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1

Shepherd, Peter. Integrated circuit design, fabrication, and test. New York: McGraw-Hill, 1996.

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2

Shepherd, Peter. Integrated Circuit Design, Fabrication and Test. London: Macmillan Education UK, 1996. http://dx.doi.org/10.1007/978-1-349-13656-8.

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3

Simons, Rainee N. Novel low loss wide-band multi-port integrated circuit technology for RF/microwave applications. [Cleveland, Ohio]: National Aeronautics and Space Administration, Glenn Research Center, 2001.

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4

Simons, Rainee N. Novel low loss wide-band multi-port integrated circuit technology for RF/microwave applications. [Cleveland, Ohio]: National Aeronautics and Space Administration, Glenn Research Center, 2001.

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5

Simons, Rainee N. Novel low loss wide-band multi-port integrated circuit technology for RF/microwave applications. [Cleveland, Ohio]: National Aeronautics and Space Administration, Glenn Research Center, 2001.

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6

Simons, Rainee. Novel low loss wide-band multi-port integrated circuit technology for RF/microwave applications. [Cleveland, Ohio]: National Aeronautics and Space Administration, Glenn Research Center, 2001.

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7

Kondo, K. Morphological evolution of electrodeposits and electrochemical processing in ULSI fabrication and electrodeposition of and on semiconductors IV: Proceedings of the international symposia. Edited by Electrochemical Society Electrodeposition Division, Electrochemical Society. Dielectric Science and Technology Division, Electrochemical Society Electronics Division, and Electrochemical Society Meeting. Pennington, NJ: Electrochemical Society, 2005.

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8

Custom-specific integrated circuits: Design and fabrication. New York: Dekker, 1985.

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9

The worldwide IC wafer fabrication foundry market. Saratoga, Calif: Electronic Trend Publications, 1993.

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10

1936-, Sze S. M., ed. Fundamentals of semiconductor fabrication. New York: Wiley, 2004.

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11

Richard, Blanchard, ed. Modern semiconductor fabrication technology. Englewood Cliffs, N.J: Prentice-Hall, 1986.

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12

May, Gary S. Fundamentals of semiconductor fabrication. New York, NY: Wiley, 2003.

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13

Ree, Moonhor. Low-k nanoporous interdielectrics: Materials, thin film fabrications, structures and properties. Hauppauge, N.Y: Nova Science Publishers, 2010.

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14

VLSI fabrication principles: Silicon and gallium arsenide. 2nd ed. New York: Wiley, 1994.

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15

Montanari, Simone. Fabrication and characterization of planar Gunn diodes for monolithic microwave integrated circuits. Jülich: Forschungszentrum, Zentralbibliothek, 2005.

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16

Introduction to microelectronic fabrication. 2nd ed. Upper Saddle River, N.J: Prentice Hall, 2002.

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17

Introduction to microelectronic fabrication. Reading, Mass: Addison-Wesley Pub. Co., 1988.

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18

Microlithography: Process technology for IC fabrication. New York: McGraw-Hill, 1986.

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19

Zant, Peter Van. Microchip fabrication: A practicalguide to semiconductor processing. 2nd ed. New York: McGraw-Hill, 1990.

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20

J, Lacombat Michel, Wittekoek Steve, European Physical Society, European Federation for Applied Optics., Society of Photo-optical Instrumentation Engineers., and Association nationale de la recherche technique., eds. Optical microlithography and metrology for microcircuit fabrication: Proceedings, ECO2, 27-28 April, 1989, Paris, France. Bellingham, Wash., USA: SPIE, 1989.

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21

Zant, Peter Van. Microchip fabrication: A practical guide to semiconductor processing. 3rd ed. New York: McGraw-Hill, 1997.

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22

Zant, Peter Van. Microchip fabrication: A practical guide to semiconductor processing. 2nd ed. New York: McGraw-Hill, 1990.

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23

Microchip fabrication: A practical guide to semiconductor processing. 5th ed. New York: McGraw-Hill, 2004.

