Bond." In Inorganic Reactions and Methods, 233. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2007. http://dx.doi.org/10.1002/9780470145241.ch145.

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Arnett, David, Bruce Fryxell, and Ewald Muller. "Instabilities and Mixing in SN 1987A." In Supernovae, 232–44. New York, NY: Springer New York, 1991. http://dx.doi.org/10.1007/978-1-4612-2988-9_32.

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Nagatomo, Yasuhiro, Hisao Esaka, and Kei Shinozuka. "Comparison of the Volume Fractions of Primary Sn Depending on the Holding Time in Sn-Ag and Sn-Pb Alloys." In Proceedings of the 8th Pacific Rim International Congress on Advanced Materials and Processing, 2479–85. Cham: Springer International Publishing, 2013. http://dx.doi.org/10.1007/978-3-319-48764-9_307.

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Marton, Daniele, and Giuseppe Tagliavini. "Organotin Compounds: Studies on Sn-C, Sn-Sn, C-C and C-O-C Bond-forming Reactions in Aqueous Media." In Main Group Elements and their Compounds, 341–54. Berlin, Heidelberg: Springer Berlin Heidelberg, 1996. http://dx.doi.org/10.1007/978-3-642-52478-3_30.

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Nagatomo, Yasuhiro, Hisao Esaka, and Kei Shinozuka. "Comparison of the Volume Fractions of Primary Sn Depending on the Holding Time in Sn-Ag and Sn-Pb Alloys." In PRICM, 2479–85. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2013. http://dx.doi.org/10.1002/9781118792148.ch307.

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Conference papers on the topic "In-Sn"

1

Kang, Sung K., Jaewon Chang, Jae-Ho Lee, Keun-Soo Kim, and Hyuck Mo Lee. "Plastic deformation effect on Sn whisker growth in electroplated Sn and Sn-Ag solders." In 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC). IEEE, 2013. http://dx.doi.org/10.1109/ectc.2013.6575697.

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Dwarkadas, Vikram V., Stefan Immler, and Kurt Weiler. "SN Shock Evolution in the Circumstellar Medium surrounding SN 1987A." In SUPERNOVA 1987A: 20 YEARS AFTER: Supernovae and Gamma-Ray Bursters. AIP, 2007. http://dx.doi.org/10.1063/1.3682892.

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Dwarkadas, Vikram V., Stefan Immler, and Kurt Weiler. "SN Shock Evolution in the Circumstellar Medium surrounding SN 1987A." In SUPERNOVA 1987A: 20 YEARS AFTER: Supernovae and Gamma-Ray Bursters. AIP, 2007. http://dx.doi.org/10.1063/1.2803551.

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Illes, Balazs, and Barbara Horvath. "Comparing the IMC layer growth in Sn-Cu, Sn-Ag-Cu and Sn-Ni-Cu layer systems." In 2013 36th International Spring Seminar on Electronics Technology (ISSE). IEEE, 2013. http://dx.doi.org/10.1109/isse.2013.6648224.

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Chiang, P. J., J. Y. Wu, Y. C. Liao, and C. R. Kao. "Creep mechanism in characteristic orientation of Sn and Sn-1.8Ag by nanoindentation." In 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC). IEEE, 2018. http://dx.doi.org/10.23919/icep.2018.8374707.

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Pedigo, A. E., C. A. Handwerker, and J. E. Blendell. "Whiskers, hillocks, and film stress evolution in electroplated Sn and Sn-Cu films." In 2008 58th Electronic Components and Technology Conference (ECTC 2008). IEEE, 2008. http://dx.doi.org/10.1109/ectc.2008.4550174.

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Gao, Yanfang, Congqian Cheng, Mingliang Huang, Lihua Wang, and Jie Zhao. "Corrosion of Sn-0.75Cu solder and Sn-0.75Cu/Cu joint in salt solutions." In High Density Packaging (ICEPT-HDP). IEEE, 2011. http://dx.doi.org/10.1109/icept.2011.6066979.

