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Journal articles on the topic 'Integrated electronics design'

Author: Grafiati

Published: 4 June 2021

Last updated: 6 February 2022

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Liu, Wei, and Gong Kun Cao. "Integrated Design of Testing Software in Machinery Production." Applied Mechanics and Materials 484-485 (January 2014): 938–40. http://dx.doi.org/10.4028/www.scientific.net/amm.484-485.938.

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The development of modern scientifical technology has greatly promoted the reformation in the field of machinery industry; meanwhile, this technology development has also brought tremendous impact on the relevant production industry as well as improve the level of production and technology. With the integrated development of various technologies, electromechanical control areas will contribute to more practical applications in industrial and scientific research as well as other fields, with core fields in computer electronics technology and mechanical technology. This paper will outline the development of mechanical and electronic control in industry. Besides, this paper will also focuses on the wide applications introduction of computer testing software in the machinery and electronics industries as well as industrial production manufacturing and people's daily life.

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Ortlepp, Thomas. "General design aspects of integrated superconductor electronics." Cryogenics 49, no. 11 (2009): 648–51. http://dx.doi.org/10.1016/j.cryogenics.2008.12.016.

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Pang, Y., E. Scott, J. D. van Wyk, and Z. Liang. "Assessment of Some Integrated Cooling Mechanisms for an Active Integrated Power Electronics Module." Journal of Electronic Packaging 129, no. 1 (2006): 1–8. http://dx.doi.org/10.1115/1.2429703.

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The increased heat generation in power electronic components can greatly reduce the reliability of the components and increase the chances of malfunction to the components. A good understanding of the thermal behavior of these components can help in deciding an effective thermal management scheme. Recognizing the inherent need for the thermal design of the active integrated power electronics modules, this paper assesses various possibilities of integrated thermal management for integrated power electronics modules. These integrated thermal management strategies include employing high thermal conductivity materials as well as structural modifications to the current module structure while not adding complexity to the fabrication process to reduce the cost.

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Chung, Kyung-won, and Karen Freeze. "Samsung Electronics and the Pathway to Integrated Design Success." Design Management Review 20, no. 3 (2009): 20–27. http://dx.doi.org/10.1111/j.1948-7169.2009.00018.x.

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Valdivia, V., J. Pleite, P. Zumel, and C. Gonzalez. "Improving design of integrated magnetics for power electronics converters." Electronics Letters 44, no. 11 (2008): 693. http://dx.doi.org/10.1049/el:20080112.

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Allderdice, Hugh B., and Robert I. King. "The design of a computer integrated electronics manufacturing system." Computer-Aided Engineering Journal 2, no. 2 (1985): 57. http://dx.doi.org/10.1049/cae.1985.0012.

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Giraud, X., M. Budinger, X. Roboam, H. Piquet, M. Sartor, and J. Faucher. "Optimal design of the Integrated Modular Power Electronics Cabinet." Aerospace Science and Technology 48 (January 2016): 37–52. http://dx.doi.org/10.1016/j.ast.2015.10.013.

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Huang, Tsung-Ching, Ting Lei, Leilai Shao, et al. "Process Design Kit and Design Automation for Flexible Hybrid Electronics." Journal of Microelectronics and Electronic Packaging 16, no. 3 (2019): 117–23. http://dx.doi.org/10.4071/imaps.925849.

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Abstract High-performance low-cost flexible hybrid electronics (FHE) are desirable for applications such as internet of things and wearable electronics. Carbon nanotube (CNT) thin-film transistor (TFT) is a promising candidate for high-performance FHE because of its high carrier mobility, superior mechanical flexibility, and material compatibility with low-cost printing and solution processes. Flexible sensors and peripheral CNT-TFT circuits, such as decoders, drivers, and sense amplifiers, can be printed and hybrid-integrated with thinned (&lt;50 μm) silicon chips on soft, thin, and flexible substrates for a wide range of applications, from flexible displays to wearable medical devices. Here, we report (1) a process design kit (PDK) to enable FHE design automation for large-scale FHE circuits and (2) solution process-proven intellectual property blocks for TFT circuits design, including Pseudo-Complementary Metal-Oxide-Semiconductor (Pseudo-CMOS) flexible digital logic and analog amplifiers. The FHE-PDK is fully compatible with popular silicon design tools for design and simulation of hybrid-integrated flexible circuits.

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Pandey and Vora. "Open Electronics for Medical Devices: State-of-Art and Unique Advantages." Electronics 8, no. 11 (2019): 1256. http://dx.doi.org/10.3390/electronics8111256.

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A wide range of medical devices have significant electronic components. Compared to open-source medical software, open (and open-source) electronic hardware has been less published in peer-reviewed literature. In this review, we explore the developments, significance, and advantages of using open platform electronic hardware for medical devices. Open hardware electronics platforms offer not just shorter development times, reduced costs, and customization; they also offer a key potential advantage which current commercial medical devices lack—seamless data sharing for machine learning and artificial intelligence. We explore how various electronic platforms such as microcontrollers, single board computers, field programmable gate arrays, development boards, and integrated circuits have been used by researchers to design medical devices. Researchers interested in designing low cost, customizable, and innovative medical devices can find references to various easily available electronic components as well as design methodologies to integrate those components for a successful design.

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Leroux, Paul. "Radiation Tolerant Electronics." Electronics 8, no. 7 (2019): 730. http://dx.doi.org/10.3390/electronics8070730.

