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Relevant bibliographies by topics / Inductors

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Academic literature on the topic 'Inductors'

Author: Grafiati

Published: 4 June 2021

Last updated: 25 July 2025

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Journal articles on the topic "Inductors"

1

Scirè, Daniele, Gianpaolo Vitale, Marco Ventimiglia, and Giuseppe Lullo. "Non-Linear Inductors Characterization in Real Operating Conditions for Power Density Optimization in SMPS." Energies 14, no. 13 (2021): 3924. http://dx.doi.org/10.3390/en14133924.

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The exploitation of power inductors outside their linear region in switching converters can be achieved by raising the current until a decrease in the inductance can be noticed. This allows using a smaller magnetic core, increasing the power density of the converter. On the other hand, a detailed description of the magnetization curve including the temperature is required. Since this information is often not included in the inductor’s datasheets, this paper shows how to identify the behavior of an inductor when it is operated up to saturation and its temperature rises. In order to characterize

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Wang, James J. "Flexible On-Chip Inductors and Transformer." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2010, DPC (2010): 001948–66. http://dx.doi.org/10.4071/2010dpc-wp34.

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Inductors directly on-chip was designed, processed and tested. Combining thick, electroplated gold used to produce LCD driver ICs plus gold wire bonding, toroidal inductors are formed directly on top of ICs. Both processes are production ready. One layouts inductor line segments on top of ICs and then complete loops using gold wire bonds at packaging. Two, 4, 8 or 16 toroids will fit inside thin QFN package. Cost to integrate 2 or more inductors is less than buying 0402 chip inductors and then soldering SMT components around ICs. Integrating inductors shrinks PCB board and allows IC design of

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Balamurugan, Karthigha, M. Nirmala Devi, and M. Jayakumar. "Low Noise Amplifier at 60 GHz Using Low Loss On-Chip Inductors." Journal of Electrical and Computer Engineering 2023 (August 23, 2023): 1–15. http://dx.doi.org/10.1155/2023/2469673.

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This paper proposes the technique of using low loss on-chip inductors in the design of low noise amplifier (LNA) that offers high gain and lower noise figure. Upon the substrate of octagonal spiral inductors, a surface of patterned ground shield is inserted that significantly reduces the substrate loss. This effect limits the penetration of electric filed into the substrate, thereby improving the inductor’s Quality (Q) factor and decouples the substrate parasitic that results with smaller series resistance. These effects result with improved gain and noise figure of LNA at 60 GHz when the desi

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Namoune, A., R. Taleb, N. Mansour, M. R. Benzidane, and A. Boukortt. "Integrated through-silicon-via-based inductor design in buck converter for improved efficiency." Electrical Engineering & Electromechanics, no. 6 (October 21, 2023): 54–57. http://dx.doi.org/10.20998/2074-272x.2023.6.09.

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Introduction. Through-silicon-via (TSV) is one of the most important components of 3D integrated circuits. Similar to two-dimensional circuits, the performance evaluation of 3D circuits depends on both the quality factor and inductance. Therefore, accurate TSV-inductor modeling is required for the design and analysis of 3D integrated circuits. Aim. This work proposes the equivalent circuit model of the TSV-inductor to derive the relations that determine both the quality factor and the inductance by Y-parameters. Methods. The model developed was simulated using MATLAB software, and it was used

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Muneeswaran, Dhamodaran, Jegadeesan Subramani, Thanapal Pandi, Navaneethan Chenniappan, and Meenatchi Shanmugam. "Modelling of Different On-chip Inductors for Radio Frequency Integrated Circuits." Proceedings of the Bulgarian Academy of Sciences 75, no. 10 (2022): 1491–98. http://dx.doi.org/10.7546/crabs.2022.10.12.

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This paper presents a typical frequency-dependent modelling of different on-chip inductors for RFICs design problems. Modern RF circuits often feature on-chip inductors required by modern circuit design. A comparison of different inductor geometrics includes a planar spiral inductor and novel multilayer inductors are analyzed. An electromagnetic model with fewer assumptions than empirical equations and higher efficiency than full-field solvers would be welcome. So would facile comparisons of different inductor structures. This paper describes recent work on the electromagnetic modelling of on-

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Wirtz, Jochen, Chris Tang, and Dominik Georgi. "Successful referral behavior in referral reward programs." Journal of Service Management 30, no. 1 (2019): 48–74. http://dx.doi.org/10.1108/josm-04-2018-0111.

