Journal articles on the topic 'Integrated circuits – Ultra large scale integration'
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HASEGAWA, HIDEKI, SEIYA KASAI, and TAKETOMO SATO. "TOWARD ULTRA-LOW POWER III-V QUANTUM LARGE SCALE INTEGRATED CIRCUITS FOR UBIQUITOUS NETWORK ERA." International Journal of High Speed Electronics and Systems 16, no. 02 (2006): 421–36. http://dx.doi.org/10.1142/s0129156406003758.
Full textIwai, Hiroshi, Kuniyuki Kakushima, and Hei Wong. "CHALLENGES FOR FUTURE SEMICONDUCTOR MANUFACTURING." International Journal of High Speed Electronics and Systems 16, no. 01 (2006): 43–81. http://dx.doi.org/10.1142/s0129156406003539.
Full textYao, Yuhan, Yanxian Wei, Jianji Dong, Ming Li, and Xinliang Zhang. "Large-Scale Reconfigurable Integrated Circuits for Wideband Analog Photonic Computing." Photonics 10, no. 3 (2023): 300. http://dx.doi.org/10.3390/photonics10030300.
Full textSathyakam, P. Uma, and Partha S. Mallick. "Future Dielectric Materials for CNT Interconnects - Possibilities and Challenges." Journal of Nano Research 52 (May 2018): 21–42. http://dx.doi.org/10.4028/www.scientific.net/jnanor.52.21.
Full textChen, Xiangyu, Takeaki Yajima, Isao H. Inoue, and Tetsuya Iizuka. "An ultra-compact leaky integrate-and-fire neuron with long and tunable time constant utilizing pseudo resistors for spiking neural networks." Japanese Journal of Applied Physics 61, SC (2022): SC1051. http://dx.doi.org/10.35848/1347-4065/ac43e4.
Full textZeng, Xiang, Jin Jiang He, Xuan Jiang, Hao Zeng, Xiao Yong Wan, and Zai Yan Shang. "Research on Grain Refinement Process and Microstructure of Ultra-High Purity Copper Used for Integrated Circuit." Materials Science Forum 852 (April 2016): 601–6. http://dx.doi.org/10.4028/www.scientific.net/msf.852.601.
Full textChen, Mengwen, Chenyu Wang, Xiao-Hui Tian, et al. "Wafer-Scale Periodic Poling of Thin-Film Lithium Niobate." Materials 17, no. 8 (2024): 1720. http://dx.doi.org/10.3390/ma17081720.
Full textKaloyeros, Alain E., and Michael A. Fury. "Chemical Vapor Deposition of Copper for Multilevel Metallization." MRS Bulletin 18, no. 6 (1993): 22–29. http://dx.doi.org/10.1557/s0883769400047291.
Full textGong, Xiao, Kaizhen Han, Chen Sun, et al. "Beol-Compatible Ingazno-Based Devices for 3D Integrated Circuits." ECS Meeting Abstracts MA2022-02, no. 32 (2022): 1186. http://dx.doi.org/10.1149/ma2022-02321186mtgabs.
Full textTucker, J. R., and T. C. Shen. "Fabricating an all-epitaxial silicon quantum computer." Quantum Information and Computation 1, Special (2001): 129–33. http://dx.doi.org/10.26421/qic1.s-14.
Full textFair, R. B. "Challenges to manufacturing submicron, ultra-large scale integrated circuits." Proceedings of the IEEE 78, no. 11 (1990): 1687–705. http://dx.doi.org/10.1109/5.63298.
Full textGamra, D., F. Ouerghi, W. Belhadj, F. Abdelmalek, M. Mejatty, and H. Bouchriha. "Analysis of ultra-small photonic large scale integrated circuits." Optical and Quantum Electronics 36, no. 12 (2004): 1105–15. http://dx.doi.org/10.1007/s11082-004-3549-7.
Full textGarth, Simon C. J. "Electron beam testing of ultra large scale integrated circuits." Microelectronic Engineering 4, no. 2 (1986): 121–38. http://dx.doi.org/10.1016/0167-9317(86)90099-7.