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Kang, Hanbyul, Miji Lee, Sangkwon Park, Sangsu Ha, Gunrae Kim, Sangchul Shin, and Sangwoo Pae. "Characterization of plate-like Ni-Sn intermetallic compounds in Sn-Ag solder bump." In 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA). IEEE, 2017. http://dx.doi.org/10.1109/ipfa.2017.8060200.

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Mysliwiec, Marcin, Ryszard Kisiel, and Tomasz Falat. "Die attach by diffusion Sn-Ag-Sn soldering in high temperature electronics applications." In 2016 39th International Spring Seminar on Electronics Technology (ISSE). IEEE, 2016. http://dx.doi.org/10.1109/isse.2016.7563176.

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Vani, R., G. Kumar, and R. C. D'Souza. "Comparative study on corrosion of SN-3.5AG and SN-9ZN solders in acidic environment." In National Conference on Challenges in Research & Technology in the Coming Decades National Conference on Challenges in Research & Technology in the Coming Decades (CRT 2013). Institution of Engineering and Technology, 2013. http://dx.doi.org/10.1049/cp.2013.2559.

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Reports on the topic "In-Sn"

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Goldstein, J. L. F., Z. Mei, and J. W. Jr Morris. Research into the microstructure and mechanical behavior of eutectic Bi-Sn and In-Sn. Office of Scientific and Technical Information (OSTI), August 1993. http://dx.doi.org/10.2172/10111223.

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Wofenstine, Jeff, Donald Foster, Jeffrey Read, and Wishvender Behl. Cycle Life Enhancement in Cu-Sn Anodes. Fort Belvoir, VA: Defense Technical Information Center, May 2002. http://dx.doi.org/10.21236/ada403236.

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Mokhov, N. V., and I. L. Rakhno. Mitigating radiation loads in Nb(3)Sn quadrupoles for LHC upgrades. Office of Scientific and Technical Information (OSTI), August 2006. http://dx.doi.org/10.2172/892496.

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Bordini, Bernardo. Thermo-magnetic instabilities in Nb₃Sn superconducting accelerator magnets. Office of Scientific and Technical Information (OSTI), September 2006. http://dx.doi.org/10.2172/900365.

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Hearn, Thomas M., and James F. Ni. Uppermost Mantle Structure in Southern Eurasia from PN Tomography and Sn Attenuation. Fort Belvoir, VA: Defense Technical Information Center, June 1996. http://dx.doi.org/10.21236/ada310351.

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Kouvetakis, John, and J. Menendez. Next Generation, Si-Compatible Materials and Devices in the Si-Ge-Sn System. Fort Belvoir, VA: Defense Technical Information Center, October 2015. http://dx.doi.org/10.21236/ad1003360.

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Hays, W. H. Project W-314 specific test and evaluation plan for SN-635 transfer line (241-AY-01A to 241-AY-02A) and SN-633 transfer line tie in. Office of Scientific and Technical Information (OSTI), May 1998. http://dx.doi.org/10.2172/10148325.

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Imbasciati, Linda. Studies of Quench Protection in $Nb_{3}Sn$ Superconducting Magnets for Future Particle Accelerators. Office of Scientific and Technical Information (OSTI), June 2003. http://dx.doi.org/10.2172/1419205.

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McClenaghan, M. B., M. A. Parkhill, A. G. Pronk, G. R. Boldon, R M Pyne, and J. M. Rice. Till geochemical signatures of the Mount Pleasant Sn-W-Mo-Bi-In deposit, New Brunswick. Natural Resources Canada/ESS/Scientific and Technical Publishing Services, 2015. http://dx.doi.org/10.4095/295614.

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McClenaghan, M. B., M. A. Parkhill, A. G. Pronk, G. R. Boldon, R M Pyne, and J. M. Rice. Indicator mineral signatures of the Mount Pleasant Sn-W-Mo-Bi-In deposit, New Brunswick. Natural Resources Canada/ESS/Scientific and Technical Publishing Services, 2015. http://dx.doi.org/10.4095/297245.

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