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Research on radiation tolerant electronics has increased rapidly over the last few years, resulting in many interesting approaches to model radiation effects and design radiation hardened integrated circuits and embedded systems [...]

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Hamilton, Tara Julia, Saeed Afshar, Andre van Schaik, and Jonathan Tapson. "Stochastic Electronics: A Neuro-Inspired Design Paradigm for Integrated Circuits." Proceedings of the IEEE 102, no. 5 (2014): 843–59. http://dx.doi.org/10.1109/jproc.2014.2310713.

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Pang, Ying Feng, Elaine P. Scott, Jonah Zhou Chen, and Karen A. Thole. "Thermal Design and Optimization Methodology for Integrated Power Electronics Modules." Journal of Electronic Packaging 127, no. 1 (2005): 59–66. http://dx.doi.org/10.1115/1.1849233.

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A methodology was developed and implemented to optimize the design layout for i_ntegrated p_ower e_lectronics m_odules (IPEMs) by considering both the electrical and thermal performances. This paper is primarily focused on the thermal aspects, which were analyzed using three-dimensional (3D) computational software tools. Implementation of the design methodology resulted in a 70 percent reduction in the common mode current, a 4 percent reduction in the size of the geometric footprint, and a 7°C reduction in the maximum temperature rise for the case studied, thus, providing an increase in the IPEM’s overall performance.

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Wang, Xiao Li. "Counter System Design According to ATmega16L-8PC on the Machine Production Line." Applied Mechanics and Materials 58-60 (June 2011): 680–84. http://dx.doi.org/10.4028/www.scientific.net/amm.58-60.680.

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Along with electronics technique of development rapidly, SCM has become essential tool to the development of modern electronic technology. This paper introduces the core of ATmega16L-8PC microcontroller, and the MAX485 with low-power transceiver for the system of products counting on the production line system. The system is highly integrated, strongly stable and low power consumption, very convenient use and maintenance, with high Cost effective and practical value.

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Wong, C. P. "An Overview of Integrated Circuit Device Encapsulants." Journal of Electronic Packaging 111, no. 2 (1989): 97–107. http://dx.doi.org/10.1115/1.3226528.

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The rapid development of integrated circuit technology from small-scale integration (SSI) to very large scale integration (VLSI) has had great technological and economical impact on the electronics industry. The exponential growth of the number of components per IC chip, the exponential decrease of device dimensions, and the steady increase in IC chip size have imposed stringent requirements, not only on the IC physical design and fabrication, but also on IC encapsulants. This report addresses the purpose of encapsulation, encapsulation techniques, and a general overview of the application of inorganic and organic polymer materials as electronic device encapsulants.

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Gutierrez, Cassie, Rudy Salas, Gustavo Hernandez, et al. "CubeSat Fabrication through Additive Manufacturing and Micro-Dispensing." International Symposium on Microelectronics 2011, no. 1 (2011): 001021–27. http://dx.doi.org/10.4071/isom-2011-tha4-paper3.

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Fabricating entire systems with both electrical and mechanical content through on-demand 3D printing is the future for high value manufacturing. In this new paradigm, conformal and complex shapes with a diversity of materials in spatial gradients can be built layer-by-layer using hybrid Additive Manufacturing (AM). A design can be conceived in Computer Aided Design (CAD) and printed on-demand. This new integrated approach enables the fabrication of sophisticated electronics in mechanical structures by avoiding the restrictions of traditional fabrication techniques, which result in stiff, two dimensional printed circuit boards (PCB) fabricated using many disparate and wasteful processes. The integration of Additive Manufacturing (AM) combined with Direct Print (DP) micro-dispensing and robotic pick-and-place for component placement can 1) provide the capability to print-on-demand fabrication, 2) enable the use of micron-resolution cavities for press fitting electronic components and 3) integrate conductive traces for electrical interconnect between components. The fabrication freedom introduced by AM techniques such as stereolithography (SL), ultrasonic consolidation (UC), and fused deposition modeling (FDM) have only recently been explored in the context of electronics integration and 3D packaging. This paper describes a process that provides a novel approach for the fabrication of stiff conformal structures with integrated electronics and describes a prototype demonstration: a volumetrically-efficient sensor and microcontroller subsystem scheduled to launch in a CubeSat designed with the CubeFlow methodology.

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Valdivia, V., J. Pleite, P. Zumel, and C. Gonzalez. "Erratum for ‘Improving design of integrated magnetics for power electronics converters’." Electronics Letters 44, no. 21 (2008): 1284. http://dx.doi.org/10.1049/el:20089750.

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Chiolino, N., A. M. Francis, J. Holmes, and M. Barlow. "Digital Logic Synthesis for 470 Celsius Silicon Carbide Electronics." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2018, HiTEC (2018): 000064–70. http://dx.doi.org/10.4071/2380-4491-2018-hiten-000064.

