Academic literature on the topic 'Inductor-less'

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Journal articles on the topic "Inductor-less"

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Jadav, Sunil, Garima Jain, and Pooja Rathi. "Monte Carlo analysis of inductor-less wideband amplifier." Journal of Information and Optimization Sciences 38, no. 6 (August 18, 2017): 781–89. http://dx.doi.org/10.1080/02522667.2017.1372128.

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Eguchi, Kei, Wanglok Do, and Akira Shibata. "Inductor‐Less Voltage Equalizer with Cross‐Coupled Structure." IEEJ Transactions on Electrical and Electronic Engineering 16, no. 1 (October 26, 2020): 164–66. http://dx.doi.org/10.1002/tee.23279.

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AMIRABADI, Amir, and Mahmoud KAMAREI. "Wideband Inductor-Less Linear LNA Using Post Distortion Technique." IEICE Transactions on Fundamentals of Electronics, Communications and Computer Sciences E94-A, no. 8 (2011): 1662–70. http://dx.doi.org/10.1587/transfun.e94.a.1662.

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Nagai, Ayumi, Takumi Kitamura, Mitsuo Ebisawa, and Manabu Ishitobi. "Densification of Core-Less Power Inductor for High Frequency Applications." IEEJ Transactions on Industry Applications 138, no. 9 (September 1, 2018): 723–29. http://dx.doi.org/10.1541/ieejias.138.723.

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Zhu, S., A. O. Mikul, P. Sun, Y. You, Jong-Hoon Kim, Byeong-Sam Kim, and Deukhyoun Heo. "Inductor-less SiGe pin diode attenuator with low phase variations." Electronics Letters 48, no. 20 (2012): 1287. http://dx.doi.org/10.1049/el.2012.2151.

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Martinez, Wilmar, Jun Imaoka, Kimihiro Nanamori, Masayoshi Yamamoto, and Takahiro Kawashima. "Recovery-Less Boost Converter with Saturable Inductor for Electric Vehicle Applications." IEEJ Transactions on Industry Applications 135, no. 9 (2015): 914–21. http://dx.doi.org/10.1541/ieejias.135.914.

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Pilli, Naresh K., Avneet K. Chauhan, Santosh Kumar Singh, and Xiaogang Xiong. "An Inductor-Less, Discontinuous Current Source Gate Driver for SiC Devices." IEEE Access 7 (2019): 34227–37. http://dx.doi.org/10.1109/access.2019.2904085.

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K, Vasudeva Reddy, and Prashantha Kumar H. "Inductor-less PVT robust gain switching balun LNA for multistandard applications." International Journal of Electronics 106, no. 9 (April 15, 2019): 1412–26. http://dx.doi.org/10.1080/00207217.2019.1600732.

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Bhattacharya, Ritabrata, Ananjan Basu, Karun Rawat, and Shiban K. Koul. "A high efficiency inductor-less broadband fully integrated CMOS power amplifier." International Journal of RF and Microwave Computer-Aided Engineering 25, no. 4 (October 25, 2014): 311–20. http://dx.doi.org/10.1002/mmce.20864.

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Chen, Zhiyuan, Man-Kay Law, Pui-In Mak, Wing-Hung Ki, and Rui P. Martins. "Fully Integrated Inductor-Less Flipping-Capacitor Rectifier for Piezoelectric Energy Harvesting." IEEE Journal of Solid-State Circuits 52, no. 12 (December 2017): 3168–80. http://dx.doi.org/10.1109/jssc.2017.2750329.

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Dissertations / Theses on the topic "Inductor-less"

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Abou, Seido Maamoun Carleton University Dissertation Engineering Electronics. "Design and analysis of CMOS monolithic inductor-less voltage controlled oscillators." Ottawa, 1996.

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Lin, Ray-Lee. "Piezoelectric Transformer Characterization and Application of Electronic Ballast." Diss., Virginia Tech, 2001. http://hdl.handle.net/10919/29948.