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24

Luo, Jianfeng. Integrated modeling of chemical mechanical planarization for sub-micron IC fabrication: From particle scale to feature, die and wafer scales. Berlin: Springer, 2004.

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25

Luo, Jianfeng. Integrated modeling of chemical mechanical planarization for sub-micron IC fabrication: From particle scale to feature, die and wafer scales. Berlin: Springer, 2005.

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26

Symposium on Electrochemical Processing in ULSI Fabrication (3rd 2000 Toronto, Ont.). Electrochemical processing in ULSI fabricatrion III: Proceedings of the International Symposium. Edited by Andricacos Panayotis C. 1951-, Electrochemical Society Electrodeposition Division, Electrochemical Society. Dielectric Science and Technology Division., Electrochemical Society Electronics Division, and Electrochemical Society Meeting. Pennington, N.J: Electrochemical Society, 2002.

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27

Integrated Circuit Fabrication Technology. 2nd ed. Mcgraw-Hill (Tx), 1989.

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28

Mathad, G. S. Pattern Transfer in Integrated Circuit Fabrication. John Wiley & Sons Inc, 2006.

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29

Zorich, Robert. The handbook of integrated circuit fabrication. Integrated Circuit Engineering, 2000.

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30

Zant, Peter Van. Integrated Circuit Manufacturing - Non-Technical References: Microchip Fabrication, Semiconductor Terminology. Semiconductor Services, 1992.

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31

Digital Integrated Circuit Design: From VLSI Architectures to CMOS Fabrication. Cambridge University Press, 2008.

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32

A, Mack Chris, Yuan Xiaocong, Society of Photo-optical Instrumentation Engineers., Nanyang Technological University, and Institute of Physics Singapore, eds. Microlithographic techniques in integrated circuit fabrication II: 28-30 November 2000, Singapore. Bellingham, Wash., USA: SPIE, 2000.

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33

L, Stover Harry, Wittekoek Steven, and Association nationale de la recherche technique., eds. Optical microlithographic technology for integrated circuit fabrication and inspection: 2-3 April 1987, The Hague, The Netherlands. Bellingham, Wash., USA: SPIE-the International Society for Optical Engineering, 1987.

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34

Capmany, José, and Daniel Pérez. Programmable Integrated Photonics. Oxford University Press, 2020. http://dx.doi.org/10.1093/oso/9780198844402.001.0001.

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Programmable Integrated Photonics (PIP) is a new paradigm that aims at designing common integrated optical hardware configurations, which by suitable programming can implement a variety of functionalities that, in turn, can be exploited as basic operations in many application fields. Programmability enables by means of external control signals both chip reconfiguration for multifunction operation as well as chip stabilization against non-ideal operation due to fluctuations in environmental conditions and fabrication errors. Programming also allows activating parts of the chip, which are not essential for the implementation of a given functionality but can be of help in reducing noise levels through the diversion of undesired reflections. After some years where the Application Specific Photonic Integrated Circuit (ASPIC) paradigm has completely dominated the field of integrated optics, there is an increasing interest in PIP justified by the surge of a number of emerging applications that are and will be calling for true flexibility, reconfigurability as well as low-cost, compact and low-power consuming devices. This book aims to provide a comprehensive introduction to this emergent field covering aspects that range from the basic aspects of technologies and building photonic component blocks to the design alternatives and principles of complex programmable photonics circuits, their limiting factors, techniques for characterization and performance monitoring/control and their salient applications both in the classical as well as in the quantum information fields. The book concentrates and focuses mainly on the distinctive features of programmable photonics as compared to more traditional ASPIC approaches.
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35

R, Bowman Ronald, and Integrated Circuit Engineering Corporation, eds. Advanced VLSI fabrication. Scottsdale, Ariz: Integrated Circuit Engineering Corporation, 1995.

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36

Eynon, Benjamin G., and Banqiu Wu. Photomask Fabrication Technology (Professional Engineering). McGraw-Hill Professional, 2005.

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37

Photomask Fabrication Technology (Professional Engineering). McGraw-Hill Professional, 2005.