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Abstract Advancements in Silicon Carbide (SiC) digital integrated circuit (IC) design have enabled the ability to design complex, dense, digital blocks. Because of the large number of transistors, these complex digital designs make the time and risk of hand-crafted digital design, which has been the norm for SiC, too costly and risky. For large scale integrated digital circuits, computer aided design (CAD) tools are necessary, specifically the use of automatic synthesis, rule-based placement and signal routing software. The tools are used in progression as a design flow and are necessary for the timely and accurate creation of high-density digital designs. Application of an automated digital design flow to high-temperature SiC processes presents new challenges, such as extraction of timing characteristics at high temperatures, specifically above 400°C, as well as managing the complexity of synthesis, optimization of cell placement, verification of timing enclosure, and identifying routing constraints. These activities all require a willingness to extend and enhance the CAD software. Presented is a high temperature SiC digital synthesis flow. This flow is fully integrated with the characterization of a standard cell library that considers the variation of voltage, temperature, and process characteristics. A digital controller for a 10,000-pixel UV focal plan array (FPA) in a SiC CMOS process was designed using this high temperature digital flow. The controller is comprised of a finite state machine (FSM), that monitors several counters, shift registers and combinational logic feedback signals. The FSM is configured to optimize the FPA for different applications and exposures. The Register-Transfer Level (RTL) design of the FSM produces between 900 and 1,000 gates, depending on the temperature-dependent time closure with a total footprint of 14mm2. Typical SiC processes present a non-monotonic clock speed over temperature. The advantage of this digital design flow is that it allows the designer to target a temperature corner for the netlist design but verify its operation over a &gt; 400°C operating range. This flow is currently being enhanced for use with NASA's SiC JFET-R process to create a high temperature communication protocol interface.

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Karanassios, V., and G. Horlick. "New Design Concepts for Direct Reader Measurement Electronics." Applied Spectroscopy 42, no. 6 (1988): 961–72. http://dx.doi.org/10.1366/0003702884430209.

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A dual-processor, distributed-intelligence approach toward the computerization of a direct-reading polychromator for atomic emission spectrometry is described. Emphasis is placed on a “zero based design” of the PMT current integration electronics of a direct-reader channel using microprocessor bus architectures, programmable support chips, data domain conversion integrated circuits, and inexpensive single-board microcomputers. Traditional analog integration of the current signal is replaced by domain conversion of the current to a frequency, and integration/digitization is achieved with the use of single chip software programmable counters. Each channel can be independently addressed, configured, cleared, preset, and read, as the channels are autonomous units on the bus of the data acquisition and control microcomputer.

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Jay., Paul R. "Gallium arsenide electronics in the marketplace." Canadian Journal of Physics 70, no. 10-11 (1992): 943–45. http://dx.doi.org/10.1139/p92-150.

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The last few years have seen a significant emergence of real product applications using gallium arsenide metal semi-conductor field effect transistor technology. These applications range from large volume consumer markets based on small low-cost GaAs integrated circuits to high-end supercomputer products using very large scale integrated GaAs chips containing up to 50 000 logic gates. This situation represents substantial advances in many areas: materials technology, device and integrated circuit process technology, packaging and high speed testing, as well as appropriate system design to obtain maximum benefit from the GaAs technology. This paper reviews some recent commercial successes, and considers commonalities existing between them in the context of recent technological developments.

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Halpern, Mar. "Pushing the Design Envelope with CAE." Mechanical Engineering 120, no. 11 (1998): 66–71. http://dx.doi.org/10.1115/1.1998-nov-2.

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This article examines the growing usefulness of computer-aided engineering (CAE) programs for the design of electronics packaging. CAE combined with expert interpretation, can help manufacturers quickly satisfy demand for increasingly small yet reliable products. Currently, three classes of software specifically support electronics packaging design: integrated computer-aided design (CAD) CAE software, general-purpose CAE software, and specialty CAE software solutions. The integrated CAE software emphasizes automatic creation and updating of finite-element-analysis (FEA) models based on CAD geometry. The effectiveness of this associativity between CAD and FEA depends on the product behavior to be evaluated and the quality of implementation. CAE simulation can calculate the maximum acceptable loads on pins, as well as the vibration characteristics of components. Solids-based CAD helps detect interference problems across components, as in these exploded views of a disc drive and a headset. While several general-purpose CAE suppliers permit engineers to build customized environments for automating model creation, specialty suppliers such as Pacific Numerix deliver the specific automated capabilities and connector libraries.

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Lostetter, A. B., F. Barlow, and A. Elshabini. "An overview to integrated power module design for high power electronics packaging." Microelectronics Reliability 40, no. 3 (2000): 365–79. http://dx.doi.org/10.1016/s0026-2714(99)00219-x.

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Abdalla, Hassan, and Tun Hsueh Chan. "An integrated design framework for mass customisation in the consumer electronics industry." International Journal of Computer Applications in Technology 40, no. 1/2 (2011): 37. http://dx.doi.org/10.1504/ijcat.2011.038549.

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Song, Jizhou, Xue Feng, and Yonggang Huang. "Mechanics and thermal management of stretchable inorganic electronics." National Science Review 3, no. 1 (2015): 128–43. http://dx.doi.org/10.1093/nsr/nwv078.

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Abstract Stretchable electronics enables lots of novel applications ranging from wearable electronics, curvilinear electronics to bio-integrated therapeutic devices that are not possible through conventional electronics that is rigid and flat in nature. One effective strategy to realize stretchable electronics exploits the design of inorganic semiconductor material in a stretchable format on an elastomeric substrate. In this review, we summarize the advances in mechanics and thermal management of stretchable electronics based on inorganic semiconductor materials. The mechanics and thermal models are very helpful in understanding the underlying physics associated with these systems, and they also provide design guidelines for the development of stretchable inorganic electronics.

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Akturk, Akin, Neil Goldsman, Ahayi Ahyi, Sarit Dhar, Brendan Cusack, and Minseo Park. "SPICE Modeling of Advanced Silicon Carbide High Temperature Integrated Circuits." Materials Science Forum 858 (May 2016): 1070–73. http://dx.doi.org/10.4028/www.scientific.net/msf.858.1070.