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The characterization and modeling of piezoelectric transformers are studied and developed for use in electronic ballasts. By replacing conventional L-C resonant tanks with piezoelectric transformers, inductor-less piezoelectric transformer electronic ballasts have been developed for use in fluorescent lamps. The piezoelectric transformer is a combination of piezoelectric actuators as the primary side and piezoelectric transducers as the secondary side, both of which work in longitudinal or transverse vibration mode. These actuators and transducers are both made of piezoelectric elements, which are composed of electrode plates and piezoelectric ceramic materials. Instead of the magnetic field coupling between the primary and secondary windings in a conventional magnetic core transformer, piezoelectric transformers transfer electrical energy via electro-mechanical coupling that occurs between the primary and secondary piezoelectric elements for isolation and step-up or step-down voltage conversion. Currently, there are three major types of piezoelectric transformers: Rosen, thickness vibration mode, and radial vibration mode, all three of which are used in DC/DC converters or in electronic ballasts for fluorescent lamps. Unlike the other two transformers, the characterization and modeling of the radial vibration mode piezoelectric transformer have not been studied and developed prior to this research work. Based on the piezoelectric and wave equations, the physics-based equivalent circuit model of radial vibration mode piezoelectric transformers is derived and verified through characterization work. Besides the major vibration mode, piezoelectric transformers have many spurious vibration modes in other frequency ranges. An improved multi-branch equivalent circuit is proposed, which more precisely characterizes radial vibration mode piezoelectric transformers to include other spurious vibration modes in wide frequency ranges, as compared with the characterizations achieved by prior circuits. Since the equivalent circuit of piezoelectric transformers is identical to the conventional L-C resonant tank used in electronic ballasts for fluorescent lamps, piezoelectric transformers replace the conventional L-C resonant tank in order to reduce the amount and cost of electronic components for the electronic ballasts. With the inclusion of the radial vibration mode piezoelectric transformer, the design and implementation of inductor-less piezoelectric transformer electronic ballast applications have been completed.
Ph. D.
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Trulls, Fortuny Xavier. "Design of broadband inductor-less RF front-ends with high dynamic range for G.hn." Doctoral thesis, Universitat Politècnica de Catalunya, 2012. http://hdl.handle.net/10803/463012.