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PurposeReferral reward programs (RRPs) incentivize existing customers (inductors) to refer new customers (inductees). The effectiveness of RRPs is not well understood as previous studies either focused on referral intent and/or ignored inductee responses. However, an RRP is only effective if inductors recommend and inductees respond with buying the service. The purpose of this paper is to examine the drivers of existing customers’ successful referral behavior.Design/methodology/approachThis study combines a bank’s customer relationship management (CRM) data which were used to identify successf

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Karjalainen, Päivi H., Juha Rapelo, and Eero O. Ristolainen. "Spiral Inductors with Multi-Strip Coils Processed on Sapphire and Bulk Silicon Substrates." Journal of Microelectronics and Electronic Packaging 1, no. 4 (2004): 206–16. http://dx.doi.org/10.4071/1551-4897-1.4.206.

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Improvements in inductor properties are demonstrated using inductors fabricated by the SOS and CMOS processes. Inductor coils are constructed in the form of several separate strips and the effect of the coil layout on the inductance and quality factor is examined with respect to traditional (“un-slit”) inductors. Optimized multi-strip layout increases the inductance and the quality factor of an inductor. The coil layout has very little influence on the self-resonance frequency of the inductor. Multi-strip layout of the inductor coil increases the coil's series resistance, which in conjunction

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Li, Xu, and Li. "Analysis of the Performance Variation Mechanism of MEMS Suspended Inductors under Mechanical Shock." Micromachines 10, no. 10 (2019): 686. http://dx.doi.org/10.3390/mi10100686.

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Micro-electromechanical system (MEMS) suspended inductors have been widely studied in recent decades because of their excellent radio frequency performance. However, the deformation of the inductor coil and the performance variation usually occur to the MEMS suspended inductors when the inductors are under mechanical shock. Few studies have been carried out on the performance variation of MEMS suspended inductors under shock. In this study, the mechanism of the performance variation of MEMS suspended inductors under mechanical shock is analyzed by combining theoretical analysis and experiments

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SOLIMAN, AHMED M. "A NOTE ON THE TRANSFORMATION OF GROUNDED INDUCTORS TO FLOATING INDUCTORS USING OFA AND FCCII." Journal of Circuits, Systems and Computers 22, no. 02 (2013): 1250086. http://dx.doi.org/10.1142/s0218126612500867.

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Recently this author published a paper1 discussing the transformation of grounded inductors to floating inductors using operational floating amplifier (OFA) or floating current conveyor (FCCII). The author classified the paper as a partially review paper as stated in the abstract and in the introduction of Ref. 1 The author states in the abstract that: It is well known that a floating inductor circuit is realized from a grounded inductor circuit by replacing the operational amplifier by a floating operational transconductance amplifier. This idea is extended to transform current conveyor groun

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Farooq, Muhammad, Bilal Amin, Adnan Elahi, William Wijns, and Atif Shahzad. "Planar Elliptical Inductor Design for Wireless Implantable Medical Devices." Bioengineering 10, no. 2 (2023): 151. http://dx.doi.org/10.3390/bioengineering10020151.

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Wireless implantable medical devices (WIMDs) have seen unprecedented progress in the past three decades. WIMDs help clinicians in better-understanding diseases and enhance medical treatment by allowing for remote data collection and delivering tailored patient care. The wireless connectivity range between the external reader and the implanted device is considered one of the key design parameters in WIMD technology. One of the common modes of communication in battery-free WIMDs is inductive coupling, where the power and data between the reader and the implanted device are transmitted via magnet

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Dissertations / Theses on the topic "Inductors"

1

Kavimandan, Mandar Dilip. "Integrated Inductors." Wright State University / OhioLINK, 2008. http://rave.ohiolink.edu/etdc/view?acc_num=wright1229637343.

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Nguyen, Thi Yen Mai. "Ferrite-based micro-inductors for power systems on chip : from material elaboration to inductor optimisation." Toulouse 3, 2014. http://thesesups.ups-tlse.fr/2564/.