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Due to the wide band-gap and high thermal conductivity of the 4H polytype of silicon carbide (SiC) as well as the maturity of this polytype’s fabrication processes, 4H-SiC offers an extremely attractive wide bandgap semiconductor technology for harsh environment applications spanning a variety of markets. To this end, 4H-SiC power electronics is gradually emerging as the technology of choice for next-generation power electronics; however, relatively limited progress has been made with regards to silicon carbide integrated circuits (ICs). We address this problem by developing fabrication and design methods for the SiC IC components themselves, as well as complementary SPICE type compact models for these components, and thereby facilitate the development of future SiC ICs and Process Design Kits (PDKs).

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Cobley, Rosemary A. "The Introduction of Electronics Computer Aided Design Facilities to Engineering Science Students." International Journal of Electrical Engineering & Education 26, no. 1-2 (1989): 23–29. http://dx.doi.org/10.1177/002072098902600105.

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The impact made by professional electronic CAD tools and engineering workstations, upon undergraduate courses in the department, is outlined. Student groups have successfully designed, simulated and tested digital systems, which had been implemented as gate arrays. The interest throughout the department has highlighted areas for integrated mechanical/electronic projects.

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Yin, Yafei, Min Li, Wei Yuan, Xiaolian Chen, and Yuhang Li. "A widely adaptable analytical method for thermal analysis of flexible electronics with complex heat source structures." Proceedings of the Royal Society A: Mathematical, Physical and Engineering Sciences 475, no. 2228 (2019): 20190402. http://dx.doi.org/10.1098/rspa.2019.0402.

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Flexible electronics, as a relatively new category of device, exhibit prodigious potential in many applications, especially in bio-integrated fields. It is critical to understand that thermal management of certain kinds of exothermic flexible electronics is a crucial issue, whether to avoid or to take advantage of the excessive temperature. A widely adaptable analytical method, validated by finite-element analysis and experiments, is conducted to investigate the thermal properties of exothermic flexible electronics with a heat source in complex shape or complex array layout. The main theoretical strategy to obtain the thermal field is through an integral along the complex curve source region. The results predicted by the analytical model enable accurate control of temperature and heat flow in the flexible electronics, which may help in the design and fabrication of flexible electronic devices in the future.

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Chi, Jun, Jian Liang Guo, and Wei Wei Zhang. "The Teaching Design for Mechanics-Electronics- Hydraulics Integrated Experiment Based on Learning Psychology." Advanced Materials Research 591-593 (November 2012): 2243–46. http://dx.doi.org/10.4028/www.scientific.net/amr.591-593.2243.

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The teaching scheme of mechanics-electronics-hydraulics integrated controlling experiment is introduced. The psychological model on which the teaching scheme is based is indicated according to the shortcomings in college teaching. Then the equipment and teaching scheme in details is described. Finally, the principles of teacher indication are specified. The scheme achieves designed purpose in practice mostly.

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Andreta, André, Luiz Fernando Lavado Villa, Yves Lembeye, and Jean Christophe Crebier. "A Novel Automated Design Methodology for Power Electronics Converters." Electronics 10, no. 3 (2021): 271. http://dx.doi.org/10.3390/electronics10030271.

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This work proposes a methodology for designing power electronic converters called “Automatic Design for Manufacturing” (ADFM). This methodology proposes creating Power Converter Arrays (PCAs) using standardized converter cells. The approach is greatly inspired by the microelectronics integrated circuit design flow, power electronics building blocks, and multicell converters. To achieve the desired voltage/current specifications, the PCA conversion stage is made from the assembly of several Conversion-Standard Cells (CSCs) in series and/or parallel. The ADFM uses data-based models to simulate the behavior of a PCA with very little computational effort. These models require a special characterization approach to maximize the amount of knowledge while minimizing the amount of data. This approach consists of establishing an experiment plan to select the relevant measurements that contain the most information about the PCA technology, building an experimental setup that is capable of acquiring data automatically and using statistical learning to train models that can yield precise predictions. This work performed over 210 h of tests in nine different PCAs in order to gather data to the statistical models. The models predict the efficiency and converter temperature of several PCAs, and the accuracy is compared with real measurements. Finally, the models are employed to compare the performance of PCAs in a specific battery charging application.

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Park, Won Ho, Tamer Ali, and C. K. Ken Yang. "Analysis of Refrigeration Requirements of Digital Processors in Subambient Temperatures." Journal of Microelectronics and Electronic Packaging 7, no. 4 (2010): 197–204. http://dx.doi.org/10.4071/imaps.257.

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The total power consumption for high-performance computing systems is a serious concern for designers of integrated circuits and systems. It is well known that cooling the operating temperature results in reduced electronic power and/or speed gains. However, total power dissipation includes both electronic power and the refrigeration power. This study explores the optimal operating temperatures and the amount of total power reduction at subambient temperatures. This paper presents a realistic system-level model that includes both the electronic and the refrigeration systems. Analysis using the model shows the optimal temperature, and sensitivity to parameters of the electronic and refrigeration systems. For instance, a system with 50% electronic leakage and a minimum refrigeration coefficient of performance (COP) of 3.3, the optimized design operates at 8°C and offers a 44% power reduction over the noncooled design. Analysis also shows that temperatures near that of domestic freezers is nearly optimal for digital processors and such cooling may be viable approach for current and future electronics due to the scaling trends of integrated circuits technology.