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System-on-Chip (SoC) was adopted in recent years as one of the solutions to reduce the cost of integrated systems. When the SoC solution started to be used, the final product was actually more expensive due to lower yield. The developments in integrated technology through the years allowed the integration of more components in lesser area with a better yield. Thus, SoCs became a widely used solution to reduced the cost of the final product, integrating into a single-chip the main parts of a system: analog, digital and memory. As integrated technology kept scaling down to allow a higher density of transistors and thus providing more functionality with the same die area, the analog RF parts of the SoC became a bottleneck to cost reduction as inductors occupy a large die area and do not scale down with technology. Hence, the trend moves toward the research and design of inductor-less SoCs that further reduce the cost of the final solution. Also, as the demand for home networking high-data-rates communication systems has increased over the last decade, several standards have been developed to satisfy the requirements of each application, the most popular being wireless local area networks (WLANs) based on the IEEE 802.11 standard. However, poor signal propagation across walls make WLANs unsuitable for high-speed applications such as high-definition in-home video streaming, leading to the development of wired technologies using the existing in-home infrastructure. The ITU-T G.hn recommendation (G.9960 and G.9961) unifies the most widely used wired infrastructures at home (coaxial cables, phone lines and power lines) into a single standard for high-speed data transmission of up to 1 Gb/s. The G.hn recommendation defines a unified networking over power lines, phone lines and coaxial cables with different plans for baseband and RF. The RF-coax bandplan, where this thesis is focused, uses 50 MHz and 100 MHz bandwidth channels with 256 and 512 carriers respectively. The center frequency can range from 350 MHz to 2450 MHz. The recommendation specifies a transmission power limit of 5 dBm for the 50 MHz bandplan and 8~dBm for the 100 MHz bandplan, therefore the maximum transmitted power in each carrier is the same for both bandplans. Due to the nature of an in-home wired environment, receivers that can handle both very large and very small amplitude signals are required; when transmitter and receiver are connected on the same electric outlet there is no channel attenuation and the signal-to-noise-plus-distortion ratio (SNDR) is dominated by the receiver linearity, whereas when transmitter and receiver are several rooms apart channel attenuation is high and the SNDR is dominated by the receiver noise figure. The high dynamic range specifications for these receivers require the use of configurable-gain topologies that can provide both high-linearity and low-noise for different configurations. Thus, this thesis has been aimed at researching high dynamic range broadband inductor-less topologies to be used as the RF front-end for a G.hn receiver complying with the provided specifications. A large part of the thesis has been focused on the design of the input amplifier of the front-end, which is the most critical stage as the noise figure and linearity of the input amplifier define the achievable overall specifications of the whole front-end. Three prototypes has been manufactured using a 65 nm CMOS process: two input RFPGAs and one front-end using the second RFPGA prototype.
El "sistema en un chip" (SoC) fue adoptado recientemente como una de las soluciones para reducir el coste de sistemas integrados. Cuando se empezó a utilizar la solución SoC, el producto final era más caro debido al bajo rendimiento de producción. Los avances en tecnología integrada a lo largo de los años han permitido la integración de más componentes en menos área con mejoras en rendimiento. Por lo tanto, SoCs pasó a ser una solución ampliamente utilizada para reducir el coste del producto final, integrando en un único chip las principales partes de un sistema: analógica, digital y memoria. A medida que las tecnologías integradas se reducían en tamaño para permitir una mayor densisdad de transistores y proveer mayor funcionalidad con la misma área, las partes RF analógicas del SoC pasaron a ser la limitación en la reducción de costes ya que los inductores ocupan mucha área y no escalan con la tecnología. Por lo tanto, las tendencias en investigación se mueven hacia el diseño de SoCs sin inductores que todavía reducen más el coste final del producto. También, a medida que la demanda en sistemas de comunicación domésticos de alta velocidad ha crecido a lo largo de la última década, se han desarrollado varios estándares para satisfacer los requisitos de cada aplicación, siendo las redes sin hilos (WLANs) basadas en el estándar IEEE 802.11 las más populares. Sin embargo, una pobre propagación de señal a través de las paredes hacen que las WLANs sean inadecuadas para aplicaciones de alta-velocidad como transmisión de vídeo de alta definición en tiempo real, resultando en el desarrollo de tecnologías con hilos utilizando la infraestructura existente en los domicilios. La recomendación ITU-T G.hn (G.9960 and G.9961) unifica las principales infraestructuras con hilos domésticas (cables coaxiales, línias de teléfono y línias de electricidad) en un sólo estándar para la transmisión de datos hasta 1 Gb/s. La recomendación G.hn define una red unificada sobre línias de electricidad, de teléfono y coaxiales con diferentes esquemas para banda base y RF. El esquema RF-coax en el cual se basa esta tesis, usa canales con un ancho de banda de 50 MHz y 100 MHz con 256 y 512 portadoras respectivamente. La frecuencia centra puede variar desde 350 MHz hasta 2450 MHz. La recomendación especifica un límite en la potencia de transmisión de 5 dBm para el esquema de 50 MHz y 8 dBm para el esquema de 100 MHz, de tal forma que la potencia máxima por portadora es la misma en ambos esquemas. Debido a la estructura de un entorno doméstico con hilos, los receptores deben ser capaces de procesar señales con amplitud muy grande o muy pequeña; cuando transmisor y receptor están conectados en la misma toma eléctrica no hay atenuación de canal y el ratio de señal a rudio más distorsión (SNDR) está dominado por la linealidad del receptor, mientras que cuando transmisor y receptor están separados por varias habitaciones la atenuación es elevada y el SNDR está dominado por la figura de ruido del receptor. Los elevados requisitos de rango dinámico para este tipo de receptores requieren el uso de topologías de ganancia configurable que pueden proporcionar tanto alta linealidad como bajo ruido para diferentes configuraciones. Por lo tanto, esta tesis está encarada a la investigación de topologías sin inductores de banda ancha y elevado rango dinámico para ser usadas a la entrada de un receptor G.hn cumpliendo con las especificaciones proporcionadas. Una gran parte de la tesis se ha centrado en el diseño del amplificador de entrada al ser la etapa más crítica, ya que la figura de ruido y linealidad del amplificador de entrada definen lás máximas especificaciones que el sistema puede conseguir. Se han fabricado 3 prototipos con un proceso CMOS de 65 nm: 2 amplificadores y un sistema completo con amplificador y mezclador.
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Wong, Man Chun. "A 1.8-V 2.4-GHz monolithic CMOS inductor-less frequency synthesizer for bluetooth application /." View Abstract or Full-Text, 2002. http://library.ust.hk/cgi/db/thesis.pl?ELEC%202002%20WONG.