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Les composants passifs intégrés sont des éléments clés pour les futures alimentations sur puce, compactes et présentant des performances améliorées: haut rendement et forte densité de puissance. L'objectif de ce travail de thèse est d'étudier les matériaux et la technologie pour réaliser de bobines à base de ferrite, intégrées sur silicium, avec des faibles empreintes (<4 mm ²) et de faible épaisseur (<250 µm). Ces bobines, dédiées à la conversion de puissance (˜ 1 W) doivent présenter une forte inductance spécifique et un facteur de qualité élevé dans la gamme de fréquence visée (5-10 M

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Woodward, Lisa. "Fabrication of Novel Suspended Inductors." Thesis, University of Waterloo, 2004. http://hdl.handle.net/10012/870.

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With the rapid growth in the wireless industry there has been increasing demand to make devices with better performance. This means lower power, lower voltage, smaller, and in general more efficient. This has lead to the interest in and necessity for good quality passive components. Good quality passive components make better filters, baluns, voltage controlled oscillators, and matching networks. There has been a lot of work over the last ten years focused on improving the quality of inductors. Typical inductors fabricated on silicon have Q factors of approximately 10.

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Raieszadeh, Mina. "High-Q Integrated Inductors on Trenched Silicon Islands." Thesis, Georgia Institute of Technology, 2005. http://hdl.handle.net/1853/6991.

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This thesis reports on a new implementation of high quality factor (Q) copper (Cu) inductors on CMOS-grade (10-20ohm.cm) silicon (Si) substrates using a fully CMOS-compatible process. A low-temperature (less than300C) fabrication sequence is employed to reduce the loss of Si wafers at RF frequencies by trenching the Si substrate. The high aspect-ratio (30:1) trenches are subsequently bridged over or refilled with a low-loss material to close the open areas and to create a rigid low-loss island (Trenched Si Island) on which the inductors can be fabricated. The method reported here does not requ

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Hon, Wai Cheong. "CMOS-compatible high-performance micromachined edge-suspended inductors /." View abstract or full-text, 2004. http://library.ust.hk/cgi/db/thesis.pl?ELEC%202004%20HON.

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Thesis (M. Phil.)--Hong Kong University of Science and Technology, 2004.<br>Includes bibliographical references (leaves 95-97). Also available in electronic version. Access restricted to campus users.

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Nation, Joshua C. (Joshua Caleb). "Fabrication of chip-scale radio frequency inductors." Thesis, Massachusetts Institute of Technology, 2014. http://hdl.handle.net/1721.1/92067.

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Thesis: S.M., Massachusetts Institute of Technology, Department of Mechanical Engineering, 2014.<br>This electronic version was submitted by the student author. The certified thesis is available in the Institute Archives and Special Collections.<br>Cataloged from student-submitted PDF version of thesis.<br>Includes bibliographical references (pages 101-104).<br>The purpose of this research was to learn the relationship between force and deformation in forming of micro-scale inductor coils. This was accomplished by applying large-deflection beam bending to the case of planar wire deformation a

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Butler, Stephen J. "Analysis and design of a low-ripple coupled-inductor boost topology." Thesis, This resource online, 1993. http://scholar.lib.vt.edu/theses/available/etd-10312009-020328/.

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Athreya, Dhanya. "High Q inductors on ultra thin organic substrates." Thesis, Atlanta, Ga. : Georgia Institute of Technology, 2008. http://hdl.handle.net/1853/24733.

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Thesis (M. S.)--Electrical and Computer Engineering, Georgia Institute of Technology, 2009.<br>Committee Chair: Prof. Rao Tummala; Committee Member: Prof. G.K. Chang; Committee Member: Prof. Maysam Ghovanloo.

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Danesh, Mina. "Monolithic inductors for silicon radio frequency integrated circuits." Thesis, National Library of Canada = Bibliothèque nationale du Canada, 1999. http://www.collectionscanada.ca/obj/s4/f2/dsk1/tape8/PQDD_0007/MQ45607.pdf.