Full textNAWAFUNE, Hidemi. "New Technologies for Scaled-down Cu Interconnection in Ultra-Large Scale Integrated Circuits. Prospects on Copper Plating Systems for Ultra-large Scale Integrated Circuits." Journal of the Surface Finishing Society of Japan 49, no. 11 (1998): 1180–84. http://dx.doi.org/10.4139/sfj.49.1180.
Full textChen, Xiangfei. "Precision photonic integration for future large-scale photonic integrated circuits." Journal of Semiconductors 40, no. 5 (2019): 050301. http://dx.doi.org/10.1088/1674-4926/40/5/050301.
Full textHan, Juyeon, Seokgyu Ryu, Harim Seo, et al. "Monolithic Self-Charging Storage Device with Stable 3 V Operation." ECS Meeting Abstracts MA2023-02, no. 1 (2023): 43. http://dx.doi.org/10.1149/ma2023-02143mtgabs.
Full textNAWAFUNE, Hidemi, Seiichiro NAKAO, Shozo MIZUMOTO, Yoshiki MURAKAMI, and Shin HASHIMOTO. "Fabrication of Ultra-large Scale Integrated Circuits by Electroless Copper Plating System." Journal of the Surface Finishing Society of Japan 49, no. 12 (1998): 1360–61. http://dx.doi.org/10.4139/sfj.49.1360.
Full textYang, Boyu. "Very Large-Scale Integration Circuit and Its Current Status Analysis." Highlights in Science, Engineering and Technology 71 (November 28, 2023): 421–27. http://dx.doi.org/10.54097/hset.v71i.14627.
Full textHarris, Nicholas C., Darius Bunandar, Mihir Pant, et al. "Large-scale quantum photonic circuits in silicon." Nanophotonics 5, no. 3 (2016): 456–68. http://dx.doi.org/10.1515/nanoph-2015-0146.
Full textPatel, Ambresh, and Ritesh Sadiwala. "Performance Analysis of Various Complementary Metaloxide Semiconductor Logics for High Speed Very Large Scale Integration Circuits." SAMRIDDHI : A Journal of Physical Sciences, Engineering and Technology 15, no. 01 (2023): 91–95. http://dx.doi.org/10.18090/10.18090/samriddhi.v15i01.13.
Full textZhang, Chuang, Chang-Ling Zou, Yan Zhao, et al. "Organic printed photonics: From microring lasers to integrated circuits." Science Advances 1, no. 8 (2015): e1500257. http://dx.doi.org/10.1126/sciadv.1500257.
Full textKalra, Shruti, та A. B. Bhattacharyya. "An Analytical Study Of Temperature Dependence of Scaled CMOS Digital Circuits Using α-Power MOSFET Model". Journal of Integrated Circuits and Systems 11, № 1 (2016): 57–68. http://dx.doi.org/10.29292/jics.v11i1.430.
Full textKanazawa, Yusuke, Tetsuya Asai, and Yoshihito Amemiya. "Basic Circuit Design of a Neural Processor: Analog CMOS Implementation of Spiking Neurons and Dynamic Synapses." Journal of Robotics and Mechatronics 15, no. 2 (2003): 208–18. http://dx.doi.org/10.20965/jrm.2003.p0208.
Full textChen, Jia He, Xiang Yang Ma, and De Ren Yang. "Impurity Engineering of Czochralski Silicon." Solid State Phenomena 156-158 (October 2009): 261–67. http://dx.doi.org/10.4028/www.scientific.net/ssp.156-158.261.
Full textM, Thillai Rani, Rajkumar R, Sai Pradeep K.P, Jaishree M, and Rahul S.G. "Integrated extreme gradient boost with c4.5 classifier for high level synthesis in very large scale integration circuits." ITM Web of Conferences 56 (2023): 01005. http://dx.doi.org/10.1051/itmconf/20235601005.