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Horsley, Edward Lewis. "Modelling and analysis of radial mode piezoelectric transformers and inductor-less resonant power converters." Thesis, University of Sheffield, 2011. http://etheses.whiterose.ac.uk/12870/.

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Within the electronics industry there is a continual demand for DC-DC power converters that achieve high power density at low cost. Since a piezoelectric transformer (PT) has an electrical equivalent circuit that is similar to several resonant converter topologies, a PT can be used to replace many of the reactive components in these topologies with a single ceramic component, thereby offering potential savings in cost, size, and mass. The first part of this thesis presents a new equivalent circuit model for one of the most promising types of PT, the radial mode Transoner. This model relates the electrical characteristics of the PT to the physical dimensions and material properties. Considerable insight is then gained about how to design these devices to meet a particular set of converter specifications whilst simultaneously maximising PT power density. The second part of this thesis concerns the effect of the rectifier topology on PT power density. Using concepts from material science, together with equivalent circuit models of both the PT and the rectifier topologies, it is shown that a given PT will always achieve a higher thermally limited maximum output power when used in an AC-output topology compared to a DC-output topology. The half-bridge inductor-less PT-based converter topology is particularly attractive because it requires no additional components between the half-bridge and the rectifier. However, it is difficult to achieve zero-voltage-switching (ZVS) without significantly compromising PT power density when using this topology. The third part of this thesis details the development and experimental verification of a new model for the ZVS condition. Using a normalisation scheme and numerical optimisation techniques, the requirements for achieving inductor-less ZVS are accurately quantified for the first time. The impact of these requirements on PT power density is assessed, and design guidelines for maximising PT power density are given.
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Szilàgyi, Làszlò, Guido Belfiore, Ronny Henker, and Frank Ellinger. "20–25 Gbit/s low-power inductor-less single-chip optical receiver and transmitter frontend in 28 nm digital CMOS." Cambridge University Press, 2017. https://tud.qucosa.de/id/qucosa%3A70657.

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The design of an analog frontend including a receiver amplifier (RX) and laser diode driver (LDD) for optical communication system is described. The RX consists of a transimpedance amplifier, a limiting amplifier, and an output buffer (BUF). An offset compensation and common-mode control circuit is designed using switched-capacitor technique to save chip area, provides continuous reduction of the offset in the RX. Active-peaking methods are used to enhance the bandwidth and gain. The very low gate-oxide breakdown voltage of transistors in deep sub-micron technologies is overcome in the LDD by implementing a topology which has the amplifier placed in a floating well. It comprises a level shifter, a pre-amplifier, and the driver stage. The single-chip frontend, fabricated in a 28 nm bulk-digital complementary metal–oxide–semiconductor (CMOS) process has a total active area of 0.003 mm² , is among the smallest optical frontends. Without the BUF, which consumes 8 mW from a separate supply, the RX power consumption is 21 mW, while the LDD consumes 32 mW. Small-signal gain and bandwidth are measured. A photo diode and laser diode are bonded to the chip on a test-printed circuit board. Electro-optical measurements show an error-free detection with a bit error rate of 10⁻¹² at 20 Gbit/s of the RX at and a 25 Gbit/s transmission of the LDD.
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Tan, Zheyuan. "Four-Output Isolated Power Supply for the Application of IGBT Gate Drive." Thesis, Virginia Tech, 2010. http://hdl.handle.net/10919/32925.

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This thesis focuses on the design issues of the multiple-output boost full-bridge converter, which is constructed by cascading the boost regulator with the inductor-less full-bridge converter. The design of the boost regulator has been proposed briefly with component selection and compensator design. After that, the inductor-less full-bridge converter is analyzed extensively. In the first place, the operation principle of the inductor-less full-bridge converter is introduced. Later, the effect of parasitic resistance and inductance is analyzed in an L-R series circuit model as step-response, which relates the drop of output voltage to the load current. Then, the effects of the dc blocking capacitor for the unbalanced load condition and unbalanced duty cycle are tackled. The theoretical results are compared with the experimental results and the simulation results to verify the relationship between the output voltage drop and load current. The overall efficiency of the converter is tested under various conditions.