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Rogers, John W. M. "Voltage-controlled oscillators and high-Q copper inductors." Thesis, National Library of Canada = Bibliothèque nationale du Canada, 1999. http://www.collectionscanada.ca/obj/s4/f2/dsk1/tape8/PQDD_0024/MQ48457.pdf.

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Books on the topic "Inductors"

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Yuan, Fei. CMOS Active Inductors and Transformers. Springer US, 2008. http://dx.doi.org/10.1007/978-0-387-76479-5.

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Bossche, Alex van den. Inductors and tranformers for power electronics. Taylor & Francis, 2005.

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Hurley, W. G., and W. H. Wölfle. Transformers and Inductors for Power Electronics. John Wiley & Sons, Ltd, 2013. http://dx.doi.org/10.1002/9781118544648.

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Haobijam, Genemala, and Roy Paily Palathinkal. Design and Analysis of Spiral Inductors. Springer India, 2014. http://dx.doi.org/10.1007/978-81-322-1515-8.

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Vencislav, Valchev, ed. Inductors and transformers for power electronics. Taylor & Francis, 2005.

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Commission, International Electrotechnical. Fixed inductors for radio interference suppression. International Electrotechnical Commission, 1988.

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7

Edward, Herbert. Design and application of matrix transformers & inductors. FMTT, 1989.

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Danesh, Mina. Monolithic inductors for silicon radio frequency integrated circuits. National Library of Canada, 1999.

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9

Aguilera, Jaime. Design and test of integrated inductors for RF applications. Kluwer Academic Publishers, 2003.

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10

Banerjee, Amal. Planar Spiral Inductors, Planar Antennas and Embedded Planar Transformers. Springer International Publishing, 2023. http://dx.doi.org/10.1007/978-3-031-08778-3.

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Book chapters on the topic "Inductors"

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Bartlett, Jonathan. "Inductors." In Electronics for Beginners. Apress, 2020. http://dx.doi.org/10.1007/978-1-4842-5979-5_20.

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Powell, Richard F. "Inductors." In Testing Active and Passive Electronic Components. Routledge, 2022. http://dx.doi.org/10.1201/9780203737255-4.

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Voltmer, David. "Inductors." In Fundamentals of Electromagnetics 1: Internal Behavior of Lumped Elements. Springer International Publishing, 2007. http://dx.doi.org/10.1007/978-3-031-79414-8_3.

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Enderle, John D. "Inductors." In Bioinstrumentation. Springer International Publishing, 2006. http://dx.doi.org/10.1007/978-3-031-01616-5_7.

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Zeng, Gengsheng Lawrence, and Megan Zeng. "Inductors." In Electric Circuits. Springer International Publishing, 2021. http://dx.doi.org/10.1007/978-3-030-60515-5_15.

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Pour Aryan, Naser. "Designing Inductors." In SpringerBriefs in Electrical and Computer Engineering. Springer International Publishing, 2014. http://dx.doi.org/10.1007/978-3-319-10187-3_2.

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Rincón-Mora, Gabriel Alfonso. "Switched Inductors." In Switched Inductor Power IC Design. Springer International Publishing, 2022. http://dx.doi.org/10.1007/978-3-030-95899-2_3.

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Raj, P. Markondeya, Gopal C. Jha, Sun Teng, Himani Sharma, Swapan K. Bhattacharya, and Rao R. Tummala. "Inductors: Micro- to Nanoscale Embedded Thin Power Inductors." In Nanopackaging. Springer International Publishing, 2018. http://dx.doi.org/10.1007/978-3-319-90362-0_10.

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Tahir-Kheli, Raza. "Resistors, Inductors, Capacitors." In Ordinary Differential Equations. Springer International Publishing, 2018. http://dx.doi.org/10.1007/978-3-319-76406-1_9.

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May, Colin. "Inductors and Transformers." In Passive Circuit Analysis with LTspice®. Springer International Publishing, 2020. http://dx.doi.org/10.1007/978-3-030-38304-6_11.

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Conference papers on the topic "Inductors"

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Roc’h, Anne, Riccardo Iannarelli, and Frank Leferink. "New Materials for Inductors." In 2009_EMC-Europe_Athens-Workshop. IEEE, 2009. https://doi.org/10.23919/emc.2009.10814006.