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Kothari, Rushabh, and CT Sun. "Design and analysis of multifunctional structures with embedded electronics for thermomechanical loads." Journal of Sandwich Structures & Materials 14, no. 6 (2012): 734–52. http://dx.doi.org/10.1177/1099636212460541.

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Multifunctional structures, of various forms, are being used in aerospace industry and there have been increasing efforts to enhance their performance. The design and analysis of a composite sandwich beam embedded avionics and integrated cooling systems is presented in this article. The integrated electronics inside a sandwich beam reduces the overall weight of a vehicle by eliminating most of the avionics housing, cables, interconnects, etc. The foam core of a sandwich beam is modified with a cavity to embed avionics. Since the presence of a cavity degrades the strength of the structure, various methods of reinforcement have been presented. The heat dissipation system has been designed to protect the structure from excessive thermal loads. The design of heat dissipating system consists of two parts, thermal interface materials and a highly efficient heat transfer device. Design guidelines for a thermal interface material consisting of particulate composites are presented here. Among various choices, heat pipes have been chosen as the preferred heat transfer device. An example is given for an unmanned aerial vehicle skin acting as the heat sink to maintain embedded electronics within their operational limit at subsonic air speeds.

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Ghezzo, Fabrizia, Anthony F. Starr, and David R. Smith. "Integration of Networks of Sensors and Electronics for Structural Health Monitoring of Composite Materials." Advances in Civil Engineering 2010 (2010): 1–13. http://dx.doi.org/10.1155/2010/598458.

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The low-cost, widespread availability and robust nature of current electronic devices suggest the feasibility of creating a composite structure with integrated networked sensors to monitor in real time the life of civil and aerospace structures while in service conditions. For structures that need to survive to high number of life cycles under varying load-environmental conditions, it is of crucial importance that the strength, stiffness, endurance, and general load-bearing capabilities of the composite not to be severely degraded by the integrated networked components. Therefore, design tools must be developed to achieve optimized, safe, and reliable structures. High values of stress concentrations due to the presence of a rigid device within a highly anisotropic material can trigger the initiation of microcracks in the resin matrix. To quantify these effects, the acoustic emission technique is used to characterize the initiation of microfailures within laminated composites with integrated electronics.

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Zhao, Wei Min, Xu Xia Zhu, and Chao Zhen Yang. "Construction of Mechatronics Engineering Talents Cultivation System Based on Local Economy." Advanced Materials Research 591-593 (November 2012): 2306–9. http://dx.doi.org/10.4028/www.scientific.net/amr.591-593.2306.

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A truly qualified mechatronics talents must organically combine the mechanical knowledge and electronic technology, computer technology and information technology together with a comprehensive and integrated manner to consider electromechanical integration problems, and design mechatronics products. Aiming at solving the problems that mechatronics talents cultivation lack experiences and involve the two fields: mechanics and electronics, in this paper, based on the development of local economic, the knowledge and ability structure requirements for mechatronics talent was expounded, and curriculum, teaching contents and methods etc. were systematically integrated, the structure tree of curricula and practical link were constructed, meanwhile training model of the mechatronics professionals was discussed.

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Maralani, Ayden, Wei Cheng Lien, Nuo Zhang, and A. P. Pisano. "Silicon Carbide Transistors for IC Design Applications up to 600 °C." Materials Science Forum 778-780 (February 2014): 1126–29. http://dx.doi.org/10.4028/www.scientific.net/msf.778-780.1126.

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Low power Silicon Carbide (SiC) devices and Integrated Circuits (ICs) in conjunction with SiC or Aluminum Nitride (AlN) sensing elements will enable sensing functions in high temperature environments up to 600 °C where no silicon based devices or circuits have been able to survive in that temperature range. In power electronics applications, existence of low power SiC devices and IC technologies will significantly aid the development of high power density power modules in which total weights and cooling systems sizes are reduced. This paper will be evaluating the performances of the fabricated low power SiC device candidates (JFET and BJT) for SiC-based analog ICs design for high temperature and power electronics applications.

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Silvério, V., S. Cardoso, J. Gaspar, Paulo P. Freitas, and A. L. N. Moreira. "Design, fabrication and test of an integrated multi-microchannel heat sink for electronics cooling." Sensors and Actuators A: Physical 235 (November 2015): 14–27. http://dx.doi.org/10.1016/j.sna.2015.09.023.

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Xue, T., J. Zhu, G. Gong, L. Wei, and J. Li. "The prototype design of integrated base for PMT with pulse digitalization and readout electronics." Journal of Instrumentation 13, no. 06 (2018): T06007. http://dx.doi.org/10.1088/1748-0221/13/06/t06007.

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Brenneis, Matthias, Mesut Ibis, Alexander Duschka, and Peter Groche. "Towards Mass Production of Smart Products by Forming Technologies." Advanced Materials Research 907 (April 2014): 113–25. http://dx.doi.org/10.4028/www.scientific.net/amr.907.113.