The design of the planar transformer is critical to limit the profile of the converter and the leakage phenomenon. A planar transformer fit for the inductor-less full-bridge converter is designed and analyzed in 3D FEA software. An N-port transformer model is proposed to implement the inductance matrix into the leakage inductance matrix for circuit analysis. Based on this N-port model several measurements to extract the parameters in this model are proposed, where only the impedance analyzer is needed. Finally, the effects of trace layout and encapsulation on breakdown voltage in PCB are summarized from experimental results.
Master of Science

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Peng, Hsin-Chan, and 彭新展. "An Inductor-less VCSEL Driver for Short Distance Optical Interconnection." Thesis, 2013. http://ndltd.ncl.edu.tw/handle/41314081208017146165.

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碩士
國立清華大學
電子工程研究所
101
Due to the wide spread of mobile devices, the needs of short–distance information processing grow fast recently. Since the properties and the bandwidth of electrical communication are restricted by the physical characteristics of copper cables, the application of electrical communication will reach its limit in the near future. However, the optical fiber communication performs well at the high bandwidth interface and has only a few drawbacks at the electrical interface, therefore the short-distance optical fiber communication system has become an important research topic. Because of low energy consumption of short-distance optical fiber communication system, VCSEL is usually chosen as a trigger for transferring electrical energy to light. The operation bandwidth of Pre-Amplifier in VCSEL driver is usually increased by the inductor due to its simple design. However, the inductor occupies a huge portion of layout, and the coils inside easily generates electromagnetic fields while the current flowing through them. To overcome this issue, the distance between different passive inductor should be extended, which occupies more area in layout. In this thesis, active inductor is introduced to solve the problem above. This design contains negative capacitance, folded active inductor, cascode structure, and active feedback circuit etc. to increase the bandwidth but lower the power consumption. VCSEL Driver is produced by TSMC 0.18μm CMOS fabrication, and the range of current is from 5mA to 15mA. The optical measurement result shows that the power consumption of Pre-Amplifier is only 182mW, the total area of circuit is 0.48mm x 0.44mm, and Bit Rate is 7.5Gb/s.
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Chia-HuaYeh and 葉佳樺. "A Novel Electrolytic Capacitor-Less Multilevel Inverter with Coupled Inductor." Thesis, 2014. http://ndltd.ncl.edu.tw/handle/37221899383670942408.

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碩士
國立成功大學
電機工程學系
102
In this thesis, a novel multilevel electrolytic capacitor-less inverter is proposed. With the three-winding coupled inductor, input voltage can be divided without electrolytic capacitors. Hence, no voltage-balancing circuit is needed. Less power switches are required for the proposed circuit compared to the existing topologies. Only ten switches are required to generate seven-level output. The operating principle, mode analysis and modulation method are introduced. The control scheme is implemented by TMS320F28035. Finally, a laboratory prototype of seven-level inverter with 320V input voltage and 220 Vrms/3kW output is implemented. The efficiency under full load is 94.82%, the maximum efficiency is 96.39% under 74.34 % load. Lastly, extended circuits are also proposed.
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Lee, Ying-Han, and 李盈翰. "An Inductor-less 20 Gb/s AC Coupled Chip-to-Chip Interconnect." Thesis, 2013. http://ndltd.ncl.edu.tw/handle/68566422711759993272.