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Dai, Wei, Xiaoguo Liang, Alan Wu, Kaladhar Radhakrishnan, Michael Hansen, and Rishik Bazaz. "A Novel Control Scheme for Voltage Regulators with Coupled Inductors and Discrete Inductor." In 2024 IEEE Energy Conversion Congress and Exposition (ECCE). IEEE, 2024. https://doi.org/10.1109/ecce55643.2024.10861616.

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Frankemölle, Annika, and Alexander Lang. "Voltage Specification For Molded Inductors." In 2024 Energy Conversion Congress & Expo Europe (ECCE Europe). IEEE, 2024. http://dx.doi.org/10.1109/ecceeurope62508.2024.10751974.

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Jin, Lin, Albert Chee W. Lu, Lai L. Wai, Wei Fan, Aik Chong Tan, and Kai Chong Chan. "Design Optimization of Off-Chip Inductors." In ASME 2003 International Electronic Packaging Technical Conference and Exhibition. ASMEDC, 2003. http://dx.doi.org/10.1115/ipack2003-35223.

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A solution space design methodology is presented for optimization of off-chip inductors. The analysis has been performed for an advanced wafer level redistribution manufacturing process. Electromagnetic simulations were performed to extract the characteristics of different inductor designs. It was observed that the design optimization should be tuned to the operating frequency.

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Chang, Chao-Liang, Uei-Ming Jow, Chao-Ta Huang, et al. "Optimum Design of Inductors Used for Wireless Power Transmission Micro-Module." In ASME 2004 International Mechanical Engineering Congress and Exposition. ASMEDC, 2004. http://dx.doi.org/10.1115/imece2004-59934.

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The micro-inductor is a key component in wireless power transmission micro modules. In this paper, an optimum design for the micro-inductor was studied and related MEMS fabrication techniques were also developed. Commercial electromagnetic property analysis software, ANSOFT, was used to screen the main design factors of the micro-inductor. It was found that the high inductance and high quality factors of the micro-inductor implied high power transmission efficiency for the micro-module’s wireless power transmission. The electrical performance of the micro-inductor was affected by the thermal s

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Strakova, Malvine N., Alvis Eimuss, Vadims Geža, Mihails Ščepanskis, and Marcus Hellriegel. "Does 3D-Printed Coil Perform Better for Induction Hardening and How to Predict the Performance Based on Numerical Simulation?" In HT2021. ASM International, 2021. http://dx.doi.org/10.31399/asm.cp.ht2021exabp0066.

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Abstract Recent developments in additive manufacturing (also called 3D printing of inductors) have opened new possibilities in the induction heating field by making inductors that have a longer service life and are more reproducible. Computer simulations were done to compare inductors made with two different techniques – conventional manufacturing and additive manufacturing. To compare inductor performance, heating of the soldered joints, the change in power consumption in the inductors and the temperature field in the workpiece were studied. Also, different steel structures such as austenite,

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Hsu, Yung-Yu, Chao-Ta Huang, Chao-Liang Chang, Chih-Min Yao, Ming-Hsiao Lee, and Kung-Yu Tzeng. "Thermal Stress Analysis of Contactless Energy Transfer Micro Module." In ASME 2003 International Mechanical Engineering Congress and Exposition. ASMEDC, 2003. http://dx.doi.org/10.1115/imece2003-41241.

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The technology of contactless energy transfer is emerging for application in implantable medical device. High transfer efficiency and high quality factor are specific design requirements for micro-inductors which are key component of contactless energy transfer micro-modules. Thermal stress analysis and electrical analysis of an inductor are sequentially performed to elucidate the effect of thermal strain on the electrical properties of a micro-inductor. Three dimensional finite element models of an inductor were generated by the commercial stress analysis software, ANSYS, to calculate the the

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Wojewoda, Leigh, Dhanya Athreya, and Michael J. Hill. "Use Condition Characterization of Package Components." In ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems. ASMEDC, 2011. http://dx.doi.org/10.1115/ipack2011-52268.