Full textUchikoga, Shuichi. "Low-Temperature Polycrystalline Silicon Thin-Film Transist or Technologies for System-on-Glass Displays." MRS Bulletin 27, no. 11 (2002): 881–86. http://dx.doi.org/10.1557/mrs2002.277.
Full textWang, Zhicheng, Junbo Feng, Haitang Li, et al. "Ultra-Compact and Broadband Nano-Integration Optical Phased Array." Nanomaterials 13, no. 18 (2023): 2516. http://dx.doi.org/10.3390/nano13182516.
Full textIm, James S., and Robert S. Sposili. "Crystalline Si Films for Integrated Active-Matrix Liquid-Crystal Displays." MRS Bulletin 21, no. 3 (1996): 39–48. http://dx.doi.org/10.1557/s0883769400036125.
Full textShuto, Takanori, Keiichiro Iwanabe, Kazuhiro Noda, Seiya Nakai, and Tanemasa Asano. "Ultrasonic Bonding of Cone Bump for Integration of Large-Scale Integrated Circuits in Flexible Electronics." Japanese Journal of Applied Physics 52, no. 5S1 (2013): 05DB10. http://dx.doi.org/10.7567/jjap.52.05db10.
Full textAlharbi, Mohammed, Gerard Edwards, and Richard Stocker. "An Ultra-Energy-Efficient Reversible Quantum-Dot Cellular Automata 8:1 Multiplexer Circuit." Quantum Reports 6, no. 1 (2024): 41–57. http://dx.doi.org/10.3390/quantum6010004.
Full textDai, Xiao, Jiang Wu, Zhicheng Qian, et al. "Ultra-smooth glassy graphene thin films for flexible transparent circuits." Science Advances 2, no. 11 (2016): e1601574. http://dx.doi.org/10.1126/sciadv.1601574.
Full textDwivedi, V. K. "A Bird's‐Beak‐Free Sealed‐Interface Local Oxidation Technology for Submicron Ultra‐Large‐Scale Integrated Circuits." Journal of The Electrochemical Society 137, no. 8 (1990): 2586–88. http://dx.doi.org/10.1149/1.2086991.
Full textPang, Zhenjiang, Hengchao Sun, Yan Guo, et al. "Research Advances of Porous Polyimide—Based Composites with Low Dielectric Constant." Polymers 15, no. 16 (2023): 3341. http://dx.doi.org/10.3390/polym15163341.
Full textFan, Ya Ping. "Research of Ultra Precision Machining Technology." Applied Mechanics and Materials 687-691 (November 2014): 476–79. http://dx.doi.org/10.4028/www.scientific.net/amm.687-691.476.
Full textBaklanov, Mikhail R., and Karen Maex. "Porous low dielectric constant materials for microelectronics." Philosophical Transactions of the Royal Society A: Mathematical, Physical and Engineering Sciences 364, no. 1838 (2005): 201–15. http://dx.doi.org/10.1098/rsta.2005.1679.
Full textTAKAO, Hidekuni, Nobuhiro TANAKA, Masanori SUGIURA, Kazuaki SAWADA, and Makoto ISHIDA. "423 Formation and Evaluation of Micro Fluidic Integrated Circuits by Surface Micromachining for Large Scale Integration." Proceedings of the JSME annual meeting 2008.8 (2008): 147–48. http://dx.doi.org/10.1299/jsmemecjo.2008.8.0_147.
Full textChen, Zhifeng, Jiming Chen, Wenli Liao, Yuan Zhao, Jianhua Jiang, and Chengying Chen. "Progress on a Carbon Nanotube Field-Effect Transistor Integrated Circuit: State of the Art, Challenges, and Evolution." Micromachines 15, no. 7 (2024): 817. http://dx.doi.org/10.3390/mi15070817.
Full textJeon, Yunchae, Donghyun Lee, and Hocheon Yoo. "Recent Advances in Metal-Oxide Thin-Film Transistors: Flexible/Stretchable Devices, Integrated Circuits, Biosensors, and Neuromorphic Applications." Coatings 12, no. 2 (2022): 204. http://dx.doi.org/10.3390/coatings12020204.