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碩士
國立臺灣大學
電子工程學研究所
102
Today, the scaling of MOS transistor dimensions is a key factor in the improvement of performance of CMOS technology. High speed links with small AC coupling capacitances are increasing in importance. As a result, the receiver receives a stream of positive and negative pulses corresponding to the rising and falling edges of transmitted data. Receivers which are capable of recovering NRZ signals from these narrow pulses are referred to in this work as AC coupled receivers, and are not to be confused with receivers for links with a relatively large DC blocking capacitor where the received waveforms still look like an NRZ signal with some baseline wander. This thesis introduces a high-speed 12 Gb/s AC coupled receiver architecture for high density interconnects and a modified design for the 1st design which can operate at the 20Gb/s. The proposed architecture combines a novel hysteresis circuit path and a linear broadband amplifier path to recover a NRZ signal from a 75fF capacitor coupled channel. Due to the small coupling capacitances, the transmitted NRZ data at high frequency transitions can be detected at the receiver. The main challenge of the receiver front end is to recover NRZ data from the low swing pulses. In conclusion, 2 chips are designed and fabricated in TSMC 90nm CMOS technology. The 1st proposed chip is using a novel hysteresis circuit path without any compensation technique. The 2nd proposed chip improve the 1st chip integrated with time domain compensation. In addition, we also designed a Low dropout, low quiescent current, output capacitor-less regulator showed in appendix.
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Book chapters on the topic "Inductor-less"

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Farazian, Mohammad, Prasad S. Gudem, and Lawrence E. Larson. "An Inductor-Less CMOS 14-Band Frequency Synthesizer for UWB." In Fast Hopping Frequency Generation in Digital CMOS, 107–33. New York, NY: Springer New York, 2012. http://dx.doi.org/10.1007/978-1-4614-0490-3_6.

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Samiullah, Md, Imtiaz Ashraf, and Atif Iqbal. "A Transformer-Less Ultra-Gain Switched Inductor Boost Converter for DC Microgrid Applications." In Lecture Notes in Electrical Engineering, 689–700. Singapore: Springer Singapore, 2021. http://dx.doi.org/10.1007/978-981-33-4080-0_66.

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Kumar, Abhishek. "40-GHz Inductor Less VCO." In AI Techniques for Reliability Prediction for Electronic Components, 288–98. IGI Global, 2020. http://dx.doi.org/10.4018/978-1-7998-1464-1.ch016.

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In a modern communication system, voltage-controlled oscillator (VCO) acts as a basic building block for frequency generation. VCO with LC tank is preferred with passive inductor and varactor in radio frequency. Practical tuning range of VCO is low and unsuitable for wideband application. Switched capacitor and inductor can widen but at cost of chip area and complex system architecture. To overcome it, an equivalent circuit of the inductor is created. In this work, inductor-less VCO is implemented with CMOS 90nm technology that has center frequency 40GHz and frequency tuning range 37.7GHz to 41.9GHz.
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Ben Amor, M., M. Loulou, S. Quintanel, and D. Pasquet. "Multiband Multi-Standard LNA with CPW Transmission Line Inductor." In Advances in Monolithic Microwave Integrated Circuits for Wireless Systems, 48–68. IGI Global, 2012. http://dx.doi.org/10.4018/978-1-60566-886-4.ch003.

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LNA is one very essential bloc in the RF receiver. Due to the growth of the standard evolution, this component must handle several frequency bands with the best performances. This chapter presents a wide band LNA design for IEEE802.16 standard with the CMOS 0.35µm technology. In this LNA, we use a CPW transmission line to design the inductive degeneration inductor of 0.38nH. This circuit has a S21 of 12dB, a noise figure less than 3dB and an input/output reflexion coefficient less than -10dB between 2 and 6GHz. The CPW line presents a characteristic impedance of 120O, an inductance of 0.38nH, a capacitance of few fF and a resistance less than 2O on the desired frequency band.
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Keats, Jonathon. "Memristor." In Virtual Words. Oxford University Press, 2010. http://dx.doi.org/10.1093/oso/9780195398540.003.0014.