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38

Zant, Peter Van. Microchip Fabrication: Practical Guide to Semiconductor Processing. McGraw-Hill Professional Publishing, 2013.

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39

Zant, Peter Van. Microchip Fabrication: A Practical Guide to Semiconductor Processing. Semiconductor Services, 1996.

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40

Zant, Peter Van. Microchip Fabrication: A Practical Guide to Semiconductor Processing. 3rd ed. Semiconductor Services, 1996.

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41

Zant, Peter Van. Microchip Fabrication: A Practical Guide to Semiconductor Processing. 4th ed. McGraw-Hill Professional Publishing, 2000.

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42

Microchip Fabrication: A Practical Guide to Semiconductor Processing. McGraw-Hill Professional Publishing, 2000.

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43

Andricacos, Panayotis C. Electrochemical Processing in Ulsi Fabrication III. Electrochemical Society, 2000.

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44

Soon-Fatt, Yoon, Yu Raymond, Mack Chris A, Society of Photo-optical Instrumentation Engineers., Society of Photo-optical Instrumentation Engineers. Singapore Chapter, Institute of Physics Singapore, and Society of Photo-optical Instrumentation Engineers. Japan Chapter, eds. Microlithographic techniques in IC fabrication: 25-26 June, 1997, Singapore. Bellingham, Washington: SPIE, 1997.

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45

H, Holloway Paul, ed. Advanced processing and characterization technologies: Fabrication and characterization of semiconductor optoelectronic devices and integrated circuits, Clearwater, FL, 1991. New York: American Institute of Physics, 1991.

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46

(Editor), Panayotis C. Andricacos, Electrochemical Society. Dielectric Science and Technology Division (Corporate Author), and Electrochemical Society Electronics Division (Corporate Author), eds. Electrochemical Processing in Ulsi Fabrication & Semiconductor/Metal Deposition II: Proceedings of the International Symposium (Proceedings (Electrochemical Society), V. 99-9.). Electrochemical Society, 1999.

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47

1951-, Andricacos Panayotis C., Electrochemical Society. Dielectric Science and Technology Division., Electrochemical Society Electronics Division, Electrochemical Society Electrodeposition Division, Electrochemical Society Meeting, Electrochemical Society Meeting, Symposium on Electrochemical Processing in ULSI Fabrication (1st : 1998 : San Diego, Calif.), and Symposium on Interconnect and Contact Metallization--Materials, Processes, and Reliability (1998 : Boston, Mass.), eds. Proceedings of the symposia on Electrochemical Processing in ULSI Fabrication I: And Interconnect and Contact Metallization--Materials, Processes, and Reliability. Pennington, New Jersey: Electrochemical Society, 1999.

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48

Anderson, James A. Computing Hardware. Oxford University Press, 2018. http://dx.doi.org/10.1093/acprof:oso/9780199357789.003.0003.

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Digital computers are built from hardware of great simplicity. First, they are built from devices with two states: on or off, one or zero, high voltage or low voltage, or logical TRUE or FALSE. Second, the devices are connected with extremely fine connections, currently on the order of size of a large virus. Their utility, value, and perceived extreme complexity lie in the software controlling them. Different devices have been used to build computers: relays, vacuum tubes, transistors, and integrated circuits. Theoretically, all can run the same software, only slower or faster. More exotic technologies have not proved commercially viable. Digital computer hardware has increased in power by roughly a factor of 2 every 2 years for five decades, an observation called Moore’s Law. Engineering problems with very small devices, such as quantum effects, heat, and difficulty of fabrication, are increasing and may soon end Moore’s Law.
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49

Jaeger, Richard C. Introduction to Microelectronic Fabrication: Volume 5 of Modular Series on Solid State Devices (2nd Edition). Prentice Hall, 2001.

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50

1945-, Weisbuch C., Kelly M. J. 1949-, and Winter School on "the Physics and Fabrication of Microstructures" (1986 : Les Houches, Haute-Savoie, France), eds. The Physics and fabrication of microstructures and microdevices: Proceedings of the winter school, Les Houches, France, March 25-April 5, 1986. Berlin: Springer-Verlag, 1986.

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