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Discrete components, such as capacitors and inductors, play an important role in the analysis and design of electronic packages and printed circuit boards. Although the electrical parameters of discrete components are described by manufacturers, the component performance at product operating conditions can vary drastically from the manufacturer’s specification. Accurate characterization of discrete package components at operating conditions is essential to understand product operation. This paper will introduce a method to characterize discrete capacitors and inductors while applying multiple

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López de Urald, Pablo, Eider Gorostegui-Colinas, Beñat Urtasun, and Jon Mata-Etxaniz. "INDUSTRIAL APPLICATIONS OF INDUCTIVE THERMOGRAPHY: A NOVEL INDUCTOR FOR MULTI-DIRECTIONAL CRACK DETECTION." In QIRT. QIRT Council, 2022. http://dx.doi.org/10.21611/qirt.2022.3008.

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In the application of inductive thermography as a non-destructive testing technique for crack detection, the relative orientation of the induced currents with respect to the cracks is a fundamental parameter[1].During the last year, a new multidirectional inductor has been developed[2]. In this paper, this new inductor concept is applied to the detection of defects in components that belong to different industrial sectors in order to prove its utility. Obtained results are compared to traditional inductors

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Ciscato, D., and M. Cesano. "3D Multiphysics Modelling Applied to Parametric Analysis on Inductors Design." In HT 2017. ASM International, 2017. http://dx.doi.org/10.31399/asm.cp.ht2017p0106.

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Abstract The inductors design process is the key point in the development of an induction heating machine to fulfil the customer specifications. Some special hardening profiles can be uniquely achieved using the induction heating technology. Different inductors shapes, flux concentrators, power supply frequencies and cooling media can be used to get the optimal thermal profile for the heat treatment. The possibility to study the design robustness of the process using virtual prototyping is the key to speed up the test-trials loop and to give a tool for a better understanding of the process. In

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Reports on the topic "Inductors"

1

Swanson, H. W. Jr. Development of high reliability planar chip inductors. Office of Scientific and Technical Information (OSTI), 1994. http://dx.doi.org/10.2172/10181255.

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Bartkowski, Peter T., and Paul R. Berning. Inductance Calculations of Variable Pitch Helical Inductors. Defense Technical Information Center, 2015. http://dx.doi.org/10.21236/ada625194.

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Scofield, James, Seana McNeal, Brett Jordon, Hiroyuki Kosai, and Biswajit Ray. Studies of Interleaved DC-DC Boost Converters with Coupled Inductors. Defense Technical Information Center, 2011. http://dx.doi.org/10.21236/ada542736.

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Fasenfest, B., D. White, and J. Rockway. An Integral Method for Determining Induced Voltage in Time-Varying Wire Inductors. Office of Scientific and Technical Information (OSTI), 2005. http://dx.doi.org/10.2172/15016594.

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Hong, Y. K., Y. Qiang, D. E. Aston, C. A. Berven, J. L. Young, and G. W. Donohoe. Development of High Resistive and High Magnetization Soft Thin Film and Fabrication of Thin Film Inductors. Defense Technical Information Center, 2004. http://dx.doi.org/10.21236/ada433358.

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VIANCO, PAUL T., and STEVEN N. BURCHETT. Solder Joint Reliability Predictions for Leadless Chip Resistors, Chip Capacitors, and Ferrite Chip Inductors Using the SRS Software. Office of Scientific and Technical Information (OSTI), 2001. http://dx.doi.org/10.2172/783992.

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Sogayares, Patricia de Caires. Instituto Ethos: Empresas e responsabilidade social. Inter-American Development Bank, 2006. http://dx.doi.org/10.18235/0007274.

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Cadotte, R., S. C. Tidrow, W. Van Meerbeke, A. DeAnni, and A. Lepore. High Temperature Superconducting Inductor for Antenna Matching. Defense Technical Information Center, 1998. http://dx.doi.org/10.21236/ada358606.

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Veliz, O. Huancayo magnetic observatory Sokkisha earth inductor magnetometer. Natural Resources Canada/ESS/Scientific and Technical Publishing Services, 1988. http://dx.doi.org/10.4095/226566.

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Hull, J. P., and D. W. Scholfield. A Composite Capacitor/Inductor Assembly for Resonant Circuits. Defense Technical Information Center, 2001. http://dx.doi.org/10.21236/ada406884.

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