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The capacitor was discovered in 1745 by Ewald Georg von Kleist, whose encounter with a generator and a jar of water shocked him so severely that he declared himself unwilling to repeat the experience “for the kingdom of France.” The resistor announced itself to mankind somewhat less dramatically in 1827, followed by the inductor in 1831. For the next 140 years these three components were considered the basic elements of electronics. Each accomplished what the others could not, even in combination, and together they gave engineers rudimentary control over electromagnetism. The capacitor linked charge and current, the resistor, current and voltage, and the inductor, current and flux. Later innovations, most notably the invention of transistors in 1947, would vastly expand the capability of electronics and even more incredibly stretch our expectations, yet everyone remained satisfied with the three old “passive” elements. If any more existed there simply was no need to find them. Then along came a young engineer named Leon Chua, who, unusual for someone in his profession, had an Aristotelian turn of mind. Instead of asking himself what could be done with capacitors and resistors and inductors, he sought to define what they were. His definitions, expressed in abstract terms of charge and current and voltage and flux, suggested to him an incomplete pattern, like a crossword puzzle with all but one word filled in. In 1971 he predicted the existence of a missing link between flux and charge. He gave it a name. He called his component a memristor . Still, it was only a placeholder, since nobody had ever seen one or cared about manufacturing them. His mathematical reasoning was elegant, acknowledged those who bothered to follow it, but engineers were much more excited by his 1983 invention of a simple circuit that behaved chaotically (in the formal mathematical sense), with obvious applications in computing and security. The circuit was named in his honor, making him a very minor celebrity.
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Conference papers on the topic "Inductor-less"

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Lim, Seongwoong, Wasanthamala Badalawa, and Minoru Fujishima. "A 110GHz inductor-less CMOS frequency divider." In 2009 IEEE Asian Solid-State Circuits Conference (A-SSCC). IEEE, 2009. http://dx.doi.org/10.1109/asscc.2009.5357179.

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Ahmed, Abdulhakim, and James Stuart Wight. "5.9 GHZ Inductor-Less Low Noise Amplifier." In 2006 Canadian Conference on Electrical and Computer Engineering. IEEE, 2006. http://dx.doi.org/10.1109/ccece.2006.277455.

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Liu, Mengmeng, Sheng Zhang, Shuo Wang, Jianliang Zhang, and Runde Zhou. "Low power inductor-less pulse UWB transceiver." In 2009 IEEE International Symposium on Circuits and Systems - ISCAS 2009. IEEE, 2009. http://dx.doi.org/10.1109/iscas.2009.5118207.

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Ahmed, Abdulhakim, and James Wight. "5.9 GHZ Inductor-Less Low Noise Amplifier." In 2006 IEEE North-East Workshop on Circuits and Systems. IEEE, 2006. http://dx.doi.org/10.1109/newcas.2006.250898.

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Haddad, F., I. Ghorbel, and W. Rahajandraibe. "Multi-band inductor-less VCO for IoT applications." In 2017 IEEE International Symposium on Circuits and Systems (ISCAS). IEEE, 2017. http://dx.doi.org/10.1109/iscas.2017.8050738.

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Zhan, Jing-hong Conan, and Stewart S. Taylor. "An Inductor-Less Broadband LNA with Gain Step." In ESSCIRC 2006. Proceedings of the 32nd European Solid-State Circuits Conference. IEEE, 2006. http://dx.doi.org/10.1109/esscir.2006.307601.

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Alahyari, A., H. Hassani, A. Habibzadeh, M. Zamani, and M. Dousti. "Inductor-Less monolithic tunable active dual-band bandpass Filter." In 2011 International Conference on Electronic Devices, Systems and Applications (ICEDSA). IEEE, 2011. http://dx.doi.org/10.1109/icedsa.2011.5959035.

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Chaodong Ling, Lifen Lin, Xiao Yang, and Weiwei Huang. "Design of CMOS inductor-less LNA with active balun." In 2011 International Conference on Anti-Counterfeiting, Security and Identification (2011 ASID). IEEE, 2011. http://dx.doi.org/10.1109/asid.2011.5967449.

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Guoxi Sun, Jay Guoxu Liu, Haibing Zhang, Dongming Wang, and Z. Frank Fan. "A fully-integrated compact LED module with inductor-less and capacitor-less LED driver." In 2013 10th China International Forum on Solid State Lighting (ChinaSSL). IEEE, 2013. http://dx.doi.org/10.1109/sslchina.2013.7177301.

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Romanova, Agata, and Vaidotas Barzdenas. "Inductor-less Low-Noise CMOS Transimpedance Amplifier for OTDR Applications." In 2019 IEEE Microwave Theory and Techniques in Wireless Communications (MTTW). IEEE, 2019. http://dx.doi.org/10.1109/mttw.2019.8897257.

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