Full textGuo, Shan Shan, Yuan Yuan Jiang, Hao Zeng, Xiao Yong Wan, and Yong Jun Li. "Diffusion Bonding Performance of Copper Target for 300mm Integrated Circuit." Materials Science Forum 1035 (June 22, 2021): 692–97. http://dx.doi.org/10.4028/www.scientific.net/msf.1035.692.
Full textDiao, Zhu, Vincent T. K. Sauer, and Wayne K. Hiebert. "Integrated On-Chip Nano-Optomechanical Systems." International Journal of High Speed Electronics and Systems 26, no. 01n02 (2017): 1740005. http://dx.doi.org/10.1142/s0129156417400055.
Full textBoychenko, Dmitry, Oleg Kalashnikov, Alexander Nikiforov, Anastasija Ulanova, Dmitry Bobrovsky, and Pavel Nekrasov. "Total ionizing dose effects and radiation testing of complex multifunctional VLSI devices." Facta universitatis - series: Electronics and Energetics 28, no. 1 (2015): 153–64. http://dx.doi.org/10.2298/fuee1501153b.
Full textMadhura, S. "A Review on Low Power VLSI Design Models in Various Circuits." Journal of Electronics and Informatics 4, no. 2 (2022): 74–81. http://dx.doi.org/10.36548/jei.2022.2.002.
Full textSharma, Vijay Kumar. "Design of Low Leakage PVT Variations Aware CMOS Bootstrapped Driver Circuit." Journal of Circuits, Systems and Computers 26, no. 09 (2017): 1750137. http://dx.doi.org/10.1142/s0218126617501377.
Full textBeck, Anthony, Franziska Obst, Mathias Busek, et al. "Hydrogel Patterns in Microfluidic Devices by Do-It-Yourself UV-Photolithography Suitable for Very Large-Scale Integration." Micromachines 11, no. 5 (2020): 479. http://dx.doi.org/10.3390/mi11050479.
Full textAsif, A., H. Richter, and J. N. Burghartz. "High-voltage (100 V) Chipfilm<sup>TM</sup> single-crystal silicon LDMOS transistor for integrated driver circuits in flexible displays." Advances in Radio Science 7 (May 19, 2009): 237–42. http://dx.doi.org/10.5194/ars-7-237-2009.
Full textMishra, Brijendra, Vivek Singh Kushwah, and Rishi Sharma. "MODELING OF HYBRID MOS FOR THE IMPLEMENTATION OF SWITCHED CAPACITOR FILTER USING SINGLE ELECTRON TRANSISTOR." International Journal of Engineering Technologies and Management Research 5, no. 2 (2020): 294–300. http://dx.doi.org/10.29121/ijetmr.v5.i2.2018.659.
Full textMarsan-Loyer, C., D. Danovitch, and N. Boyer. "Addressing Flux Dip Challenges for 3D Integrated Large Die, Ultra-fine Pitch Interconnect." International Symposium on Microelectronics 2016, no. 1 (2016): 000054–59. http://dx.doi.org/10.4071/isom-2016-tp25.
Full textCastro, J. E., T. J. Steiner, L. Thiel, et al. "Expanding the quantum photonic toolbox in AlGaAsOI." APL Photonics 7, no. 9 (2022): 096103. http://dx.doi.org/10.1063/5.0098984.
Full textSun, Chongjun, and Chao Ding. "Study on Calibration Method for Testing During Burn In equipment of integrated circuits." Journal of Physics: Conference Series 2029, no. 1 (2021): 012035. http://dx.doi.org/10.1088/1742-6596/2029/1/012035.
Full textIKEDA, SHOJI, HIDEO SATO, MICHIHIKO YAMANOUCHI, et al. "RECENT PROGRESS OF PERPENDICULAR ANISOTROPY MAGNETIC TUNNEL JUNCTIONS FOR NONVOLATILE VLSI." SPIN 02, no. 03 (2012): 1240003. http://dx.doi.org/10.1142/s2010324712400036.
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