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In all areas of technology, the demand for high-quality, competitive and more valuable products is rising steadily. One approach to increase the value of manufactured products is the integration of electronic components in load carrying structures. These new products, which combine electrical and mechanical components synergistically, are called smart products. They consist of a passive structure and integrated electronics or smart materials. In addition to their mechanical properties they are also able to sense, to actuate or to transmit energy or data. The resulting product architecture requires both a mechanical and an electronic design in order to save subsequent assembly costs. Since further components are required to evaluate and control as well as to supply energy, all of those components need to be connected and integrated into the smart product. However, the main prerequisite for the marketability is the possibility of low-cost manufacturing and a robust mass production. Nowadays processes for the manufacturing of smart products do not fulfill the requirements for a sustainable mass production in a satisfying way as long as metallic structures are used. The authors deploy the forming technologies roll forming and sheet metal hydroforming to form sheets with applied flat electronics. Since the components are applied prior to the forming process, small and difficult to access installation spaces can be used effectively in the product architecture. The incremental bulk forming process rotary swaging is employed to integrate piezoceramics during the forming procedure without any additional joining elements. Challenges resulting from the chosen integrative manufacturing approach are the prevention of new kinds of failure modes and additional requirements for defined residual stress states. These challenges lead to extended process design requirements, which will be discussed in the paper in detail.

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García-Zubía, Javier, Ignacio Angulo, Luis Rodriguez-Gil, Pablo Orduña, Olga Dziabenko, and Maria Güenaga. "Boole-WebLab-FPGA: Creating an Integrated Digital Electronics Learning Workflow Through a Hybrid Laboratory and an Educational Electronics Design Tool." International Journal of Online and Biomedical Engineering (iJOE) 9, S8 (2013): 19. http://dx.doi.org/10.3991/ijoe.v9is8.3362.

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During the last years the presence of remote laboratories has been growing. However, many labs focus on providing a very specific experience, intended to prove a specific point or to carry out a specific practice, rather than to help the student acquire a wider range of skills through several different uses of the lab. This paper describes the creation of Boole-WebLab-FPGA, a system which integrates Boole-Deusto â??an educational electronics design toolâ?? and WebLab-Deusto-FPGA. The latter is a hybrid remote laboratory which lets users program a real FPGA board remotely. This real, physical board has been given the capability to interact with not only real hardware (LEDs), but also with virtual simulations of more complicated models, such as a watertank. The integration of these tools in a single system provides an attractive workflow for teachers and students. Students can design a combinational circuit easily through Boole-Deusto and immediately (in the same lecture session, if they so wish) try it on real hardware. Because additionally that real hardware can also be interacting with a virtual simulation, a wide range of experiments can be proposed and the replay potential of the laboratory is increased.

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ELIAHOU-NIV, S. "A MECHANICAL DARLINGTON MODEL FOR MEMS APPLICATIONS." Journal of Circuits, Systems and Computers 15, no. 03 (2006): 313–19. http://dx.doi.org/10.1142/s0218126606002988.

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This paper presents the design and Micro-Electro-Mechanical-System (MEMS) realization of a Darlington-pair circuit used in power electronics engineering. MEMS are integrated micro devices or systems combining electrical and mechanical components fabricated using integrated circuits processing techniques. The size range of the components is from micrometers up to a couple of millimeters. Current MEMS applications include almost all engineering fields. Since MEMS is a newly developed technology, very few studies have been carried out directly on knowledge transferring from different engineering disciplines. The objective of this paper is to demonstrate a mechanical model developing of a power electronic circuit, to characterize and to analyze its performance and its suitability to MEMS application.

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Kgatuke, Matholo, Dorothy Hardy, Katherine Townsend, et al. "Exploring the Role of Textile Craft Practice in Interdisciplinary E-Textiles Development through the Design of an Illuminated Safety Cycling Jacket." Proceedings 32, no. 1 (2019): 12. http://dx.doi.org/10.3390/proceedings2019032012.

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Most E-textile research tends to fall within the arts or science disciplinary boundaries, despite E-textiles themselves being interdisciplinary in nature. This work explores how contemporary woven textile practice methodologies can play a role within interdisciplinary research, expanding the creative and technical applications of materials and technologies. A team of electronics, textiles, and fashion specialists was formed to design and make an illuminated jacket for use by cyclists. The jacket incorporated bespoke woven panels that integrated electronic yarns within the pattern. The development of this prototype raised questions about the use of craft practice methodologies in the development of new E-textiles.

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Kim, Haklae. "Developing a Product Knowledge Graph of Consumer Electronics to Manage Sustainable Product Information." Sustainability 13, no. 4 (2021): 1722. http://dx.doi.org/10.3390/su13041722.

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Transformational computing paradigms, such as artificial intelligence, home automation, and the Internet of Things, are being rapidly applied to consumer electronics products, thus aiding in the development of integrated and innovative features. Hence, ubiquitous computing and electronic devices are increasingly becoming essential to everyday life. In this context, a wide gulf often exists between the capabilities and technical features of consumer electronic devices and the consumers’ understanding of such devices and ability to operate them correctly and effectively. This study proposes a machine-readable knowledge model representing technical terms in product specifications along with a product knowledge graph to discover semantic relationships among various products. Formal concept analysis is applied to conceptually analyze the specification terms of heterogeneous electronic products and design a hierarchical knowledge structure of extracted concepts, to elaborate the proposed knowledge model.

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S., Madhavan Nampoothiri, Sabu Sebastian M., and Sajith Kumar P.C. "Implementation of Peltier Cooling in Hermetically Sealed Electronic Packaging Unit for Sub-sea Vessel." Defence Science Journal 68, no. 3 (2018): 326. http://dx.doi.org/10.14429/dsj.68.12149.

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This paper presents the methodology adopted for implementation of Peltier cooling in hermetically sealed electronic packaging units used in sub-sea vessels. In sub-sea vessels, sonar front-end electronics is packaged in hermetically sealed electronic packaging units. The thermal design of the unit is a highly challenging task considering the heat dissipation of 300W from the electronics, non-availability of chilled air for cooling and IP68 sealing requirements. Cooling fans cannot be integrated, since these units are to be placed in acoustically sensitive pressure capsule area of the subsea vessel. The electronic cooling in this unit is achieved using conduction cooling with external fins. To enhance the cooling, suitable Peltier cooling (Thermo-electric cooling or TEC) module is selected and implemented with the system. Computational fluid dynamic analysis of the unit is carried-out to study the air-flow and thermal performances with Peltier cooler. The unit is realised and the estimated temperatures validated by experimental temperature measurements on the realised unit. The measured temperatures are within the safe operating limits of the electronic components and hence the cooling design of the unit is satisfactory. It is also observed that maximum temperature reduction has occurred at 1.5A current and card edge temperature of Printed circuit board lowered by 9.28 °C by implementing Peltier cooling.

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Riches, S. T., C. Warn, K. Cannon, G. Rickard, L. Stoica, and C. Johnston. "Design and Assembly of High Temperature Distributed Aero-engine Control System Demonstrator." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2014, HITEC (2014): 000285–90. http://dx.doi.org/10.4071/hitec-tha12.

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This paper covers the development of a distributed high temperature electronics demonstrator for integration with sensor elements to provide digital outputs that can be used by the FADEC (Full Authority Digital Electronic Control) system or the EHMS (Engine Health Monitoring System) on an aircraft engine. This distributed electronics demonstrator eliminates the need for the FADEC or EHMS to process the sensor signal, which will assist in making the overall system more accurate and efficient in processing only digital signals. This will offer weight savings in cables, harnesses and connector pin reduction. The design concept was to take the output from several on-engine sensors, carry out the signal conditioning, multiplexing, analogue to digital conversion and data transmission through a serial data bus. The unit has to meet the environmental requirements of DO-160 with the need to operate at 200°C, with short term operation at temperatures up to 250°C. The work undertaken has been to design an ASIC based on 1.0μm Silicon on Insulator (SOI) device technology incorporating sensor signal conditioning electronics for sensors including resistance temperature probes, strain gauges, thermocouples, torque and frequency inputs. The ASIC contains analogue multiplexers, temperature stable voltage band-gap reference and bias circuits, ADC, BIST, core logic, DIN inputs and two parallel ARINC 429 serial databuses. The ASIC was tested and showed to be functional up to a maximum temperature of 275°C. The ASIC has been integrated with other high temperature components including voltage regulators, a crystal oscillator, precision resistors, silicon capacitors within a hermetic hybrid package. The hybrid circuit has been assembled within a stainless steel enclosure with high temperature connectors. The high temperature electronics demonstrator has been shown to operate from −40°C to +250°C. This work has been carried out under the EU Clean Sky HIGHTECS project with the Project being led by Turbomeca (Fr) and carried out by GE Aviation Systems (UK), GE Research – Munich (D) and Oxford University (UK).

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Verma, P., D. Chatterjee, and T. Nagarajan. "Design and development of a modular valveless micropump on a printed circuit board for integrated electronic cooling." Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science 223, no. 4 (2009): 953–63. http://dx.doi.org/10.1243/09544062jmes1315.

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With constraints on size, cost, reliability, and performance for liquid-based cooling systems, the design of modular micropumps suitable for an integrated thermal management system still remains a challenge. In this paper, the effectiveness of a low-cost valveless micropump—heat exchanger on a printed circuit board is investigated for electronic cooling. Signal conditioning and control electronics are integrated with the fluidic components on the substrate to form a compact modular unit. Piezoelectric actuation and conical diffusers are utilized to generate pulsating flow through a minichannel heat sink. With ethanol as the working fluid, the tested pump reached a maximum flowrate and a pressure head of 2.4 ml/min and 743 Pa at an input voltage of 6 VDC. Suitability of the system for active real-time temperature control has been demonstrated at two input heater power levels of 1.45 and 2.5 W. A maximum reduction of 57 per cent in the average heat sink surface temperature could be achieved at a maximum power consumption of 150 mW by the micropump.

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Peters, Teresa B., Matthew McCarthy, Jon Allison, et al. "Design of an Integrated Loop Heat Pipe Air-Cooled Heat Exchanger for High Performance Electronics." IEEE Transactions on Components, Packaging and Manufacturing Technology 2, no. 10 (2012): 1637–48. http://dx.doi.org/10.1109/tcpmt.2012.2207902.

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Minotti, Paolo, Stefano Dellea, Giorgio Mussi, et al. "High Scale-Factor Stability Frequency-Modulated MEMS Gyroscope: 3-Axis Sensor and Integrated Electronics Design." IEEE Transactions on Industrial Electronics 65, no. 6 (2018): 5040–50. http://dx.doi.org/10.1109/tie.2017.2772212.

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Herna´ndez-Mora, M., J. E. Gonza´lez, M. Ve´lez-Reyes, J. M. Ortiz-Rodrı´guez, Y. Pang, and E. Scott. "Dynamic Reduced Electrothermal Model for Integrated Power Electronics Modules (IPEM)." Journal of Electronic Packaging 126, no. 4 (2004): 477–90. http://dx.doi.org/10.1115/1.1827264.

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Background: This paper presents a reduced mathematical model using a practical numerical formulation of the thermal behavior of an integrated power electronics module (IPEM). This model is based on the expanded lumped thermal capacitance method (LTCM), in which the number of variables involved in the analysis of heat transfer is reduced only to time. Method of Approach: By applying the LTCM, a simple, nonspatial, but highly nonlinear model is obtained for the case of the IPEM Generation II. Steady and transient results of the model are validated against results from a three-dimensional, transient thermal analysis software tool, FLOTHERM™ 3.1. The electrothermal coupling was obtained by implementing the reduced-order thermal model into the SABER™ circuit simulator. Two experimental setups, for low- and high-speed thermal responses, were developed and used to calibrate the reduced model with actual data. Results: The comparison of the LTCM model implemented in a Generation II IPEM with FLOTHERM 3.1 results compared very favorably in terms of accuracy and efficiency, reducing the computational time significantly. Additional validations of the reduced thermal model were made using experiment data for the low-speed thermal response at different constant powers, and good agreement was demonstrated in all cases. A comparison between SABER™ simulations, which incorporated the proposed LTCM, and the fast thermal experimental response results is also presented to validate the dynamic electrothermal model response, and excellent agreement was found for this case. Conclusions: The good agreement found for all three cases presented, the three-dimensional, transient numerical formulation, and the low- and high-speed experimental data indicates that reduced electrothermal models are an excellent alterative for design methodologies of new generations of IPEMs.

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Snook, Ian, Jane Marshall, and Robert Newman. "Physics of Failure as an Integrated Part of Design for Reliability." Journal of the IEST 47, no. 1 (2004): 67–73. http://dx.doi.org/10.17764/jiet.47.1.74q481n144708775.

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A study of the use of Physics of Failure (PoF) methods was undertaken as part of a collaboratively funded United Kingdom Government Department of Industry (UK DTI) project for developing a holistic methodology and assessment model for the enhancement of electronics reliability. Several case studies were conducted to review the use of PoF techniques. The study concluded PoF methods, and in particular life modeling, are essential tools in design for reliability. PoF analysis can also be used to establish reliability enhancement testing (RET) and environmental stress screening (ESS) conditions. A guide for the effective use and inclusion of the PoF methods in the product design and development process was developed and described. Use of the techniques facilitates accurate design right, thereby avoiding redesign and retest cycles, with consequent cost savings and reduced product development times. The PoF method has limitations. It is essentially a bottom-up approach assessing time to failure due to known failure mechanisms. Consequently, it is difficult to apply to full systems, has limitations in assessing failure rate prior to the onset of life-limiting wear out, and is dependent on identifying and having a validated model for all potential failure mechanisms.

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Khan, Mohammad Ayub, Prakash Chandra, Pratibha Mishra, and Rajansh Sinha. "A TOOLBOX DESIGN FOR LABORATORY APPLICATION OF ELECTRONIC NOSE USING VIRTUAL INSTRUMENTATION." International Journal of Engineering Technologies and Management Research 5, no. 2 (2020): 208–15. http://dx.doi.org/10.29121/ijetmr.v5.i2.2018.646.

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The tool consists of several virtual instrumentation allowing the implantation of the different measurement technique that are commonly used in this research field. What follows describes an integrated system that automatically controls the composition of the mixture under analysis, provides set up for both the virtual instrumentation and customs electronics, and performs the selected class algorithms for features extraction, data dimensionality reduction and classification. Assisting perspective task to virtual instrumentation controlling the entire system gives us the possibility to avoid the presence of error due to human control. Such systems, and in particular those designed for research application, utilize a large number of sub system for chemical sampling control, for signal generation and acquisition, and for data manipulation. This paper describes a tool box of virtual instrumentation developed for research purposes and based on a laboratory electronics nose.

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Niu, Jun Tao, and Dong Hong Liu. "Security Mechanism Design on the Embedded Computer System." Applied Mechanics and Materials 651-653 (September 2014): 1937–40. http://dx.doi.org/10.4028/www.scientific.net/amm.651-653.1937.

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With the constant innovation and development of micro-electronics technology, and large scale integrated circuit in-depth research, more advanced embedded microcontroller processors are applied to all kinds of instruments and equipment, which has brought a new technological revolution to the modern industrial control field. And it results to the embedded system, as an important field of computer application, has gone deep in all aspects of society, and got more and more attention from people. Now the designing and implementation technique of dependable computer is one of the most important research fields. The research on security, one of the important characters of dependable computer, is becoming increasingly important.

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Raud, Zoja, and Valery Vodovozov. "Ontology-Based Design of the Learner’s Knowledge Domain in Electrical Engineering." Electrical, Control and Communication Engineering 15, no. 1 (2019): 47–53. http://dx.doi.org/10.2478/ecce-2019-0007.

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AbstractThis research addresses some personalization aspects of education in electrical engineering. Its goal is to help students and educators evaluate the complexity of the disciplines they have chosen for studying and optimize the order of the learned courses and topics. A new instrument, namely, an educational thesaurus, is presented and its assembling procedure is shown. The offered educational thesauri implemented in the labs and integrated in the exercises have become smart platforms suitable for design and management of the students’ individual knowledge domains. The ontology-based Web manuals in Electronics and Power Electronics for the Bachelor study cycle have been introduced. An example of ontology graph to be applied within the Master study cycle has been developed and explained in the paper. According to the authors’ investigation, the decrease of stress caused by the new educational environment and achievement of success in learning were observed thanks to the individual knowledge domain organization proposed in this study.

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